WO2018109967A1 - 枠体治具、樹脂供給治具及びその計量方法、モールド樹脂の計量装置及び方法、樹脂供給装置、樹脂供給計量装置及び方法、並びに樹脂モールド装置及び方法 - Google Patents

枠体治具、樹脂供給治具及びその計量方法、モールド樹脂の計量装置及び方法、樹脂供給装置、樹脂供給計量装置及び方法、並びに樹脂モールド装置及び方法 Download PDF

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Publication number
WO2018109967A1
WO2018109967A1 PCT/JP2017/024805 JP2017024805W WO2018109967A1 WO 2018109967 A1 WO2018109967 A1 WO 2018109967A1 JP 2017024805 W JP2017024805 W JP 2017024805W WO 2018109967 A1 WO2018109967 A1 WO 2018109967A1
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WO
WIPO (PCT)
Prior art keywords
resin
mold
film
resin supply
jig
Prior art date
Application number
PCT/JP2017/024805
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
吉和 村松
正樹 川口
実 花里
Original Assignee
アピックヤマダ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アピックヤマダ株式会社 filed Critical アピックヤマダ株式会社
Priority to KR1020197019213A priority Critical patent/KR102254056B1/ko
Priority to CN201780076734.XA priority patent/CN110099777B/zh
Publication of WO2018109967A1 publication Critical patent/WO2018109967A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses

Definitions

  • the present invention relates to a frame jig, a resin supply jig and its measuring method, a mold resin measuring device and method, and a mold for the resin supply jig, which are used for transporting a single wafer film together with a mold resin to a mold die.
  • the present invention relates to a resin supply apparatus for supplying resin, a resin supply and weighing apparatus and method using these, and a resin mold apparatus and method including the above.
  • the single wafer film includes a film formed by cutting a long or large size film into a predetermined size in addition to an individual film previously formed into a predetermined size.
  • a resin molding apparatus used in the current semiconductor manufacturing factory, in molding of WLP (Wafer Level Package) or PLP (Panel Level Package) as a workpiece, for example, a resin mold using a semiconductor wafer or carrier of ⁇ 8 inch or ⁇ 12 inch size.
  • resin molding is performed using a workpiece (rectangular panel, substrate, carrier, etc.) having a size of ⁇ 300 mm to ⁇ 600 mm (each side has a size of 300 mm to 600 mm).
  • a mold die by upper mold compression molding in which a cavity recess is provided in the upper mold, it is generally performed by feeding a resin having a high viscosity at the center position on the workpiece and supplying it to the lower mold all at once. Has been done.
  • a cavity recess is provided in the lower mold, the lower mold clamping surface including the lower mold cavity recess is covered with a film, and a mold resin is supplied with a uniform thickness. Resin molding is also performed by lower mold compression molding to be immersed.
  • the film and the mold resin are supplied to the lower mold cavity recess by the lower mold compression molding, it is necessary to measure and supply the amount of resin necessary for one resin mold.
  • a powder resin or a granular resin melting starts as soon as it is charged into the mold, and therefore it is necessary to charge the mold resin all at once in order to reduce the time difference between when charging is started and when charging is completed.
  • the resin can be placed on the substrate and accurately measured and collectively transferred to the mold, but the lower mold compression molding in which the lower mold cavity is formed.
  • the resin is put on the film and put into the mold for the reason of putting the resin in a lump, and it is required to weigh and transport the resin on the film. If it is a resin with high viscosity, it can be placed directly on the film and weighed, but in the case of granular resin or powder resin, the film is fixed to one side of the frame to prevent the resin from spilling. Therefore, it is necessary to form and measure and transport the resin container.
  • the lower opening of the frame-shaped resin housing plate is closed with a release film, and the feeder-side metering is performed on the feeder side distribution means with respect to the plate that is suction-fixed at the periphery of the plate by the release-film suction fixing mechanism.
  • a technique has been proposed in which means (load cell) is provided and the amount of resin is measured by measuring the weight before and after supplying the granular resin from the hopper (see Patent Document 1: Paragraph [0028] of the specification).
  • Patent Literature a technique has been proposed in which a plate-side weighing means (load cell) is provided in the receiving side distribution means for the resin material, and the amount of resin is measured by measuring the weight before and after the granular resin is charged from the hopper.
  • Patent Literature 1: See paragraph [0041] in the description). Or it is proposed to use these together.
  • an electronic balance is installed just below the resin supply device that supplies granular resin to the lower mold cavity, and a device that supplies resin while measuring whether the resin supply amount has reached the target value relative to the initial value is also proposed. (See Patent Document 2).
  • Patent Document 2 when an electronic balance for weighting the resin supply device itself is provided as in Patent Document 2, the configuration of the device is increased in size and weight, and an electromagnetic feeder for introducing granular resin is provided. There is a problem that measurement cannot be performed until the value converges, it takes time to measure, and errors are likely to occur. If the mold resin cannot be accurately measured in this way, the molding quality may be deteriorated. In addition, if it takes a long time to measure the amount of resin, it takes time for one resin mold, and the productivity also decreases.
  • the object of the present invention is to solve the above-mentioned problems of the prior art and to accurately measure the weight without connecting an air hose or the like using a frame jig that covers the one side opening of the frame with a single sheet film.
  • An object of the present invention is to provide a resin supply jig in which a resin accommodating portion capable of being formed and a measuring method thereof. Further, there are provided a weighing device and method for accurately weighing mold resin, a resin supply device that uniformly supplies mold resin to a resin housing portion of a resin supply jig without excess or deficiency, and a resin metering supply device and method including these. It is to provide. It is another object of the present invention to provide a resin molding apparatus and method in which molding quality and productivity are improved by using the above-described resin supply measuring apparatus and resin measuring method.
  • the present invention comprises the following arrangement.
  • a frame having an opening with a predetermined shape on the inner surface corresponding to the cavity recess formed on the clamping surface of the mold, and a single wafer assembled to cover one opening of the frame
  • a pair of film gripping portions provided at least on opposite sides for gripping the outer peripheral edge of the film, and a tension maintaining mechanism capable of maintaining a predetermined tension while gripping the outer peripheral edge of the single-wafer film. It is characterized by that.
  • the sheet film to be assembled to cover the one side opening of the frame body is gripped by the film gripping portion provided at least one pair of the outer peripheral edge portions of the sheet film on the opposite sides, and the outer peripheral edge of the sheet film Since the predetermined tension is maintained by the tension maintaining mechanism while holding the part, the sheet can be assembled without generating wrinkles.
  • the frame body is formed with a film on which the mold resin is difficult to adhere or a material to which the mold resin is difficult to adhere.
  • a material to which the mold resin is difficult to adhere for example, hard chrome plating, fluorine-based coating, and yttrium-based ceramic can be used as an example of a film to which mold resin does not easily adhere.
  • a material to which the mold resin is difficult to adhere for example, a ceramic, a heat resistant resin, or the like may be used. Thereby, by making the surface property of the surface of the frame into a smooth surface, it is possible to make it difficult for the mold resin to adhere to the inside of the frame opening.
