WO2019239892A1 - 基板処理方法、改質装置及び基板処理システム - Google Patents
基板処理方法、改質装置及び基板処理システム Download PDFInfo
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- WO2019239892A1 WO2019239892A1 PCT/JP2019/021264 JP2019021264W WO2019239892A1 WO 2019239892 A1 WO2019239892 A1 WO 2019239892A1 JP 2019021264 W JP2019021264 W JP 2019021264W WO 2019239892 A1 WO2019239892 A1 WO 2019239892A1
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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Definitions
- the present disclosure relates to a substrate processing method, a reformer, and a substrate processing system.
- Patent Document 1 discloses an apparatus for bonding two wafers.
- the bonding apparatus first, of the two wafers arranged opposite to each other in the vertical direction, the central portion of the upper wafer is pressed with a push pin, and this central portion is brought into contact with the lower wafer. Thereafter, the spacer supporting the upper wafer is retracted, the entire upper wafer is brought into contact with the entire lower wafer, and the wafers are bonded together.
- the technology according to the present disclosure accurately processes the front surface of the substrate while the back surface of the substrate is held.
- One aspect of the present disclosure is a substrate processing method for processing a substrate, wherein at least a back surface layer of the substrate or an inside of the substrate is irradiated with laser light to form a modified layer, and then And a surface treatment step of treating the surface of the substrate while the back surface of the substrate is held.
- the surface of the substrate can be processed with high accuracy while the back surface of the substrate is held.
- FIG. 1 is a plan view schematically showing an outline of a configuration of a substrate processing system according to a first embodiment. It is a side view which shows the outline of a structure of a superposition
- two semiconductor substrates (hereinafter referred to as “substrates”) are joined. Specifically, for example, the substrates are bonded together by van der Waals force and hydrogen bond (intermolecular force).
- the first substrate disposed on the upper side and the second substrate disposed on the lower side are appropriately aligned. Becomes important. That is, it is necessary to match the position of the pattern formed on the first substrate with the position of the pattern formed on the second substrate.
- the first substrate and the second substrate are displaced due to various factors.
- the center portion of the first substrate is moved to the center portion side of the second substrate by the push pin while the outer periphery of the first substrate is held by the upper chuck. Therefore, the first substrate extends downward in a convex manner.
- the bonded substrates hereinafter referred to as “polymerized substrates”
- the outer peripheral portion thereof is displaced in the horizontal direction (Scaling ).
- substrate changes.
- misalignment such as Translation, Rotation, Orthogonality also occurs.
- Translation is a case where the position of the first substrate is entirely displaced in the horizontal direction with respect to the second substrate.
- Rotation is a case where the first substrate rotates and shifts with respect to the second substrate.
- Orthogonality is a case where the orthogonality of the pattern of the first substrate deviates from the pattern of the second substrate.
- misalignments such as Scaling, Translation, Rotation, Orthogonality, etc. can be calculated using model equations.
- the model formula is derived, for example, by measuring the position (coordinates) of each point on the first substrate and the second substrate, and from the measurement result by least square approximation. And the said position shift can be eliminated by correct
- misalignment such as Scaling, Translation, Rotation, and Orthogonality
- misalignment in the horizontal direction may remain randomly within the substrate surface.
- the misalignment that cannot be eliminated by this correction is referred to as distortion. Due to this distortion, for example, a positional shift between the pattern of the first substrate and the pattern of the second substrate occurs in the superposed substrate.
- the difference in crystal orientation includes a difference in density between patterns formed on the substrate.
- the substrate is a silicon wafer and the crystal indices of the mirror indices (110) and (100) will be described.
- the (110) crystal plane and the (100) crystal plane have different Young's modulus and Poisson's ratio, that is, the amount of expansion and contraction of the substrate in the (110) crystal plane and the (100) crystal plane is different.
- the amount of elongation varies within the substrate plane due to the difference in crystal orientation.
- the stress applied to the inside of the substrate differs within the substrate surface.
- the substrate is distorted due to the difference in elongation, and distortion is randomly generated in the substrate surface.
- the substrate W has, for example, (110) crystal planes in the directions of 0 ° and 90 ° with respect to the position of the notch N, and (100) crystals in the direction of 45 °. There is a face.
- the inventors calculated the distortion generated in the bonded substrate W. In calculating the distortion, first, the measured value of the elongation amount was measured at each point in the surface of the substrate W after bonding, and the linear components (Scaling, Translation, Rotation, Orthogonality) were calculated from the above-described model formula. Then, the distortion was calculated by subtracting the model calculation value from the actual measurement value.
- FIG. 1 shows an example of the result. In FIG.
- the amount and direction of distortion at each point in the plane of the substrate W are indicated by arrows. Referring to FIG. 1, it can be seen that the crystal orientation of the substrate W and the direction of distortion correspond well, and the distortion is caused by the difference in crystal orientation in the substrate plane.
- FIG. 2 is a plan view schematically showing the outline of the configuration of the substrate processing system 1.
- the first substrate W ⁇ b> 1 and the second substrate W ⁇ b> 2 are bonded to form a superposed substrate T, and further, the first substrate W ⁇ b> 1 is processed.
- the surface of the first substrate W1 bonded to the second substrate W2 is referred to as “front surface W1a”, and the surface opposite to the front surface W1a is referred to as “back surface W1b”.
