WO2018038059A1 - 無アルカリガラス - Google Patents
無アルカリガラス Download PDFInfo
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- WO2018038059A1 WO2018038059A1 PCT/JP2017/029817 JP2017029817W WO2018038059A1 WO 2018038059 A1 WO2018038059 A1 WO 2018038059A1 JP 2017029817 W JP2017029817 W JP 2017029817W WO 2018038059 A1 WO2018038059 A1 WO 2018038059A1
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- free glass
- mgo
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
- C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
Definitions
- the present invention relates to an alkali-free glass suitable as a substrate glass for various displays.
- various display substrate glasses especially glass that forms a metal or oxide thin film on the surface, contain alkali metal oxides, so that alkali metal ions diffuse into the thin film and deteriorate the film characteristics.
- alkali-free glass that is substantially free of alkali metal ions.
- the thermal contraction (compaction) of the glass substrate by heating is required to be small.
- a flat panel display typified by a liquid crystal display (LCD)
- two substrate glasses constituting the FPD in the case of LCD, a substrate glass provided with TFT elements and a color filter are provided).
- the substrate glass is bonded using a curable resin.
- the FPD has components that have a problem with heat resistance such as a TFT element. Therefore, a photocurable resin is usually used as the curable resin, and the resin is cured by ultraviolet irradiation.
- the substrate glass for display is required to have ultraviolet transparency, and Patent Documents 1 and 2 disclose an alkali-free glass substrate in which the ultraviolet transmittance at a wavelength of 300 nm is 50 to 85% at a thickness of 0.5 mm. Proposed.
- glass that is mass-produced contains Fe 2 O 3 derived from raw materials and manufacturing processes.
- Fe 2 O 3 exists in the glass as Fe 2+ or Fe 3+ , and especially Fe 3+ has an absorption peak in the vicinity of a wavelength of 300 nm. Therefore, in order to improve the ultraviolet transmittance of the glass, Fe 2 O 3 It is necessary to reduce the content of.
- the content of Fe 2 O 3 is small, there is a problem that the amount of infrared rays absorbed by Fe 2+ is lowered in the melting step, the temperature of the glass is hardly raised, the meltability is deteriorated, and the bubble quality is lowered.
- An object of the present invention is to provide an alkali-free glass which has a small compaction indicating thermal shrinkage in a TFT element manufacturing process and the like, a high strain point, a high ultraviolet transmittance and an easy melting.
- the present invention relates to SiO 2 65 to 75 in terms of mol% based on oxide.
- Al 2 O 3 9-15, B 2 O 3 0-3, MgO 0-12, CaO 0-8, SrO 0-6, BaO 0-5, MgO + CaO + SrO + BaO is 12-22, 4.
- [Fe 2 O 3 ] +5.65 [Na 2 O] +4.03 [K 2 O] +4.55 [SnO 2 ] is 0.55 or less, and the alkali-free glass has a compaction of 80 ppm or less. I will provide a.
- the present invention includes, among other things, SiO 2 65 to 70 in terms of mol% based on oxide.
- Al 2 O 3 9-15, B 2 O 3 0-3, MgO 5-12, CaO 3-8, SrO 1-6, BaO 0-4, Fe 2 O 3 0.001 to 0.03, Na 2 O 0.003 to 0.06, K 2 O 0 to 0.02, SnO 2 0 to 0.12, ZrO 2 0-2, and MgO + CaO + SrO + BaO is 15-22, MgO / (MgO + CaO + SrO + BaO) is 0.33 or more, MgO / (MgO + CaO) is 0.40 or more, MgO / (MgO + SrO) is 0.45 or more, and 4.84 [Fe 2 O 3 ] +5.
- an alkali-free glass having a small compaction, a high strain point, a high ultraviolet transmittance, and a high melting point can be obtained.
- FIG. 6 is a graph showing measurement results of electrical resistivity of molten glass (compositions of Examples 3 to 6) and refractories (refractory 1 and refractory 2) in Examples.
- composition range of each component of alkali-free glass If the SiO 2 content is less than 65% (mol%, hereinafter the same unless otherwise specified), the strain point is not sufficiently increased, the thermal expansion coefficient is increased, and the density is increased.
- the content is preferably 65.5% or more, more preferably 66% or more, and further preferably 66.5% or more. In the amount is greater than 75%, decreases meltability during glass manufacture, the temperature T 4 which is a temperature T 2 and 10 4 dPa ⁇ s glass viscosity becomes 10 2 dPa ⁇ s is increased, the devitrification temperature Rises.
- the content is preferably 70% or less, more preferably 69% or less, further preferably 68.5% or less, and further preferably 68% or less.
- Al 2 O 3 suppresses the phase separation of the glass, lowers the thermal expansion coefficient, and raises the strain point.
- the content is preferably 10% or more, more preferably 11% or more, further preferably 12% or more, and particularly preferably 12.5% or more. If the content exceeds 15%, the meltability of the glass during production may be deteriorated or the devitrification temperature may be increased.
- the content is preferably 14.5% or less, more preferably 14% or less, and even more preferably 13.5% or less.
- the content is preferably 2.5% or less, more preferably 2% or less, and even more preferably 1.5% or less.
- MgO has the characteristics of increasing the Young's modulus while maintaining a low density without increasing the coefficient of thermal expansion in alkaline earths, and can be contained because it improves the meltability during glass production. If the content exceeds 12%, the devitrification temperature may increase. It is preferably 11% or less, more preferably 10% or less, and even more preferably 9.5% or less. In order to obtain a low expansion coefficient, low density and high Young's modulus, or to increase the meltability of the glass, the content is preferably 3% or more, more preferably 5% or more, more preferably 6% or more, and 7%. The above is more preferable, 8% or more is further preferable, and 8.5% or more is particularly preferable.
- CaO has the characteristics that it does not increase the thermal expansion coefficient of glass in alkaline earth next to MgO, and increases the Young's modulus while maintaining a low density, and can be contained to improve the meltability during glass production. .
- the devitrification temperature may increase, so the content is 8% or less, preferably 7% or less, more preferably 6.5% or less, and even more preferably 6% or less.
- the content is more preferably 4% or more, further preferably 4.5% or more, and further preferably 5% or more.
- the content is preferably 1% or more, preferably 2% or more, more preferably 3% or more, Furthermore, it is 3.5% or more. However, if the content exceeds 6%, the expansion coefficient may increase. 5.5% or less and 5% or less are preferable.
- BaO is not essential, but can be contained to improve meltability. However, if the content is too large, the thermal expansion coefficient and density of the glass are excessively increased.
- the content is preferably 4% or less, more preferably less than 2%, more preferably 1% or less, and more preferably 0.5% or less, and further preferably not substantially contained.
- SnO 2 is not essential, but is preferably contained in order to improve the ultraviolet transmittance of the glass.
- SnO 2 is reduced from SnO 2 to SnO at a temperature of 1450 ° C. or higher in the glass melt.
- SnO in the glass is oxidized and Fe 2 O 3 is reduced, so that the ultraviolet transmittance of the glass increases.
- the Sn content in the glass is preferably 0.01% or more in terms of SnO 2 . When the content is 0.01% or more, the effect of improving the ultraviolet transmittance of glass is preferably exhibited.
- the content is more preferably 0.02% or more, still more preferably 0.03% or more.
- the glass may be colored or devitrified, so the Sn content in the glass is 0.12% or less in terms of SnO 2 .
- the content is preferably 0.10% or less, more preferably 0.07% or less, and still more preferably 0.05% or less. Furthermore, it is preferable not to contain substantially.
