WO2017164174A1 - Electromagnetic shielding film - Google Patents
Electromagnetic shielding film Download PDFInfo
- Publication number
- WO2017164174A1 WO2017164174A1 PCT/JP2017/011234 JP2017011234W WO2017164174A1 WO 2017164174 A1 WO2017164174 A1 WO 2017164174A1 JP 2017011234 W JP2017011234 W JP 2017011234W WO 2017164174 A1 WO2017164174 A1 WO 2017164174A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- shielding film
- electromagnetic wave
- wave shielding
- adhesive layer
- layer
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Definitions
- the present invention relates to an electromagnetic wave shielding film.
- Patent Documents 1 to 3 As a method for shielding a printed wiring board, use of an electromagnetic wave shielding film having a shield layer made of a metal film and a conductive adhesive layer containing a conductive filler has been studied (for example, Patent Documents 1 to 3). See).
- the electromagnetic wave shielding film is bonded by heating and pressing the conductive adhesive layer facing the insulating layer covering the printed wiring board.
- the insulating layer is provided with an opening for exposing the ground circuit.
- the opening is filled with the conductive adhesive.
- the shield layer and the ground circuit of the printed wiring board are connected via the conductive adhesive, and the printed wiring board is shielded.
- the shielded printed wiring board is exposed to a high temperature of about 270 ° C. in a reflow process in order to connect the printed wiring board and the electronic component.
- a shielding layer in a conventional electromagnetic wave shielding film a thin film on which silver is deposited or a metal film made of copper foil is used. Since silver and copper are expensive materials, it is preferable to use an inexpensive material such as aluminum in order to reduce the cost of the shield layer.
- an inexpensive material such as aluminum in order to reduce the cost of the shield layer.
- a high-resistance oxide film is likely to be formed on the surface of the aluminum film, and the normal conductive adhesive cannot electrically connect the aluminum film as a shield layer to the ground circuit and does not function as a shield. There is. Moreover, even if conduction was ensured in the initial state, the problem that the resistance value increased due to the reflow process became clear.
- the problem of the present disclosure is to realize an electromagnetic wave shielding film in which electrical connection with a printed wiring board is stably maintained without using an expensive material.
- One aspect of the electromagnetic wave shielding film of the present disclosure includes a shield layer made of an aluminum film and a conductive adhesive layer, and the conductive adhesive layer includes a conductive filler made of spike-like or filament-like nickel particles. .
- the conductive filler has a median diameter (D50) of 5 ⁇ m or more and 30 ⁇ m or less, a mode diameter of 3 ⁇ m or more and 50 ⁇ m or less, and a cumulative distribution in the mode diameter of 35% or more, preferably 60% or more. It can be.
- the conductive filler can have a maximum particle size of 90 ⁇ m or less.
- the conductive adhesive layer can have a thickness equal to or smaller than the median diameter of the conductive filler.
- the conductive adhesive layer may include 20% by mass or more and 50% by mass or less of the conductive filler.
- One embodiment of the conductive filler for an electromagnetic wave shielding film of the present disclosure is made of nickel particles having a spike shape or a filament shape, a mode diameter of 3 ⁇ m or more and 50 ⁇ m or less, and a cumulative distribution in the mode diameter of 35% or more.
- the nickel particles can have a maximum diameter of 90 ⁇ m or less.
- the electrical connection with the printed wiring board can be stably maintained without using an expensive material.
- the electromagnetic wave shielding film 100 of this embodiment includes a shield layer 111 made of an aluminum film, a conductive adhesive layer 112 provided on the first surface side of the shield layer 111, and a shield layer 111. And an insulating protective layer 113 provided on the second surface side opposite to the first surface.
- the shield layer 111 of this embodiment is made of an aluminum film.
- the thickness of the aluminum film is preferably 0.01 ⁇ m or more, more preferably 0.1 ⁇ m or more, from the viewpoint of improving the shielding characteristics.
- the thickness is preferably 12 ⁇ m or less, more preferably 10 ⁇ m or less, and even more preferably 3 ⁇ m or less, from the viewpoint of flexibility and the like and from the viewpoint of transmission characteristics of a high-frequency signal of 10 MHz or more.
- the method for producing the aluminum film is not particularly limited, and a method for producing an aluminum foil by rolling, an additive method such as vacuum deposition, sputtering, chemical vapor deposition (CVD), or metal organic growth (MO) It can be manufactured by a plating method or the like.
- an additive method such as vacuum deposition, sputtering, chemical vapor deposition (CVD), or metal organic growth (MO) It can be manufactured by a plating method or the like.
- the conductive adhesive layer 112 of this embodiment is a conductive adhesive layer having an adhesive resin composition and a conductive filler.
- the conductive filler is composed of spike-like or filament-like nickel particles.
- the spike-like nickel particles are particles mainly composed of nickel having spike-like protrusions on the surface.
- Examples of the spike-like nickel particles include Vale type 123.
- the filamentous nickel particles are mainly composed of nickel, in which primary particles having an average primary particle diameter of about 0.1 ⁇ m to 10 ⁇ m are connected in a chain to form filamentary secondary particles. Particles.
- filamentary nickel particles include Vale's Type 210, Type 255, Type 270, and Type 287.
- the description of the particle size of the filamentary nickel particles is a description of the secondary particles unless otherwise specified.
- the spiked or filamentary nickel particles preferably have a median diameter (D50) of 5 ⁇ m or more, and more preferably 10 ⁇ m or more. Moreover, 30 micrometers or less are preferable and 25 micrometers or less are more preferable. When the median diameter is 5 ⁇ m or more, the resistance value described later becomes low, and the electromagnetic wave shielding characteristics become good. When the median diameter is 30 ⁇ m or less, the heat resistance is good.
- the conductive filler made of spike-like or filament-like nickel particles preferably has a mode diameter of 3 ⁇ m or more, and more preferably 10 ⁇ m or more. Moreover, it is preferable that it is 50 micrometers or less, and it is more preferable that it is 40 micrometers or less. When the mode diameter is 3 ⁇ m or more, the resistance value to be described later becomes low and the electromagnetic wave shielding characteristics become good. When the mode diameter is 50 ⁇ m or less, the heat resistance of the electromagnetic wave shielding film is improved.