- a surface bonded to the first substrate W1 is referred to as “front surface W2a”
- a surface opposite to the front surface W2a is referred to as “back surface W2b”.
- Each of the first substrate W1 and the second substrate W2 is a semiconductor substrate such as a silicon substrate, and a plurality of patterns are formed. Further, the first substrate W1 and the second substrate W2 have a (110) crystal plane and a (100) crystal plane, respectively, as shown in FIG.
- the substrate processing system 1 has a configuration in which a carry-in / out station 2 and a processing station 3 are integrally connected.
- cassettes Cw 1, Cw 2, and Ct that can accommodate a plurality of first substrates W 1, a plurality of second substrates W 2, and a plurality of superposed substrates T are carried in and out of the loading / unloading station 2, for example.
- the processing station 3 includes various processing apparatuses that perform predetermined processing on the first substrate W1, the second substrate W2, and the superposed substrate T.
- the cassette loading table 10 is provided at the loading / unloading station 2.
- a plurality of, for example, four cassettes Cw1, Cw2, and Ct can be placed on the cassette mounting table 10 in a line in the X-axis direction.
- the number of cassettes Cw1, Cw2, and Ct placed on the cassette placing table 10 is not limited to this embodiment, and can be arbitrarily determined.
- a transfer area 20 is provided adjacent to the cassette mounting table 10.
- a transport device 22 that is movable on a transport path 21 extending in the X-axis direction is provided.
- the transfer device 22 includes, for example, two transfer arms 23 and 23 that hold and transfer the first substrate W1, the second substrate W2, and the superposed substrate T.
- Each transfer arm 23 is configured to be movable in the horizontal direction, the vertical direction, the horizontal axis, and the vertical axis.
- the structure of the conveyance arm 23 is not limited to this embodiment, Arbitrary structures can be taken.
- a reformer 30, a joining device 31, and a processing device 32 are arranged side by side from the X axis negative direction to the positive direction side on the Y axis positive direction side of the transfer region 20.
- the reformer 30 forms a modified layer on the first substrate W1.
- the bonding apparatus 31 bonds the first substrate W1 and the second substrate W2.
- the processing device 32 grinds and processes the back surface W1b of the first substrate W1.
- positioning of these reforming apparatus 30, the joining apparatus 31, and the processing apparatus 32 are not limited to this embodiment, It can determine arbitrarily.
- the above substrate processing system 1 is provided with a control device 40.
- the control device 40 is a computer, for example, and has a program storage unit (not shown).
- a program for controlling processing of the first substrate W1, the second substrate W2, and the superposed substrate T in the substrate processing system 1 is stored.
- the program storage unit also stores a program for controlling the operation of drive systems such as the above-described various processing apparatuses and transfer apparatuses to realize substrate processing described later in the substrate processing system 1.
- the program may be recorded on a computer-readable storage medium H and may be installed on the control device 40 from the storage medium H.
- the reforming device 30, the joining device 31, and the processing device 32 will be described.
- the processing device 32, the joining device 31, and the reforming device 30 will be described in this order for the sake of easy understanding of the technology.
- the processing apparatus 32 grinds and processes the back surface W1b of the 1st board
- the processing apparatus 32 includes, for example, a grinding unit that grinds the back surface W1b, a cleaning unit that cleans the back surface W1b of the first substrate W1, the back surface W2b of the second substrate W2, and the like.
- the structure of the processing apparatus 32 is arbitrary and a well-known processing apparatus can be used.
- the bonding apparatus 31 bonds the surface W1a of the first substrate W1 and the surface W2a of the second substrate W2 by van der Waals force and hydrogen bond (intermolecular force).
- the bonding apparatus 31 includes, for example, a bonding unit that bonds the first substrate W1 and the second substrate W2, an activation unit that activates the surface W1a and the surface W2a, and a hydrophilization that hydrophilizes the surface W1a and the surface W2a. Units are provided.
- oxygen gas or nitrogen gas which is a processing gas, is excited to be turned into plasma and ionized.
- the surface W1a and the surface W2a are irradiated with this oxygen ion or nitrogen ion, and the surface W1a and the surface W2a are plasma-treated and activated.
- the hydrophilization unit pure water is supplied to the activated surfaces W1a and W2a to make the surfaces W1a and W2a hydrophilic.
- the joining unit the activated and hydrophilicized surface W1a and the surface W2a are joined.
- the bonding unit 100 includes a first holding unit 110 that sucks and holds the back surface W1b of the first substrate W1, and a second holding unit 111 that sucks and holds the back surface W2b of the second substrate W2.
- the second holding unit 111 is provided below the first holding unit 110 and is configured to be disposed so as to face the first holding unit 110. That is, the first substrate W1 held by the first holding unit 110 and the second substrate W2 held by the second holding unit 111 can be arranged to face each other.
- the second holding unit 111 is configured to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction by a moving mechanism (not shown), and is configured to be rotatable about the vertical axis.
- the pin holder method is adopted for the first holding unit 110.
- the first holding part 110 has a main body part 120 having a diameter larger than at least the first substrate W1 in plan view.
- a plurality of pins 121 that contact the back surface W1b of the first substrate W1 are provided on the lower surface of the main body 120.
