WO2017057372A1 - 光検出装置 - Google Patents
光検出装置 Download PDFInfo
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- WO2017057372A1 WO2017057372A1 PCT/JP2016/078476 JP2016078476W WO2017057372A1 WO 2017057372 A1 WO2017057372 A1 WO 2017057372A1 JP 2016078476 W JP2016078476 W JP 2016078476W WO 2017057372 A1 WO2017057372 A1 WO 2017057372A1
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- light
- fabry
- perot interference
- outer edge
- filter
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Classifications
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- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/12—Generating the spectrum; Monochromators
- G01J3/26—Generating the spectrum; Monochromators using multiple reflection, e.g. Fabry-Perot interferometer, variable interference filters
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
- G01J3/0213—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows using attenuators
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
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- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
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- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/21—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour by interference
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0304—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L31/03046—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds including ternary or quaternary compounds, e.g. GaAlAs, InGaAs, InGaAsP
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
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- G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/21—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour by interference
- G02F1/213—Fabry-Perot type
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
- H10N15/10—Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point
Definitions
- the present disclosure relates to a light detection device including a Fabry-Perot interference filter having a first mirror and a second mirror whose distances are variable.
- a Fabry-Perot interference filter having a first mirror and a second mirror whose distance from each other is variable, a photodetector that detects light transmitted through the Fabry-Perot interference filter, and a Fabry-Perot interference filter and a photodetector are housed.
- a photodetection device including a package and a light transmission portion arranged on the inner surface of the package so as to close the opening of the package (see, for example, Patent Document 1).
- stray light (light that does not pass through the light transmission region of the Fabry-Perot interference filter) is prevented from entering the photodetector from the viewpoint of improving the S / N ratio and resolution. Very important.
- the Fabry-Perot interference filter since the distance between the first mirror and the second mirror needs to be controlled with extremely high accuracy, the fluctuation of stress generated in the Fabry-Perot interference filter due to the change in the operating environment temperature is reduced. In order to suppress this, it is extremely important to make the temperature in the package uniform.
- an object of one embodiment of the present disclosure is to provide a light detection device having high light detection characteristics.
- a light detection device includes a first mirror and a second mirror that are variable in distance from each other, and transmits light according to the distance between the first mirror and the second mirror.
- a Fabry-Perot interference filter having a region provided on a predetermined line, a photodetector disposed on the first side of the Fabry-Perot interference filter on the line, and detecting light transmitted through the light transmission region;
- the outer edge of the Fabry-Perot interference filter is located outside the outer edge of the package opening, and the outer edge of the light transmitting portion including the bandpass filter is located outside the outer edge of the Fabry-Perot interference filter. ing. Accordingly, the side surface of the light transmitting portion (light incident surface and light of the light transmitting member facing each other in the direction parallel to the predetermined line) due to the incident angle of light at the opening of the package, diffraction at the opening of the package, etc. It is possible to suppress the light from entering the package via the surface (excluding the emission surface) and becoming stray light.
- this photodetection device has high photodetection characteristics.
- the light transmission unit further includes a light transmission member provided with a bandpass filter.
- the outer edge of the light transmission member is a fabric. It may be located outside the outer edge of the Perot interference filter. That is, the photodetection device (photodetection device on the first side surface) in this case has a first mirror and a second mirror whose distances are variable, and depends on the distance between the first mirror and the second mirror.
- a light transmission region for transmitting the transmitted light is provided on a predetermined line, and is disposed on one side (first side) of the Fabry-Perot interference filter on the line and transmits the light transmission region.
- a photodetector for detecting light an opening located on the other side (second side) of the Fabry-Perot interference filter on the line, a package for housing the Fabry-Perot interference filter and the photodetector, and an opening;
- a light transmitting member disposed on the inner surface of the package so as to close the bandpass filter provided on the light transmitting member, and when viewed from a direction parallel to the line, a Fabry-Perot interference filter
- the outer edge of the data is the outer edge of the opening is located outside the outer edge of the light transmitting member is located outside the outer edge of the Fabry-Perot interference filter.
- the outer edge of the Fabry-Perot interference filter is located outside the outer edge of the package opening, and the outer edge of the light transmitting member is located outside the outer edge of the Fabry-Perot interference filter.
- the heat capacity of the light transmissive member and the thermal connection area between the light transmissive member and the package are larger than when the outer edge of the light transmissive member is located inside the outer edge of the Fabry-Perot interference filter. As a result, the temperature in the package can be made uniform. As described above, in the light detection device of the first side surface, the light detection characteristics are improved.
- the outer edge of the bandpass filter may be located outside the outer edge of the Fabry-Perot interference filter when viewed from a direction parallel to the line. This ensures that the light incident on the light transmission region of the Fabry-Perot interference filter has passed through the bandpass filter.
- the thickness of the light transmission member may be a value equal to or greater than a value obtained by multiplying the distance between the Fabry-Perot interference filter and the light transmission member by 0.5.
- the Fabry-Perot interference filter has a silicon substrate that supports the first mirror and the second mirror, and the photodetector has an InGaAs substrate on which a photoelectric conversion region is formed.
- a photodetector having an InGaAs substrate in which a photoelectric conversion region is formed can detect, for example, light having a wavelength shorter than 1200 nm and light having a wavelength longer than 1,200 nm compared to light having a wavelength shorter than 1,200 nm. And high sensitivity. However, the photodetector has higher sensitivity to light having a wavelength shorter than 1200 nm as compared to light having a wavelength longer than 2100 nm.
- the silicon substrate has higher absorptivity for light having a wavelength shorter than 1200 nm compared to light having a wavelength of 1200 nm or more (depending on the manufacturing method, thickness, and impurity concentration of the silicon substrate, In particular, it has high absorptivity for light having a wavelength shorter than 1100 nm). Therefore, for example, when light having a wavelength of 1200 nm or more and 2100 nm or less is to be detected, the silicon substrate of the Fabry-Perot interference filter can function as a high-pass filter. By the effect, the photodetector can be reliably suppressed from detecting noise light (light having a wavelength shorter than 1200 nm (particularly shorter than 1100 nm) and light having a wavelength longer than 2100 nm).
- the bandpass filter may be provided on the light emitting surface of the light transmitting member. As a result, it is possible to prevent the bandpass filter from being damaged due to physical interference from the outside.
- the light detection device on the first side surface may further include a lead pin that penetrates the package, and a wire that electrically connects a terminal of the Fabry-Perot interference filter and the lead pin.
- a lead pin that penetrates the package
- a wire that electrically connects a terminal of the Fabry-Perot interference filter and the lead pin.
- An optical detection device further includes an adhesive member, the shape of the bandpass filter is a polygonal plate, and the package includes a first wall portion in which an opening is formed, a Fabry-Perot interference filter, An adhesive member having a second wall portion facing the first wall portion across the bandpass filter and the photodetector, and a cylindrical side wall portion surrounding the Fabry-Perot interference filter, the bandpass filter and the photodetector
- the bandpass filter is fixed to the inner surface of the first wall, and when viewed from a direction parallel to the line, the outer edge of the bandpass filter is located outside the outer edge of the Fabry-Perot interference filter. It may be.
- the photodetection device (photodetection device on the second side surface) in this case has a first mirror and a second mirror whose distances are variable, and depends on the distance between the first mirror and the second mirror. And a Fabry-Perot interference filter provided with a light transmission region on a predetermined line, and the one side (second side) of the Fabry-Perot interference filter on the line, and enter the light transmission region.
- a polygonal plate-shaped bandpass filter that transmits light, a photodetector that is disposed on the other side (first side) of the Fabry-Perot interference filter on the line, and detects light transmitted through the light transmission region;
- a first wall portion having an opening (light incident opening) located on one side of the bandpass filter on the line, a first wall portion sandwiching the Fabry-Perot interference filter, the bandpass filter, and the photodetector
- the outer edge of the Fabry-Perot interference filter is located outside the outer edge of the opening when viewed from a direction parallel to the line, and the outer edge of the bandpass filter is the outer edge of the Fabry-Perot interference filter. It is located outside.
- the bandpass filter In a photodetection device as described in the background art, for example, in order to obtain a spectrum for light in a predetermined wavelength range, it is necessary for the bandpass filter to transmit only light in the wavelength range. That is, in order to improve the light detection characteristics of the light detection device, it is important to make the bandpass filter function properly.
- the shape of the side wall portion of the package is a cylindrical shape
- the shape of the bandpass filter is a polygonal plate shape.
- the bandpass is compared with the distance between each side surface of the bandpass filter (the surface excluding the light incident surface and the light exit surface of the bandpass filter facing each other in the direction parallel to the predetermined line) and the inner surface of the side wall.
- the distance between each corner of the filter (corner formed by adjacent side surfaces) and the inner surface of the side wall is reduced. Therefore, the band pass filter fixed to the inner surface of the first wall portion of the package is positioned with high accuracy by each corner portion.
- the shape of the bandpass filter is a circular plate
- the distance between the side surface of the bandpass filter and the inner surface of the side wall portion is reduced.
- the diameter of the pass filter is increased, the following problem occurs.
- the bandpass filter since the area of the light incident surface of the bandpass filter that is thermally connected to the inner surface of the first wall portion of the package is increased, the bandpass filter is subjected to thermal influence (deformation by heat, etc.) from the package. It becomes easy.
- the shape of the bandpass filter is a polygonal plate shape
- the area of the light incident surface of the bandpass filter thermally connected to the inner surface of the first wall portion of the package is, for example, that of the bandpass filter. Since the shape is smaller than that of a circular plate shape, the bandpass filter is less susceptible to thermal influence from the package.
- the outer edge of the Fabry-Perot interference filter is located outside the outer edge of the opening, and the outer edge of the bandpass filter is located outside the outer edge of the Fabry-Perot interference filter. It is guaranteed that the light incident on the region has passed through the bandpass filter. As described above, according to the photodetecting device of the second aspect, the bandpass filter can function properly.
- the light detection device on the second side surface further includes a light transmission member disposed on the inner surface of the first wall portion so as to close the opening, and the bandpass filter is fixed to the inner surface of the light transmission member by an adhesive member.
- the adhesive member may be disposed in the entire region of the light incident surface of the bandpass filter facing the inner surface of the light transmitting member. According to this configuration, since the adhesive member is disposed in the entire region of the light incident surface of the bandpass filter, the bandpass filter is securely fixed to the inner surface of the first wall portion. In addition, even if bubbles are generated in the adhesive member during manufacturing, the bubbles are easily removed from between the side surfaces of the bandpass filter and the inner surface of the side wall portion, so light scattering and diffraction at the adhesive member are suppressed. The Furthermore, according to this configuration, since the light transmitting member is provided, the hermeticity of the package is improved. Further, since the bandpass filter is fixed to the inner surface of the light transmission member, it is less susceptible to thermal influence from the package.
- the light detection device of the second side further includes a light transmission member disposed on the inner surface of the first wall so as to close the opening, and the bandpass filter is fixed to the inner surface of the light transmission member by an adhesive member.
- the adhesive member is not disposed in the region other than the corner region on the light incident surface of the bandpass filter facing the inner surface of the light transmitting member, and may be disposed in the corner region. According to this configuration, since the adhesive member is not disposed in a region other than the corner region on the light incident surface of the bandpass filter, light scattering and diffraction at the adhesive member are more reliably suppressed. Furthermore, according to this configuration, since the light transmitting member is provided, the hermeticity of the package is improved.
- the bandpass filter is fixed to the inner surface of the light transmitting member, and the adhesive member is not disposed in the region other than the corner region of the light incident surface of the bandpass filter, so that the thermal influence from the package Is more difficult to receive.
- the bandpass filter is fixed to the inner surface of the first wall portion by an adhesive member, and the adhesive member is a light incident surface of the bandpass filter facing the inner surface of the first wall portion. Of these, it may be arranged in a region excluding a facing region facing the opening. According to this configuration, since the adhesive member is disposed in a region of the light incident surface of the bandpass filter excluding the facing region facing the opening, the bandpass filter is reliably secured to the inner surface of the first wall portion. It becomes a fixed state. In addition, even if bubbles are generated in the adhesive member at the time of manufacture, the bubbles are easily removed not only between the respective side surfaces of the bandpass filter and the inner surface of the side wall portion but also from the opening. Diffraction and the like are suppressed.