- the conductive filler made of spike-like or filament-like nickel particles preferably has a cumulative distribution in mode diameter of 35% or more, more preferably 60% or more, and even more preferably 65% or more. Preferably, it is still more preferably 70% or more. When the cumulative distribution of the mode diameter is 35% or more, the heat resistance of the electromagnetic wave shielding film is improved.
- the conductive filler made of spike-like or filamentary nickel particles preferably has a maximum particle diameter (Dmax) of 90 ⁇ m or less, more preferably 85 ⁇ m or less, and even more preferably 80 ⁇ m or less, More preferably, it is 70 ⁇ m or less.
- Dmax is 90 ⁇ m or less, the heat resistance of the electromagnetic wave shielding film is improved.
- the mode diameter, cumulative distribution, D50, and Dmax can be measured by the methods shown in the examples described later.
- spike-like nickel particles and filament-like nickel particles can be mixed and used as a conductive filler.
- the shield layer is a film of silver or copper
- a good electrical connection can be obtained by using copper particles, silver particles, silver-coated copper particles, or ordinary spherical nickel particles as a conductive filler. Can do.
- the shield layer is an aluminum film, an oxide film is formed on the surface. Therefore, when these particles are used as a conductive filler, it is difficult to obtain good electrical connection. Even if an electrical connection is obtained in the initial state, the resistance value is increased by the reflow process, and it is difficult to stably maintain the connection.
- the oxide film on the surface of the aluminum film can be pierced by the effect of the hardness and shape of the particles, and stable and good electrical properties can be obtained. It is possible to maintain a general connection. In the case of soft particles made of silver, copper, or the like, even if the shape has protrusions or the like, the oxide film cannot be broken through, and it is difficult to obtain good electrical connection.
- the amount of the conductive filler added to the entire conductive adhesive layer is preferably 20% by mass or more, more preferably 25% by mass or more, and further preferably 30% by mass or more, from the viewpoint of ensuring good conductivity. Moreover, from a viewpoint of the adhesiveness of a conductive adhesive layer, Preferably it is 50 mass% or less, More preferably, it is 45 mass% or less, More preferably, it is 40 mass% or less.
- the adhesive resin composition is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, Thermoplastic resin compositions such as amide resin compositions or acrylic resin compositions, or phenolic resin compositions, epoxy resin compositions, urethane resin compositions, melamine resin compositions, or alkyd resin compositions
- a thermosetting resin composition such as a product can be used. These may be used alone or in combination of two or more.
- a curing accelerator for the conductive adhesive layer, if necessary, a curing accelerator, tackifier, antioxidant, pigment, dye, plasticizer, ultraviolet absorber, antifoaming agent, leveling agent, filler, flame retardant, And at least one of a viscosity modifier and the like may be contained.
- the thickness of the conductive adhesive layer is not particularly limited and can be appropriately set as necessary, but is preferably 3 ⁇ m or more, more preferably 4 ⁇ m or more, and preferably 10 ⁇ m or less, more preferably 7 ⁇ m or less. can do.
- the thickness of the conductive adhesive layer is not more than the median diameter (D50) of the conductive filler made of spike-like or filament-like nickel particles. It is preferable. When the thickness of the conductive adhesive layer is equal to or less than the median diameter (D50) of the conductive filler, the electrical connection between the electromagnetic wave shield and the printed wiring board is good.
- the insulating protective layer 113 of the present embodiment is not particularly limited as long as it has predetermined mechanical strength, chemical resistance, heat resistance, and the like that can protect the adhesive layer and the shield layer, and has sufficient insulating properties.
- a thermoplastic resin composition, a thermosetting resin composition, or an active energy ray curable composition can be used.
- the thermoplastic resin composition is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, Alternatively, an acrylic resin composition or the like can be used.
- the thermosetting resin composition is not particularly limited, but is a phenolic resin composition, an epoxy resin composition, a urethane resin composition having an isocyanate group at the terminal, a urea resin having an isocyanate group at the terminal, and a terminal. Urethane urea resins having an isocyanate group, melamine resin compositions, alkyd resin compositions, and the like can be used.
- the active energy ray-curable composition is not particularly limited, and for example, a polymerizable compound having at least two (meth) acryloyloxy groups in the molecule can be used. These resins may be used alone or in combination of two or more.
- insulating protective layer curing accelerator, tackifier, antioxidant, pigment, dye, plasticizer, ultraviolet absorber, antifoaming agent, leveling agent, filler, flame retardant, viscosity adjustment as necessary At least one of an agent, an anti-blocking agent and the like may be included.
- the insulating protective layer may be a laminate of two or more layers having different materials or physical properties such as hardness or elastic modulus. For example, if the outer layer having a low hardness and the inner layer having a high hardness are laminated, the outer layer has a cushioning effect, so that the pressure applied to the shield layer in the step of heating and pressurizing the electromagnetic wave shielding film to the printed wiring board can be reduced. For this reason, it can suppress that a shield layer is destroyed by the level
- the thickness of the insulating protective layer is not particularly limited and can be appropriately set as necessary, but it is 1 ⁇ m or more, preferably 4 ⁇ m or more, and 20 ⁇ m or less, preferably 10 ⁇ m or less, more preferably 5 ⁇ m or less. can do.
- the adhesive layer and the shield layer can be sufficiently protected.
- the thickness of the insulating protective layer is set to 20 ⁇ m or less, the flexibility of the electromagnetic wave shielding film can be secured, and it becomes easy to apply one electromagnetic wave shielding film to a member that requires flexibility. .
- the manufacturing method of the electromagnetic wave shielding film of this embodiment is not specifically limited, It can manufacture by various methods. For example, as shown below, a conductive adhesive layer is formed on a support substrate, an insulating protective layer and a shield layer are formed on another support substrate, a conductive adhesive layer, and a shield. The layers can be bonded together.
- an adhesive layer composition is prepared.
- the composition for an adhesive layer includes a conductive filler, a resin composition, and a solvent.
- the conductive filler is spiked or filamentary nickel particles.
- the resin composition is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, an amide resin.
- Compositions, or thermoplastic resin compositions such as acrylic resin compositions, or phenolic resin compositions, epoxy resin compositions, urethane resin compositions, melamine resin compositions, alkyd resin compositions, etc. It can be set as a thermosetting resin composition or the like. These may be used alone or in combination of two or more.
