WO2018068380A1 - 柔性oled显示器及其制作方法 - Google Patents

柔性oled显示器及其制作方法 Download PDF

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WO2018068380A1
WO2018068380A1 PCT/CN2016/109571 CN2016109571W WO2018068380A1 WO 2018068380 A1 WO2018068380 A1 WO 2018068380A1 CN 2016109571 W CN2016109571 W CN 2016109571W WO 2018068380 A1 WO2018068380 A1 WO 2018068380A1
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polymer film
film layer
layers
layer
tft
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PCT/CN2016/109571
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English (en)
French (fr)
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徐超
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武汉华星光电技术有限公司
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Priority to US15/326,641 priority Critical patent/US10243163B2/en
Publication of WO2018068380A1 publication Critical patent/WO2018068380A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a flexible OLED display and a method of fabricating the same.
  • OLED Organic Light-Emitting Diode
  • OLED Organic Light-Emitting Diode
  • the working temperature has wide adaptability, light volume, fast response, easy to realize color display and large screen display, easy to realize integration with integrated circuit driver, easy to realize flexible display, and the like, and thus has broad application prospects.
  • OLED can be divided into two types: passive matrix OLED (PMOLED) and active matrix OLED (AMOLED), namely direct addressing and thin film transistor (TFT, Thin Film Transistor).
  • PMOLED passive matrix OLED
  • AMOLED active matrix OLED
  • TFT thin film transistor
  • matrix addressing There are two types of matrix addressing.
  • the AMOLED has pixels arranged in an array, belongs to an active display type, has high luminous efficiency, and is generally used as a high-definition large-sized display device.
  • the OLED generally includes a substrate, an anode disposed on the substrate, a Hole Inject Layer (HIL) disposed on the anode, and a Hole Transport Layer (HTL) disposed on the hole injection layer.
  • HIL Hole Inject Layer
  • HTL Hole Transport Layer
  • a light-emitting layer provided on the hole transport layer
  • ETL electron transport layer
  • EIL electron injection layer
  • EIL electron set Inject the cathode on the layer.
  • the principle of luminescence of OLED display devices is that semiconductor materials and organic luminescent materials are driven by electric fields, causing luminescence by carrier injection and recombination.
  • an OLED display device generally employs an ITO pixel electrode and a metal electrode as anodes and cathodes of the device, respectively.
  • an ITO pixel electrode and a metal electrode as anodes and cathodes of the device, respectively.
  • electrons and holes are injected from the cathode and the anode to the electron transport layer and the hole transport layer, respectively.
  • the holes migrate to the light-emitting layer through the electron transport layer and the hole transport layer, respectively, and meet in the light-emitting layer to form excitons and excite the light-emitting molecules, and the latter emits visible light through radiation relaxation.
  • the biggest advantage of OLED is that it can prepare large-sized and ultra-thin flexible devices.
  • flexible substrates are easy to deform and difficult to operate in the production process, the production of flexible devices is greatly Subject to restrictions.
  • the method for preparing a flexible OLED device is mainly to bond a flexible substrate to a rigid substrate, and after the OLED device is prepared on the flexible substrate, the rigid substrate is separated from the flexible substrate.
  • the rigid substrate and the flexible substrate are relatively tightly bonded, it is difficult to separate them.
  • the laser stripping method can separate the flexible substrate from the rigid substrate, but the process is complicated and the production yield is poor.
  • An object of the present invention is to provide a method for fabricating a flexible OLED display, which effectively solves the problem that the rigid substrate and the flexible substrate are not easily separated when preparing a flexible OLED display, and greatly improves the production efficiency and product yield of the flexible OLED display.
  • the present invention provides a method for fabricating a flexible OLED display, comprising the following steps:
  • Step 1 providing a transfer template, forming a plurality of first polymer film layers spaced apart on the transfer template;
  • Step 2 providing a rigid substrate, wherein a plurality of frame seals are formed on the rigid substrate corresponding to positions of the plurality of first polymer film layers on the transfer template, and the position of each ring seal corresponds to each first An area within the edge or edge of the polymeric film layer;
  • Step 3 transferring a plurality of first polymer film layers on the transfer template onto the rigid substrate, wherein the plurality of first polymer film layers are respectively adhered to the On a rigid substrate;
  • Step 4 coating a second polymer film layer on the plurality of first polymer film layers and the rigid substrate, wherein an area of the second polymer film layer is larger than an area of the plurality of first polymer film layers ;
  • Step 5 forming a plurality of TFT layers on the second polymer film layer corresponding to the plurality of first polymer film layers, and respectively forming a plurality of OLED devices on the plurality of TFT layers, the plurality of The positions of the TFT layer and the plurality of OLED devices respectively correspond to the inner sides of the plurality of rings of the sealant;
  • Step 6 packaging the plurality of OLED devices and the plurality of TFT layers, and forming the plurality of OLED devices and the plurality of TFT layers respectively on the second polymer film layer and the plurality of OLED devices a plurality of package structure layers on the surface to obtain a substrate to be cut;
  • Step 7 cutting the substrate to be cut along the inner side of the plurality of ring seals, and the first polymer film layer under the OLED device is disconnected from the rigid substrate, thereby peeling off the rigid substrate, and obtaining the number Flexible OLED displays;
  • the flexible OLED display includes a first polymer film layer, a second polymer film layer, a TFT layer, an OLED device, and a package structure layer disposed in order from bottom to top, and the package structure layer is located at the second polymer Overlying the film layer and the OLED device and cladding the OLED device and TFT The outer surface of the layer.