- an outer wall portion 122 that supports the outer peripheral portion of the back surface W1b of the first substrate W1 is provided on the lower surface of the main body portion 120.
- the outer wall portion 122 is provided in an annular shape outside the plurality of pins 121.
- a partition wall 123 is provided on the lower surface of the main body 120 inside the outer wall 122.
- the partition wall 123 is provided in an annular shape concentrically with the outer wall 122.
- a region 124 inside the outer wall portion 122 (hereinafter also referred to as a suction region 124) includes a first suction region 124 a inside the partition wall portion 123 and a second suction region 124 b outside the partition wall portion 123. It is divided into and.
- a first suction port 125a for evacuating the first substrate W1 is formed in the first suction region 124a.
- the first suction port 125a is formed in two places in the first suction region 124a.
- a first suction pipe 126a provided in the main body 120 is connected to the first suction port 125a.
- a first vacuum pump 127a is connected to the first suction pipe 126a.
- a second suction port 125b for evacuating the first substrate W1 is formed in the lower surface of the main body 120 in the second suction region 124b.
- the second suction port 125b is formed in two places in the second suction region 124b.
- a second suction pipe 126b provided in the main body 120 is connected to the second suction port 125b.
- a second vacuum pump 127b is connected to the second suction pipe 126b.
- a through-hole 128 that penetrates the main body 120 in the thickness direction is formed at the center of the main body 120.
- the central portion of the main body portion 120 corresponds to the central portion of the first substrate W1 that is sucked and held by the first holding portion 110.
- tip part of the actuator part 131 in the pushing member 130 mentioned later is penetrated by the through-hole 128. As shown in FIG.
- a pressing member 130 that presses the central portion of the first substrate W1 is provided on the upper surface of the first holding unit 110.
- the pushing member 130 has an actuator part 131 and a cylinder part 132.
- the pushing member 130 controls the pressing load applied to the central portion of the first substrate W1 by the actuator unit 131, and controls the movement of the actuator unit 131 in the vertical direction by the cylinder unit 132. Then, the pressing member 130 can press the central portion of the first substrate W1 and the central portion of the second substrate W2 while abutting the first substrate W1 and the second substrate W2. it can.
- the second holding part 111 has a main body part 140 having a diameter larger than at least the second substrate W2 in plan view.
- a plurality of pins 141 that contact the back surface W2b of the second substrate W2 are provided on the upper surface of the main body 140.
- An outer wall 142 that supports the outer peripheral portion of the back surface W2b of the second substrate W2 is provided on the upper surface of the main body 140.
- the outer wall portion 142 is provided in an annular shape outside the plurality of pins 141.
- a partition wall 143 is provided on the upper surface of the main body 140 inside the outer wall 142.
- the partition wall 143 is provided in an annular shape concentrically with the outer wall 142.
- a region 144 inside the outer wall 142 (hereinafter, also referred to as a suction region 144) includes a first suction region 144a inside the partition wall 143 and a second suction region 144b outside the partition 143. It is divided into and.
- a first suction port 145a for evacuating the second substrate W2 is formed in the first suction region 144a.
- the first suction port 145a is formed in two places in the first suction region 144a.
- a first suction tube 146a provided inside the main body 140 is connected to the first suction port 145a.
- a first vacuum pump 147a is connected to the first suction pipe 146a.
- a second suction port 145b for evacuating the second substrate W2 is formed on the upper surface of the main body 140 in the second suction region 144b.
- the second suction port 145b is formed in two places in the second suction region 144b.
- a second suction pipe 146b provided in the main body 140 is connected to the second suction port 145b.
- a second vacuum pump 147b is connected to the second suction pipe 146b.
- the first substrate W1 is evacuated from the suction ports 125a and 125b, and the back surface W1b of the first substrate W1 is adsorbed to the first holding unit 110. Retained.
- the second substrate W2 is evacuated from the suction ports 145a and 145b, and the back surface W2b of the second substrate W2 is sucked and held by the second holding unit 111. Thereafter, the horizontal alignment and vertical alignment of the first substrate W1 and the second substrate W2 are performed.
- the actuator 131 is lowered by the cylinder 132 of the pushing member 130. Then, as the actuator portion 131 is lowered, the central portion of the first substrate W1 is pressed and lowered. Then, the central portion of the first substrate W1 and the central portion of the second substrate W2 are pressed and brought into contact with each other by the pushing member 130. At this time, the evacuation of the first substrate W1 from the first suction port 125a is stopped. Then, joining by the van der Waals force and the hydrogen bond starts between the central portion of the pressed first substrate W1 and the central portion of the second substrate W2 (thick line portion in FIG. 5B). .
- the bonding (bonding wave) between the surface W1a and the surface W2a diffuses from the central portion to the outer peripheral portion, and after the elapse of a predetermined time, the surface W1a is removed except for the outer peripheral portion. And the surface W2a are almost completely joined.
- evacuation of the first substrate W1 from the second suction port 125b is stopped. Then, the outer periphery of the first substrate W1 falls on the second substrate W2. Then, as shown in FIG. 5E, the surface W1a and the surface W2a are in contact with each other, and the first substrate W1 and the second substrate W2 are bonded.
- the reformer 30 irradiates the inside of the first substrate W1 before bonding with laser light to form a modified layer.
