WO2019013009A1 - Procédé de fabrication d'un corps d'emballage ayant une couche d'étanchéité fixée à celui-ci, et procédé de fabrication d'emballage étanche à l'air - Google Patents

Procédé de fabrication d'un corps d'emballage ayant une couche d'étanchéité fixée à celui-ci, et procédé de fabrication d'emballage étanche à l'air Download PDF

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Publication number
WO2019013009A1
WO2019013009A1 PCT/JP2018/024616 JP2018024616W WO2019013009A1 WO 2019013009 A1 WO2019013009 A1 WO 2019013009A1 JP 2018024616 W JP2018024616 W JP 2018024616W WO 2019013009 A1 WO2019013009 A1 WO 2019013009A1
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Prior art keywords
sealing material
material layer
package
glass
laser
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PCT/JP2018/024616
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English (en)
Japanese (ja)
Inventor
将行 廣瀬
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日本電気硝子株式会社
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Publication of WO2019013009A1 publication Critical patent/WO2019013009A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container

Definitions

  • the present invention relates to a method of manufacturing a package substrate with a sealing material layer and a method of manufacturing an airtight package.
  • the hermetic package generally includes a package base having a base and a frame provided on the base, a glass lid having light transparency, and an internal element housed in an inner space surrounded by them. Have.
  • An internal element such as a MEMS (micro-electro-mechanical system) element mounted inside the hermetic package may be deteriorated by moisture intruding from the surrounding environment.
  • MEMS micro-electro-mechanical system
  • an organic resin adhesive having a low temperature curing property has been used to integrate the package base and the glass lid.
  • the organic resin-based adhesive can not completely shield moisture and gas, the internal element may be deteriorated with time.
  • the sealing portion is less likely to be deteriorated by the moisture of the surrounding environment, and the airtight reliability of the airtight package can be easily secured.
  • the glass powder has a softening temperature higher than that of the organic resin adhesive, there is a possibility that the internal element may be thermally deteriorated at the time of sealing. From such a situation, in recent years, laser sealing has attracted attention.
  • the sealing material layer is softened and deformed, and the glass lid and the package substrate are airtightly integrated.
  • the laser sealing it is possible to locally heat only the portion to be sealed, and the package base and the glass lid can be airtightly integrated without thermally deteriorating the internal element.
  • JP 2014-224006 Japanese Patent Application Publication No. 2014-177356
  • a sealing material layer is formed on the glass lid side, but a sealing material layer is not formed on the package substrate side.
  • the sealing material layer is formed in advance on the top of the frame of the package base by electric furnace firing, the internal elements housed in the frame of the package base are thermally degraded.
  • the present invention has been made in view of the above circumstances, and the technical object thereof is a method of effectively securing sealing strength at the interface between a package base and a sealing material layer while preventing thermal deterioration of internal elements. To provide.
  • the present inventor has found that the above problem can be solved by using a sealing material paste having a low resin ratio and sintering a dried film by laser light irradiation. That is, in the method of manufacturing a package base having a sealing material layer according to the present invention, a process of preparing a package base having a base and a frame provided on the base, kneading a sealing material and a vehicle, A process of producing a sealing material paste having a content of less than 0.6% by mass, a process of applying the sealing material paste on the top of the frame portion of the package base and drying to produce a dry film, and a dry film And a step of sintering the dried film by irradiating a laser beam to obtain a sealing material layer.
  • the sealing material paste is applied and dried to obtain a dried film. It is characterized by producing.
  • the dried film is sintered by the irradiation of the laser beam, the energy loss due to the heat of decomposition of the resin is reduced, so that it is possible to use the laser beam of low output.
  • thermal deterioration of the internal element can be suppressed.
  • the resin is less likely to remain in the sealing material layer. As a result, at the time of laser sealing, re-decomposition of resin in the sealing material layer is less likely to occur, and it is possible to prevent flow failure and foaming of the sealing material layer.
  • the dried film is sintered by irradiating the dried film with a laser beam, and the sealing is made to have an average thickness of 1.0 to 10.0 ⁇ m. It is preferable to obtain a material layer.
  • the absorptivity of monochromatic light having a wavelength of 808 nm of the sealing material layer is preferably 5 to 50% per 1 ⁇ m thickness.
  • the method further comprises the step of housing the internal element in the frame of the package base before forming the dry film on the top of the frame of the package base. preferable.
  • the package base is preferably any of glass ceramic, aluminum nitride, aluminum oxide, or a composite material of these.