  • the material of the transfer template is polydimethylsiloxane.
  • the rigid substrate is a glass substrate or a stainless steel substrate.
  • the sealant is a UV glue
  • the step 3 further comprises the step of subjecting the plurality of sealants to ultraviolet light to cure.
  • the materials of the first polymer film layer and the second polymer film layer are both polyimide.
  • the plurality of OLED devices are fabricated by evaporation or solution processing.
  • the OLED device and the plurality of TFT layers are packaged by a thin film encapsulation technique.
  • the substrate to be cut is cut by a laser cutting method.
  • the present invention also provides a flexible OLED display comprising a first polymer film layer, a second polymer film layer, a TFT layer, an OLED device, and a package structure layer disposed in order from bottom to top, wherein the package structure layer is located at The second polymer film layer is over the OLED device and covers the outer surface of the OLED device and the TFT layer.
  • the materials of the first polymer film layer and the second polymer film layer are both polyimide.
  • the invention also provides a manufacturing method of a flexible OLED display, comprising the following steps:
  • Step 1 providing a transfer template, forming a plurality of first polymer film layers spaced apart on the transfer template;
  • Step 2 providing a rigid substrate, wherein a plurality of frame seals are formed on the rigid substrate corresponding to positions of the plurality of first polymer film layers on the transfer template, and the position of each ring seal corresponds to each first An area within the edge or edge of the polymeric film layer;
  • Step 3 transferring a plurality of first polymer film layers on the transfer template onto the rigid substrate, wherein the plurality of first polymer film layers are respectively adhered to the On a rigid substrate;
  • Step 4 coating a second polymer film layer on the plurality of first polymer film layers and the rigid substrate, wherein an area of the second polymer film layer is larger than an area of the plurality of first polymer film layers ;
  • Step 5 forming a plurality of TFT layers on the second polymer film layer corresponding to the plurality of first polymer film layers, and respectively forming a plurality of OLED devices on the plurality of TFT layers, the plurality of The positions of the TFT layer and the plurality of OLED devices respectively correspond to the inner sides of the plurality of rings of the sealant;
  • Step 6 packaging the plurality of OLED devices and the plurality of TFT layers, and forming the plurality of OLED devices and the plurality of TFT layers respectively on the second polymer film layer and the plurality of OLED devices a plurality of package structure layers on the surface to obtain a substrate to be cut;
  • Step 7 cutting the substrate to be cut along the inner side of the plurality of rings of glue, the first polymer film layer under the OLED device is disconnected from the rigid substrate, thereby peeling off the a rigid substrate to obtain several flexible OLED displays;
  • the flexible OLED display includes a first polymer film layer, a second polymer film layer, a TFT layer, an OLED device, and a package structure layer disposed in order from bottom to top, and the package structure layer is located at the second polymer a film layer over the OLED device and covering an outer surface of the OLED device and the TFT layer;
  • the material of the transfer template is polydimethylsiloxane
  • the rigid substrate is a glass substrate or a stainless steel substrate
  • the materials of the first polymer film layer and the second polymer film layer are both polyimide.
  • the present invention provides a method for fabricating a flexible OLED display by adhering a plurality of first polymer film layers on a rigid substrate coated with a plurality of rings of glue, and then Coating a plurality of first polymer film layers and a rigid substrate with a second polymer film layer, and then forming a plurality of TFT layers and a plurality of OLEDs on the second polymer film layer corresponding to the inner side of the plurality of rings of the sealant
  • the device is packaged and finally cut along the inner side of the plurality of rings of the frame to obtain a plurality of flexible OLED displays, which effectively solves the problem that the rigid substrate and the flexible substrate are not easily separated when preparing the flexible OLED display, and the problem is greatly improved. Production efficiency and product yield of flexible OLED displays.
  • the invention provides a flexible OLED display, which is easy to process and has high product yield.