- the reformer 30 includes a holding unit 150 that holds the first substrate W1 with the back surface W1b on the upper side and the front surface W1a on the lower side.
- the holding unit 150 is configured to be movable in the X-axis direction and the Y-axis direction by the moving mechanism 151.
- the moving mechanism 151 is configured by a general precision XY stage.
- the holding unit 150 is configured to be rotatable around the vertical axis by the rotation mechanism 152.
- the laser irradiation unit 153 is a high-frequency pulsed laser beam oscillated from a laser beam oscillator (not shown), and a laser beam having a wavelength that is transmissive to the first substrate W1 The light is condensed and irradiated to a predetermined position inside the substrate W1.
- the portion where the laser beam L is condensed inside the first substrate W1 is modified, specifically, amorphized to form the modified layer M.
- the modified layer M extends in the depth direction and has a vertically long aspect ratio. As shown in FIG.
- the laser irradiation unit 153 may be configured to be movable in the X-axis direction and the Y-axis direction by the moving mechanism 154.
- the moving mechanism 154 is configured by a general precision XY stage.
- the laser irradiation unit 153 may be configured to be movable in the Z-axis direction by the lifting mechanism 155.
- the reformer 30 first, the first substrate W1 is held by the holding unit 150, and then the holding unit 150 is moved in the horizontal direction by the moving mechanism 151 to center the first substrate W1. Further, the position of the laser irradiation unit 153 is adjusted by the moving mechanism 154 so that the laser irradiation unit 153 is positioned immediately above a predetermined position of the first substrate W1. Thereafter, while the holding unit 150 is rotated by the rotation mechanism 152, the modified layer M is formed by irradiating the laser beam L from the laser irradiation unit 153 to the inside of the first substrate W1. In order to perform the above-described position adjustment, the reformer 30 may be provided with a camera (not shown) that images the position of the superposed substrate T.
- the holding unit 150 is moved in the horizontal direction.
- the laser irradiation unit 153 may be moved in the horizontal direction, or both the holding unit 150 and the laser irradiation unit 153 are moved. May be moved horizontally. Further, although the holding unit 150 is rotated, the laser irradiation unit 153 may be rotated.
- the processing apparatus 32 grinds the back surface W1b of the first substrate W1 bonded to the second substrate W2. As shown in FIG. 7, the lower end of the modified layer M is located above the target surface W1c (dotted line in FIG. 7) of the ground first substrate W1. In such a case, in the processing apparatus 32, the back surface W1b of the first substrate W1 is ground including the modified layer M, and the modified layer M does not remain on the ground first substrate W1.
- the modified layer M to be ground and removed here includes cracks extending from the modified portion.
- the first substrate W1 when the center portion of the first substrate W1 is pressed by the pressing member 130 and the modified layer M is deformed into a convex shape, The one substrate W1 is formed so that the elongation amount thereof is uniform within the substrate surface.
- the first substrate W1 has a (110) crystal plane and a (100) crystal plane, and a difference in elongation occurs due to the difference in crystal orientation.
- the modified layer M is formed so as to suppress the distortion by correcting the difference in elongation.
- the modified layer M is formed by amorphizing the portion where the laser light L emitted from the laser irradiation unit 153 is condensed.
- the portion of the first substrate W1 where the modified layer M is formed becomes amorphous, and the amount of elongation of the first substrate W1 changes.
- the difference in crystal orientation in the first substrate W1 is eliminated, and the difference in elongation due to the difference in crystal orientation can be corrected and suppressed.
- voids voids
- the elongation of the first substrate W1 can be absorbed by the voids and the amount of elongation can be corrected.
- the position on the first substrate W1 where the modified layer M is formed can be arbitrarily set.
- the modified layer M may be formed in a radial double manner at a position corresponding to the (110) crystal plane.
- the modified layers M may be formed in a radial double manner at positions corresponding to the (100) crystal plane.
- the modified layer M may be formed in a double shape in the radial direction concentrically with the first substrate W1.
- the modified layer M may be formed in a single layer in the radial direction, or may be formed in a triple layer or more. In any case, the modified layer M may be formed so that the extension amount of the first substrate W1 is uniform in the substrate plane.
- the modifications illustrated in FIGS. 8 to 10 are based on this crystal orientation.
- the formation position of the quality layer M can be controlled arbitrarily. Further, even when the distortion is known in advance, the formation position of the modified layer M can be arbitrarily controlled. In this way, the formation position of the modified layer M may be feedforward controlled based on the crystal orientation and distortion of the first substrate W1.
- the depth and width of the modified layer M may be controlled in order to make the extension amount of the first substrate W1 uniform.
- the bonding wave moves from the central part to the outer peripheral part.
- the stress applied to the first substrate W1 increases. That is, as the bonding wave moves, the stress applied to the first substrate W1 varies. Therefore, the degree of modification, for example, the depth and width of the modified layer M, may be controlled in the radial direction of the first substrate W1 according to the magnitude of this stress.
- the modified layer M may be formed in a plurality of layers in the depth direction. However, even when the modified layer M is formed in a plurality of layers in this way, it is desirable that all the modified layers M are removed by grinding the back surface W1b in the processing device 32.
