WO2018181813A1 - Composition de résine époxy et dispositif à composant électronique - Google Patents

Composition de résine époxy et dispositif à composant électronique Download PDF

Info

Publication number
WO2018181813A1
WO2018181813A1 PCT/JP2018/013454 JP2018013454W WO2018181813A1 WO 2018181813 A1 WO2018181813 A1 WO 2018181813A1 JP 2018013454 W JP2018013454 W JP 2018013454W WO 2018181813 A1 WO2018181813 A1 WO 2018181813A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
resin composition
mass
compound
specific
Prior art date
Application number
PCT/JP2018/013454
Other languages
English (en)
Japanese (ja)
Inventor
依子 井上
中村　真也
遠藤　由則
Original Assignee
日立化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成株式会社 filed Critical 日立化成株式会社
Priority to CN201880021249.7A priority Critical patent/CN110461938A/zh
Priority to JP2019510186A priority patent/JP7212830B2/ja
Publication of WO2018181813A1 publication Critical patent/WO2018181813A1/fr
Priority to JP2022212335A priority patent/JP7485009B2/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Definitions

  • the present invention relates to an epoxy resin composition and an electronic component device.
  • the surface mounting type package is different from the conventional pin insertion type. That is, when the pins are attached to the wiring board, the conventional pin insertion type package is soldered from the back surface of the wiring board after the pins are inserted into the wiring board, so that the package is not directly exposed to high temperature.
  • the entire electronic component device is processed by a solder bath, a reflow device or the like, so that the package is directly exposed to a soldering temperature (reflow temperature).
  • reflow temperature soldering temperature
  • the package absorbs moisture, moisture due to moisture absorption rapidly expands during soldering, and the generated vapor pressure acts as a peeling stress, and peeling occurs between the insert of the element, lead frame, etc., and the sealing material. This may cause package cracks, poor electrical characteristics, and the like. For this reason, it is desired to develop a sealing material that is excellent in adhesiveness to the insert, and thus excellent in solder heat resistance (reflow resistance).
  • the use of various epoxy resin modifiers is also being studied.
  • the use of a silane coupling agent is being studied with a focus on improving the adhesion between the element and an insert such as a lead frame.
  • use of an epoxy group-containing silane coupling agent or amino group-containing silane coupling agent for example, see JP-A-11-147939
  • use of a sulfur atom-containing silane coupling agent for example, JP-A-2000-2000).
  • the adhesive improvement effect may not be enough only by using an epoxy group containing silane coupling agent or an amino group containing silane coupling agent.
  • the amino group-containing silane coupling agent described in JP-A-11-147939 has high reactivity, and when used in an epoxy resin composition for sealing, the fluidity when sealing is lowered.
  • the epoxy group-containing silane coupling agent and amino group-containing silane coupling agent described in JP-A-11-147939 have problems in fluidity, such as gelation of the silane coupling agent itself.
  • the present condition is that the epoxy resin composition which fully satisfies both reflow resistance and fluidity
  • Means for solving the above problems include the following embodiments.
  • An epoxy resin composition containing an epoxy resin having a melting point or softening point exceeding 40 ° C., a curing agent, and a compound having a glycidyl group and a melting point of 40 ° C. or less.
  • ⁇ 3> The epoxy resin according to ⁇ 1> or ⁇ 2>, wherein the content of the compound having a glycidyl group and a melting point of 40 ° C.
  • composition ⁇ 4> The epoxy resin composition according to any one of ⁇ 1> to ⁇ 3>, further containing a curing accelerator.
  • an electronic component device including an epoxy resin composition excellent in reflow resistance while maintaining fluidity, and a cured product of the epoxy resin composition. Therefore, its industrial value is great.
  • numerical ranges indicated using “to” include numerical values described before and after “to” as the minimum value and the maximum value, respectively.
  • the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical description.
  • the upper limit value or the lower limit value of the numerical range may be replaced with the values shown in the examples.
  • the content rate or content of each component in the composition is such that when there are a plurality of substances corresponding to each component in the composition, the plurality of substances present in the composition unless otherwise specified. Means the total content or content.
  • the term “layer” refers to a case where the layer is formed only in a part of the region in addition to the case where the layer is formed over the entire region. included.
  • laminate indicates that layers are stacked, and two or more layers may be combined, or two or more layers may be detachable.
  • the epoxy resin composition according to the embodiment of the present invention includes an epoxy resin having a melting point or a softening point exceeding 40 ° C. (hereinafter also referred to as “(A) specific epoxy resin” or “specific epoxy resin”), and a curing agent (hereinafter referred to as “ (B) also referred to as “curing agent” or “curing agent”), a compound having a glycidyl group and a melting point of 40 ° C. or less (hereinafter also referred to as “(C) specific glycidyl compound” or “specific glycidyl compound”), Containing.
  • the epoxy resin composition may contain other components as necessary.
  • (C) specific glycidyl compound a liquid compound is mentioned at normal temperature (for example, 25 degreeC), for example. With this configuration, the epoxy resin composition is excellent in reflow resistance.
  • the epoxy resin composition has good fluidity.
