WO2017179439A1 - Bande adhésive pour le traitement de semi-conducteurs et procédé de fabrication de puce semi-conductrice ou d'élément semi-conducteur l'utilisant - Google Patents

Bande adhésive pour le traitement de semi-conducteurs et procédé de fabrication de puce semi-conductrice ou d'élément semi-conducteur l'utilisant Download PDF

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WO2017179439A1
WO2017179439A1 PCT/JP2017/013424 JP2017013424W WO2017179439A1 WO 2017179439 A1 WO2017179439 A1 WO 2017179439A1 JP 2017013424 W JP2017013424 W JP 2017013424W WO 2017179439 A1 WO2017179439 A1 WO 2017179439A1
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Prior art keywords
mass
semiconductor
adhesive tape
parts
semiconductor processing
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PCT/JP2017/013424
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English (en)
Japanese (ja)
Inventor
雄紀 柴山
齊藤　岳史
智章 田中
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デンカ株式会社
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Priority to JP2018511962A priority Critical patent/JP6829250B2/ja
Publication of WO2017179439A1 publication Critical patent/WO2017179439A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Definitions

  • the present invention relates to an adhesive tape for semiconductor processing, and a method for manufacturing a semiconductor chip or a semiconductor component using the same.
  • the adhesive tape for semiconductor processing may be transported by the rotation of two transport rolls. At that time, if the adhesive force of the adhesive layer is too large, the adhesive tape adheres to the roll and the roll is wound (Hereinafter referred to as “mounter”), sometimes it could not be smoothly transported.
  • the transported adhesive tape is bonded to a semiconductor wafer or substrate on which a circuit is formed, cut into element pieces (dicing), stretching of the adhesive tape (expanding), and peeling of the element pieces from the adhesive tape (pickup). Moved to the process. It is desirable that the adhesive tape used in these processes has a sufficient adhesive force to the element pieces (chips) to be cut during dicing, and the adhesive force is reduced to such an extent that no adhesive remains when picking up. It is.
  • a pressure-sensitive adhesive layer that undergoes a polymerization curing reaction by ultraviolet rays or the like is applied to a base film that is transmissive to both active rays of either ultraviolet rays and electron beams or ultraviolet rays and electron beams.
  • This pressure-sensitive adhesive tape is used in a step of picking up a cut chip after irradiating the pressure-sensitive adhesive layer with ultraviolet rays or the like after the dicing step, polymerizing and curing the pressure-sensitive adhesive layer to reduce the adhesive strength.
  • the present invention uses a pressure-sensitive adhesive tape for semiconductor processing that suppresses excessive wrapping around a transport roll due to close contact even when transported by rotation of a plurality of transport rolls, and can be easily peeled off in a pickup process, and the same
  • the object is to provide a method of manufacturing a semiconductor chip or a semiconductor component.
  • a semiconductor processing adhesive tape having an adhesive layer on a vinyl chloride film,
  • the Young's modulus of the vinyl chloride film is 200 to 500 MPa
  • the pressure-sensitive adhesive layer contains a (meth) acrylic acid ester polymer having no hydroxyl group and no carboxyl group, 20 parts by mass to 150 parts by mass of a photopolymerizable compound, 0.1 part by mass to 10 parts by mass of a curing agent, and 0.1 part by mass of a photopolymerization initiator with respect to 100 parts by mass of the (meth) acrylic acid ester polymer.
  • the photopolymerizable compound is a urethane acrylate having an isophorone diisocyanate skeleton or a tolylene diisocyanate skeleton, a weight average molecular weight of 1,000 to 10,000, and a carbon-carbon double bond number of 6 to 15.
  • Adhesive tape for semiconductor processing (2) The adhesive tape for semiconductor processing according to (1), wherein the curing agent has an isocyanate group or an epoxy group.
  • the above-described pressure-sensitive adhesive tape for semiconductor processing according to the present invention suppresses excessive winding around the transport roll due to close contact even when transported by the rotation of a plurality of transport rolls, and can be easily peeled off in the pick-up process.