- the solvent can be, for example, toluene, acetone, methyl ethyl ketone, methanol, ethanol, propanol, or dimethylformamide.
- the adhesive layer composition may include a curing accelerator, tackifier, antioxidant, pigment, dye, plasticizer, ultraviolet absorber, antifoaming agent, leveling agent, filler, flame retardant. , And at least one of a viscosity modifier and the like may be included.
- the composition for the adhesive layer is applied to one side of the support base material for forming the conductive adhesive layer.
- the method for applying the protective layer composition to the support substrate for forming the conductive adhesive layer is not particularly limited, and employs known techniques such as lip coating, comma coating, gravure coating, and slot die coating. Can do.
- the support base material for forming the conductive adhesive layer can be, for example, a film.
- the support base material for forming the conductive adhesive layer is not particularly limited, and can be formed of, for example, a polyolefin-based, polyester-based, polyimide-based, or polyphenylene sulfide-based material.
- the prepared adhesive layer composition is applied to the surface of the conductive adhesive layer forming support substrate, and the adhesive layer composition applied to the surface of the conductive adhesive layer forming support substrate is heated.
- a conductive adhesive layer is formed by removing the solvent by drying.
- a protective layer composition is prepared.
- the protective layer composition can be prepared by adding an appropriate amount of a solvent and other compounding agents to the resin composition.
- the solvent can be, for example, toluene, acetone, methyl ethyl ketone, methanol, ethanol, propanol, dimethylformamide, and the like.
- a crosslinking agent, a polymerization catalyst, a curing accelerator, a filler, a colorant, and the like can be added. Other compounding agents may be added as necessary.
- the prepared protective layer composition is applied to one side of the support substrate for forming the insulating protective layer.
- the method for applying the protective layer composition to the insulating protective layer-forming support substrate is not particularly limited, and known techniques such as lip coating, comma coating, gravure coating, and slot die coating can be employed. .
- the support substrate for forming the insulating protective layer can be formed into a film, for example.
- the support substrate for forming the insulating protective layer is not particularly limited, and can be formed of, for example, a polyolefin-based material, a polyester-based material, a polyimide-based material, or a polyphenylene sulfide-based material.
- the insulating protective layer is formed by heating and drying the protective layer composition applied to the surface of the supporting substrate for forming the insulating protective layer to remove the solvent.
- a shield layer is formed on the surface of the insulating protective layer to form a laminate of the insulating protective layer and the shield layer.
- a method in which an aluminum foil formed in advance to a predetermined thickness is bonded to the insulating protective layer, or a method in which an aluminum film is formed on the surface of the insulating protective layer by vapor deposition or plating can be used.
- the support base material for electroconductive adhesive bond layer formation can be used as a protective film of a conductive adhesive layer.
- the support base material for insulating protective layer formation can be performed after affixing an electromagnetic wave shielding film on a printed wiring board. In this way, the electromagnetic wave shielding film can be protected by the support base material.
- the insulating protective layer may be peeled off at any time after the insulating protective layer is formed.
- a shield layer and an insulating protective layer can be sequentially formed on the conductive adhesive layer.
- a shield layer and a conductive adhesive layer can be sequentially formed on the insulating protective layer.
- the electromagnetic wave shielding film of this embodiment can be used for the shield printed wiring board 300 shown in FIG. 2, for example.
- the shield printed wiring board 300 includes a printed wiring board 200 and an electromagnetic wave shielding film 100.
- the printed wiring board 200 includes a base layer 211, a printed circuit (ground circuit) 212 formed on the base layer 211, and an insulating adhesive layer 213 provided on the base layer 211 adjacent to the ground circuit 212. And an insulating cover lay 214 that is formed so as to cover the insulating adhesive layer 213 and has an opening for exposing a part of the ground circuit 212.
- the insulating adhesive layer 213 and the coverlay 214 constitute an insulating layer of the printed wiring board.
- the base layer 211, the insulating adhesive layer 213, and the coverlay 214 are not particularly limited, and may be, for example, a resin film. In this case, it can be formed of a resin such as polypropylene, cross-linked polyethylene, polyester, polybenzimidazole, polyimide, polyimide amide, polyether imide, or polyphenylene sulfide.
- the ground circuit 212 can be, for example, a copper wiring pattern formed on the base layer 211.
- the electromagnetic wave shielding film 100 is bonded to the printed wiring board 200 with the conductive adhesive layer 112 facing the coverlay 214 side.
- the electromagnetic wave shielding film 100 is placed on the printed wiring board 200 and pressed while being heated by a press machine. A part of the conductive adhesive layer 112 softened by heating flows into an opening formed in the coverlay 214 by pressurization. Thereby, the shield layer 111 and the ground circuit 212 of the printed wiring board 200 are connected via the conductive adhesive, and the shield layer 111 and the ground circuit 212 are connected.
- ⁇ Evaluation of particle size> The mode diameter, cumulative distribution, D50 and Dmax of the aggregate of the conductive filler particles were measured using a particle size distribution measuring apparatus (manufactured by Microtrack Bell Co., Ltd., MT3300EXII) using water as a dispersion medium.
- the printed wiring board has two copper foil patterns extending parallel to each other at an interval, and has an insulating layer (thickness: 25 ⁇ m) made of polyimide, covering the copper foil pattern. An opening (diameter: 1 mm) for exposing the copper foil pattern was provided. When the electromagnetic wave shielding film adhesive layer and the printed wiring board were overlapped, the opening was completely covered with the electromagnetic wave shielding film.
- the electrical resistance value between the two copper foil patterns of the obtained shield printed wiring board was measured using a resistance meter, and the electrical connection between the printed wiring board and the shield layer before reflow was evaluated.
- ⁇ Creation of insulation protective layer and shield layer 100 parts by mass of bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., jER1256) and 0.1% of a curing agent (manufactured by Mitsubishi Chemical Co., Ltd., ST14) so that the solid content is 20% by mass. 1 part by mass was blended to prepare an insulating protective layer composition.
- This composition is applied to a support substrate for forming an insulating protective layer made of a polyethylene terephthalate (PET) film whose surface has been subjected to mold release treatment, dried by heating, and an insulating protective layer ( 6 ⁇ m thick) was formed.