  • the reason why the epoxy resin composition is excellent in reflow resistance while maintaining fluidity is not clear, but can be considered as follows. Specifically, when the glycidyl group in the specific glycidyl compound is bonded to the curing agent in the epoxy resin composition, an effect of improving the adhesive force and an effect of reducing the elastic modulus are obtained, and resistance to high resistance is maintained while maintaining high fluidity. This is considered to improve the reflow property.
  • the said epoxy resin composition what is a solid under normal temperature normal pressure (for example, 25 degreeC 1 atmosphere) is mentioned, for example.
  • normal temperature normal pressure for example, 25 degreeC 1 atmosphere
  • the specific glycidyl compound is a compound having a glycidyl group in the molecular structure and a melting point of 40 ° C. or lower.
  • the specific glycidyl compound may be used alone or in combination of two or more.
  • the number of glycidyl groups in one molecule of the specific glycidyl compound is preferably 1 to 6 and more preferably 2 to 4 from the viewpoint of obtaining an epoxy resin composition having excellent reflow resistance while maintaining fluidity.
  • the specific glycidyl compound preferably further has a dicyclopentadiene skeleton in the molecular structure from the viewpoint of obtaining an epoxy resin composition excellent in reflow resistance while maintaining fluidity.
  • a specific glycidyl compound having a glycidyl group and a dicyclopentadiene skeleton in the molecular structure the glycidyl group in the specific glycidyl compound is bonded to the curing agent in the epoxy resin composition, and further a dicyclopentadiene structure. It is presumed that the adhesive force is further improved because of the interaction with the metal surface.
  • the number of dicyclopentadiene skeletons that one molecule of the specific glycidyl compound has is preferably 1 to 4, more preferably 1 to 2, from the viewpoint of obtaining an epoxy resin composition excellent in reflow resistance while maintaining fluidity. .
  • specific examples of the specific glycidyl compound include dicyclopentadiene dimethanol diglycidyl ether.
  • specific examples of the specific glycidyl compound include rubber-crosslinked bisphenol-type epoxy resins and chelate-modified epoxy resins.
  • the molecular weight of the specific glycidyl compound is preferably 100 to 600, more preferably 200 to 400, from the viewpoint of obtaining an epoxy resin composition having excellent reflow resistance while maintaining fluidity. Further, the melting point of the specific glycidyl compound is 40 ° C. or less, and from the viewpoint of obtaining an epoxy resin composition having excellent reflow resistance while maintaining fluidity, 0 ° C. to 35 ° C. is preferable, and 0 ° C. to 30 ° C. is more preferable. preferable.
  • the epoxy equivalent of the specific glycidyl compound is preferably 165 g / eq to 365 g / eq, and more preferably 165 g / eq to 240 g / eq.
  • the content rate in the epoxy resin composition of a specific glycidyl compound 5 mass% or more and less than 45 mass% are preferable with respect to the total amount of (A) specific epoxy resin.
  • adhesiveness improves and there exists a tendency for the improvement effect of reflow resistance to be acquired.
  • a decrease in hardness during molding tends to be suppressed as compared with the case of 45% by mass or more.
  • the content of the specific glycidyl compound is more preferably 10% by mass or more and less than 45% by mass, more preferably 20% by mass or more and less than 45% by mass, and more preferably 25% by mass or more, with respect to the total amount of the (A) specific epoxy resin. Less than 45% by weight is particularly preferred. Moreover, as for the content rate of a specific glycidyl compound, 1 mass% or more is preferable with respect to the whole epoxy resin composition.
  • An epoxy resin composition contains at least 1 sort (s) of the epoxy resin (namely, (A) specific epoxy resin) whose melting
  • the melting point or softening point of the epoxy resin is a value measured by a single-cylinder rotational viscometer method described in JIS K 7234: 1986 and JIS K 7233: 1986.
  • the specific epoxy resin may be one generally used in an epoxy resin composition, and is not particularly limited as long as the melting point or the softening point exceeds 40 ° C.
  • the melting point or softening point of the specific epoxy resin is preferably 45 ° C. to 180 ° C., more preferably 50 ° C. to 150 ° C., more preferably 80 ° C. to 80 ° C. from the viewpoint of obtaining an epoxy resin composition having excellent reflow resistance while maintaining fluidity. 130 ° C. is more preferable, and 96 ° C. to 113 ° C. is particularly preferable.
  • the specific epoxy resin preferably contains two or more epoxy groups in one molecule.
  • the epoxy equivalent of the specific epoxy resin is preferably 100 g / eq to 1000 g / eq, more preferably 150 g / eq to 1000 g / eq, more preferably 150 g from the viewpoint of obtaining an epoxy resin composition excellent in reflow resistance while maintaining fluidity.
  • / Eq to 500 g / eq is more preferable, and 196 g / eq to 245 g / eq is particularly preferable.
  • the epoxy equivalent is measured by dissolving a weighed epoxy resin in a solvent such as methyl ethyl ketone, adding acetic acid and a tetraethylammonium bromide acetic acid solution, and then performing potentiometric titration with a perchloric acid acetic acid standard solution. An indicator may be used for this titration.
  • the specific epoxy resin is specifically selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, and naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol, and dihydroxynaphthalene.
  • phenol compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, and naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol, and dihydroxynaphthalene.
