WO2017056127A1 - Structure de connexion pour connecteur - Google Patents

Structure de connexion pour connecteur Download PDF

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Publication number
WO2017056127A1
WO2017056127A1 PCT/JP2015/004930 JP2015004930W WO2017056127A1 WO 2017056127 A1 WO2017056127 A1 WO 2017056127A1 JP 2015004930 W JP2015004930 W JP 2015004930W WO 2017056127 A1 WO2017056127 A1 WO 2017056127A1
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WO
WIPO (PCT)
Prior art keywords
pair
terminals
insulating housing
differential
terminal
Prior art date
Application number
PCT/JP2015/004930
Other languages
English (en)
Japanese (ja)
Inventor
直之 小野
林　攻
Original Assignee
Smk株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smk株式会社 filed Critical Smk株式会社
Priority to JP2016508510A priority Critical patent/JP6436162B2/ja
Priority to PCT/JP2015/004930 priority patent/WO2017056127A1/fr
Priority to CN201580003883.4A priority patent/CN108352659B/zh
Priority to TW105131347A priority patent/TWI618318B/zh
Publication of WO2017056127A1 publication Critical patent/WO2017056127A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching

Definitions

  • the present invention relates to a connector connection structure that solder-connects a pair of differential signal terminals of a connector through which a high-frequency signal of opposite phase flows to a signal pattern on a wiring board, and more specifically, a shield shell of a connector that shields differential signal terminals.
  • the present invention relates to a connector connection structure for grounding a metal fitting to a ground pattern on a wiring board around a solder connection position between a differential signal terminal and a signal pattern.
  • the connector 100 described in Patent Document 1 used for high-speed data transmission such as a USB connector conforming to the USB (Universal Serial Bus) standard for connecting a host device and peripheral devices is as shown in FIGS.
  • a support plate portion 102a of the insulating housing 102 protrudes into the fitting recess 101 into which the mating plug is inserted, and the plug contact portions 104a of the plurality of terminals 104 attached to the insulating housing 102 serve as the support plate portion 102a. It is exposed on the back surface and contacts the plug-side terminal of the mating plug, and the leg portion 104 b of each terminal 104 protrudes from the back surface of the insulating housing 102.
  • the leg portions 104b of the terminals 104 protruding from the back surface of the insulating housing 102 are bent downward in a crank shape so as to be flush with the bottom surface of the insulating housing 102, and are arranged along the bottom surface of the insulating housing 102.
  • the connector 100 is connected to the printed wiring board by soldering to the corresponding signal pattern exposed on the facing surface of the wiring board (not shown).
  • the fitting recess 101 of the connector 100 is also fitted with the shield shell fitting 105 grounded.
  • a grounding piece 105b formed of a cylindrical portion 105a and bent outwardly at a right angle along the bottom surface of the insulating housing 102 at the lower end thereof is solder-connected to the grounding pattern of the printed wiring board exposed on the opposite surface, and the shield shell metal fitting 105 is a ground potential.
  • the shield shell metal fitting 105 surrounding each terminal 104 shields the plug side terminal and the terminal 104 of the connector 100 from the outside and electromagnetically shields them. The noise is not superimposed.
  • the shield shell fitting 105 that surrounds each terminal 104 in a cylindrical shape cannot shield the leg 104b of each terminal 104 protruding from the back of the insulating housing 102 from the outside.
  • the entire leg portion 104b of each terminal 104 is surrounded by a shield cover 106 formed by bending a conductive metal plate so as to surround the space on the back side of the insulating housing 102.
  • the lower end of the shield cover 106 is also a grounding piece 106a that is bent outward at a right angle along the bottom surface of the insulating housing 102, and is connected to the grounding pattern of the printed wiring board exposed on the opposite surface by soldering. 106 is a ground potential.
  • each terminal 104 protruding from the back surface of the insulating housing 102 is surrounded by a shield cover 106 which is temporarily grounded, so that it is shielded from the outside. Therefore, unnecessary inductance is generated in the high-frequency transmission path that flows through the terminal 104. This problem becomes more prominent as the frequency of the high-frequency signal flowing through the terminal 104 becomes higher. If the transfer speed of the terminal 104 is 640 MB / s under the USB 3.0 or higher standard, a transmission loss that cannot be ignored.
  • a pair of differential signal terminals If the grounding position of the shield cover 106 or the shield cover 106 with the ground potential is biased toward one of the two, the parasitic capacitance hanging from each differential signal line is different, and therefore, the parasitic capacitance is added to the differential current repeated in the opposite phase. If a difference between the two is generated and the frequency of the high frequency signal is increased, a common mode current having a magnitude that cannot be ignored is generated.