  • a process of preparing a package substrate with a sealing material layer by the method of producing a package substrate with a sealing material layer, a process of preparing a glass lid, and a sealing material A step of laminating and arranging the package base and the glass lid through the layers, and irradiating the laser light from the glass lid side to soften and deform the sealing material layer, the glass lid and the package base are airtightly integrated to form an airtight package.
  • the method comprises the steps of
  • the method for manufacturing a package base having a sealing material layer of the present invention comprises the step of preparing a package base having a base and a frame provided on the base.
  • a package base having a base and a frame provided on the base can house internal elements within the frame.
  • the frame portion of the package base is preferably formed in a frame shape on the outer periphery of the package base. In this way, the effective area functioning as a device can be expanded.
  • the internal element can be easily accommodated in the space in the hermetic package, and the wiring connection can be easily performed.
  • the width of the top of the frame is preferably 100 to 3000 ⁇ m, 200 to 1500 ⁇ m, in particular 300 to 900 ⁇ m.
  • the width of the top of the frame is too narrow, it becomes difficult to form the sealing material layer on the top of the frame.
  • the width of the top of the frame is too wide, the effective area to function as a device decreases.
  • the height of the frame of the package base ie the height of the package base minus the thickness of the base, is preferably 100 to 3000 ⁇ m, in particular 200 to 2500 ⁇ m. In this way, it is easy to reduce the thickness of the hermetic package while properly accommodating the internal elements.
  • the thickness of the base of the package substrate is preferably 0.1 to 4.5 mm, particularly 0.2 to 3.5 mm. Thus, the airtight package can be thinned.
  • the package substrate is preferably glass, glass ceramic, aluminum nitride, aluminum oxide, or a composite material of these (for example, an integrated product of aluminum nitride and glass ceramic).
  • the glass ceramic can easily form the sealing material layer and the reaction layer, so that strong sealing strength can be secured at the interface between the package base and the sealing material layer.
  • the thermal via can be easily formed, it is possible to properly prevent the temperature rise of the hermetic package from being excessive. Since aluminum nitride and aluminum oxide have good heat dissipation, it is possible to appropriately prevent the temperature rise of the hermetic package excessively.
  • the package substrate can absorb the laser light transmitted through the sealing material layer.
  • the portion of the package base in contact with the sealing material layer is heated, so that the formation of a reaction layer can be promoted at the interface between the sealing material layer and the package base.
  • the method for producing a package base with a sealing material layer of the present invention has a step of kneading a sealing material and a vehicle to produce a sealing material paste having a resin amount of less than 0.6% by mass.
  • the sealing material is generally a composite material powder containing a glass powder and a refractory filler powder, and if necessary, a laser absorber such as a color pigment may be added.
  • the sealing material is a material that softens and flows during laser sealing to airtightly integrate the package base and the glass lid.
  • the vehicle generally refers to a mixture of resin and solvent, ie a viscous solution in which the resin is dissolved, for dispersing the sealing material and uniformly applying the sealing material paste on top of the frame of the package substrate. It is a material. In addition, surfactants, thickeners, etc. may be added to the vehicle as needed.
  • a composite powder containing a bismuth-based glass powder and a refractory filler powder from the viewpoint of enhancing the laser sealing strength. It is preferable to use a composite powder containing 55 to 100% by volume of bismuth based glass powder and 0 to 45% by volume of refractory filler powder as a composite powder, and 60 to 95% by volume of bismuth based glass powder and 5 to 40%. It is further preferred to use a composite powder containing a volume percent refractory filler powder, and in particular to use a composite powder containing 60 to 85 volume percent bismuth-based glass powder and 15 to 40 volume percent refractory filler powder. preferable.
  • the addition of the refractory filler powder facilitates matching the thermal expansion coefficient of the sealing material layer to the thermal expansion coefficients of the glass lid and the package substrate. As a result, it becomes easy to prevent the situation in which an excessive stress remains in the sealing portion after the laser sealing. On the other hand, if the content of the refractory filler powder is too large, the content of the bismuth-based glass powder relatively decreases, so the surface smoothness of the sealing material layer is reduced and the laser sealing accuracy is easily reduced. Become.
  • the softening point of the sealing material is preferably 510 ° C. or less, 480 ° C. or less, in particular 450 ° C. or less. If the softening point of the sealing material is too high, it will be difficult to improve the surface smoothness of the sealing material layer.
  • the lower limit of the softening point of the sealing material is not particularly set, but in consideration of the thermal stability of the glass powder, the softening point of the sealing material is preferably 350 ° C. or more.
  • the "softening point" corresponds to the fourth inflection point when measured by the macro DTA apparatus.