- PET polyethylene terephthalate
- An aluminum film having a thickness of 0.1 ⁇ m was formed on the surface of the obtained insulating protective layer by vapor deposition to obtain a laminate of the insulating protective layer and the shield layer.
- a support base material on which an insulating protective layer is formed is placed in a batch type vacuum evaporation apparatus (ULVAC, EBH-800), and the degree of vacuum reaches 5 ⁇ 10 ⁇ 1 Pa or less in an argon gas atmosphere. After adjustment, aluminum was deposited to a thickness of 0.1 ⁇ m by magnetron sputtering (DC power output: 3.0 kW).
- 43 parts by mass of a conductive filler composed of part by mass and filamentary nickel particles was added and mixed by stirring to prepare an adhesive layer composition.
- the mode diameter of the conductive filler was 34 ⁇ m, the cumulative distribution was 76%, the median diameter (D50) was 20 ⁇ m, and the maximum particle diameter (Dmax) was 88 ⁇ m.
- the ratio of the nickel particle in the obtained adhesive bond layer composition will be 30 mass%.
- the obtained adhesive layer composition is applied to a support substrate for forming a conductive adhesive layer made of a PET film whose surface has been release-treated, and dried by heating, whereby a support substrate for forming a conductive adhesive layer is formed.
- a conductive adhesive layer (thickness 12 ⁇ m) was formed on the surface.
- the obtained conductive adhesive layer was bonded to a separately prepared laminate of an insulating protective layer and a shield layer to obtain an electromagnetic wave shielding film of Example 1.
- the initial electrical resistance value before reflow was 563 m ⁇
- the first electrical resistance value was 653 m ⁇
- the second electrical resistance value was 740 m ⁇
- the reflow was reflowed.
- the third electric resistance value was 797 m ⁇
- the fourth reflow electric resistance value was 842 m ⁇
- the fifth reflow electric resistance value was 881 m ⁇ .
- Example 2 Similar to Example 1 except that a conductive filler made of filamentary nickel particles having a mode diameter of 31 ⁇ m, a cumulative distribution of 79%, a median diameter (D50) of 19 ⁇ m, and a maximum particle diameter (Dmax) of 62 ⁇ m was used. did.
- the initial electrical resistance value before reflow was 607 m ⁇
- the first electrical resistance value was 658 m ⁇
- the second electrical resistance value was 691 m ⁇
- the third electric resistance value was 711 m ⁇
- the fourth reflow electric resistance value was 726 m ⁇
- the fifth reflow electric resistance value was 739 m ⁇ .
- Example 3 Similar to Example 1 except that a conductive filler made of filamentary nickel particles having a mode diameter of 23 ⁇ m, a cumulative distribution of 68%, a median diameter (D50) of 15 ⁇ m, and a maximum particle diameter (Dmax) of 88 ⁇ m was used. did.
- the initial electrical resistance value before reflowing was 622 m ⁇
- the first electrical resistance value was 741 m ⁇
- the second electrical resistance value was 851 m ⁇
- reflowing The third electric resistance value was 925 m ⁇
- the fourth reflow electric resistance value was 984 m ⁇
- the fifth reflow electric resistance value was 1036 m ⁇ .
- Example 4 Similar to Example 1, except that a conductive filler made of spike-like nickel particles having a mode diameter of 8 ⁇ m, a cumulative distribution of 37%, a median diameter (D50) of 10 ⁇ m, and a maximum particle diameter (Dmax) of 105 ⁇ m was used. did.
- the initial electrical resistance value before reflow is 1155 m ⁇
- the first electrical resistance value is 2089 m ⁇
- the second electrical resistance value is 2967 m ⁇
- the third electrical resistance value is 3255 m ⁇
- the fourth electrical resistance value is 4066 m ⁇ .
- the electrical resistance value at the fifth reflow was 4317 m ⁇ .
- Example 1 (Comparative Example 1) Example 1 was used except that a conductive filler made of spherical nickel particles having a mode diameter of 7 ⁇ m, a cumulative distribution of 66%, a median diameter (D50) of 6 ⁇ m, and a maximum particle diameter (Dmax) of 19 ⁇ m was used. .
- the initial electrical resistance value before reflowing was 7750 m ⁇ .
- the electrical resistance values at the first to fifth reflows were infinite (out of the measurement range).
- Comparative Example 2 Conductivity made of dendritic silver-coated copper particles (Ag-Cu, manufactured by Mitsui Kinzoku Co., Ltd.) having a mode diameter of 17 ⁇ m, a cumulative distribution of 64%, a median diameter (D50) of 14 ⁇ m, and a maximum particle diameter (Dmax) of 52 ⁇ m.
- the same procedure as in Example 1 was performed except that a filler was used.
- the electrical resistance value before reflow was infinite (out of the measurement range). For this reason, the measurement of the electrical resistance value after reflow was not performed.
- Table 1 summarizes the evaluation results of each example and comparative example.
- the electromagnetic wave shielding films of Examples 1 to 4 using filamentary or spiked nickel particles have lower electrical resistance before reflowing than the electromagnetic wave shielding film of Comparative Example 1 using spherical nickel particles, and after reflowing. The low electric resistance is maintained. Further, the electromagnetic wave shielding film of Comparative Example 2 using dendritic silver-coated copper particles could not confirm conduction even before reflow.
- the electromagnetic shielding film of the present disclosure can stably maintain an electrical connection with a printed wiring board without using an expensive material, and is useful as an electromagnetic shielding film for shielding a printed wiring board or the like.