  • the pin assignments of the plurality of terminals arranged along the upper surface of the support plate portion 102a and the plurality of terminals arranged along the lower surface are made symmetrical, so that the mating plug The plug-side terminal can be electrically connected to the corresponding terminal 104 even if it is inserted into the fitting recess 101 in either the front or back orientation.
  • the present invention has been made in view of such problems, and even if a high-frequency signal having a high frequency with a transfer rate of 640 MB / s flows by reducing the inductance generated at the connection portion between the terminal and the wiring board, the present invention has been made.
  • a connector connection structure includes a plurality of terminals attached to an insulating housing by being insulated from each other, and a plurality of terminals attached to the outer surface of the insulating housing and attached to the insulating housing.
  • at least a pair of terminals attached adjacent to the insulating housing are a pair of differential signal terminals in which a high-frequency signal having a reverse phase flows between the pair of terminals, and the wiring board is disposed on the back surface of the insulating housing. Solder-connect each differential terminal leg of the pair of differential signal terminals to the signal pattern of the opposing wiring board at the protruding position where each differential terminal leg protrudes from the back of the insulating housing.
  • the shield ground connection portion is disposed around the protruding position of the pair of differential terminal legs at a first ground connection position that is symmetrical with respect to each protruding position of the pair of differential terminal legs. It is characterized in that each projecting position of the terminal leg is soldered to the first ground pattern of the wiring board having a symmetrical shape.
  • the first ground connection position where the shield ground connection part is disposed is equidistant from each pair of projecting positions around each projecting position of the pair of differential terminal legs, and the shield ground connection part is solder-connected. Since the first grounding pattern is symmetrical with respect to the protruding positions of the pair of differential terminal legs, the first grounding pattern between the pair of differential signal terminals grounded with the shielded ground connection part and the first grounding pattern.
  • the parasitic capacitances generated in are substantially equal and no common mode current is generated due to the difference in parasitic capacitance.
  • the plurality of terminals are insulated from the intermediate conductive plate mounted horizontally in the insulating housing, and are attached along each row partitioned vertically by the intermediate conductive plate.
  • the plate protrudes from the back of the insulating housing to the second ground connection position that is symmetrical about the protruding positions of the pair of differential terminal legs, around the protruding position of the pair of differential terminal legs, and the pair of differential terminals It is characterized in that each projecting position of the leg is soldered to the second ground pattern of the wiring board having a symmetrical shape.
  • the plurality of terminals are partitioned into the upper and lower rows of the insulating housing by the intermediate conductive plate which is grounded by soldering to the second ground pattern, the upper and lower rows of terminals are not high-frequency coupled.
  • the second ground connection position from which the intermediate conductive plate protrudes is equidistant from each of the pair of protrusion positions around each protrusion position of the pair of differential terminal legs, and the second ground connection to which the intermediate conductive plate is connected by soldering Since the pattern has a symmetrical shape with respect to each protruding position of the pair of differential terminal legs, the parasitic capacitance generated between the pair of differential signal terminals and the grounded intermediate conductive plate or the second ground pattern is Almost equal and no common mode current is generated due to the difference in parasitic capacitance.
  • the intermediate conductive plate and the insulating housing are integrally formed.
  • ⁇ A part of the insulating housing fills the anchor hole, and the intermediate conductive plate and the insulating housing are firmly integrated.
  • the grounded intermediate conductive plate Since the projection area of the intermediate conductive plate closest to the pair of differential signal terminals has no anchor hole, the grounded intermediate conductive plate has the same shape at the same distance for each pair of differential signal terminals.
  • the parasitic capacitance generated between the pair of differential signal terminals and the grounded intermediate conductive plate is substantially equal, and no common mode current is generated due to the difference in parasitic capacitance.