  • Bismuth-based glass is a glass composition including, in mol%, Bi 2 O 3 28 ⁇ 60%, B 2 O 3 15 ⁇ 37%, ZnO 0 ⁇ 30%, CuO + MnO (CuO and the total amount of MnO) 1 ⁇ 40% It is preferable to contain The reason which limited the content range of each component as mentioned above is demonstrated below. In addition, in description of a glass composition range,% indication refers to mol%.
  • Bi 2 O 3 is a main component to lower the softening point.
  • the content of Bi 2 O 3 is preferably 28 to 60%, 33 to 55%, in particular 35 to 45%. If the content of Bi 2 O 3 is too low, the softening point becomes too high, and the softening flowability tends to be reduced. On the other hand, when the content of Bi 2 O 3 is too large, the glass is likely to be devitrified at the time of laser sealing, and due to the devitrification, the softening flowability is easily reduced.
  • B 2 O 3 is an essential component as a glass forming component.
  • the content of B 2 O 3 is preferably 15 to 37%, 19 to 33%, in particular 22 to 30%. If the content of B 2 O 3 is too small, it becomes difficult to form a glass network, so that the glass tends to be devitrified at the time of laser sealing. On the other hand, when the content of B 2 O 3 is too large, the viscosity of the glass becomes high, and the softening flowability tends to be reduced.
  • ZnO is a component that enhances the devitrification resistance.
  • the content of ZnO is preferably 0 to 30%, 3 to 25%, 5 to 22%, in particular 5 to 20%. When the content of ZnO is too large, the component balance of the glass composition is broken, and the devitrification resistance tends to be reduced.
  • CuO and MnO are components that greatly enhance the laser absorption capacity.
  • the total amount of CuO and MnO is preferably 1 to 40%, 3 to 35%, 10 to 30%, especially 15 to 30%.
  • the total amount of CuO and MnO is too small, the laser absorptivity tends to be reduced.
  • the total amount of CuO and MnO is too large, the softening point becomes too high, and the glass becomes difficult to soften and flow even when the laser light is irradiated. In addition, the glass becomes thermally unstable, and the glass tends to be devitrified at the time of laser sealing.
  • the content of CuO is preferably 1 to 30%, particularly 10 to 25%.
  • the content of MnO is preferably 0 to 25%, 1 to 25%, in particular 3 to 15%.
  • SiO 2 is a component that enhances water resistance.
  • the content of SiO 2 is preferably 0 to 5%, 0 to 3%, 0 to 2%, in particular 0 to 1%. If the content of SiO 2 is too large, the softening point may be unduly increased. In addition, the glass tends to be devitrified during laser sealing.
  • Al 2 O 3 is a component that enhances water resistance.
  • the content of Al 2 O 3 is preferably 0 to 10%, 0.1 to 5%, especially 0.5 to 3%. If the content of Al 2 O 3 is too large, the softening point may be unduly increased.
  • Li 2 O, Na 2 O and K 2 O are components that reduce the devitrification resistance. Therefore, the content of Li 2 O, Na 2 O and K 2 O is preferably 0 to 5%, 0 to 3%, particularly 0 to less than 1%.
  • MgO, CaO, SrO and BaO are components that enhance the devitrification resistance, but are components that increase the softening point. Therefore, the content of MgO, CaO, SrO and BaO is preferably 0 to 20%, 0 to 10%, particularly 0 to 5%.
  • Fe 2 O 3 is a component that enhances the devitrification resistance and the laser absorption capacity.
  • the content of Fe 2 O 3 is preferably 0 to 10%, 0.1 to 5%, in particular 0.4 to 2%. When the content of Fe 2 O 3 is too large, the component balance of the glass composition is lost and the devitrification resistance tends to be reduced.
  • Sb 2 O 3 is a component that enhances the devitrification resistance.
  • the content of Sb 2 O 3 is preferably 0 to 5%, in particular 0 to 2%. When the content of Sb 2 O 3 is too large, the component balance of the glass composition is lost, and the devitrification resistance tends to decrease.
  • the average particle size D 50 of the glass powder is preferably less than 15 ⁇ m, 0.5 to 10 ⁇ m, in particular 1 to 5 ⁇ m. As the average particle diameter D 50 of the glass powder is small, the softening point of the glass powder is lowered.
  • “average particle diameter D 50 ” refers to a value measured on a volume basis by a laser diffraction method.
  • the refractory filler powder is preferably one or more selected from cordierite, zircon, tin oxide, niobium oxide, zirconium phosphate ceramic, willemite, ⁇ -eucryptite and ⁇ -quartz solid solution, particularly preferably ⁇ - Eucryptite or cordierite is preferred.