- Sn content is not the input amount in a glass raw material but the quantity which exists in the glass after cooling.
- ZrO 2 may be contained up to 2% in order to lower the glass melting temperature. If the content exceeds 2%, the glass becomes unstable, or the relative dielectric constant ⁇ of the glass becomes large, so it is preferably 1.5% or less. Furthermore, it is desirable not to contain substantially.
- the meltability is poor.
- the total amount is preferably 15% or more, more preferably 17% or more, and further preferably 18% or more. If the total amount is more than 22%, there is a possibility that the thermal expansion coefficient cannot be reduced.
- the content is preferably 21% or less, more preferably 20% or less, and even more preferably 19.5% or less.
- MgO / (MgO + CaO + SrO + BaO) is 0.33 or more, preferably 0.36 or more, more preferably 0.40 or more, and particularly preferably 0.45 or more.
- MgO / (MgO + CaO) is 0.40 or more, preferably 0.50 or more, more preferably 0.55 or more.
- MgO / (MgO + SrO) is 0.45 or more, preferably 0.55 or more, more preferably 0.60 or more. It is more preferable to satisfy all three of these.
- the content of alkali metal in the glass raw material is expressed in terms of mol% on the basis of oxide, and Na 2 O is 0.00. It is preferable to set the range from 003 to 0.06% and K 2 O from 0 to 0.02%.
- Alkali-free glass has lower alkali metal oxide content than alkali glass such as soda lime glass, and less alkali metal ions are present in the molten glass. Is suitable.
- the glass of the present invention preferably has a Na 2 O content of 0.005 to 0.04%, more preferably 0.008 to 0.03%, and still more preferably 0.01 to 0.025%. Na 2 O accounts for the majority of alkali metal oxides inevitably mixed from the raw materials.
- the content of K 2 O is preferably 0.001 to 0.02%, more preferably 0.003 to 0.015%, and still more preferably 0.005 to 0.01%.
- the total content of alkali metal oxides (Li 2 O + Na 2 O + K 2 O) is 0.06% or less, preferably 0.04% or less, more preferably 0.03% or less, and even more preferably 0.02% or less. Then, such a problem does not occur.
- the content of Fe 2 O 3 is 0.03% or less in order to increase the ultraviolet transmittance, but 0.001% or more is preferable in order to increase the heating efficiency by burner combustion.
- the content is more preferably 0.003% or more and 0.025% or less, more preferably 0.005% or more and 0.02% or less, still more preferably 0.008% or more and 0.015% or less. is there.
- the alkali-free glass of the present invention has a value represented by the following formula (I) of 0.55 or less. 4.84 [Fe 2 O 3 ] +5.65 [Na 2 O] +4.03 [K 2 O] +4.55 [SnO 2 ]... (I)
- the numerical value of the component enclosed in square brackets represents the content (mol%) of the component in the alkali-free glass (the same applies to the description of other parts of the present specification).
- the value represented by the formula (I) (also referred to as a parameter of the formula (1)) is an index of the electrical resistivity at 1400 ° C. of the alkali-free glass. The electrical resistivity is increased, and Joule heat can be easily obtained.
- the value represented by the formula (I) is more preferably 0.40 or less, further preferably 0.30 or less, and particularly preferably 0.20 or less. Although the lower limit of the value represented by the formula (I) is not particularly defined, the value represented by the formula (I) is usually 0.04 or more, particularly 0.08 or more.
- the glass preferably does not substantially contain P 2 O 5 . Furthermore, in order to facilitate recycling of the glass, it is preferable that PbO, As 2 O 3 , and Sb 2 O 3 are not substantially contained. Further, in order to improve the meltability, clarity and formability of the glass, ZnO, SO 3 , F and Cl can be added to the glass raw material in a total amount of 5% or less.
- silica sand can be used as the silicon source of SiO 2 , but the proportion of particles having a median particle size D 50 of 20 ⁇ m to 27 ⁇ m, a particle size of 2 ⁇ m or less is 0.3% by volume or less, and the particle size is 100 ⁇ m or more.
- silica sand of 2.5 vol% or less can suppress the aggregation of silica sand and dissolve it, facilitating the dissolution of silica sand, reducing the number of bubbles, and making the alkali-free glass with high homogeneity and flatness.
- particle size in this specification is the equivalent sphere diameter of silica sand (meaning the primary particle size in the present invention), and specifically, in the particle size distribution of the powder measured by the laser diffraction / scattering method. Refers to particle size.
- “median particle diameter D 50 ” means that the volume frequency of particles larger than a certain particle diameter is 50% of that of the whole powder in the particle size distribution of the powder measured by the laser diffraction method.
- the “ratio of particles having a particle diameter of 2 ⁇ m or less” and “ratio of particles having a particle diameter of 100 ⁇ m or more” in this specification are measured by measuring the particle size distribution by a laser diffraction / scattering method, for example.
- the median particle size D 50 of silica sand is 25 ⁇ m or less, it is more preferable because dissolution of silica sand becomes easier. Further, the ratio of the particles having a particle diameter of 100 ⁇ m or more in the silica sand is particularly preferably 0% because the silica sand is more easily dissolved.
- Alkaline earth metal compound can be used as the alkaline earth metal source.
- alkaline earth metal source include carbonates such as MgCO 3 , CaCO 3 , BaCO 3 , SrCO 3 , (Mg, Ca) CO 3 (dolomite), oxides such as MgO, CaO, BaO and SrO, Mg (OH ) 2 , Ca (OH) 2 , Ba (OH) 2 , Sr (OH) 2 and other hydroxides.
- the undissolved amount of the SiO 2 component contained in the silica sand increases, the undissolved SiO 2 is taken into the bubbles when the bubbles are generated in the molten glass and gathers near the surface layer of the molten glass. As a result, a difference in the composition ratio of SiO 2 occurs between the surface layer of the molten glass and the portion other than the surface layer, so that the homogeneity of the glass is lowered and the flatness is also lowered.
- the content of the alkaline earth metal hydroxide is preferably 15 to 100 mol%, more preferably 30 to 100 mol%, and further preferably 60 to 100 mol, out of 100 mol% of the alkaline earth metal source. % Is more preferable because the undissolved amount of the SiO 2 component at the time of melting the glass raw material decreases. Note that “mol%” here is in MO conversion, and M is an alkaline earth metal element. As the molar ratio of hydroxide in the alkaline earth metal source increases, the undissolved amount of the SiO 2 component at the time of melting the glass raw material decreases, so the higher the molar ratio of the hydroxide is, the better.
- the alkaline earth metal source a mixture of an alkaline earth metal hydroxide and a carbonate, an alkaline earth metal hydroxide alone, or the like can be used.
- the carbonate it is preferable to use one or more of MgCO 3 , CaCO 3 and dolomite.
- the alkaline earth metal hydroxide it is preferable to use at least one of Mg (OH) 2 and Ca (OH) 2 , and it is particularly preferable to use Mg (OH) 2 .
- the glass raw material does not substantially contain P 2 O 5 . Since the Ca raw material often contains phosphorus as an impurity, it is preferable to use a high-purity raw material when the glass contains CaO.
- a boron compound can be used as the boron source.
- the boron compound include orthoboric acid (H 3 BO 3 ), metaboric acid (HBO 2 ), tetraboric acid (H 2 B 2 O 4 O 7 ), boric anhydride (B 2 O 3 ) and the like. Is mentioned. In the production of ordinary alkali-free glass, orthoboric acid is used because it is inexpensive and easily available.
