WO2017056127A1 - Connection structure for connector - Google Patents

Connection structure for connector Download PDF

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Publication number
WO2017056127A1
WO2017056127A1 PCT/JP2015/004930 JP2015004930W WO2017056127A1 WO 2017056127 A1 WO2017056127 A1 WO 2017056127A1 JP 2015004930 W JP2015004930 W JP 2015004930W WO 2017056127 A1 WO2017056127 A1 WO 2017056127A1
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WO
WIPO (PCT)
Prior art keywords
pair
terminals
insulating housing
differential
terminal
Prior art date
Application number
PCT/JP2015/004930
Other languages
French (fr)
Japanese (ja)
Inventor
直之 小野
林　攻
Original Assignee
Smk株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smk株式会社 filed Critical Smk株式会社
Priority to CN201580003883.4A priority Critical patent/CN108352659B/en
Priority to JP2016508510A priority patent/JP6436162B2/en
Priority to PCT/JP2015/004930 priority patent/WO2017056127A1/en
Priority to TW105131347A priority patent/TWI618318B/en
Publication of WO2017056127A1 publication Critical patent/WO2017056127A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching

Definitions

  • the present invention relates to a connector connection structure that solder-connects a pair of differential signal terminals of a connector through which a high-frequency signal of opposite phase flows to a signal pattern on a wiring board, and more specifically, a shield shell of a connector that shields differential signal terminals.
  • the present invention relates to a connector connection structure for grounding a metal fitting to a ground pattern on a wiring board around a solder connection position between a differential signal terminal and a signal pattern.
  • the connector 100 described in Patent Document 1 used for high-speed data transmission such as a USB connector conforming to the USB (Universal Serial Bus) standard for connecting a host device and peripheral devices is as shown in FIGS.
  • a support plate portion 102a of the insulating housing 102 protrudes into the fitting recess 101 into which the mating plug is inserted, and the plug contact portions 104a of the plurality of terminals 104 attached to the insulating housing 102 serve as the support plate portion 102a. It is exposed on the back surface and contacts the plug-side terminal of the mating plug, and the leg portion 104 b of each terminal 104 protrudes from the back surface of the insulating housing 102.
  • the leg portions 104b of the terminals 104 protruding from the back surface of the insulating housing 102 are bent downward in a crank shape so as to be flush with the bottom surface of the insulating housing 102, and are arranged along the bottom surface of the insulating housing 102.
  • the connector 100 is connected to the printed wiring board by soldering to the corresponding signal pattern exposed on the facing surface of the wiring board (not shown).
  • the fitting recess 101 of the connector 100 is also fitted with the shield shell fitting 105 grounded.
  • a grounding piece 105b formed of a cylindrical portion 105a and bent outwardly at a right angle along the bottom surface of the insulating housing 102 at the lower end thereof is solder-connected to the grounding pattern of the printed wiring board exposed on the opposite surface, and the shield shell metal fitting 105 is a ground potential.
  • the shield shell metal fitting 105 surrounding each terminal 104 shields the plug side terminal and the terminal 104 of the connector 100 from the outside and electromagnetically shields them. The noise is not superimposed.
  • the shield shell fitting 105 that surrounds each terminal 104 in a cylindrical shape cannot shield the leg 104b of each terminal 104 protruding from the back of the insulating housing 102 from the outside.
  • the entire leg portion 104b of each terminal 104 is surrounded by a shield cover 106 formed by bending a conductive metal plate so as to surround the space on the back side of the insulating housing 102.
  • the lower end of the shield cover 106 is also a grounding piece 106a that is bent outward at a right angle along the bottom surface of the insulating housing 102, and is connected to the grounding pattern of the printed wiring board exposed on the opposite surface by soldering. 106 is a ground potential.
  • each terminal 104 protruding from the back surface of the insulating housing 102 is surrounded by a shield cover 106 which is temporarily grounded, so that it is shielded from the outside. Therefore, unnecessary inductance is generated in the high-frequency transmission path that flows through the terminal 104. This problem becomes more prominent as the frequency of the high-frequency signal flowing through the terminal 104 becomes higher. If the transfer speed of the terminal 104 is 640 MB / s under the USB 3.0 or higher standard, a transmission loss that cannot be ignored.
  • a pair of differential signal terminals If the grounding position of the shield cover 106 or the shield cover 106 with the ground potential is biased toward one of the two, the parasitic capacitance hanging from each differential signal line is different, and therefore, the parasitic capacitance is added to the differential current repeated in the opposite phase. If a difference between the two is generated and the frequency of the high frequency signal is increased, a common mode current having a magnitude that cannot be ignored is generated.
  • the pin assignments of the plurality of terminals arranged along the upper surface of the support plate portion 102a and the plurality of terminals arranged along the lower surface are made symmetrical, so that the mating plug The plug-side terminal can be electrically connected to the corresponding terminal 104 even if it is inserted into the fitting recess 101 in either the front or back orientation.
  • the present invention has been made in view of such problems, and even if a high-frequency signal having a high frequency with a transfer rate of 640 MB / s flows by reducing the inductance generated at the connection portion between the terminal and the wiring board, the present invention has been made.
  • a connector connection structure includes a plurality of terminals attached to an insulating housing by being insulated from each other, and a plurality of terminals attached to the outer surface of the insulating housing and attached to the insulating housing.
  • at least a pair of terminals attached adjacent to the insulating housing are a pair of differential signal terminals in which a high-frequency signal having a reverse phase flows between the pair of terminals, and the wiring board is disposed on the back surface of the insulating housing. Solder-connect each differential terminal leg of the pair of differential signal terminals to the signal pattern of the opposing wiring board at the protruding position where each differential terminal leg protrudes from the back of the insulating housing.
  • the shield ground connection portion is disposed around the protruding position of the pair of differential terminal legs at a first ground connection position that is symmetrical with respect to each protruding position of the pair of differential terminal legs. It is characterized in that each projecting position of the terminal leg is soldered to the first ground pattern of the wiring board having a symmetrical shape.
  • the first ground connection position where the shield ground connection part is disposed is equidistant from each pair of projecting positions around each projecting position of the pair of differential terminal legs, and the shield ground connection part is solder-connected. Since the first grounding pattern is symmetrical with respect to the protruding positions of the pair of differential terminal legs, the first grounding pattern between the pair of differential signal terminals grounded with the shielded ground connection part and the first grounding pattern.
  • the parasitic capacitances generated in are substantially equal and no common mode current is generated due to the difference in parasitic capacitance.
  • the plurality of terminals are insulated from the intermediate conductive plate mounted horizontally in the insulating housing, and are attached along each row partitioned vertically by the intermediate conductive plate.
  • the plate protrudes from the back of the insulating housing to the second ground connection position that is symmetrical about the protruding positions of the pair of differential terminal legs, around the protruding position of the pair of differential terminal legs, and the pair of differential terminals It is characterized in that each projecting position of the leg is soldered to the second ground pattern of the wiring board having a symmetrical shape.
  • the plurality of terminals are partitioned into the upper and lower rows of the insulating housing by the intermediate conductive plate which is grounded by soldering to the second ground pattern, the upper and lower rows of terminals are not high-frequency coupled.
  • the second ground connection position from which the intermediate conductive plate protrudes is equidistant from each of the pair of protrusion positions around each protrusion position of the pair of differential terminal legs, and the second ground connection to which the intermediate conductive plate is connected by soldering Since the pattern has a symmetrical shape with respect to each protruding position of the pair of differential terminal legs, the parasitic capacitance generated between the pair of differential signal terminals and the grounded intermediate conductive plate or the second ground pattern is Almost equal and no common mode current is generated due to the difference in parasitic capacitance.
  • the intermediate conductive plate and the insulating housing are integrally formed.
  • ⁇ A part of the insulating housing fills the anchor hole, and the intermediate conductive plate and the insulating housing are firmly integrated.
  • the grounded intermediate conductive plate Since the projection area of the intermediate conductive plate closest to the pair of differential signal terminals has no anchor hole, the grounded intermediate conductive plate has the same shape at the same distance for each pair of differential signal terminals.
  • the parasitic capacitance generated between the pair of differential signal terminals and the grounded intermediate conductive plate is substantially equal, and no common mode current is generated due to the difference in parasitic capacitance.
  • the connector connection structure according to claim 4 is characterized in that a plurality of anchor holes drilled on both sides of the projection area are drilled in a shape that is symmetrical with respect to the projection area.
  • the anchor holes drilled in the vicinity of the pair of differential signal terminals are formed in a symmetrical shape with respect to the projection region, the anchor holes are formed between the pair of differential signal terminals and the grounded intermediate conductive plate.
  • the parasitic capacitances generated in are substantially equal and no common mode current is generated due to the difference in parasitic capacitance.
  • a connector connecting structure comprising: a plurality of anchor holes formed in each of the projection regions in which a plurality of anchor holes are formed in the intermediate conductive plate and a pair of differential signal terminals are projected onto the intermediate conductive plate.
  • Each projection region is formed in a shape that is symmetrical.
  • a part of the insulating housing fills the anchor hole, the intermediate conductive plate and the insulating housing are firmly integrated, and the anchor hole formed in each projection area of the pair of differential signal terminals is symmetrical with respect to each projection area. Since it is formed in a shape, the parasitic capacitance generated between the pair of differential signal terminals and the grounded intermediate conductive plate is substantially equal, and no common mode current is generated due to the difference in parasitic capacitance.
  • the back surface of the insulating housing is covered with a ground layer of a multilayer board.
  • leg portions and signal patterns of a large number of terminals protruding from the back of the insulating housing are shielded from the outside by the shield ground connection portion of the shield shell metal fitting and the ground layer of the multilayer board.
  • the pair of differential signal terminals arranged adjacent to the insulating housing is connected to the second intermediate conductive plate. Since the parasitic capacitance between the two ground connection positions and the second ground pattern is substantially equal, even if a high-frequency signal of opposite phase flows to the pair of differential signal terminals, no common mode noise is generated at the pair of differential signal terminals. .
  • the pair of differential signal terminals disposed adjacent to the insulating housing even when the intermediate conductive plate grounded in the insulating housing is mounted in parallel with the pair of differential signal terminals. Since the parasitic capacitance between the surrounding conductive plates is substantially equal, no common mode noise is generated at the pair of differential signal terminals.
  • the leg portions and signal patterns of a large number of terminals protruding from the back surface of the insulating housing can be shielded from the outside simply by covering the back surface of the insulating housing with the multilayer substrate on which the ground layer is laminated.
  • FIG. 1 is a plan view of a connector connection structure 1 according to an embodiment of the present invention.
  • 3 is a perspective view showing a state in which the connector 10 is connected to the wiring board 20.
  • FIG. It is the perspective view which looked at the connector 10 from diagonally upward on the back side.
  • 1 is a longitudinal sectional view of a connector 10.
  • FIG. 5 is an exploded perspective view showing a process of assembling a large number of terminals 3 to the insulating housing 2.
  • FIG. It is a longitudinal cross-sectional view of the insulating housing 2 to which a large number of terminals 3 and intermediate conductive plates 5 are attached.
  • It is a disassembled perspective view which shows the assembly process which attaches the shield shell metal fitting 4 to the outer surface of the insulation housing 2 shown in FIG.
  • FIG. 4 is a perspective view of a main part showing connection between the connector 10 and the wiring board 20.
  • FIG. It is a principal part enlarged rear view which shows the relationship between each protrusion position of a pair of differential terminal leg part 31a, and the 1st grounding pattern 23A and the 2nd grounding pattern 23B.
  • FIG. 4 is a plan view showing a relationship between the intermediate conductive plate 5 and projection regions 7a and 7b obtained by projecting a pair of differential signal terminals 31 onto the intermediate conductive plate 5.
  • FIG. 3 is an explanatory diagram showing pin assignment as seen from the back side of the connector 10. It is the perspective view which looked at the conventional connector 100 from the front side. It is the disassembled perspective view which looked at the connector 100 from the upper diagonal back side.
  • the connector connection structure 1 connects the connector 10 to the surface of a flexible wiring board (hereinafter referred to as FPC) 20 arranged in parallel to the back surface of the connector 10.
  • FPC flexible wiring board
  • the connector 10 is a USB connector conforming to the USB 3.1 standard, and is shown in FIG. 11 as an insulating housing 2 including a housing body 2A, an upper sub-housing 2B, and a lower sub-housing 2C shown in FIG.
  • twelve terminals 3 (A1 to A12) and 3 (B1 to B12) are attached to each other along two upper and lower AB rows.
  • A1 and A12 on both sides of the upper row A are grounded and connected to the ground terminal to be at ground potential
  • A4 and A9 are Vbus terminals for supplying DC 5V
  • A5 is a CC1 terminal for transmitting high power in the USB power delivery mode.
  • A8 is the SBU1 terminal of the secondary bus.
  • A6 and A7 are a D + terminal and a D ⁇ terminal that are connected to a USB plug conforming to the USB 2.0 standard and transmit / receive data, and the remaining A2, A3, A10, and A11 are paired with each other and USB SuperSpeed.
  • This is a differential signal terminal 3 for transferring data at high speed in the mode or USB SuperSpeed + mode (hereinafter, only the differential signal terminal is denoted by 31).
  • A2 and A3 are a TX1 + terminal 31 and a TX1-terminal 31 that transmit data at high speed as a pair.
  • a high-frequency signal obtained by converting 8 bits into 10 bits is transmitted to the TX1 + terminal 31 and TX1-
  • the terminal 31 is in reverse phase and flows in the transmission direction at a maximum transmission speed of 640 MB / s (5 Gbps).
  • TX1 + terminal 31 and TX1- terminal 31 which are attached to insulating housing 2 adjacent to each other in reverse phase, even if noise is added from the outside, it is equally added to both, and the influence of noise is affected. Transfer data can be accurately decoded from the difference voltage between the two not received. Further, since currents in opposite directions flow through the pair of TX1 + terminal 31 and TX1-terminal 31, the magnetic flux is canceled and EMI noise due to harmonics of the high frequency signal is reduced.
  • A10 and A11 are an RX1-terminal 31 and an RX1 + terminal 31 that receive data at high speed as a pair.