  • the semiconductor chip or semiconductor component manufacturing method using the semiconductor processing adhesive tape can easily pick up the semiconductor chip or semiconductor component.
  • (meth) acrylic acid means both acrylic acid and methacrylic acid
  • (meth) acrylate means both acrylate and methacrylate.
  • semiconductor chip refers to a chip obtained by dividing a silicon wafer or the like
  • semiconductor component refers to a chip obtained by packaging a chip.
  • the adhesive tape for semiconductor processing has an adhesive layer on a vinyl chloride film.
  • each member of the adhesive tape for semiconductor processing will be described.
  • a vinyl chloride resin polyvinyl chloride
  • a plasticizer a stabilizer, and the like
  • the vinyl chloride resin include: vinyl chloride homopolymer; copolymer of vinyl chloride and monomers such as ethylene, propylene, acrylonitrile, vinylidene chloride, vinyl acetate; polyvinyl chloride, MBS, ABS, nitrile rubber Chlorinated polyethylene, ethylene vinyl alcohol-vinyl chloride graft copolymer, and modified polyvinyl chloride resin to which various plasticizers are added.
  • plasticizer examples include phthalate ester plasticizers such as dioctyl phthalate, epoxy plasticizers such as epoxidized soybean oil, and polyester plasticizers such as polyethylene glycol diester phthalate.
  • the Young's modulus of the vinyl chloride film can be adjusted by adding the plasticizer.
  • the Young's modulus of the vinyl chloride film is 200 MPa to 500 MPa, preferably 250 MPa to 400 MPa.
  • the amount of the plasticizer added to satisfy the Young's modulus in this range can be, for example, 23 to 30 parts by mass with respect to 100 parts by mass of the vinyl chloride resin.
  • the Young's modulus is a value measured according to a tensile test method of JIS K 7113 (plastic film and sheet tensile test method).
  • the stabilizer is not particularly limited.
  • an epoxy stabilizer for example, an epoxy stabilizer, a barium stabilizer, a calcium stabilizer, a tin stabilizer, a zinc stabilizer, a calcium-zinc (Ca-Zn), or barium-zinc.
  • Examples include composite stabilizers such as those based on Ba-Zn, metal soaps such as fatty acid calcium, fatty acid zinc and fatty acid barium, hydrotalcite, ⁇ -diketone compounds, and copolymers of glycidyl methacrylate and methyl methacrylate. It is done. These stabilizers may be used alone or in combination of two or more.
  • the content of the stabilizer is not particularly limited, and can be 1 to 15 parts by mass with respect to 100 parts by mass of the vinyl chloride resin.
  • the method for forming a vinyl chloride resin film is not particularly limited, and a calendar film forming method and a T-die processing method can be used.
  • the thickness of the vinyl chloride film is preferably 30 ⁇ m to 200 ⁇ m, more preferably 50 to 150 ⁇ m.
  • the antistatic treatment may be applied to the vinyl chloride film.
  • the antistatic treatment include a treatment of adding an antistatic agent to the vinyl chloride film, a treatment of applying the antistatic agent to the surface of the vinyl chloride film, and a treatment by corona discharge.
  • a quaternary amine salt monomer or the like can be used as the antistatic agent.
  • the quaternary amine salt monomer include dimethylaminoethyl (meth) acrylate quaternary chloride, diethylaminoethyl (meth) acrylate quaternary chloride, methylethylaminoethyl (meth) acrylate quaternary chloride, p-dimethyl.
  • examples include aminostyrene quaternary chloride and p-diethylaminostyrene quaternary chloride. Of these, dimethylaminoethyl methacrylate quaternary chloride is preferred.
  • a slipping agent can be applied to the adhesive non-contact surface of the vinyl chloride film, or a slipping agent can be kneaded into the vinyl chloride film.
  • the slip agent is not particularly limited as long as it is a substance that reduces the friction coefficient of the adhesive tape and the expanding device.