- the boron source it is preferable to use boric acid anhydride containing 10 to 100% by mass (converted to B 2 O 3 ) out of 100% by mass (converted to B 2 O 3 ).
- the boric anhydride By setting the boric anhydride to 10% by mass or more, aggregation of the glass raw material is suppressed, and an effect of reducing bubbles, homogeneity, and improving flatness can be obtained.
- the boric anhydride is more preferably 20 to 100% by mass, and further preferably 40 to 100% by mass.
- orthoboric acid is preferable because it is inexpensive and easily available.
- the glass of the present invention is prepared by continuously charging a glass raw material prepared so as to have the above composition into a melting furnace. It can be produced by a method of heating to ⁇ 1750 ° C. and dissolving. For heating in the melting furnace, it is preferable to use both heating by a combustion flame of the burner and energization heating of the molten glass in the melting furnace.
- the burner is usually disposed above the melting furnace and is heated by a combustion flame of fossil fuel, specifically, a liquid fuel such as heavy oil or kerosene, or a gaseous fuel such as LPG.
- a combustion flame of fossil fuel specifically, a liquid fuel such as heavy oil or kerosene, or a gaseous fuel such as LPG.
- the fuel can be mixed and burned with oxygen gas, or the fuel can be mixed and burned with oxygen gas and air.
- the electric heating of the molten glass in the melting furnace is performed by applying a DC voltage or an AC voltage to a heating electrode provided on the bottom or side of the melting furnace so as to be immersed in the molten glass in the melting furnace. It is preferable. As will be described later, it is preferable to maintain the potential difference between the electrodes at 100 to 500 V when conducting heating by heating. However, in order to apply such a DC voltage, conversion from AC that can be used as a commercial power source to DC is performed. Therefore, it is preferable to apply an AC voltage.
- the material used for the heating electrode is required to have excellent heat resistance and corrosion resistance to molten glass in addition to excellent conductivity.
- Examples of the material satisfying these include rhodium, iridium, osmium, hafnium, molybdenum, tungsten, platinum, and alloys thereof.
- the heating amount T (J / h) by the electric heating is represented by the following formula ( It is preferable to satisfy II). 0.10 ⁇ T 0 ⁇ T ⁇ 0.40 ⁇ T 0 (II)
- T is smaller than 0.10 ⁇ T 0 , there is a possibility that the effect of the combined use of the heated heating of the molten glass, that is, the effect of suppressing erosion of the refractory constituting the melting kiln may be insufficient.
- T is larger than 0.40 ⁇ T 0 , the temperature at the bottom of the melting furnace rises, and refractory erosion may progress.
- the melting kiln is heated to a high temperature of 1400 to 1700 ° C. when the glass raw material is melted, a refractory is used as a constituent material.
- the refractory constituting the melting furnace is required to have corrosion resistance, mechanical strength, and oxidation resistance against molten glass.
- a zirconia refractory containing 90% by mass or more of ZrO 2 has been preferably used since it has excellent corrosion resistance against molten glass.
- the above zirconia refractories contain alkali components (Na 2 O and K 2 O) in a total amount of 0.12% by mass or more as components for reducing the viscosity of the matrix glass, When heated to a high temperature, it exhibits ionic conductivity due to the presence of the alkali component. For this reason, at the time of energization heating, current may flow not only from the molten glass but also to the refractory constituting the melting kiln from the heating electrode provided in the melting kiln.
- alkali components Na 2 O and K 2 O
- the glass raw material is set so that Rb> Rg.
- the refractory which comprises a melting kiln As shown in the examples described later, the electrical resistivity of the molten glass and the refractory decreases as the temperature increases, but the decrease in the electrical resistivity with respect to the temperature increase is larger in the molten glass than in the refractory. For this reason, if the electrical resistivity at 1400 ° C.
- the refractory always has a higher electrical resistivity than the molten glass at a higher temperature, that is, in the temperature range of 1400 to 1700 ° C. Become. And if it selects a glass raw material and the refractory which comprises a melting furnace so that it may become Rb> Rg, it will suppress that an electric current flows into the refractory which comprises a melting furnace from a heating electrode at the time of energization heating. .
- the ratio of Rb to Rg preferably satisfies Rb / Rg> 1.00, more preferably satisfies Rb / Rg> 1.05, and Rb / Rg> 1.10. It is more preferable to satisfy.
- the alkali-free glass can reduce the Rg by adding an alkali metal oxide, Fe 2 O 3, and SnO 2 as necessary.
- Rg can also be adjusted by changing the temperature T 2 at which the viscosity ⁇ of the alkali-free glass to be produced becomes 10 2 poise (dPa ⁇ s). Rg decreases as T 2 decreases.
- Rb can be adjusted by changing the content of alkali components (Na 2 O, K 2 O).
- Rb can be adjusted by changing the proportion of K 2 O in the alkali component.
- Rb increases as the content of alkali components (Na 2 O, K 2 O) decreases.
- Rb increases as the proportion of K 2 O in the alkali component increases.
- ZrO 2 is 85 to 91%
- SiO 2 is 7.0 to 11.2%
- P 2 O 5 0.05 to 1.0% B 2 O 3 0.05 to 1.0%
- K 2 O and Na 2 O High zirconia molten cast refractories containing 0.01 to 0.12% of the total content of K 2 O and Na 2 O or more.
- the high zirconia molten cast refractory having the above composition is a refractory consisting mainly of zirconia (ZrO 2 ) of 85 to 91% of the chemical component, and has a badelite crystal as a main constituent, It exhibits excellent corrosion resistance, has a low alkali component content, and mainly contains K 2 O having a large ionic radius and a low mobility as an alkali component, and therefore has an electrical resistivity in a temperature range of 1400 to 1700 ° C. large.
- ZrO 2 is 88 to 91%
- SiO 2 is 7.0 to 10%
- Al 2 O 3 is 1.0 to 3.0% in terms of mass%.
- High zirconia molten cast refractories containing 0.10 to 1.0% P 2 O 5 and 0.10 to 1.0% B 2 O 3 are preferred.
- the glass raw material is continuously charged into a melting furnace, heated to 1400 to 1700 ° C. to form molten glass, and then the molten glass is formed into a plate shape by a float process, whereby an alkali-free glass can be obtained.
- an alkali-free glass can be obtained as a plate glass by forming it to a predetermined plate thickness by a float process, and cutting it after slow cooling.
- the forming method for the plate glass is preferably a float method, a fusion method, a roll-out method, or a slot down draw method, and the float method is particularly preferable in consideration of productivity and enlargement of the plate glass.
- the glass substrate made of the alkali-free glass of the present invention preferably has an ultraviolet transmittance at a wavelength of 300 nm of 40% or more in terms of a glass plate thickness of 0.5 mm.
- the ultraviolet rays used for the ultraviolet curable resin used for bonding the two substrate glasses constituting the FPD are mainly ultraviolet rays having a wavelength near 300 nm. If the two substrate glasses have a low ultraviolet transmittance at a wavelength of 300 nm, it takes a long time to bond the two substrate glasses with the ultraviolet curable resin.
- the alkali-free glass substrate of the present invention has a high ultraviolet transmittance at a wavelength of 300 nm, it does not take a long time to cure the ultraviolet curable resin when used as a substrate glass constituting an FPD.
- the ultraviolet transmittance of the glass substrate varies depending on the thickness of the substrate.
- the ultraviolet transmittance at a wavelength of 300 nm is more preferably 45% or more, further preferably 50% or more, and further preferably 70% or more.