- the bandpass filter is fixed to the inner surface of the first wall portion by an adhesive member, and the adhesive member is a light incident surface of the bandpass filter facing the inner surface of the first wall portion.
- the adhesive member is not arranged in the area excluding the corner area, but may be arranged in the corner area. According to this configuration, since the adhesive member is not disposed in a region other than the corner region on the light incident surface of the bandpass filter, light scattering and diffraction at the adhesive member are more reliably suppressed.
- the adhesive member protrudes outward from the outer edge of the bandpass filter when viewed from a direction parallel to the line, and protrudes outward from the outer edge of the bandpass filter among the adhesive members.
- the portion may be in contact with the side surface of the bandpass filter. According to this configuration, the bandpass filter is more reliably fixed.
- the shape of the opening may be circular when viewed from a direction parallel to the line. According to this configuration, the intensity profile of light incident on the package is made uniform.
- the shape of the bandpass filter may be a square plate. According to this structure, the thermal influence given to a band pass filter from a package can be effectively suppressed, ensuring the stability of fixation of the band pass filter with respect to the inner surface of the 1st wall part of a package.
- the package may be formed of a metal material. According to this configuration, the hermeticity of the package is improved and electrical shielding is facilitated. If the package is made of a metal material, the package has a higher thermal conductivity. However, as described above, the shape of the side wall of the package is cylindrical, whereas the shape of the bandpass filter is large. Due to the square plate shape, the band-pass filter is not easily affected by heat from the package.
- FIG. 1 is a cross-sectional view of the photodetecting device according to the first embodiment.
- FIG. 2 is a plan view of the photodetecting device of FIG.
- FIG. 3 is a perspective view of a Fabry-Perot interference filter of the light detection device of FIG.
- FIG. 4 is a cross-sectional view of the Fabry-Perot interference filter taken along line IV-IV in FIG.
- FIG. 5 is a cross-sectional view of the photodetecting device of the second embodiment.
- FIG. 6 is a cross-sectional view of a modification of the photodetecting device according to the second embodiment.
- FIG. 7 is a cross-sectional view of the photodetection device according to the third embodiment.
- FIG. 8 is an enlarged view of a part of the photodetecting device of FIG. FIG.
- FIG. 9 is a plan view of the photodetecting device of FIG.
- FIG. 10 is a perspective view of a Fabry-Perot interference filter of the light detection device of FIG.
- FIG. 11 is a cross-sectional view of the Fabry-Perot interference filter taken along line XI-XI in FIG.
- FIG. 12 is a cross-sectional view of the photodetection device according to the fourth embodiment.
- FIG. 13 is a plan view of the photodetecting device of FIG.
- FIG. 14 is a cross-sectional view of the photodetecting device of the fifth embodiment.
- FIG. 15 is a plan view of the photodetecting device of FIG.
- FIG. 16 is a cross-sectional view of the light detection device according to the sixth embodiment.
- FIG. 17 is a plan view of the photodetector in FIG.
- the light detection device 1 ⁇ / b> A includes a package 2.
- the package 2 is a CAN package having a stem 3 and a cap 4.
- the cap 4 is integrally formed by the side wall 5 and the top wall 6.
- the top wall 6 faces the stem 3 in a direction parallel to the predetermined line L.
- the stem 3 and the cap 4 are made of, for example, metal and are airtightly joined to each other.
- a wiring board 7 is fixed to the inner surface 3 a of the stem 3.
- a substrate material of the wiring substrate 7 for example, silicon, ceramic, quartz, glass, plastic, or the like can be used.
- a photodetector 8 and a temperature compensation element (not shown) such as a thermistor are mounted on the wiring board 7, a photodetector 8 and a temperature compensation element (not shown) such as a thermistor are mounted.
- the photodetector 8 is disposed on the line L. More specifically, the photodetector 8 is arranged so that the center line of the light receiving portion coincides with the line L.
- the photodetector 8 is an infrared detector such as a quantum sensor using InGaAs or the like, or a thermal sensor using a thermopile or bolometer.
- a silicon photodiode When detecting light in each of the ultraviolet, visible, and near-infrared wavelength regions, for example, a silicon photodiode can be used as the photodetector 8.
- the photodetector 8 may be provided with one light receiving portion, or a plurality of light receiving portions may be provided in an array. Furthermore, a plurality of photodetectors 8 may be mounted on the wiring board 7.
- a plurality of spacers 9 are fixed on the wiring board 7.
- a material of each spacer 9 for example, silicon, ceramic, quartz, glass, plastic, or the like can be used.
- a Fabry-Perot interference filter 10 is fixed on the plurality of spacers 9 by, for example, an adhesive.
- the Fabry-Perot interference filter 10 is disposed on the line L. More specifically, the Fabry-Perot interference filter 10 is arranged so that the center line of the light transmission region 10a coincides with the line L.
- the spacer 9 may be integrally formed with the wiring board 7.
- the Fabry-Perot interference filter 10 may be supported by one spacer 9 instead of the plurality of spacers 9.
- a plurality of lead pins 11 are fixed to the stem 3. More specifically, each lead pin 11 penetrates the stem 3 while maintaining electrical insulation and airtightness with the stem 3.
- Each lead pin 11 is electrically connected with an electrode pad provided on the wiring board 7, a terminal of the photodetector 8, a terminal of the temperature compensation element, and a terminal of the Fabry-Perot interference filter 10 by wires 12. ing. Thereby, it is possible to input / output electric signals to / from each of the photodetector 8, the temperature compensating element, and the Fabry-Perot interference filter 10.
- the package 2 has an opening 2a. More specifically, the opening 2 a is provided in the top wall 6 of the cap 4 so that the center line thereof coincides with the line L.
- a light transmitting member 13 is disposed on the inner surface 6a of the top wall 6 so as to close the opening 2a.
- the light transmitting member 13 is airtightly joined to the inner surface 6 a of the top wall 6.
- the light transmission member 13 transmits at least light in the measurement wavelength range of the light detection device 1A.
- the light transmitting member 13 is a plate-like member including a light incident surface 13a, a light emitting surface 13b, and a side surface 13c that face each other in a direction parallel to the line L.
- the light transmitting member 13 is made of, for example, glass, quartz, silicon, germanium, plastic, or the like.
- a band pass filter 14 is provided on the light emitting surface 13 b of the light transmitting member 13.
- the bandpass filter 14 is disposed on the light emitting surface 13b of the light transmitting member 13 by, for example, vapor deposition or pasting.
- the bandpass filter 14 selectively transmits light in the measurement wavelength range of the photodetecting device 1A.
- the bandpass filter 14 is a dielectric multilayer film made of a combination of a high refractive material such as TiO 2 or Ta 2 O 5 and a low refractive material such as SiO 2 or MgF 2 .
- the light transmission member 100 and the band pass filter 14 constitute the light transmission unit 100. That is, the light transmission unit 100 includes a band-pass filter 14 that transmits light incident on the light transmission region 10 a of the Fabry-Perot interference filter 10.
- the package 2 contains a wiring board 7, a photo detector 8, a temperature compensating element (not shown), a plurality of spacers 9, and a Fabry-Perot interference filter 10.
- the photodetector 8 is located on one side (first side) of the Fabry-Perot interference filter 10 on the line L, and the opening 2 a and the light transmission member 13 are on the line L. It is located on the other side (second side) of the Perot interference filter 10.
- the thickness T of the light transmitting member 13 (the thickness in the direction parallel to the line L, the distance between the light incident surface 13a and the light emitting surface 13b) is the distance D1 (fabric between the Fabry-Perot interference filter 10 and the light transmitting member 13).
- the distance between the surface of the Perot interference filter 10 on the light transmitting member 13 side and the light emitting surface 13b of the light transmitting member 13) is a value equal to or greater than 0.5.
- the thickness T of the light transmitting member 13 is determined by the distance D2 between the Fabry-Perot interference filter 10 and the photodetector 8 (the surface of the Fabry-Perot interference filter 10 on the side of the photodetector 8 and the Fabry-Perot interference of the photodetector 8).
- the distance is equal to or greater than the distance to the surface on the filter 10 side.
- the positional relationship and the size relationship of each part when viewed from the direction parallel to the line L are as follows. As shown in FIG. 2, the center line of the opening 2 a, the center line of the light transmission member 13, the center line of the band pass filter 14, the center line of the light transmission region 10 a of the Fabry-Perot interference filter 10, and the light detector 8 The center line of the light receiving unit coincides with the line L.
- the outer edge of the opening 2a and the light transmission region 10a of the Fabry-Perot interference filter 10 is, for example, circular.
- the outer edges of the light transmission member 13, the bandpass filter 14, the Fabry-Perot interference filter 10, and the photodetector 8 are, for example, rectangular.
- the outer edge of the light transmission region 10 a of the Fabry-Perot interference filter 10 is located outside the outer edge of the photodetector 8.
- the outer edge of the opening 2 a is located outside the outer edge of the light transmission region 10 a of the Fabry-Perot interference filter 10.
- the outer edge of the bandpass filter 14 is located outside the outer edge of the opening 2a.
- the outer edge of the Fabry-Perot interference filter 10 is located outside the outer edge of the opening 2a.
- the outer edge of the Fabry-Perot interference filter 10 is located outside the outer edge of the photodetector 8.
- the outer edge of the bandpass filter 14 is located outside the outer edge of the Fabry-Perot interference filter 10.
- the outer edge of the light transmitting member 13 is located outside the outer edge of the Fabry-Perot interference filter 10.
- the outer edge of the light transmission member 13 and the outer edge of the bandpass filter 14 coincide.
- “when viewed from a predetermined direction, one outer edge is located outside of the other outer edges” means that “one outer edge surrounds the other outer edge when viewed from a predetermined direction”. Means that “one outer edge includes another outer edge when viewed from a predetermined direction”.
- the light detection apparatus 1A configured as described above, when light enters the light transmission region 10a of the Fabry-Perot interference filter 10 from the outside via the opening 2a, the light transmission member 13, and the bandpass filter 14, a predetermined value is obtained. Is selectively transmitted (details will be described later).
- the light transmitted through the light transmission region 10 a of the Fabry-Perot interference filter 10 enters the light receiving portion of the photodetector 8 and is detected by the photodetector 8. [Configuration of Fabry-Perot interference filter]
- a light transmission region 10a that transmits light according to the distance between the first mirror and the second mirror is provided on the line L.
- the distance between the first mirror and the second mirror is controlled with extremely high accuracy. That is, the light transmission region 10a can control the distance between the first mirror and the second mirror to a predetermined distance in order to selectively transmit light having a predetermined wavelength in the Fabry-Perot interference filter 10.
- This region is a region through which light having a predetermined wavelength according to the distance between the first mirror and the second mirror can be transmitted.
- the Fabry-Perot interference filter 10 includes a substrate 21. On the light incident side surface 21a of the substrate 21, an antireflection layer 31, a first stacked body 32, an intermediate layer 33, and a second stacked body 34 are stacked in this order. A gap (air gap) S is formed by the frame-shaped intermediate layer 33 between the first stacked body 32 and the second stacked body 34.
- the substrate 21 is made of, for example, silicon, quartz, glass or the like.
- the antireflection layer 31 and the intermediate layer 33 are made of, for example, silicon oxide.
- the thickness of the intermediate layer 33 may be an integral multiple of 1/2 of the center transmission wavelength (that is, the center wavelength of the wavelength range that can be transmitted by the Fabry-Perot interference filter 10).
- the portion of the first stacked body 32 corresponding to the light transmission region 10 a functions as the first mirror 35.
- the first mirror 35 is supported on the substrate 21 via the antireflection layer 31.
- the first stacked body 32 is configured by alternately stacking a plurality of polysilicon layers and a plurality of silicon nitride layers one by one. Each optical thickness of the polysilicon layer and the silicon nitride layer constituting the first mirror 35 may be an integral multiple of 1/4 of the center transmission wavelength. Note that a silicon oxide layer may be used instead of the silicon nitride layer.
- the portion of the second stacked body 34 corresponding to the light transmission region 10a functions as the second mirror 36 that faces the first mirror 35 with the gap S therebetween.
- the second mirror 36 is supported on the substrate 21 via the antireflection layer 31, the first stacked body 32, and the intermediate layer 33.