  • silicone compounds such as silicone resin and (modified) silicone oil, fluororesin, hexagonal boron nitride, carbon black, and And molybdenum disulfide. These friction reducing agents may mix a plurality of components. Since manufacture of an electronic component is performed in a clean room, it is preferable to use a silicone compound or a fluororesin.
  • a copolymer having a silicone macromonomer unit is particularly preferably used because it has good compatibility with an antistatic agent and can achieve a balance between antistatic properties and expandability.
  • the method of using the slipping agent and the antistatic agent is not particularly limited.
  • a pressure-sensitive adhesive may be applied to one side of a vinyl chloride film, and either or both of the slipping agent and the antistatic agent may be applied to the back side.
  • / or antistatic agent may be kneaded into a vinyl chloride film resin to form a sheet.
  • the vinyl chloride film can have an adhesive layer on one side and an embossed surface with an average surface roughness (Ra) of 0.3 ⁇ m to 1.5 ⁇ m on the other side.
  • Ra average surface roughness
  • the pressure-sensitive adhesive layer is a layer formed using a pressure-sensitive adhesive and contains a (meth) acrylic acid ester polymer having no hydroxyl group and carboxyl group, a photopolymerizable compound, a curing agent, and a photopolymerization initiator. That is, the pressure-sensitive adhesive layer can be formed using an adhesive containing a (meth) acrylic acid ester polymer having no hydroxyl group and carboxyl group, a photopolymerizable compound, a curing agent, and a photopolymerization initiator.
  • each member of the pressure-sensitive adhesive layer will be described.
  • ((Meth) acrylic acid ester copolymer) The (meth) acrylic acid ester copolymer does not have a hydroxyl group and a carboxyl group.
  • (meth) acrylic acid ester copolymer having no hydroxyl group and carboxyl group” is also simply referred to as “(meth) acrylic acid ester copolymer”.
  • a (meth) acrylic acid ester copolymer that does not have a hydroxyl group and a carboxyl group a copolymer of an acrylic acid ester that does not contain a hydroxyl group and a carboxyl group, such as methyl (meth) acrylate, or a copolymer with these monomers
  • a copolymer obtained by copolymerizing possible unsaturated monomers for example, vinyl acetate, styrene, acrylonitrile. Since it does not contain a carboxyl group and a hydroxyl group, it can be easily peeled off when picking up even when using an automated processing apparatus that may not be easily peeled off by a conventional adhesive tape in the pick-up process.
  • ester monomer of a (meth) acrylic polymer not containing a hydroxyl group and a carboxyl group examples include n-butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, and pentyl (meth).
  • the photopolymerizable compound is a urethane acrylate having an isophorone diisocyanate skeleton or a tolylene diisocyanate skeleton.
  • a urethane acrylate oligomer is used as the urethane acrylate.
  • the urethane acrylate oligomer is obtained by reacting a hydroxyl group-containing (meth) acrylate with a terminal isocyanate urethane prepolymer obtained by reacting a polyol compound such as polyester type or polyether type with a polyvalent isocyanate compound.
  • polyester diol, polyether diol, polycaprolactone diol, polycarbonate diol, and the like can be used as the polyol compound when synthesizing the terminal isocyanate urethane prepolymer.
  • a urethane acrylate having an isophorone diisocyanate skeleton or a tolylene diisocyanate skeleton for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, isophorone diisocyanate, and their trimers , And adducts with trimethylolpropane can be used.
  • the (meth) acrylate having a hydroxyl group for example, pentaerythritol triacrylate, glycidol di (meth) acrylate, dipentaerythritol pentaacrylate and the like can be used.
  • the blending amount of the photopolymerizable compound is 20 parts by mass to 150 parts by mass, and more preferably 60 parts by mass to 110 parts by mass with respect to 100 parts by mass of the (meth) acrylic acid ester copolymer.
  • the blending amount of the photopolymerizable compound is less than 20 parts by mass, the peelability of the pressure-sensitive adhesive tape after the light irradiation is lowered, and the pickup failure of the semiconductor chip is likely to occur.
  • the blending amount of the photopolymerizable compound is more than 150 parts by mass, the elastic modulus of the pressure-sensitive adhesive is excessively increased by the light irradiation process, and chips are scattered in the pickup process, which causes a decrease in productivity. .