  • the connector connection structure according to claim 4 is characterized in that a plurality of anchor holes drilled on both sides of the projection area are drilled in a shape that is symmetrical with respect to the projection area.
  • the anchor holes drilled in the vicinity of the pair of differential signal terminals are formed in a symmetrical shape with respect to the projection region, the anchor holes are formed between the pair of differential signal terminals and the grounded intermediate conductive plate.
  • the parasitic capacitances generated in are substantially equal and no common mode current is generated due to the difference in parasitic capacitance.
  • a connector connecting structure comprising: a plurality of anchor holes formed in each of the projection regions in which a plurality of anchor holes are formed in the intermediate conductive plate and a pair of differential signal terminals are projected onto the intermediate conductive plate.
  • Each projection region is formed in a shape that is symmetrical.
  • a part of the insulating housing fills the anchor hole, the intermediate conductive plate and the insulating housing are firmly integrated, and the anchor hole formed in each projection area of the pair of differential signal terminals is symmetrical with respect to each projection area. Since it is formed in a shape, the parasitic capacitance generated between the pair of differential signal terminals and the grounded intermediate conductive plate is substantially equal, and no common mode current is generated due to the difference in parasitic capacitance.
  • the back surface of the insulating housing is covered with a ground layer of a multilayer board.
  • leg portions and signal patterns of a large number of terminals protruding from the back of the insulating housing are shielded from the outside by the shield ground connection portion of the shield shell metal fitting and the ground layer of the multilayer board.
  • the pair of differential signal terminals arranged adjacent to the insulating housing is connected to the second intermediate conductive plate. Since the parasitic capacitance between the two ground connection positions and the second ground pattern is substantially equal, even if a high-frequency signal of opposite phase flows to the pair of differential signal terminals, no common mode noise is generated at the pair of differential signal terminals. .
  • the pair of differential signal terminals disposed adjacent to the insulating housing even when the intermediate conductive plate grounded in the insulating housing is mounted in parallel with the pair of differential signal terminals. Since the parasitic capacitance between the surrounding conductive plates is substantially equal, no common mode noise is generated at the pair of differential signal terminals.
  • the leg portions and signal patterns of a large number of terminals protruding from the back surface of the insulating housing can be shielded from the outside simply by covering the back surface of the insulating housing with the multilayer substrate on which the ground layer is laminated.
  • FIG. 1 is a plan view of a connector connection structure 1 according to an embodiment of the present invention.
  • 3 is a perspective view showing a state in which the connector 10 is connected to the wiring board 20.
  • FIG. It is the perspective view which looked at the connector 10 from diagonally upward on the back side.
  • 1 is a longitudinal sectional view of a connector 10.
  • FIG. 5 is an exploded perspective view showing a process of assembling a large number of terminals 3 to the insulating housing 2.
  • FIG. It is a longitudinal cross-sectional view of the insulating housing 2 to which a large number of terminals 3 and intermediate conductive plates 5 are attached.
  • It is a disassembled perspective view which shows the assembly process which attaches the shield shell metal fitting 4 to the outer surface of the insulation housing 2 shown in FIG.
  • FIG. 4 is a perspective view of a main part showing connection between the connector 10 and the wiring board 20.
  • FIG. It is a principal part enlarged rear view which shows the relationship between each protrusion position of a pair of differential terminal leg part 31a, and the 1st grounding pattern 23A and the 2nd grounding pattern 23B.
  • FIG. 4 is a plan view showing a relationship between the intermediate conductive plate 5 and projection regions 7a and 7b obtained by projecting a pair of differential signal terminals 31 onto the intermediate conductive plate 5.
  • FIG. 3 is an explanatory diagram showing pin assignment as seen from the back side of the connector 10. It is the perspective view which looked at the conventional connector 100 from the front side. It is the disassembled perspective view which looked at the connector 100 from the upper diagonal back side.
  • the connector connection structure 1 connects the connector 10 to the surface of a flexible wiring board (hereinafter referred to as FPC) 20 arranged in parallel to the back surface of the connector 10.
  • FPC flexible wiring board
  • the connector 10 is a USB connector conforming to the USB 3.1 standard, and is shown in FIG. 11 as an insulating housing 2 including a housing body 2A, an upper sub-housing 2B, and a lower sub-housing 2C shown in FIG.
  • twelve terminals 3 (A1 to A12) and 3 (B1 to B12) are attached to each other along two upper and lower AB rows.