  • FIG. 1 is a flow chart of a method of fabricating a flexible OLED display of the present invention
  • step 1 is a schematic diagram of step 1 of a method of fabricating a flexible OLED display of the present invention
  • Figure 3 is a cross-sectional view taken along line AA of Figure 2;
  • step 2 is a schematic diagram of step 2 of a method for fabricating a flexible OLED display of the present invention
  • Figure 5 is a cross-sectional view taken along line AA of Figure 4.
  • FIG. 6 is a schematic diagram of step 3 of a method for fabricating a flexible OLED display of the present invention.
  • Figure 7 is a cross-sectional view taken along line AA of Figure 6;
  • step 4 is a schematic diagram of step 4 of a method for fabricating a flexible OLED display of the present invention.
  • Figure 9 is a cross-sectional view taken along line AA of Figure 8.
  • step 5 is a schematic diagram of step 5 of a method for fabricating a flexible OLED display of the present invention.
  • Figure 11 is a cross-sectional view taken along line AA of Figure 10;
  • step 6 is a schematic diagram of step 6 of a method of fabricating a flexible OLED display of the present invention.
  • Figure 13 is a cross-sectional view taken along line AA of Figure 12;
  • FIG. 14 and FIG. 16 are schematic diagrams showing the seventh step of the method for fabricating the flexible OLED display of the present invention.
  • Figure 15 is a cross-sectional view taken along line AA of Figure 14;
  • FIG. 17 is a cross-sectional view along line AA of FIG. 16 and a schematic structural view of the flexible OLED display of the present invention.
  • the present invention provides a method for fabricating a flexible OLED display, including the following steps:
  • Step 1 as shown in FIGS. 2-3, a transfer template 10 is provided, and a plurality of first polymer film layers 11 are formed on the transfer template 10.
  • the plurality includes one or more.
  • the material of the transfer template 10 is polydimethylsiloxane (PDMS).
  • Step 2 As shown in FIG. 4-5, a rigid substrate 20 is provided, and a plurality of ring seals 21 are formed on the rigid substrate 20 corresponding to the positions of the plurality of first polymer film layers 11 on the transfer template 10.
  • the position of the sealant 21 per ring corresponds to the area within the edge or edge of each of the first polymer film layers 11.
  • the rigid substrate 20 is a glass substrate or a stainless steel substrate.
  • Step 3 as shown in FIGS. 6-7, transferring a plurality of first polymer film layers 11 on the transfer template 10 onto the rigid substrate 20, the plurality of first polymer film layers 11
  • the plurality of frame seals 21 are adhered to the rigid substrate 20 by the plurality of rings.
  • the sealant 21 is a UV glue
  • the step 3 further comprises the step of irradiating the plurality of seals 21 with ultraviolet light to cure.
  • Step 4 as shown in FIG. 8-9, coating a second polymer film layer 22 on the plurality of first polymer film layers 11 and the rigid substrate 20, the area of the second polymer film layer 22 being larger than The area of the plurality of first polymer film layers 11.
  • the upper surface of the second polymer film layer 22 obtained in the step 4 is flat, thereby facilitating the fabrication and packaging of the TFT layer 23 and the OLED device 24 in the subsequent step.
  • the materials of the first polymer film layer 11 and the second polymer film layer 22 are both polyimide (PI).
  • Step 5 as shown in FIG. 10-11, a plurality of TFT layers 23 are formed on the second polymer film layer 22 corresponding to the plurality of first polymer film layers 11, respectively, in the plurality of TFT layers 23
  • a plurality of OLED devices 24 are respectively fabricated, and the positions of the plurality of TFT layers 23 and the plurality of OLED devices 24 respectively correspond to the inner sides of the plurality of ring sealants 21.
  • the plurality of OLED devices 24 are fabricated by evaporation or solution processing.
  • Step 6 as shown in FIG. 12-13, encapsulating the plurality of OLED devices 24 and the plurality of TFT layers 23, forming separate coatings on the second polymer film layer 22 and the plurality of OLED devices 24.
  • the plurality of package structure layers 25 of the outer surface of the plurality of TFT layers 23 are described by the plurality of OLED devices 24 to obtain a substrate 1 to be cut.
  • the OLED device 24 and the plurality of TFT layers 23 are encapsulated by a thin film encapsulation technology (TFE).
  • TFE thin film encapsulation technology
  • Step 7 as shown in FIG. 14-17, the substrate 1 to be cut is cut along the inner side of the plurality of rings of the sealant 21, and the first polymer film layer 11 and the rigid substrate 20 under the OLED device 24 are cut. Disengaged, thereby peeling off the rigid substrate 20, resulting in a plurality of flexible OLED displays 30;
  • the flexible OLED display 30 includes a first polymer film layer 11, a second polymer film layer 22, a TFT layer 23, an OLED device 24, and a package structure layer 25, which are sequentially disposed from bottom to top, and the package structure layer 25 Located above the second polymer film layer 22 and the OLED device 24 and covering the outer surfaces of the OLED device 24 and the TFT layer 23.