  • the photopolymerizable compound has a weight average molecular weight (Mw) of 1,000 to 10,000, and more preferably 3,000 to 8,000.
  • Mw weight average molecular weight
  • the weight average molecular weight (Mw) can be determined by a gel permeation chromatograph (GPC) method.
  • the number of carbon-carbon double bonds of the photopolymerizable compound is 6 to 15, and 9 to 15 is more preferable. If the number of carbon-carbon double bonds is less than 6, the adhesive strength is not sufficiently lowered and pickup failure occurs. In order to obtain a structure having 6 to 15 carbon-carbon double bonds, it can be adjusted by a combination of a polyisocyanate compound of a terminal isocyanate urethane prepolymer and a (meth) acrylate having a hydroxyl group.
  • the polyvalent isocyanate compound has two isocyanate groups such as 2,4-tolylene diisocyanate and 2,6-tolylene diisocyanate, pentaerythritol triacrylate which is a (meth) acrylate having three or more hydroxyl groups Or dipentaerythritol pentaacrylate.
  • pentaerythritol triacrylate which is a (meth) acrylate having three or more hydroxyl groups Or dipentaerythritol pentaacrylate.
  • the glycidol di (meth) acrylate which is (meth) acrylate which has two hydroxyl groups can also be used. Those having more than 15 carbon-carbon double bonds are difficult to obtain and expensive. The number of carbon-carbon double bonds can be measured by a titration method.
  • curing agent it is preferable to have an isocyanate group or an epoxy group, and a polyfunctional isocyanate hardening
  • the polyfunctional isocyanate curing agent include aromatic polyisocyanate curing agent, aliphatic polyisocyanate curing agent, and alicyclic polyisocyanate curing agent, and those trimers or adducts with trimethylolpropane may be used. it can.
  • the aromatic polyisocyanate curing agent is not particularly limited.
  • the aliphatic polyisocyanate curing agent is not particularly limited.
  • the alicyclic polyisocyanate curing agent is not particularly limited.
  • the adduct of trimer or trimethylolpropane is not particularly limited, and an adduct of 2,4-tolylene diisocyanate and trimethylolpropane is preferably used.
  • the polyfunctional epoxy curing agent mainly means a compound having two or more epoxy groups and one or more tertiary nitrogen atoms.
  • N N-glycidylaniline, N, N-glycidyltoluidine, mN, N-glycidylamino Phenyl glycidyl ether, pN, N-glycidylaminophenyl glycidyl ether, triglycidyl isocyanurate, N, N, N ′, N′-tetraglycidyl diaminodiphenylmethane, N, N, N ′, N′-tetraglycidyl-m -Xylylenediamine, N, N, N ′, N ′, N ′′ -pentaglycidyldiethylenetriamine and the like.
  • the compounding amount of the curing agent is 0.1 to 10 parts by mass, preferably 1 to 9 parts by mass with respect to 100 parts by mass of the (meth) acrylic acid ester copolymer.
  • the blending amount of the curing agent is less than 0.1 parts by mass, problems are likely to occur in chipping (chip chipping) and mounter suitability (degree of winding around the transport roll).
  • the blending amount of the curing agent is more than 10 parts by mass, the chip will be scattered due to insufficient adhesive force, which causes a decrease in productivity.
  • the photopolymerization initiator is not particularly limited, and benzoin, benzoin alkyl ethers, acetophenones, anthraquinones, thioxanthones, ketals, benzophenones, or xanthones are used.
  • benzoin examples include benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin propyl ether.
  • acetophenones include benzoin alkyl ethers, acetophenone, 2,2-dimethoxy-2-acetophenone, 2,2-diethoxy-2-acetophenone, 1,1-dichloroacetophenone, 2-hydroxy-1- ⁇ 4- [ 4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl ⁇ -2-methyl-propan-1-one and the like.
  • Anthraquinones include 2-methylanthraquinone, 2-ethylanthraquinone, 2-tertiarybutylanthraquinone, 1-chloroanthraquinone and the like.