- the second stacked body 34 is configured by alternately stacking a plurality of polysilicon layers and a plurality of silicon nitride layers one by one.
- the optical thickness of each of the polysilicon layer and the silicon nitride layer constituting the second mirror 36 may be an integral multiple of 1/4 of the center transmission wavelength. Note that a silicon oxide layer may be used instead of the silicon nitride layer.
- a plurality of through holes (not shown) extending from the surface 34 a of the second stacked body 34 to the space S are provided in a portion corresponding to the space S in the second stacked body 34.
- the plurality of through holes are formed to such an extent that the function of the second mirror 36 is not substantially affected.
- the plurality of through-holes are used for forming a void S by removing a part of the intermediate layer 33 by etching.
- the first electrode 22 is formed on the first mirror 35 so as to surround the light transmission region 10a.
- a second electrode 23 is formed on the first mirror 35 so as to include the light transmission region 10a.
- the first electrode 22 and the second electrode 23 are formed by doping the polysilicon layer with impurities to reduce the resistance.
- the size of the second electrode 23 may be a size including the entire light transmission region 10a, or may be substantially the same as the size of the light transmission region 10a.
- the third electrode 24 is formed on the second mirror 36.
- the third electrode 24 faces the first electrode 22 and the second electrode 23 with the gap S in the direction parallel to the line L.
- the third electrode 24 is formed by doping the polysilicon layer with impurities to reduce the resistance.
- the second electrode 23 is located on the opposite side of the first electrode 22 from the third electrode 24 in the direction parallel to the line L. That is, the first electrode 22 and the second electrode 23 are not located on the same plane in the first mirror 35. The second electrode 23 is farther from the third electrode 24 than the first electrode 22.
- a pair of terminals 25 are provided so as to face each other with the light transmission region 10a interposed therebetween.
- Each terminal 25 is disposed in a through hole extending from the surface 34 a of the second stacked body 34 to the first stacked body 32.
- Each terminal 25 is electrically connected to the first electrode 22 via a wiring 22a.
- a pair of terminals 26 are provided so as to face each other with the light transmission region 10a interposed therebetween.
- Each terminal 26 is disposed in a through hole extending from the surface 34 a of the second stacked body 34 to the front of the intermediate layer 33.
- Each terminal 26 is electrically connected to the second electrode 23 via the wiring 23a and is also electrically connected to the third electrode 24 via the wiring 24a.
- the direction in which the pair of terminals 25 face each other and the direction in which the pair of terminals 26 face each other are orthogonal (see FIG. 3).
- the trenches 27 and 28 are provided on the surface 32 a of the first stacked body 32.
- the trench 27 extends in an annular shape so as to surround the wiring 23 a extending from the terminal 26 along the direction parallel to the line L.
- the trench 27 electrically insulates the first electrode 22 and the wiring 23a.
- the trench 28 extends in a ring shape along the inner edge of the first electrode 22.
- the trench 28 electrically insulates the first electrode 22 and a region inside the first electrode 22.
- the region in each of the trenches 27 and 28 may be an insulating material or a gap.
- a trench 29 is provided on the surface 34 a of the second stacked body 34.
- the trench 29 extends in an annular shape so as to surround the terminal 25.
- the trench 29 electrically insulates the terminal 25 from the third electrode 24.
- the region in the trench 28 may be an insulating material or a gap.
- An antireflection layer 41, a third laminated body 42, an intermediate layer 43, and a fourth laminated body 44 are laminated in this order on the surface 21b on the light emitting side of the substrate 21.
- the antireflection layer 41 and the intermediate layer 43 have the same configurations as the antireflection layer 31 and the intermediate layer 33, respectively.
- the third stacked body 42 and the fourth stacked body 44 have symmetrical stacked structures with the first stacked body 32 and the second stacked body 34, respectively, with respect to the substrate 21.
- the antireflection layer 41, the third stacked body 42, the intermediate layer 43, and the fourth stacked body 44 have a function of suppressing the warpage of the substrate 21.
- the opening 40a is provided in the antireflection layer 41, the third laminated body 42, the intermediate layer 43, and the fourth laminated body 44 so as to include the light transmission region 10a.
- the opening 40a has a diameter substantially the same as the size of the light transmission region 10a.
- the opening 40 a is opened on the light emitting side, and the bottom surface of the opening 40 a reaches the antireflection layer 41.
- a light shielding layer 45 is formed on the light emitting surface of the fourth stacked body 44.
- the light shielding layer 45 is made of, for example, aluminum.
- a protective layer 46 is formed on the surface of the light shielding layer 45 and the inner surface of the opening 40a.
- the protective layer 46 is made of, for example, aluminum oxide. Note that the optical influence of the protective layer 46 can be ignored by setting the thickness of the protective layer 46 to 1 to 100 nm (preferably about 30 nm).
- the Fabry-Perot interference filter 10 configured as described above, when a voltage is applied between the first electrode 22 and the third electrode 24 via the terminals 25 and 26, an electrostatic force corresponding to the voltage is generated. Occurs between the first electrode 22 and the third electrode 24. Due to the electrostatic force, the second mirror 36 is attracted to the first mirror 35 fixed to the substrate 21, and the distance between the first mirror 35 and the second mirror 36 is adjusted. Thus, in the Fabry-Perot interference filter 10, the distance between the first mirror 35 and the second mirror 36 is variable.
- the wavelength of light transmitted through the Fabry-Perot interference filter 10 depends on the distance between the first mirror 35 and the second mirror 36 in the light transmission region 10a. Therefore, by adjusting the voltage applied between the first electrode 22 and the third electrode 24, the wavelength of the transmitted light can be appropriately selected.
- the second electrode 23 is at the same potential as the third electrode 24. Therefore, the second electrode 23 functions as a compensation electrode for keeping the first mirror 35 and the second mirror 36 flat in the light transmission region 10a.
- the Fabry-Perot interference filter is changed while changing the voltage applied to the Fabry-Perot interference filter 10 (that is, while changing the distance between the first mirror 35 and the second mirror 36 in the Fabry-Perot interference filter 10).
- the photodetector 8 By detecting the light transmitted through the ten light transmission regions 10a with the photodetector 8, a spectral spectrum can be obtained.
- the outer edge of the chip-shaped Fabry-Perot interference filter 10 is located outside the outer edge of the opening 2a of the package 2, and the outer edge of the light transmitting member 13 (the outer edge of the light transmitting portion 100) is the Fabry-Perot. It is located outside the outer edge of the interference filter 10. Thereby, it is possible to prevent light from entering the package 2 and becoming stray light due to the incident angle of light at the opening 2a, diffraction at the opening 2a, and the like through the side surface 13c of the light transmitting member 13. it can.
- the light detection device 1A it is possible to suppress the light that has become stray light due to the incident angle of light at the opening 2a, diffraction at the opening 2a, and the like from entering the photodetector 8. Further, for example, as compared with the case where the outer edge of the light transmitting member 13 is located inside the outer edge of the Fabry-Perot interference filter 10, the heat capacity of the light transmitting member 13 and the thermal connection between the light transmitting member 13 and the package 2. Since the area is increased, the temperature in the package 2 can be made uniform as a result. As described above, in the light detection device 1A, the light detection characteristics are improved.
- a part of the light incident on the opening 2a of the package 2 includes an incident angle of the light at the opening 2a, a side surface of the opening 2a, and an emission side corner (a corner where the side surface of the opening 2a and the inner surface 6a of the top wall 6 intersect). ) May be emitted from the side surface 13c of the light transmitting member 13 into the package 2.
- an incident angle of the light at the opening 2a a side surface of the opening 2a
- an emission side corner a corner where the side surface of the opening 2a and the inner surface 6a of the top wall 6 intersect.
- the light emitted from the side surface 13c of the light transmitting member 13 into the package 2 is light. Is easily scattered light and incident on the photodetector 8.
- the outer edge of the Fabry-Perot interference filter 10 is positioned outside the outer edge of the opening 2 a of the package 2, and the outer edge of the light transmission member 13 is outside the outer edge of the Fabry-Perot interference filter 10. Is located.
- the light transmission member 13 compared with the case where the outer edge of the light transmission member 13 is located inside the outer edge of the Fabry-Perot interference filter 10, for example, the light transmission member 13 from the light transmission region 10 a of the Fabry-Perot interference filter 10 and the photodetector 8.
- the side surface 13c is moved away. Therefore, the incidence of stray light on the photodetector 8 is suppressed, and the S / N ratio and the resolution are improved.
- the temperature uniformity in the package 2 will be described more specifically.
- the volume of the package 2 itself is increased.
- the heat capacity of the light transmitting member 13 and the thermal connection area between the light transmitting member 13 and the package 2 are increased, while the volume of the space in the package 2 is decreased.
- the volume of the package 2 itself which is made of metal, has high thermal conductivity, and is easily maintained at a uniform temperature as a whole (heat is likely to spread throughout), is increased.
- the thermal connection area between the light transmissive member 13 and the package 2 is large, heat is easily transmitted from the package 2 to the light transmissive member 13, and the light transmissive member 13 is also kept at a uniform temperature with the package 2. Further, since the volume of the space in the package 2 is small, the temperature of the space in the package 2 (and the constituent elements such as the Fabry-Perot interference filter 10 disposed therein) is also maintained at a uniform temperature. Due to the influence of the light transmitting member 13, it is kept uniform. Furthermore, temporal change in temperature is suppressed by the light transmitting member 13 and the package 2 having a large heat capacity. By these actions, the temperature in the package 2 becomes thermally uniform, and the thermal characteristics of the photodetector 1A are stabilized.
- the outer edge of the bandpass filter 14 when viewed from a direction parallel to the line L, the outer edge of the bandpass filter 14 is positioned outside the outer edge of the Fabry-Perot interference filter 10. This ensures that the light incident on the light transmission region 10 a of the Fabry-Perot interference filter 10 has transmitted through the bandpass filter 14.
- the outer edge of the light transmission region 10 a of the Fabry-Perot interference filter 10 is located outside the outer edge of the photodetector 8.
- the outer edge of the opening 2 a is located outside the outer edge of the light transmission region 10 a of the Fabry-Perot interference filter 10.
- the outer edge of the bandpass filter 14 is located outside the outer edge of the opening 2a. This ensures that the light incident on the photodetector 8 through the aperture 2a and the light transmission region 10a of the Fabry-Perot interference filter 10 has transmitted through the bandpass filter 14.
- the outer edge of the Fabry-Perot interference filter 10 is located outside the outer edge of the photodetector 8. Thereby, it can suppress that the light which does not permeate
- the thickness T of the light transmission member 13 is a value equal to or greater than a value obtained by multiplying the distance D1 between the Fabry-Perot interference filter 10 and the light transmission member 13 by 0.5.
- the thickness T is a value equal to or greater than the value obtained by multiplying the distance D1 by 0.7 in order to further uniform the temperature in the package 2 and further suppress the incidence of stray light on the photodetector 8. It is more preferable that the value is more than the distance D1.
- the thickness T of the light transmission member 13 is a value equal to or greater than the distance D2 between the Fabry-Perot interference filter 10 and the light detector 8.
- the band pass filter 14 is provided on the light emitting surface 13 b of the light transmitting member 13. As a result, it is possible to prevent the band-pass filter 14 from being damaged due to physical interference from the outside.
- the terminals 25 and 26 of the Fabry-Perot interference filter 10 and the lead pins 11 are electrically connected by wires 12.
- the outer edge of the Fabry-Perot interference filter 10 is positioned outside the outer edge of the opening 2 a of the package 2, and the outer edge of the light transmission member 13 is more than the outer edge of the Fabry-Perot interference filter 10. Is also located on the outside. Therefore, even if the wire 12 is bent, the contact between the wire 12 and the package 2 can be prevented.
- the photodetector 8 having an InGaAs substrate in which a photoelectric conversion region is formed is, for example, a light having a wavelength of 1200 nm or more and 2100 nm or less as compared with light having a wavelength shorter than 1200 nm and light having a wavelength longer than 2100 nm. It has high sensitivity.
- the photodetector 8 has higher sensitivity to light having a wavelength shorter than 1200 nm as compared to light having a wavelength longer than 2100 nm.