- characteristics of the TFT element such as a Vth characteristic shift in the oxide semiconductor change when irradiated with ultraviolet light, and the characteristics of the constituent elements of the FPD may be impaired.
- the alkali-free glass substrate has an ultraviolet transmittance at a wavelength of 300 nm of 85% or less in terms of a plate thickness of 0.5 mm, there is no possibility that the constituent elements of the FPD in which heat resistance is a problem will be damaged when irradiated with ultraviolet rays.
- it is 80% or less, More preferably, it is 75% or less.
- the alkali-free glass of the present invention preferably has a compaction measured below of 80 ppm or less. Compaction is the glass heat shrinkage generated by relaxation of the glass structure during the heat treatment. When the alkali-free glass of the present invention has a compaction in the above range, an advantage of excellent dimensional stability during the manufacturing process of TFTs and the like can be obtained.
- Measurement method of compaction A glass plate sample (length 100 mm ⁇ width 10 mm ⁇ thickness 1 mm sample mirror-polished with cerium oxide) is held at a temperature of glass transition point + 100 ° C. for 10 minutes, and then cooled to room temperature at 40 ° C. per minute. Here, the total length (length direction) L1 of the sample is measured.
- the sample is heated at 100 ° C. per hour to 600 ° C., held at 600 ° C. for 80 minutes, cooled to room temperature at 100 ° C. per hour, and the total length L2 of the sample is measured again.
- a ratio of the difference between the total length difference before and after the heat treatment at 600 ° C. (L1 ⁇ L2) and the total length L1 of the sample before the heat treatment at 600 ° C. is (L1 ⁇ L2) / L1.
- the alkali-free glass of the present invention can have a compaction of 70 ppm or less, more preferably 60 ppm or less, and particularly preferably 50 ppm or less. For this reason, since the alkali-free glass of the present invention is suitable for the production of high-definition TFTs, it has further advantages.
- the alkali-free glass of the present invention has a strain point of 690 ° C. or higher, and preferably higher than 700 ° C., thereby effectively suppressing thermal shrinkage during panel manufacture.
- the strain point is more preferably 710 ° C. or higher, most preferably 720 ° C. or higher.
- the strain point is 720 ° C. or higher, it is used for a high strain point (for example, a display substrate or lighting substrate for organic EL having a plate thickness of 0.7 mm or less, preferably 0.5 mm or less, more preferably 0.3 mm or less. Or a thin display substrate or lighting substrate having a thickness of 0.3 mm or less, preferably 0.1 mm or less.
- the drawing speed at the time of forming tends to be high.
- the glass tends to be rapidly cooled, and the glass fictive temperature rises, so that the glass compaction tends to increase. Even in this case, compaction can be suppressed when the glass is a high strain point glass.
- the glass transition point of the alkali-free glass of the present invention is preferably 750 ° C. or higher, more preferably 760 ° C. or higher, further preferably 770 ° C. or higher, and most preferably 780 ° C. or higher.
- the average thermal expansion coefficient of the alkali-free glass of the present invention at 50 to 350 ° C. is 30 ⁇ 10 ⁇ 7 to 45 ⁇ 10 ⁇ 7 / ° C., and has high thermal shock resistance, and the productivity at the time of panel production is high. Can be high.
- the average thermal expansion coefficient at 50 to 350 ° C. is preferably 35 ⁇ 10 ⁇ 7 to 40 ⁇ 10 ⁇ 7 / ° C.
- the density of the alkali-free glass of the present invention is preferably 2.65 g / cm 3 or less, more preferably 2.64 g / cm 3 or less, and further preferably 2.62 g / cm 3 or less.
- the temperature T 2 at which the viscosity ⁇ becomes 10 2 poise (dPa ⁇ s) is preferably 1710 ° C. or less, preferably 1690 ° C. or less, more preferably 1670 ° C. or less, and further preferably 1660. Since it is below °C, melting is relatively easy.
- the alkali-free glass of the present invention preferably has a temperature T 4 at which the viscosity ⁇ is 10 4 poise, preferably 1350 ° C. or less, preferably 1330 ° C. or less, more preferably 1320 ° C. or less, and further preferably 1310 ° C. or less.
- T 4 at which the viscosity ⁇ is 10 4 poise
- the devitrification temperature is obtained by putting crushed glass particles in a platinum dish and performing heat treatment for 17 hours in an electric furnace controlled at a constant temperature. It is an average value of the maximum temperature at which crystals are deposited inside and the minimum temperature at which crystals are not deposited.
- the Young's modulus of the alkali-free glass of the present invention is preferably 82 GPa or more, more preferably 83 GPa or more, further 84 GPa or more, and further preferably 84.5 GPa or more.
- the larger Young's modulus is preferable, but 95 GPa or less is usually preferable. Young's modulus can be measured by an ultrasonic pulse method.
- the photoelastic constant of the alkali-free glass of the present invention is preferably 31 nm / MPa / cm or less. Due to the birefringence of the glass substrate due to stress generated during the manufacturing process of the liquid crystal display panel and the liquid crystal display device, a phenomenon in which the black display becomes gray and the contrast of the liquid crystal display decreases may be observed.
- the photoelastic constant By setting the photoelastic constant to 31 nm / MPa / cm or less, this phenomenon can be suppressed small. Preferably it is 30 nm / MPa / cm or less, More preferably, it is 29 nm / MPa / cm or less, More preferably, it is 28.5 nm / MPa / cm or less, Most preferably, it is 28 nm / MPa / cm or less.
- the alkali-free glass of the present invention preferably has a photoelastic constant of 23 nm / MPa / cm or more, more preferably 25 nm / MPa / cm or more, considering the ease of securing other physical properties.
- the photoelastic constant can be measured by a disk compression method at a measurement wavelength of 546 nm.
- the relative dielectric constant of the alkali-free glass of the present invention is preferably 5.6 or more.
- the sensing sensitivity of the touch sensor is improved, the driving voltage is reduced, From the viewpoint of electric power, it is better that the glass substrate has a higher relative dielectric constant.
- the relative dielectric constant is 5.8 or more, More preferably, it is 6.0 or more, More preferably, it is 6.1 or more, Most preferably, it is 6.2 or more.
- the relative dielectric constant can be measured by the method described in JIS C-2141.
- the ⁇ -OH value of the alkali-free glass of the present invention can be appropriately selected according to the required characteristics of the alkali-free glass.
- the ⁇ -OH value is low.
- beta-OH value is preferably 0.45 mm -1 or less, more preferably 0.4 mm -1 or less, more preferably 0.35 mm -1 or less.
- the ⁇ -OH value can be adjusted by various conditions at the time of melting the raw material, for example, the amount of water in the glass raw material, the water vapor concentration in the melting kiln, the residence time of the molten glass in the melting kiln, and the like.
- a method for adjusting the amount of water in the glass raw material a method using a hydroxide instead of an oxide as a glass raw material (for example, magnesium hydroxide (Mg (OH) 2 instead of magnesium oxide (MgO) as a magnesium source) )).
- Mg (OH) 2 magnesium hydroxide
- MgO magnesium oxide
- a method for adjusting the water vapor concentration in the melting furnace there are a method in which fossil fuel is mixed with oxygen gas and burned, and a method in which it is burned with oxygen gas and air at the time of combustion in a burner.
- Examples 1, 3, 7 to 18 are Examples, and Examples 2, 4 to 6 are Comparative Examples.
- the electrical resistivity in the temperature range of 1400 to 1600 ° C. of the molten glass and the refractory (zirconia electrocast refractory) having the compositions of Examples 3 to 6 was measured.