  • Examples of thioxanthones include 2,4-dimethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone.
  • ketals include acetophenone dimethyl ketal, benzyldimethylmethal, benzyldiphenylsulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, ⁇ -chloranthraquinone and the like.
  • the blending amount of the photopolymerization initiator is 0.1 to 10 parts by mass, preferably 1 to 9 parts by mass with respect to 100 parts by mass of the (meth) acrylic acid ester polymer.
  • the blending amount of the photopolymerization initiator is less than 0.1 parts by mass, the peelability from the pressure-sensitive adhesive tape after the light irradiation is lowered, and the pick-up failure of the semiconductor chip is likely to occur.
  • the blending amount of the photopolymerization initiator is more than 10 parts by weight, the adhesive strength after UV irradiation is excessively reduced, and chip dispersion occurs.
  • the photopolymerization initiator may be used in combination with one or more conventionally known photopolymerization accelerators, if necessary.
  • group, a tertiary amine, etc. can be used for a photoinitiator.
  • the tertiary amine include triethylamine, tetraethylpentamine, dimethylamino ether and the like.
  • Tackifying resin A terpene phenol resin in which a terpene phenol resin is completely or partially hydrogenated may be added to the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer as a tackifier resin.
  • additives such as a softening agent, an anti-aging agent, a filler, a conductive agent, an ultraviolet absorber, and a light stabilizer may be added to the adhesive.
  • the content of the additive is not particularly limited, and can be 0 to 5 parts by mass with respect to 100 parts by mass of the (meth) acrylic acid ester polymer.
  • the thickness of the pressure-sensitive adhesive layer is preferably 5 ⁇ m to 15 ⁇ m. If the pressure-sensitive adhesive layer is thicker than 15 ⁇ m, chipping tends to occur. On the other hand, when the pressure-sensitive adhesive layer is thinner than 5 ⁇ m, the adhesive strength becomes too low, the chip retainability at the time of dicing is lowered and chip jumping may occur, or peeling may occur between the ring frame and the sheet.
  • An adhesive layer is applied on a vinyl chloride film to obtain an adhesive tape for semiconductor processing.
  • a method of directly applying an adhesive on a vinyl chloride film with a coater such as a gravure coater, comma coater, bar coater, knife coater or roll coater, or a vinyl chloride film after applying / drying an adhesive to a release film
  • a coater such as a gravure coater, comma coater, bar coater, knife coater or roll coater, or a vinyl chloride film after applying / drying an adhesive to a release film
  • the adhesive may be printed on the vinyl chloride film by convex plate printing, concave plate printing, flat plate printing, flexographic printing, offset printing, screen printing, or the like.
  • the manufacturing method of a semiconductor chip or a semiconductor component includes a sticking process of a semiconductor processing adhesive tape, a dicing process, a light irradiation process, an expanding process, and a pickup process in this order.
  • the adhesive tape for semiconductor processing is affixed on a semiconductor wafer or a board
  • the attaching step can be, for example, a step of attaching a semiconductor wafer or substrate to a semiconductor processing adhesive tape and then attaching the semiconductor processing adhesive tape to a ring frame and fixing it.
  • the wafer may be a conventional general-purpose wafer such as a silicon wafer, a gallium nitride wafer, a silicon carbide wafer, or a sapphire wafer.
  • the substrate may be a general-purpose substrate such as a package substrate in which a chip is sealed with a resin, an LED package substrate, or a ceramic substrate.
  • a silicon wafer or the like is diced to obtain a semiconductor chip or a semiconductor component.
  • a semiconductor chip or a semiconductor component is cut by cutting a semiconductor wafer or a substrate while rotating a dicing blade (such as a circular rotary blade made of diamond) at a high speed, cooling with pure water as necessary, and washing away cutting waste. obtain.
  • a dicing blade such as a circular rotary blade made of diamond
  • actinic rays such as an ultraviolet-ray
  • actinic rays are irradiated to a photocurable adhesive layer from the vinyl chloride film side.