- a cassette Cw1 storing a plurality of first substrates W1 and a cassette Cw2 storing a plurality of second substrates W2 are placed on the cassette mounting table 10 of the loading / unloading station 2.
- the first substrate W1 in the cassette Cw1 is taken out by the transport device 22 and transported to the reforming device 30.
- the laser beam L is irradiated from the laser irradiation unit 153 to the inside of the first substrate W ⁇ b> 1 held by the holding unit 150.
- the portion where the laser beam L is condensed is modified to form a modified layer M.
- the modified layer M is formed such that the lower end thereof is located above the target surface W1c of the ground first substrate W1.
- the modified layer M for example, as illustrated in FIGS. 8 to 10
- the difference in crystal orientation in the first substrate W1 is eliminated, and the difference in elongation due to the difference in crystal orientation is suppressed. Formed as follows.
- the first substrate W1 on which the modified layer M is formed is transferred to the bonding device 31 by the transfer device 22.
- the second substrate W2 in the cassette Cw2 is taken out by the transport device 22 and transported to the bonding device 31.
- the bonding apparatus 31 first, in the activation unit, the surface W1a of the first substrate W1 and the surface W2a of the second substrate W2 are activated, for example, by oxygenated oxygen ions or nitrogen ions. Thereafter, in the hydrophilization unit, pure water is supplied to the surface W1a and the surface W2a, and the surface W1a and the surface W2a are hydrophilized.
- the bonding apparatus 31 for example, in a reversing unit (not shown), the front and back surfaces of the first substrate W1 and the front and back surfaces of the second substrate W2 are reversed appropriately.
- the activated and hydrophilicized surface W1a and the surface W2a are joined in the joining unit.
- the bonding of the first substrate W1 and the second substrate W2 is as described with reference to FIG.
- the central portion of the first substrate W1 is pressed by the pressing member 130, and the first substrate W1 is deformed into a convex shape.
- the modified layer M is formed on the first substrate W1
- the difference in elongation due to the difference in crystal orientation is suppressed.
- the first substrate W1 is deformed into a convex shape, the amount of elongation becomes uniform within the substrate surface. Therefore, distortion during bonding can be suppressed, and the first substrate W1 and the second substrate W2 can be bonded appropriately.
- the superposed substrate T on which the first substrate W1 and the second substrate W2 are joined is transported to the processing device 32 by the transport device 22.
- the back surface W1b of the first substrate W1 in the superposed substrate T is ground to the target surface W1c shown in FIG.
- the back surface W1b of the first substrate W1 is ground including the modified layer M, and the modified layer M does not remain on the ground first substrate W1.
- the modified layer M is amorphous and has low strength. In this respect, in the present embodiment, since the modified layer M remains on the first substrate W1 after grinding, strong strength can be ensured.
- the superposed substrate T that has been subjected to all the processes is transported to the cassette Ct of the cassette mounting table 10 by the transport device 22.
- a series of substrate processing in the substrate processing system 1 is completed.
- the reforming device 30 forms the reformed layer M inside the first substrate W1, so that the first substrate W1 is deformed into a convex shape at the time of joining in the joining device 31.
- the difference in elongation due to the difference in crystal orientation is suppressed.
- the elongation amount of the first substrate W1 is uniform within the substrate surface. Therefore, distortion during bonding can be suppressed, and the first substrate W1 and the second substrate W2 can be bonded appropriately.
- the lower end of the modified layer M formed in the first substrate W1 by the reformer 30 is above the target surface W1c of the first substrate W1 after grinding. positioned.
- the back surface W1b of the first substrate W1 is ground including the modified layer M in the processing apparatus 32, and the modified layer M does not remain on the ground first substrate W1.
- substrate W1 after grinding can ensure strong intensity
- the modified layer M is formed in the first substrate W1 in the reformer 30.
- the modified layer M may be formed in the second substrate W2.
- the modified layer M may be formed in each of the inside of the first substrate W1 and the inside of the second substrate W2. In any case, the same effect as in the above embodiment can be enjoyed, that is, distortion during joining can be suppressed.
- the modified layer M is formed in the first substrate W1 in the reformer 30.
- the modified layer M is formed on the surface layer of the back surface W1b of the first substrate W1. May be.
- the surface layer of the back surface W1b is irradiated with a laser beam L and condensed.
- the modified layer M is formed in the part which the laser beam L condensed.
- the back surface W1b of the first substrate W1 is sucked and held by the first holding unit 110. At this time, friction may be generated between the holding surface of the first holding unit 110 and the back surface W1b, and stress may be generated in the first substrate W1 due to the friction. When stress is applied to the first substrate W1 in this way, the first substrate W1 is distorted.
- the modified layer M is formed on the surface layer of the back surface W1b as in this embodiment, the back surface W1b is roughened. Then, the frictional force between the roughened back surface W1b and the holding surface of the first holding unit 110 is reduced. As a result, stress generated in the first substrate W1 due to friction can be suppressed, and distortion of the first substrate W1 can be suppressed.
- the reformed layer M may be formed on the surface layer of the back surface W2b on the second substrate W2 as well as the first substrate W1.
- the frictional force between the roughened back surface W2b and the holding surface of the second holding unit 111 is reduced.
- stress generated in the second substrate W2 due to friction can be suppressed, and distortion of the second substrate W2 can also be suppressed.