  • A1 and A12 on both sides of the upper row A are grounded and connected to the ground terminal to be at ground potential
  • A4 and A9 are Vbus terminals for supplying DC 5V
  • A5 is a CC1 terminal for transmitting high power in the USB power delivery mode.
  • A8 is the SBU1 terminal of the secondary bus.
  • A6 and A7 are a D + terminal and a D ⁇ terminal that are connected to a USB plug conforming to the USB 2.0 standard and transmit / receive data, and the remaining A2, A3, A10, and A11 are paired with each other and USB SuperSpeed.
  • This is a differential signal terminal 3 for transferring data at high speed in the mode or USB SuperSpeed + mode (hereinafter, only the differential signal terminal is denoted by 31).
  • A2 and A3 are a TX1 + terminal 31 and a TX1-terminal 31 that transmit data at high speed as a pair.
  • a high-frequency signal obtained by converting 8 bits into 10 bits is transmitted to the TX1 + terminal 31 and TX1-
  • the terminal 31 is in reverse phase and flows in the transmission direction at a maximum transmission speed of 640 MB / s (5 Gbps).
  • TX1 + terminal 31 and TX1- terminal 31 which are attached to insulating housing 2 adjacent to each other in reverse phase, even if noise is added from the outside, it is equally added to both, and the influence of noise is affected. Transfer data can be accurately decoded from the difference voltage between the two not received. Further, since currents in opposite directions flow through the pair of TX1 + terminal 31 and TX1-terminal 31, the magnetic flux is canceled and EMI noise due to harmonics of the high frequency signal is reduced.
  • A10 and A11 are an RX1-terminal 31 and an RX1 + terminal 31 that receive data at high speed as a pair.
  • a high-frequency signal obtained by converting 8 bits into 10 bits is an RX1 + terminal 31 and an RX1-terminal. 31 is reversed in phase and flows in the receiving direction at a maximum transmission speed of 640 MB / s (5 Gbps).
  • a pair of data communication lines per lane is provided in each direction of transmission / reception for full-duplex communication so that no high-frequency coupling occurs between communication signal lines for transmission / reception.
  • the TX1 + terminal 31 and the TX1-terminal 31 that are paired in the transmission direction and the RX1 + terminal 31 and the RX1-terminal 31 that are paired in the reception direction are separated from each other on the left and right sides of the insulating housing 2 adjacent to the GND terminal. It is attached to.
  • each terminal 3 (A1 to A12) in row A is integrally formed at an equal pitch in the left-right direction in an upper sub-housing 2B formed of insulating synthetic resin, and the upper sub-housing 2B is formed in the housing body 2A. It inserts in the recessed part 12 of this from back, and is attached to the insulating housing 2 along the front-back direction.
  • the leg portions 3a of the terminals 3 (A1 to A12) protruding rearward of the upper sub-housing 2B face the surface of the FPC 20 attached along the back surface of the insulating housing 2. Further, it is bent at a right angle upward. Further, as shown in FIG.
  • each terminal 3 protruding forward from the upper sub-housing 2B is along the upper surface of the support plate portion 11 protruding horizontally in front of the housing body 2A.
  • the contact portion 3 b is exposed and comes into contact with the mating plug inserted from the front along the support plate portion 11.
  • the 12 terminals 3 (B1 to B12) in the lower B row are the same terminals as the respective terminals 3 (A1 to A12) in the upper A row arranged at the left and right symmetrical positions. That is, B1 and B12 are GND terminals, B4 and B9 are Vbus terminals, B5 is a CC terminal, B8 is an SBU terminal, B6 and B7 are D + terminals, D ⁇ terminals, and B2 and B3 are a pair.
  • the TX2 + terminal 31 and the TX2- terminal 31, which transmit data at high speed, and the B10 and B11, as a pair, are an RX2-terminal 31 and an RX2 + terminal 31 which receive data at high speed.
  • the terminals 3 (B1 to B12) in the B row are integrally formed at a constant pitch in the left-right direction in the lower sub-housing 2C formed of insulating synthetic resin, and the lower sub-housing 2C is connected to the upper sub-housing.
  • 2B is inserted into the recess 12 of the lower housing body 2A from behind, and is attached to the insulating housing 2 along the front-rear direction below the terminals 3 (A1 to A12) in the A row.
  • each terminal 3 (B1 to B12) protruding rearward of the lower sub-housing 2C in a state attached to the housing body 2A is bent downward at a right angle so as to face the surface of the FPC 20 in the same manner. Yes. Further, the front portion of each terminal 3 (B1 to B12) protruding forward from the lower sub-housing 2C is along the lower surface of the support plate portion 11 protruding horizontally in front of the housing body 2A as shown in FIG. The contact portion 3 b is exposed and comes into contact with the mating plug inserted from the front along the support plate portion 11.
  • the mating plug inserted along the support plate portion 11 of the connector 10 can be arranged in the A row or in the insertion posture in which the electrode contacting each terminal 3 of the connector 10 is exposed on either the upper surface or the lower surface.