  • a novolak-type epoxy resin obtained by epoxidizing a novolak resin obtained by condensation or cocondensation of at least one phenolic compound and an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde or the like under an acidic catalyst Phenol novolac type epoxy resin, orthocresol novolak type epoxy resin, etc.
  • Phenol novolac type epoxy resin, orthocresol novolak type epoxy resin, etc. Phenol novolac type epoxy resin, orthocresol novolak type epoxy resin, etc.
  • the above-mentioned phenolic compound and an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde are acidic.
  • Triphenylmethane type epoxy resin obtained by epoxidizing triphenylmethane type phenol resin obtained by condensation or cocondensation under a medium; co-condensation of the above phenol compound, naphthol compound, and aldehyde compound under an acidic catalyst Copolymerized epoxy resin obtained by epoxidizing the novolak resin obtained by the above treatment; diphenylmethane type epoxy resin that is diglycidyl ether such as bisphenol A and bisphenol F; biphenyl that is diglycidyl ether of alkyl-substituted or unsubstituted biphenol Type epoxy resin; stilbene type epoxy resin which is diglycidyl ether of stilbene phenol compound; epoxy resin containing sulfur atom such as diglycidyl ether of bisphenol S and thiodiphenol type epoxy resin; butanedio Epoxy resins that are glycidyl ethers of alcohols such as polyethylene glycol and polypropylene glycol;
  • the specific epoxy resin includes bisphenol F type epoxy resin, stilbene type epoxy resin, and sulfur atom-containing epoxy resin which are epoxy resins having a bisphenol F skeleton from the viewpoint of fluidity and reflow resistance.
  • a novolac type epoxy resin is preferable from the viewpoint of curability
  • a dicyclopentadiene type epoxy resin is preferable from the viewpoint of low moisture absorption
  • a naphthalene type epoxy resin is preferable from the viewpoint of heat resistance and low warpage
  • flame retardant From the viewpoint of properties, a biphenylene type epoxy resin which is an epoxy resin having a biphenylene skeleton and a naphthol aralkyl type epoxy resin which is an epoxidized naphthol aralkyl resin are preferable.
  • Specific epoxy resins include bisphenol F type epoxy resins, stilbene type epoxy resins, sulfur atom-containing epoxy resins, novolac type epoxy resins, dicyclopentadiene type epoxy resins, naphthalene type epoxy resins, biphenylene type epoxy resins, and naphthol aralkyl type epoxy resins. It is preferable to contain at least one of these. It is preferable from the viewpoint of improving high-temperature storage properties that a non-halogen and non-antimony resin (that is, an epoxy resin that does not have both a halogen atom and an antimony atom) is used by using a resin having good flame retardancy as the specific epoxy resin. .
  • the specific epoxy resin can be selected and used according to the purpose and manufacturing conditions.
  • a specific epoxy resin a biphenylene skeleton-containing phenol aralkyl type epoxy resin that is an epoxidized product of a phenol aralkyl resin containing a biphenylene skeleton, a methoxynaphthalene type epoxy resin that is an epoxy resin having a methoxynaphthalene skeleton, etc., alone or in combination Can be used.
  • Bisphenol F type epoxy resin stilbene type epoxy resin, sulfur atom-containing epoxy resin, novolac type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, biphenylene type epoxy resin, and naphthol aralkyl type epoxy for the entire specified epoxy resin 20 mass% or more is preferable, as for the total content rate of resin, 30 mass% or more is more preferable, and 50 mass% or more is further more preferable.
  • the total content of the specific epoxy resin is preferably 0.4% by mass to 28% by mass in the epoxy resin composition from the viewpoint of balance of various properties such as moldability, reflow resistance, and electrical reliability. A mass% to 26 mass% is more preferred.
  • the content of the specific epoxy resin in the epoxy resin composition is 28% by mass or less, the reflow resistance tends to be maintained better than when the content exceeds 28% by mass.
  • the epoxy resin composition contains at least one curing agent.
  • curing agent may be what is generally used for the epoxy resin composition, and there is no restriction
  • Examples of (B) curing agents include phenol curing agents, amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, and blocked isocyanate curing agents.
  • the curing agent is preferably a phenol curing agent, an amine curing agent, and an acid anhydride curing agent, and more preferably a phenol curing agent.
  • phenol curing agent examples include phenol resins and polyhydric phenol compounds having two or more phenolic hydroxyl groups in one molecule.
  • polyphenol compounds such as resorcin, catechol, bisphenol A, bisphenol F, substituted or unsubstituted biphenol; phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol, etc.
  • a novolak-type phenol resin obtained by co-condensation synthesized from the above phenolic compound and dimethoxyparaxylene, bis (methoxymethyl) biphenyl, etc.
  • Aralkyl-type phenolic resin (phenol aralkyl resin, naphthol aralkyl resin, etc.); paraxylylene-modified phenolic resin; metaxylylene-modified phenolic resin; melamine-modified phenolic resin; terpene-modified phenolic resin; Dicyclopentadiene-type phenol resin and dicyclopentadiene-type naphthol resin; cyclopentadiene-modified phenol resin; polycyclic aromatic ring-modified phenol resin; biphenyl-type phenol resin; phenolic compounds and aromatic aldehydes such as benzaldehyde and salicylaldehyde A triphenylmethane type phenol resin obtained by condensing or co-condensing a compound with an acidic catalyst; a phenol tree obtained by copolymerizing two or more of these compounds ; And the like. These phenol resins may be used alone or in combination of two or more.
  • Curing agents exemplified above i.e., novolak type phenol resin, aralkyl type phenol resin, paraxylylene modified phenol resin, metaxylylene modified phenol resin, melamine modified phenol resin, terpene modified phenol resin, dicyclopentadiene type phenol resin, dicyclopentadiene type A naphthol resin, a cyclopentadiene-modified phenol resin, a polycyclic aromatic ring-modified phenol resin, a biphenyl type phenol resin, a triphenylmethane type phenol resin, or a phenol resin obtained by copolymerizing two or more of these is any one