- the silicon substrate has higher absorptivity for light having a wavelength shorter than 1200 nm compared to light having a wavelength of 1200 nm or more (depending on the manufacturing method, thickness, and impurity concentration of the silicon substrate, In particular, it has high absorptivity for light having a wavelength shorter than 1100 nm). Therefore, for example, when light having a wavelength of 1200 nm or more and 2100 nm or less is to be detected, the silicon substrate of the Fabry-Perot interference filter 10 can function as a high-pass filter.
- the light detection device 1 ⁇ / b> B is different from the above-described light detection device 1 ⁇ / b> A in the configuration of the light transmission member 13 and the band pass filter 14.
- the light transmitting member 13 disposed on the inner surface of the package 2 reaches the inside of the opening 2 a and the inner surface 5 a of the side wall 5.
- the light incident surface 13a of the light transmitting member 13 is substantially flush with the outer surface of the top wall 6 at the opening 2a.
- Such a light transmission member 13 is formed by disposing a glass pellet inside the cap 4 with the opening 2a on the lower side and melting the glass pellet. That is, the light transmission member 13 is made of fused glass.
- the band pass filter 14 extends from the light emitting surface 13 b of the light transmitting member 13 to a part of the inner surface 5 a of the side wall 5 of the cap 4.
- the light transmission portion 100 is configured by the light transmission member 13 and the bandpass filter 14 as in the above-described light detection device 1A. That is, the light transmission unit 100 includes a band-pass filter 14 that transmits light incident on the light transmission region 10 a of the Fabry-Perot interference filter 10.
- the thickness T of the light transmission member 13 is a value equal to or larger than a value obtained by multiplying the distance D1 between the Fabry-Perot interference filter 10 and the light transmission member 13 by 0.5.
- the thickness T of the light transmission member 13 is a value equal to or greater than the distance D2 between the Fabry-Perot interference filter 10 and the photodetector 8.
- the outer edge of the light transmission region 10 a of the Fabry-Perot interference filter 10 is located outside the outer edge of the photodetector 8.
- the outer edge of the opening 2 a is located outside the outer edge of the light transmission region 10 a of the Fabry-Perot interference filter 10.
- the outer edge of the bandpass filter 14 is located outside the outer edge of the opening 2a.
- the outer edge of the Fabry-Perot interference filter 10 is located outside the outer edge of the opening 2a.
- the outer edge of the Fabry-Perot interference filter 10 is located outside the outer edge of the photodetector 8.
- the outer edge of the bandpass filter 14 is located outside the outer edge of the Fabry-Perot interference filter 10.
- the outer edge of the light transmitting member 13 is located outside the outer edge of the Fabry-Perot interference filter 10.
- the operation and effect similar to those of the above-described light detection device 1A are also exhibited by the light detection device 1B.
- the side surface 13c of the light transmitting member 13 reaches the inner surface 5a of the side wall 5
- light is transmitted through the side surface 13c of the light transmitting member 13 due to the incident angle of light at the opening 2a, diffraction at the opening 2a, and the like.
- the heat capacity of the light transmissive member 13 and the thermal connection area between the light transmissive member 13 and the package 2 become larger, as a result, the temperature in the package 2 can be made more uniform.
- the volume (particularly, the thickness T) of the light transmission member 13 is large, the planarity of the light incident surface 13a and the light emission surface 13b of the light transmission member 13 made of fused glass is improved. be able to. Furthermore, even if bubbles generated at the time of formation remain in the light transmitting member 13 made of fused glass, the light transmitting member 13 has a large volume (particularly, thickness T), so that the influence of the bubbles can be reduced. it can.
- the plate-shaped band pass filter 14 may be affixed with the adhesive agent etc. on the light-projection surface 13b of the light transmissive member 13 like the optical detection apparatus 1C shown by FIG.
- the plate-like bandpass filter 14 is formed by forming a dielectric multilayer film on the surface of a light transmission member made of, for example, silicon or glass. In the light transmission member 13 made of fused glass, the flatness of the light exit surface 13b is improved because the thickness T is large, and therefore the bandpass filter 14 can be suitably disposed on the light exit surface 13b. .
- the heat capacity is increased by the plate-shaped bandpass filter 14, and the volume of the space in the package 2 is further reduced, so that the temperature in the package 2 can be made more uniform. . Furthermore, since the distance between the bandpass filter 14 and the Fabry-Perot interference filter 10 is reduced by the thickness of the light transmission member constituting the plate-shaped bandpass filter 14, the light transmission region 10a of the Fabry-Perot interference filter 10 is reduced. It is more reliably guaranteed that the light incident on the light passes through the band-pass filter 14.
- the light transmission portion 100 is configured by the light transmission member 13 and the band-pass filter 14 as in the above-described light detection device 1A. That is, the light transmission unit 100 includes a band-pass filter 14 that transmits light incident on the light transmission region 10 a of the Fabry-Perot interference filter 10. [Modification]
- the band pass filter 14 may be provided on the light incident surface 13a of the light transmitting member 13, or may be provided on both the light incident surface 13a and the light emitting surface 13b of the light transmitting member 13.
- a bandpass filter 14 is provided on the light incident surface 13a of the light transmitting member 13 that is substantially flush with the outer surface of the top wall 6 in the opening 2a, as in the light detection device 1B shown in FIG. It may be.
- the Fabry-Perot interference filter 10 includes a laminated structure (an antireflection layer 41, a third laminated body 42, an intermediate layer 43, a fourth laminated body 44, a light shielding layer 45, and a light emitting layer 45 provided on the surface 21b on the light emitting side of the substrate 21.
- the protective layer 46 may not be provided.
- the outer edge of the light transmission region 10a of the Fabry-Perot interference filter 10 may be located outside the outer edge of the opening 2a.
- the ratio of the light entering the light transmission region 10a out of the light incident from the opening 2a is increased, and the utilization efficiency of the light incident from the opening 2a is increased.
- the position of the opening 2a with respect to the light transmission region 10a is slightly shifted, the light incident from the opening 2a enters the light transmission region 10a, so that the positional accuracy required when the photodetectors 1A, 1B, and 1C are assembled. Is alleviated.
- the light detection device 1 ⁇ / b> D includes a package 2.
- the package 2 is a CAN package having a stem (second wall portion) 3 and a cap 4.
- the cap 4 is integrally formed by a side wall (side wall part) 5 and a top wall (first wall part) 6.
- the stem 3 and the cap 4 are made of a metal material and are airtightly joined to each other.
- the shape of the side wall 5 is a cylindrical shape having a predetermined line L as a center line.
- the stem 3 and the top wall 6 are opposed to each other in a direction parallel to the line L, and close both ends of the side wall 5.
- a wiring board 7 is fixed to the inner surface 3 a of the stem 3.
- a substrate material of the wiring substrate 7 for example, silicon, ceramic, quartz, glass, plastic, or the like can be used.
- a photodetector 8 and a temperature compensation element (not shown) such as a thermistor are mounted on the wiring board 7, a photodetector 8 and a temperature compensation element (not shown) such as a thermistor are mounted.
- the photodetector 8 is disposed on the line L. More specifically, the photodetector 8 is arranged so that the center line of the light receiving portion coincides with the line L.
- the photodetector 8 is an infrared detector such as a quantum sensor using InGaAs or the like, or a thermal sensor using a thermopile or bolometer.
- a silicon photodiode When detecting light in each of the ultraviolet, visible, and near-infrared wavelength regions, for example, a silicon photodiode can be used as the photodetector 8.
- the photodetector 8 may be provided with one light receiving portion, or a plurality of light receiving portions may be provided in an array. Furthermore, a plurality of photodetectors 8 may be mounted on the wiring board 7.
- a plurality of spacers 9 are fixed on the wiring board 7.
- a material of each spacer 9 for example, silicon, ceramic, quartz, glass, plastic, or the like can be used.
- a Fabry-Perot interference filter 10 is fixed on the plurality of spacers 9 by, for example, an adhesive.
- the Fabry-Perot interference filter 10 is disposed on the line L. More specifically, the Fabry-Perot interference filter 10 is arranged so that the center line of the light transmission region 10a coincides with the line L.
- the spacer 9 may be integrally formed with the wiring board 7.
- the Fabry-Perot interference filter 10 may be supported by one spacer 9 instead of the plurality of spacers 9.
- a plurality of lead pins 11 are fixed to the stem 3. More specifically, each lead pin 11 penetrates the stem 3 while maintaining electrical insulation and airtightness with the stem 3.
- Each lead pin 11 is electrically connected with an electrode pad provided on the wiring board 7, a terminal of the photodetector 8, a terminal of the temperature compensation element, and a terminal of the Fabry-Perot interference filter 10 by wires 12. ing. Thereby, it is possible to input / output electric signals to / from each of the photodetector 8, the temperature compensating element, and the Fabry-Perot interference filter 10.
- the package 2 has an opening (light incident opening) 2a. More specifically, the opening 2 a is formed in the top wall 6 of the cap 4 so that the center line thereof coincides with the line L. When viewed from a direction parallel to the line L, the shape of the opening 2a is circular.
- a light transmitting member 13 is disposed on the inner surface 6a of the top wall 6 so as to close the opening 2a. The light transmitting member 13 is airtightly joined to the inner surface 6 a of the top wall 6.
- the light transmitting member 13 has a light incident surface 13a, a light emitting surface (inner surface) 13b, and a side surface 13c that face each other in a direction parallel to the line L.
- the light incident surface 13a of the light transmitting member 13 is substantially flush with the outer surface of the top wall 6 at the opening 2a.
- the side surface 13 c of the light transmitting member 13 is in contact with the inner surface 5 a of the side wall 5 of the package 2. That is, the light transmitting member 13 reaches the inside of the opening 2 a and the inner surface 5 a of the side wall 5.
- Such a light transmission member 13 is formed by disposing a glass pellet inside the cap 4 with the opening 2a on the lower side and melting the glass pellet. That is, the light transmission member 13 is formed of fused glass.
- a band pass filter 14 is fixed to the light emitting surface 13 b of the light transmitting member 13 by an adhesive member 15. That is, the adhesive member 15 fixes the band pass filter 14 to the inner surface 6 a of the top wall 6 through the light transmitting member 13 joined to the inner surface 6 a of the top wall 6.
- the band-pass filter 14 is light in the measurement wavelength range of the light detection device 1D out of the light transmitted through the light transmission member 13 (light in a predetermined wavelength range and is incident on the light transmission region 10a of the Fabry-Perot interference filter 10). Light to be transmitted) is selectively transmitted (that is, only light in the wavelength range is transmitted).
- the shape of the bandpass filter 14 is a quadrangular plate.
- the bandpass filter 14 has a light incident surface 14a and a light exit surface 14b, and four side surfaces 14c that face each other in a direction parallel to the line L.
- the bandpass filter 14 has a dielectric multilayer film (for example, TiO 2, Ta 2 O 5, etc.) and a high refractive material such as TiO 2, Ta 2 O 5
- a multilayer film made of a combination with a low refractive material such as SiO 2 or MgF 2 is formed.
- the light transmission unit 100 is configured by the band-pass filter 14. That is, the light transmission unit 100 includes a band-pass filter 14 that transmits light incident on the light transmission region 10 a of the Fabry-Perot interference filter 10.
- the adhesive member 15 has a first portion 15 a disposed in the entire region of the light incident surface 14 a of the bandpass filter 14.
- the first portion 15 a is a portion of the adhesive member 15 that is disposed between the light emitting surface 13 b of the light transmitting member 13 and the light incident surface 14 a of the bandpass filter 14 that face each other.
- the adhesive member 15 has a second portion 15 b that protrudes outward from the outer edge of the bandpass filter 14 when viewed from a direction parallel to the line L.
- the second portion 15 b reaches the inner surface 5 a of the side wall 5 and is in contact with the inner surface 5 a of the side wall 5. Further, the second portion 15 b is in contact with the side surface 14 c of the band pass filter 14.
- the thickness of the second portion 15b in the direction parallel to the line L is the maximum in the portion in contact with the central portion of each side surface 14c, and each corner of the bandpass filter 14 is shown. It is the smallest in the portion in contact with the portion 14d (the corner formed by the adjacent side surface 14c). However, the thickness of the second portion 15b in the direction parallel to the line L decreases, for example, as the surface of the second portion 15b has a convex curved surface and approaches the corner portions 14d from the central portion of each side surface 14c. If so, the thickness of the second portion 15b may not be the smallest in the portion in contact with each corner portion 14d.