  • an ultraviolet light source a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high pressure mercury lamp, a metal halide lamp, or a black light can be used.
  • an electron beam may be used instead of ultraviolet rays, and ⁇ -rays, ⁇ -rays, and ⁇ -rays can be used as the light source of the electron beams.
  • the light-sensitive adhesive layer is three-dimensionally reticulated and cured by light irradiation, and the adhesive strength of the pressure-sensitive adhesive layer is reduced.
  • the pressure-sensitive adhesive tape for semiconductor processing according to this embodiment does not excessively adhere to a wafer or the like even when heated, so that a sufficient decrease in adhesive strength can be obtained by irradiation with ultraviolet rays or the like.
  • the adhesive tape is stretched to widen the gap between the semiconductor chips or between the semiconductor components, and the chip or components are pushed up with a needle pin or the like. Thereafter, the chip or component is adsorbed by a vacuum collet or air tweezers, and peeled off from the adhesive layer of the semiconductor processing adhesive tape (pickup step).
  • the pressure-sensitive adhesive tape according to the present embodiment, a sufficient reduction in the adhesive force is obtained while maintaining the elastic modulus of the pressure-sensitive adhesive by irradiation with ultraviolet rays or the like, so that peeling between the chip or component and the pressure-sensitive adhesive layer is easy.
  • the pick-up is good, and no defects such as adhesive residue occur.
  • Example 1 The adhesive tape which concerns on Example 1 was produced with the following prescription.
  • the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape is composed of 100 parts by weight of (meth) acrylic acid ester copolymer a (AR-72L, manufactured by Nippon Zeon Co., Ltd.) and photopolymerizable compound a (UN-3320HS, Negami Kogyo Co., Ltd.).
  • Examples 2 to 16 Comparative Examples 1 to 12 Except for the formulations shown in Tables 1 and 2, adhesive tapes of Examples 2 to 16 and Comparative Examples 1 to 12 were obtained in the same manner as Example 1.
  • the numerical values for the (meth) acrylic acid ester polymer, photopolymerizable compound, curing agent, and photopolymerization initiator in Tables 1 and 2 are the masses when the (meth) acrylic acid ester copolymer is 100 parts by mass. The part etc. are shown. Details of the vinyl chloride film, (meth) acrylic acid ester copolymer, photopolymerizable compound, curing agent and photopolymerization initiator are as follows.
  • Vinyl chloride film a GM-311 (Diaplus Film), Young's modulus: 110 MPa Vinyl chloride film b: FUZB-2950 (manufactured by Achilles), Young's modulus: 200 MPa Vinyl chloride film c: FUZB-2850 (manufactured by Achilles), Young's modulus: 260 MPa Vinyl chloride film d: FUZB-2650 (manufactured by Achilles), Young's modulus: 350 MPa Vinyl chloride film e: FUZB-2550 (manufactured by Achilles), Young's modulus: 450 MPa
  • ⁇ Adhesive layer> ((Meth) acrylic acid ester copolymer) a: AR-72L (manufactured by Nippon Zeon Co., Ltd.), 15% by mass of n-butyl acrylate, 70% by mass of ethyl acrylate, 15% by mass of 2-methoxyethyl acrylate, Tg: ⁇ 32.0 ° C., weight average molecular weight 1.5 million, no hydroxyl and carboxyl groups) b: 14% by mass of n-butyl acrylate, 70% by mass of ethyl acrylate, 15% by mass of 2-methoxyethyl acrylate, 1% by mass of acrylic acid, Tg: ⁇ 30.9 ° C., weight average molecular weight 1,500,000, acrylic C: n-butyl acrylate 14% by mass, ethyl acrylate 70% by mass, 2-methoxyethyl acrylate 15% by mass, 2-hydroxyethyl acrylate 1% by
  • Em Young's modulus (tensile modulus, Pa), ⁇ : stress difference (Pa) due to the original average cross-sectional area between two points in a straight line, ⁇ : difference in strain between the same two points.
  • Device RTG1210 (Orientec) Width: 20mm Distance between chucks: 50mm
  • the conditions of the dicing process were as follows.