  • the substrate 1 to be cut is cut by a laser cutting method.
  • a plurality of first polymer film layers 11 are adhered on a rigid substrate 20 coated with a plurality of rings of the frame glue 21 by transfer, and then in the plurality of first polymer film layers Applying a second polymer film layer 22 to the rigid substrate 20, and then forming a plurality of TFT layers 23 and a plurality of OLED devices 24 on the second polymer film layer 22 corresponding to the inner side of the plurality of ring sealants 21.
  • a plurality of flexible OLED displays 30 can be obtained, the manufacturing method effectively solves the problem that the rigid substrate and the flexible substrate are not easily separated when preparing the flexible OLED display, Increased production efficiency and product yield of flexible OLED displays.
  • the present invention further provides a flexible OLED display 30 comprising a first polymer film layer 11 disposed in order from bottom to top, based on the above-described manufacturing method of the flexible OLED display.
  • the materials of the first polymer film layer 11 and the second polymer film layer 22 are both polyimide.
  • the flexible OLED display is obtained through the manufacturing method of the flexible OLED display, and the rigid substrate and the flexible substrate are easily separated during the manufacturing process, and are easy to process and manufacture, and the product yield is high.
  • the present invention provides a flexible OLED display and a method of fabricating the same.
  • the manufacturing method of the flexible OLED display of the present invention by means of transfer, adheres a plurality of first polymer film layers on a rigid substrate coated with a plurality of rings of glue, and then in the plurality of first polymer film layers Coating a second polymer film layer on the rigid substrate, and then forming a plurality of TFT layers and a plurality of OLED devices on the second polymer film layer corresponding to the inner side of the plurality of ring sealants, and packaging, and finally Several flexible OLED displays can be obtained by cutting the inner area of the ring frame rubber.