  • the seeds may be used alone or in combination of two or more.
  • the content of the above-described curing agents (the total when two or more are used) is preferably 50% by mass or more, more preferably 60% by mass or more, and further preferably 80% by mass or more in the total amount of the curing agent.
  • the functional group equivalent of the curing agent is not particularly limited, and is preferably 70 g / eq to 1000 g / eq, more preferably 80 g / eq to 500 g / eq from the viewpoint of the balance of moldability, reflow resistance, and electrical reliability. preferable.
  • the functional group equivalent is a value measured according to JIS K0070: 1992.
  • the softening point or melting point of the curing agent is not particularly limited, and is preferably 40 ° C. to 180 ° C. from the viewpoint of moldability and reflow resistance, and 50 ° C. to 130 ° C. from the viewpoint of handleability when preparing the epoxy resin composition. Is more preferable.
  • curing agent is the same as the measuring method of the softening point or melting
  • the ratio of the number of functional groups is not particularly limited. In order to keep each unreacted component small, it is preferably set in the range of 0.5 to 2.0, more preferably in the range of 0.6 to 1.3.
  • the ratio is 0.5 or more
  • the epoxy resin composition is sufficiently cured as compared with the case where the ratio is less than 0.5, and the cured product of the epoxy resin composition has heat resistance, moisture resistance, and electricity. There is a tendency for the characteristics to be good.
  • the curing efficiency decreases due to excessive curing agent components, and a large amount of functional groups remain in the cured product. There is a tendency that deterioration of the electrical characteristics and moisture resistance of the package is suppressed.
  • the above ratio is 2.0 or less, and compared with the case where the ratio exceeds 2.0, the curing efficiency is reduced due to excess phenol resin component, and curing There is a tendency that a decrease in electrical characteristics and moisture resistance of the package due to a large amount of phenolic hydroxyl group remaining in the product is suppressed.
  • the epoxy resin composition comprises (A) a specific epoxy resin, (B) a curing agent, and (C) a specific glycidyl compound, and (D) a curing accelerator as required. May be included.
  • the curing accelerator is not limited as long as it is a compound that accelerates the reaction between (A) the specific epoxy resin and (B) the curing agent.
  • Examples of the curing accelerator include 1,8-diaza-bicyclo (5,4,0) undecene-7,1,5-diaza-bicyclo (4,3,0) nonene and 5,6-dibutyl.
  • Cycloamidine compounds such as amino-1,8-diaza-bicyclo (5,4,0) undecene-7; maleic anhydride, quinone compounds (for example, 1,4-benzoquinone, 2,5- Toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, A compound having intramolecular polarization formed by adding a compound having a ⁇ bond, such as phenyl-1,4-benzoquinone), diazophenylmethane, and a phenol resin; Tertiary amines such as ruamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol and their derivatives; imidazoles such as 2-methylimidazole, 2-phenylimid
  • phosphine compounds such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, tris (4-methylphenyl) phosphine, diphenylphosphine, phenylphosphine; maleic anhydride, quinone compound, diazophenyl Phosphorus compounds having intramolecular polarization formed by adding a compound having a ⁇ bond such as methane or phenol resin; tetraphenylphosphonium tetraphenylborate, triphenylphosphine Tiger tetraphenylborate, 2-ethyl-4-methylimidazole tetraphenyl borate, tetraphenyl boron salts and derivatives thereof such as N- methylmorpholine tetraphenylborate; and the like.
  • These curing accelerators may be used alone or in combination of two or more.
  • the content of the (D) curing accelerator is not particularly limited as long as the curing acceleration effect is achieved, and is preferably 0.005% by mass to 2% by mass in the epoxy resin composition. A mass% to 0.5 mass% is more preferable.
  • the content of the curing accelerator in the epoxy resin composition is 0.005% by mass or more, the curability in a short time tends to be better than when it is less than 0.005% by mass,
  • the content is 2% by mass or less, the curing rate is not too high as compared with the case where the content exceeds 2% by mass, and thus a good molded product tends to be easily obtained.
  • the epoxy resin composition comprises at least one of (E) inorganic filler as required. May be included.
  • the inorganic filler can be used, for example, for the purposes of hygroscopicity, linear expansion coefficient reduction, thermal conductivity improvement, and strength improvement.
  • the kind of inorganic filler is not particularly limited. Specifically, spherical silica (for example, fused silica), crystalline silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, potassium titanate, silicon carbide, silicon nitride, aluminum nitride, boron nitride, beryllia, Examples include inorganic materials such as zirconia, zircon, fosterite, steatite, spinel, mullite, titania, talc, clay, mica and the like. An inorganic filler having a flame retardant effect may be used.
  • Examples of the inorganic filler having a flame retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxide such as composite hydroxide of magnesium and zinc, zinc borate, and zinc molybdate.
  • Examples of the shape of the inorganic filler include non-powder, beads spheroidized from the powder, and fibers.
  • inorganic fillers may be used alone or in combination of two or more.
  • spherical silica is preferable from the viewpoint of filling property and linear expansion coefficient