- the thickness of the second portion 15b does not become the maximum in the portion in contact with each corner portion 14d, the occurrence of cracks in the corner portion 14d of the bandpass filter 14 can be suppressed.
- a light transmissive material for example, a light transmissive resin, low-melting glass, or the like
- FIG. 8 for convenience of explanation, only the package 2 and the light transmission member 13 are shown in cross section.
- the package 2 includes a wiring board 7, a photodetector 8, a temperature compensating element (not shown), a plurality of spacers 9, a Fabry-Perot interference filter 10, and a bandpass.
- a filter 14 is accommodated.
- the opening 2a, the light transmitting member 13, and the bandpass filter 14 are arranged on one side (second side) of the Fabry-Perot interference filter 10 on the line L, and the photodetector 8 is arranged on the other side (first side) of the Fabry-Perot interference filter 10 on the line L.
- the stem 3 faces the top wall 6 of the cap 4 with the Fabry-Perot interference filter 10, the bandpass filter 14, and the photo detector 8 interposed therebetween, and the side wall 5 of the cap 4 is The Fabry-Perot interference filter 10, the bandpass filter 14 and the photodetector 8 are surrounded.
- the thickness T of the light transmitting member 13 (the thickness in the direction parallel to the line L, the distance between the light incident surface 13a and the light emitting surface 13b) is the distance D1 (fabric between the Fabry-Perot interference filter 10 and the light transmitting member 13).
- the distance between the surface of the Perot interference filter 10 on the light transmitting member 13 side and the light emitting surface 13b of the light transmitting member 13) is a value equal to or greater than 0.3.
- the thickness T of the light transmitting member 13 is determined by the distance D2 between the Fabry-Perot interference filter 10 and the photodetector 8 (the surface of the Fabry-Perot interference filter 10 on the side of the photodetector 8 and the Fabry-Perot interference of the photodetector 8).
- the distance is equal to or greater than the distance to the surface on the filter 10 side.
- the positional relationship and the size relationship of each part when viewed from the direction parallel to the line L are as follows.
- the center line of the opening 2 a, the center line of the light transmission member 13, the center line of the band pass filter 14, the center line of the light transmission region 10 a of the Fabry-Perot interference filter 10, and the light detector 8 The center line of the light receiving unit coincides with the line L.
- the outer edge of the light transmission region 10a of the opening 2a, the light transmission member 13, the adhesive member 15, and the Fabry-Perot interference filter 10 is circular.
- the outer edges of the bandpass filter 14, the Fabry-Perot interference filter 10, and the photodetector 8 are square.
- the outer edge of the light transmission region 10 a of the Fabry-Perot interference filter 10 is located outside the outer edge of the photodetector 8.
- the outer edge of the opening 2 a is located outside the outer edge of the light transmission region 10 a of the Fabry-Perot interference filter 10.
- the outer edge of the Fabry-Perot interference filter 10 is located outside the outer edge of the opening 2a.
- the outer edge of the bandpass filter 14 is located outside the outer edge of the Fabry-Perot interference filter 10.
- the outer edges of the light transmission member 13 and the adhesive member 15 are located outside the outer edge of the bandpass filter 14 and coincide with the inner surface 5 a of the side wall 5 of the cap 4.
- one outer edge when viewed from a predetermined direction, one outer edge is located outside of the other outer edges” means that “one outer edge surrounds the other outer edge when viewed from a predetermined direction”. Means that “one outer edge includes another outer edge when viewed from a predetermined direction”.
- the light detection device 1D when light enters the bandpass filter 14 from the outside via the opening 2a, the light transmission member 13, and the adhesive member 15, light in a predetermined wavelength range is selected. Transparent.
- the light transmitted through the bandpass filter 14 enters the light transmission region 10a of the Fabry-Perot interference filter 10
- light having a predetermined wavelength is selectively transmitted among the light in the predetermined wavelength range.
- the light transmitted through the light transmission region 10 a of the Fabry-Perot interference filter 10 enters the light receiving portion of the photodetector 8 and is detected by the photodetector 8.
- a light transmission region 10 a that transmits light according to the distance between the first mirror and the second mirror is provided on the line L.
- the distance between the first mirror and the second mirror is controlled with extremely high accuracy. That is, the light transmission region 10a can control the distance between the first mirror and the second mirror to a predetermined distance in order to selectively transmit light having a predetermined wavelength in the Fabry-Perot interference filter 10.
- This region is a region through which light having a predetermined wavelength according to the distance between the first mirror and the second mirror can be transmitted.
- the Fabry-Perot interference filter 10 includes a substrate 21. On the light incident side surface 21a of the substrate 21, an antireflection layer 31, a first stacked body 32, an intermediate layer 33, and a second stacked body 34 are stacked in this order. A gap (air gap) S is formed by the frame-shaped intermediate layer 33 between the first stacked body 32 and the second stacked body 34.
- the substrate 21 is made of, for example, silicon, quartz, glass or the like.
- the antireflection layer 31 and the intermediate layer 33 are made of, for example, silicon oxide.
- the thickness of the intermediate layer 33 may be an integral multiple of 1/2 of the center transmission wavelength (that is, the center wavelength of the wavelength range that can be transmitted by the Fabry-Perot interference filter 10).
- the portion of the first stacked body 32 corresponding to the light transmission region 10 a functions as the first mirror 35.
- the first mirror 35 is supported on the substrate 21 via the antireflection layer 31.
- the first stacked body 32 is configured by alternately stacking a plurality of polysilicon layers and a plurality of silicon nitride layers one by one. Each optical thickness of the polysilicon layer and the silicon nitride layer constituting the first mirror 35 may be an integral multiple of 1/4 of the center transmission wavelength. Note that a silicon oxide layer may be used instead of the silicon nitride layer.
- the portion of the second stacked body 34 corresponding to the light transmission region 10a functions as the second mirror 36 that faces the first mirror 35 with the gap S therebetween.
- the second mirror 36 is supported on the substrate 21 via the antireflection layer 31, the first stacked body 32, and the intermediate layer 33.
- the second stacked body 34 is configured by alternately stacking a plurality of polysilicon layers and a plurality of silicon nitride layers one by one.
- the optical thickness of each of the polysilicon layer and the silicon nitride layer constituting the second mirror 36 may be an integral multiple of 1/4 of the center transmission wavelength. Note that a silicon oxide layer may be used instead of the silicon nitride layer.
- a plurality of through holes 24 b extending from the surface 34 a of the second stacked body 34 to the space S are provided in a portion corresponding to the space S in the second stacked body 34.
- the plurality of through holes 24b are formed to such an extent that the function of the second mirror 36 is not substantially affected.
- the plurality of through holes 24b are used to form a void S by removing a part of the intermediate layer 33 by etching.
- the first electrode 22 is formed on the first mirror 35 so as to surround the light transmission region 10a.
- a second electrode 23 is formed on the first mirror 35 so as to include the light transmission region 10a.
- the first electrode 22 and the second electrode 23 are formed by doping the polysilicon layer with impurities to reduce the resistance.
- the size of the second electrode 23 is substantially the same as the size of the light transmission region 10a.
- the third electrode 24 is formed on the second mirror 36.
- the third electrode 24 faces the first electrode 22 and the second electrode 23 with the gap S in the direction parallel to the line L.
- the third electrode 24 is formed by doping the polysilicon layer with impurities to reduce the resistance.
- the second electrode 23 is located on the same plane as the first electrode 22 in the direction parallel to the line L.
- the distance between the second electrode 23 and the third electrode 24 is the same as the distance between the first electrode 22 and the third electrode 24.
- the second electrode 23 is surrounded by the first electrode 22.
- a pair of terminals 25 are provided so as to face each other with the light transmission region 10a interposed therebetween.
- Each terminal 25 is disposed in a through hole extending from the surface 34 a of the second stacked body 34 to the first stacked body 32.
- Each terminal 25 is electrically connected to the first electrode 22 via a wiring 22a.
- a pair of terminals 26 are provided so as to face each other with the light transmission region 10a interposed therebetween.
- Each terminal 26 is disposed in a through hole extending from the surface 34 a of the second stacked body 34 to the front of the intermediate layer 33.
- Each terminal 26 is electrically connected to the second electrode 23 via the wiring 23a and is also electrically connected to the third electrode 24 via the wiring 24a. Note that the direction in which the pair of terminals 25 face each other and the direction in which the pair of terminals 26 face each other are orthogonal (see FIG. 10).
- the trenches 27 and 28 are provided on the surface 32 a of the first stacked body 32.
- the trench 27 extends in an annular shape so as to surround a connection portion with the terminal 26 of the wiring 23 a extending from the terminal 26 along the direction parallel to the line L.
- the trench 27 electrically insulates the first electrode 22 and the wiring 23a.
- the trench 28 extends in a ring shape along the inner edge of the first electrode 22.
- the trench 28 electrically insulates the first electrode 22 and the second electrode 23.
- the region in each of the trenches 27 and 28 may be an insulating material or a gap.
- a trench 29 is provided on the surface 34 a of the second stacked body 34.
- the trench 29 extends in an annular shape so as to surround the terminal 25.
- the trench 29 electrically insulates the terminal 25 from the third electrode 24.
- the region in the trench 28 may be an insulating material or a gap.
- An antireflection layer 41, a third laminated body 42, an intermediate layer 43, and a fourth laminated body 44 are laminated in this order on the surface 21b on the light emitting side of the substrate 21.
- the antireflection layer 41 and the intermediate layer 43 have the same configurations as the antireflection layer 31 and the intermediate layer 33, respectively.
- the third stacked body 42 and the fourth stacked body 44 have symmetrical stacked structures with the first stacked body 32 and the second stacked body 34, respectively, with respect to the substrate 21.
- the antireflection layer 41, the third stacked body 42, the intermediate layer 43, and the fourth stacked body 44 have a function of suppressing the warpage of the substrate 21.
- the opening 40a is provided in the antireflection layer 41, the third laminated body 42, the intermediate layer 43, and the fourth laminated body 44 so as to include the light transmission region 10a.
- the opening 40a has a diameter substantially the same as the size of the light transmission region 10a.
- the opening 40 a is opened on the light emitting side, and the bottom surface of the opening 40 a reaches the antireflection layer 41.
- a light shielding layer 45 is formed on the light emitting surface of the fourth stacked body 44.
- the light shielding layer 45 is made of, for example, aluminum.
- a protective layer 46 is formed on the surface of the light shielding layer 45 and the inner surface of the opening 40a.
- the protective layer 46 is made of, for example, aluminum oxide. Note that the optical influence of the protective layer 46 can be ignored by setting the thickness of the protective layer 46 to 1 to 100 nm (preferably about 30 nm).
- the Fabry-Perot interference filter 10 configured as described above, when a voltage is applied between the first electrode 22 and the third electrode 24 via the terminals 25 and 26, an electrostatic force corresponding to the voltage is generated. Occurs between the first electrode 22 and the third electrode 24. Due to the electrostatic force, the second mirror 36 is attracted to the first mirror 35 fixed to the substrate 21, and the distance between the first mirror 35 and the second mirror 36 is adjusted. Thus, in the Fabry-Perot interference filter 10, the distance between the first mirror 35 and the second mirror 36 is variable.
- the wavelength of light transmitted through the Fabry-Perot interference filter 10 depends on the distance between the first mirror 35 and the second mirror 36 in the light transmission region 10a. Therefore, by adjusting the voltage applied between the first electrode 22 and the third electrode 24, the wavelength of the transmitted light can be appropriately selected.
- the second electrode 23 is at the same potential as the third electrode 24. Therefore, the second electrode 23 functions as a compensation electrode for keeping the first mirror 35 and the second mirror 36 flat in the light transmission region 10a.
- the Fabry-Perot interference filter 10 While changing the voltage applied to the Fabry-Perot interference filter 10 (that is, while changing the distance between the first mirror 35 and the second mirror 36 in the Fabry-Perot interference filter 10), the Fabry-Perot interference filter. By detecting the light transmitted through the ten light transmission regions 10a with the photodetector 8, a spectral spectrum can be obtained. [Action and effect]
- the shape of the side wall 5 of the package 2 is cylindrical, whereas the shape of the bandpass filter 14 is a quadrangular plate.