  • these refractory filler powders have high mechanical strength and good compatibility with bismuth-based glasses.
  • the average particle size D 50 of the refractory filler powder is preferably less than 2 ⁇ m, in particular greater than or equal to 0.1 ⁇ m and less than 1.5 ⁇ m. If the average particle diameter D 50 of the refractory filler powder is too large, the surface smoothness of the sealing material layer is likely to be reduced and the average thickness of the sealing material layer is likely to be large. As a result, the laser sealing accuracy is It becomes easy to fall.
  • the 99% particle size D 99 of the refractory filler powder is preferably less than 5 ⁇ m, 4 ⁇ m or less, in particular 0.3 ⁇ m or more and 3 ⁇ m or less. If the 99% particle size D 99 of the refractory filler powder is too large, the surface smoothness of the sealing material layer is likely to be reduced, and the average thickness of the sealing material layer is likely to be large. Tends to decrease.
  • “99% particle size D 99 ” refers to a value measured on a volume basis by a laser diffraction method.
  • the sealing material may further contain a laser absorber in order to enhance the light absorption characteristics, but the laser absorber has an action to promote the devitrification of the bismuth-based glass. Therefore, the content of the laser absorbing material in the sealing material layer is preferably 10% by volume or less, 5% by volume or less, 1% by volume or less, 0.5% by volume or less, particularly preferably substantially not contained. If the devitrification resistance of the bismuth-based glass is good, the laser absorbing material may be introduced in an amount of 1% by volume or more, in particular 3% by volume or more, in order to enhance the laser absorbing ability.
  • the laser absorber Cu-based oxides, Fe-based oxides, Cr-based oxides, Mn-based oxides, spinel-type composite oxides of these, and the like can be used.
  • the thermal expansion coefficient of the sealing material is preferably 55 ⁇ 10 ⁇ 7 to 110 ⁇ 10 ⁇ 7 / ° C., 60 ⁇ 10 ⁇ 7 to 105 ⁇ 10 ⁇ 7 / ° C., in particular 65 ⁇ 10 ⁇ 7 to 100 ⁇ 10 ⁇ It is 7 / ° C.
  • the “thermal expansion coefficient” is a value measured by a TMA (push rod type thermal expansion coefficient measurement) device in a temperature range of 30 to 300 ° C.
  • the sealing material paste is usually prepared by kneading the sealing material and the vehicle by a triple roller or the like.
  • the vehicle as described above, usually comprises a resin and a solvent.
  • the resin is added for the purpose of adjusting the viscosity of the paste.
  • a high molecular weight resin for example, a resin having a molecular weight of more than 250, generates a large decomposition heat upon irradiation with a laser beam, which makes it difficult to sinter the dried film.
  • the amount of resin in the sealing material paste is less than 0.6% by mass, preferably 0.5% by mass or less, 0.4% by mass or less, 0.3% by mass or less, 0.2% by mass or less, particularly 0 Less than 1% by mass. If the amount of resin in the sealing material paste is too large, energy loss due to decomposition heat of the resin increases when sintering the dried film by laser light irradiation, so it is not possible to use low-power laser light It will be possible. As a result, the internal elements are susceptible to thermal degradation. Furthermore, when the dried film is sintered by laser light irradiation, the resin tends to remain in the sealing material layer. As a result, at the time of laser sealing, re-decomposition of the resin occurs in the sealing material layer, and flow defects and foaming easily occur in the sealing material layer.
  • a vehicle substantially free of resin a vehicle having a resin amount of less than 0.1% by mass.
  • acrylic acid ester acrylic resin
  • ethyl cellulose polyethylene glycol derivative
  • nitrocellulose polymethyl styrene
  • polyethylene carbonate polypropylene carbonate
  • methacrylic acid ester etc.
  • N, N'-dimethylformamide (DMF), ⁇ -terpineol, higher alcohol, ⁇ -butyl lactone ( ⁇ -BL), tetralin, terpene, butyl carbitol acetate, ethyl acetate, isoamyl acetate, diethylene glycol Monoethyl ether, diethylene glycol monoethyl ether acetate, benzyl alcohol, toluene, 3-methoxy-3-methylbutanol, triethylene glycol monomethyl ether, triethylene glycol dimethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monobutyl ether, tripropylene glycol Monomethyl ether, tripropylene glycol monobutyl ether, propylene carbonate, dimethyl sulfone De (DMSO), N-methyl-2-pyrrolidone and the like can be used.