  • the sheet film covering one side opening of the frame body of the frame jig, and the film gripping part grips the outer peripheral edge of the sheet film.
  • a resin containing portion for containing a mold resin formed by closing one side opening of the frame body by holding it with a predetermined tension applied is applied.
  • the resin accommodating part which closed the one side opening part of the frame can be formed with a simple structure without generating wrinkles in the sheet film.
  • an air suction hose for film adsorption or the like is not connected to the frame, the weight of the frame and the film itself before and after the mold resin supply can be accurately measured.
  • a predetermined amount of the mold resin is formed on the sheet film by scanning at least in the XY direction while dropping the mold resin from the resin dropping portion to the resin housing portion of the resin supply jig described above. It is characterized by supplying. According to the above configuration, the resin casting portion is scanned at least in the XY direction with respect to the resin housing portion, and the mold resin necessary for the resin mold is uniformly supplied, so that the resin housing portion having a relatively large area can be obtained. On the other hand, the mold resin, in particular, the granular resin or the powdery resin can be supplied uniformly without flattening.
  • a shutter capable of opening and closing the drop opening is provided on the resin drop portion.
  • an ionizer for removing static electricity generated in the opening of the frame body is provided on the resin throwing portion. As a result, even if the resin falls near the frame opening, it does not adhere due to static electricity.
  • a film detection sensor for detecting the stretched state of the sheet-fed film is provided on the resin supply jig at the resin dropping portion. Therefore, the setting mistake of the sheet
  • the resin throwing portion may be provided with a frame knocking portion that strikes the frame body and drops mold resin adhering to the inner surface of the opening including the inclined portion to the resin housing portion. Thereby, even if mold resin adheres to a frame body opening part, it can be dropped in a resin accommodating part by hitting the frame body by a frame body knock part, and can be resin-molded.
  • the weight of the resin supply jig before the mold resin is supplied to the resin container, and the resin container
  • the amount of resin required for the resin mold is measured from the weight of the resin supply jig after the mold resin is supplied.
  • the resin supply and metering device includes any of the above-described resin supply jigs, any of the above-described resin supply devices, and the above-described mold resin metering device.
  • the resin supply device uniformly supplies the mold resin to the resin container formed in the resin supply jig, and accurately measures the weight of the resin supply jig before and after the mold resin supply, thereby reducing the resin supply amount. Accurate weighing is possible.
  • the resin mold apparatus includes the above-described resin supply and metering apparatus, and a resin supply jig in which a mold resin necessary for one resin mold is supplied to the resin container is conveyed to a mold and molded.
  • a resin supply jig in which a mold resin necessary for one resin mold is supplied to the resin container is conveyed to a mold and molded.
  • a resin container in which one side opening of a frame body having an opening having a predetermined shape on the inner surface corresponding to a cavity recess formed on a clamping surface of a mold is covered with a sheet-fed film And a weighing step of weighing the weight of the mold resin by directly supporting the resin supply jig before and after the supply of the mold resin on a weighing device. To do. Thereby, the supply amount of the mold resin can be accurately measured by directly supporting the resin supply jig before and after the supply of the mold resin by the measuring device.
  • the method further includes a step of uniformly supplying a predetermined amount of mold resin onto the single-wafer film from the other side opening of the frame body to the resin storage portion, and supplying the mold resin to the resin storage portion.
  • a predetermined amount of resin measured by taking a difference between the weight of the resin supply jig before the resin is supplied and the weight of the resin supply jig after the mold resin is supplied to the resin container You may make it supply from.
  • the difference between the weight of the resin supply jig before the mold resin is supplied to the resin container and the weight of the resin supply jig after the mold resin is supplied to the resin container is obtained.
  • the mold resin may be supplied from the resin supply device while the measurement device measures the resin amount calculated in this way. Thereby, the measurement and supply of the mold resin can be continuously performed at the same position, the apparatus area can be reduced, and the resin supply operation can be performed quickly.
  • a step of forming the resin supply jig having the resin accommodating portion by holding the resin supply jig in a state in which a predetermined tension is applied while being held by a side; and the resin supply jig by directly supporting the resin supply jig on a weighing device.
  • a measuring step for measuring the weight of the supply jig, and a predetermined amount of mold resin is uniformly supplied onto the single-wafer film from the other opening of the frame body to the resin container by the resin supply device.
  • the weighing device includes a weight of the resin supply jig before the mold resin is supplied to the resin container, and the resin supply after the mold resin is supplied to the resin container.
  • a resin amount necessary for a resin mold to be measured by the weighing device is supplied from the resin supply device based on the weight of the jig.
  • the mold resin can be supplied without generating wrinkles on the single-wafer film forming the resin container.
  • the frame is overlapped with the sheet film so that the opening on one side is covered while the sheet film is adsorbed and held on one side, and at the same time, the outer peripheral edge of the sheet film is held with a predetermined tension.
  • the resin container in the resin supply jig by assembling it to the frame with the sheet film adsorbed and held on the stage part, and to supply the resin by placing the weighing device directly under the stage part. It is possible to measure by directly supporting the jig. Therefore, the assembly operation of the resin supply jig and the weighing operation of the resin supply jig and the mold resin can be performed quickly and accurately at the same position without requiring an installation area.
  • the resin supply device scans the resin throwing portion at least in the XY direction with respect to the resin storage portion and uniformly supplies the mold resin necessary for the resin mold, so that the resin storage portion having a relatively wide area
  • a mold resin in particular, a granular resin or a powder resin, without flattening separately.
  • the resin supply device temporarily stops the supply operation before the amount of resin supplied to the resin container reaches a predetermined amount, measures the amount by the metering device, and then changes the resin drop amount per unit time and supplies the resin. It is preferable to repeat the operation. As a result, the mold resin can be supplied while finely adjusting the target resin supply amount as close as possible.
  • a resin supply jig in which a mold resin necessary for the resin mold is supplied to the resin accommodating portion by any of the above-described resin supply and metering methods is conveyed to a mold by a resin supply loader, and the sheet is fed.
  • the method includes a step of delivering a film and a mold resin to the mold.
  • the one side opening part of a frame can be covered with a sheet film without a crack.
  • the frame jig does not have an air hose or the like, and the weight of the frame and the single film can be accurately measured before the mold resin is supplied.
  • the mold resin metering apparatus and method the mold resin can be accurately metered.
  • the resin supply device it is possible to uniformly supply mold resin (particularly, granule resin, powder resin, liquid resin) to the resin container having a relatively wide area of the resin supply jig.
  • the mold resin can be supplied at the metering position without excess or deficiency.
  • the resin mold apparatus and method which improved the molding quality and productivity can be provided using the resin supply measuring apparatus and resin measuring method which were mentioned above.
  • the workpiece is described as a rectangular strip as an example, but is not necessarily limited to this, and may be a circular wafer or carrier.
  • the resin mold apparatus will be described assuming that the lower mold is a movable mold and the upper mold is a fixed mold.