  • Dicing machine DAD341 manufactured by DISCO Dicing blade: NBC-ZH205O-27HEEE made by DISCO Dicing blade shape: outer diameter 55.56 mm, blade width 35 ⁇ m, inner diameter 19.05 mm
  • Dicing blade rotation speed 40,000 rpm
  • Dicing blade feed rate 100 mm / sec
  • Dicing size 1.0 mm square
  • Cutting depth into adhesive tape 30 ⁇ m
  • Cutting water volume 1.0 l / min
  • UVC-4800-4 manufactured by Ushio Electric Co., Ltd. was used, and irradiation was performed with an illuminance of 365 nm in wavelength of 280 mW / cm 2 and an integrated irradiation amount of 150 mJ / cm 2 .
  • Chip skipping is less than 5% ⁇ (Good): Chip skipping is 5% or more and less than 10% ⁇ (Not possible): Chip skipping is 10% or more
  • Chip pickup success rate is 95% or more
  • Chip pickup success rate is 80% or more and less than 95%
  • Chip pickup success rate is less than 80%
  • Mounter suitability is 1 m / sec of adhesive tape 3 having an adhesive layer disposed on the fluororesin roll side between a fluororesin roll 1 and a rubber roll 2 having a diameter of 5 cm adhered at 1 kPa.
  • the evaluation was based on the winding at the time of transportation (see FIG. 1). This evaluation was performed in a room with a room temperature of 23 ⁇ 2 ° C. and a humidity of 50 ⁇ 2%.
  • the adhesive tapes for semiconductor processing of Examples 1 to 12 have good mounter suitability during tape mounting, can suppress chip jumping and chipping in the dicing process, and are easy in the pickup process. It was found that it can be peeled off.
  • the comparative example was inferior as follows. In Comparative Example 1, since the Young's modulus of the vinyl chloride film is low, it is considered that defects occurred in chipping, pick-up properties, and mounter suitability. Since the comparative examples 2 and 3 contain a carboxyl group or a hydroxyl group in the (meth) acrylic acid ester copolymer, it is considered that poor pick-up properties occurred.
  • Comparative Example 4 since the number of parts by mass of the photopolymerizable compound was too small, it is considered that poor pick-up properties and chip retention were caused. In Comparative Example 5, it is considered that defects in chipping, pick-up property, and mounter suitability occurred because the number of parts by mass of the photopolymerizable compound was excessive. In Comparative Example 6, since the isocyanate skeleton of the photopolymerizable compound is hexamethylene diisocyanate, it is considered that the mounter suitability was poor. In Comparative Example 7, it is considered that the pick-up property was poor because the number of carbon-carbon double bonds of the photopolymerizable compound was small.
  • Comparative Example 8 since the weight average molecular weight of the photopolymerizable compound was not appropriate, the adhesion with the chip was poor, and it was considered that the chip retention was poor. In Comparative Example 9, since the number of parts by mass of the curing agent was too small, it was considered that defects in chipping and mounter suitability occurred. In Comparative Example 10, it is considered that the chip retention was poor because the number of parts by mass of the curing agent was excessive. In Comparative Example 11, it is considered that the pickup property was poor because the number of parts by mass of the photopolymerization initiator was too small. In Comparative Example 12, it is considered that the pickup property was poor because the number of parts by mass of the photopolymerization initiator was excessive.
  • the pressure-sensitive adhesive tape according to the present invention can be easily peeled off in the pick-up process even in a processing device in which the pressure-sensitive adhesive surface and the roll are in contact with each other, even if an automatic processing device is used. Therefore, the pressure-sensitive adhesive tape according to the present invention is suitably used for manufacturing a semiconductor chip or a semiconductor component manufactured by dicing, picking up, or the like.