- the molten glass was prepared so that the raw materials of each component had the composition shown in the table, and melted at a temperature of 1600 ° C. using a platinum crucible. In melting, the glass was homogenized by stirring with a platinum stirrer.
- the electrical resistivity was measured by the method described in the following document in a state where the obtained molten glass was kept in a temperature range of 1400 to 1600 ° C.
- the electrical resistivity is measured in a state where the temperature is maintained in a temperature range of 1400 to 1600 ° C.
- “JIS C2141 Electric The measurement principle of the volume resistivity (Section 14) of “Insulating ceramic material test method” was developed at a high temperature (the sample was placed in an electric furnace and heated) and measured.
- FIG. 1 The measurement result of electrical resistivity is shown in FIG.
- Rb of refractory 1 had a higher electrical resistivity than Rg of the glasses having the compositions of Examples 3 to 6. If a melting kiln is comprised with such a refractory 1, it will be thought that it is suppressed that an electric current flows into the refractory which comprises a melting kiln from a heating electrode at the time of energization heating.
- the electrical resistivity Rb at 1400 to 1600 ° C. was in the relationship of Rb ⁇ Rg with respect to the electrical resistivity Rg of the molten glass.
- a melting kiln is configured with such a refractory 2, it is considered that a current flows from the heating electrode to the refractory constituting the melting kiln during energization heating.
- a mixture of raw materials of each component so as to have a target composition was put into a melting furnace composed of the refractory 1, and was melted at a temperature of 1500 to 1600 ° C.
- the median particle size D 50 is 26 ⁇ m
- the proportion of particles having a particle size of 2 ⁇ m or less is less than 0.1%
- the proportion of particles having a particle size of 100 ⁇ m or more is 0.00. It is 6%
- the mass ratio (in terms of MO) of the hydroxide raw material in the alkaline earth metal is 23 ⁇ 5%.
- heating by a burner flame and electric heating of the molten glass by a heating electrode arranged so as to be immersed in the molten glass in the melting furnace were used in combination.
- an alternating voltage was applied to the heating electrode at a local current density of 0.5 A / cm 2 , a potential difference between the electrodes of 300 V, and a frequency of 50 Hz.
- T 0 J / h
- Tables 1 to 4 show the glass composition (unit: mol%), the ⁇ -OH value of the glass (unit: mm ⁇ 1 ), the transmittance at a wavelength of 300 nm (unit:%), and the average at 50 to 350 ° C.
- the ⁇ -OH value and the compaction measurement method are as described below.
- Method for measuring ⁇ -OH value The transmittance of the glass sample is measured using an infrared spectrophotometer. The minimum value of transmittance (%) at a wave number of 3500 to 3700 cm ⁇ 1 is I a , the transmittance (%) at a wave number of 4000 cm ⁇ 1 is I b, and the thickness (mm) of the sample is d. -OH can be determined.
- ⁇ -OH (mm ⁇ 1 ) ⁇ (log (I a / I b )) / d [Measurement method of compaction]
- the thermal expansion coefficient is as low as 30 ⁇ 10 ⁇ 7 to 40 ⁇ 10 ⁇ 7 / ° C.
- the strain point is as high as 690 ° C. or higher
- the compaction is small. It can be seen that it can withstand
- the glass of an Example has a small value (parameter) represented by Formula (I), it has a high electrical resistivity at 1400 ° C. compared to the comparative example, and can more efficiently obtain Joule heating by energization. it can.
- the temperature T 2 that is a measure of meltability is relatively low at 1710 ° C. or less and is easy to dissolve
- the temperature T 4 that is a measure of moldability is 1350 ° C. or less, and molding by the float method is particularly easy.
- the devitrification temperature is 1350 ° C. or lower, and it is considered that there is no trouble such as the generation of devitrification particularly during float forming.