  • alumina is preferable from the viewpoint of high thermal conductivity.
  • the shape of the inorganic filler is preferably a spherical shape from the viewpoints of fillability and mold wear.
  • the content of the inorganic filler in the epoxy resin composition is preferably 60% by mass or more, from the viewpoint of flame retardancy, moldability, hygroscopicity, reduction of linear expansion coefficient, strength improvement, and reflow resistance. 95 mass% is more preferable from the viewpoint of flame retardancy, and 70 mass% to 90 mass% is more preferable.
  • the content of the inorganic filler in the epoxy resin composition is 60% by mass or more, flame retardancy and reflow resistance tend to be improved as compared to the case of less than 60% by mass.
  • the content of the inorganic filler in the epoxy resin composition is 95% by mass or less, the fluidity tends to be improved as compared with the case where it exceeds 95% by mass, and the flame retardancy tends to be improved.
  • the epoxy resin composition includes a coupling agent, a flame retardant, an anion exemplified below as necessary.
  • Various additives such as an exchanger, a release agent, a colorant, and a stress relaxation agent may be included.
  • the epoxy resin composition may contain at least one coupling agent in order to enhance the adhesion between the resin component and the filler, if necessary.
  • the coupling agent is not particularly limited as long as it is generally used in an epoxy resin composition, and has, for example, at least one of a primary amino group, a secondary amino group, and a tertiary amino group.
  • Various silane compounds such as silane compounds, epoxy silanes, mercapto silanes, alkyl silanes, ureido silanes, vinyl silanes (for example, the following silane coupling agents), titanium compounds (for example, the following titanate coupling agents), aluminum chelates And aluminum / zirconium-based compounds. From the viewpoint of reflow resistance, it is preferable to use the silane compound as a coupling agent.
  • coupling agents include vinyltrichlorosilane, vinyltriethoxysilane, vinyltris ( ⁇ -methoxyethoxy) silane, ⁇ -methacryloxypropyltrimethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane.
  • silane coupling agent having a secondary amino group is preferred from the viewpoint of fluidity and flame retardancy.
  • the silane coupling agent having a secondary amino group is not particularly limited as long as it is a silane compound having a secondary amino group in the molecule. Specific examples thereof include ⁇ -anilinopropyltrimethoxysilane, ⁇ -anilinopropyltrisilane.
  • the content of the coupling agent in the epoxy resin composition is preferably 0.037% by mass to 4.75% by mass, more preferably 0.05% by mass to 5% by mass, and 0.1% by mass to 2.5%. More preferred is mass%.
  • the content of the coupling agent in the epoxy resin composition is 0.037% by mass or more, the adhesion with the frame tends to be improved as compared with the case of less than 0.037% by mass.
  • the moldability of the package tends to be improved as compared with the case where it exceeds 4.75 mass%.
  • At least one flame retardant can be blended as necessary to impart flame retardancy.
  • a flame retardant For example, the well-known organic or inorganic compound containing a halogen atom, an antimony atom, a nitrogen atom, or a phosphorus atom, a metal hydroxide, etc. are mentioned, These 1 type is used independently. Alternatively, two or more kinds may be used in combination.
  • the content of the flame retardant is not particularly limited as long as the flame retardant effect is achieved, and is preferably 1% by mass to 30% by mass and more preferably 2% by mass to 15% by mass with respect to the (A) specific epoxy resin.
  • an anion exchanger can be blended as necessary.
  • an epoxy resin composition uses an epoxy resin composition as a molding material for sealing, an anion is used from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of an electronic component device including a device to be sealed.
  • an anion exchanger A conventionally well-known thing can be used, As a specific example, Hydrotalcite; Hydrous oxide of the element chosen from magnesium, aluminum, titanium, zirconium, and bismuth; Etc.
  • An anion exchanger can be used individually by 1 type or in combination of 2 or more types. Among these, the anion exchanger is preferably a hydrotalcite represented by the following general formula (1).
  • the content of the anion exchanger is not particularly limited as long as it is a sufficient amount capable of capturing anions such as halogen ions, and is preferably 0.1% by mass to 30% by mass with respect to (A) the specific epoxy resin, 1% by mass to 5% by mass is more preferable.
  • release agents such as higher fatty acid, higher fatty acid metal salt, ester wax, polyolefin wax, polyethylene, polyethylene oxide, etc .; Colorant such as carbon black; Silicone oil , Stress relaxation agents such as silicone rubber powder; and the like can be blended as necessary.
  • the epoxy resin composition can be prepared by any method as long as various raw materials can be dispersed and mixed.
  • the raw materials are sufficiently mixed by a mixer or the like, and then mixed with a mixing roll, an extruder, or a raking machine. Examples thereof include a method of mixing or melt-kneading with a planetary mixer or the like and then cooling and defoaming and pulverizing as necessary.
  • An electronic component device includes an element and a cured product of the above-described epoxy resin composition that seals the element.
  • Electronic component devices include lead frames, pre-wired tape carriers, wiring boards, glass, silicon wafers and other supporting members or mounting substrates, elements (semiconductor chips, transistors, diodes, thyristors and other active elements, capacitors, resistors , Electronic devices, etc. in which necessary parts are mounted with the above-described epoxy resin composition.