  • a high-frequency signal obtained by converting 8 bits into 10 bits is an RX1 + terminal 31 and an RX1-terminal. 31 is reversed in phase and flows in the receiving direction at a maximum transmission speed of 640 MB / s (5 Gbps).
  • a pair of data communication lines per lane is provided in each direction of transmission / reception for full-duplex communication so that no high-frequency coupling occurs between communication signal lines for transmission / reception.
  • the TX1 + terminal 31 and the TX1-terminal 31 that are paired in the transmission direction and the RX1 + terminal 31 and the RX1-terminal 31 that are paired in the reception direction are separated from each other on the left and right sides of the insulating housing 2 adjacent to the GND terminal. It is attached to.
  • each terminal 3 (A1 to A12) in row A is integrally formed at an equal pitch in the left-right direction in an upper sub-housing 2B formed of insulating synthetic resin, and the upper sub-housing 2B is formed in the housing body 2A. It inserts in the recessed part 12 of this from back, and is attached to the insulating housing 2 along the front-back direction.
  • the leg portions 3a of the terminals 3 (A1 to A12) protruding rearward of the upper sub-housing 2B face the surface of the FPC 20 attached along the back surface of the insulating housing 2. Further, it is bent at a right angle upward. Further, as shown in FIG.
  • each terminal 3 protruding forward from the upper sub-housing 2B is along the upper surface of the support plate portion 11 protruding horizontally in front of the housing body 2A.
  • the contact portion 3 b is exposed and comes into contact with the mating plug inserted from the front along the support plate portion 11.
  • the 12 terminals 3 (B1 to B12) in the lower B row are the same terminals as the respective terminals 3 (A1 to A12) in the upper A row arranged at the left and right symmetrical positions. That is, B1 and B12 are GND terminals, B4 and B9 are Vbus terminals, B5 is a CC terminal, B8 is an SBU terminal, B6 and B7 are D + terminals, D ⁇ terminals, and B2 and B3 are a pair.
  • the TX2 + terminal 31 and the TX2- terminal 31, which transmit data at high speed, and the B10 and B11, as a pair, are an RX2-terminal 31 and an RX2 + terminal 31 which receive data at high speed.
  • the terminals 3 (B1 to B12) in the B row are integrally formed at a constant pitch in the left-right direction in the lower sub-housing 2C formed of insulating synthetic resin, and the lower sub-housing 2C is connected to the upper sub-housing.
  • 2B is inserted into the recess 12 of the lower housing body 2A from behind, and is attached to the insulating housing 2 along the front-rear direction below the terminals 3 (A1 to A12) in the A row.
  • each terminal 3 (B1 to B12) protruding rearward of the lower sub-housing 2C in a state attached to the housing body 2A is bent downward at a right angle so as to face the surface of the FPC 20 in the same manner. Yes. Further, the front portion of each terminal 3 (B1 to B12) protruding forward from the lower sub-housing 2C is along the lower surface of the support plate portion 11 protruding horizontally in front of the housing body 2A as shown in FIG. The contact portion 3 b is exposed and comes into contact with the mating plug inserted from the front along the support plate portion 11.
  • the mating plug inserted along the support plate portion 11 of the connector 10 can be arranged in the A row or in the insertion posture in which the electrode contacting each terminal 3 of the connector 10 is exposed on either the upper surface or the lower surface.
  • the corresponding terminal 3 in any of the B rows is contacted.
  • the counterpart plug is connected to any of the upper and lower terminals 3 (A1 to A12) and 3 (B1 to B12), the effective maximum transfer rate is further doubled using 8 data communication lines of 2 lanes. The speed can be.
  • the TX1 + terminal 31 that is a pair of A2 and A3 in the upper A row, the TX1 ⁇ terminal 31 and the RX1 ⁇ terminal 31 that is a pair of A10 and A11, and the RX1 + terminal 31 are above and below the insulating housing 2, respectively.
  • an intermediate conductive plate 5 that is grounded by soldering to the second ground pattern 23B of the FPC 20 is insulated from the terminals 3 in the A row and the B row, as will be described later. It arrange
  • the intermediate conductive plate 5 is insert-molded when the housing body 2A is molded, and is integrally attached along the horizontal plane in the middle of the housing body 2A including the support plate portion 11 in the vertical direction. Accordingly, the mechanical strength of the flat and thin support plate portion 11 is reinforced by the rigid intermediate conductive plate 5.
  • a large number of anchor holes 6 are formed in the intermediate conductive plate 5, and the molten resin flowing into the anchor holes 6 when the housing body 2 ⁇ / b> A is insert-molded is cured.
  • the housing body 2A is firmly integrated.
  • the anchor hole 6 is formed so as to avoid projection regions 7a and 7b indicated by broken lines in the figure in which each pair of differential signal terminals 31 attached to the insulating housing 2 is projected onto the intermediate conductive plate 5 in the vertical direction.
  • the shapes and positions of the anchor holes 6 drilled on the left and right sides of the projection areas 7a and 7b are formed so as to be symmetrical with respect to the pair of projection areas 7a and 7b.
  • the symmetry with respect to the pair of projection regions 7a and 7b means that the symmetry is about the center line between the pair of projection regions 7a and 7b whose longitudinal direction is the front-rear direction. Therefore, the parasitic capacitance generated between the pair of differential signal terminals 31 and 31 and the intermediate conductive plate 5 in which the adjacent anchor hole 6 is formed is substantially equal to each other, and the common mode current due to the difference of the parasitic capacitance is generated. Does not occur. *
  • the contour of the intermediate conductive plate 5 embedded in the support plate portion 11 matches the left and right contours of the support plate portion 11, and as shown in FIG.
  • the intermediate conductive plate 5 is exposed along both side surfaces.
  • the front of both side surfaces of the support plate 11 where the intermediate conductive plate 5 is exposed in the middle protrudes to the left and right, and engages with an engagement recess (not shown) of the mating plug inserted from the front along the support plate 11. It becomes the engaging protrusion 8 to do. Since both side surfaces of the intermediate conductive plate 5 formed of a metal plate constitute a part of the engaging protrusion 8, the engaging protrusion 8 is not bent or damaged, and the engaging recess of the mating plug is engaged. And engage securely. Further, when the engaging recess of the mating plug is formed of a metal plate having a ground potential, both side surfaces of the intermediate conductive plate 5 facing the engaging protrusion 8 are also in contact with the engaging recess and are grounded.
  • the intermediate conductive plate 5 is mounted horizontally at an intermediate height of the recess 2b that opens to the rear of the housing-main body 2A, and each terminal 3 (A1 to A12) in the above-mentioned row A is integrated.
  • the molded upper sub-housing 2B and the lower sub-housing 2C in which the B rows of terminals 3 (B1 to B12) are integrally formed are accommodated separately above and below the recess 2b partitioned by the intermediate conductive plate 5, respectively. Is done. As shown in FIG.
  • the upper sub-housing 2B and the lower sub-housing 2C are rearward with respect to the rear by a locking means (not shown) at a position where the rear surface is continuous with the rear surface of the housing-main body 2A around the recess 2b.
  • the back surface 2D of the insulating housing 2 is a vertical surface with no unevenness.
  • the twelve terminals 3 (A1 to A12) and 3 (B1 to B12) attached to the insulating housing 2 at equal pitches in the horizontal direction along the upper row A and the lower row B are arranged along the front-rear direction.
  • Each terminal leg 3a is protruded from the protruding position of the back surface 2D of the attached insulating housing 2.
  • the differential signal terminals 31 for transferring data at high speed are provided with four pairs of differential signals, as shown in FIG. 8, since the pair of differential signal terminals 31 are mounted adjacent to the insulating housing 2.
  • the differential terminal legs 31a of the terminals 31 protrude from regions distributed on the left and right sides of each stage partitioned by the intermediate conductive plate 5 into an upper stage and a lower stage and each pair of differential terminal legs 31a. Protrudes backward from adjacent positions in each region.
  • the intermediate conductive plate 5 is formed from six positions on the back surface 2 ⁇ / b> D of the insulating housing 2 in order to solder-connect to the second ground pattern 23 ⁇ / b> B of the FPC 20 attached along the back surface of the insulating housing 2.
  • the grounding legs 50a, 50b, 50c, 50d, 50e, and 50f are protruded rearward.
  • Each plate ground leg 50a, 50b, 50c, 50d, 50e, 50f is a rear surface of the insulating housing 2 at a second ground connection position that is symmetrical with respect to each projecting position of the pair of differential terminal legs 31a projecting around it. Protruding from.
  • being symmetrical about each protruding position of the pair of differential terminal legs 31a means being symmetrical about a vertical line passing through the midpoint of each protruding position of the pair of differential terminal legs 31a.
  • the protruding position of the plate grounding leg 50b is the middle of the protruding position of the differential terminal leg 31a of the RX1-terminal 31 and the protruding position of the differential terminal leg 31a of the RX1 + terminal 31.
  • TX2 is a position that is equidistant from any protruding position that is symmetric with respect to the vertical line passing through the point, and the protruding position of the differential terminal leg 31a of the TX2 + terminal 31 and TX2 that form a pair in the lower B row -It is also a symmetrical position with respect to a vertical line passing through the midpoint of the protruding position of the differential terminal leg 31a of the terminal 31.
  • the protruding position of the plate ground leg 50e is the difference between the protruding position of the differential terminal leg 31a of the TX1-terminal 31 and the protruding position of the differential terminal leg 31a of the TX1 + terminal 31, which is a pair in the upper row A.
  • the plate grounding legs 50b and 50e protruding from the back surface 2D of the insulating housing 2 around the protruding positions of the pair of differential terminal legs 31a are equidistant from the protruding positions of the pair of differential terminal legs 31a. It protrudes at the position.
  • a conductive metal plate is formed in a horizontally long cylindrical shape on the outer periphery of the insulating housing 2 to which 12 terminals 3 (A1 to A12) and 3 (B1 to B12) are attached for each row along the two AB rows.
  • the shield shell metal fitting 4 that has been bent is attached.
  • the shield shell metal fitting 4 is attached to the insulation housing 2 by inserting the insulation housing 2 from the rear side of the shield shell metal fitting 4 so that the back surface 2D of the insulation housing 2 and the rear end face of the shield shell metal fitting 4 coincide with each other.
  • the locking claw 41 cut and raised from a part of the flat surface and the bottom surface of the shield shell metal fitting 4 is locked and attached to the locking hole 13 of the insulating housing 2.
  • the periphery of the support plate portion 11 where the contact portion 3b of each terminal 3 is exposed on the front and back surfaces is cylindrical with a fitting recess 9 into which the mating plug is inserted.
  • the shield ground legs 40a to 40h constituting the shield ground connection portion soldered to the first ground pattern 23A of the FPC 20 from the eight positions along the ring shape of the rear end surface thereof are It protrudes toward you.
  • the shield grounding legs 40a to 40h protrude rearward of the insulating housing 2 at first ground connection positions that are symmetrical with respect to the protruding positions of the pair of differential terminal legs 31a protruding from the back surface of the insulating housing 2 around the shield grounding legs 40a to 40h. ing.
  • the shield grounding leg 40b is equidistant from the protruding position of the differential terminal leg 31a of the RX1-terminal 31 and the protruding position of the differential terminal leg 31a of the RX1 + terminal 31, which is a pair in the upper A row.
  • the shield grounding leg 40d protrudes from the protruding position of the differential terminal leg 31a of the TX1-terminal 31 and the protruding position of the differential terminal leg 31a of the TX1 + terminal 31. It protrudes at a peripheral position that is equidistant.
  • the shield ground leg 40f is equidistant from the projecting position of the differential terminal leg 31a of the RX2 + terminal 31 and the projecting position of the differential terminal leg 31a of the RX2-terminal 31 which form a pair in the lower B row.
  • the shield ground leg 40h protrudes at the protruding position of the differential terminal leg 31a of the TX2 + terminal 31 and the protruding of the differential terminal leg 31a of the TX2-terminal 31. It protrudes at a peripheral position that is equidistant from the position.
  • the shield grounding legs 40b, 40d, 40f, and 40h that protrude from the periphery of the back surface 2D of the insulating housing 2 around the protruding position of the pair of differential terminal legs 31a are respectively connected to the pair of differential terminal legs 31a. It protrudes at a position that is equidistant from the protruding position.
  • the FPC 20 to which the connector 10 configured in this way is connected to the back surface 2D of the insulating housing 2 of the connector 10 on the signal pattern 22, the first ground pattern 23A, and the second ground pattern 23B. It is attached along the back surface 2D with the exposed surface of the ground pattern consisting of
  • the FPC 20 is composed of a multilayer substrate, and the first ground pattern 23A and the second ground pattern 23B exposed on the surface pass through the ground layer 21 with the ground potential formed on the bottom layer on the back surface side with the front surface side of the FPC 20 as an upper layer. It is electrically connected via a hall.
  • the ground layer 21 is formed evenly at the terminal portion of the FPC 20 that surrounds at least the rear of the connector 10 to be connected (see FIG. 8), whereby the rear side 2D of the insulating housing 2 including the connection portion of the differential signal terminal 31 is formed. It is shielded by the ground layer 21.
  • the signal patterns 22 exposed on the surface are drawn out through an intermediate conductive layer different from the ground layer 21 while being insulated from each other.
  • the connector 10 and the FPC 20 are relatively positioned and positioned by inserting the positioning protrusions 42 protruding from the left and right sides of the shield shell metal fitting 4 into the positioning holes 24 drilled at two positions of the FPC 20.
  • the signal pattern 22, the first ground pattern 23A, and the second ground pattern 23B exposed on the surface of the FPC 20 are respectively leg portions 3a (differential terminal leg portions) of the corresponding terminals 3 (differential signal terminals 31). 31a), formed so as to face the projecting positions of the respective leg portions so as to be solder-connected to the shield grounding leg portions 40a to 40h of the shield shell metal fitting 4 and the plate grounding leg portions 50a to 50f of the intermediate conductive plate 5.
  • the signal pattern 22 for solder-connecting the differential terminal legs 31a is denoted by reference numeral 22 ', and the first ground pattern 23A formed around each protruding position of the pair of differential terminal legs 31a.
  • the second ground pattern 23B are denoted by reference numerals 23A 'and 23B', respectively.