- a photoelastic constant is 31 nm / MPa / cm or less, and when used as a glass substrate of a liquid crystal display, a decrease in contrast can be suppressed. Further, the relative dielectric constant is 5.6 or more, and the sensing sensitivity of the touch sensor is improved when used as a glass substrate of an in-cell type touch panel.
- the alkali-free glass of the present invention has a high strain point and good foam quality, and is suitable for uses such as a display substrate, a photomask substrate, and a flexible OLED manufacturing substrate. Moreover, it is suitable also for uses, such as a substrate for solar cells and a glass substrate for magnetic disks. Note that the entire contents of the specification, claims, drawings, and abstract of Japanese Patent Application No. 2016-162676 filed on August 23, 2016 are cited herein as disclosure of the specification of the present invention. Incorporate.
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Abstract
Description
また、薄膜形成工程において、加熱によるガラス基板の熱収縮(コンパクション)が小さいことが求められる。
この際、FPDには、TFT素子等の耐熱性が問題となる構成要素が存在するため、通常、硬化性樹脂として光硬化性樹脂を使用し、紫外線照射により樹脂を硬化させる。このため、ディスプレイ用基板ガラスは紫外線透過性を有することが求められており、特許文献1および2では、波長300nmにおける紫外線透過率が厚み0.5mmで50~85%となる無アルカリガラス基板が提案されている。
SiO2 65~75、
Al2O3 9~15、
B2O3 0~3、
MgO 0~12、
CaO 0~8、
SrO 0~6、
BaO 0~5、
MgO+CaO+SrO+BaO が12~22であり、
4.84[Fe2O3]+5.65[Na2O]+4.03[K2O]+4.55[SnO2]が0.55以下であり、コンパクションが、80ppm以下である無アルカリガラスを提供する。
SiO2 65~70、
Al2O3 9~15、
B2O3 0~3、
MgO 5~12、
CaO 3~8、
SrO 1~6、
BaO 0~4、
Fe2O3 0.001~0.03、
Na2O 0.003~0.06、
K2O 0~0.02、
SnO2 0~0.12、
ZrO2 0~2、であり、かつ、
MgO+CaO+SrO+BaO が15~22であり、
MgO/(MgO+CaO+SrO+BaO)が0.33以上であり、MgO/(MgO+CaO)が0.40以上であり、MgO/(MgO+SrO)が0.45以上であり、4.84[Fe2O3]+5.65[Na2O]+4.03[K2O]+4.55[SnO2]が0.55以下であり、好ましくは、歪点が690℃以上であって、50~350℃での平均熱膨張係数が30×10-7~45×10-7/℃であって、ガラス粘度が102dPa・sとなる温度T2が1710℃以下であって、ガラス粘度が104dPa・sとなる温度T4が1350℃以下である無アルカリガラスを提供する。
SiO2含有量は65%(モル%、以下、特記しない限り同じである。)未満では、歪点が充分に上がらず、かつ、熱膨張係数が増大し、密度が上昇する。該含有量は65.5%以上が好ましく、66%以上がより好ましく、66.5%以上がさらに好ましい。該含有量が75%超では、ガラス製造時における溶融性が低下し、ガラス粘度が102dPa・sとなる温度T2や104dPa・sとなる温度T4が上昇し、失透温度が上昇する。該含有量は70%以下が好ましく、69%以下がより好ましく、68.5%以下がさらに好ましく、68%以下がさらに好ましい。
ガラス中のSn含有量はSnO2換算で、0.01%以上であることが好ましい。該含有量が0.01%以上であると、ガラスの紫外線透過率向上効果が好ましく発揮される。該含有量は、より好ましくは0.02%以上、さらに好ましくは0.03%以上である。該含有量が0.12%超だと、ガラスの着色や、失透が発生する恐れがあるため、ガラス中のSn含有量はSnO2換算で0.12%以下とする。該含有量は、好ましくは0.10%以下、より好ましくは0.07%以下、さらに好ましくは0.05%以下である。さらに実質的に含有しないことが好ましい。
なお、Sn含有量は、ガラス原料における投入量ではなく、冷却後のガラス中に存在する量である。
MgO/(MgO+CaO+SrO+BaO)が0.33以上、好ましくは0.36以上であり、より好ましくは0.40以上、特に好ましくは0.45以上である。
MgO/(MgO+CaO)が0.40以上であり、好ましくは0.50以上、さらに好ましくは0.55以上である。
MgO/(MgO+SrO)が0.45以上であり、好ましくは0.55以上、さらに好ましくは0.60以上である。
これらの3つをすべて満たすことがより好ましい。
本発明では、特にNa2Oの含有量に着目した。本発明のガラスは、Na2Oの含有量が好ましくは0.005~0.04%、より好ましくは0.008~0.03%、さらに好ましくは0.01~0.025%である。原料中から不可避的に混入するアルカリ金属酸化物の大半を占めるのはNa2Oである。
ガラス原料中のアルカリ金属酸化物を含有量が高くなると、アルカリ金属イオンが薄膜中に拡散して膜特性を劣化させるため、各種ディスプレイ用基板ガラスとしての使用時に問題となるが、ガラス組成中のアルカリ金属酸化物の含有量の総量(Li2O+Na2O+K2O)を0.06%以下、好ましくは0.04%以下、より好ましくは0.03%以下、さらに好ましくは0.02%以下であれば、このような問題を生じることがない。
4.84[Fe2O3]+5.65[Na2O]+4.03[K2O]+4.55[SnO2]・・・・(I)
式(I)中、角括弧で囲まれた成分の数値表示は、無アルカリガラス中のそれぞれ当該成分の含有量(モル%)を表す(本明細書の他の部分の記載において同じ)。
かかる式(I)で表される値(式(1)のパラメータともいう)は無アルカリガラスの1400℃における電気抵抗率の指標であり、この値が0.55以下であると通電加熱時の電気抵抗率が高くなり、ジュール熱を得やすくすることができる。本発明の無アルカリガラスにおいて、式(I)で表される値は0.40以下がより好ましく、0.30以下がさらに好ましく、0.20以下が特に好ましい。
式(I)で表される値の下限は特に規定されないが、式(I)で表される値は、通常、0.04以上であり、特には0.08以上である。
また、ガラスの溶融性、清澄性、成形性を改善するため、ガラス原料にはZnO、SO3、F、Clを総量で5%以下添加できる。
(珪素源)
SiO2の珪素源としては珪砂を用いることができるが、メディアン粒径D50が20μm~27μm、粒径2μm以下の粒子の割合が0.3体積%以下、かつ粒径100μm以上の粒子の割合が2.5体積%以下の珪砂を用いることが、珪砂の凝集を抑えて溶解させることができるので、珪砂の溶解が容易になり、泡が少なく、均質性、平坦度が高い無アルカリガラスが得られることから好ましい。
なお、本明細書における「粒径」とは珪砂の球相当径(本発明では一次粒径の意)であって、具体的にはレーザー回折/散乱法によって計測された粉体の粒度分布における粒径をいう。
また、本明細書における「粒径2μm以下の粒子の割合」及び「粒径100μm以上の粒子の割合」は、例えば、レーザー回折/散乱法によって粒度分布を計測することにより測定される。
珪砂のメディアン粒径D50が25μm以下であれば、珪砂の溶解がより容易になるので、より好ましい。また、珪砂における粒径100μm以上の粒子の割合は、0%であることが珪砂の溶解がより容易になるので特に好ましい。
アルカリ土類金属源としては、アルカリ土類金属化合物を用いることができる。その具体例としては、MgCO3、CaCO3、BaCO3、SrCO3、(Mg,Ca)CO3(ドロマイト)等の炭酸塩や、MgO、CaO、BaO、SrO等の酸化物や、Mg(OH)2、Ca(OH)2、Ba(OH)2、Sr(OH)2等の水酸化物を例示できる。