- Electromagnetic wave shielding film 111 Shield layer 112 Conductive adhesive layer 113 Insulating protective layer 200 Printed wiring board 211 Base layer 212 Ground circuit 213 Insulating adhesive layer 214 Coverlay 300 Shield printed wiring board
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
Description
図1に示すように、本実施形態の電磁波シールドフィルム100は、アルミニウム膜からなるシールド層111と、シールド層111の第1の面側に設けられた導電性接着剤層112と、シールド層111の第1の面とは反対側の第2の面側に設けられた絶縁保護層113とを備えている。 (Electromagnetic wave shielding film)
As shown in FIG. 1, the electromagnetic
本実施形態のシールド層111は、アルミニウム膜からなる。アルミニウム膜の厚さは、シールド特性を良好にする観点から、好ましくは0.01μm以上、より好ましくは0.1μm以上である。また、厚さは、柔軟性等の観点及び10MHz以上の高周波信号の伝送特性の観点から、好ましくは12μm以下、より好ましくは10μm以下、さらに好ましくは3μm以下である。 <Shield layer>
The
本実施形態の導電性接着剤層112は、接着性樹脂組成物と導電性フィラーとを有する導電性接着剤層である。本実施形態において、導電性フィラーは、スパイク状又はフィラメント状のニッケル粒子からなる。 <Conductive adhesive layer>
The conductive
本実施形態の絶縁保護層113は、接着剤層及びシールド層を保護できる所定の機械的強度、耐薬品性及び耐熱性等を満たし、充分な絶縁性を有していれば特に限定されない。例えば、熱可塑性樹脂組成物、熱硬化性樹脂組成物、又は活性エネルギー線硬化性組成物等を用いることができる。 <Insulation protective layer>
The insulating
本実施形態の電磁波シールドフィルムの製造方法は特に限定されず種々の方法により製造することができる。例えば、以下に示すように、支持基材の上に、導電性接着剤層を形成し、別の支持基材の上に絶縁保護層及びシールド層を形成し、導電性接着剤層と、シールド層とを貼り合わせて製造することができる。 (Production method)
The manufacturing method of the electromagnetic wave shielding film of this embodiment is not specifically limited, It can manufacture by various methods. For example, as shown below, a conductive adhesive layer is formed on a support substrate, an insulating protective layer and a shield layer are formed on another support substrate, a conductive adhesive layer, and a shield. The layers can be bonded together.
まず、接着剤層用組成物を調製する。接着剤層用組成物は、導電性フィラーと、樹脂組成物と、溶剤とを含む。導電性フィラーは、スパイク状又はフィラメント状のニッケル粒子とする。樹脂組成物は、特に限定されないが、スチレン系樹脂組成物、酢酸ビニル系樹脂組成物、ポリエステル系樹脂組成物、ポリエチレン系樹脂組成物、ポリプロピレン系樹脂組成物、イミド系樹脂組成物、アミド系樹脂組成物、若しくはアクリル系樹脂組成物等の熱可塑性樹脂組成物、又はフェノール系樹脂組成物、エポキシ系樹脂組成物、ウレタン系樹脂組成物、メラミン系樹脂組成物、若しくはアルキッド系樹脂組成物等の熱硬化性樹脂組成物等とすることができる。これらは単独で用いてもよく、2種以上を併用してもよい。 <Conductive adhesive layer forming step>
First, an adhesive layer composition is prepared. The composition for an adhesive layer includes a conductive filler, a resin composition, and a solvent. The conductive filler is spiked or filamentary nickel particles. The resin composition is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, an amide resin. Compositions, or thermoplastic resin compositions such as acrylic resin compositions, or phenolic resin compositions, epoxy resin compositions, urethane resin compositions, melamine resin compositions, alkyd resin compositions, etc. It can be set as a thermosetting resin composition or the like. These may be used alone or in combination of two or more.
まず、保護層用組成物を調製する。保護層用組成物は、樹脂組成物に、溶剤及びその他の配合剤を適量加えて調製することができる。溶剤は、例えば、トルエン、アセトン、メチルエチルケトン、メタノール、エタノール、プロパノール及びジメチルホルムアミド等とすることができる。その他の配合剤としては、架橋剤、重合用触媒、硬化促進剤、充填材及び着色剤等を加えることができる。その他の配合剤は必要に応じて加えればよい。 <Insulating protective layer formation process>
First, a protective layer composition is prepared. The protective layer composition can be prepared by adding an appropriate amount of a solvent and other compounding agents to the resin composition. The solvent can be, for example, toluene, acetone, methyl ethyl ketone, methanol, ethanol, propanol, dimethylformamide, and the like. As other compounding agents, a crosslinking agent, a polymerization catalyst, a curing accelerator, a filler, a colorant, and the like can be added. Other compounding agents may be added as necessary.
次に、絶縁保護層の表面にシールド層を形成し、絶縁保護層とシールド層との積層体とする。具体的には、予め所定の厚さに形成したアルミニウム箔を絶縁保護層に貼り合わせる方法や、絶縁保護層の表面に蒸着又はめっき等によりアルミニウム膜を形成する方法を用いることができる。 <Shield layer formation process>
Next, a shield layer is formed on the surface of the insulating protective layer to form a laminate of the insulating protective layer and the shield layer. Specifically, a method in which an aluminum foil formed in advance to a predetermined thickness is bonded to the insulating protective layer, or a method in which an aluminum film is formed on the surface of the insulating protective layer by vapor deposition or plating can be used.
導電性接着剤層とシールド層とを対向させ、導電性接着剤層と積層体とを貼り合わせることにより、絶縁保護層、シールド層及び導電性接着剤層を有する電磁波シールドフィルムが得られる。 <Lamination process>
By facing the conductive adhesive layer and the shield layer and bonding the conductive adhesive layer and the laminate, an electromagnetic wave shielding film having an insulating protective layer, a shield layer, and a conductive adhesive layer is obtained.
本実施形態の電磁波シールドフィルムは、例えば、図2に示すシールドプリント配線板300に用いることができる。シールドプリント配線板300は、プリント配線板200と、電磁波シールドフィルム100と備えている。 (Shield printed wiring board)
The electromagnetic wave shielding film of this embodiment can be used for the shield printed
導電性フィラー粒子の凝集体のモード径、累積分布、D50及びDmaxは、粒度分布測定装置(マイクロトラックベル社製、MT3300EXII)を用い、水を分散媒として測定した。 <Evaluation of particle size>
The mode diameter, cumulative distribution, D50 and Dmax of the aggregate of the conductive filler particles were measured using a particle size distribution measuring apparatus (manufactured by Microtrack Bell Co., Ltd., MT3300EXII) using water as a dispersion medium.
作成した電磁波シールドフィルムと、評価用のプリント配線基板とを重ね合わせ、プレス機を用いて170℃、3.0MPaの条件で1分間加熱加圧した後、同じ温度及び圧力で3分間加熱加圧した。この後、支持基材を保護層から剥離して、評価用のシールドプリント配線板を作製した。 <Evaluation of electrical connection>
The produced electromagnetic wave shielding film and the printed wiring board for evaluation are superposed and heated and pressurized for 1 minute at 170 ° C. and 3.0 MPa using a press machine, and then heated and pressurized for 3 minutes at the same temperature and pressure. did. Then, the support base material was peeled from the protective layer to produce a shield printed wiring board for evaluation.