  • the resin mold apparatus includes a mold opening / closing mechanism, but the illustration is omitted, and the configuration of the mold will be mainly described.
  • a control unit controls each unit described later to perform various operations.
  • the molding apparatus in the present embodiment is configured such that a workpiece processing unit Uw, two press units Up, and a dispensing unit Ud (supply unit) are connected, and resin molding is automatically performed on the workpiece W in the apparatus.
  • the workpiece processing unit Uw includes, for example, a workpiece supply unit 1, a molded product storage unit 2, a curing furnace 3, and a robot transfer device 4.
  • workpiece supply unit 1 for example, workpieces (rectangular panels, substrates, carriers, etc.) each having a size of about 600 mm are accommodated as workpieces W.
  • the molded product storage unit 2 stores a molded product M resin-molded in a press unit 5 described later.
  • the curing furnace 3 heats and cures the resin package part by storing the molded product M resin-molded in a semi-cured state by a press part 5 described later in a multi-stage shelf provided in the furnace and after-curing.
  • the robot transport device 4 delivers and transports the workpiece W and the molded product M between the parts arranged so as to surround the robot transport device 4.
  • the robot conveyance device 4 takes out and supplies the workpiece W from the workpiece supply unit 1, conveys the molded product M to the cure furnace 3, and sequentially conveys and stores the molded product M from the cure furnace 3 to the molded product storage unit 2.
  • a vertical articulated type, a horizontal articulated type, or a multi-joint type robot that combines these is used as the robot conveyance device 4, and the workpiece W and the molded product M are held and conveyed by the robot hand 4 a by suction or gripping. To do.
  • a cooling unit for cooling the molded product M In the workpiece processing unit Uw, a cooling unit for cooling the molded product M, an inspection unit for performing an appearance inspection of the molded product, a data reading unit for reading molding conditions associated with individual workpieces W, and a workpiece W Or you may arrange
  • FIG. For example, when the surface (molding surface) to be molded with resin in the workpiece W is supplied upward in the workpiece supply unit 1, the reversing unit directs the molding surface to the lower surface. Further, the reversing unit reverses the molded product M, which has been resin-molded, until the molding surface faces upward until it is stored in the molded product storage unit 2.
  • the press unit 5 in the press unit Up includes a compression mold 6 (upper mold 6A and lower mold 6B) that opens and closes to a known mold opening / closing mechanism that raises and lowers the platen relative to the posts 5a provided at the four corners. Yes.
  • the press units Up are provided at two places, but may be provided at one place or three or more places.
  • the resin supply jig 13 is supplied with mold resin (for example, granule resin, powder resin, liquid resin, etc.) from the dispenser 9 (resin supply device) to the sheet film F supplied from the film supply unit 8 in the dispensing unit Ud. In this state, it is supplied into the mold 6 of the press unit 5.
  • the film supply unit 8 is provided with a film roll 8a in which a long film is wound in a roll shape. With the film end pulled out from the film roll 8a, the stage portion 17 (see FIG. 2A) is drawn (cut) into a rectangular shape of any size by the cutter 18, and is held on the stage portion 17 as a single-wafer film F. Is done.
  • the stage portion 17 is provided with film suction holes 17a for film suction on four sides (see FIG. 2A).
  • the stage portion 17 is provided with a plurality of through-holes 17b into which measuring pins 21a of a measuring device 21 (for example, an electronic balance) described later are inserted.
  • the weighing device 21 is disposed directly below the stage unit 17 (see FIG. 3H). In addition, it may replace with the through-hole 17b provided in the stage part 17, and may provide the notch through which the measuring pin 21a passes, and you may make it support the frame 13a from the outer peripheral side of the stage part 17.
  • the through hole 17b may be a position that temporarily supports the frame body 13a, and the measuring pin 21a does not necessarily have a pin shape, and may have a block shape.
  • the configuration including the resin supply jig 13, the dispenser 9, and the weighing device 21 described above is defined as a resin supply and weighing device.
  • the resin accommodating portion 22 is formed in the resin supply jig 13 by applying a necessary tension to the sheet film F covering the one side opening of the frame body 13a and supporting it. Mold resin R (granular resin) necessary for one resin molding is supplied onto the sheet film F by the dispenser 9 from the other side opening of the frame 13a.
  • a powder resin, a liquid resin, a sheet resin, or a combination thereof may be used instead of the granule resin.
  • the sheet film F has heat resistance, and is easily peeled off from the mold surface and the resin surface after molding, and has flexibility and extensibility, such as PTFE, ETFE, PET, FEP film.
  • a monolayer film or a multi-layer film mainly composed of fluorine-impregnated glass cloth, polypropylene film, polyvinyl chloride or the like is preferably used.
  • the work loader 10 receives the workpiece W from the robot hand 4a of the robot transport device 4 and carries it into the mold die 6 (upper die 6A) of the press unit 5.
  • the work loader 10 receives the molded product M from the mold 6 and transfers it to the robot hand 4 a of the robot transport device 4.
  • the work loader 10 takes out the molded product M from the mold 6, the used single-wafer film F is also sucked and held, and the taken-out single-wafer film F is collected by the film collecting unit 12.
  • the resin supply loader 11 receives the sheet film F held with the required tension applied to the resin supply jig 13 and the mold resin R (granular resin) supplied onto the film F, and receives the mold 6 (lower Transport to mold 6B).
  • the resin supply jig 13 has a weight before and after supplying the mold resin R necessary for one resin mold placed below the stage portion 17 (see FIG. 1 below the resin supply position: FIG. 3H).
  • the weighing device 21 measures the weight.
  • the work loader 10 and the resin supply loader 11 are provided so as to reciprocate along a plurality of guide rails 14 laid along the longitudinal direction of the apparatus.
  • a loader hand (not shown) is moved to each part (for example, the press part 5) so as to be orthogonal to the position on the guide rail 14.
  • a loader hand claw 11a that can be opened and closed by a cylinder or the like is provided below the loader hand of the resin supply loader 11 (see FIG. 2D).
  • the resin supply jig 13 includes a frame body 13a having an inner surface corresponding to a planar shape of a lower mold clamping surface surrounding a lower mold cavity recess 6C, which will be described later, having a predetermined shape (for example, a rectangular shape). .
  • a fulcrum frame body 13b that serves as a fulcrum portion in the resin supply jig 13 and applies tension to the sheet film F is provided in a rectangular shape along the frame body 13a (see FIG. 5).
  • a fulcrum part you may use the outer corner
  • a plurality of film chucks 13c for gripping the outer peripheral edge portion of the single wafer film F over the entire circumference are provided outside the resin supply jig 13 (the film chuck 13c (film gripping portion is attached to the frame 13a).
  • Part is defined as a frame jig).
  • a pair of film chucks 13c are provided to be openable and closable at opposite sides in order to grip and convey the rectangular sheet F.
  • the film gripping portions are provided at four positions (XY directions) of the opposing sides of the frame jig, but it is sufficient that there are at least a pair of opposing sides.