  • the corresponding terminal 3 in any of the B rows is contacted.
  • the counterpart plug is connected to any of the upper and lower terminals 3 (A1 to A12) and 3 (B1 to B12), the effective maximum transfer rate is further doubled using 8 data communication lines of 2 lanes. The speed can be.
  • the TX1 + terminal 31 that is a pair of A2 and A3 in the upper A row, the TX1 ⁇ terminal 31 and the RX1 ⁇ terminal 31 that is a pair of A10 and A11, and the RX1 + terminal 31 are above and below the insulating housing 2, respectively.
  • an intermediate conductive plate 5 that is grounded by soldering to the second ground pattern 23B of the FPC 20 is insulated from the terminals 3 in the A row and the B row, as will be described later. It arrange
  • the intermediate conductive plate 5 is insert-molded when the housing body 2A is molded, and is integrally attached along the horizontal plane in the middle of the housing body 2A including the support plate portion 11 in the vertical direction. Accordingly, the mechanical strength of the flat and thin support plate portion 11 is reinforced by the rigid intermediate conductive plate 5.
  • a large number of anchor holes 6 are formed in the intermediate conductive plate 5, and the molten resin flowing into the anchor holes 6 when the housing body 2 ⁇ / b> A is insert-molded is cured.
  • the housing body 2A is firmly integrated.
  • the anchor hole 6 is formed so as to avoid projection regions 7a and 7b indicated by broken lines in the figure in which each pair of differential signal terminals 31 attached to the insulating housing 2 is projected onto the intermediate conductive plate 5 in the vertical direction.
  • the shapes and positions of the anchor holes 6 drilled on the left and right sides of the projection areas 7a and 7b are formed so as to be symmetrical with respect to the pair of projection areas 7a and 7b.
  • the symmetry with respect to the pair of projection regions 7a and 7b means that the symmetry is about the center line between the pair of projection regions 7a and 7b whose longitudinal direction is the front-rear direction. Therefore, the parasitic capacitance generated between the pair of differential signal terminals 31 and 31 and the intermediate conductive plate 5 in which the adjacent anchor hole 6 is formed is substantially equal to each other, and the common mode current due to the difference of the parasitic capacitance is generated. Does not occur. *
  • the contour of the intermediate conductive plate 5 embedded in the support plate portion 11 matches the left and right contours of the support plate portion 11, and as shown in FIG.
  • the intermediate conductive plate 5 is exposed along both side surfaces.
  • the front of both side surfaces of the support plate 11 where the intermediate conductive plate 5 is exposed in the middle protrudes to the left and right, and engages with an engagement recess (not shown) of the mating plug inserted from the front along the support plate 11. It becomes the engaging protrusion 8 to do. Since both side surfaces of the intermediate conductive plate 5 formed of a metal plate constitute a part of the engaging protrusion 8, the engaging protrusion 8 is not bent or damaged, and the engaging recess of the mating plug is engaged. And engage securely. Further, when the engaging recess of the mating plug is formed of a metal plate having a ground potential, both side surfaces of the intermediate conductive plate 5 facing the engaging protrusion 8 are also in contact with the engaging recess and are grounded.
  • the intermediate conductive plate 5 is mounted horizontally at an intermediate height of the recess 2b that opens to the rear of the housing-main body 2A, and each terminal 3 (A1 to A12) in the above-mentioned row A is integrated.
  • the molded upper sub-housing 2B and the lower sub-housing 2C in which the B rows of terminals 3 (B1 to B12) are integrally formed are accommodated separately above and below the recess 2b partitioned by the intermediate conductive plate 5, respectively. Is done. As shown in FIG.
  • the upper sub-housing 2B and the lower sub-housing 2C are rearward with respect to the rear by a locking means (not shown) at a position where the rear surface is continuous with the rear surface of the housing-main body 2A around the recess 2b.
  • the back surface 2D of the insulating housing 2 is a vertical surface with no unevenness.
  • the twelve terminals 3 (A1 to A12) and 3 (B1 to B12) attached to the insulating housing 2 at equal pitches in the horizontal direction along the upper row A and the lower row B are arranged along the front-rear direction.
  • Each terminal leg 3a is protruded from the protruding position of the back surface 2D of the attached insulating housing 2.
  • the differential signal terminals 31 for transferring data at high speed are provided with four pairs of differential signals, as shown in FIG. 8, since the pair of differential signal terminals 31 are mounted adjacent to the insulating housing 2.
  • the differential terminal legs 31a of the terminals 31 protrude from regions distributed on the left and right sides of each stage partitioned by the intermediate conductive plate 5 into an upper stage and a lower stage and each pair of differential terminal legs 31a. Protrudes backward from adjacent positions in each region.