  • the mounting substrate is not particularly limited, and specific examples include an organic substrate, an organic film, a ceramic substrate, an interposer substrate such as a glass substrate, a liquid crystal glass substrate, an MCM (Multi Chip Module) substrate, and a hybrid. Examples include IC substrates.
  • the electronic component device include a semiconductor device, and more specifically, an element such as a semiconductor chip is arranged on a lead frame (island, tab), and a terminal portion of an element such as a bonding pad
  • the lead parts are connected by wire bonding, bumps, etc., and then sealed by transfer molding etc.
  • DIP Device Inline Package
  • PLCC Physical Leaded Chip Carrier
  • QFP Quad Flat
  • SOP Small Outline Package
  • SOJ Small Outline J-lead package
  • TSOP Thin Small Outline Package
  • TQFP T Resin-encapsulated IC such as in Quad Flat Package
  • TCP Tepe Carrier Package
  • a semiconductor chip lead-bonded to a tape carrier is encapsulated with the epoxy resin composition
  • Semiconductor devices in which semiconductor chips connected by wire bonding, flip chip bonding, solder, etc. are mounted with bare chips such as COB (Chip On Board), COG (Chip On Glass), etc.
  • a low-pressure transfer molding method is the most common, but an injection molding method, The compression molding method etc. are also mentioned.
  • a dispensing method, a casting method, a printing method, or the like may be used as a method for obtaining an electronic component device such as a semiconductor device in which an element is sealed.
  • Epoxy resin 1 Thiodiphenol type epoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name: YSLV-120TE, epoxy equivalent 245, softening point 113 ° C.)
  • Epoxy resin 2 Aralkyl epoxy resin obtained by epoxidizing a phenol aralkyl resin containing a biphenylene skeleton (manufactured by Nippon Kayaku Co., Ltd., trade name: CER-3000L, epoxy equivalent 240, softening point 96 ° C.)
  • Epoxy resin 3 biphenyl type epoxy resin (manufactured by Mitsubishi Chemical Corporation, trade name: YX-4000, epoxy equivalent 196, melting point 106 ° C.) It was used.
  • Curing agent 1 Phenol aralkyl resin having a hydroxyl group equivalent of 176 and a softening point of 70 ° C. (trade name: Milex XLC, manufactured by Mitsui Chemicals, Inc.)
  • Curing agent 2 Melamine-modified phenol resin having a hydroxyl equivalent weight of 120 and a softening point of 85 ° C (manufactured by Hitachi Chemical Co., Ltd., trade name: HPM-J3) It was used.
  • Liquid resin 1 dicyclopentadiene dimethanol diglycidyl ether (manufactured by ADEKA Corporation, trade name: EP-4088L, epoxy equivalent 165, melting point: 25 ° C. or less)
  • Liquid resin 2 rubber-crosslinked bisphenol type epoxy resin (manufactured by ADEKA, trade name: EPR-4030, epoxy equivalent 365, melting point: 25 ° C. or less)
  • Liquid resin 3 Chelate-modified epoxy resin (manufactured by ADEKA Corporation, trade name: EP-49-10N, epoxy equivalent 220, melting point: 25 ° C. or less) It was used.
  • Curing accelerator 1 Addition reaction product of triphenylphosphine and benzoquinone
  • Curing accelerator 2 Mixture of triparatolylphosphine and parabenzoquinone was used.
  • Fused silica Spherical fused silica having a volume average particle size of 18 ⁇ m and a specific surface area of 1.5 m 2 / g was used.
  • Coupling agent 1 ⁇ -mercaptopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM-803)
  • Coupling agent 2 N-phenyl- ⁇ -aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM-573)
  • Coupling agent 3 methyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM-13) It was used.
  • Colorant Carbon black (Mitsubishi Chemical Corporation, trade name: MA100)
  • Mold release agent Montanate ester (manufactured by Clariant Japan Ltd., trade name: HW-E)
  • Additive Magnesium, aluminum, hydroxide, carbonate, hydrate (anion exchanger, hydrotalcite, manufactured by Sakai Chemical Industry Co., Ltd., trade name: HT-P) It was used.
  • the epoxy resin compositions of Examples and Comparative Examples were evaluated by the following various characteristic tests (1) to (5).
  • the evaluation results are summarized in Table 1 and Table 2 below.
  • the epoxy resin composition was molded by a transfer molding machine under conditions of a mold temperature of 180 ° C., a molding pressure of 6.9 MPa, and a curing time of 90 seconds unless otherwise specified. Further, post-curing was performed at 175 ° C. for 6 hours as necessary.
  • E is the flexural modulus (Pa)
  • ⁇ P is the load cell value (N)
  • ⁇ y is the displacement (mm)
  • Adhesive strength test A palladium-plated copper plate is placed on a mold provided with a 9 mm ⁇ 9 mm slit, and the epoxy resin composition is placed there under the above conditions with a diameter of 4 mm at the bottom, a diameter of 3 mm at the top, and a height of 4 mm. It was molded into a size, post-cured, and the shear adhesive strength (MPa) was measured with a bond tester (Series 4000 manufactured by Nordson Advanced Technology Co., Ltd.) at room temperature (25 ° C.) at a shear rate of 50 ⁇ m / s.
  • MPa shear adhesive strength
  • a treated product (“Cu—Ag” in the table) and a palladium alloy plating treated product (“PPF” in the table)) were produced by molding and post-curing using the epoxy resin composition under the above-mentioned conditions. After baking at 24 ° C. for 24 hours, humidifying at 60 ° C. and 60% RH for 40 hours, and then performing reflow treatment three times at 260 ° C. for 30 seconds, respectively, at the interface between the resin and the frame The presence or absence of delamination was observed with an ultrasonic flaw detector, and the reflow resistance was evaluated by the number of delamination generation packages relative to the number of test packages (20).
  • the ratio of the liquid resin 1 to the entire epoxy composition is higher than that of Example 4 and Example 5 in which the ratio of the liquid resin 1 to the entire epoxy composition is 1% by mass or less. It turns out that Example 6 and Example 7 which are 1 mass% or more are excellent by reflow resistance.