  • the pair of film chucks 13c an open / close type chuck is used, and the outer peripheral edge portion of the rectangular sheet F is sandwiched and held on each side. Both ends in the longitudinal direction of the pair of film chucks 13c are respectively supported by a pair of rotating levers 13d (rotating members).
  • the pair of rotation levers 13d is provided to be rotatable about a rotation shaft 13e formed inside the film chuck 13c in the frame 13a. For this reason, the pair of film chucks 13c is provided on the opposite side of the rotary shaft 13e in the rotary lever 13d.
  • the rotation lever 13d is provided with an offset mechanism that rotates only in the direction of offset with respect to the fulcrum frame 13b.
  • the pair of film chucks 13c are always separated from each other and, as will be described later, when the outer frame body 13a1 approaches the frame body 13a, the end portions of the film are sandwiched by the cam mechanism.
  • the rotation shaft 13e of the film chuck 13c is provided with a ratchet mechanism (one-way clutch mechanism) 13f in which the ratchet teeth engage with the ratchet pawl (tension maintaining mechanism).
  • the ratchet mechanism 13f allows the film chuck 13c to rotate only in a direction away from the fulcrum frame body 13b by a predetermined angle around the rotation shaft 13e (rotate and lift in the direction in which the arrow in FIG. 2F opens).
  • the film chuck 13c is held at a predetermined rotational position rotated in one direction and locked in multiple stages, so that it can be transported while maintaining the tension applied to the sheet-fed film F.
  • the resin supply jig 13 is likely to be larger than the structure provided with the ratchet mechanism 13f, but it is preferable in that the tension applied to the sheet film F can be adjusted at any time. Since it becomes difficult, it becomes difficult to measure accurately as will be described later.
  • the rotation lever 13d is supported by an outer frame 13a1 that is movably provided outside the frame 13a.
  • the outer frame body 13a1 is configured so as to be able to move toward and away from each side of the frame body 13a by locking with a locking portion that moves forward and backward by a driving source such as a cylinder (not shown) provided in the resin supply loader 11.
  • a driving source such as a cylinder (not shown) provided in the resin supply loader 11.
  • the pair of film chucks 13c is configured such that the film chuck 13c is closed by a cam mechanism (not shown) when the outer frame body 13a1 moves in a direction approaching the frame body 13a.
  • the outer peripheral edge (four sides) of the single-wafer film F is held by a pair of film chucks 13c, it is lifted up and down by a lift drive mechanism (not shown) (cylinder drive, solenoid drive, motor drive, etc.).
  • the rotation lever 13d is pushed up by the pin 15.
  • the rotating lever 13d rotates about the rotating shaft 13e to offset the film chuck 13c away from the fulcrum frame 13b (rotates and lifts in the direction in which the arrow opens) and is locked in multiple stages.
  • the end portions of the sheet film F are interposed through the fulcrum frame 13b.
  • the amount of separation can be increased to increase the tension.
  • the tension of the sheet film F can be adjusted in multiple stages for each side of the film by each rotation about the rotation axis 13e of the film chuck 13c arranged on the four sides, an appropriate tension is applied to the sheet film F.
  • the resin supply jig 13 that can be added can have a small and simple configuration.
  • the resin accommodating portion 22 is formed by the frame-shaped resin supply jig 13 and the sheet film F covering the opening on one side (lower side).
  • a mold resin R granular resin necessary for a single resin mold from the dispenser 9 (see FIG. 1) is provided on the sheet film F to which the required tension is applied from the other side (upper side) opening, for example, trough 16 ( The resin is fed uniformly through the resin film lower portion and is not evenly distributed on the sheet film F (see FIG. 3J).
  • an inclined portion 13g whose diameter is increased toward the opening end side of the rectangular shape in plan view is formed in the upper opening of the frame 13a.
  • the mold resin R By supplying the mold resin R to the inner side of the inclined portion 13g, the mold resin R can be supplied onto the sheet film F in an arbitrary shape.
  • the inclined portion 13g prevents the molding resin R supplied on the sheet film F from running on the frame 13a.
  • mold resin R can also be supplied in a circular area
  • a metal material for example, aluminum material
  • a coating film on which the resin hardly adheres is formed on the surface of the metal base material.
  • a coating film on which the resin hardly adheres is formed on the surface of the metal base material.
  • hard chrome plating, fluorine-based coating, and yttrium-based ceramic can be used as an example of a film to which mold resin does not easily adhere.
  • a material that does not easily adhere to the mold resin may be used.
  • the material may be ceramic, heat resistant resin, or the like. Thereby, the mold resin R can be made difficult to adhere by making the surface property of the surface of the frame 13a a smooth surface.
  • the frame 13a is provided with a plurality of locking holes 13n (two on each side in FIG. 5) in which the loader hand claws 11a of the resin supply loader 11 are inserted and locked. Then, as shown in FIG. 4N, the mold resin R is supplied onto the single-wafer film F forming the resin container 22, and the resin supply jig is used by the loader hand claw 11a of the resin supply loader 11 in a state where the measurement is completed. 13 (frame body 13 a) is chucked and conveyed to the mold 6.
  • the film drooping detection unit 20 may be provided at a position close to the stage unit 17 (see FIG. 5).
  • the film drooping detection unit 20 may include a light emitting unit and a light receiving unit and an optical or laser sensor that detects a shielding state and a shielding position between them.
  • a configuration in which a light emitting portion and a light receiving portion are provided at positions sandwiching the resin supply jig 13 can be adopted.
  • the film drooping detection unit 20 detects whether or not the sheet F is hanging from an appropriate position when the resin supply jig 13 is lifted by detecting a shield in the space on the stage unit 17 ( It is possible to detect the stretched state of the sheet film F). Only one set of the film droop detection unit 20 may be provided so as to detect drooping in one direction, or two sets may be provided so as to detect in two intersecting directions as shown in FIG.
  • the film drooping detection unit 20 may have any configuration as long as the drooping of the single-wafer film F can be detected.
  • a contact sensor may be used, and it may be configured to detect that the sheet F that hangs down is in contact when the resin supply jig 13 is lifted to a predetermined height.
  • the film drooping detection unit 20 is provided outside the resin supply jig 13 so as not to provide an electrical wiring in the resin supply jig 13.
  • the film chuck 13c that holds each side of the rectangular sheet F shown in FIG. 3 can be made uniform or different in the amount pushed up on each side.
  • the amount pushed up for each set of the pair of film chucks 13c on the opposite sides can be varied. In this case, depending on the length of each side of the sheet film F and the ease with which the film is stretched depending on the direction drawn from the film roll 8a, etc., the amount to be pushed up for each set of film chucks 13c varies.
  • the tension applied to each side of the film F can also be made uniform.
  • the film chucks 13c may be provided in a pair at least on the opposite side on the short side.
  • the push-up amount of the pair of film chucks 13 c on the two sides (right side and left side) pulled in the longitudinal direction (left and right direction in the figure) is reduced in the short direction (same figure).