なお、アルカリ土類金属源の一部または全部にアルカリ土類金属の水酸化物を含有させることが、ガラス原料の溶解時のSiO2成分の未溶解量が低下するので好ましい。珪砂中に含まれるSiO2成分の未溶解量が増大すると、この未溶解のSiO2が、溶融ガラス中に泡が発生した際にこの泡に取り込まれて溶融ガラスの表層近くに集まる。これにより、溶融ガラスの表層と表層以外の部分との間においてSiO2の組成比に差が生じて、ガラスの均質性が低下するとともに平坦性も低下する。
アルカリ土類金属源中の水酸化物のモル比が増加するにつれて、ガラス原料の溶解時のSiO2成分の未溶解量が低下するので、上記水酸化物のモル比は高ければ高いほどよい。
なお、パネル製造時にガラス表面に設ける金属ないし酸化物薄膜の特性劣化を生じさせないために、ガラス原料はP2O5を実質的に含有しないことが好ましい。Ca原料には不純物としてリンが含まれることが多いので、ガラスがCaOを含有する場合には、高純度の原料を用いることが好ましい。
無アルカリガラスがB2O3を含有する場合、ホウ素源としては、ホウ素化合物を用いることができる。ここでホウ素化合物の具体例としては、オルトホウ酸(H3BO3)、メタホウ酸(HBO2)、四ホウ酸(H2B2O4O7)、無水ホウ酸(B2O3)等が挙げられる。通常の無アルカリガラスの製造においては、安価で、入手しやすい点から、オルトホウ酸が用いられる。
ホウ素源としては、無水ホウ酸を、ホウ素源100質量%(B2O3換算)のうち、10~100質量%(B2O3換算)含有するものを用いることが好ましい。無水ホウ酸を10質量%以上とすることにより、ガラス原料の凝集が抑えられ、泡の低減効果、均質性、平坦度の向上効果が得られる。無水ホウ酸は、20~100質量%がより好ましく、40~100質量%がさらに好ましい。無水ホウ酸以外のホウ素化合物としては、安価で、入手しやすい点から、オルトホウ酸が好ましい。
本発明のガラスは、上記組成となるように調合したガラス原料を溶解窯に連続的に投入し、1350~1750℃に加熱して溶解する方法で製造することができる。
また、溶解窯での加熱には、バーナーの燃焼炎による加熱と、溶解窯内の溶融ガラスの通電加熱と、を併用することが好ましい。
局所電流密度:0.1~2.0A/cm2
電極間の電位差:20~500V
交流電圧の周波数:10~90Hz
なかでも、局所電流密度は、0.2~1.7A/cm2がより好ましく、0.3~1.0A/cm2がさらに好ましい。電極間の電位差は、30~480Vがより好ましく、40~450Vがさらに好ましい。交流電圧の周波数は、30~80Hzがより好ましく、50~60Hzがさらに好ましい。
これらの満たす材料としては、ロジウム、イリジウム、オスミウム、ハフニウム、モリブデン、タングステン、白金、および、これらの合金が例示される。
0.10×T0≦T≦0.40×T0 ・・・(II)
Tが0.10×T0より小さいと、溶融ガラスの通電加熱の併用による効果、すなわち、溶解窯を構成する耐火物の浸食を抑制する効果が不十分となるおそれがある。
Tが0.40×T0より大きいと、溶融窯底部の温度が上昇し、耐火物の浸食が進行する恐れがある。
溶解窯を構成する耐火物としては、溶融ガラスに対する耐食性に優れることから、ZrO2を90質量%以上含有するジルコニア系耐火物が好ましく用いられてきた。
しかしながら、上記のジルコニア系耐火物には、マトリックスガラスの粘性を低減する成分としてアルカリ成分(Na2OやK2O)を合量で0.12質量%以上含有するため、1400~1700℃の高温に加熱した際には、該アルカリ成分の存在によりイオン導電性を示す。このため、通電加熱時に、溶解窯に設けた加熱電極から、溶融ガラスだけではなく、溶解窯を構成する耐火物にも電流が流れるおそれがある。
後述する実施例に示すように、溶融ガラスおよび耐火物の電気抵抗率は、温度の上昇に応じて低くなるが、温度上昇に対する電気抵抗率の低下は、耐火物よりも溶融ガラスのほうが大きい。このため、1400℃における電気抵抗率がRb>Rgの関係であれば、それよりも高い温度、すなわち、1400~1700℃の温度域では、常に耐火物のほうが溶融ガラスよりも電気抵抗率が大きくなる。
そして、Rb>Rgとなるように、ガラス原料、および、溶解窯を構成する耐火物を選択すれば、通電加熱時に、加熱電極から溶解窯を構成する耐火物に電流が流れるのが抑制される。
なお、無アルカリガラスは、アルカリ金属酸化物、Fe2O3、および必要に応じてSnO2を添加することでRgを低下させることができる。
また、製造される無アルカリガラスの粘度ηが102ポイズ(dPa・s)となる温度T2を変えることによっても、Rgを調節することができる。T2が低いほどRgは低くなる。
なお、板ガラスへの成形法は、フロート法、フュージョン法、ロールアウト法、スロットダウンドロー法が好ましく、特に生産性や板ガラスの大型化を考慮するとフロート法が好ましい。
FPDの製造時、該FPDを構成する2枚の基板ガラスの貼り合わせに用いられる紫外線硬化樹脂に使用される紫外線は、主として波長300nm付近の波長の紫外線である。2枚の基板ガラスが、波長300nmにおける紫外線透過率が低いと、紫外線硬化樹脂によって2枚の基板ガラスを貼り合わせるのに長時間を要する。すなわち紫外線硬化樹脂に対して紫外線を照射しても、基板ガラスに吸収されやすいため、樹脂を硬化させるのに時間がかかる。
本発明の無アルカリガラス基板は、波長300nmにおける紫外線透過率が高いので、FPDを構成する基板ガラスとして使用した場合に、紫外線硬化樹脂の硬化に長時間を要することがない。
波長300nmにおける紫外線透過率は、より好ましくは45%以上、さらに好ましくは50%以上、さらに好ましくは70%以上である。ただし、紫外線透過率が高くなりすぎると、紫外線を照射した際に、酸化物半導体でのVth特性シフトなど、TFT素子の特性が変化し、FPDの構成要素の特性が損なわれるおそれがある。
無アルカリガラス基板は、波長300nmにおける紫外線透過率が、板厚0.5mm換算で85%以下であると、耐熱性が問題となるFPDの構成要素が、紫外線照射時に破損するおそれがない。好ましくは80%以下、より好ましくは75%以下である。
[コンパクションの測定方法]
ガラス板試料(酸化セリウムで鏡面研磨した長さ100mm×幅10mm×厚さ1mmの試料)をガラス転移点+100℃の温度で10分間保持した後、毎分40℃で室温まで冷却する。ここで、試料の全長(長さ方向)L1を計測する。次いで、毎時100℃で600℃まで加熱し、600℃で80分間保持し、毎時100℃で室温まで冷却し、再度、試料の全長L2を計測する。600℃での熱処理前後での全長の差(L1-L2)と、600℃での熱処理前の試料全長L1と、の比:(L1-L2)/L1をコンパクションとする。
試料の全長を高精度で測定することが困難な場合は、試料表面の2箇所に圧痕を形成し、その間隔を測定する方法により、コンパクションをより正確に求められる。
その場合、試料の表面に点状の圧痕を長辺方向に2箇所、間隔A(A=95mm)で打ち、毎時100℃で600℃まで加熱し、600℃で80分間保持し、毎時100℃で室温まで冷却した後、圧痕の間隔Bを測定することが好ましい。コンパクションは(A-B)/Aから求められる。
歪点は、さらに好ましくは710℃以上、最も好ましくは720℃以上である。歪点が720℃以上であると、高歪点用途(例えば、板厚0.7mm以下、好ましくは0.5mm以下、より好ましくは0.3mm以下の有機EL用のディスプレイ用基板または照明用基板、あるいは板厚0.3mm以下、好ましくは0.1mm以下の薄板のディスプレイ用基板または照明用基板)に適している。板厚0.7mm以下、さらには0.5mm以下、さらには0.3mm以下、さらには0.1mm以下の板ガラスの成形では、成形時の引き出し速度が速くなる傾向がある。成形時の引き出し速度が大きくなると、ガラスが急冷される傾向がありガラスの仮想温度が上昇することで、ガラスのコンパクションが増大しやすい。この場合でも、高歪点ガラスであると、コンパクションを抑制できる。
また、本発明の無アルカリガラスの50~350℃での平均熱膨張係数は、30×10-7~45×10-7/℃であり、耐熱衝撃性が大きく、パネル製造時の生産性を高くできる。50~350℃での平均熱膨張係数は、35×10-7~40×10-7/℃が好ましい。
また、本発明の無アルカリガラスは、粘度ηが102ポイズ(dPa・s)となる温度T2が1710℃以下が好ましく、好ましくは1690℃以下、より好ましくは1670℃以下、さらに好ましくは1660℃以下になっているため、溶融が比較的容易である。
本明細書における失透温度は、白金製の皿に粉砕されたガラス粒子を入れ、一定温度に制御された電気炉中で17時間熱処理を行い、熱処理後の光学顕微鏡観察によって、ガラスの表面及び内部に結晶が析出する最高温度と結晶が析出しない最低温度との平均値である。
本発明の無アルカリガラスの光弾性定数は、31nm/MPa/cm以下が好ましい。
液晶ディスプレイパネル製造工程や液晶ディスプレイ装置使用時に発生した応力によってガラス基板が複屈折性を有することにより、黒の表示がグレーになり、液晶ディスプレイのコントラストが低下する現象が認められることがある。