- the distance between each corner 14d of the bandpass filter 14 and the inner surface 5a of the side wall 5 is smaller than the distance between each side surface 14c of the bandpass filter 14 and the inner surface 5a of the side wall 5. Therefore, the band pass filter 14 fixed to the inner surface 6a of the top wall 6 of the package 2 is positioned with high accuracy by each corner portion 14d.
- the distance between the side surface 14 c of the band-pass filter 14 and the inner surface 5 a of the side wall 5 is set to achieve high-precision positioning of the band-pass filter 14.
- the diameter of the bandpass filter 14 is increased so as to decrease, the following problem occurs. That is, since the area of the light incident surface 14a of the bandpass filter 14 thermally connected to the inner surface 6a of the top wall 6 of the package 2 is increased, the bandpass filter 14 is affected by the thermal influence from the package 2 (due to heat). Deformation).
- the bandpass filter 14 when the shape of the bandpass filter 14 is a quadrangular plate, the area of the light incident surface 14a of the bandpass filter 14 thermally connected to the inner surface 6a of the top wall 6 of the package 2 is, for example, a band. Since the shape of the pass filter 14 is smaller than that in the case of a circular plate shape, the band pass filter 14 is less susceptible to thermal influence from the package 2. Further, since the outer edge of the Fabry-Perot interference filter 10 is located outside the outer edge of the opening 2 a and the outer edge of the bandpass filter 14 is located outside the outer edge of the Fabry-Perot interference filter 10, Fabry-Perot interference. It is guaranteed that the light incident on the light transmission region 10 a of the filter 10 has transmitted through the bandpass filter 14. As described above, according to the photodetecting device 1D, the bandpass filter 14 can function appropriately.
- the photodetecting device 1D includes the bandpass filter 14, so that it is possible to provide the photodetecting device 1D as a general product with a high degree of completeness that does not require a custom Fabry-Perot interference filter 10. Further, since a single element photodiode can be used as the photodetector 8, it is possible to reduce the manufacturing cost of the photodetector 1D.
- the merit of the shape of the side wall 5 of the package 2 being cylindrical will be described.
- durability of the light detection device 1D is improved. More specifically, since the shape of the side wall 5 of the package 2 is cylindrical, the shape stability of the package 2 is higher than that when the shape of the side wall 5 of the package 2 is a polygonal cylinder, for example.
- the shape of the side wall 5 of the package 2 is cylindrical, stress concentration is less likely to occur compared to, for example, a case where the shape of the package 2 is a polygonal cylinder.
- the shape of the package 2 is a polygonal cylindrical shape, stress due to an impact applied to the package 2 tends to concentrate on the corners, whereas the shape of the side wall 5 of the package 2 is cylindrical.
- the stress is dispersed in the impact without concentrating on one point.
- the Fabry-Perot interference filter 10 accommodated in the package 2 is vulnerable to physical impact. For this reason, by making the shape of the side wall 5 of the package 2 cylindrical, the Fabry-Perot interference filter 10 is suitably protected from an external physical impact.
- thermal stress is generated in the package 2 due to the thermal history at the time of assembly of the light detection device 1D (thermosetting of the adhesive member 15, connection of the wire 12, sealing of the stem 3, etc.), temperature change after assembly, and the like.
- the thermal stress is generated due to a difference in coefficient of thermal expansion between members constituting the light detection device 1D. It is desirable to avoid the thermal stress from being concentrated and accumulated in a specific place or a specific direction inside the light detection device 1D. This is because when thermal stress concentrates in a specific place or a specific direction, it leads to abnormal characteristics or damage of the light detection device 1D.
- the shape of the side wall 5 of the package 2 is cylindrical, so that the generated thermal stress is dispersed without concentrating on one point. As a result, characteristic abnormality occurs in the light detection device 1D or light detection is performed. It is possible to prevent the device 1D from being damaged.
- the light detection device 1D further includes a light transmission member 13 disposed on the inner surface 6a of the top wall 6 so as to close the opening 2a.
- the bandpass filter 14 emits light from the light transmission member 13 by the adhesive member 15.
- the adhesive member 15 is fixed to the surface (inner surface) 13 b, and is disposed in the entire region of the light incident surface 14 a of the band pass filter 14 that faces the light emitting surface 13 b of the light transmitting member 13. According to this configuration, since the adhesive member 15 is disposed in the entire region of the light incident surface 14 a of the bandpass filter 14, the bandpass filter 14 is securely fixed to the inner surface 6 a of the top wall 6. It becomes.
- the band pass filter 14 is fixed to the light emitting surface 13 b of the light transmitting member 13, it is less susceptible to thermal influence from the package 2. Further, since the band pass filter 14 is fixed to the light emitting surface 13b of the light transmitting member 13, the band pass filter 14 is prevented from being damaged due to physical interference from the opening 2a. be able to.
- the light emitting surface 13b of the light transmitting member 13 may not have good flatness and may have a curvature.
- the region of the light emitting surface 13b of the light transmitting member 13 that faces the opening 2a may be distorted so as to be recessed toward the opening 2a. This is because, in this region, the light transmitting member 13 is distorted so as to be recessed toward the opening 2a due to the weight of the light transmitting member 13 (which is molten glass) during firing.
- each corner 14d of the bandpass filter 14 and the inner surface 5a of the side wall 5 are not in contact with each other and are separated. Thereby, the damage of the band pass filter 14 (especially each corner part 14d) by contact with each corner
- each corner 14 d of the bandpass filter 14 and the inner surface 5 a of the side wall 5 are not in contact with each other, and are separated from each other, so that the bandpass filter 14 is hardly affected by the heat from the package 2.
- each corner 14d of the bandpass filter 14 and the inner surface 5a of the side wall 5 are not in contact with each other, that is, each corner 14d of the bandpass filter 14 has an R portion (light Since the band-pass filter 14 is separated from the light emitting surface 13b of the light transmitting member 13 which is a flat surface, the light emitting surface 13b of the transmitting member 13 and the inner surface 5a of the side wall 5 are separated from each other. It becomes a fixed state.
- the shape of the side wall 5 of the package 2 is cylindrical, whereas the shape of the bandpass filter 14 is a quadrangular plate.
- the band-pass filter 14 is positioned with high accuracy by the corners 14d.
- the shape of the band-pass filter 14 is a circular plate shape, the distance between the side surface 14 c of the band-pass filter 14 and the inner surface 5 a of the side wall 5 is set to achieve high-precision positioning of the band-pass filter 14.
- the diameter of the bandpass filter 14 is increased so as to decrease, the following problem occurs.
- the adhesive member 15 increases the area of the light incident surface 14a of the band-pass filter 14 fixed to the light emitting surface 13b of the light transmitting member 13, so that bubbles generated in the adhesive member 15 are difficult to remove.
- the shape of the bandpass filter 14 is a quadrangular plate
- the area of the light incident surface 14a of the bandpass filter 14 fixed to the light emitting surface 13b of the light transmitting member 13 is, for example, a bandpass filter. Since the shape of 14 is smaller than the case of a circular plate shape, bubbles generated in the adhesive member 15 can easily escape from between each side surface 14c of the bandpass filter 14 and the inner surface 5a of the side wall 5. As a result, light scattering, diffraction, and the like at the adhesive member 15 are suppressed.
- region which opposes the opening 2a among the light-projection surfaces 13b of the light transmissive member 13 is distorted so that it may be dented in the opening 2a side, the area
- physical contact with the light emitting surface 13b of the light transmitting member 13 can be avoided, and damage to the region can be prevented.
- the adhesive member 15 protrudes outward from the outer edge of the bandpass filter 14 when viewed from a direction parallel to the line L, and from the outer edge of the bandpass filter 14 in the adhesive member 15.
- the portion protruding outward is in contact with the side surface 14 c of the bandpass filter 14. According to this configuration, the bandpass filter 14 is more reliably fixed.
- the thickness of the second portion 15b of the adhesive member 15 in the direction parallel to the line L is maximum at the portion in contact with the central portion of each side surface 14c. It is the smallest at the part in contact with each of the 14 corners 14d. According to this configuration, for example, when the adhesive member 15 is cured, the adhesive member 15 can be prevented from being cracked at portions corresponding to the respective corner portions 14 d of the band pass filter 14. However, the thickness of the second portion 15b in the direction parallel to the line L decreases, for example, as the surface of the second portion 15b has a convex curved surface and approaches the corner portions 14d from the central portion of each side surface 14c.
- the thickness of the second portion 15b may not be the smallest in the portion in contact with each corner portion 14d. If the thickness of the second portion 15b does not become the maximum in the portion in contact with each corner portion 14d, the occurrence of cracks in the corner portion 14d of the bandpass filter 14 can be suppressed.
- the shape of the opening 2a is circular. According to this configuration, the intensity profile of light incident on the package 2 is made uniform.
- the shape of the bandpass filter 14 is a quadrangular plate. According to this structure, the thermal influence given to the band pass filter 14 from the package 2 is effectively suppressed while ensuring the stability of fixing the band pass filter 14 to the inner surface 6 a of the top wall 6 of the package 2. be able to. In addition, air bubbles generated in the adhesive member 15 at the time of manufacture are more easily removed from between the side surfaces 14 c of the bandpass filter 14 and the inner surface 5 a of the side wall 5 of the package 2, and light scattering and diffraction at the adhesive member 15. Etc. are suppressed. Furthermore, the manufacturing cost of the bandpass filter 14 by the wafer process is reduced.
- the package 2 is made of a metal material. According to this configuration, since hermetic sealing is possible, the hermeticity of the package 2 is improved as compared with the package 2 formed of, for example, plastic. As a result, the process for countermeasures against humidity in each component housed in the package 2 is not required, and the manufacturing cost of the photodetecting device 1D is reduced. Further, when the package 2 is formed of a metal material, the strength of the package 2 is improved as compared with the package 2 formed of plastic, for example. Protected from physical shock from. Further, when the package 2 is formed of a metal material, electrical shielding is facilitated. When the package 2 is formed of a metal material, the thermal conductivity of the package 2 is increased. However, as described above, the shape of the side wall 5 of the package 2 is cylindrical, whereas the band-pass filter 14 is used. Since the shape of the filter is a quadrangular plate, the band-pass filter 14 is not easily affected by the heat from the package 2.
- the outer edge of the Fabry-Perot interference filter 10 is positioned outside the outer edge of the opening 2a of the package 2, and the outer edge of the light transmitting member 13 is located outside the outer edge of the Fabry-Perot interference filter 10. positioned.
- the outer edge of the Fabry-Perot interference filter 10 is positioned outside the outer edge of the opening 2a of the package 2, and the outer edge of the light transmitting member 13 is located outside the outer edge of the Fabry-Perot interference filter 10. positioned.
- a part of the light incident on the opening 2a of the package 2 includes an incident angle of the light at the opening 2a, a side surface of the opening 2a, and an emission side corner (a corner where the side surface of the opening 2a and the inner surface 6a of the top wall 6 intersect). ) May be emitted from the side surface 13c of the light transmitting member 13 into the package 2.
- an incident angle of the light at the opening 2a a side surface of the opening 2a
- an emission side corner a corner where the side surface of the opening 2a and the inner surface 6a of the top wall 6 intersect.
- the side surface 13c of the light transmitting member 13 is often rougher than the light incident surface 13a and the light emitting surface 13b of the light transmitting member 13, the side surface 13c of the light transmitting member 13 is connected to the inside of the package 2.
- the light emitted to the light is likely to enter the photodetector 8 as scattered light.
- the outer edge of the Fabry-Perot interference filter 10 is positioned outside the outer edge of the opening 2a of the package 2, and the outer edge of the light transmitting member 13 is more than the outer edge of the Fabry-Perot interference filter 10. Located on the outside.
- the outer edge of the light transmitting member 13, that is, the side surface 13 c of the light transmitting member 13 is in contact with the inner surface 5 a of the side wall 5 of the package 2.
- the outer edge of the light transmission member 13 is located inside the outer edge of the Fabry-Perot interference filter 10, for example, the light transmission member 13 from the light transmission region 10 a of the Fabry-Perot interference filter 10 and the photodetector 8.
- the side surface 13c is moved away.