固形分量が20質量%となるように、トルエンにビスフェノールA型エポキシ系樹脂(三菱化学(株)製、jER1256)を100質量部、硬化剤として(三菱化学(株)製、ST14)を0.1質量部配合し、絶縁保護層組成物を調製した。この組成物を、表面を離型処理したポリエチレンテレフタレート(PET)フィルムからなる絶縁保護層形成用支持基材に塗布し、加熱乾燥して絶縁保護層形成用支持基材の表面に絶縁保護層(厚さ6μm)を形成した。 <Creation of insulation protective layer and shield layer>
100 parts by mass of bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., jER1256) and 0.1% of a curing agent (manufactured by Mitsubishi Chemical Co., Ltd., ST14) so that the solid content is 20% by mass. 1 part by mass was blended to prepare an insulating protective layer composition. This composition is applied to a support substrate for forming an insulating protective layer made of a polyethylene terephthalate (PET) film whose surface has been subjected to mold release treatment, dried by heating, and an insulating protective layer ( 6 μm thick) was formed.
-電磁波シールドフィルムの作成-
固形分量が20質量%となるように、トルエンにビスフェノールA型エポキシ系樹脂(三菱化学(株)製、jER1256)を100質量部、硬化剤(三菱化学(株)製、ST14)を0.1質量部、フィラメント状のニッケル粒子からなる導電性フィラーを43質量部添加し、撹拌混合して接着剤層組成物を調製した。なお、導電性フィラーのモード径は34μmで、累積分布は76%であり、メディアン径(D50)は20μm、最大粒子径(Dmax)は88μmであった。また、得られた接着剤層組成物中のニッケル粒子の割合は30質量%となる。得られた接着剤層組成物を、表面を離型処理したPETフィルムからなる導電性接着剤層形成用支持基材に塗布し、加熱乾燥することで、導電性接着剤層形成用支持基材の表面に導電性接着剤層(厚さ12μm)を形成した。 Example 1
-Creation of electromagnetic shielding film-
100 parts by mass of bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., jER1256) and 0.1% of curing agent (manufactured by Mitsubishi Chemical Co., Ltd., ST14) so that the solid content is 20% by mass. 43 parts by mass of a conductive filler composed of part by mass and filamentary nickel particles was added and mixed by stirring to prepare an adhesive layer composition. The mode diameter of the conductive filler was 34 μm, the cumulative distribution was 76%, the median diameter (D50) was 20 μm, and the maximum particle diameter (Dmax) was 88 μm. Moreover, the ratio of the nickel particle in the obtained adhesive bond layer composition will be 30 mass%. The obtained adhesive layer composition is applied to a support substrate for forming a conductive adhesive layer made of a PET film whose surface has been release-treated, and dried by heating, whereby a support substrate for forming a conductive adhesive layer is formed. A conductive adhesive layer (thickness 12 μm) was formed on the surface.
モード径が31μmで累積分布が79%、メディアン径(D50)が19μm、最大粒子径(Dmax)が62μmの、フィラメント状のニッケル粒子からなる導電性フィラーを用いた他は実施例1と同様にした。 (Example 2)
Similar to Example 1 except that a conductive filler made of filamentary nickel particles having a mode diameter of 31 μm, a cumulative distribution of 79%, a median diameter (D50) of 19 μm, and a maximum particle diameter (Dmax) of 62 μm was used. did.
モード径が23μmで累積分布が68%、メディアン径(D50)が15μm、最大粒子径(Dmax)が88μmの、フィラメント状のニッケル粒子からなる導電性フィラーを用いた他は実施例1と同様にした。 (Example 3)
Similar to Example 1 except that a conductive filler made of filamentary nickel particles having a mode diameter of 23 μm, a cumulative distribution of 68%, a median diameter (D50) of 15 μm, and a maximum particle diameter (Dmax) of 88 μm was used. did.
モード径が8μmで累積分布が37%、メディアン径(D50)が10μm、最大粒子径(Dmax)が105μmの、スパイク状のニッケル粒子からなる導電性フィラーを用いた他は実施例1と同様にした。 (Example 4)
Similar to Example 1, except that a conductive filler made of spike-like nickel particles having a mode diameter of 8 μm, a cumulative distribution of 37%, a median diameter (D50) of 10 μm, and a maximum particle diameter (Dmax) of 105 μm was used. did.
モード径が7μmで累積分布が66%、メディアン径(D50)が6μm、最大粒子径(Dmax)が19μmの、球状のニッケル粒子からなる導電性フィラーを用いた他は実施例1と同様にした。リフロー前の初期電気抵抗値は、7750mΩであった。リフロー1回目~5回目の電気抵抗値はいずれも無限大(測定レンジ外)であった。 (Comparative Example 1)
Example 1 was used except that a conductive filler made of spherical nickel particles having a mode diameter of 7 μm, a cumulative distribution of 66%, a median diameter (D50) of 6 μm, and a maximum particle diameter (Dmax) of 19 μm was used. . The initial electrical resistance value before reflowing was 7750 mΩ. The electrical resistance values at the first to fifth reflows were infinite (out of the measurement range).
モード径が17μmで累積分布が64%、メディアン径(D50)が14μm、最大粒子径(Dmax)が52μmの、デンドライト状の銀被覆銅粒子(Ag-Cu、三井金属社製)からなる導電性フィラーを用いた他は実施例1と同様にした。リフロー前の電気抵抗値は、無限大(測定レンジ外)であった。このため、リフロー後の電気抵抗値の測定は行わなかった。 (Comparative Example 2)
Conductivity made of dendritic silver-coated copper particles (Ag-Cu, manufactured by Mitsui Kinzoku Co., Ltd.) having a mode diameter of 17 μm, a cumulative distribution of 64%, a median diameter (D50) of 14 μm, and a maximum particle diameter (Dmax) of 52 μm. The same procedure as in Example 1 was performed except that a filler was used. The electrical resistance value before reflow was infinite (out of the measurement range). For this reason, the measurement of the electrical resistance value after reflow was not performed.