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Le problème décrit par la présente invention concerne : une bande adhésive pour le traitement de semi-conducteurs, dont l'enroulement excessif autour d'un rouleau de transport est supprimé et qui est apte à être facilement séparée dans une étape de saisie ; et un procédé de fabrication d'une puce semi-conductrice ou d'un élément semi-conducteur, qui utilise cette bande adhésive pour un traitement de semi-conducteurs. La solution porte sur une bande adhésive pour le traitement de semi-conducteurs, qui est configurée de telle sorte que : un film de chlorure de vinyle présente un module de Young de 200 à 500 MPa ; une couche adhésive contient un polymère d'ester de (méth)acrylate ne présentant pas de groupe hydroxyle ni de groupe carboxyle ; la couche adhésive contient, pour 100 parties en masse du polymère d'ester de (méth)acrylate, 20 parties en masse à 150 parties en masse d'un composé photopolymérisable, 0,1 partie en masse à 10 parties en masse d'un agent de durcissement et 0,1 partie en masse à 10 parties en masse d'un initiateur de photopolymérisation ; et le composé photopolymérisable est un uréthane-acrylate qui présente un squelette de diisocyanate d'isophorone ou un squelette de diisocyanate de toluylène, tout en présentant un poids moléculaire pondéral moyen de 1000 à 10.000 et 6-15 doubles liaisons carbone-carbone.
PCT/JP2017/013424 2016-04-15 2017-03-30 Bande adhésive pour le traitement de semi-conducteurs et procédé de fabrication de puce semi-conductrice ou d'élément semi-conducteur l'utilisant WO2017179439A1 (fr)

Priority Applications (1)

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JP2018511962A JP6829250B2 (ja) 2016-04-15 2017-03-30 半導体加工用粘着テープ、及びそれを用いた半導体チップ又は半導体部品の製造方法

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JP2016-081685 2016-04-15

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
WO2021125152A1 (fr) * 2019-12-17 2021-06-24 昭和電工株式会社 Bande de traitement de semi-conducteur
JP7111213B1 (ja) 2021-04-22 2022-08-02 大日本印刷株式会社 半導体加工用粘着テープ

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JP2009164556A (ja) * 2007-12-11 2009-07-23 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2010129700A (ja) * 2008-11-26 2010-06-10 Nitto Denko Corp ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP2011253833A (ja) * 2008-09-29 2011-12-15 Denki Kagaku Kogyo Kk 半導体部材製造方法及び粘着テープ
JP2012191098A (ja) * 2011-03-14 2012-10-04 Lintec Corp ダイシングシートおよび半導体チップの製造方法
JP2014063803A (ja) * 2012-09-20 2014-04-10 Lintec Corp レーザーダイシングシート−剥離シート積層体、レーザーダイシングシートおよびチップ体の製造方法

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JP4805765B2 (ja) * 2006-09-12 2011-11-02 電気化学工業株式会社 電子部品固定用粘着シート及びそれを用いた電子部品の製造方法。
JP5859193B2 (ja) * 2010-07-14 2016-02-10 デンカ株式会社 多層粘着シート及び電子部品の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009164556A (ja) * 2007-12-11 2009-07-23 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2011253833A (ja) * 2008-09-29 2011-12-15 Denki Kagaku Kogyo Kk 半導体部材製造方法及び粘着テープ
JP2010129700A (ja) * 2008-11-26 2010-06-10 Nitto Denko Corp ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP2012191098A (ja) * 2011-03-14 2012-10-04 Lintec Corp ダイシングシートおよび半導体チップの製造方法
JP2014063803A (ja) * 2012-09-20 2014-04-10 Lintec Corp レーザーダイシングシート−剥離シート積層体、レーザーダイシングシートおよびチップ体の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021125152A1 (fr) * 2019-12-17 2021-06-24 昭和電工株式会社 Bande de traitement de semi-conducteur
JP7111213B1 (ja) 2021-04-22 2022-08-02 大日本印刷株式会社 半導体加工用粘着テープ
JP2022166959A (ja) * 2021-04-22 2022-11-04 大日本印刷株式会社 半導体加工用粘着テープ

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JPWO2017179439A1 (ja) 2019-02-28
JP6829250B2 (ja) 2021-02-10
TWI726089B (zh) 2021-05-01

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