- the side surface 13c of the light transmitting member 13 is in contact with the inner surface 5a of the side wall 5 of the package 2 and is covered with the inner surface 5a. For this reason, the incidence of stray light on the photodetector 8 is suppressed, and the S / N ratio and the resolution are improved.
- the outer edge of the light transmission region 10a of the Fabry-Perot interference filter 10 is located outside the outer edge of the photodetector 8.
- the outer edge of the opening 2 a is located outside the outer edge of the light transmission region 10 a of the Fabry-Perot interference filter 10.
- the outer edge of the Fabry-Perot interference filter 10 is located outside the outer edge of the opening 2a.
- the outer edge of the bandpass filter 14 is located outside the outer edge of the Fabry-Perot interference filter 10. This ensures that the light incident on the photodetector 8 through the aperture 2a and the light transmission region 10a of the Fabry-Perot interference filter 10 has transmitted through the bandpass filter 14.
- the outer edge of the Fabry-Perot interference filter 10 is located outside the outer edge of the photodetector 8. Thereby, it can suppress that the light which does not permeate
- the light detection device 1D includes a light transmission member 13. Further, in the light detection device 1D, the thickness T of the light transmission member 13 is a value equal to or greater than a value obtained by multiplying the distance D1 between the Fabry-Perot interference filter 10 and the light transmission member 13 by 0.3. Thereby, since the volume of the space in the package 2 is reduced while the heat capacity of the light transmitting member 13 is increased, the temperature in the package 2 can be made uniform. Therefore, each part accommodated in the package 2 such as the bandpass filter 14 and the Fabry-Perot interference filter 10 is not easily affected by the temperature change.
- the light transmitting member 13 is relatively close to the Fabry-Perot interference filter 10, it is possible to suppress the light that does not pass through the light transmitting region 10a of the Fabry-Perot interference filter 10 from entering the photodetector 8 as stray light. be able to.
- the thickness T is a value equal to or greater than the value obtained by multiplying the distance D1 by 0.6 in order to make the temperature in the package 2 uniform and to further suppress the incidence of stray light on the photodetector 8. It is more preferable.
- the thickness T of the light transmission member 13 is a value equal to or greater than the distance D2 between the Fabry-Perot interference filter 10 and the light detector 8.
- the terminals 25 and 26 of the Fabry-Perot interference filter 10 and the lead pins 11 are electrically connected by wires 12.
- the outer edge of the Fabry-Perot interference filter 10 is positioned outside the outer edge of the opening 2 a of the package 2, and the outer edge of the light transmission member 13 is more than the outer edge of the Fabry-Perot interference filter 10. Is also located on the outside.
- the outer edge of the light transmitting member 13, that is, the side surface 13 c of the light transmitting member 13 is in contact with the inner surface 5 a of the side wall 5 of the package 2. That is, the light transmission member 13 covers the entire inner surface 6 a of the top wall 6 of the package 2. For this reason, even if the wire 12 is bent, the contact between the wire 12 and the inner surface 6a of the top wall 6 of the package 2 can be prevented.
- the photodetector 8 having an InGaAs substrate in which a photoelectric conversion region is formed is, for example, a light having a wavelength of 1200 nm or more and 2100 nm or less as compared with light having a wavelength shorter than 1200 nm and light having a wavelength longer than 2100 nm. It has high sensitivity.
- the photodetector 8 has higher sensitivity to light having a wavelength shorter than 1200 nm as compared to light having a wavelength longer than 2100 nm.
- the silicon substrate has higher absorptivity for light having a wavelength shorter than 1200 nm compared to light having a wavelength of 1200 nm or more (depending on the manufacturing method, thickness, and impurity concentration of the silicon substrate, In particular, it has high absorptivity for light having a wavelength shorter than 1100 nm). Therefore, for example, when light having a wavelength of 1200 nm or more and 2100 nm or less is to be detected, the silicon substrate of the Fabry-Perot interference filter 10 can function as a high-pass filter.
- the light detector 8 By the synergistic effect of the above, it is possible to reliably suppress the light detector 8 from detecting noise light (light having a wavelength shorter than 1200 nm (particularly shorter than 1100 nm) and light having a wavelength longer than 2100 nm). it can.
- the outer edge of the chip-shaped Fabry-Perot interference filter 10 is located outside the outer edge of the opening 2a of the package 2, and the outer edge of the light transmitting portion 100 is more than the outer edge of the Fabry-Perot interference filter 10. Is also located on the outside. Thereby, it is possible to suppress the light from entering the package 2 and becoming stray light due to the incident angle of light at the opening 2a, diffraction at the opening 2a, and the like through the side surface of the light transmitting portion 100. .
- the photodetecting device 1 ⁇ / b> E is disposed so that the adhesive member 15 corresponds to each corner (the corner formed by the adjacent side surface 14 c) of the bandpass filter 14. This is mainly different from the above-described photodetector 1D.
- the first portion 15a of the adhesive member 15 is adjacent to the corner region 14e of the light incident surface 14a of the bandpass filter 14 (out of the light incident surface 14a). (A region including a corner formed by the side surface 14c). That is, the first portion 15 a is disposed between the light emitting surface 13 b of the light transmitting member 13 and the corner region 14 e of the band pass filter 14 that face each other.
- the second portion 15 b of the adhesive member 15 protrudes outward from the outer edge of the band pass filter 14 when viewed from a direction parallel to the line L.
- the second portion 15 b reaches the inner surface 5 a of the side wall 5 and is in contact with the inner surface 5 a of the side wall 5. Further, the second portion 15 b is in contact with the side surface 14 c of the band pass filter 14. The second portion 15b covers a region facing the corner region 14e in the light emission surface 14b of the bandpass filter 14. As a result, the bandpass filter 14 is more reliably fixed. At this time, since the corner region 14e of the bandpass filter 14 is positioned farthest from the opening 2a, the second portion 15b covering the region facing the corner region 14e of the light exit surface 14b is The possibility of covering the region facing the light transmission region 10a in the light exit surface 14b is low.
- the adhesive members 15 at each corner of the band pass filter 14 are separated from each other. As described above, in the light detection device 1E, the adhesive member 15 is not disposed in the region other than the corner region 14e on the light incident surface 14a of the bandpass filter 14, but is disposed in the corner region 14e. In the photodetecting device 1E, the adhesive member 15 fixes the band pass filter 14 to the inner surface 6a of the top wall 6 via the light transmitting member 13 joined to the inner surface 6a of the top wall 6. .
- the light transmission unit 100 is configured by the bandpass filter 14 as in the photodetecting device 1D described above. That is, the light transmission unit 100 includes a band-pass filter 14 that transmits light incident on the light transmission region 10 a of the Fabry-Perot interference filter 10.
- region which opposes the opening 2a among the light-projection surfaces 13b of the light transmissive member 13 is distorted so that it may dent in the opening 2a side, the area
- physical contact with the light emitting surface 13b of the light transmitting member 13 can be avoided, and damage to the region can be prevented.
- the adhesive member 15 arranged so as to correspond to each corner of the band pass filter 14 from entering the region facing the opening 2a in the light emitting surface 13b of the light transmitting member 13. This is because the area surrounding the area facing the opening 2a of the light emitting surface 13b of the light transmitting member 13 tends to rise.
- the bandpass filter 14 can function appropriately as in the photodetecting device 1D described above. Moreover, in the photodetection device 1E, the photodetection characteristics are improved as in the photodetection device 1D described above.
- the light detection device 1E further includes a light transmission member 13 disposed on the inner surface 6a of the top wall 6 so as to close the opening 2a.
- the bandpass filter 14 emits light from the light transmission member 13 by the adhesive member 15.
- the adhesive member 15 is fixed to the surface 13b, and is not disposed in a region other than the corner region 14e in the light incident surface 14a of the bandpass filter 14 facing the light emitting surface 13b of the light transmitting member 13, Arranged in the region 14e. According to this configuration, since the adhesive member 15 is not disposed in a region other than the corner region 14e of the light incident surface 14a of the bandpass filter 14, light scattering and diffraction at the adhesive member 15 are more reliably performed. It is suppressed.
- the band pass filter 14 is fixed to the light emitting surface 13 b of the light transmitting member 13, it is less susceptible to thermal influence from the package 2.
- the light detection device 1 ⁇ / b> F is mainly different from the light detection device 1 ⁇ / b> D described above in that the light transmission member 13 is not provided.
- the bandpass filter 14 is directly fixed to the inner surface 6a of the top wall 6 by the adhesive member 15. That is, in the photodetecting device 1F, the adhesive member 15 is band-passed with respect to the inner surface 6a of the top wall 6 without passing through other members (such as the light transmitting member 13 joined to the inner surface 6a of the top wall 6).
- the filter 14 is fixed.
- the first portion 15a of the adhesive member 15 is disposed in a region excluding the facing region 14f facing the opening 2a on the light incident surface 14a of the bandpass filter 14 facing the inner surface 6a of the top wall 6.
- the first portion 15a is disposed between the inner surface 6a of the ceiling wall 6 facing each other and the region (that is, the region excluding the facing region 14f of the light incident surface 14a of the bandpass filter 14).
- the second portion 15 b of the adhesive member 15 protrudes outward from the outer edge of the bandpass filter 14 when viewed from a direction parallel to the line L.
- the second portion 15 b reaches the inner surface 5 a of the side wall 5 and is in contact with the inner surface 5 a of the side wall 5. Further, the second portion 15 b is in contact with the side surface 14 c of the band pass filter 14.
- the light transmission unit 100 is configured by the band-pass filter 14 as in the above-described light detection device 1D. That is, the light transmission unit 100 includes a band-pass filter 14 that transmits light incident on the light transmission region 10 a of the Fabry-Perot interference filter 10. [Action and effect]
- the bandpass filter 14 can function appropriately as in the photodetection device 1D described above. Moreover, in the photodetection device 1F, the photodetection characteristics are improved, as in the photodetection device 1D described above.
- the bandpass filter 14 is fixed to the inner surface 6a of the top wall 6 by an adhesive member 15, and the adhesive member 15 is provided on the bandpass filter 14 facing the inner surface 6a of the top wall 6. It arrange
- the light detection device 1G is mainly different from the light detection device 1E described above in that the light transmission member 13 is not provided.
- the bandpass filter 14 is directly fixed to the inner surface 6a of the top wall 6 by the adhesive member 15.
- the adhesive member 15 is band-passed with respect to the inner surface 6a of the top wall 6 without passing through other members (such as the light transmitting member 13 joined to the inner surface 6a of the top wall 6).
- the filter 14 is fixed.
- the first portion 15 a of the adhesive member 15 is disposed in the corner area 14 e of the light incident surface 14 a of the bandpass filter 14. That is, the first portion 15 a is disposed between the inner surface 6 a of the top wall 6 and the corner region 14 e of the band pass filter 14 that face each other.
- the second portion 15 b of the adhesive member 15 protrudes outward from the outer edge of the band pass filter 14 when viewed from a direction parallel to the line L.
- the second portion 15 b reaches the inner surface 5 a of the side wall 5 and is in contact with the inner surface 5 a of the side wall 5. Further, the second portion 15 b is in contact with the side surface 14 c of the band pass filter 14.
- the second portion 15b covers a region facing the corner region 14e in the light emission surface 14b of the bandpass filter 14. As a result, the bandpass filter 14 is more reliably fixed.
- the second portion 15b covering the region facing the corner region 14e of the light exit surface 14b is The possibility of covering the region facing the light transmission region 10a in the light exit surface 14b is low.
- the adhesive members 15 at each corner of the band pass filter 14 are separated from each other. As described above, in the light detection device 1G, the adhesive member 15 is not disposed in the region other than the corner region 14e on the light incident surface 14a of the bandpass filter 14, but is disposed in the corner region 14e.
- the light transmission unit 100 is configured by the band-pass filter 14 as in the above-described light detection device 1D. That is, the light transmission unit 100 includes a band-pass filter 14 that transmits light incident on the light transmission region 10 a of the Fabry-Perot interference filter 10. [Action and effect]
- the bandpass filter 14 can function appropriately as in the photodetecting device 1D described above. Further, in the photodetecting device 1G, the photodetection characteristics are improved as in the photodetecting device 1D described above.