Abstract

La présente invention concerne une composition de résine époxy contenant une résine époxy qui présente un point de fusion ou un point de ramollissement supérieur à 40°C, un agent de durcissement et un composé ayant un groupe glycidyle et présentant un point de fusion inférieur ou égal à 40°C.
PCT/JP2018/013454 2017-03-31 2018-03-29 Composition de résine époxy et dispositif à composant électronique WO2018181813A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201880021249.7A CN110461938A (zh) 2017-03-31 2018-03-29 环氧树脂组合物和电子部件装置
JP2019510186A JP7212830B2 (ja) 2017-03-31 2018-03-29 封止用エポキシ樹脂組成物及び電子部品装置
JP2022212335A JP7485009B2 (ja) 2017-03-31 2022-12-28 封止用エポキシ樹脂組成物及び電子部品装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-072889 2017-03-31
JP2017072889 2017-03-31

Publications (1)

Publication Number Publication Date
WO2018181813A1 true WO2018181813A1 (fr) 2018-10-04

Family

ID=63676421

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/013454 WO2018181813A1 (fr) 2017-03-31 2018-03-29 Composition de résine époxy et dispositif à composant électronique

Country Status (4)

Country Link
JP (1) JP7212830B2 (fr)
CN (1) CN110461938A (fr)
TW (1) TW201842052A (fr)
WO (1) WO2018181813A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021021050A (ja) * 2019-07-30 2021-02-18 味の素株式会社 樹脂組成物
WO2022153762A1 (fr) * 2021-01-14 2022-07-21 信越化学工業株式会社 Composition comprenant un composé d'organosilicium, agent de mélange de caoutchouc, et composition de caoutchouc

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011129272A1 (fr) * 2010-04-13 2011-10-20 積水化学工業株式会社 Matériau de fixation pour montage de puces semi-conductrices, film de fixation pour montage de puces semi-conductrices, procédé de fabrication d'un dispositif semi-conducteur, et dispositif semi-conducteur
JP2012153885A (ja) * 2011-01-07 2012-08-16 Ajinomoto Co Inc 剥離フィルム用樹脂組成物
JP2013006981A (ja) * 2011-06-24 2013-01-10 Mitsubishi Chemicals Corp 三次元積層型半導体装置用の層間充填材組成物及びその塗布液
JP2014521754A (ja) * 2011-07-29 2014-08-28 ナミックス株式会社 半導体封止用エポキシ樹脂組成物、それを用いた半導体装置及び半導体製造方法
JP2015010146A (ja) * 2013-06-28 2015-01-19 太陽インキ製造株式会社 熱硬化性樹脂組成物及びプリント配線板
JP2016179564A (ja) * 2015-03-23 2016-10-13 味の素株式会社 樹脂シート
WO2017057561A1 (fr) * 2015-09-30 2017-04-06 積水化学工業株式会社 Composition de résine et substrat multicouche