- the modified layer M may be formed on the entire back surface W1b of the first substrate W1 and the entire surface of the second substrate W2, or the modified layer M may be locally formed. Also good. For example, when the distortion is known in advance, the modified layer M may be locally formed in accordance with the distortion.
- the modified layer M may be formed on both the inside of the first substrate W1 and the surface layer of the back surface W1b, or the modified layer M may be formed on either one. Similarly, the modified layer M may be formed on both the inside of the second substrate W2 and the surface layer of the back surface W2b, or the modified layer M may be formed on either one.
- the modified layer M is formed inside the first substrate W1 (inside the second substrate W2), and the surface layer of the back surface W1b of the first substrate W1 (the surface layer of the back surface W2b of the second substrate W2).
- the reforming layer M may be formed in a different reforming apparatus. In such a case, in the reformer that forms the reformed layer M on the surface layers of the back surfaces W1b and W2b, laser light having a wavelength that does not transmit through the first substrate W1 and the second substrate W2 may be used.
- the substrate processing system 1 of the above embodiment has the reforming device 30, the bonding device 31, and the processing device 32, but the configuration of the substrate processing system 1 is not limited to this.
- the bonding apparatus 31 and the processing apparatus 32 may be provided outside the substrate processing system 1.
- FIG. 11 is a plan view schematically showing the outline of the configuration of the substrate processing system 200.
- 12 and 13 are side views schematically showing the outline of the internal configuration of the substrate processing system 200, respectively.
- the photolithography process is performed on the substrate W.
- the substrate W is a semiconductor substrate such as a silicon substrate.
- the substrate processing system 200 has a configuration in which a carry-in / out station 210, a processing station 211, and an interface station 212 are integrally connected.
- a cassette C containing a plurality of substrates W is carried into and out of the carry-in / out station 210.
- the processing station 211 includes various processing apparatuses that perform predetermined processing on the substrate W.
- the interface station 212 is adjacent to the processing station 211 and transfers the substrate W to and from an exposure apparatus 213 that performs exposure processing on the substrate W.
- the loading / unloading station 210 is provided with a cassette mounting table 220.
- a cassette mounting table 220 In the illustrated example, a plurality of, for example, four cassettes C can be placed on the cassette mounting table 220 in a line in the Y-axis direction. Note that the number of cassettes C placed on the cassette mounting table 220 is not limited to this embodiment, and can be arbitrarily determined.
- the carry-in / out station 210 is provided with a transfer region 221 adjacent to the cassette mounting table 220.
- a transport device 223 that is movable on a transport path 222 extending in the Y-axis direction is provided.
- the transfer device 223 is also movable in the vertical direction and the vertical axis, and can transfer the substrate W between the cassette C and a transfer device of a third block G3 of the processing station 211 described later.
- the processing station 211 is provided with a plurality of, for example, four blocks including various devices, that is, a first block G1 to a fourth block G4.
- the first block G1 is provided on the front side of the processing station 211 (Y-axis negative direction side in FIG. 11), and the second block is provided on the back side of the processing station 211 (Y-axis positive direction side in FIG. 11).
- G2 is provided.
- a third block G3 is provided on the loading / unloading station 210 side (X-axis negative direction side in FIG. 11) of the processing station 211, and the interface station 212 side (X-axis positive direction side in FIG. 11) of the processing station 211. Is provided with a fourth block G4.
- a plurality of liquid processing devices for example, a developing device 230, a lower antireflection film forming device 231, a coating device 232, and an upper antireflection film forming device 233 are arranged in this order from the bottom.
- the developing device 230 develops the substrate W.
- the lower antireflection film forming apparatus 231 forms an antireflection film under the resist film of the substrate W.
- the coating apparatus 232 applies a resist solution as a coating solution to the substrate W to form a resist film.
- the upper antireflection film forming apparatus 233 forms an antireflection film on the resist film of the substrate W.
- the developing device 230, the lower antireflection film forming device 231, the coating device 232, and the upper antireflection film forming device 233 are arranged side by side in the horizontal direction.
- the number and arrangement of the developing device 230, the lower antireflection film forming device 231, the coating device 232, and the upper antireflection film forming device 233 can be arbitrarily selected.
- a heat treatment apparatus 240, a hydrophobic treatment apparatus 241 and a peripheral exposure apparatus 242 are provided side by side in the vertical direction and the horizontal direction.
- the heat treatment apparatus 240 performs a heat treatment such as heating or cooling of the substrate W.
- the hydrophobizing apparatus 241 performs a hydrophobizing process in order to improve the fixability between the resist solution and the substrate W.
- the peripheral exposure device 242 exposes the outer peripheral portion of the substrate W. Note that the number and arrangement of the heat treatment apparatus 240, the hydrophobic treatment apparatus 241, and the peripheral exposure apparatus 242 can be arbitrarily selected.
- a plurality of delivery devices 250, 251, 252, 253, 254, 255, 256 are provided in order from the bottom.
- the fourth block G4 is provided with a plurality of delivery devices 260, 261, and 262 in order from the bottom.
- a transport area 270 is formed in an area surrounded by the first block G1 to the fourth block G4.
- a plurality of transport devices 271 that can move around the horizontal direction, the vertical direction, and the vertical axis are arranged.