  • the intermediate conductive plate 5 is formed from six positions on the back surface 2 ⁇ / b> D of the insulating housing 2 in order to solder-connect to the second ground pattern 23 ⁇ / b> B of the FPC 20 attached along the back surface of the insulating housing 2.
  • the grounding legs 50a, 50b, 50c, 50d, 50e, and 50f are protruded rearward.
  • Each plate ground leg 50a, 50b, 50c, 50d, 50e, 50f is a rear surface of the insulating housing 2 at a second ground connection position that is symmetrical with respect to each projecting position of the pair of differential terminal legs 31a projecting around it. Protruding from.
  • being symmetrical about each protruding position of the pair of differential terminal legs 31a means being symmetrical about a vertical line passing through the midpoint of each protruding position of the pair of differential terminal legs 31a.
  • the protruding position of the plate grounding leg 50b is the middle of the protruding position of the differential terminal leg 31a of the RX1-terminal 31 and the protruding position of the differential terminal leg 31a of the RX1 + terminal 31.
  • TX2 is a position that is equidistant from any protruding position that is symmetric with respect to the vertical line passing through the point, and the protruding position of the differential terminal leg 31a of the TX2 + terminal 31 and TX2 that form a pair in the lower B row -It is also a symmetrical position with respect to a vertical line passing through the midpoint of the protruding position of the differential terminal leg 31a of the terminal 31.
  • the protruding position of the plate ground leg 50e is the difference between the protruding position of the differential terminal leg 31a of the TX1-terminal 31 and the protruding position of the differential terminal leg 31a of the TX1 + terminal 31, which is a pair in the upper row A.
  • the plate grounding legs 50b and 50e protruding from the back surface 2D of the insulating housing 2 around the protruding positions of the pair of differential terminal legs 31a are equidistant from the protruding positions of the pair of differential terminal legs 31a. It protrudes at the position.
  • a conductive metal plate is formed in a horizontally long cylindrical shape on the outer periphery of the insulating housing 2 to which 12 terminals 3 (A1 to A12) and 3 (B1 to B12) are attached for each row along the two AB rows.
  • the shield shell metal fitting 4 that has been bent is attached.
  • the shield shell metal fitting 4 is attached to the insulation housing 2 by inserting the insulation housing 2 from the rear side of the shield shell metal fitting 4 so that the back surface 2D of the insulation housing 2 and the rear end face of the shield shell metal fitting 4 coincide with each other.
  • the locking claw 41 cut and raised from a part of the flat surface and the bottom surface of the shield shell metal fitting 4 is locked and attached to the locking hole 13 of the insulating housing 2.
  • the periphery of the support plate portion 11 where the contact portion 3b of each terminal 3 is exposed on the front and back surfaces is cylindrical with a fitting recess 9 into which the mating plug is inserted.
  • the shield ground legs 40a to 40h constituting the shield ground connection portion soldered to the first ground pattern 23A of the FPC 20 from the eight positions along the ring shape of the rear end surface thereof are It protrudes toward you.
  • the shield grounding legs 40a to 40h protrude rearward of the insulating housing 2 at first ground connection positions that are symmetrical with respect to the protruding positions of the pair of differential terminal legs 31a protruding from the back surface of the insulating housing 2 around the shield grounding legs 40a to 40h. ing.
  • the shield grounding leg 40b is equidistant from the protruding position of the differential terminal leg 31a of the RX1-terminal 31 and the protruding position of the differential terminal leg 31a of the RX1 + terminal 31, which is a pair in the upper A row.
  • the shield grounding leg 40d protrudes from the protruding position of the differential terminal leg 31a of the TX1-terminal 31 and the protruding position of the differential terminal leg 31a of the TX1 + terminal 31. It protrudes at a peripheral position that is equidistant.
  • the shield ground leg 40f is equidistant from the projecting position of the differential terminal leg 31a of the RX2 + terminal 31 and the projecting position of the differential terminal leg 31a of the RX2-terminal 31 which form a pair in the lower B row.
  • the shield ground leg 40h protrudes at the protruding position of the differential terminal leg 31a of the TX2 + terminal 31 and the protruding of the differential terminal leg 31a of the TX2-terminal 31. It protrudes at a peripheral position that is equidistant from the position.
  • the shield grounding legs 40b, 40d, 40f, and 40h that protrude from the periphery of the back surface 2D of the insulating housing 2 around the protruding position of the pair of differential terminal legs 31a are respectively connected to the pair of differential terminal legs 31a. It protrudes at a position that is equidistant from the protruding position.