光弾性定数を31nm/MPa/cm以下とすることにより、この現象を小さく抑えることができる。好ましくは30nm/MPa/cm以下、より好ましくは29nm/MPa/cm以下、さらに好ましくは28.5nm/MPa/cm以下、特に好ましくは28nm/MPa/cm以下である。
本発明の無アルカリガラスは、他の物性確保の容易性を考慮すると、光弾性定数が23nm/MPa/cm以上、さらには25nm/MPa/cm以上が好ましい。
なお、光弾性定数は円板圧縮法により測定波長546nmにて測定できる。
日本特開2011-70092号公報に記載されているような、インセル型のタッチパネル(液晶ディスプレイパネル内にタッチセンサを内蔵したもの)の場合、タッチセンサのセンシング感度の向上、駆動電圧の低下、省電力化の観点から、ガラス基板の比誘電率が高いほうがよい。比誘電率を5.6以上とすることにより、タッチセンサのセンシング感度が向上する。好ましくは5.8以上、より好ましくは6.0以上、さらに好ましくは6.1以上、特に好ましくは6.2以上である。
なお、比誘電率はJIS C-2141に記載の方法で測定できる。
β-OH値は、原料溶融時の各種条件、たとえば、ガラス原料中の水分量、溶解窯中の水蒸気濃度、溶解窯における溶融ガラスの滞在時間等によって調節することができる。ガラス原料中の水分量を調節する方法としては、ガラス原料として酸化物の代わりに水酸化物を用いる方法(例えば、マグネシウム源として酸化マグネシウム(MgO)の代わりに水酸化マグネシウム(Mg(OH)2)を用いる)がある。また、溶解窯中の水蒸気濃度を調節する方法としては、バーナーでの燃焼時に、化石燃料を酸素ガスと混合して燃焼させる方法、酸素ガスおよび空気と混合して燃焼させる方法がある。
例3~例6の組成の溶融ガラスと耐火物(ジルコニア系電鋳耐火物)の1400~1600℃の温度域における電気抵抗率を測定した。
溶融ガラスは、各成分の原料を表に示す組成になるように調合し、白金坩堝を用いて1600℃の温度で溶解した。溶解にあたっては、白金スターラを用いて撹拌しガラスの均質化を行った。得られた溶融ガラスを1400~1600℃の温度域に保持した状態で電気抵抗率を、下記文献に記載の方法で測定した。
「イオン性融体の導電率測定法、大田能生、宮永光、森永健次、柳ヶ瀬勉、日本金属学会誌第45巻第10号(1981)1036~1043」
化学組成(質量%):
ZrO2:88、SiO2:9.3、Al2O3:1.5、P2O3:0.1、B2O3:0.8、Fe2O3:0.05、TiO2:0.15、Na2O:0.02、K2O:0.04
鉱物組成(質量%)
バテライト:88、ガラス相:12
化学組成(質量%)
ZrO2:94.5、SiO2:4.0、Al2O3:0.8、P2O5:0.10、B2O3:0.8、Fe2O3:0.05、TiO2:0.15、Na2O:0.4、K2O:0.01
鉱物組成(質量%)
バテライト:88、ガラス相:12
一方、耐火物2では1400~1600℃における電気抵抗率Rbが、溶融ガラスの電気抵抗率Rgに対して、Rb<Rgの関係となっていた。このような耐火物2で溶解窯を構成した場合、通電加熱時に、加熱電極から溶解窯を構成する耐火物に電流が流れると考えられる。
なお、バーナーの燃焼炎による加熱量と、溶解窯内の溶融ガラスの通電加熱による加熱量の合計をT0(J/h)とするとき、通電加熱による加熱量T(J/h)は、T=0.30×T0の関係を満たしていた。
次いで溶融ガラスを流し出し、板状に成形後徐冷した。
なお、表1~表4中、括弧書で示した値は計算値である。
[β-OH値の測定方法]
ガラス試料について、赤外分光光度計を用いて透過率を測定する。波数3500~3700cm-1における透過率(%)の極小値をIaとし、波数4000cm-1における透過率(%)をIbとし、試料の厚み(mm)をdとして、以下の式よりβ-OHを求めることができる。
β-OH(mm-1)=-(log(Ia/Ib))/d
[コンパクションの測定方法]
ガラス板試料(酸化セリウムで鏡面研磨した長さ100mm×幅10mm×厚さ1mmの試料)をガラス転移点+100℃の温度で10分間保持した後、毎分40℃で室温まで冷却した。試料の表面に点状の圧痕を長辺方向に2箇所、間隔A(A=95mm)で打った。次いで、毎時100℃で600℃まで加熱し、600℃で80分間保持し、毎時100℃で室温まで冷却し圧痕の間隔Bを測定した。なお、A、Bは光学顕微鏡を用いて測定した。コンパクションは(A-B)/Aから求められる。
また、比誘電率が5.6以上であり、インセル型のタッチパネルのガラス基板として使用した場合にタッチセンサのセンシング感度が向上する。
なお、2016年8月23日に出願された日本特許出願2016-162676号の明細書、特許請求の範囲、図面、及び要約書の全内容をここに引用し、本発明の明細書の開示として、取り入れるものである。
Claims (14)
- 酸化物基準のモル%表示で
SiO2 65~75、
Al2O3 9~15、
B2O3 0~3、
MgO 0~12、
CaO 0~8、
SrO 0~6、
BaO 0~5、であり、かつ
MgO+CaO+SrO+BaO が12~22であり、
4.84[Fe2O3]+5.65[Na2O]+4.03[K2O]+4.55[SnO2]が0.55以下であり、コンパクションが80ppm以下であることを特徴とする無アルカリガラス。 - 酸化物基準のモル%表示で
SiO2 65~70、
Al2O3 9~15、
B2O3 0~3、
MgO 5~12、
CaO 3~8、
SrO 1~6、
BaO 0~4、
Fe2O3 0.001~0.03、
Na2O 0.003~0.06、
K2O 0~0.02、
SnO2 0~0.12、
ZrO2 0~2、であり、かつ、
MgO+CaO+SrO+BaO が15~22であり、
MgO/(MgO+CaO+SrO+BaO)が0.33以上であり、MgO/(MgO+CaO)が0.40以上であり、MgO/(MgO+SrO)が0.45以上であり、4.84[Fe2O3]+5.65[Na2O]+4.03[K2O]+4.55[SnO2]が0.55以下である、請求項1に記載の無アルカリガラス。 - 歪点が690℃以上であり、50~350℃での平均熱膨張係数が30×10-7~45×10-7/℃であり、ガラス粘度が102dPa・sとなる温度T2が1710℃以下であり、ガラス粘度が104dPa・sとなる温度T4が1350℃以下である、請求項1又は2に記載の無アルカリガラス。
- コンパクションが50ppm以下である、請求項1~3のいずれか一項に記載の無アルカリガラス。
- 波長300nmにおける板厚0.5mm換算の紫外線透過率が40%以上である、請求項1~4のいずれか一項に記載の無アルカリガラス。
- 歪点が725℃以上である、請求項1~5のいずれか一項に記載の無アルカリガラス。
- 光弾性定数が31nm/MPa/cm以下である、請求項1~6のいずれか一項に記載の無アルカリガラス。
- β-OH値が0.45mm-1以下である、請求項1~7のいずれか一項に記載の無アルカリガラス。
- ガラス転移点が750℃以上である、請求項1~8のいずれか一項に記載の無アルカリガラス。
- 比誘電率が5.6以上である、請求項1~9のいずれか一項に記載の無アルカリガラス。
- ヤング率が82GPa以上である、請求項1~10のいずれか一項に記載の無アルカリガラス。
- ディスプレイ用基板ガラスである、請求項1~11のいずれか一項に記載の無アルカリガラス。
- 前記ディスプレイ用基板ガラスが、表面に金属ないし酸化物薄膜等を有する、請求項1~12のいずれか一項に記載の無アルカリガラス。
- 前記ディスプレイ用基板ガラスが、液晶表示装置用、有機EL装置、又は照明装置用である、請求項12又は13に記載の無アルカリガラス。
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Also Published As
Publication number | Publication date |
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CN109641782A (zh) | 2019-04-16 |
JP6943252B2 (ja) | 2021-09-29 |
CN109641782B (zh) | 2022-10-28 |
CN115557695A (zh) | 2023-01-03 |
JPWO2018038059A1 (ja) | 2019-06-20 |
KR102403524B1 (ko) | 2022-05-31 |
TWI756254B (zh) | 2022-03-01 |
TW201819326A (zh) | 2018-06-01 |
US11053160B2 (en) | 2021-07-06 |
US20190185368A1 (en) | 2019-06-20 |
KR20190044060A (ko) | 2019-04-29 |
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