- the transfer device 271 can move in the transfer area 270 and transfer the substrate W to a predetermined device in the surrounding first block G1, second block G2, third block G3, and fourth block G4.
- a shuttle transport device 280 that transports the substrate W linearly between the third block G3 and the fourth block G4 is provided in the transport region 270.
- the shuttle transport device 280 is linearly movable, for example, in the X-axis direction of FIG.
- the shuttle transfer device 280 moves in the X-axis direction while supporting the substrate W, and can transfer the substrate W between the transfer device 252 of the third block G3 and the transfer device 262 of the fourth block G4.
- a transport device 290 that is movable around the horizontal direction, the vertical direction, and the vertical axis is provided next to the Y-axis positive direction side of the third block G3, for example.
- the transfer device 290 moves up and down while supporting the substrate W, and can transfer the substrate W to each delivery device in the third block G3.
- a transfer device 300 In the interface station 212, a transfer device 300, a delivery device 301, and a reforming device 30 are provided.
- the transport apparatus 300 is configured to be movable around, for example, the horizontal direction, the vertical direction, and the vertical axis.
- the transfer apparatus 300 can transfer the substrate W between each transfer apparatus, the transfer apparatus 301, the reforming apparatus 30, and the exposure apparatus 213 in the fourth block G4.
- the configuration of the reformer 30 is the same as that of the reformer 30 in the substrate processing system 1 of the first embodiment. However, in the reformer 30 of this embodiment, the reformed layer M is formed on the surface layer of the back surface Wb of the substrate W.
- the exposure apparatus 213 includes a mounting table 310, a light source 311, and a mask 312.
- the mounting table 310 mounts the back surface Wb of the substrate W by suction.
- the light source 311 is disposed above the mounting table 310.
- the light source 311 irradiates the surface Wa of the substrate W placed on the placement table 310 with light.
- the mask 312 is disposed between the mounting table 310 and the light source 311.
- the mask 312 is imprinted with a predetermined pattern.
- light is irradiated from the light source 311 to the substrate W on the mounting table 310 via the mask 312 to expose the resist film on the substrate W to a predetermined pattern.
- a cassette C storing a plurality of substrates W is placed on the cassette placing table 220 of the loading / unloading station 2.
- each substrate W in the cassette C is taken out by the transport device 223 and transported to the delivery device 253 of the third block G3 of the substrate W processing station 211.
- the substrate W is transferred to the heat treatment apparatus 240 of the second block G2 by the transfer apparatus 271 and subjected to temperature adjustment processing. Thereafter, the substrate W is transported to the lower antireflection film forming device 231 of the first block G1 by the transport device 271, and a lower antireflection film is formed on the substrate W. Thereafter, the substrate W is transferred to the heat treatment apparatus 240 of the second block G2, and heat treatment is performed. Thereafter, the substrate W is returned to the delivery device 253 of the third block G3.
- the substrate W is transported by the transport device 290 to the delivery device 254 of the third block G3. Thereafter, the substrate W is transported to the hydrophobizing apparatus 241 of the second block G2 by the transporting apparatus 271 and subjected to the hydrophobizing process.
- the substrate W is transported to the coating device 232 by the transport device 271, and a resist film is formed on the substrate W. Thereafter, the substrate W is transported to the heat treatment apparatus 240 by the transport apparatus 271 and pre-baked. Thereafter, the substrate W is transported to the delivery device 255 of the third block G3 by the transport device 271.
- the substrate W is transported to the upper antireflection film forming device 233 by the transport device 271, and an upper antireflection film is formed on the substrate W. Thereafter, the substrate W is transferred to the heat treatment apparatus 240 by the transfer apparatus 271 and heated to adjust the temperature. Thereafter, the substrate W is transferred to the peripheral exposure device 242 and subjected to peripheral exposure processing.
- the substrate W is transferred by the transfer device 271 to the delivery device 256 of the third block G3.
- the substrate W is transported to the delivery device 252 by the transport device 290, and is transported to the delivery device 262 of the fourth block G4 by the shuttle transport device 280.
- the substrate W is transported to the reformer 30 by the transport device 300 of the interface station 212, and the reformed layer M is formed on the surface layer of the back surface Wb.
- the modified layer M may be formed on the entire back surface Wb of the substrate W or locally. Note that the formation of the reformed layer M in the reformer 30 is the same as in the first embodiment.
- the substrate W is transported to the exposure device 213 by the transport device 300 and subjected to exposure processing in a predetermined pattern.
- the back surface Wb of the substrate W is sucked and held by the mounting table 310.
- friction may occur between the holding surface of the mounting table 310 and the back surface Wb of the substrate W, and stress may be generated in the substrate W due to the friction. .
- the first substrate W1 is distorted.
- the reforming layer M is formed on the surface of the back surface Wb of the substrate W in the reforming apparatus 30 as in the present embodiment, the back surface Wb is roughened. Then, the frictional force between the roughened back surface Wb and the holding surface of the mounting table 310 is reduced. As a result, stress generated in the substrate W due to friction can be suppressed, and distortion of the substrate W can be suppressed.
- the substrate W is transferred by the transfer device 300 to the delivery device 260 of the fourth block G4. Thereafter, the film is transferred to the heat treatment apparatus 240 by the transfer device 271 and subjected to post-exposure baking.