  • the FPC 20 to which the connector 10 configured in this way is connected to the back surface 2D of the insulating housing 2 of the connector 10 on the signal pattern 22, the first ground pattern 23A, and the second ground pattern 23B. It is attached along the back surface 2D with the exposed surface of the ground pattern consisting of
  • the FPC 20 is composed of a multilayer substrate, and the first ground pattern 23A and the second ground pattern 23B exposed on the surface pass through the ground layer 21 with the ground potential formed on the bottom layer on the back surface side with the front surface side of the FPC 20 as an upper layer. It is electrically connected via a hall.
  • the ground layer 21 is formed evenly at the terminal portion of the FPC 20 that surrounds at least the rear of the connector 10 to be connected (see FIG. 8), whereby the rear side 2D of the insulating housing 2 including the connection portion of the differential signal terminal 31 is formed. It is shielded by the ground layer 21.
  • the signal patterns 22 exposed on the surface are drawn out through an intermediate conductive layer different from the ground layer 21 while being insulated from each other.
  • the connector 10 and the FPC 20 are relatively positioned and positioned by inserting the positioning protrusions 42 protruding from the left and right sides of the shield shell metal fitting 4 into the positioning holes 24 drilled at two positions of the FPC 20.
  • the signal pattern 22, the first ground pattern 23A, and the second ground pattern 23B exposed on the surface of the FPC 20 are respectively leg portions 3a (differential terminal leg portions) of the corresponding terminals 3 (differential signal terminals 31). 31a), formed so as to face the projecting positions of the respective leg portions so as to be solder-connected to the shield grounding leg portions 40a to 40h of the shield shell metal fitting 4 and the plate grounding leg portions 50a to 50f of the intermediate conductive plate 5.
  • the signal pattern 22 for solder-connecting the differential terminal legs 31a is denoted by reference numeral 22 ', and the first ground pattern 23A formed around each protruding position of the pair of differential terminal legs 31a.
  • the second ground pattern 23B are denoted by reference numerals 23A 'and 23B', respectively.
  • the shield grounding legs 40b, 40d, 40f, and 40h are grounded by soldering to the first grounding pattern 23A of the opposing FPC 20 at the protruding position, and therefore the grounding position of the shield shell metal fitting 4 is also a pair of differentials.
  • the distance from each protruding position of the terminal leg portion 31a is an equidistant position.
  • the pattern shape of the first ground pattern 23A ′ solder-connected to the shield ground legs 40b, 40d, 40f, and 40h around the protruding positions of the pair of differential terminal legs 31a is the same as the pair of differential terminal legs.
  • a shield ground leg for a pair of differential signal terminals 31 is formed.
  • Parasitic capacitance generated between the portions 40b, 40d, 40f, 40h and the first ground pattern 23A ′ is substantially equal, and common mode noise is generated even if a high-frequency signal of opposite phase flows between the pair of differential signal terminals 31. do not do.
  • the grounding position of the intermediate conductive plate 5 is also a pair of differential terminal legs.
  • the distance from each protruding position of 31a is an equidistant position.
  • the pattern shape of the second ground pattern 23B ′ that is solder-connected to the plate ground legs 50b and 50e around the protruding positions of the pair of differential terminal legs 31a is also different from the protrusions of the pair of differential terminal legs 31a.
  • the parasitic capacitance generated between the plate ground legs 50b and 50e and the second ground pattern 23B ′ for the pair of differential signal terminals 31 is substantially equal. Even if a high-frequency signal having a reverse phase flows between the differential signal terminals 31, no common mode noise is generated.
  • the anchor holes 6 are formed avoiding the projection areas 7a and 7b indicated by the broken lines in FIG. 10 in which each pair of differential signal terminals 31 is projected onto the intermediate conductive plate 5 in the vertical direction.
  • the position and shape of the anchor hole 6 are symmetrical with respect to the projection areas 7a and 7b, so that a part or the whole of the anchor hole 6 is drilled in the projection areas 7a and 7b.
  • the parasitic capacitance generated between the anchor hole 6 and the intermediate conductive plate 5 is substantially equal to each other, and no common mode current is generated due to the difference in parasitic capacitance.
  • the connector 10 has been described as a USB socket conforming to the USB 3.1 standard. However, if the connector 10 is a connector in which a high-frequency signal having a reverse phase flows at least at a pair of terminals arranged adjacent to the insulating housing, The invention can be applied.
  • the connector 10 does not necessarily have to include the intermediate conductive plate 5 described in the above embodiment.
  • the present invention is suitable for a connector connection structure in which a connector that cancels noise by flowing a high-frequency signal of opposite phase to a pair of terminals is connected to a wiring board.