  • the up-and-down direction of the pair of film chucks 13c on the two sides (upper side and lower side) to be pulled may be different. That is, the push-up amount of the film chuck 13c in the longitudinal direction may be set larger than the push-up amount of the film chuck 13c in the short direction.
  • seat film F in the direction of a longitudinal direction and a transversal direction can be equalized.
  • the film chuck 13c may be divided into a plurality of parts on one side, without being limited to the case where the sheet F is integrally chucked for each side.
  • the amount of rotation of the film chuck 13c at the side position is changed and tension is applied to twist the sheet film F to stretch the wrinkles. It can be held in the state. For example, if the tension is partially increased, wrinkles are generated at other positions. For this reason, after the film chuck 13c is uniformly pushed up and tension is applied, when a wrinkle occurs, the tension of the portion is weakened or the tension other than that portion is increased. Can do.
  • the film chuck 13c is not only configured to be gripped on the side of the sheet film F by a predetermined length so as to be pulled so as to intersect the extending direction of the side, but also from the center at the corner of the sheet film F.
  • a configuration may be adopted in which the corners of the single-wafer film F are gripped in order to stretch in the direction of separation.
  • the present example illustrates a mold 6 for compression molding.
  • the mold 6 is provided with a heater (not shown) at an arbitrary position so that the mold resin R is heat-cured and the workpiece W is resin-molded to produce a molded product M.
  • a heater not shown
  • On the upper clamp surface 6a of the upper mold 6A an air suction hole 6b and an air suction passage 6c communicating with the air suction hole 6b are formed to suck and hold the work W.
  • work holding pins 6d are provided at opposing positions on the outer edge of the rectangular work W at a plurality of positions. The work holding pin 6d presses and holds the outer peripheral surface of the work W.
  • the work holding pin 6d may be a cylindrical pin or a prismatic pin, and is preferably configured to be pressed against the work W via an elastic body.
  • the workpiece holding pin 6d may be a guide for centering the workpiece W when the workpiece W is sucked and held. According to such a configuration, for example, the area of the cavity can be widened as compared with a configuration in which the outer periphery of the workpiece W is held by an L-shaped claw-shaped hook.
  • the lower mold 6B is integrally supported with a lower mold cavity piece 6f that forms the bottom of the lower mold cavity in the lower mold block 6e.
  • a lower mold movable clamper 6g that forms the side of the lower mold cavity is floatingly supported on the lower mold block 6e via a coil spring 6h.
  • a lower mold cavity recess 6C is formed by the lower mold cavity piece 6f and the lower mold movable clamper 6g.
  • a gap between the lower mold movable clamper 6g and the lower mold cavity piece 6f is sealed with a seal ring 6i (O-ring).
  • the lower mold movable clamper 6g is provided with air suction paths 6g1 and 6g2 for attracting and holding the sheet film F on the lower mold surface including the lower mold cavity recess 6C.
  • the air suction path 6g1 sucks the film inner peripheral side from the gap between the lower mold cavity piece 6f and the lower mold movable clamper 6g, and the air suction path 6g2 sucks the film outer peripheral side on the clamp surface of the lower mold movable clamper 6g. It has become. Thereby, the sheet film F is adsorbed so as to follow the concave shape of the lower mold cavity concave portion 6C.
  • a pair of upper and lower clamp blocks are provided between the upper mold 6A and the lower mold 6B when a mold clamping operation is started to form a decompression space in the mold. Good.
  • a pusher 6j is provided outside the lower mold movable clamper 6g of the lower mold 6B (tension applying mechanism).
  • the pusher 6j is provided in order to further increase the tension on the single-wafer film F.
  • the sheet supply film F is carried into the lower mold 6B together with the resin supply jig 13 by the resin supply loader 11, the sheet film F is stretched by the radiant heat from the lower mold 6B, and the tension is reduced. End up.
  • the tension of the sheet film F decreases and sagging occurs, the central part of the sheet film F hangs down due to the weight of the sheet film F or the weight of the supplied mold resin R.
  • the pusher 6j is provided at a position corresponding to the rotation lever 13d of the lower mold 6B.
  • the pusher 6j is moved up and down by an elevating drive mechanism (for example, a drive mechanism such as cylinder drive, solenoid drive, motor drive, etc.). It is configured to be rotatable.
  • the pusher 6j is provided to increase the offset amount of the pair of film chucks 13c and further increase the tension on the single-wafer film F.
  • the pusher 6j can also be used to release the ratchet mechanism 13f.
  • the sheet film F supplying process and the resin supplying jig 13 assembling process will be described with reference to FIG. 2, and the metering process and resin supply of the resin supplying jig before the resin supplying will be described with reference to FIG.
  • the weighing process will be described, and the weighing process after the resin supply of the resin supply jig and the transport process of the resin supply jig will be described with reference to FIG.
  • FIG. 2A the film end is pulled out above the stage unit 17 from the film roll 8a in the film supply unit 8 (see FIG. 1). The film end is pulled out on the stage unit 17 while being held by a chuck hand (not shown), for example.
  • the stage portion 17 is raised and brought into close contact with the long film F.
  • suction is performed from a film suction hole 17a by a suction device (not shown), and the film F is sucked and held at positions corresponding to the four rectangular sides of the stage portion 17, and the cutter 18 is operated in a state free from wrinkles to be larger than the cavity recess.
  • Cut to a predetermined rectangular size In the present embodiment, it is cut into a rectangular shape so as to be larger than the outer shape of the lower mold movable clamper 6g.
  • the cut film F after cutting is shown in FIG. 2C.
  • the sheet film F is in a state of being held by suction on the stage unit 17.
  • the frame 13a held by the loader hand claws 11a of the resin supply loader 11 is superimposed on the cut sheet F.
  • the loader hand claw 11a is inserted into the locking hole 13n and placed on the sheet film F sucked and held by the stage portion 17 while locking the frame 13a.
  • the outer frame body 13a1 is at a position spaced outward from the frame body 13a, and the film chuck 13c supported by the rotating lever 13d is in an open state at a position outside the outer peripheral edge of the sheet film F.
  • the film chuck 13c held by the rotating lever 13d by the cylinder mechanism mounted on the resin supply loader 11 side is moved in the direction in which the outer frame body 13a1 is close to the frame body 13a and The outer peripheral edge portion enters between the pair of film chucks 13c.
  • a pair of film chucks 13c provided on each side are closed by a cam mechanism (not shown), thereby sandwiching the outer peripheral edge of each side of the sheet film F.
  • the suction operation by the film suction hole 17a of the stage unit 17 is released.
  • the drive source (not shown) is operated to start the push-up operation of the push-up pin 15.
  • the rotation lever 13d rotates in the direction of the arrow about the rotation shaft 13e.
  • the rotation direction is the direction in which the film chuck 13c is offset (separated) from the fulcrum frame 13b.
  • the film chuck 13c is moved in the vertical direction with respect to the fulcrum frame 13b (fulcrum portion) to squeeze the sheet film F.
  • the film chuck 13c is pulled in the lateral direction.
  • the tension can be effectively applied to the single wafer film F.