  • the manufacturing method effectively solves the problem that the rigid substrate and the flexible substrate are not easily separated when preparing the flexible OLED display, and greatly improves the production efficiency of the flexible OLED display. And product yield.
  • the flexible OLED display of the invention is easy to process and has high product yield.

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Abstract

一种柔性OLED显示器(30)的制作方法，通过转印的方式，在涂有数圈框胶(21)的刚性基板(20)上粘附数个第一聚合物膜层(11)，然后在所述数个第一聚合物膜层(11)与刚性基板(20)上涂布第二聚合物膜层(22)，接着在所述第二聚合物膜层(22)上对应所述数圈框胶(21)的内侧制作数个TFT层(23)与数个OLED(24)器件，并进行封装，最后沿所述数圈框胶(21)内侧的区域进行切割，即可得到数个柔性OLED显示器(30)，该制作方法有效解决了制备柔性OLED显示器时刚性基板(20)和柔性基板不易分离的问题，大大提高了柔性OLED显示器(30)的生产效率和产品良率。

Description

柔性OLED显示器及其制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种柔性OLED显示器及其制作方法。
背景技术
有机发光二极管(Organic Light-Emitting Diode，OLED)显示器，也称为有机电致发光显示器，是一种新兴的平板显示装置，由于其具有制备工艺简单、成本低、功耗低、发光亮度高、工作温度适应范围广、体积轻薄、响应速度快，而且易于实现彩色显示和大屏幕显示、易于实现和集成电路驱动器相匹配、易于实现柔性显示等优点，因而具有广阔的应用前景。
OLED按照驱动方式可以分为无源矩阵型OLED(Passive Matrix OLED，PMOLED)和有源矩阵型OLED(Active Matrix OLED，AMOLED)两大类，即直接寻址和薄膜晶体管(TFT，Thin Film Transistor)矩阵寻址两类。其中，AMOLED具有呈阵列式排布的像素，属于主动显示类型，发光效能高，通常用作高清晰度的大尺寸显示装置。
OLED通常包括：基板、设于基板上的阳极、设于阳极上的空穴注入层(Hole Inject Layer，HIL)、设于空穴注入层上的空穴传输层(Hole Transport Layer，HTL)、设于空穴传输层上的发光层、设于发光层上的电子传输层(Electron Transport Layer，ETL)、设于电子传输层上的电子注入层(Electron Inject Layer，EIL)、及设于电子注入层上的阴极。OLED显示器件的发光原理为半导体材料和有机发光材料在电场驱动下，通过载流子注入和复合导致发光。具体的，OLED显示器件通常采用ITO像素电极和金属电极分别作为器件的阳极和阴极，在一定电压驱动下，电子和空穴分别从阴极和阳极注入到电子传输层和空穴传输层，电子和空穴分别经过电子传输层和空穴传输层迁移到发光层，并在发光层中相遇，形成激子并使发光分子激发，后者经过辐射弛豫而发出可见光。
OLED与液晶显示面板(TFT-LCD)相比，最大的优势就是可制备大尺寸、超薄的柔性器件，但由于柔性基板易产生形变，在生产过程中难以操作，因此目前柔性器件的生产大大受到制约。
目前制备柔性OLED器件的方法主要是将柔性基板粘合在刚性基板上，在柔性基板上制备好OLED器件后，再将刚性基板与柔性基板分离开 来。但是，由于刚性基板和柔性基板粘合的比较紧，二者很难分离开。目前采用的镭射剥离的方法，虽然可以把柔性基板和刚性基板分离开来，但是工艺复杂，生产良率较差。
发明内容
本发明的目的在于提供一种柔性OLED显示器的制作方法，有效解决了制备柔性OLED显示器时刚性基板和柔性基板不易分离的问题，大大提高了柔性OLED显示器的生产效率和产品良率。
本发明的目的还在于提供一种柔性OLED显示器，易于加工制作，产品良率高。
为实现上述目的，本发明提供一种柔性OLED显示器的制作方法，包括如下步骤：
步骤1、提供一转印模板，在所述转印模板上形成间隔设置的数个第一聚合物膜层；
步骤2、提供一刚性基板，在所述刚性基板上分别对应所述转印模板上数个第一聚合物膜层的位置形成数圈框胶，每圈框胶的位置对应于每个第一聚合物膜层的边缘或者边缘以内的区域；
步骤3、将所述转印模板上的数个第一聚合物膜层转印至所述刚性基板上，所述数个第一聚合物膜层分别通过所述数圈框胶粘附于所述刚性基板上；
步骤4、在所述数个第一聚合物膜层及刚性基板上涂布第二聚合物膜层，所述第二聚合物膜层的面积大于所述数个第一聚合物膜层的面积；