Landscapes

  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

L'invention concerne des parties de patte (31a) de borne différentielle d'une paire de bornes à signal différentiel (31) qui sont connectées en étant soudées, au niveau de leurs positions en saillie sur la surface arrière d'un boîtier d'isolation (2), à des modèles de signal (22) respectifs sur une plaque de base de câblage (20) opposée, et des parties de connexion de mise à la terre de blindage (40a à 40h) qui sont disposées à des positions de connexion de mise à la terre qui sont liées par une symétrie basée sur les deux positions en saillie de la paire de parties de patte (31a) de borne différentielle, et sont connectées en étant soudées à des modèles de mise à la terre (23A') respectifs sur la plaque de base de câblage (20) qui est de forme symétrique sur la base des positions en saillie de la paire de parties de patte (31a) de borne différentielle. Étant donné que des capacités parasites qui se produisent entre les parties de connexion de mise à la terre de blindage (40a à 40h) mises à la terre ou le modèle de mise à la terre (23A') et chacune de la paire de bornes à signal différentiel (31) sont approximativement égales, aucun courant de mode commun dû à la différence de capacités parasites n'est généré même si un signal différentiel haute fréquence s'écoule dans la paire de bornes à signal différentiel (31).
PCT/JP2015/004930 2015-09-29 2015-09-29 Structure de connexion pour connecteur WO2017056127A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016508510A JP6436162B2 (ja) 2015-09-29 2015-09-29 コネクタの接続構造
PCT/JP2015/004930 WO2017056127A1 (fr) 2015-09-29 2015-09-29 Structure de connexion pour connecteur
CN201580003883.4A CN108352659B (zh) 2015-09-29 2015-09-29 连接器的连接构造
TW105131347A TWI618318B (zh) 2015-09-29 2016-09-29 Connector connection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/004930 WO2017056127A1 (fr) 2015-09-29 2015-09-29 Structure de connexion pour connecteur

Publications (1)

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WO2017056127A1 true WO2017056127A1 (fr) 2017-04-06

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PCT/JP2015/004930 WO2017056127A1 (fr) 2015-09-29 2015-09-29 Structure de connexion pour connecteur

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JP (1) JP6436162B2 (fr)
CN (1) CN108352659B (fr)
TW (1) TWI618318B (fr)
WO (1) WO2017056127A1 (fr)

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CN108736258A (zh) * 2017-04-24 2018-11-02 矽玛科技股份有限公司 利用接地片的接地脚降低双排端子间信号干扰的连接器
JP2019117837A (ja) * 2017-12-26 2019-07-18 シーシーエス株式会社 発光装置
CN110391538A (zh) * 2018-04-20 2019-10-29 安波福中央电气（上海）有限公司 电气连接器及其制造方法
CN112838444A (zh) * 2019-11-05 2021-05-25 沈晓萱 可降低信号干扰的连接器
JP2021190244A (ja) * 2020-05-28 2021-12-13 ヒロセ電機株式会社 充電用コネクタユニット

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JP2007080782A (ja) * 2005-09-16 2007-03-29 Japan Aviation Electronics Industry Ltd 電気コネクタ
JP2009231053A (ja) * 2008-03-24 2009-10-08 Tyco Electronics Amp Kk 電気コネクタ
JP2011154954A (ja) * 2010-01-28 2011-08-11 Japan Aviation Electronics Industry Ltd コネクタ
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Publication number Priority date Publication date Assignee Title
CN108736258A (zh) * 2017-04-24 2018-11-02 矽玛科技股份有限公司 利用接地片的接地脚降低双排端子间信号干扰的连接器
JP2019117837A (ja) * 2017-12-26 2019-07-18 シーシーエス株式会社 発光装置
JP7007180B2 (ja) 2017-12-26 2022-01-24 シーシーエス株式会社 発光装置
CN110391538A (zh) * 2018-04-20 2019-10-29 安波福中央电气（上海）有限公司 电气连接器及其制造方法
CN112838444A (zh) * 2019-11-05 2021-05-25 沈晓萱 可降低信号干扰的连接器
JP2021190244A (ja) * 2020-05-28 2021-12-13 ヒロセ電機株式会社 充電用コネクタユニット
JP7402746B2 (ja) 2020-05-28 2023-12-21 ヒロセ電機株式会社 充電用コネクタユニット

Also Published As

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CN108352659B (zh) 2019-06-11
JP6436162B2 (ja) 2018-12-12
JPWO2017056127A1 (ja) 2018-03-22
CN108352659A (zh) 2018-07-31
TW201712975A (en) 2017-04-01
TWI618318B (zh) 2018-03-11

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