111 シールド層
112 導電性接着剤層
113 絶縁保護層
200 プリント配線板
211 ベース層
212 グランド回路
213 絶縁性接着剤層
214 カバーレイ
300 シールドプリント配線板 DESCRIPTION OF
Claims (7)
- アルミニウム膜からなるシールド層と、導電性接着剤層とを備え、
前記導電性接着剤層は、スパイク状又はフィラメント状のニッケル粒子からなる、導電性フィラーを含み、
前記ニッケル粒子は、
メディアン径(D50)が5μm以上、30μm以下、
モード径が3μm以上、50μm以下、
モード径における累積分布が35%以上、
である、電磁波シールドフィルム。 Provided with a shield layer made of an aluminum film and a conductive adhesive layer,
The conductive adhesive layer includes a conductive filler composed of spiked or filamentary nickel particles,
The nickel particles are
Median diameter (D50) is 5 μm or more and 30 μm or less,
The mode diameter is 3 μm or more and 50 μm or less,
Cumulative distribution in mode diameter is 35% or more,
An electromagnetic wave shielding film. - 前記導電性フィラーは、
モード径における累積分布が、60%以上である、請求項1に記載の電磁波シールドフィルム。 The conductive filler is
The electromagnetic wave shielding film according to claim 1, wherein the cumulative distribution in the mode diameter is 60% or more. - 前記導電性フィラーは、最大粒子径が90μm以下である、請求項1又は2に記載の電磁波シールドフィルム。 The electromagnetic wave shielding film according to claim 1 or 2, wherein the conductive filler has a maximum particle size of 90 µm or less.
- 前記導電性接着剤層は、厚さが前記導電性フィラーのメディアン径以下である、請求項1~3のいずれか1項に記載の電磁波シールドフィルム。 The electromagnetic wave shielding film according to any one of claims 1 to 3, wherein the conductive adhesive layer has a thickness equal to or less than a median diameter of the conductive filler.
- 前記導電性接着剤層は、前記導電性フィラーを20質量%以上、50質量%以下含む、
請求項1~4のいずれか1項に記載の電磁波シールドフィルム。 The conductive adhesive layer contains 20% by mass or more and 50% by mass or less of the conductive filler,
The electromagnetic wave shielding film according to any one of claims 1 to 4. - スパイク状又はフィラメント状で、
モード径が3μm以上、50μm以下であり、
モード径における累積分布が35%以上である、ニッケル粒子からなる電磁波シールドフィルム用導電性フィラー。 Spike or filament,
The mode diameter is 3 μm or more and 50 μm or less,
A conductive filler for an electromagnetic wave shielding film made of nickel particles, wherein the cumulative distribution in mode diameter is 35% or more. - 前記ニッケル粒子は、最大粒子径が90μm以下である、請求項6に記載の電磁波シールドフィルム用導電性フィラー。 The conductive filler for an electromagnetic wave shielding film according to claim 6, wherein the nickel particles have a maximum particle diameter of 90 μm or less.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020187020204A KR102280175B1 (en) | 2016-03-23 | 2017-03-21 | electromagnetic shielding film |
CN201780013187.0A CN108702863B (en) | 2016-03-23 | 2017-03-21 | Electromagnetic wave shielding film |
JP2018507336A JP7023836B2 (en) | 2016-03-23 | 2017-03-21 | Electromagnetic wave shield film |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-059059 | 2016-03-23 | ||
JP2016059059 | 2016-03-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017164174A1 true WO2017164174A1 (en) | 2017-09-28 |
Family
ID=59899408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2017/011234 WO2017164174A1 (en) | 2016-03-23 | 2017-03-21 | Electromagnetic shielding film |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7023836B2 (en) |
KR (1) | KR102280175B1 (en) |
CN (1) | CN108702863B (en) |
TW (1) | TWI732836B (en) |
WO (1) | WO2017164174A1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019077909A1 (en) * | 2017-10-16 | 2019-04-25 | タツタ電線株式会社 | Electroconductive adhesive |
CN109868077A (en) * | 2019-01-08 | 2019-06-11 | 信维通信(江苏)有限公司 | A kind of antifreeze plate and preparation method thereof |
WO2021177328A1 (en) * | 2020-03-03 | 2021-09-10 | タツタ電線株式会社 | Electromagnetic wave shielding film |
WO2023243621A1 (en) * | 2022-06-14 | 2023-12-21 | 株式会社スリーボンド | Electrically conductive resin composition and cured product thereof |
JP7506150B2 (en) | 2020-03-03 | 2024-06-25 | タツタ電線株式会社 | Electromagnetic wave shielding film |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05222346A (en) * | 1992-02-10 | 1993-08-31 | Surion Tec:Kk | Conductive pressure-sensitive adhesive tape |
JP2004263030A (en) * | 2003-02-28 | 2004-09-24 | Dainippon Ink & Chem Inc | Conductive pressure sensitive adhesive sheet |
JP2009079127A (en) * | 2007-09-26 | 2009-04-16 | Nitto Denko Corp | Conductive pressure-sensitive adhesive tape |
JP2009299186A (en) * | 2008-05-12 | 2009-12-24 | Nippon Steel Corp | Surface treated metal sheet |
JP2014056967A (en) * | 2012-09-13 | 2014-03-27 | Dic Corp | Conductive thin adhesive sheet |
WO2015076174A1 (en) * | 2013-11-20 | 2015-05-28 | Dic株式会社 | Conductive adhesive sheet and electronic device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4201548B2 (en) | 2002-07-08 | 2008-12-24 | タツタ電線株式会社 | SHIELD FILM, SHIELD FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR PRODUCING THEM |
JP2005277145A (en) * | 2004-03-25 | 2005-10-06 | Dainippon Ink & Chem Inc | Adhesive sheet for shielding electromagnetic wave |
JP4114706B2 (en) | 2005-02-18 | 2008-07-09 | 東洋インキ製造株式会社 | Electromagnetic wave shielding adhesive film, production method thereof, and electromagnetic wave shielding method for adherend |
JP4974803B2 (en) | 2007-08-03 | 2012-07-11 | タツタ電線株式会社 | Shield film for printed wiring board and printed wiring board |
KR20120125614A (en) * | 2009-12-29 | 2012-11-16 | 로저스코포레이션 | Conductive polymer foams, method of manufacture, and uses thereof |
JP2012178469A (en) | 2011-02-25 | 2012-09-13 | Ist Corp | Method of manufacturing radio wave absorber and radio wave absorber |
JPWO2013077108A1 (en) * | 2011-11-24 | 2015-04-27 | タツタ電線株式会社 | Shield film, shield printed wiring board, and method of manufacturing shield film |