- the substrate W is transported to the developing device 230 by the transport device 271 and developed. After completion of the development, the substrate W is transferred to the heat treatment apparatus 240 by the transfer apparatus 290 and subjected to a post baking process.
- the substrate W is transported to the transfer device 250 of the third block G3 by the transport device 271 and then transported to the cassette C of the cassette mounting table 220 by the transport device 223 of the carry-in / out station 210. In this way, a series of substrate processing is completed.
- the reforming layer 30 is formed on the surface layer of the back surface Wb of the substrate W by the reforming apparatus 30, so that the frictional force between the back surface Wb and the holding surface of the mounting table 310 decreases. If it does so, the stress which generate
- a photolithography process is performed a plurality of times on the substrate W to form a pattern of a plurality of layers.
- the pattern in each layer can be appropriately formed at a predetermined position, so that the overlay (overlapping position accuracy) can be improved.
- the reforming layer 30 may be formed inside the substrate W in the reformer 30 as in the first embodiment.
- the distortion of the substrate W can be more reliably suppressed.
- the surface layer of the back surface Wb of the substrate W is processed before the processing in the processing apparatus is performed.
- the modified layer M may be formed.
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Abstract
Description
本願は、2018年6月12日に日本国に出願された特願2018-111598号に基づき、優先権を主張し、その内容をここに援用する。
153 レーザ照射部
W 基板
W1 第1の基板
W2 第2の基板
Claims (12)
- 基板を処理する基板処理方法であって、
少なくとも前記基板の裏面表層又は前記基板の内部に、レーザ光を照射して改質層を形成する改質工程と、
その後、前記基板の裏面が保持された状態で、当該基板の表面を処理する表面処理工程と、を有する。 - 請求項1に記載の基板処理方法において、
前記改質工程において、少なくとも第1の基板の裏面表層又は前記第1の基板の内部に、前記改質層を形成し、
前記表面処理工程において、前記第1の基板の表面と第2の基板の表面を接合する。 - 請求項2に記載の基板処理方法において、
前記改質工程において、前記第2の基板の裏面表層に前記改質層を形成する。 - 請求項2に記載の基板処理方法において、
前記表面処理工程は、
前記第1の基板の裏面を真空引きして第1の保持部で保持し、前記第2の基板の裏面を真空引きして第2の保持部で保持した後、当該第1の基板と第2の基板を対向対置する配置工程と、
その後、前記第1の保持部に設けられ、前記第1の基板の中心部を押圧する押動部材を下降させ、当該押動部材によって前記第1の基板の中心部と前記第2の基板の中心部を押圧して当接させる押圧工程と、
その後、前記第1の基板の中心部と前記第2の基板の中心部が押圧された状態で、前記第1の基板の中心部から外周部に向けて、前記第1の基板と前記第2の基板を順次接合する接合工程と、を有する。 - 請求項2に記載の基板処理方法において、
前記改質工程の後、前記第1の基板の裏面を研削する加工工程を有し、
前記改質工程において、前記改質層は、前記加工工程において前記第1の基板が当該改質層を含めて研削される位置に形成される。 - 請求項1に記載の基板処理方法において、
前記改質工程において、前記基板の裏面表層に前記改質層を形成し、
前記表面処理工程において、前記基板の表面にフォトリソグラフィー処理における露光処理を行う。 - 基板の裏面が保持された状態で基板の表面を処理する前に、当該基板に改質層を形成する改質装置であって、
少なくとも前記基板の裏面表層又は前記基板の内部に、レーザ光を照射して改質層を形成するレーザ照射部を有する。 - 基板を処理する基板処理システムであって、
少なくとも第1の基板の裏面表層又は前記第1の基板の内部に、レーザ光を照射して改質層を形成するレーザ照射部を備えた改質装置と、
前記改質層が形成された前記第1の基板の表面と、第2の基板の表面とを接合する接合装置と、
前記改質装置と前記接合装置に対して、前記第1の基板と前記第2の基板を搬送する搬送装置と、を有する。 - 請求項8に記載の基板処理システムにおいて、
前記改質装置は、前記第2の基板の裏面表層に前記改質層を形成する。 - 請求項8に記載の基板処理システムにおいて、
前記接合装置は、
前記第1の基板の裏面を吸着保持する第1の保持部と、
前記第2の基板の裏面を吸着保持する第2の保持部と、
前記第1の保持部に設けられ、前記第1の基板の中心部を押圧する押動部材と、を有する。 - 請求項8に記載の基板処理システムにおいて、
前記改質層が形成された前記第1の基板の裏面を研削する加工装置を有し、
前記改質装置は、前記加工装置において前記第1の基板が前記改質層を含めて研削される位置に、当該改質層を形成する。 - 基板を処理する基板処理システムであって、
少なくとも前記基板の裏面表層又は前記基板の内部に、レーザ光を照射して改質層を形成するレーザ照射部を備えた改質装置と、
前記基板の表面に塗布液を塗布する塗布装置と、
露光処理後の前記基板を現像処理する現像装置と、
前記改質装置、前記塗布装置及び前記現像装置に対して、前記基板を搬送する搬送装置と、を有し、
前記改質装置は、前記基板の裏面が保持された状態で当該基板の表面に露光処理を行う前に、前記改質層を形成する。
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