  • seat film F can be reduced in planar view. That is, the larger the sheet film F, the larger the pulling amount in order to apply the same tension.
  • the pulling amount depends on the pulling amount. A large area must be secured in the apparatus, and the enlargement of the apparatus is inevitable.
  • the apparatus area does not increase, and the apparatus can be effectively increased in size. Can be suppressed. Since the film chuck 13c can be rotated about the rotation shaft 13e and the film chuck 13c side of the rotation lever 13d is pushed up by the push-up pin 15 and rotated, a tension can be applied to the sheet film F with a small force. it can.
  • the holding of the frame 13 by the loader hand claw 11a of the resin supply loader 11 is released and retracted from the locking hole 13n.
  • the loader hand claw 11a moves to the resin supply loader 11 side (see FIG. 1) and retracts from just above the stage portion 17. Further, the push-up pin 15 is stopped at a position where the film chuck 13c is offset from the fulcrum frame body 13b by rotating the rotation lever 13d (a state in which a tension is applied to the sheet film F).
  • the push-up pin 15 is retracted so as to be separated from the rotary lever 13d, and the weighing operation by the weighing device 21 arranged immediately below the stage unit 17 is started.
  • the measuring pin 21a is aligned with the through hole 17b and stands by, and the measuring device 21 is provided so as to be lifted and lowered by a lift mechanism (not shown).
  • the through-hole 17b is passed through the stage portion 17 during measurement.
  • the measuring device 21 may be arranged at another position for measurement.
  • the measurement pin 21a and the through-hole 17b become unnecessary.
  • the weighing device 21 is raised, the weighing pin 21 a passes through the through hole 17 b of the stage portion 17, and the resin supply jig 13 (frame body 13 a) is pushed up from the stage portion 17. 13 and the weight of the single wafer film F before resin charging are weighed.
  • the initial weight measured at this time may be reset to zero and then the amount of resin described later may be measured, or the amount of resin may be measured by subtracting the initial weight from the weight after resin input described later.
  • a dispenser 9 (see FIG. 1) described later is scanned to remove the granular resin R. It supplies to the resin accommodating part 22 of the frame 13a.
  • the dispenser 9 is made uniform (flat) while continuously feeding the granular resin R with an electromagnetic feeder while the trough 16 scans the sheet F in the XY direction by a scanning mechanism 23 (scanning unit) described later. Supply.
  • the granular resin R is supplied in an amount necessary for one resin molding operation.
  • FIG. 4K the state in which the granule resin R is supplied uniformly (flat) by the dispenser 9 to the resin container 22 (on the sheet film F) is shown.
  • the weight after charging the resin is measured by the measuring device 21.
  • the resin supply jig 13 does not have other connections such as an electric wiring and an air suction hose, and the weight of the frame body and the single wafer film F can be directly and accurately measured. As a result, the amount of granular resin R required for one resin mold can be accurately measured in real time.
  • a predetermined amount of resin may be continuously supplied while scanning.
  • the amount of resin is a predetermined amount.
  • the amount of resin dropped per unit time may be changed to supply a predetermined amount. For example, when 100 g of the granular resin R is supplied by the dispenser 9, first, the resin is continuously dropped up to 90 g, and the electromagnetic feeder is once stopped and weighed. By changing at least one of the amplitude and frequency of the electromagnetic feeder after weighing, the amount of resin dropped per unit time is changed.
  • the dropping is stopped again and weighed, and by repeating this operation, 100 g which is the target value can be supplied.
  • 100 g which is the target value can be supplied.
  • the resin supply is temporarily stopped and the dispenser 9 is moved slightly inward from the outermost periphery.
  • the resin is supplied while moving slightly to the inner circle along the outermost circle.
  • the resin drop amount may be changed for each inner circumference. By repeating this, the resin can be uniformly supplied to the center.
  • FIG. 4L when the measurement of the resin amount is completed, the measuring device 21 is lowered so as to be separated from the stage unit 17. At this time, the resin supply jig 13 (frame body 13a) supported by the measuring pin 21a is transferred to the stage unit 17 again.
  • FIG. 4M the resin supply loader 11 moves onto the resin supply jig 13, and the loader hand claw 11a enters the locking hole 13n and locks to the frame 13a.
  • the loader hand claw 11a rises, lifts the resin supply jig 13 to which the granular resin R is supplied from the stage portion 17, and draws it to the guide rail 14 side on which the resin supply loader 11 moves.
  • the sheet film F hangs down at the center or the like. Therefore, the operation can be stopped in a state where the resin supply jig 13 is lifted to an arbitrary detection position, and the shielding state in the space on the stage unit 17 can be detected by the film drooping detection unit 20 (see FIG. 5).
  • the push-up pin 15 is operated so that the resin supply jig 13 is lowered and tension is applied again.
  • the single-wafer film F can be conveyed after applying an appropriate tension.
  • the film drooping detection unit 20 detects the drooping of the sheet film F, an alarm may be generated as an abnormal state and the apparatus may be stopped.
  • the resin supply loader 11 holds the resin supply jig 13 while the resin supply loader 11 holds the resin supply jig 13, the resin supply loader 11 conveys it along the guide rail 14 of FIG. 1 and carries it into the mold 6 (lower mold 6 ⁇ / b> B) of the predetermined press unit 5.
  • the resin supply jig 13 is supplied into the mold 6 through the gap between the posts 5 a in the press portion 5.
  • the film chuck 13c is not pulled in the lateral direction, and the film chuck 13c is moved in the vertical direction with respect to the fulcrum frame body 13b (fulcrum portion) to apply tension (open the rotation lever 13d).
  • the resin supply jig 13 can be carried into the mold 6 through a limited gap between the posts 5a. The same effect can be obtained even if the press structure is such that the side of the platen is held by the frame plate in the press portion 5 without using the post 5a.
  • the resin supply jig 13 can be used for conveyance while maintaining a predetermined tension, the sheet can be transferred to the mold 6 without generating wrinkles. Further, since the granular resin R necessary for one resin molding is accurately measured and supplied to the resin container 22, the molding quality of the molded product can be improved.
  • FIGS. 7 and 8 illustrate and explain only the lower mold 6B.
  • the resin supply loader 11 holding the resin supply jig 13 enters the upper part of the lower mold 6B of the mold 6 in which the mold is opened and performs alignment. Positioning is performed so that the mounting surface of the granule resin R of the sheet film F overlaps the upper surface of the lower mold cavity piece 6f, and the frame 13a overlaps the lower mold movable clamper 6g.
  • the resin supply loader 11 is lowered and lowered until the frame 13a comes into contact with the lower mold movable clamper 6g.
  • the pusher 6j provided in the lower mold 6B is disposed at a position corresponding to the rotation lever 13d.
  • the single wafer film F When the single wafer film F approaches the lower die 6B, the single wafer film F is stretched by the radiant heat from the lower die 6B, and there is a possibility that the problem such as the film drooping as described above may occur. For this reason, as shown in FIG. 7C, a driving source (not shown) is operated to push up the pusher 6j, thereby further rotating the rotating lever 13d around the rotating shaft 13e.