步骤5、在所述第二聚合物膜层上分别对应所述数个第一聚合物膜层制作数个TFT层，在所述数个TFT层上分别制作数个OLED器件，所述数个TFT层与数个OLED器件的位置分别对应所述数圈框胶的内侧；
步骤6、对所述数个OLED器件及数个TFT层进行封装，在所述第二聚合物膜层及数个OLED器件上形成分别包覆所述数个OLED器件与数个TFT层的外表面的数个封装结构层，得到一待切割的基板；
步骤7、沿所述数圈框胶的内侧对所述待切割的基板进行切割，所述OLED器件下方的第一聚合物膜层与刚性基板脱离连接，从而剥离掉所述刚性基板，得到数个柔性OLED显示器；
所述柔性OLED显示器包括从下到上依次设置的第一聚合物膜层、第二聚合物膜层、TFT层、OLED器件、及封装结构层，所述封装结构层位于所述第二聚合物膜层与OLED器件上方并且包覆所述OLED器件与TFT 层的外表面。
所述转印模板的材料为聚二甲基硅氧烷。
所述刚性基板为玻璃基板或者不锈钢基板。
所述框胶为UV胶，所述步骤3还包括对所述数圈框胶进行紫外光照射使其固化的步骤。
所述第一聚合物膜层与第二聚合物膜层的材料均为聚酰亚胺。
所述步骤5中，采用蒸镀或溶液加工的方法制作所述数个OLED器件。
所述步骤6中，采用薄膜封装技术对所述数个OLED器件及数个TFT层进行封装。
所述步骤7中，采用激光切割的方法对所述待切割的基板进行切割。
本发明还提供一种柔性OLED显示器，包括从下到上依次设置的第一聚合物膜层、第二聚合物膜层、TFT层、OLED器件、及封装结构层，所述封装结构层位于所述第二聚合物膜层与OLED器件上方并且包覆所述OLED器件与TFT层的外表面。
所述第一聚合物膜层与第二聚合物膜层的材料均为聚酰亚胺。
本发明还提供一种柔性OLED显示器的制作方法，包括如下步骤：
步骤1、提供一转印模板，在所述转印模板上形成间隔设置的数个第一聚合物膜层；
步骤2、提供一刚性基板，在所述刚性基板上分别对应所述转印模板上数个第一聚合物膜层的位置形成数圈框胶，每圈框胶的位置对应于每个第一聚合物膜层的边缘或者边缘以内的区域；
步骤3、将所述转印模板上的数个第一聚合物膜层转印至所述刚性基板上，所述数个第一聚合物膜层分别通过所述数圈框胶粘附于所述刚性基板上；
步骤4、在所述数个第一聚合物膜层及刚性基板上涂布第二聚合物膜层，所述第二聚合物膜层的面积大于所述数个第一聚合物膜层的面积；
步骤5、在所述第二聚合物膜层上分别对应所述数个第一聚合物膜层制作数个TFT层，在所述数个TFT层上分别制作数个OLED器件，所述数个TFT层与数个OLED器件的位置分别对应所述数圈框胶的内侧；
步骤6、对所述数个OLED器件及数个TFT层进行封装，在所述第二聚合物膜层及数个OLED器件上形成分别包覆所述数个OLED器件与数个TFT层的外表面的数个封装结构层，得到一待切割的基板；
步骤7、沿所述数圈框胶的内侧对所述待切割的基板进行切割，所述OLED器件下方的第一聚合物膜层与刚性基板脱离连接，从而剥离掉所述 刚性基板，得到数个柔性OLED显示器；
所述柔性OLED显示器包括从下到上依次设置的第一聚合物膜层、第二聚合物膜层、TFT层、OLED器件、及封装结构层，所述封装结构层位于所述第二聚合物膜层与OLED器件上方并且包覆所述OLED器件与TFT层的外表面；
其中，所述转印模板的材料为聚二甲基硅氧烷；
其中，所述刚性基板为玻璃基板或者不锈钢基板；
其中，所述第一聚合物膜层与第二聚合物膜层的材料均为聚酰亚胺。
本发明的有益效果：本发明提供的一种柔性OLED显示器的制作方法，通过转印的方式，在涂有数圈框胶的刚性基板上粘附数个第一聚合物膜层，然后在所述数个第一聚合物膜层与刚性基板上涂布第二聚合物膜层，接着在所述第二聚合物膜层上对应所述数圈框胶的内侧制作数个TFT层与数个OLED器件，并进行封装，最后沿所述数圈框胶内侧的区域进行切割，即可得到数个柔性OLED显示器，有效解决了制备柔性OLED显示器时刚性基板和柔性基板不易分离的问题，大大提高了柔性OLED显示器的生产效率和产品良率。本发明提供的一种柔性OLED显示器，易于加工制作，产品良率高。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为本发明的柔性OLED显示器的制作方法的流程图；
图2为本发明的柔性OLED显示器的制作方法的步骤1的示意图；
图3为图2沿AA线的剖视示意图；
图4为本发明的柔性OLED显示器的制作方法的步骤2的示意图；
图5为图4沿AA线的剖视示意图；
图6为本发明的柔性OLED显示器的制作方法的步骤3的示意图；
图7为图6沿AA线的剖视示意图；
图8为本发明的柔性OLED显示器的制作方法的步骤4的示意图；
图9为图8沿AA线的剖视示意图；
图10为本发明的柔性OLED显示器的制作方法的步骤5的示意图；
图11为图10沿AA线的剖视示意图；
图12为本发明的柔性OLED显示器的制作方法的步骤6的示意图；
图13为图12沿AA线的剖视示意图；
图14与图16为本发明的柔性OLED显示器的制作方法的步骤7的示意图；
图15为图14沿AA线的剖视示意图；
图17为图16沿AA线的剖视示意图暨本发明的柔性OLED显示器的结构示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图1，本发明提供一种柔性OLED显示器的制作方法，包括如下步骤：