  • the method for manufacturing a package base with a sealing material layer according to the present invention preferably includes the step of containing the internal element in the frame of the package base before forming the dry film on the top of the frame of the package base. In this way, the manufacturing efficiency of the hermetic package can be enhanced.
  • the method for producing a package base with a sealing material layer of the present invention comprises the steps of applying a sealing material paste onto the top of the frame of the package base and drying it to produce a dried film. It is preferable to use coating machines, such as a dispenser and a screen printer, for application
  • the drying of the coating film is preferably higher than the lower limit temperature at which the solvent in the sealing material paste evaporates, and lower than the upper temperature limit of the internal element.
  • the method for producing a package base having a sealing material layer of the present invention comprises the step of irradiating the dried film with a laser beam to sinter the dried film to obtain a sealing material layer.
  • Various lasers can be used as a laser for irradiating the dried film.
  • near infrared semiconductor lasers are preferable in terms of easy handling.
  • the beam diameter of the laser is preferably larger than the width of the dry film in order to make the sintering state uniform.
  • the external atmosphere at the time of laser beam irradiation is not particularly limited, and may be an air atmosphere or an inert atmosphere such as a nitrogen atmosphere.
  • the laser light When the laser light is irradiated, it is preferable to preheat the package substrate at a temperature of 100 ° C. or more and a heat resistance temperature of the internal element or less. As a result, the temperature difference between the inner and outer surfaces of the dry film is reduced, and the surface state of the sealing material layer is likely to be uniform and smooth.
  • the scanning of the laser onto the dry film may be performed at a constant speed, or the speed may be changed in any area.
  • the sealing material layer is preferably formed such that the contact position with the frame is separated from the inner edge of the top of the frame and is separated from the outer edge of the top of the frame, More preferably, they are formed at a distance of 50 ⁇ m or more, 60 ⁇ m or more, 70 to 2000 ⁇ m, particularly 80 to 1000 ⁇ m from the inner edge of the top of the frame. If the distance between the inner edge of the top of the frame and the sealing material layer is too short, the heat generated by local heating will be difficult to escape during laser sealing, so the glass cover is likely to be damaged during the cooling process. . On the other hand, if the distance between the inner edge of the top of the frame and the sealing material layer is too long, it becomes difficult to miniaturize the hermetic package.
  • it is preferably formed at a position separated by 50 ⁇ m or more, 60 ⁇ m or more, 70 to 2000 ⁇ m, particularly 80 to 1000 ⁇ m from the outer edge of the top of the frame. If the distance between the outer edge of the top of the frame and the sealing material layer is too short, the heat generated by the local heating becomes difficult to escape during laser sealing, so the glass cover is easily damaged during the cooling process. . On the other hand, if the distance between the outer edge of the top of the frame and the sealing material layer is too long, it becomes difficult to miniaturize the hermetic package.
  • the surface roughness Ra of the surface of the sealing material layer is preferably less than 0.5 ⁇ m, 0.2 ⁇ m or less, in particular 0.01 to 0.15 ⁇ m. Further, the surface roughness RMS of the sealing material layer is preferably less than 1.0 ⁇ m, and not more than 0.5 ⁇ m, and particularly 0.05 to 0.3 ⁇ m. In this way, the laser sealing accuracy is improved.
  • “surface roughness Ra” and “surface roughness RMS” can be measured, for example, by a stylus type or non-contact type laser film thickness meter or surface roughness meter.
  • the average thickness of the sealing material layer is preferably 10.0 ⁇ m or less, in particular 1.0 ⁇ m or more and less than 6.0 ⁇ m. As the average thickness of the sealing material layer is smaller, the stress remaining in the sealing portion after the laser sealing can be reduced when the thermal expansion coefficients of the sealing material layer and the glass lid are mismatched. It is also possible to improve the laser sealing accuracy.
  • a method of regulating the average thickness of the sealing material layer as described above a method of applying a thin sealing material paste and a method of polishing the surface of the sealing material layer may be mentioned.
  • the absorptivity (thickness direction) of monochromatic light with a wavelength of 808 nm of the sealing material layer is preferably 20 to 90%, particularly 30 to 60%.
  • the absorptivity of monochromatic light with a wavelength of 808 nm of the sealing material layer is preferably 5 to 50%, particularly 7 to 30%, per 1 ⁇ m thickness.
  • the light absorptivity with monochromatic light of wavelength 808 nm refers to a value obtained by measuring the reflectance and the transmittance with a spectrophotometer and subtracting the total value from 100%.
  • the method for producing an airtight package comprises the steps of preparing a package substrate with a sealing material layer, preparing a glass lid, and a sealing material layer according to the method of producing a package substrate with a sealing material layer described above.