- the bandpass filter 14 is fixed to the inner surface 6a of the top wall 6 by an adhesive member 15, and the adhesive member 15 is provided on the bandpass filter 14 facing the inner surface 6a of the top wall 6.
- the light incident surface 14a is not disposed in the region other than the corner region 14e, but is disposed in the corner region 14e. According to this configuration, since the adhesive member 15 is not disposed in a region other than the corner region 14e of the light incident surface 14a of the bandpass filter 14, light scattering and diffraction at the adhesive member 15 are more reliably performed. It is suppressed. [Modification]
- the adhesive member 15 may not protrude outward from the outer edge of the bandpass filter 14 when viewed from a direction parallel to the line L.
- the 2nd part 15b which protruded outside from the outer edge of the band pass filter 14 among the adhesive members 15 does not reach the inner surface 5a of the side wall 5, but is separated from the inner surface 5a of the side wall 5.
- the second portion 15b is formed on the inner surface 5a of the side wall 5 from the viewpoint of improving the fixing strength of the bandpass filter 14 to the inner surface 6a of the top wall 6. It is preferable that it has reached.
- the material of the adhesive member 15 is a low-melting glass or a resin having a high hardness
- the thickness of the second portion 15b of the adhesive member 15 in the direction parallel to the line L is in contact with the inner surface 5a of the side wall 5 due to the viscosity of the adhesive member 15. It may be the maximum in the part. Thereby, for example, when the adhesive member 15 is cured, it is possible to suppress the occurrence of cracks in the adhesive member 15 at portions corresponding to the respective corner portions 14 d of the band pass filter 14. Further, the adhesive member 15 is prevented from turning around the light emitting surface 14b of the bandpass filter 14.
- the adhesive member 15 since the adhesive member 15 is not disposed in the region facing the opening 2a on the line L, the material of the adhesive member 15 transmits light. It may be a material that does not.
- the bandpass filter 14 is fixed to the inner surface 6a of the top wall 6 by the adhesive member 15 disposed in the corner region 14e, and then the bandpass when viewed from the direction parallel to the line L.
- the adhesive member 15 may be further filled between the inner surface 6 a of the top wall 6 and the light incident surface 14 a of the band pass filter 14 from the region where the adhesive member 15 is not disposed in the outer edge of the pass filter 14. At this time, the adhesive member 15 is prevented from entering the facing region of the light incident surface 14a of the bandpass filter 14 that faces the opening 2a.
- the shape of the bandpass filter 14 is not limited to a rectangular plate shape, but may be a polygonal plate shape. Also in this case, the band pass filter 14 is positioned with high precision by each corner, and the band pass filter 14 is less susceptible to thermal influence from the package 2. Therefore, even when the shape of the bandpass filter 14 is a polygonal plate shape, the bandpass filter 14 can function appropriately.
- the package 2 is not limited to the CAN package as described above, and may be any of the following. That is, the package 2 includes a first wall portion in which the opening 2 a is formed, a Fabry-Perot interference filter 10, a band pass filter 14, a second wall portion facing the first wall portion with the photodetector 8 interposed therebetween, and a Fabry. What is necessary is just to have the cylindrical side wall part which surrounds the Perot interference filter 10, the band pass filter 14, and the photodetector 8. FIG.
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Abstract
Description
[第1実施形態]
[光検出装置の構成]
[ファブリペロー干渉フィルタの構成]
[作用及び効果]
[第2実施形態]
[光検出装置の構成]
[作用及び効果]
[変形例]
[第3実施形態]
[光検出装置の構成]
[ファブリペロー干渉フィルタの構成]
[作用及び効果]
[第4実施形態]
[光検出装置の構成]
[作用及び効果]
[第5実施形態]
[光検出装置の構成]
[作用及び効果]
[第6実施形態]
[光検出装置の構成]
[作用及び効果]
[変形例]
Claims (16)
- 互いの距離が可変とされた第1ミラー及び第2ミラーを有し、前記第1ミラーと前記第2ミラーとの距離に応じた光を透過させる光透過領域が所定のライン上に設けられたファブリペロー干渉フィルタと、
前記ライン上において前記ファブリペロー干渉フィルタの第1の側に配置され、前記光透過領域を透過した光を検出する光検出器と、
前記ライン上において前記ファブリペロー干渉フィルタの第2の側に位置する開口を有し、前記ファブリペロー干渉フィルタ及び前記光検出器を収容するパッケージと、
前記開口を塞ぐように前記パッケージの内面に配置され、前記光透過領域に入射させる光を透過させるバンドパスフィルタを含む光透過部と、を備え、
前記ラインに平行な方向から見た場合に、前記ファブリペロー干渉フィルタの外縁は、前記開口の外縁よりも外側に位置しており、前記光透過部の外縁は、前記ファブリペロー干渉フィルタの前記外縁よりも外側に位置している、光検出装置。 - 前記光透過部は、前記バンドパスフィルタが設けられた光透過部材を更に含み、
前記ラインに平行な方向から見た場合に、前記光透過部材の外縁は、前記ファブリペロー干渉フィルタの前記外縁よりも外側に位置している、請求項1記載の光検出装置。 - 前記ラインに平行な方向から見た場合に、前記バンドパスフィルタの外縁は、前記ファブリペロー干渉フィルタの前記外縁よりも外側に位置している、請求項2記載の光検出装置。
- 前記光透過部材の厚さは、前記ファブリペロー干渉フィルタと前記光透過部材との距離に0.5を乗じた値以上の値である、請求項2又は3記載の光検出装置。
- 前記ファブリペロー干渉フィルタは、前記第1ミラー及び前記第2ミラーを支持するシリコン基板を有し、
前記光検出器は、光電変換領域が形成されたInGaAs基板を有する、請求項2~4のいずれか一項記載の光検出装置。 - 前記バンドパスフィルタは、前記光透過部材の光出射面に設けられている、請求項2~5のいずれか一項記載の光検出装置。
- 前記パッケージを貫通するリードピンと、
前記ファブリペロー干渉フィルタの端子と前記リードピンとを電気的に接続するワイヤと、を更に備える、請求項2~6のいずれか一項記載の光検出装置。 - 接着部材を更に備え、
前記バンドパスフィルタの形状は、多角形板状であり、
前記パッケージは、前記開口が形成された第1壁部、前記ファブリペロー干渉フィルタ、前記バンドパスフィルタ及び前記光検出器を挟んで前記第1壁部と対向する第2壁部、並びに、前記ファブリペロー干渉フィルタ、前記バンドパスフィルタ及び前記光検出器を包囲する円筒状の側壁部を有し、
前記接着部材は、前記第1壁部の内面に対して前記バンドパスフィルタを固定しており、
前記ラインに平行な方向から見た場合に、前記バンドパスフィルタの外縁は、前記ファブリペロー干渉フィルタの前記外縁よりも外側に位置している、請求項1記載の光検出装置。 - 前記開口を塞ぐように前記第1壁部の前記内面に配置された光透過部材を更に備え、
前記バンドパスフィルタは、前記接着部材によって、前記光透過部材の内面に固定されており、
前記接着部材は、前記光透過部材の前記内面と対向する前記バンドパスフィルタの光入射面の全領域に配置されている、請求項8記載の光検出装置。 - 前記開口を塞ぐように前記第1壁部の前記内面に配置された光透過部材を更に備え、
前記バンドパスフィルタは、前記接着部材によって、前記光透過部材の内面に固定されており、
前記接着部材は、前記光透過部材の前記内面と対向する前記バンドパスフィルタの光入射面のうち角領域を除く領域に配置されておらず、前記角領域に配置されている、請求項8記載の光検出装置。 - 前記バンドパスフィルタは、前記接着部材によって、前記第1壁部の前記内面に固定されており、
前記接着部材は、前記第1壁部の前記内面と対向する前記バンドパスフィルタの光入射面のうち前記開口と対向する対向領域を除く領域に配置されている、請求項8記載の光検出装置。 - 前記バンドパスフィルタは、前記接着部材によって、前記第1壁部の前記内面に固定されており、
前記接着部材は、前記第1壁部の前記内面と対向する前記バンドパスフィルタの光入射面のうち角領域を除く領域に配置されておらず、前記角領域に配置されている、請求項8記載の光検出装置。 - 前記接着部材は、前記ラインに平行な方向から見た場合に、前記バンドパスフィルタの前記外縁から外側に突出しており、
前記接着部材のうち前記バンドパスフィルタの前記外縁から外側に突出した部分は、前記バンドパスフィルタの側面に接触している、請求項9~12のいずれか一項記載の光検出装置。 - 前記ラインに平行な方向から見た場合に、前記開口の形状は、円形状である、請求項8~13のいずれか一項記載の光検出装置。
- 前記バンドパスフィルタの形状は、四角形板状である、請求項8~14のいずれか一項記載の光検出装置。
- 前記パッケージは、金属材料によって形成されている、請求項8~15のいずれか一項記載の光検出装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
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CN201680058106.4A CN108139270B (zh) | 2015-10-02 | 2016-09-27 | 光检测装置 |
US15/764,943 US10656020B2 (en) | 2015-10-02 | 2016-09-27 | Light detection device |
JP2017543435A JP6945450B2 (ja) | 2015-10-02 | 2016-09-27 | 光検出装置 |
KR1020187012004A KR20180062463A (ko) | 2015-10-02 | 2016-09-27 | 광 검출 장치 |
EP16851543.5A EP3358320A4 (en) | 2015-10-02 | 2016-09-27 | LIGHT DETECTION DEVICE |
US16/843,244 US11835388B2 (en) | 2015-10-02 | 2020-04-08 | Light detection device |
US18/373,532 US20240019304A1 (en) | 2015-10-02 | 2023-09-27 | Light detection device |
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US16/843,244 Division US11835388B2 (en) | 2015-10-02 | 2020-04-08 | Light detection device |
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JP (1) | JP6945450B2 (ja) |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2018203495A1 (ja) * | 2017-05-01 | 2018-11-08 | 浜松ホトニクス株式会社 | 光計測制御プログラム、光計測システム及び光計測方法 |
JPWO2018230567A1 (ja) * | 2017-06-13 | 2020-04-16 | 浜松ホトニクス株式会社 | 光学フィルタシステム |
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JP7388815B2 (ja) | 2018-10-31 | 2023-11-29 | 浜松ホトニクス株式会社 | 分光ユニット及び分光モジュール |
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US11959802B2 (en) | 2018-12-12 | 2024-04-16 | Robert Bosch Gmbh | Spectrometer device and method for producing a spectrometer device |
DE102018221522A1 (de) | 2018-12-12 | 2020-06-18 | Robert Bosch Gmbh | Spektrometervorrichtung und Verfahren zum Herstellen einer Spektrometervorrichtung |
WO2020234139A1 (de) | 2019-05-21 | 2020-11-26 | Robert Bosch Gmbh | Interferometereinrichtung und verfahren zum herstellen einer interferometereinrichtung |
WO2021043457A1 (de) | 2019-09-03 | 2021-03-11 | Robert Bosch Gmbh | Interferometereinrichtung und verfahren zum herstellen einer interferometereinrichtung |
CN114514449A (zh) * | 2019-10-04 | 2022-05-17 | 浜松光子学株式会社 | 分光单元和分光模块 |
JP2021060249A (ja) * | 2019-10-04 | 2021-04-15 | 浜松ホトニクス株式会社 | 分光ユニット及び分光モジュール |
WO2021065668A1 (ja) * | 2019-10-04 | 2021-04-08 | 浜松ホトニクス株式会社 | 分光ユニット及び分光モジュール |
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EP3358320A4 (en) | 2019-07-17 |
CN113358223A (zh) | 2021-09-07 |
US20240019304A1 (en) | 2024-01-18 |
US11835388B2 (en) | 2023-12-05 |
US20180292267A1 (en) | 2018-10-11 |
EP3358320A1 (en) | 2018-08-08 |
TWI743053B (zh) | 2021-10-21 |
CN108139270A (zh) | 2018-06-08 |
TW201725367A (zh) | 2017-07-16 |
JP6945450B2 (ja) | 2021-10-06 |
US20200232852A1 (en) | 2020-07-23 |
CN108139270B (zh) | 2021-06-08 |
US10656020B2 (en) | 2020-05-19 |
KR20180062463A (ko) | 2018-06-08 |
JPWO2017057372A1 (ja) | 2018-07-19 |
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