  • the shield grounding legs 40b, 40d, 40f, and 40h are grounded by soldering to the first grounding pattern 23A of the opposing FPC 20 at the protruding position, and therefore the grounding position of the shield shell metal fitting 4 is also a pair of differentials.
  • the distance from each protruding position of the terminal leg portion 31a is an equidistant position.
  • the pattern shape of the first ground pattern 23A ′ solder-connected to the shield ground legs 40b, 40d, 40f, and 40h around the protruding positions of the pair of differential terminal legs 31a is the same as the pair of differential terminal legs.
  • a shield ground leg for a pair of differential signal terminals 31 is formed.
  • Parasitic capacitance generated between the portions 40b, 40d, 40f, 40h and the first ground pattern 23A ′ is substantially equal, and common mode noise is generated even if a high-frequency signal of opposite phase flows between the pair of differential signal terminals 31. do not do.
  • the grounding position of the intermediate conductive plate 5 is also a pair of differential terminal legs.
  • the distance from each protruding position of 31a is an equidistant position.
  • the pattern shape of the second ground pattern 23B ′ that is solder-connected to the plate ground legs 50b and 50e around the protruding positions of the pair of differential terminal legs 31a is also different from the protrusions of the pair of differential terminal legs 31a.
  • the parasitic capacitance generated between the plate ground legs 50b and 50e and the second ground pattern 23B ′ for the pair of differential signal terminals 31 is substantially equal. Even if a high-frequency signal having a reverse phase flows between the differential signal terminals 31, no common mode noise is generated.
  • the anchor holes 6 are formed avoiding the projection areas 7a and 7b indicated by the broken lines in FIG. 10 in which each pair of differential signal terminals 31 is projected onto the intermediate conductive plate 5 in the vertical direction.
  • the position and shape of the anchor hole 6 are symmetrical with respect to the projection areas 7a and 7b, so that a part or the whole of the anchor hole 6 is drilled in the projection areas 7a and 7b.
  • the parasitic capacitance generated between the anchor hole 6 and the intermediate conductive plate 5 is substantially equal to each other, and no common mode current is generated due to the difference in parasitic capacitance.
  • the connector 10 has been described as a USB socket conforming to the USB 3.1 standard. However, if the connector 10 is a connector in which a high-frequency signal having a reverse phase flows at least at a pair of terminals arranged adjacent to the insulating housing, The invention can be applied.
  • the connector 10 does not necessarily have to include the intermediate conductive plate 5 described in the above embodiment.
  • the present invention is suitable for a connector connection structure in which a connector that cancels noise by flowing a high-frequency signal of opposite phase to a pair of terminals is connected to a wiring board.

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Abstract

In this invention, differential terminal leg portions (31a) of a pair of differential signal terminals (31) are connected by being soldered, at protruding positions thereof on the back surface of an insulation housing (2), to respective signal patterns (22) on an opposing wiring base plate (20), and shield-grounding connection portions (40a to 40h) are disposed at grounding connection positions that are related by a symmetry based on both protruding positions of the pair of differential terminal leg portions (31a), and are connected by being soldered to respective grounding patterns (23A') on the wiring base plate (20) which is symmetrically shaped based on both protruding positions of the pair of differential terminal leg portions (31a). Since parasitic capacitances which occur between the grounded shield-grounding connection portions (40a to 40h) or the grounding pattern (23A') and each of the pair of differential signal terminals (31) are approximately equal, no common mode current due to the difference in parasitic capacitances is generated even if a high frequency differential signal flows in the pair of differential signal terminals (31).

Description

コネクタの接続構造Connector connection structure
　本発明は、逆相の高周波信号が流れるコネクタの一対の差動信号端子を配線基板の信号パターンへ半田接続するコネクタの接続構造に関し、更に詳しくは、差動信号端子をシールドするコネクタのシールドシェル金具を、差動信号端子と信号パターンの半田接続位置の周囲で配線基板の接地パターンへ接地するコネクタの接続構造に関する。 The present invention relates to a connector connection structure that solder-connects a pair of differential signal terminals of a connector through which a high-frequency signal of opposite phase flows to a signal pattern on a wiring board, and more specifically, a shield shell of a connector that shields differential signal terminals. The present invention relates to a connector connection structure for grounding a metal fitting to a ground pattern on a wiring board around a solder connection position between a differential signal terminal and a signal pattern.
　ホスト機器と周辺機器を接続するＵＳＢ（ユニバーサル・シリアル・バス）規格に準拠するＵＳＢコネクタ等の高速データ伝送の用途で用いられる特許文献１に記載のコネクタ１００は、図１２、図１３に示すように、相手側プラグが挿入される嵌合凹部１０１内に絶縁ハウジング１０２の支持板部１０２ａが突設され、絶縁ハウジング１０２に取り付けられた複数の端子１０４のプラグ接触部１０４ａが支持板部１０２ａの背面に露出して相手側プラグのプラグ側端子に接触し、各端子１０４の脚部１０４ｂが絶縁ハウジング１０２の背面から突出している。 The connector 100 described in Patent Document 1 used for high-speed data transmission such as a USB connector conforming to the USB (Universal Serial Bus) standard for connecting a host device and peripheral devices is as shown in FIGS. In addition, a support plate portion 102a of the insulating housing 102 protrudes into the fitting recess 101 into which the mating plug is inserted, and the plug contact portions 104a of the plurality of terminals 104 attached to the insulating housing 102 serve as the support plate portion 102a. It is exposed on the back surface and contacts the plug-side terminal of the mating plug, and the leg portion 104 b of each terminal 104 protrudes from the back surface of the insulating housing 102.
　絶縁ハウジング１０２の背面から突出する各端子１０４の脚部１０４ｂは、絶縁ハウジング１０２の底面と同一面上となるように下方にクランク状に折り曲げられ、絶縁ハウジング１０２の底面に沿って配置されるプリント配線基板（図示せず）の対向面に露出する対応する信号パターンに半田接続することにより、コネクタ１００がプリント配線基板に接続される。 The leg portions 104b of the terminals 104 protruding from the back surface of the insulating housing 102 are bent downward in a crank shape so as to be flush with the bottom surface of the insulating housing 102, and are arranged along the bottom surface of the insulating housing 102. The connector 100 is connected to the printed wiring board by soldering to the corresponding signal pattern exposed on the facing surface of the wiring board (not shown).
　このコネクタ１００に接続する図示しない相手側プラグは、外周面側を接地電位とした金属筒状に形成されているので、コネクタ１００の嵌合凹部１０１も、接地させたシールドシェル金具１０５の嵌合筒部１０５ａで形成し、その下端の絶縁ハウジング１０２の底面に沿って外方に直角に折り曲げられた接地片１０５ｂを、対向面に露出するプリント配線基板の接地パターンに半田接続してシールドシェル金具１０５を接地電位としている。これにより、各端子１０４の周囲を囲うシールドシェル金具１０５により、プラグ側端子とコネクタ１００の端子１０４を外部から遮蔽して電磁シールドし、これらの端子に流れる高周波信号が外部に輻射したり、外部からノイズが重畳しないようにしている。 Since the mating plug (not shown) connected to the connector 100 is formed in a metal cylinder shape with the outer peripheral surface side being the ground potential, the fitting recess 101 of the connector 100 is also fitted with the shield shell fitting 105 grounded. A grounding piece 105b formed of a cylindrical portion 105a and bent outwardly at a right angle along the bottom surface of the insulating housing 102 at the lower end thereof is solder-connected to the grounding pattern of the printed wiring board exposed on the opposite surface, and the shield shell metal fitting 105 is a ground potential. As a result, the shield shell metal fitting 105 surrounding each terminal 104 shields the plug side terminal and the terminal 104 of the connector 100 from the outside and electromagnetically shields them. The noise is not superimposed.
　一方、各端子１０４の周囲を筒状に囲うシールドシェル金具１０５では、絶縁ハウジング１０２の背面から突出する各端子１０４の脚部１０４ｂを外部から遮蔽できないので、従来のコネクタ１００では、図１３に示すように、導電性金属板を折り曲げ加工して、絶縁ハウジング１０２の背面側の空間を囲う形状に形成されたシールドカバー１０６で、各端子１０４の脚部１０４ｂの全体を囲っている。シールドカバー１０６の下端も、絶縁ハウジング１０２の底面に沿って外方に直角に折り曲げられた接地片１０６ａとなっていて、その対向面に露出するプリント配線基板の接地パターンに半田接続してシールドカバー１０６を接地電位としている。 On the other hand, the shield shell fitting 105 that surrounds each terminal 104 in a cylindrical shape cannot shield the leg 104b of each terminal 104 protruding from the back of the insulating housing 102 from the outside. As described above, the entire leg portion 104b of each terminal 104 is surrounded by a shield cover 106 formed by bending a conductive metal plate so as to surround the space on the back side of the insulating housing 102. The lower end of the shield cover 106 is also a grounding piece 106a that is bent outward at a right angle along the bottom surface of the insulating housing 102, and is connected to the grounding pattern of the printed wiring board exposed on the opposite surface by soldering. 106 is a ground potential.
特開２０１４－４１７９７号公報JP 2014-41797 A
　この従来のコネクタ１００の接続構造は、絶縁ハウジング１０２の背面から突出する各端子１０４の脚部１０４ｂが一応接地されたシールドカバー１０６で囲われるので外部から遮蔽されるが、脚部１０４ｂはクランク状に折り曲げられるので、端子１０４を流れる高周波伝送路に不必要なインダクタンスが発生する。この問題は、端子１０４に流れる高周波信号の周波数が高くなるほど顕著になり、ＵＳＢ３．０以上の規格で端子１０４の転送速度が６４０ＭＢ／ｓとなると無視できない伝送損失となる。 In this conventional connector 100 connection structure, the leg 104b of each terminal 104 protruding from the back surface of the insulating housing 102 is surrounded by a shield cover 106 which is temporarily grounded, so that it is shielded from the outside. Therefore, unnecessary inductance is generated in the high-frequency transmission path that flows through the terminal 104. This problem becomes more prominent as the frequency of the high-frequency signal flowing through the terminal 104 becomes higher. If the transfer speed of the terminal 104 is 640 MB / s under the USB 3.0 or higher standard, a transmission loss that cannot be ignored.
　また、絶縁ハウジングに隣接して取り付けられる一対の差動信号端子間に流れる高周波信号を差動合成して転送データを生成するＵＳＢ３．０以上の規格に準拠するコネクタでは、一対の差動信号端子の一方に偏って接地電位のシールドカバー１０６やシールドカバー１０６の接地位置が接近していると、各差動信号線にぶら下がる寄生容量が異なるので、互いに逆相で繰り返される差動電流に寄生容量の差分が生じ、高周波信号の周波数が高くなると無視できない大きさのコモンモード電流が発生する。 In addition, in a connector conforming to the USB 3.0 or higher standard for differentially synthesizing high-frequency signals flowing between a pair of differential signal terminals attached adjacent to the insulating housing to generate transfer data, a pair of differential signal terminals If the grounding position of the shield cover 106 or the shield cover 106 with the ground potential is biased toward one of the two, the parasitic capacitance hanging from each differential signal line is different, and therefore, the parasitic capacitance is added to the differential current repeated in the opposite phase. If a difference between the two is generated and the frequency of the high frequency signal is increased, a common mode current having a magnitude that cannot be ignored is generated.
　また、ＵＳＢ３．１規格に準拠するコネクタでは、支持板部１０２ａの上面に沿って配置される複数の端子と下面に沿って配置される複数の端子のピンアサインを左右対称形状として、相手側プラグのプラグ側端子を表裏いずれの姿勢で嵌合凹部１０１に挿入しても対応する端子１０４に電気接続可能としているが、このような従来のコネクタ１００のままでは、支持板部１０２ａの上面と下面から絶縁ハウジング１０２の背面から突出する端子１０４の脚部１０４ｂの長さが異なり、絶縁ハウジング１０２の上下に分けて取り付けられる端子１０４の特性インピーダンスを同一にすることができなかった。 In addition, in the connector conforming to the USB 3.1 standard, the pin assignments of the plurality of terminals arranged along the upper surface of the support plate portion 102a and the plurality of terminals arranged along the lower surface are made symmetrical, so that the mating plug The plug-side terminal can be electrically connected to the corresponding terminal 104 even if it is inserted into the fitting recess 101 in either the front or back orientation. However, with such a conventional connector 100, the upper and lower surfaces of the support plate portion 102a Thus, the length of the leg 104b of the terminal 104 protruding from the back surface of the insulating housing 102 is different, and the characteristic impedance of the terminals 104 attached separately on the upper and lower sides of the insulating housing 102 cannot be made the same.
　更に、絶縁ハウジング１０２の背面から突出する各端子１０４の脚部１０４ｂを周囲から遮蔽するために、導電性金属板を折り曲げ加工するシールドカバー１０６を用意して絶縁ハウジング１０２に組み付ける必要があり、部品点数が増加すると共に余分な組み立て工程が必要となっていた。 Furthermore, in order to shield the leg 104b of each terminal 104 protruding from the back surface of the insulating housing 102 from the surroundings, it is necessary to prepare a shield cover 106 for bending a conductive metal plate and to assemble it to the insulating housing 102. As the number of points increased, an extra assembly process was required.
　本発明はこのような問題点に鑑みてなされたもので、端子の配線基板との接続部に発生するインダクタンスを減少させて、転送速度が６４０ＭＢ／ｓとなる高い周波数の高周波信号が流れてもインピーダンスの発生を抑止し、データ伝送特性に優れたコネクタの接続構造を提供する。 The present invention has been made in view of such problems, and even if a high-frequency signal having a high frequency with a transfer rate of 640 MB / s flows by reducing the inductance generated at the connection portion between the terminal and the wiring board, the present invention has been made. To provide a connector connection structure that suppresses the generation of impedance and has excellent data transmission characteristics.
　また、絶縁ハウジングに隣接して取り付けられる一対の差動信号端子に高い周波数の差動信号が流れても、コモンモードノイズが発生しないコネクタの接続構造を提供する。 Also provided is a connector connection structure that does not generate common mode noise even when a high-frequency differential signal flows through a pair of differential signal terminals mounted adjacent to the insulating housing.