  • the step of laminating and arranging the package base and the glass lid, and irradiating the laser light from the glass lid side to soften and deform the sealing material layer, the glass lid and the package base are airtightly integrated to obtain an airtight package. It is preferable to provide the process of
  • Various glasses can be used as the glass lid.
  • alkali-free glass borosilicate glass, soda lime glass can be used.
  • the thickness of the glass lid is preferably 0.01 to 2.0 mm, 0.1 to 1 mm, and particularly 0.2 to 0.7 mm. Thus, the airtight package can be thinned.
  • a functional film may be formed on the surface on the inner element side of the glass lid, or may be formed on the outer surface of the glass lid.
  • an antireflective film is preferable as the functional film. Thereby, the light reflected by the surface of a glass lid can be reduced.
  • the manufacturing method of the airtight package of the present invention includes the step of laminating and arranging the package base and the glass lid through the sealing material layer.
  • the glass lid may be disposed below the package substrate, it is preferable to dispose the glass lid above the package substrate from the viewpoint of the efficiency of laser sealing.
  • a sealing material layer is preferably formed on the surface of the glass lid, in which case the center lines of the sealing material layer formed on the package substrate and the sealing material layer formed on the glass lid overlap with each other.
  • the package base and the glass lid are stacked.
  • the sealing pattern of the sealing material layer formed on the glass lid is preferably substantially the same as the sealing pattern of the sealing material layer formed on the top of the frame portion of the package base. In this way, the laser sealing accuracy and the laser sealing strength can be simultaneously enhanced.
  • the method for manufacturing an airtight package of the present invention comprises the step of airtightly integrating the glass lid and the package base by irradiating the laser light from the glass lid side to soften and deform the sealing material layer to obtain an airtight package.
  • the atmosphere in which the laser sealing is performed is not particularly limited, and may be an air atmosphere or an inert atmosphere such as a nitrogen atmosphere.
  • the glass lid When performing laser sealing, if the glass lid is preheated at a temperature of (100 ° C. or more and the heat-resistant temperature of the internal element), cracking of the glass lid due to thermal shock can be suppressed. Further, immediately after the laser sealing, when the annealing laser is irradiated from the glass lid side, it is possible to suppress the breakage of the glass lid due to the thermal shock.
  • the package substrate When performing laser sealing, if the package substrate is preheated at a temperature of (100 ° C. or more and the heat-resistant temperature of the internal element), the heat conduction to the package substrate side can be inhibited at the time of laser sealing. Wearing can be performed efficiently.
  • FIG. 1 is a schematic cross-sectional view for explaining an embodiment of the present invention.
  • the hermetic package 1 includes a package base 10 and a glass lid 11.
  • the package base 10 has a base 12 and further has a frame 13 on the outer peripheral edge of the base 12. Further, the internal element 14 is accommodated in the frame portion 13 of the package base 10.
  • the sealing material layer 16 is formed on the top 15 of the frame 13, and the surface of the top 15 is polished in advance, and the surface roughness Ra is 0.15 ⁇ m or less. .
  • the width of the sealing material layer 16 is slightly smaller than the width of the frame 13.
  • the sealing material layer 16 is obtained by applying and drying a sealing material paste to produce a dried film, and then irradiating the dried film with a laser beam to sinter the dried film.
  • the sealing material paste has a resin content of less than 0.6% by mass, and is produced by kneading the sealing material and the vehicle with a three-roller or the like.
  • the sealing material contains a bismuth-based glass containing a transition metal oxide in the glass composition and a refractory filler powder.
  • an electrical wiring (not shown) for electrically connecting the internal element 14 and the outside is formed.
  • a sealing material layer 17 in the shape of a frame is formed on the surface of the glass lid 11.
  • the sealing material layer 17 is obtained by sintering the sealing material, and has substantially the same material configuration as the sealing material layer 16, and the sealing material is bismuth containing a transition metal oxide in the glass composition. It contains a system glass and a refractory filler powder.
  • the width of the sealing material layer 17 is substantially the same as the width of the sealing material layer 16. Furthermore, the thickness of the sealing material layer 17 is slightly smaller than the thickness of the sealing material layer 16.
  • the package base 10 and the glass lid 11 are disposed so as to be stacked such that the glass lid 11 is on the upper side and center lines in the width direction of the sealing material layer 16 and the sealing material layer 17 contact each other. Thereafter, the laser light L emitted from the laser irradiation device 18 is irradiated along the sealing material layer 16 and the sealing material layer 17 from the glass lid 11 side. Thereby, after the sealing material layer 16 and the sealing material layer 17 soften and flow, the package base 10 and the glass lid 11 are airtightly integrated, and the airtight structure of the airtight package 1 is formed.