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0551435A (ja) * 1991-08-23 1993-03-02 Mitsui Toatsu Chem Inc エポキシ樹脂組成物
JPH1121426A (ja) * 1997-07-02 1999-01-26 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JP2001131393A (ja) * 1999-10-29 2001-05-15 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2002128868A (ja) * 2000-10-24 2002-05-09 Japan Epoxy Resin Kk 半導体封止用エポキシ樹脂組成物
JP4096806B2 (ja) * 2003-05-13 2008-06-04 ジャパンエポキシレジン株式会社 フェノール樹脂、エポキシ樹脂用硬化剤、及びエポキシ樹脂組成物
JP2007031698A (ja) * 2005-06-21 2007-02-08 Hitachi Chem Co Ltd エポキシ樹脂組成物及び電子部品装置
KR101752222B1 (ko) * 2009-12-14 2017-06-29 신닛테츠 수미킨 가가쿠 가부시키가이샤 에폭시수지, 그 제조방법, 그것을 사용한 에폭시수지 조성물 및 경화물
KR101480178B1 (ko) * 2011-12-20 2015-01-09 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
CN103819870B (zh) * 2012-11-16 2016-06-15 株式会社田村制作所 热固性树脂组合物、b阶化的树脂膜、金属箔、覆铜板及多层积层基板
KR101518502B1 (ko) * 2012-12-26 2015-05-11 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
JP6315170B2 (ja) * 2013-09-30 2018-04-25 ナガセケムテックス株式会社 半導体封止用エポキシ樹脂組成物、半導体実装構造体、およびその製造方法
JP6555042B2 (ja) * 2015-09-17 2019-08-07 味の素株式会社 粒状樹脂組成物
CN106398112B (zh) * 2016-05-31 2019-09-13 江苏华海诚科新材料股份有限公司 一种适用于esop封装的环氧树脂组合物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011129272A1 (fr) * 2010-04-13 2011-10-20 積水化学工業株式会社 Matériau de fixation pour montage de puces semi-conductrices, film de fixation pour montage de puces semi-conductrices, procédé de fabrication d'un dispositif semi-conducteur, et dispositif semi-conducteur
JP2012153885A (ja) * 2011-01-07 2012-08-16 Ajinomoto Co Inc 剥離フィルム用樹脂組成物
JP2013006981A (ja) * 2011-06-24 2013-01-10 Mitsubishi Chemicals Corp 三次元積層型半導体装置用の層間充填材組成物及びその塗布液
JP2014521754A (ja) * 2011-07-29 2014-08-28 ナミックス株式会社 半導体封止用エポキシ樹脂組成物、それを用いた半導体装置及び半導体製造方法
JP2015010146A (ja) * 2013-06-28 2015-01-19 太陽インキ製造株式会社 熱硬化性樹脂組成物及びプリント配線板
JP2016179564A (ja) * 2015-03-23 2016-10-13 味の素株式会社 樹脂シート
WO2017057561A1 (fr) * 2015-09-30 2017-04-06 積水化学工業株式会社 Composition de résine et substrat multicouche

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021021050A (ja) * 2019-07-30 2021-02-18 味の素株式会社 樹脂組成物
JP7255411B2 (ja) 2019-07-30 2023-04-11 味の素株式会社 樹脂組成物
WO2022153762A1 (fr) * 2021-01-14 2022-07-21 信越化学工業株式会社 Composition comprenant un composé d'organosilicium, agent de mélange de caoutchouc, et composition de caoutchouc
JP7415961B2 (ja) 2021-01-14 2024-01-17 信越化学工業株式会社 有機ケイ素化合物を含むゴム組成物

Also Published As

Publication number Publication date
JPWO2018181813A1 (ja) 2020-02-06
JP2023030182A (ja) 2023-03-07
TW201842052A (zh) 2018-12-01
JP7212830B2 (ja) 2023-01-26
CN110461938A (zh) 2019-11-15

Similar Documents

Publication Publication Date Title
JP7060011B2 (ja) 封止用エポキシ樹脂組成物及び電子部品装置
JP2023076548A (ja) エポキシ樹脂組成物、及び電子部品装置
JP4792768B2 (ja) 封止用エポキシ樹脂組成物及び電子部品装置
JP6171274B2 (ja) 封止用エポキシ樹脂成形材料及び電子部品装置
JP7212830B2 (ja) 封止用エポキシ樹脂組成物及び電子部品装置
JP4892984B2 (ja) 硬化性樹脂組成物及び電子部品装置
JP2004156035A (ja) 硬化性樹脂の硬化促進剤、硬化性樹脂組成物及び電子部品装置
JP6372967B2 (ja) 封止用エポキシ樹脂成形材料及び電子部品装置
JPWO2019054217A1 (ja) エポキシ樹脂組成物、及び電子部品装置
JP2014129485A (ja) エポキシ樹脂組成物及び電子部品装置
JP2018104603A (ja) 硬化性樹脂組成物及び電子部品装置
US20220315793A1 (en) Encapsulating material for compression molding and electronic part device
JP7485009B2 (ja) 封止用エポキシ樹脂組成物及び電子部品装置
JP6583312B2 (ja) 封止用エポキシ樹脂成形材料及び電子部品装置
JP7343978B2 (ja) エポキシ樹脂組成物及び電子部品装置
WO2020129248A1 (fr) Composition de résine d'étanchéité et dispositif à composant électronique
JP2021084980A (ja) 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP2007031698A (ja) エポキシ樹脂組成物及び電子部品装置
WO2020129249A1 (fr) Composition de résine pour scellement et dispositif de composant électronique
JPWO2020067016A1 (ja) 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP2012107209A (ja) 封止用エポキシ樹脂組成物及び電子部品装置
JP3659150B2 (ja) 封止用エポキシ樹脂成形材料及び電子部品装置
WO2022149594A1 (fr) Procédé de production d'une composition de résine thermodurcissable, composition de résine thermodurcissable et dispositif de composant électronique
JP2017106034A (ja) 封止用エポキシ樹脂成形材料及び電子部品装置
JP2008115364A (ja) エポキシ樹脂組成物及び電子部品装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18775365

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2019510186

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18775365

Country of ref document: EP

Kind code of ref document: A1