  • the rotation direction is the direction in which the film chuck 13c is offset (separated) from the fulcrum frame 13b.
  • the sheet film sandwiched between the film chucks 13c When the end portion of F is offset (separated) from the fulcrum frame 13b (fulcrum), the sheet film F is pulled inside the fulcrum frame 13b, and the film tension increases between the fulcrum frames 13b. Further, at this time, the ratchet mechanism 13f shown in FIG. 3 is operated, and the rotating lever 13d is held at the rotated position, so that the film tension for closing the opening of the frame 13a is maintained in an increased state.
  • the air suction operation is started from the air suction paths 6g1 and 6g2 provided in the lower mold movable clamper 6g, and the inner and outer circumferences of the sheet film F are adsorbed and held along the lower mold cavity recess 6C. Since the single-sheet film F is adsorbed and held in a state where the film tension is increased, generation of wrinkles can be effectively prevented.
  • FIG. 8E when a drive source (not shown) is operated to push the pusher 6j up to a predetermined height and then retracted downward, the ratchet mechanism 13f (see FIG. 3) is released, so that the rotation lever 13d becomes a fulcrum. It rotates in a direction approaching the frame 13b (arrow direction). At this time, the film chuck 13c returns to a horizontal posture parallel to the clamp surface of the lower mold movable clamper 6g. In this state, the outer frame body 13a1 is moved outwardly to release the chuck of the film chuck 13c that chucks the outer peripheral edge of the sheet film F by a cam mechanism (not shown).
  • seat film F can be delivered with the granular resin R being adsorbed and held on the lower mold 6B.
  • the sheet F is in the state of being sucked and held in the lower mold cavity recess 6C including the suction by the lower mold movable clamper 6g.
  • the adsorption holding state in the leaf film F is not impaired.
  • the resin supply loader 11 moves upward with the resin supply jig 13 (frame body 13 a) being chucked and retracts from the press unit 5.
  • the supply process to the lower mold 6B of the single wafer film F and the granular resin R is completed.
  • the sheet film F can be supplied to the mold die 6 without any defects. Further, when the sheet F is carried into the mold 6, the sheet F may be stretched by radiant heat. However, the tension is increased again by the pusher 6 j (tension applying mechanism) to the mold 6. It is also possible to prevent wrinkles from occurring when setting the sheet film F.
  • FIG. 9A it is assumed that the sheet feed film F and the granular resin R are carried into the lower mold 6B by the resin supply loader 11 as described above.
  • a large-size work W (work, rectangular substrate, etc.) having a side of 600 mm, for example, is carried into the upper mold 6A by the work loader 10 (see FIG. 1) and provided on the upper mold clamping surface 6a.
  • the air suction hole 6b and the air suction path 6c are held by suction.
  • the outer peripheral surface of the rectangular workpiece W is positioned and transferred to the upper die 6A by pressing and holding the outer peripheral surface of the workpiece W by the work holding pins 6d provided at the opposing positions at a plurality of locations.
  • the position may be determined by the positioning pin.
  • the rectangular workpiece W is centered by the workpiece holding pin 6d when the outer peripheral surface of the workpiece W is uniformly pressed by the workpiece holding pin 6d.
  • work W may be performed simultaneously, and after carrying in the workpiece
  • the mold 6 is closed.
  • the lower mold 6B is raised and the workpiece W is clamped between the upper mold 6A.
  • the mold space between the upper mold 6A and the lower mold 6B is closed to form a reduced pressure space, and molding is performed in a reduced pressure atmosphere.
  • it is.
  • FIG. 9C shows a state where the mold clamping operation of the mold 6 is completed and the workpiece W is immersed in the granule resin R melted in the lower mold cavity recess 6C and is heated and pressurized to be cured (compression molding). Show.
  • the mold 6 is opened.
  • the mold opening is performed while maintaining the suction holding of the molded product M on the upper clamp surface 6a of the upper mold 6A and the suction holding on the lower mold clamping surface including the lower mold cavity recess 6C of the sheet F. Is called.
  • FIG. 9D when the mold is opened, the molded product M is sucked and held on the upper clamp surface 6a of the upper mold 6A, and the single wafer film F includes the lower mold cavity recess 6C.
  • the mold is clamped and held. In this way, the molded product M and the used sheet-fed film F are held in separate molds so that they can be taken out from the press unit 5 and conveyed to the respective storage / accommodation destinations. Can be simplified.
  • the molded product M is released from the upper mold 6 ⁇ / b> A and delivered to the work loader 10 (upper surface side).
  • the used single wafer film F is delivered from the lower mold 6B by the work loader 10 (lower surface side).
  • the molded product M is delivered from the work loader 10 to the robot hand 4a of the robot transport device 4.
  • the used single wafer film F is discharged from the work loader 10 to the film collecting unit 12 and collected.
  • the robot hand 4 a holds the molded product M and carries it into a predetermined curing furnace 3. After-curing of the molded product M is performed in the curing furnace 3. Subsequently, the robot hand 4 a takes out the molded product M from the curing furnace 3, thereby completing all processes for the workpiece W and completing the manufacturing process of the molded product M. Subsequently, the molded product M is carried into the molded product storage unit 2 where the molded product M is stored.
  • the amount of film used can be reduced to reduce running costs, and the molding quality of a large-sized molded product can be reduced. And the installation area can be suppressed.
  • the granular resin R is stocked in the first reservoir 9a fixed to the dispensing unit Ud.
  • a predetermined amount of granular resin R is supplied from the first reservoir 9a to the second reservoir 9b located below and temporarily stored.
  • the supply of the granular resin R from the first reservoir 9a to the second reservoir 9b is dropped by an electromagnetic feeder, for example, with the shutter opened.
  • the trough 16 is connected to the second reservoir 9b, and the granular resin R is quantitatively fed by an electromagnetic feeder (not shown) and dropped into the resin container 22.
  • the second reservoir 9b and the trough 16 are scanned in the X, Y, and Z directions with respect to the resin container 22 by the scanning mechanism 23 and uniformly supply mold resin necessary for one resin mold.
  • the trough 16 side may move at least in the XY direction
  • the resin container 22 side may move in the Z direction by raising and lowering the stage portion 17.
  • the Y-axis drive guide 23b is connected to the X-axis drive guide 23a so as to be movable in the X-axis direction
  • the Z-axis drive guide 23c is connected to the Y-axis drive guide 23b so as to be movable in the Y-axis direction.
  • the scanning axis 23d is connected to the Z-axis drive guide 23c so as to be movable in the Z-axis direction.
  • the X-axis drive guide 23a, the Y-axis drive guide 23b, and the Z-axis drive guide 23c include a drive source (motor, cylinder, etc.) and a drive transmission mechanism (ball screw and nut, guide rail and linear guide, etc.) It can reciprocate in the axial direction.
  • the second storage portion 9b and the trough 16 are integrally supported on the scanning shaft 23d. As a result, the second storage portion 9b and the trough 16 are scanned in the X, Y, and Z directions with respect to the resin accommodating portion 22 formed in the resin supply jig 13, and the granular resin R necessary for one resin mold is obtained.