  • Table 1 shows Examples of the present invention (Sample Nos. 1 to 4) and Comparative Examples (Sample Nos. 5 to 8).
  • a glass batch prepared by preparing raw materials such as various oxides and carbonates was prepared so as to obtain a desired glass composition, and this was put in a platinum crucible and melted at 1200 ° C. for 2 hours. Next, each obtained molten glass was shape
  • Sample No. The glass powders according to 1, 2, 5 and 6 have, as a glass composition, 39% Bi 2 O 3 , 23.7% B 2 O 3 , 14.1% ZnO, Al 2 O 3 2.7 by mol% %, CuO 20%, Fe 2 O 3 0.6%, Sample No.
  • the average particle size D 50 of the bismuth-based glass powder is 1.0 ⁇ m
  • the 99% particle size D 99 is 2.5 ⁇ m
  • the average particle size D 50 of the refractory filler powder is 1.0 ⁇ m
  • 99% particle size D 99 was 2.5 ⁇ m.
  • the refractory filler powder is ⁇ -eucryptite.
  • the thermal expansion coefficient of the obtained sealing material was measured, and the thermal expansion coefficient was 71 ⁇ 10 ⁇ 7 / ° C.
  • the thermal expansion coefficient is measured by a push rod type TMA device, and the measurement temperature range is 30 to 300 ° C.
  • the thickness of the package base (30 mm ⁇ 30 mm, frame height 3 mm, frame width 2 mm) made of alumina has a thickness in the table along the center line of the top of the frame And the sealing material layer of width 0.5 mm was formed.
  • the above sealing material and the vehicle are kneaded such that the viscosity is about 100 Pa ⁇ s (25 ° C., Shear rate: 4), and the mixture is further mixed with a three-roll mill until the powder is uniformly dispersed.
  • the paste was sintered to obtain a sealing material paste.
  • Sample No. In 1 and 3 a terpene solution was used as a vehicle.
  • Sample No. In 2 and 4 what dissolved ethyl cellulose resin in a terpene type solution was used as a vehicle.
  • Sample No. In 5 to 8 a vehicle obtained by dissolving ethyl cellulose resin in tripropylene glycol monobutyl ether was used as a vehicle.
  • the sealing material paste is printed by a screen printing machine so that the center line of the top of the frame portion of the package base and the center line in the width direction of the sealing material layer coincide with each other.
  • the dried film was formed on the top of the frame of the package substrate by drying at 10 ° C. for 10 minutes.
  • the package substrate is fixed with a jig so that the dry film is on the top, and the dry film is softened and deformed by irradiating it with a semiconductor laser having a wavelength of 808 nm at an irradiation speed of 8 mm / sec.
  • a sealing material layer was formed on the top of the frame of the package base.
  • a sealing material paste is applied in the same pattern as the sealing material layer formed on the package base on one surface of a 0.3mm thick, 29.8 mm ⁇ 29.8 mm borosilicate glass (BDA made by NEG). After drying at 100 ° C. for 10 minutes in an air atmosphere, firing was performed at 520 ° C. for 10 minutes in an electric furnace to produce a glass lid with a sealing material layer.
  • BDA 29.8 mm ⁇ 29.8 mm borosilicate glass
  • the package substrate and the glass lid were stacked and arranged such that the sealing material layer formed on the package substrate and the sealing material layer formed on the glass lid were in contact with each other.
  • a semiconductor laser with a wavelength of 808 nm is irradiated at an irradiation speed of 15 mm / sec toward the sealing material layer from the glass lid side to soften and deform the sealing material layer
  • the package substrate and the glass lid were airtightly integrated to obtain an airtight package.
  • the laser irradiation diameter and the laser output are such that the average width viewed from above the sealing material layer after laser sealing is 110% of the average width viewed from above the sealing material layer before laser sealing. Adjusted.
  • the airtightness reliability was evaluated about the obtained airtight package. More specifically, after the high temperature high humidity high pressure test (temperature 85 ° C., relative humidity 85%, 1000 hours) was performed on the obtained airtight package, the vicinity of the sealing material layer was observed, and it was found that The airtight reliability was evaluated by setting the thing in which a crack, breakage, etc. were recognized as "(circle)" and a crack, breakage, etc. were recognized as "x" in what a crack, breakage, etc. were not recognized at all. Sample No. As for 6 to 8, this evaluation was omitted because sintering of the sealing material layer was insufficient.