CN204259357U (en) * | 2014-12-16 | 2015-04-08 | 苏州城邦达力材料科技有限公司 | A kind of electromagnetic shielding film with the coat of metal |
JP5861790B1 (en) | 2015-02-25 | 2016-02-16 | 東洋インキScホールディングス株式会社 | Electromagnetic shielding sheet, electromagnetic shielding wiring circuit board, and electronic equipment |
-
2017
- 2017-03-21 KR KR1020187020204A patent/KR102280175B1/en active IP Right Grant
- 2017-03-21 CN CN201780013187.0A patent/CN108702863B/en active Active
- 2017-03-21 WO PCT/JP2017/011234 patent/WO2017164174A1/en active Application Filing
- 2017-03-21 JP JP2018507336A patent/JP7023836B2/en active Active
- 2017-03-22 TW TW106109519A patent/TWI732836B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05222346A (en) * | 1992-02-10 | 1993-08-31 | Surion Tec:Kk | Conductive pressure-sensitive adhesive tape |
JP2004263030A (en) * | 2003-02-28 | 2004-09-24 | Dainippon Ink & Chem Inc | Conductive pressure sensitive adhesive sheet |
JP2009079127A (en) * | 2007-09-26 | 2009-04-16 | Nitto Denko Corp | Conductive pressure-sensitive adhesive tape |
JP2009299186A (en) * | 2008-05-12 | 2009-12-24 | Nippon Steel Corp | Surface treated metal sheet |
JP2014056967A (en) * | 2012-09-13 | 2014-03-27 | Dic Corp | Conductive thin adhesive sheet |
WO2015076174A1 (en) * | 2013-11-20 | 2015-05-28 | Dic株式会社 | Conductive adhesive sheet and electronic device |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019077909A1 (en) * | 2017-10-16 | 2019-04-25 | タツタ電線株式会社 | Electroconductive adhesive |
JP2019073622A (en) * | 2017-10-16 | 2019-05-16 | タツタ電線株式会社 | Conductive adhesive |
KR20200071104A (en) * | 2017-10-16 | 2020-06-18 | 타츠타 전선 주식회사 | Conductive adhesive |
KR102337623B1 (en) * | 2017-10-16 | 2021-12-09 | 타츠타 전선 주식회사 | conductive adhesive |
CN109868077A (en) * | 2019-01-08 | 2019-06-11 | 信维通信(江苏)有限公司 | A kind of antifreeze plate and preparation method thereof |
CN109868077B (en) * | 2019-01-08 | 2021-06-15 | 信维通信(江苏)有限公司 | Magnetic separation sheet and manufacturing method thereof |
WO2021177328A1 (en) * | 2020-03-03 | 2021-09-10 | タツタ電線株式会社 | Electromagnetic wave shielding film |
KR20220148802A (en) | 2020-03-03 | 2022-11-07 | 타츠타 전선 주식회사 | electromagnetic shielding film |
JP7506150B2 (en) | 2020-03-03 | 2024-06-25 | タツタ電線株式会社 | Electromagnetic wave shielding film |
WO2023243621A1 (en) * | 2022-06-14 | 2023-12-21 | 株式会社スリーボンド | Electrically conductive resin composition and cured product thereof |
Also Published As
Publication number | Publication date |
---|---|
JPWO2017164174A1 (en) | 2019-02-14 |
CN108702863B (en) | 2021-04-13 |
JP7023836B2 (en) | 2022-02-22 |
TW201802208A (en) | 2018-01-16 |
KR20180122597A (en) | 2018-11-13 |
CN108702863A (en) | 2018-10-23 |
TWI732836B (en) | 2021-07-11 |
KR102280175B1 (en) | 2021-07-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101956091B1 (en) | Electromagnetic wave shielding film | |
JP6467701B2 (en) | Electromagnetic wave shielding film, flexible printed wiring board with electromagnetic wave shielding film, and manufacturing method thereof | |
WO2017164174A1 (en) | Electromagnetic shielding film | |
JP6381117B2 (en) | Electromagnetic wave shielding film and method for producing flexible printed wiring board with electromagnetic wave shielding film | |
JP2017195278A (en) | Electromagnetic wave shielding film and printed wiring board with the same | |
JP2016063117A (en) | Electromagnetic wave shield film, electromagnetic wave shield film-attached flexible printed wiring board, and manufacturing methods thereof | |
WO2017111158A1 (en) | Electromagnetic wave shielding film and method for manufacturing same | |
WO2020090727A1 (en) | Electromagnetic wave shielding film, method of manufacturing shielded printed wiring board, and shielded printed wiring board | |
KR20200024121A (en) | Electromagnetic shielding film, and shielded printed wiring board having the same | |
WO2020090726A1 (en) | Electromagnetic shielding film, method for producing shielded printed wiring board, and shielded printed wiring board | |
JP2017212274A (en) | Electromagnetic wave shielding film and shielded printed wiring board including the same | |
JP2019121707A (en) | Electromagnetic wave shield film | |
JP2017147448A (en) | Metal foil for press adhesion, and electronic component package | |
JP6321944B2 (en) | Metal foil for press bonding and electronic component package | |
TW202135638A (en) | Electromagnetic wave shielding film | |
JP2018201056A (en) | Electromagnetic wave shield film, flexible printed wiring board with electromagnetic wave shield film, and manufacturing methods therefor | |
JP2018201055A (en) | Electromagnetic wave shield film, flexible printed circuit board with electromagnetic wave shield film, and manufacturing method therefor | |
JP7506150B2 (en) | Electromagnetic wave shielding film | |
JP6946437B2 (en) | Manufacturing method of connection film and shield printed wiring board, and shield printed wiring board | |
JP2021052083A (en) | Electromagnetic wave-shield film and circuit board | |
JP2019096684A (en) | Electromagnetic wave shield film |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2018507336 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20187020204 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17770216 Country of ref document: EP Kind code of ref document: A1 |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 17770216 Country of ref document: EP Kind code of ref document: A1 |