步骤1、如图2-3所示，提供一转印模板10，在所述转印模板10上形成间隔设置的数个第一聚合物膜层11。
具体的，所述数个包括一个及一个以上。
具体的，所述转印模板10的材料为聚二甲基硅氧烷(PDMS)。
步骤2、如图4-5所示，提供一刚性基板20，在所述刚性基板20上分别对应所述转印模板10上数个第一聚合物膜层11的位置形成数圈框胶21，每圈框胶21的位置对应于每个第一聚合物膜层11的边缘或者边缘以内的区域。
优选的，所述刚性基板20为玻璃基板或者不锈钢基板。
步骤3、如图6-7所示，将所述转印模板10上的数个第一聚合物膜层11转印至所述刚性基板20上，所述数个第一聚合物膜层11分别通过所述数圈框胶21粘附于所述刚性基板20上。
优选的，所述框胶21为UV胶，所述步骤3还包括对所述数圈框胶21进行紫外光照射使其固化的步骤。
步骤4、如图8-9所示，在所述数个第一聚合物膜层11及刚性基板20上涂布第二聚合物膜层22，所述第二聚合物膜层22的面积大于所述数个第一聚合物膜层11的面积。
优选的，所述步骤4得到的第二聚合物膜层22的上表面平整，从而有利于后续步骤中TFT层23与OLED器件24的制作和封装。
优选的，所述第一聚合物膜层11与第二聚合物膜层22的材料均为聚酰亚胺(PI)。
步骤5、如图10-11所示，在所述第二聚合物膜层22上分别对应所述数个第一聚合物膜层11制作数个TFT层23，在所述数个TFT层23上分别制作数个OLED器件24，所述数个TFT层23与数个OLED器件24的位置分别对应所述数圈框胶21的内侧。
具体的，所述步骤5中，采用蒸镀或溶液加工的方法制作所述数个OLED器件24。
步骤6、如图12-13所示，对所述数个OLED器件24及数个TFT层23进行封装，在所述第二聚合物膜层22及数个OLED器件24上形成分别包覆所述数个OLED器件24与数个TFT层23的外表面的数个封装结构层25，得到一待切割的基板1。
优选的，所述步骤6中，采用薄膜封装技术(TFE，Thin Film Encapsulation)对所述数个OLED器件24及数个TFT层23进行封装。
步骤7、如图14-17所示，沿所述数圈框胶21的内侧对所述待切割的基板1进行切割，所述OLED器件24下方的第一聚合物膜层11与刚性基板20脱离连接，从而剥离掉所述刚性基板20，得到数个柔性OLED显示器30；
所述柔性OLED显示器30包括从下到上依次设置的第一聚合物膜层11、第二聚合物膜层22、TFT层23、OLED器件24、及封装结构层25，所述封装结构层25位于所述第二聚合物膜层22与OLED器件24上方并且包覆所述OLED器件24与TFT层23的外表面。
具体的，所述步骤7中，采用激光切割的方法对所述待切割的基板1进行切割。
上述柔性OLED显示器的制作方法，通过转印的方式，在涂有数圈框胶21的刚性基板20上粘附数个第一聚合物膜层11，然后在所述数个第一聚合物膜层11与刚性基板20上涂布第二聚合物膜层22，接着在所述第二聚合物膜层22上对应所述数圈框胶21的内侧制作数个TFT层23与数个OLED器件24，并进行封装，最后沿数圈框胶21内侧的区域进行切割，即可得到数个柔性OLED显示器30，该制作方法有效解决了制备柔性OLED显示器时刚性基板和柔性基板不易分离的问题，大大提高了柔性OLED显示器的生产效率和产品良率。
请参阅图17，基于上述柔性OLED显示器的制作方法，本发明还提供一种柔性OLED显示器30，包括从下到上依次设置的第一聚合物膜层11、 第二聚合物膜层22、TFT层23、OLED器件24、及封装结构层25，所述封装结构层25位于所述第二聚合物膜层22与OLED器件24上方并且包覆所述OLED器件24与TFT层23的外表面。
优选的，所述第一聚合物膜层11与第二聚合物膜层22的材料均为聚酰亚胺。
上述柔性OLED显示器，经由上述柔性OLED显示器的制作方法制得，制作过程中刚性基板和柔性基板容易分离，易于加工制作，产品良率高。
综上所述，本发明提供一种柔性OLED显示器及其制作方法。本发明的柔性OLED显示器的制作方法，通过转印的方式，在涂有数圈框胶的刚性基板上粘附数个第一聚合物膜层，然后在所述数个第一聚合物膜层与刚性基板上涂布第二聚合物膜层，接着在所述第二聚合物膜层上对应所述数圈框胶的内侧制作数个TFT层与数个OLED器件，并进行封装，最后沿所述数圈框胶内侧的区域进行切割，即可得到数个柔性OLED显示器，该制作方法有效解决了制备柔性OLED显示器时刚性基板和柔性基板不易分离的问题，大大提高了柔性OLED显示器的生产效率和产品良率。本发明的柔性OLED显示器，易于加工制作，产品良率高。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (15)

  1. 一种柔性OLED显示器的制作方法，包括如下步骤：
    步骤1、提供一转印模板，在所述转印模板上形成间隔设置的数个第一聚合物膜层；
    步骤2、提供一刚性基板，在所述刚性基板上分别对应所述转印模板上数个第一聚合物膜层的位置形成数圈框胶，每圈框胶的位置对应于每个第一聚合物膜层的边缘或者边缘以内的区域；