  • the airtight package manufactured by the manufacturing method of the present invention is suitable for an airtight package on which an internal element such as a MEMS (micro-electro-mechanical system) element is mounted. It is suitably applicable to an airtight package etc. which accommodates a wavelength conversion element etc. which distributed the above.
  • MEMS micro-electro-mechanical system

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)

Abstract

Un procédé de fabrication d'un corps d'emballage ayant une couche d'étanchéité fixée à celui-ci selon la présente invention est caractérisé en ce qu'il comprend les étapes consistant à: préparer un corps d'emballage ayant une partie de base et une partie de cadre disposée sur la partie de base; malaxer un véhicule avec un agent d'étanchéité pour produire une pâte d'étanchéité contenant moins de 0,6 % en poidsde résine; appliquer et sécher la pâte d'étanchéité sur le dessus de la partie de cadre du corps d'emballage pour produire un film sec; et fritter le film sec par irradiation de celui-ci avec un faisceau laser pour obtenir une couche d'agent d'étanchéité.
PCT/JP2018/024616 2017-07-14 2018-06-28 Procédé de fabrication d'un corps d'emballage ayant une couche d'étanchéité fixée à celui-ci, et procédé de fabrication d'emballage étanche à l'air WO2019013009A1 (fr)

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JP2017137680A JP7047270B2 (ja) 2017-07-14 2017-07-14 封着材料層付きパッケージ基体の製造方法及び気密パッケージの製造方法
JP2017-137680 2017-07-14

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006137635A (ja) * 2004-11-12 2006-06-01 Nippon Electric Glass Co Ltd フィラー粉末、封着用粉末およびペースト
JP2011051811A (ja) * 2009-08-31 2011-03-17 Asahi Glass Co Ltd 封着材料層付きガラス部材の製造方法と電子デバイスの製造方法
JP2012041196A (ja) * 2010-08-12 2012-03-01 Asahi Glass Co Ltd 封着材料層付きガラス部材とそれを用いた電子デバイスおよびその製造方法
WO2012117978A1 (fr) * 2011-02-28 2012-09-07 旭硝子株式会社 Élément étanche à l'air et son procédé de production
JP2014024730A (ja) * 2012-07-30 2014-02-06 Hitachi Chemical Co Ltd 電子部品及びその製法、並びにそれに用いる封止材料ペースト
WO2014092013A1 (fr) * 2012-12-10 2014-06-19 旭硝子株式会社 Matière de scellement, substrat comprenant une couche de matière de scellement, corps stratifié et dispositif électronique
JP2015023263A (ja) * 2013-07-24 2015-02-02 日本電気硝子株式会社 電気素子パッケージの製造方法及び電気素子パッケージ
JP2016027610A (ja) * 2014-06-27 2016-02-18 旭硝子株式会社 パッケージ基板、パッケージ、および電子デバイス
WO2016136899A1 (fr) * 2015-02-26 2016-09-01 日本電気硝子株式会社 Procédé de production d'emballage hermétique

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6493798B2 (ja) 2015-05-28 2019-04-03 日本電気硝子株式会社 気密パッケージの製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006137635A (ja) * 2004-11-12 2006-06-01 Nippon Electric Glass Co Ltd フィラー粉末、封着用粉末およびペースト
JP2011051811A (ja) * 2009-08-31 2011-03-17 Asahi Glass Co Ltd 封着材料層付きガラス部材の製造方法と電子デバイスの製造方法
JP2012041196A (ja) * 2010-08-12 2012-03-01 Asahi Glass Co Ltd 封着材料層付きガラス部材とそれを用いた電子デバイスおよびその製造方法
WO2012117978A1 (fr) * 2011-02-28 2012-09-07 旭硝子株式会社 Élément étanche à l'air et son procédé de production
JP2014024730A (ja) * 2012-07-30 2014-02-06 Hitachi Chemical Co Ltd 電子部品及びその製法、並びにそれに用いる封止材料ペースト
WO2014092013A1 (fr) * 2012-12-10 2014-06-19 旭硝子株式会社 Matière de scellement, substrat comprenant une couche de matière de scellement, corps stratifié et dispositif électronique
JP2015023263A (ja) * 2013-07-24 2015-02-02 日本電気硝子株式会社 電気素子パッケージの製造方法及び電気素子パッケージ
JP2016027610A (ja) * 2014-06-27 2016-02-18 旭硝子株式会社 パッケージ基板、パッケージ、および電子デバイス
WO2016136899A1 (fr) * 2015-02-26 2016-09-01 日本電気硝子株式会社 Procédé de production d'emballage hermétique

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