　また、別にシールド部品を用意することなく、絶縁ハウジングから突出する端子の脚部を外部からシールドするコネクタの接続構造を提供することを目的とする。 It is another object of the present invention to provide a connector connection structure that shields the terminal leg protruding from the insulating housing from the outside without preparing a separate shielding component.
　上述の目的を達成するため、請求項１のコネクタの接続構造は、絶縁ハウジングに互いに絶縁して取り付けられる複数の端子と、絶縁ハウジングの外側面に取り付けられ、絶縁ハウジングに取り付けられる複数の端子をシールドするシールドシェル金具とを有するコネクタと、複数の信号パターンと接地パターンが配線された配線基板とからなり、絶縁ハウジングの背面から突出する複数の端子の脚部を、それぞれ、対応する複数の信号パターンへ半田接続するとともに、シールドシェル金具のシールド接地接続部を第１接地パターンに半田接続し、コネクタを配線基板へ接続するコネクタの接続構造であって、
　複数の端子のうち、絶縁ハウジングに隣接して取り付けられる少なくとも一対の端子は、一対の各端子間に逆相の高周波信号が流れる一対の差動信号端子であり、配線基板を絶縁ハウジングの背面に沿って配置し、一対の差動信号端子の各差動端子脚部を、それぞれ、絶縁ハウジングの背面から各差動端子脚部が突出する突出位置で対向する配線基板の信号パターンに半田接続し、シールド接地接続部を、一対の差動端子脚部の突出位置の周囲で、一対の差動端子脚部の各突出位置についてシンメトリーとなる第１接地接続位置に配設し、一対の差動端子脚部の各突出位置についてシンメトリーとなる形状とした配線基板の第１接地パターンに半田接続することを特徴とする。 In order to achieve the above-described object, a connector connection structure according to claim 1 includes a plurality of terminals attached to an insulating housing by being insulated from each other, and a plurality of terminals attached to the outer surface of the insulating housing and attached to the insulating housing. A connector having a shield shell metal fitting to be shielded, and a wiring board on which a plurality of signal patterns and a ground pattern are wired, and a plurality of terminal legs protruding from the back surface of the insulating housing, respectively, correspond to a plurality of signals. A solder connection to the pattern, a shield ground connection portion of the shield shell metal fitting to the first ground pattern, and a connector connection structure for connecting the connector to the wiring board;
Among the plurality of terminals, at least a pair of terminals attached adjacent to the insulating housing are a pair of differential signal terminals in which a high-frequency signal having a reverse phase flows between the pair of terminals, and the wiring board is disposed on the back surface of the insulating housing. Solder-connect each differential terminal leg of the pair of differential signal terminals to the signal pattern of the opposing wiring board at the protruding position where each differential terminal leg protrudes from the back of the insulating housing. The shield ground connection portion is disposed around the protruding position of the pair of differential terminal legs at a first ground connection position that is symmetrical with respect to each protruding position of the pair of differential terminal legs. It is characterized in that each projecting position of the terminal leg is soldered to the first ground pattern of the wiring board having a symmetrical shape.
　絶縁ハウジングの背面から突出する一対の差動信号端子の差動端子脚部を、絶縁ハウジングの背面に沿って配置される配線基板の対向する信号パターンに半田接続するので、クランク状に折り曲げる必要がなく、余分なインダクタンスが生じない。 Since the differential terminal legs of the pair of differential signal terminals protruding from the back surface of the insulating housing are solder-connected to the opposing signal patterns of the wiring board arranged along the back surface of the insulating housing, it is necessary to bend into a crank shape. There is no extra inductance.
　シールド接地接続部が配設される第１接地接続位置は、一対の差動端子脚部の各突出位置の周囲で一対の各突出位置から等距離にあり、また、シールド接地接続部を半田接続する第１接地パターンは、一対の差動端子脚部の各突出位置についてシンメトリーとなる形状であるので、一対の各差動信号端子について接地されたシールド接地接続部や第１接地パターンとの間に生じる寄生容量はほぼ等しく、寄生容量の差分によるコモンモード電流が発生しない。 The first ground connection position where the shield ground connection part is disposed is equidistant from each pair of projecting positions around each projecting position of the pair of differential terminal legs, and the shield ground connection part is solder-connected. Since the first grounding pattern is symmetrical with respect to the protruding positions of the pair of differential terminal legs, the first grounding pattern between the pair of differential signal terminals grounded with the shielded ground connection part and the first grounding pattern. The parasitic capacitances generated in are substantially equal and no common mode current is generated due to the difference in parasitic capacitance.
　請求項２のコネクタの接続構造は、複数の端子は、絶縁ハウジング内に水平に取り付けられた中間導電プレートと絶縁して、中間導電プレートで上下に仕切られる各列に沿って取り付けられ、中間導電プレートを、一対の差動端子脚部の突出位置の周囲で、一対の差動端子脚部の各突出位置についてシンメトリーとなる第２接地接続位置に絶縁ハウジングの背面から突出し、一対の差動端子脚部の各突出位置についてシンメトリーとなる形状とした配線基板の第２接地パターンに半田接続することを特徴とする。 In the connector connection structure according to claim 2, the plurality of terminals are insulated from the intermediate conductive plate mounted horizontally in the insulating housing, and are attached along each row partitioned vertically by the intermediate conductive plate. The plate protrudes from the back of the insulating housing to the second ground connection position that is symmetrical about the protruding positions of the pair of differential terminal legs, around the protruding position of the pair of differential terminal legs, and the pair of differential terminals It is characterized in that each projecting position of the leg is soldered to the second ground pattern of the wiring board having a symmetrical shape.
　複数の端子は、第２接地パターンに半田接続して接地される中間導電プレートにより絶縁ハウジングの上下の各列に仕切られるので、上下の各列の端子間が高周波結合しない。 Since the plurality of terminals are partitioned into the upper and lower rows of the insulating housing by the intermediate conductive plate which is grounded by soldering to the second ground pattern, the upper and lower rows of terminals are not high-frequency coupled.
　中間導電プレートが突出する第２接地接続位置は、一対の差動端子脚部の各突出位置の周囲で一対の各突出位置から等距離にあり、また、中間導電プレートを半田接続する第２接地パターンは、一対の差動端子脚部の各突出位置についてシンメトリーとなる形状であるので、一対の各差動信号端子について接地された中間導電プレートや第２接地パターンとの間に生じる寄生容量はほぼ等しく、寄生容量の差分によるコモンモード電流が発生しない。 The second ground connection position from which the intermediate conductive plate protrudes is equidistant from each of the pair of protrusion positions around each protrusion position of the pair of differential terminal legs, and the second ground connection to which the intermediate conductive plate is connected by soldering Since the pattern has a symmetrical shape with respect to each protruding position of the pair of differential terminal legs, the parasitic capacitance generated between the pair of differential signal terminals and the grounded intermediate conductive plate or the second ground pattern is Almost equal and no common mode current is generated due to the difference in parasitic capacitance.
　請求項３のコネクタの接続構造は、一対の差動信号端子を中間導電プレートへ投影させた投影領域を除いて中間導電プレートにアンカー孔を穿設し、
　中間導電プレートと絶縁ハウジングを一体成形することを特徴とする。 The connector connection structure according to claim 3, wherein an anchor hole is formed in the intermediate conductive plate except for a projection region in which the pair of differential signal terminals are projected onto the intermediate conductive plate.
The intermediate conductive plate and the insulating housing are integrally formed.
　絶縁ハウジングの一部がアンカー孔を埋めて、中間導電プレートと絶縁ハウジングが強固に一体化される。 ¡A part of the insulating housing fills the anchor hole, and the intermediate conductive plate and the insulating housing are firmly integrated.
　一対の差動信号端子に最も接近する中間導電プレートの投影領域には、アンカー孔が穿設されていないので、接地された中間導電プレートは、一対の各差動信号端子について等距離で同一形状で対向し、一対の各差動信号端子について接地された中間導電プレートとの間に生じる寄生容量はほぼ等しく、寄生容量の差分によるコモンモード電流が発生しない。 Since the projection area of the intermediate conductive plate closest to the pair of differential signal terminals has no anchor hole, the grounded intermediate conductive plate has the same shape at the same distance for each pair of differential signal terminals. The parasitic capacitance generated between the pair of differential signal terminals and the grounded intermediate conductive plate is substantially equal, and no common mode current is generated due to the difference in parasitic capacitance.
　請求項４のコネクタの接続構造は、投影領域の両側に穿設される複数のアンカー孔を、投影領域についてシンメトリーとなる形状で穿設することを特徴とする。 The connector connection structure according to claim 4 is characterized in that a plurality of anchor holes drilled on both sides of the projection area are drilled in a shape that is symmetrical with respect to the projection area.
　一対の差動信号端子の近傍に穿設されるアンカー孔は、投影領域についてシンメトリーの形状で穿設されているので、一対の各差動信号端子につてい接地された中間導電プレートとの間に生じる寄生容量はほぼ等しく、寄生容量の差分によるコモンモード電流が発生しない。 Since the anchor holes drilled in the vicinity of the pair of differential signal terminals are formed in a symmetrical shape with respect to the projection region, the anchor holes are formed between the pair of differential signal terminals and the grounded intermediate conductive plate. The parasitic capacitances generated in are substantially equal and no common mode current is generated due to the difference in parasitic capacitance.
　請求項５のコネクタの接続構造は、中間導電プレートに複数のアンカー孔を穿設し、一対の差動信号端子を中間導電プレートへ投影させた各投影領域に穿設される複数のアンカー孔を、各投影領域についてシンメトリーとなる形状で穿設することを特徴とする。 According to a fifth aspect of the present invention, there is provided a connector connecting structure comprising: a plurality of anchor holes formed in each of the projection regions in which a plurality of anchor holes are formed in the intermediate conductive plate and a pair of differential signal terminals are projected onto the intermediate conductive plate. Each projection region is formed in a shape that is symmetrical.
　絶縁ハウジングの一部がアンカー孔を埋めて、中間導電プレートと絶縁ハウジングが強固に一体化され、一対の差動信号端子の各投影領域に穿設されるアンカー孔は、各投影領域についてシンメトリーの形状で穿設されているので、一対の各差動信号端子につてい接地された中間導電プレートとの間に生じる寄生容量はほぼ等しく、寄生容量の差分によるコモンモード電流が発生しない。 A part of the insulating housing fills the anchor hole, the intermediate conductive plate and the insulating housing are firmly integrated, and the anchor hole formed in each projection area of the pair of differential signal terminals is symmetrical with respect to each projection area. Since it is formed in a shape, the parasitic capacitance generated between the pair of differential signal terminals and the grounded intermediate conductive plate is substantially equal, and no common mode current is generated due to the difference in parasitic capacitance.
　請求項６のコネクタの接続構造は、配線基板は、信号パターンが配線される導電層と接地パターンが接続するグランド層が互いに絶縁して積層された多層基板であり、
　絶縁ハウジングの背面を多層基板のグランド層で覆うことを特徴とする。 The connector connection structure according to claim 6, wherein the wiring board is a multilayer board in which a conductive layer to which a signal pattern is wired and a ground layer to which a ground pattern is connected are insulated and laminated.
The back surface of the insulating housing is covered with a ground layer of a multilayer board.
　絶縁ハウジングの背面から突出する多数の端子の各脚部と信号パターンは、シールドシェル金具のシールド接地接続部と多層基板のグランド層で外部から遮蔽される。 The leg portions and signal patterns of a large number of terminals protruding from the back of the insulating housing are shielded from the outside by the shield ground connection portion of the shield shell metal fitting and the ground layer of the multilayer board.
　請求項１の発明によれば、一対の各差動信号端子に高い周波数の高周波信号を流しても、配線基板の信号パターンと電気接続する差動端子脚部に余分なインピーダンスが発生せず、高周波信号を減衰させずに伝送できる。 According to the invention of claim 1, even if a high frequency signal of high frequency is supplied to each pair of differential signal terminals, no extra impedance is generated in the differential terminal legs electrically connected to the signal pattern of the wiring board, High frequency signals can be transmitted without being attenuated.
　また、絶縁ハウジングに隣接して配置される一対の差動信号端子について、その周囲の接地位置との間の寄生容量はほぼ等しいので、逆相の高周波信号が一対の差動信号端子に流れても、一対の差動信号端子にコモンモードノイズが発生しない。 In addition, since the parasitic capacitance between the pair of differential signal terminals arranged adjacent to the insulating housing and the ground position around the pair is substantially equal, a high-frequency signal having a reverse phase flows to the pair of differential signal terminals. However, common mode noise does not occur at the pair of differential signal terminals.
　請求項２の発明よれば、絶縁ハウジング内に接地される中間導電プレートを水平に取り付けても、絶縁ハウジングに隣接して配置される一対の差動信号端子について、その周囲の中間導電プレートの第２接地接続位置や第２接地パターンとの間の寄生容量はほぼ等しいので、逆相の高周波信号が一対の差動信号端子に流れても、一対の差動信号端子にコモンモードノイズが発生しない。 According to the second aspect of the present invention, even if the intermediate conductive plate that is grounded in the insulating housing is horizontally mounted, the pair of differential signal terminals arranged adjacent to the insulating housing is connected to the second intermediate conductive plate. Since the parasitic capacitance between the two ground connection positions and the second ground pattern is substantially equal, even if a high-frequency signal of opposite phase flows to the pair of differential signal terminals, no common mode noise is generated at the pair of differential signal terminals. .
　請求項３の発明よれば、一対の差動信号端子に平行に絶縁ハウジング内に接地される中間導電プレートを水平に取り付けても、絶縁ハウジングに隣接して配置される一対の差動信号端子について、その周囲の中間導電プレートとの間の寄生容量はほぼ等しいので、一対の差動信号端子にコモンモードノイズが発生しない。 According to the invention of claim 3, the pair of differential signal terminals disposed adjacent to the insulating housing even when the intermediate conductive plate grounded in the insulating housing is mounted in parallel with the pair of differential signal terminals. Since the parasitic capacitance between the surrounding conductive plates is substantially equal, no common mode noise is generated at the pair of differential signal terminals.