    步骤3、将所述转印模板上的数个第一聚合物膜层转印至所述刚性基板上，所述数个第一聚合物膜层分别通过所述数圈框胶粘附于所述刚性基板上；
    步骤4、在所述数个第一聚合物膜层及刚性基板上涂布第二聚合物膜层，所述第二聚合物膜层的面积大于所述数个第一聚合物膜层的面积；
    步骤5、在所述第二聚合物膜层上分别对应所述数个第一聚合物膜层制作数个TFT层，在所述数个TFT层上分别制作数个OLED器件，所述数个TFT层与数个OLED器件的位置分别对应所述数圈框胶的内侧；
    步骤6、对所述数个OLED器件及数个TFT层进行封装，在所述第二聚合物膜层及数个OLED器件上形成分别包覆所述数个OLED器件与数个TFT层的外表面的数个封装结构层，得到一待切割的基板；
    步骤7、沿所述数圈框胶的内侧对所述待切割的基板进行切割，所述OLED器件下方的第一聚合物膜层与刚性基板脱离连接，从而剥离掉所述刚性基板，得到数个柔性OLED显示器；
    所述柔性OLED显示器包括从下到上依次设置的第一聚合物膜层、第二聚合物膜层、TFT层、OLED器件、及封装结构层，所述封装结构层位于所述第二聚合物膜层与OLED器件上方并且包覆所述OLED器件与TFT层的外表面。
  2. 如权利要求1所述的柔性OLED显示器的制作方法，其中，所述转印模板的材料为聚二甲基硅氧烷。
  3. 如权利要求1所述的柔性OLED显示器的制作方法，其中，所述刚性基板为玻璃基板或者不锈钢基板。
  4. 如权利要求1所述的柔性OLED显示器的制作方法，其中，所述框胶为UV胶，所述步骤3还包括对所述数圈框胶进行紫外光照射使其固化的步骤。
  5. 如权利要求1所述的柔性OLED显示器的制作方法，其中，所述第一聚合物膜层与第二聚合物膜层的材料均为聚酰亚胺。
  6. 如权利要求1所述的柔性OLED显示器的制作方法，其中，所述步骤5中，采用蒸镀或溶液加工的方法制作所述数个OLED器件。
  7. 如权利要求1所述的柔性OLED显示器的制作方法，其中，所述步骤6中，采用薄膜封装技术对所述数个OLED器件及数个TFT层进行封装。
  8. 如权利要求1所述的柔性OLED显示器的制作方法，其中，所述步骤7中，采用激光切割的方法对所述待切割的基板进行切割。
  9. 一种柔性OLED显示器，包括从下到上依次设置的第一聚合物膜层、第二聚合物膜层、TFT层、OLED器件、及封装结构层，所述封装结构层位于所述第二聚合物膜层与OLED器件上方并且包覆所述OLED器件与TFT层的外表面。
  10. 如权利要求9所述的柔性OLED显示器，其中，所述第一聚合物膜层与第二聚合物膜层的材料均为聚酰亚胺。
  11. 一种柔性OLED显示器的制作方法，包括如下步骤：
    步骤1、提供一转印模板，在所述转印模板上形成间隔设置的数个第一聚合物膜层；
    步骤2、提供一刚性基板，在所述刚性基板上分别对应所述转印模板上数个第一聚合物膜层的位置形成数圈框胶，每圈框胶的位置对应于每个第一聚合物膜层的边缘或者边缘以内的区域；
    步骤3、将所述转印模板上的数个第一聚合物膜层转印至所述刚性基板上，所述数个第一聚合物膜层分别通过所述数圈框胶粘附于所述刚性基板上；
    步骤4、在所述数个第一聚合物膜层及刚性基板上涂布第二聚合物膜层，所述第二聚合物膜层的面积大于所述数个第一聚合物膜层的面积；
    步骤5、在所述第二聚合物膜层上分别对应所述数个第一聚合物膜层制作数个TFT层，在所述数个TFT层上分别制作数个OLED器件，所述数个TFT层与数个OLED器件的位置分别对应所述数圈框胶的内侧；
    步骤6、对所述数个OLED器件及数个TFT层进行封装，在所述第二聚合物膜层及数个OLED器件上形成分别包覆所述数个OLED器件与数个TFT层的外表面的数个封装结构层，得到一待切割的基板；
    步骤7、沿所述数圈框胶的内侧对所述待切割的基板进行切割，所述OLED器件下方的第一聚合物膜层与刚性基板脱离连接，从而剥离掉所述刚性基板，得到数个柔性OLED显示器；
    所述柔性OLED显示器包括从下到上依次设置的第一聚合物膜层、第二聚合物膜层、TFT层、OLED器件、及封装结构层，所述封装结构层位于所述第二聚合物膜层与OLED器件上方并且包覆所述OLED器件与TFT层的外表面；
    其中，所述转印模板的材料为聚二甲基硅氧烷；
    其中，所述刚性基板为玻璃基板或者不锈钢基板；
    其中，所述第一聚合物膜层与第二聚合物膜层的材料均为聚酰亚胺。
  12. 如权利要求11所述的柔性OLED显示器的制作方法，其中，所述框胶为UV胶，所述步骤3还包括对所述数圈框胶进行紫外光照射使其固化的步骤。
  13. 如权利要求11所述的柔性OLED显示器的制作方法，其中，所述步骤5中，采用蒸镀或溶液加工的方法制作所述数个OLED器件。
  14. 如权利要求11所述的柔性OLED显示器的制作方法，其中，所述步骤6中，采用薄膜封装技术对所述数个OLED器件及数个TFT层进行封装。
  15. 如权利要求11所述的柔性OLED显示器的制作方法，其中，所述步骤7中，采用激光切割的方法对所述待切割的基板进行切割。
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