  • the granular resin can be supplied by various methods, such as supplying it in a line with a single stroke, supplying it in a spiral shape, or supplying it while changing its radial position so as to draw a concentric circle. it can.
  • a shutter 24 that can be opened and closed is provided at the opening of the trough 16. Since the granular resin is quantitatively fed by the electromagnetic feeder, it is possible to prevent unnecessary resin from being dropped when it is desired to stop dropping immediately, or from being unnecessarily diffused around when moving in the XY direction. .
  • the shutter 24 is opened and closed by an open / close cylinder 24a supported by the scanning shaft 23d.
  • the trough 16 is equipped with a mold resin necessary for a single resin mold. However, since the resin drop can be stopped by changing the amplitude and frequency of the shutter 24 and the trough 16, a plurality of molds are molded. The resin necessary for the mounting may be mounted.
  • the shutter 24 has a form in which the width is gradually narrowed toward the lower side of the drop opening, the mold resin can be stopped so as not to be cut or pinched so that the mold resin can be pressed by the drop opening. More preferred. Further, it is preferable that a discarded resin recovery box 25 is provided below the trough 16 outlet. At the beginning of delivery of the granular resin R from the second reservoir 9b, the supply amount tends to vary. For this reason, the granular resin R immediately after the operation of the electromagnetic feeder is discarded until it is stabilized and dropped into the resin recovery box 25 for recovery.
  • an ionizer 26 for removing static electricity generated at the opening of the frame 13a is provided integrally with the scanning shaft 23d.
  • a frame knocking portion 27 that hits the frame body 13a and drops the granular resin R attached to the opening of the frame body 13a onto the resin housing portion 22 may be provided in front of the trough 16.
  • the frame knock part 27 is moved up and down by, for example, a knock cylinder 27a provided integrally with the scanning shaft 23d.
  • a film detection sensor 28 (for example, a pressure sensor, a contact sensor, a height-limited laser sensor, etc.) is provided in front of the trough 16.
  • the film detection sensor 28 is supported so as to be movable up and down by a lifting cylinder 28a provided integrally with the scanning shaft 23d.
  • the film detection sensor 28 detects a stretched state as to whether the sheet film F is stretched on the resin supply jig 13 with an appropriate tension. After the sheet-fed film F is stretched on the resin supply jig 13 and before the granular resin R is charged by the dispenser 9, the scanning shaft 23d is scanned in the XY direction on the resin container 22 to detect the film detection sensor. 28, the tension of the film is detected by contact pressure or reflected light.
  • the dispenser 9 can move at least in the XY direction, rather than flattening after dropping the granular resin R in one place of the resin containing portion 22, it is spread so as to be uniform when the resin is dropped into the resin containing portion 22. Therefore, the granular resin R can be flattened more reliably and quickly.
  • the dispenser 9 may be provided with a servo motor 23e between the Z-axis drive guide 23c and the scanning shaft 23d, which can rotate the scanning shaft 23d forward and backward.
  • the scanning shaft 23d is rotated in a predetermined direction by the servo motor 23e so that the exit shape of the trough 16 is always oriented along the outer periphery along the outer periphery in the frame 13a.
  • the mold resin can be supplied along the direction of the trough 16 in a direction perpendicular to the workpiece outer circumference (radial direction) or parallel (tangential direction).
  • the dispenser 9 includes an extrusion mechanism 9c having a piston and a syringe 9d containing a liquid resin R therein.
  • the extrusion mechanism 9c includes a cylinder, and discharges the liquid resin R by pressing a piston connected to the cylinder rod within the syringe 9d.
  • the dispenser 9 is provided so as to be replaceable with respect to the scanning shaft 23d.
  • the dispenser 9 is replaced with another dispenser 9 when the remaining amount of the liquid resin R accommodated in the syringe 9d decreases.
  • a discarded resin collection box 25 is provided below 9d of the syringe.
  • the liquid resin R immediately after the operation of the extrusion mechanism 9c is discarded until the liquid resin supply amount from the syringe 9d is stabilized, and is dropped into the resin recovery box 25 and recovered.
  • the dispenser 9 is not limited to a single dispenser 9 and may be provided with a plurality of (for example, two) dispensers 9 as shown in FIG. 12 and supplied to the resin container 22 formed in the resin supply jig 13.
  • the plurality of dispensers 9 may share and supply the resin charging area, or the plurality of dispensers 9 may be synchronized with the scanning mechanism 23 at least in the XY direction or XY-. You may make it scan to a Z direction and supply to the resin accommodating part 22.
  • FIG. In the embodiment shown in FIG. 11, the syringe 9d is replaced.
  • a resin supply tank is provided outside and the hose is continuously connected to the syringe 9d by a hose.
  • the mold resin R may be supplied to the structure.
  • the frame 13a is formed in a rectangular shape assuming a substrate or a plate as a workpiece, and a rectangular hollow hole is formed.
  • a semiconductor wafer or eWLB embedded wafer level
  • the outer shape of the frame 13a and the outer shape of the sheet film F are rectangular as in FIG.
  • the upper mold Only the single-wafer film F may be transported and delivered to the upper mold clamp surface on which the upper mold cavity recess is formed by compression molding.
  • the mold resin R is placed on the work and set in the lower mold.
  • the dispenser 9 scans the workpiece in the XY direction, opens and closes the dropping port of the trough 16 or the syringe 9d, and drops mold resin (granular resin, powdered resin, liquid resin, etc.). May be.
  • the running cost can be reduced by reducing the amount of the single-wafer film F used as compared to the long film.
  • only the single wafer film F may be conveyed and delivered to the lower mold clamping surface in which the lower mold cavity recess is formed.
  • the mold 6 has been described using a compression mold, it may be a transfer mold.
  • the resin supply jig 13 in addition to the configuration in which tension is additionally applied to the sheet film F stretched by the radiant heat in the mold 6, it is additionally applied before being supplied to the mold 6. It can also be configured. In this case, for example, when it is necessary to preheat and transport a resin that is difficult to transport, such as a powdered resin that may be scattered and scattered by the flow of the atmosphere during transport, for example. If the sheet resin F can be tensioned when the mold resin R is supplied and preheated, it can be transported after the sheet film F sagging due to the preheating is eliminated.
  • the dispensing unit Ud can be used by being incorporated in a resin molding apparatus as described above, but can also be used as a single unit.

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PCT/JP2017/024805 2016-12-13 2017-07-06 枠体治具、樹脂供給治具及びその計量方法、モールド樹脂の計量装置及び方法、樹脂供給装置、樹脂供給計量装置及び方法、並びに樹脂モールド装置及び方法 WO2018109967A1 (ja)

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JP7428384B2 (ja) * 2020-10-06 2024-02-06 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
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TWI841290B (zh) 2022-05-27 2024-05-01 日商Ｔｏｗａ股份有限公司 樹脂成形裝置、及樹脂成形品之製造方法

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