　請求項４の発明によれば、一対の差動信号端子の近傍に中間導電プレートと絶縁ハウジングとを強固に一体化するアンカー孔を穿設しても、一対の差動信号端子について、中間導電プレートとの間の寄生容量はほぼ等しいので、一対の差動信号端子にコモンモードノイズが発生しない。 According to the invention of claim 4, even if the anchor hole for firmly integrating the intermediate conductive plate and the insulating housing is provided in the vicinity of the pair of differential signal terminals, Since the parasitic capacitance between the plates is almost equal, common mode noise does not occur at the pair of differential signal terminals.
　請求項５の発明によれば、一対の差動信号端子を中間導電プレートへ投影させた各投影領域に中間導電プレートと絶縁ハウジングとを強固に一体化するアンカー孔を穿設しても、一対の差動信号端子について、中間導電プレートとの間の寄生容量はほぼ等しいので、一対の差動信号端子にコモンモードノイズが発生しない。 According to the invention of claim 5, even if the anchor hole for firmly integrating the intermediate conductive plate and the insulating housing is formed in each projection region where the pair of differential signal terminals are projected onto the intermediate conductive plate, Since the parasitic capacitance between the differential signal terminals and the intermediate conductive plate is substantially equal, no common mode noise is generated at the pair of differential signal terminals.
　請求項６の発明によれば、絶縁ハウジングの背面をグランド層が積層された多層基板で覆うだけで、絶縁ハウジングの背面から突出する多数の端子の各脚部と信号パターンを外部からシールドできる。 According to the sixth aspect of the present invention, the leg portions and signal patterns of a large number of terminals protruding from the back surface of the insulating housing can be shielded from the outside simply by covering the back surface of the insulating housing with the multilayer substrate on which the ground layer is laminated.
本発明の一実施の形態に係るコネクタの接続構造１の平面図である。1 is a plan view of a connector connection structure 1 according to an embodiment of the present invention. 配線基板２０へコネクタ１０を接続する状態を示す斜視図である。3 is a perspective view showing a state in which the connector 10 is connected to the wiring board 20. FIG. コネクタ１０を背面側の斜め上方からみた斜視図である。It is the perspective view which looked at the connector 10 from diagonally upward on the back side. コネクタ１０の縦断面図である。1 is a longitudinal sectional view of a connector 10. FIG. 絶縁ハウジング２へ多数の端子３を組み付ける工程を示す分解斜視図である。5 is an exploded perspective view showing a process of assembling a large number of terminals 3 to the insulating housing 2. FIG. 多数の端子３と中間導電プレート５が取り付けられた絶縁ハウジング２の縦断面図である。It is a longitudinal cross-sectional view of the insulating housing 2 to which a large number of terminals 3 and intermediate conductive plates 5 are attached. 図６に示す絶縁ハウジング２の外側面にシールドシェル金具４を取り付ける組み立て工程を示す分解斜視図である。It is a disassembled perspective view which shows the assembly process which attaches the shield shell metal fitting 4 to the outer surface of the insulation housing 2 shown in FIG. コネクタ１０と配線基板２０との接続を示す要部斜視図である。4 is a perspective view of a main part showing connection between the connector 10 and the wiring board 20. FIG. 一対の差動端子脚部３１ａの各突出位置と、第１接地パターン２３Ａ及び第２接地パターン２３Ｂとの関係を示す要部拡大背面図である。It is a principal part enlarged rear view which shows the relationship between each protrusion position of a pair of differential terminal leg part 31a, and the 1st grounding pattern 23A and the 2nd grounding pattern 23B. 中間導電プレート５と一対の差動信号端子３１を中間導電プレート５上に投影させた投影領域７ａ、７ｂとの関係を示す平面図である。FIG. 4 is a plan view showing a relationship between the intermediate conductive plate 5 and projection regions 7a and 7b obtained by projecting a pair of differential signal terminals 31 onto the intermediate conductive plate 5. コネクタ１０の背面側からみたピンアサインを示す説明図である。FIG. 3 is an explanatory diagram showing pin assignment as seen from the back side of the connector 10. 従来のコネクタ１００を正面側から見た斜視図である。It is the perspective view which looked at the conventional connector 100 from the front side. コネクタ１００を上方斜め背面側からみた分解斜視図である。It is the disassembled perspective view which looked at the connector 100 from the upper diagonal back side.
　以下、本発明の一実施の形態に係るコネクタの接続構造１を図１乃至図１１を用いて詳細に説明する。コネクタの接続構造１は、図１に示すように、コネクタ１０をコネクタ１０の背面に平行に配置されるフレキシブル配線基板（以下、ＦＰＣという）２０の表面に接続するもので、以下、各部の説明は、相手側プラグとの接続方向の正面側（図１において上方）を前方と、背面側を後方と、底面側（図１において紙面に直交する奥行方向）を下方と、平面側を上方として説明する。 Hereinafter, a connector connection structure 1 according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 11. As shown in FIG. 1, the connector connection structure 1 connects the connector 10 to the surface of a flexible wiring board (hereinafter referred to as FPC) 20 arranged in parallel to the back surface of the connector 10. The front side (upward in FIG. 1) in the connection direction with the mating plug is the front, the back side is the rear, the bottom side (the depth direction perpendicular to the paper in FIG. 1) is the lower side, and the flat side is the upper side. explain.
　本実施の形態に係るコネクタ１０は、ＵＳＢ３．１規格に準拠するＵＳＢコネクタであり、図５に示すハウジング本体２Ａ、上段サブハウジング２Ｂ及び下段サブハウジング２Ｃとからなる絶縁ハウジング２に、図１１に示すように、上下２列の各ＡＢ列に沿ってそれぞれ１２本の端子３（Ａ１～Ａ１２）、３（Ｂ１～Ｂ１２）が互いに絶縁して取り付けられている。上段Ａ列の両側のＡ１とＡ１２は、接地接続され、接地電位となるＧＮＤ端子、Ａ４とＡ９は、直流５Ｖを給電するＶｂｕｓ端子、Ａ５は、ＵＳＢパワーデリバリーモードで高い電力を送電するＣＣ１端子、Ａ８はセカンダリーバスのＳＢＵ１端子である。 The connector 10 according to the present embodiment is a USB connector conforming to the USB 3.1 standard, and is shown in FIG. 11 as an insulating housing 2 including a housing body 2A, an upper sub-housing 2B, and a lower sub-housing 2C shown in FIG. As shown, twelve terminals 3 (A1 to A12) and 3 (B1 to B12) are attached to each other along two upper and lower AB rows. A1 and A12 on both sides of the upper row A are grounded and connected to the ground terminal to be at ground potential, A4 and A9 are Vbus terminals for supplying DC 5V, and A5 is a CC1 terminal for transmitting high power in the USB power delivery mode. , A8 is the SBU1 terminal of the secondary bus.
　また、Ａ６とＡ７は、ＵＳＢ２．０規格までに準拠するＵＳＢプラグと接続してデータを送受信するＤ＋端子と、Ｄ－端子であり、残るＡ２、Ａ３及びＡ１０、Ａ１１がそれぞれ対となってＵＳＢＳｕｐｅｒＳｐｅｅｄモード若しくはＵＳＢＳｕｐｅｒＳｐｅｅｄ＋モードで高速にデータを転送する差動信号端子３（以下、差動信号端子のみ符号を３１とする）となっている。このうち、Ａ２とＡ３は、対となって高速にデータを送信するＴＸ１＋端子３１とＴＸ１－端子３１であり、ＵＳＢＳｕｐｅｒＳｐｅｅｄ＋モードでは、８ビットを１０ビットに変換した高周波信号をＴＸ１＋端子３１とＴＸ１－端子３１とで逆相にして、最大６４０ＭＢ／ｓ（５Ｇｂｐｓ）の送信速度で送信方向に流している。１０ビットに符号化したデータを隣接して絶縁ハウジング２に取り付けられるＴＸ１＋端子３１とＴＸ１－端子３１に逆相で送信することにより、外部からノイズが加わっても両者に等しく加わり、ノイズの影響を受けない両者の差電圧から転送データを正確に復号化することができる。また、一対のＴＸ１＋端子３１とＴＸ１－端子３１に互いに逆向きの電流が流れるので、磁束が打ち消されて高周波信号の高調波によるＥＭＩノイズか低減される。 A6 and A7 are a D + terminal and a D− terminal that are connected to a USB plug conforming to the USB 2.0 standard and transmit / receive data, and the remaining A2, A3, A10, and A11 are paired with each other and USB SuperSpeed. This is a differential signal terminal 3 for transferring data at high speed in the mode or USB SuperSpeed + mode (hereinafter, only the differential signal terminal is denoted by 31). Among these, A2 and A3 are a TX1 + terminal 31 and a TX1-terminal 31 that transmit data at high speed as a pair. In the USB SuperSpeed + mode, a high-frequency signal obtained by converting 8 bits into 10 bits is transmitted to the TX1 + terminal 31 and TX1- The terminal 31 is in reverse phase and flows in the transmission direction at a maximum transmission speed of 640 MB / s (5 Gbps). By sending the data encoded in 10 bits to TX1 + terminal 31 and TX1- terminal 31 which are attached to insulating housing 2 adjacent to each other in reverse phase, even if noise is added from the outside, it is equally added to both, and the influence of noise is affected. Transfer data can be accurately decoded from the difference voltage between the two not received. Further, since currents in opposite directions flow through the pair of TX1 + terminal 31 and TX1-terminal 31, the magnetic flux is canceled and EMI noise due to harmonics of the high frequency signal is reduced.
　Ａ１０とＡ１１は、対となって高速にデータを受信するＲＸ１－端子３１とＲＸ１＋端子３１であり、ＵＳＢＳｕｐｅｒＳｐｅｅｄ＋モードでは、同様に８ビットを１０ビットに変換した高周波信号をＲＸ１＋端子３１とＲＸ１－端子３１とで逆相にして、最大６４０ＭＢ／ｓ（５Ｇｂｐｓ）の送信速度で受信方向に流している。つまり、ＵＳＢ３．１規格で動作するＵＳＢＳｕｐｅｒＳｐｅｅｄ＋モードでは、１レーンあたりのデータ通信線を送受信の各方向に一対ずつ設けて全二重通信とし、送受信する通信信号線間で高周波結合が生じないように、送信方向で対となるＴＸ１＋端子３１とＴＸ１－端子３１と、受信方向で対となるＲＸ１＋端子３１とＲＸ１－端子３１とを、ＧＮＤ端子に隣接する絶縁ハウジング２の左右両側の互いに離れた位置に取り付けている。 A10 and A11 are an RX1-terminal 31 and an RX1 + terminal 31 that receive data at high speed as a pair. In the USB SuperSpeed + mode, similarly, a high-frequency signal obtained by converting 8 bits into 10 bits is an RX1 + terminal 31 and an RX1-terminal. 31 is reversed in phase and flows in the receiving direction at a maximum transmission speed of 640 MB / s (5 Gbps). In other words, in the USB SuperSpeed + mode that operates according to the USB 3.1 standard, a pair of data communication lines per lane is provided in each direction of transmission / reception for full-duplex communication so that no high-frequency coupling occurs between communication signal lines for transmission / reception. The TX1 + terminal 31 and the TX1-terminal 31 that are paired in the transmission direction and the RX1 + terminal 31 and the RX1-terminal 31 that are paired in the reception direction are separated from each other on the left and right sides of the insulating housing 2 adjacent to the GND terminal. It is attached to.
　Ａ列の各端子３（Ａ１～Ａ１２）は、図５に示すように、絶縁合成樹脂で成形される上段サブハウジング２Ｂに左右方向に等ピッチで一体成形され、上段サブハウジング２Ｂをハウジング本体２Ａの凹部１２に後方から挿入して、絶縁ハウジング２に前後方向に沿って取り付けられる。絶縁ハウジング２に取り付けられた状態で、上段サブハウジング２Ｂの後方に突出する各端子３（Ａ１～Ａ１２）の脚部３ａは、絶縁ハウジング２の背面に沿って取り付けられるＦＰＣ２０の表面に対向するように、上方に直角に折り曲げられている。また、各端子３（Ａ１～Ａ１２）の上段サブハウジング２Ｂから前方に突出する前部は、図６に示すように、ハウジング本体２Ａの前方に水平に突出する支持板部１１の上面に沿って露出し、支持板部１１に沿って前方から挿入される相手側プラグに接触する接触部３ｂとなっている。 As shown in FIG. 5, each terminal 3 (A1 to A12) in row A is integrally formed at an equal pitch in the left-right direction in an upper sub-housing 2B formed of insulating synthetic resin, and the upper sub-housing 2B is formed in the housing body 2A. It inserts in the recessed part 12 of this from back, and is attached to the insulating housing 2 along the front-back direction. When attached to the insulating housing 2, the leg portions 3a of the terminals 3 (A1 to A12) protruding rearward of the upper sub-housing 2B face the surface of the FPC 20 attached along the back surface of the insulating housing 2. Further, it is bent at a right angle upward. Further, as shown in FIG. 6, the front portion of each terminal 3 (A1 to A12) protruding forward from the upper sub-housing 2B is along the upper surface of the support plate portion 11 protruding horizontally in front of the housing body 2A. The contact portion 3 b is exposed and comes into contact with the mating plug inserted from the front along the support plate portion 11.
　また、下段のＢ列の１２本の端子３（Ｂ１～Ｂ１２）は、左右対称位置に配置される上段Ａ列の各端子３（Ａ１～Ａ１２）と同一の端子となっている。すなわち、Ｂ１とＢ１２は、ＧＮＤ端子、Ｂ４とＢ９は、Ｖｂｕｓ端子、Ｂ５は、ＣＣ端子、Ｂ８はＳＢＵ端子、Ｂ６とＢ７は、Ｄ＋端子と、Ｄ－端子、Ｂ２とＢ３は、対となって高速にデータを送信するＴＸ２＋端子３１とＴＸ２－端子３１、Ｂ１０とＢ１１は、対となって高速にデータを受信するＲＸ２－端子３１とＲＸ２＋端子３１となっている。 Also, the 12 terminals 3 (B1 to B12) in the lower B row are the same terminals as the respective terminals 3 (A1 to A12) in the upper A row arranged at the left and right symmetrical positions. That is, B1 and B12 are GND terminals, B4 and B9 are Vbus terminals, B5 is a CC terminal, B8 is an SBU terminal, B6 and B7 are D + terminals, D− terminals, and B2 and B3 are a pair. The TX2 + terminal 31 and the TX2- terminal 31, which transmit data at high speed, and the B10 and B11, as a pair, are an RX2-terminal 31 and an RX2 + terminal 31 which receive data at high speed.
　Ｂ列の各端子３（Ｂ１～Ｂ１２）は、図５に示すように、絶縁合成樹脂で成形される下段サブハウジング２Ｃに左右方向に等ピッチで一体成形され、下段サブハウジング２Ｃを上段サブハウジング２Ｂの下方のハウジング本体２Ａの凹部１２に後方から挿入して、絶縁ハウジング２にＡ列の各端子３（Ａ１～Ａ１２）の下方に前後方向に沿って取り付けられる。ハウジング本体２Ａに取り付けられた状態で、下段サブハウジング２Ｃの後方に突出する各端子３（Ｂ１～Ｂ１２）の脚部３ａは同様にＦＰＣ２０の表面に対向するように、下方に直角に折り曲げられている。また、各端子３（Ｂ１～Ｂ１２）の下段サブハウジング２Ｃから前方に突出する前部は、図６に示すように、ハウジング本体２Ａの前方に水平に突出する支持板部１１の下面に沿って露出し、支持板部１１に沿って前方から挿入される相手側プラグに接触する接触部３ｂとなっている。 As shown in FIG. 5, the terminals 3 (B1 to B12) in the B row are integrally formed at a constant pitch in the left-right direction in the lower sub-housing 2C formed of insulating synthetic resin, and the lower sub-housing 2C is connected to the upper sub-housing. 2B is inserted into the recess 12 of the lower housing body 2A from behind, and is attached to the insulating housing 2 along the front-rear direction below the terminals 3 (A1 to A12) in the A row. The leg 3a of each terminal 3 (B1 to B12) protruding rearward of the lower sub-housing 2C in a state attached to the housing body 2A is bent downward at a right angle so as to face the surface of the FPC 20 in the same manner. Yes. Further, the front portion of each terminal 3 (B1 to B12) protruding forward from the lower sub-housing 2C is along the lower surface of the support plate portion 11 protruding horizontally in front of the housing body 2A as shown in FIG. The contact portion 3 b is exposed and comes into contact with the mating plug inserted from the front along the support plate portion 11.
　これにより、コネクタ１０の支持板部１１に沿って挿入する相手側プラグは、コネクタ１０の各端子３に接触する電極が上面と下面のいずれに露出する挿入姿勢であっても、Ａ列の若しくはＢ列のいずれかの対応する端子３に接触する。更に、上下の端子３（Ａ１～Ａ１２）、３（Ｂ１～Ｂ１２）のいずれにも接続する相手側プラグであれば、２レーンの８本のデータ通信線を用いて実効最大転送速度を更に倍の速度とすることができる。この場合には、上段Ａ列のＡ２、Ａ３の対となるＴＸ１＋端子３１、ＴＸ１－端子３１とＡ１０とＡ１１の対となるＲＸ１－端子３１、ＲＸ１＋端子３１が、それぞれ絶縁ハウジング２の上下で、下段Ｂ列のＢ１０、Ｂ１１の対となるＲＸ２－端子３１、ＲＸ２＋端子３１とＢ２、Ｂ３の対となるＴＸ２＋端子３１、ＴＸ２－端子３１に近接し、相互に高周波結合する恐れがある。 As a result, the mating plug inserted along the support plate portion 11 of the connector 10 can be arranged in the A row or in the insertion posture in which the electrode contacting each terminal 3 of the connector 10 is exposed on either the upper surface or the lower surface. The corresponding terminal 3 in any of the B rows is contacted. Furthermore, if the counterpart plug is connected to any of the upper and lower terminals 3 (A1 to A12) and 3 (B1 to B12), the effective maximum transfer rate is further doubled using 8 data communication lines of 2 lanes. The speed can be. In this case, the TX1 + terminal 31 that is a pair of A2 and A3 in the upper A row, the TX1−terminal 31 and the RX1−terminal 31 that is a pair of A10 and A11, and the RX1 + terminal 31 are above and below the insulating housing 2, respectively. There is a risk of high-frequency coupling between the RX2-terminal 31 and the RX2 + terminal 31, which are a pair of the B10 and B11 in the lower row B, close to the TX2 + terminal 31 and the TX2-terminal 31 which are a pair of the B2 and B3.
　そこで、コネクタ１０には、後述するようにＦＰＣ２０の第２接地パターン２３Ｂに半田接続して接地される中間導電プレート５がＡ列とＢ列の各端子３と絶縁して、絶縁ハウジング２のＡ列とＢ列の各端子３間に水平に配設される。中間導電プレート５は、ハウジング本体２Ａの成形の際にインサート成形され、支持板部１１を含むハウジング本体２Ａの鉛直方向の中間に水平面に沿って一体に取り付けられる。これにより、扁平で厚みの薄い支持板部１１の機械的強度が剛性の中間導電プレート５により補強される。 Therefore, in the connector 10, an intermediate conductive plate 5 that is grounded by soldering to the second ground pattern 23B of the FPC 20 is insulated from the terminals 3 in the A row and the B row, as will be described later. It arrange | positions horizontally between each terminal 3 of a row | line | column and B row | line. The intermediate conductive plate 5 is insert-molded when the housing body 2A is molded, and is integrally attached along the horizontal plane in the middle of the housing body 2A including the support plate portion 11 in the vertical direction. Accordingly, the mechanical strength of the flat and thin support plate portion 11 is reinforced by the rigid intermediate conductive plate 5.
　中間導電プレート５には、図１０示すように、多数のアンカー孔６が穿設され、ハウジング本体２Ａにインサート成形する際にアンカー孔６内に流入する溶融樹脂が硬化し、中間導電プレート５とハウジング本体２Ａが強固に一体化される。アンカー孔６は、絶縁ハウジング２に取り付けられる各一対の差動信号端子３１を鉛直方向で中間導電プレート５上へ投影させた図中破線で示す投影領域７ａ、７ｂを避けて形成され、一対の投影領域７ａ、７ｂの左右両側に穿設されるアンカー孔６の形状とその位置は、一対の投影領域７ａ、７ｂについてシンメトリーとなるように形成される。ここで、本実施の形態において、一対の投影領域７ａ、７ｂについてシンメトリーとは、前後方向を長手方向とする一対の投影領域７ａ、７ｂ間の中心線について線対称であることをいう。従って、一対の各差動信号端子３１、３１について、その近傍のアンカー孔６が穿設された中間導電プレート５との間に生じる寄生容量は互いにほぼ等しく、寄生容量の差分によるコモンモード電流が発生しない。　 As shown in FIG. 10, a large number of anchor holes 6 are formed in the intermediate conductive plate 5, and the molten resin flowing into the anchor holes 6 when the housing body 2 </ b> A is insert-molded is cured. The housing body 2A is firmly integrated. The anchor hole 6 is formed so as to avoid projection regions 7a and 7b indicated by broken lines in the figure in which each pair of differential signal terminals 31 attached to the insulating housing 2 is projected onto the intermediate conductive plate 5 in the vertical direction. The shapes and positions of the anchor holes 6 drilled on the left and right sides of the projection areas 7a and 7b are formed so as to be symmetrical with respect to the pair of projection areas 7a and 7b. Here, in the present embodiment, the symmetry with respect to the pair of projection regions 7a and 7b means that the symmetry is about the center line between the pair of projection regions 7a and 7b whose longitudinal direction is the front-rear direction. Therefore, the parasitic capacitance generated between the pair of differential signal terminals 31 and 31 and the intermediate conductive plate 5 in which the adjacent anchor hole 6 is formed is substantially equal to each other, and the common mode current due to the difference of the parasitic capacitance is generated. Does not occur. *
　また、図７に示すように、支持板部１１に埋設される中間導電プレート５の輪郭は、支持板部１１の左右の輪郭に一致し、図７に示すように支持板部１１の左右の両側面に沿って中間導電プレート５が露出している。中間導電プレート５が中間に露出する支持板部１１の両側面の前方は、左右の外側に突出し、支持板部１１に沿って前方から挿入される相手側プラグの図示しない係合凹部と係合する係合突部８となっている。金属板で形成される中間導電プレート５の両側面が係合突部８の一部を構成することによって、係合突部８が撓んだり破損することがなく、相手側プラグの係合凹部と確実に係合する。また、相手側プラグの係合凹部が、接地電位とする金属板で形成されている場合には、係合突部８で臨む中間導電プレート５の両側面も係合凹部に当接して接地される。 Further, as shown in FIG. 7, the contour of the intermediate conductive plate 5 embedded in the support plate portion 11 matches the left and right contours of the support plate portion 11, and as shown in FIG. The intermediate conductive plate 5 is exposed along both side surfaces. The front of both side surfaces of the support plate 11 where the intermediate conductive plate 5 is exposed in the middle protrudes to the left and right, and engages with an engagement recess (not shown) of the mating plug inserted from the front along the support plate 11. It becomes the engaging protrusion 8 to do. Since both side surfaces of the intermediate conductive plate 5 formed of a metal plate constitute a part of the engaging protrusion 8, the engaging protrusion 8 is not bent or damaged, and the engaging recess of the mating plug is engaged. And engage securely. Further, when the engaging recess of the mating plug is formed of a metal plate having a ground potential, both side surfaces of the intermediate conductive plate 5 facing the engaging protrusion 8 are also in contact with the engaging recess and are grounded. The
　図５に示すように、中間導電プレート５は、ハウジング－本体２Ａの後方に開口する凹部２ｂの中間の高さで水平に取り付けられ、上述のＡ列の各端子３（Ａ１～Ａ１２）が一体成形された上段サブハウジング２Ｂと、Ｂ列の各端子３（Ｂ１～Ｂ１２）が一体成形された下段サブハウジング２Ｃとは、それぞれ中間導電プレート５で仕切られる凹部２ｂの上方と下方に分かれて収容される。上段サブハウジング２Ｂと下段サブハウジング２Ｃとは、図６に示すように、その背面が凹部２ｂの周囲のハウジング－本体２Ａの背面に同一面で連続する位置で図示しない係止手段によって後方に対して抜け止めされ、絶縁ハウジング２の背面２Ｄは、全体に凹凸のない鉛直面となっている。 As shown in FIG. 5, the intermediate conductive plate 5 is mounted horizontally at an intermediate height of the recess 2b that opens to the rear of the housing-main body 2A, and each terminal 3 (A1 to A12) in the above-mentioned row A is integrated. The molded upper sub-housing 2B and the lower sub-housing 2C in which the B rows of terminals 3 (B1 to B12) are integrally formed are accommodated separately above and below the recess 2b partitioned by the intermediate conductive plate 5, respectively. Is done. As shown in FIG. 6, the upper sub-housing 2B and the lower sub-housing 2C are rearward with respect to the rear by a locking means (not shown) at a position where the rear surface is continuous with the rear surface of the housing-main body 2A around the recess 2b. Thus, the back surface 2D of the insulating housing 2 is a vertical surface with no unevenness.
　上段のＡ列と下段のＢ列に沿って左右方向に等ピッチで絶縁ハウジング２に取り付けられた各１２本の端子３（Ａ１～Ａ１２）、３（Ｂ１～Ｂ１２）は、前後方向に沿って取り付けられた絶縁ハウジング２の背面２Ｄの突出位置から各端子脚部３ａを突出させている。このうち、高速にデータを転送する差動信号端子３１は、一対の差動信号端子３１が絶縁ハウジング２に隣接して取り付けられているので、図８に示すように、４対の差動信号端子３１の差動端子脚部３１ａは、中間導電プレート５で上段と下段に仕切られた各段の左右の両側の４カ所に分散された領域から突出し、対となる各差動端子脚部３１ａは、各領域内の隣接する位置から後方に突出している。 The twelve terminals 3 (A1 to A12) and 3 (B1 to B12) attached to the insulating housing 2 at equal pitches in the horizontal direction along the upper row A and the lower row B are arranged along the front-rear direction. Each terminal leg 3a is protruded from the protruding position of the back surface 2D of the attached insulating housing 2. Among these, the differential signal terminals 31 for transferring data at high speed are provided with four pairs of differential signals, as shown in FIG. 8, since the pair of differential signal terminals 31 are mounted adjacent to the insulating housing 2. The differential terminal legs 31a of the terminals 31 protrude from regions distributed on the left and right sides of each stage partitioned by the intermediate conductive plate 5 into an upper stage and a lower stage and each pair of differential terminal legs 31a. Protrudes backward from adjacent positions in each region.
　中間導電プレート５は、図７に示すように、絶縁ハウジング２の背面に沿って取り付けられるＦＰＣ２０の第２接地パターン２３Ｂに半田接続するために、絶縁ハウジング２の背面２Ｄの６カ所の位置からプレート接地脚部５０ａ、５０ｂ、５０ｃ、５０ｄ、５０ｅ、５０ｆを後方に向かって突出させている。各プレート接地脚部５０ａ、５０ｂ、５０ｃ、５０ｄ、５０ｅ、５０ｆは、その周囲で突出する一対の差動端子脚部３１ａの各突出位置についてシンメトリーとなる第２接地接続位置で絶縁ハウジング２の背面から突出している。ここで、本明細書において、一対の差動端子脚部３１ａの各突出位置についてシンメトリーとなるとは、一対の差動端子脚部３１ａの各突出位置の中点を通る鉛直線について線対称となる関係若しくは一対の差動端子脚部３１ａの各突出位置の一方を他方の突出位置に重ねるように平行移動した場合に、重ねた突出位置について点対称となる関係をいう。 As shown in FIG. 7, the intermediate conductive plate 5 is formed from six positions on the back surface 2 </ b> D of the insulating housing 2 in order to solder-connect to the second ground pattern 23 </ b> B of the FPC 20 attached along the back surface of the insulating housing 2. The grounding legs 50a, 50b, 50c, 50d, 50e, and 50f are protruded rearward. Each plate ground leg 50a, 50b, 50c, 50d, 50e, 50f is a rear surface of the insulating housing 2 at a second ground connection position that is symmetrical with respect to each projecting position of the pair of differential terminal legs 31a projecting around it. Protruding from. Here, in this specification, being symmetrical about each protruding position of the pair of differential terminal legs 31a means being symmetrical about a vertical line passing through the midpoint of each protruding position of the pair of differential terminal legs 31a. A relationship or a relationship that is point-symmetric with respect to the overlapped protrusion position when one of the protrusion positions of the pair of differential terminal legs 31a is translated so as to overlap the other protrusion position.
　すなわち、プレート接地脚部５０ｂの突出位置は、上段のＡ列の対となるＲＸ１－端子３１の差動端子脚部３１ａの突出位置とＲＸ１＋端子３１の差動端子脚部３１ａの突出位置の中点を通る鉛直線について左右線対称となるいずれの突出位置からも等距離となる位置であるとともに、下段のＢ列の対となっるＴＸ２＋端子３１の差動端子脚部３１ａの突出位置とＴＸ２－端子３１の差動端子脚部３１ａの突出位置の中点を通る鉛直線について左右対称な位置ともなっている。また、プレート接地脚部５０ｅの突出位置は、上段のＡ列の対となるＴＸ１－端子３１の差動端子脚部３１ａの突出位置とＴＸ１＋端子３１の差動端子脚部３１ａの突出位置との中点を通る鉛直線について左右対称な位置であるとともに、下段のＢ列の対となっるＲＸ２＋端子３１の差動端子脚部３１ａの突出位置とＲＸ２－端子３１の差動端子脚部３１ａの突出位置の中点を通る鉛直線について左右対称な位置ともなっている。つまり、一対の差動端子脚部３１ａの突出位置の周囲で絶縁ハウジング２の背面２Ｄから突出するプレート接地脚部５０ｂ、５０ｅは、一対の差動端子脚部３１ａの各突出位置と等距離となる位置で突出している。 In other words, the protruding position of the plate grounding leg 50b is the middle of the protruding position of the differential terminal leg 31a of the RX1-terminal 31 and the protruding position of the differential terminal leg 31a of the RX1 + terminal 31. TX2 is a position that is equidistant from any protruding position that is symmetric with respect to the vertical line passing through the point, and the protruding position of the differential terminal leg 31a of the TX2 + terminal 31 and TX2 that form a pair in the lower B row -It is also a symmetrical position with respect to a vertical line passing through the midpoint of the protruding position of the differential terminal leg 31a of the terminal 31. The protruding position of the plate ground leg 50e is the difference between the protruding position of the differential terminal leg 31a of the TX1-terminal 31 and the protruding position of the differential terminal leg 31a of the TX1 + terminal 31, which is a pair in the upper row A. The position of the differential terminal leg 31a of the RX2 + terminal 31 and the position of the differential terminal leg 31a of the RX2-terminal 31 that are symmetrical with respect to the vertical line passing through the midpoint and that are paired with the lower B row It is also a symmetrical position with respect to a vertical line passing through the midpoint of the protruding position. That is, the plate grounding legs 50b and 50e protruding from the back surface 2D of the insulating housing 2 around the protruding positions of the pair of differential terminal legs 31a are equidistant from the protruding positions of the pair of differential terminal legs 31a. It protrudes at the position.
　上下２列の各ＡＢ列に沿って各列毎に１２本の端子３（Ａ１～Ａ１２）、３（Ｂ１～Ｂ１２）が取り付けられた絶縁ハウジング２の外周に、導電性金属板を横長円筒状に折り曲げ加工したシールドシェル金具４が取り付けられる。絶縁ハウジング２へのシールドシェル金具４の取り付けは、図７に示すように、シールドシェル金具４の後方から絶縁ハウジング２を挿入し、絶縁ハウジング２の背面２Ｄとシールドシェル金具４の後端面が一致する位置でシールドシェル金具４の平面と底面の一部から切り起こされた係止爪４１を絶縁ハウジング２の係止孔１３へ係止して取り付ける。 A conductive metal plate is formed in a horizontally long cylindrical shape on the outer periphery of the insulating housing 2 to which 12 terminals 3 (A1 to A12) and 3 (B1 to B12) are attached for each row along the two AB rows. The shield shell metal fitting 4 that has been bent is attached. As shown in FIG. 7, the shield shell metal fitting 4 is attached to the insulation housing 2 by inserting the insulation housing 2 from the rear side of the shield shell metal fitting 4 so that the back surface 2D of the insulation housing 2 and the rear end face of the shield shell metal fitting 4 coincide with each other. At this position, the locking claw 41 cut and raised from a part of the flat surface and the bottom surface of the shield shell metal fitting 4 is locked and attached to the locking hole 13 of the insulating housing 2.
　絶縁ハウジング２へシールドシェル金具４を取り付けた状態で、各端子３の接触部３ｂが表裏面に露出する支持板部１１の周囲は、相手側プラグを挿入する嵌合凹部９を隔てて筒状のシールドシェル金具４で覆われ、その後端面のリング状に沿った８カ所の位置からＦＰＣ２０の第１接地パターン２３Ａに半田接続するシールド接地接続部を構成するシールド接地脚部４０ａ～４０ｈが後方に向かって突設されている。各シールド接地脚部４０ａ～４０ｈは、その周囲で絶縁ハウジング２の背面から突出する一対の差動端子脚部３１ａの各突出位置についてシンメトリーとなる第１接地接続位置で絶縁ハウジング２の後方に突出している。 In the state where the shield shell metal fitting 4 is attached to the insulating housing 2, the periphery of the support plate portion 11 where the contact portion 3b of each terminal 3 is exposed on the front and back surfaces is cylindrical with a fitting recess 9 into which the mating plug is inserted. The shield ground legs 40a to 40h constituting the shield ground connection portion soldered to the first ground pattern 23A of the FPC 20 from the eight positions along the ring shape of the rear end surface thereof are It protrudes toward you. The shield grounding legs 40a to 40h protrude rearward of the insulating housing 2 at first ground connection positions that are symmetrical with respect to the protruding positions of the pair of differential terminal legs 31a protruding from the back surface of the insulating housing 2 around the shield grounding legs 40a to 40h. ing.
　すなわち、シールド接地脚部４０ｂは、上段のＡ列の対となるＲＸ１－端子３１の差動端子脚部３１ａの突出位置とＲＸ１＋端子３１の差動端子脚部３１ａの突出位置とから等距離となる周囲の位置で突出し、シールド接地脚部４０ｄは、上段のＡ列の対となるＴＸ１－端子３１の差動端子脚部３１ａの突出位置とＴＸ１＋端子３１の差動端子脚部３１ａの突出位置と等距離となる周囲の位置で突出している。また、シールド接地脚部４０ｆは、下段のＢ列の対となっるＲＸ２＋端子３１の差動端子脚部３１ａの突出位置とＲＸ２－端子３１の差動端子脚部３１ａの突出位置と等距離となる周囲の位置で突出し、シールド接地脚部４０ｈは、下段のＢ列の対となっるＴＸ２＋端子３１の差動端子脚部３１ａの突出位置とＴＸ２－端子３１の差動端子脚部３１ａの突出位置と等距離となる周囲の位置で突出している。すなわち、一対の差動端子脚部３１ａの突出位置の周囲で絶縁ハウジング２の背面２Ｄの周囲から突出するシールド接地脚部４０ｂ、４０ｄ、４０ｆ，４０ｈは、一対の差動端子脚部３１ａの各突出位置とそれぞれ等距離となる位置で突出している。 In other words, the shield grounding leg 40b is equidistant from the protruding position of the differential terminal leg 31a of the RX1-terminal 31 and the protruding position of the differential terminal leg 31a of the RX1 + terminal 31, which is a pair in the upper A row. The shield grounding leg 40d protrudes from the protruding position of the differential terminal leg 31a of the TX1-terminal 31 and the protruding position of the differential terminal leg 31a of the TX1 + terminal 31. It protrudes at a peripheral position that is equidistant. Further, the shield ground leg 40f is equidistant from the projecting position of the differential terminal leg 31a of the RX2 + terminal 31 and the projecting position of the differential terminal leg 31a of the RX2-terminal 31 which form a pair in the lower B row. The shield ground leg 40h protrudes at the protruding position of the differential terminal leg 31a of the TX2 + terminal 31 and the protruding of the differential terminal leg 31a of the TX2-terminal 31. It protrudes at a peripheral position that is equidistant from the position. That is, the shield grounding legs 40b, 40d, 40f, and 40h that protrude from the periphery of the back surface 2D of the insulating housing 2 around the protruding position of the pair of differential terminal legs 31a are respectively connected to the pair of differential terminal legs 31a. It protrudes at a position that is equidistant from the protruding position.
　シールドシェル金具４の後端面の両側から突出するシールド接地脚部４０ａ、４０ｅの中央部は更に後方に突出し、ＦＰＣ２０の位置決め孔２４に挿入され、コネクタ１０とＦＰＣ２０を相対的に位置決めする位置決め突起４２となっている。 The center portions of the shield grounding legs 40a and 40e projecting from both sides of the rear end surface of the shield shell metal fitting 4 project further rearward and are inserted into the positioning holes 24 of the FPC 20 to position the connector 10 and the FPC 20 relatively. It has become.
　このように構成されたコネクタ１０を接続するＦＰＣ２０は、図１、図２に示すように、コネクタ１０の絶縁ハウジング２の背面２Ｄに、信号パターン２２、第１接地パターン２３Ａ及び第２接地パターン２３Ｂとからなる接地パターンを露出させた表面を対向させて、背面２Ｄに沿って取り付けられる。 As shown in FIGS. 1 and 2, the FPC 20 to which the connector 10 configured in this way is connected to the back surface 2D of the insulating housing 2 of the connector 10 on the signal pattern 22, the first ground pattern 23A, and the second ground pattern 23B. It is attached along the back surface 2D with the exposed surface of the ground pattern consisting of
　ＦＰＣ２０は、多層基板で構成され、表面に露出する第１接地パターン２３Ａ及び第２接地パターン２３Ｂは、ＦＰＣ２０の表面側を上層として裏面側の最下層に形成される接地電位のグランド層２１にスルーホール等で電気接続している。グランド層２１は、少なくとも接続するコネクタ１０の後方を囲うＦＰＣ２０の端末部にむらなく形成され（図８参照）、これにより差動信号端子３１の接続部を含む絶縁ハウジング２の背面２Ｄの後方がグランド層２１によって遮蔽される。表面に露出する各信号パターン２２は、互いに絶縁して、グランド層２１と異なる中間導電層を介して引き出される。 The FPC 20 is composed of a multilayer substrate, and the first ground pattern 23A and the second ground pattern 23B exposed on the surface pass through the ground layer 21 with the ground potential formed on the bottom layer on the back surface side with the front surface side of the FPC 20 as an upper layer. It is electrically connected via a hall. The ground layer 21 is formed evenly at the terminal portion of the FPC 20 that surrounds at least the rear of the connector 10 to be connected (see FIG. 8), whereby the rear side 2D of the insulating housing 2 including the connection portion of the differential signal terminal 31 is formed. It is shielded by the ground layer 21. The signal patterns 22 exposed on the surface are drawn out through an intermediate conductive layer different from the ground layer 21 while being insulated from each other.
　上述の通り、コネクタ１０とＦＰＣ２０は、シールドシェル金具４の左右両側から突出する位置決め突起４２を、ＦＰＣ２０の２カ所の位置に穿設した位置決め孔２４に挿入して相対的に位置決めされ、位置決めされた状態で、ＦＰＣ２０の表面に露出する信号パターン２２、第１接地パターン２３Ａ及び第２接地パターン２３Ｂは、それぞれ、対応する端子３（差動信号端子３１）の脚部３ａ（差動端子脚部３１ａ）、シールドシェル金具４のシールド接地脚部４０ａ～４０ｈ及び中間導電プレート５のプレート接地脚部５０ａ～５０ｆに半田接続するように、各脚部の突出位置と対向する位置に形成される。 As described above, the connector 10 and the FPC 20 are relatively positioned and positioned by inserting the positioning protrusions 42 protruding from the left and right sides of the shield shell metal fitting 4 into the positioning holes 24 drilled at two positions of the FPC 20. In this state, the signal pattern 22, the first ground pattern 23A, and the second ground pattern 23B exposed on the surface of the FPC 20 are respectively leg portions 3a (differential terminal leg portions) of the corresponding terminals 3 (differential signal terminals 31). 31a), formed so as to face the projecting positions of the respective leg portions so as to be solder-connected to the shield grounding leg portions 40a to 40h of the shield shell metal fitting 4 and the plate grounding leg portions 50a to 50f of the intermediate conductive plate 5.
　尚、本実施の形態では、差動端子脚部３１ａを半田接続する信号パターン２２を符号２２’で、一対の差動端子脚部３１ａの各突出位置の周囲に形成される第１接地パターン２３Ａと第２接地パターン２３Ｂとを、それぞれ符号２３Ａ’と符号２３Ｂ’で表す。 In the present embodiment, the signal pattern 22 for solder-connecting the differential terminal legs 31a is denoted by reference numeral 22 ', and the first ground pattern 23A formed around each protruding position of the pair of differential terminal legs 31a. And the second ground pattern 23B are denoted by reference numerals 23A 'and 23B', respectively.
　従って、シールド接地脚部４０ｂ、４０ｄ、４０ｆ，４０ｈは、その突出位置で対向するＦＰＣ２０の第１接地パターン２３Ａに半田接続して接地されるので、シールドシェル金具４の接地位置も一対の差動端子脚部３１ａの各突出位置との距離が等距離の位置となる。更に、一対の差動端子脚部３１ａの各突出位置の周囲でシールド接地脚部４０ｂ、４０ｄ、４０ｆ，４０ｈに半田接続する第１接地パターン２３Ａ’のパターン形状は、一対の差動端子脚部３１ａの各突出位置についてシンメトリーとなるように、ここでは、各突出位置の中点を通る鉛直線について対称形状となる横長長方形に形成されるので、一対の差動信号端子３１について、シールド接地脚部４０ｂ、４０ｄ、４０ｆ，４０ｈや第１接地パターン２３Ａ’との間に生じる寄生容量は、ほぼ等しく、一対の差動信号端子３１間に逆相の高周波信号が流れてもコモンモードノイズが発生しない。 Accordingly, the shield grounding legs 40b, 40d, 40f, and 40h are grounded by soldering to the first grounding pattern 23A of the opposing FPC 20 at the protruding position, and therefore the grounding position of the shield shell metal fitting 4 is also a pair of differentials. The distance from each protruding position of the terminal leg portion 31a is an equidistant position. Furthermore, the pattern shape of the first ground pattern 23A ′ solder-connected to the shield ground legs 40b, 40d, 40f, and 40h around the protruding positions of the pair of differential terminal legs 31a is the same as the pair of differential terminal legs. Here, in order to be symmetrical with respect to each protruding position of 31a, here, since it is formed in a horizontally long rectangle having a symmetrical shape with respect to a vertical line passing through the midpoint of each protruding position, a shield ground leg for a pair of differential signal terminals 31 is formed. Parasitic capacitance generated between the portions 40b, 40d, 40f, 40h and the first ground pattern 23A ′ is substantially equal, and common mode noise is generated even if a high-frequency signal of opposite phase flows between the pair of differential signal terminals 31. do not do.
　同様に、プレート接地脚部５０ｂ、５０ｅは、その突出位置で対向するＦＰＣ２０の第２接地パターン２３Ｂに半田接続して接地されるので、中間導電プレート５の接地位置も一対の差動端子脚部３１ａの各突出位置との距離が等距離の位置となる。更に、一対の差動端子脚部３１ａの各突出位置の周囲でプレート接地脚部５０ｂ、５０ｅに半田接続する第２接地パターン２３Ｂ’のパターン形状も、一対の差動端子脚部３１ａの各突出位置についてシンメトリーとなる横長長方形に形成されるので、一対の差動信号端子３１について、プレート接地脚部５０ｂ、５０ｅや第２接地パターン２３Ｂ’との間に生じる寄生容量は、ほぼ等しく、一対の差動信号端子３１間に逆相の高周波信号が流れてもコモンモードノイズが発生しない。 Similarly, since the plate grounding legs 50b and 50e are grounded by soldering to the second grounding pattern 23B of the FPC 20 facing at the protruding position, the grounding position of the intermediate conductive plate 5 is also a pair of differential terminal legs. The distance from each protruding position of 31a is an equidistant position. Further, the pattern shape of the second ground pattern 23B ′ that is solder-connected to the plate ground legs 50b and 50e around the protruding positions of the pair of differential terminal legs 31a is also different from the protrusions of the pair of differential terminal legs 31a. Since the position is formed in a horizontally long rectangle that is symmetrical, the parasitic capacitance generated between the plate ground legs 50b and 50e and the second ground pattern 23B ′ for the pair of differential signal terminals 31 is substantially equal. Even if a high-frequency signal having a reverse phase flows between the differential signal terminals 31, no common mode noise is generated.
　また、上述の実施の形態では、各一対の差動信号端子３１を鉛直方向で中間導電プレート５上へ投影させた図１０の破線で示す各投影領域７ａ、７ｂを避けてアンカー孔６を穿設した例で説明したが、アンカー孔６の位置や形状が各投影領域７ａ、７ｂについてシンメトリーであれば、アンカー孔６の一部若しくは全体が各投影領域７ａ、７ｂに穿設されるものであってよく、これにより、アンカー孔６が穿設された中間導電プレート５との間に生じる寄生容量は互いにほぼ等しく、寄生容量の差分によるコモンモード電流が発生しない。 Further, in the above-described embodiment, the anchor holes 6 are formed avoiding the projection areas 7a and 7b indicated by the broken lines in FIG. 10 in which each pair of differential signal terminals 31 is projected onto the intermediate conductive plate 5 in the vertical direction. As described in the example, the position and shape of the anchor hole 6 are symmetrical with respect to the projection areas 7a and 7b, so that a part or the whole of the anchor hole 6 is drilled in the projection areas 7a and 7b. As a result, the parasitic capacitance generated between the anchor hole 6 and the intermediate conductive plate 5 is substantially equal to each other, and no common mode current is generated due to the difference in parasitic capacitance.
　上述の実施の形態では、配線基板にフレキシブル印刷配線板を用いた例で説明したが、リジット基板であってもよい。 In the above-described embodiment, the example in which the flexible printed wiring board is used as the wiring board has been described, but a rigid board may be used.
　また、上記コネクタ１０は、ＵＳＢ３．１規格に準拠するＵＳＢソケットで説明したが、少なくとも絶縁ハウジングに隣接して配置される少なくとも一対の端子に、逆相の高周波信号が流れるコネクタであれば、本発明を適用できる。 The connector 10 has been described as a USB socket conforming to the USB 3.1 standard. However, if the connector 10 is a connector in which a high-frequency signal having a reverse phase flows at least at a pair of terminals arranged adjacent to the insulating housing, The invention can be applied.
　従って、コネクタ１０には、必ずしも上記実施の形態で説明した中間導電プレート５を備えるものでなくてもよい。 Therefore, the connector 10 does not necessarily have to include the intermediate conductive plate 5 described in the above embodiment.
　本発明は、一対の端子に逆相の高周波信号を流してノイズをキャンセルするコネクタを配線基板に接続するコネクタの接続構造に適している。 The present invention is suitable for a connector connection structure in which a connector that cancels noise by flowing a high-frequency signal of opposite phase to a pair of terminals is connected to a wiring board.
１　コネクタの接続構造
２　絶縁ハウジング
４　シールドシェル金具
５　中間導電プレート
２０　配線基板（ＦＰＣ）
２１　グランド層
２２　信号パターン
２３Ａ　第１接地パターン
２３Ｂ　第２接地パターン
３１　差動信号端子
３１ａ　差動端子脚部
４０ａ～４０ｈ　シールド接地脚部
５０ａ～５０ｆ　プレート接地脚部 DESCRIPTION OF SYMBOLS 1 Connector connection structure 2 Insulating housing 4 Shield shell metal fitting 5 Intermediate conductive plate 20 Wiring board (FPC)
21 ground layer 22 signal pattern 23A first ground pattern 23B second ground pattern 31 differential signal terminal 31a differential terminal legs 40a to 40h shield ground legs 50a to 50f plate ground legs

Claims (6)

  1. 絶縁ハウジングに互いに絶縁して取り付けられる複数の端子と、
    　絶縁ハウジングの外側面に取り付けられ、絶縁ハウジングに取り付けられる複数の端子をシールドするシールドシェル金具とを有するコネクタと、
    　複数の信号パターンと接地パターンが配線された配線基板とからなり、
    　絶縁ハウジングの背面から突出する複数の端子の脚部を、それぞれ、対応する複数の信号パターンへ半田接続するとともに、シールドシェル金具のシールド接地接続部を第１接地パターンへ半田接続し、コネクタを配線基板へ接続するコネクタの接続構造であって、
    　前記複数の端子のうち、前記絶縁ハウジングに隣接して取り付けられる少なくとも一対の端子は、一対の各端子間に逆相の高周波信号が流れる一対の差動信号端子であり、
    　前記配線基板を前記絶縁ハウジングの背面に沿って配置し、
    　一対の差動信号端子の各差動端子脚部を、それぞれ、前記絶縁ハウジングの背面から各差動端子脚部が突出する突出位置で対向する前記配線基板の信号パターンに半田接続し、　前記シールド接地接続部を、前記一対の差動端子脚部の突出位置の周囲で、前記一対の差動端子脚部の各突出位置についてシンメトリーとなる第１接地接続位置に配設し、前記一対の差動端子脚部の各突出位置についてシンメトリーとなる形状とした前記配線基板の第１接地パターンに半田接続することを特徴とするコネクタの接続構造。     A plurality of terminals that are attached to and insulated from the insulating housing;
    A connector attached to an outer surface of the insulating housing and having a shield shell metal fitting for shielding a plurality of terminals attached to the insulating housing;
    It consists of a wiring board on which multiple signal patterns and ground patterns are wired,
    The terminals of the terminals protruding from the back of the insulating housing are soldered to the corresponding signal patterns, and the shield ground connection of the shield shell metal fitting is soldered to the first ground pattern, and the connector is wired. A connector connection structure for connecting to a board,
    Among the plurality of terminals, at least a pair of terminals attached adjacent to the insulating housing are a pair of differential signal terminals in which a high-frequency signal having a reverse phase flows between the pair of terminals,
    Arranging the wiring board along the back surface of the insulating housing;
    Solder-connect each differential terminal leg of the pair of differential signal terminals to the signal pattern of the wiring board facing each other at the protruding position where each differential terminal leg protrudes from the back surface of the insulating housing, and the shield A ground connection portion is disposed around a protruding position of the pair of differential terminal legs, at a first ground connection position that is symmetrical with respect to each protruding position of the pair of differential terminal legs, and the pair of differences A connector connection structure characterized by solder-connecting to the first ground pattern of the wiring board having a symmetrical shape for each protruding position of the moving terminal leg.
  2. 前記複数の端子は、絶縁ハウジング内に水平に取り付けられた中間導電プレートと絶縁して、中間導電プレートで上下に仕切られる各列に沿って取り付けられ、
    　中間導電プレートを、前記一対の差動端子脚部の突出位置の周囲で、前記一対の差動端子脚部の各突出位置についてシンメトリーとなる第２接地接続位置に前記絶縁ハウジングの背面から突出し、前記一対の差動端子脚部の各突出位置についてシンメトリーとなる形状とした前記配線基板の第２接地パターンに半田接続することを特徴とする請求項１に記載のコネクタの接続構造。     The plurality of terminals are insulated from an intermediate conductive plate mounted horizontally in an insulating housing, and are attached along each row partitioned vertically by the intermediate conductive plate,
    An intermediate conductive plate protrudes from the back surface of the insulating housing to a second ground connection position that is symmetrical about each protruding position of the pair of differential terminal legs, around the protruding position of the pair of differential terminal legs. 2. The connector connection structure according to claim 1, wherein the protruding positions of the pair of differential terminal legs are solder-connected to a second ground pattern of the wiring board having a symmetrical shape.
  3. 前記一対の差動信号端子を前記中間導電プレートへ投影させた各投影領域を除いて前記中間導電プレートにアンカー孔を穿設し、
    　前記中間導電プレートと前記絶縁ハウジングを一体成形することを特徴とする請求項２に記載のコネクタの接続構造。     Excluding each projection region where the pair of differential signal terminals are projected onto the intermediate conductive plate, drilling an anchor hole in the intermediate conductive plate;
    The connector connection structure according to claim 2, wherein the intermediate conductive plate and the insulating housing are integrally formed.
  4. 前記投影領域の両側に穿設される複数のアンカー孔を、前記各投影領域についてシンメトリーとなる形状で穿設することを特徴とする請求項３に記載のコネクタの接続構造。 4. The connector connection structure according to claim 3, wherein a plurality of anchor holes drilled on both sides of the projection area are drilled in a shape that is symmetrical with respect to each projection area.
  5. 前記中間導電プレートに複数のアンカー孔を穿設し、
    　 前記一対の差動信号端子を前記中間導電プレートへ投影させた各投影領域に穿設される複数のアンカー孔を、前記各投影領域についてシンメトリーとなる形状で穿設することを特徴とする請求項２に記載のコネクタの接続構造。     Drilling a plurality of anchor holes in the intermediate conductive plate;
    The plurality of anchor holes drilled in each projection area obtained by projecting the pair of differential signal terminals onto the intermediate conductive plate are drilled in a symmetrical shape with respect to each projection area. The connector connection structure according to 2.
  6. 配線基板は、信号パターンが配線される導電層と接地パターンが接続するグランド層が互いに絶縁して積層された多層基板であり、
    　絶縁ハウジングの背面を多層基板のグランド層で覆うことを特徴とする請求項１乃至請求項５のいずれか１項に記載のコネクタの接続構造。     The wiring board is a multilayer board in which a conductive layer to which a signal pattern is wired and a ground layer to which a ground pattern is connected are insulated and laminated.
    6. The connector connection structure according to claim 1, wherein a back surface of the insulating housing is covered with a ground layer of a multilayer board.
PCT/JP2015/004930 2015-09-29 2015-09-29 Connection structure for connector WO2017056127A1 (en)

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JP2016508510A JP6436162B2 (en) 2015-09-29 2015-09-29 Connector connection structure
PCT/JP2015/004930 WO2017056127A1 (en) 2015-09-29 2015-09-29 Connection structure for connector
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108736258A (en) * 2017-04-24 2018-11-02 矽玛科技股份有限公司 Connector for reducing signal interference between double rows of terminals by using grounding pin of grounding piece
JP2019117837A (en) * 2017-12-26 2019-07-18 シーシーエス株式会社 Light-emitting device
CN110391538A (en) * 2018-04-20 2019-10-29 安波福中央电气（上海）有限公司 Electrical cnnector and its manufacturing method
CN112838444A (en) * 2019-11-05 2021-05-25 沈晓萱 Connector capable of reducing signal interference
JP2021190244A (en) * 2020-05-28 2021-12-13 ヒロセ電機株式会社 Charging connector unit

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007080782A (en) * 2005-09-16 2007-03-29 Japan Aviation Electronics Industry Ltd Electric connector
JP2009231053A (en) * 2008-03-24 2009-10-08 Tyco Electronics Amp Kk Electrical connector
JP2011154954A (en) * 2010-01-28 2011-08-11 Japan Aviation Electronics Industry Ltd Connector
JP2014041797A (en) * 2012-08-23 2014-03-06 Smk Corp Receptacle connector

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006260836A (en) * 2005-03-15 2006-09-28 Fci Asia Technology Pte Ltd Electric connector
TWI483478B (en) * 2011-03-17 2015-05-01 Molex Inc Connectors and connector systems
CN203859275U (en) * 2014-05-30 2014-10-01 莫列斯公司 Electrical connector
CN104505616A (en) * 2014-12-11 2015-04-08 连展科技电子（昆山）有限公司 Electric socket connector

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007080782A (en) * 2005-09-16 2007-03-29 Japan Aviation Electronics Industry Ltd Electric connector
JP2009231053A (en) * 2008-03-24 2009-10-08 Tyco Electronics Amp Kk Electrical connector
JP2011154954A (en) * 2010-01-28 2011-08-11 Japan Aviation Electronics Industry Ltd Connector
JP2014041797A (en) * 2012-08-23 2014-03-06 Smk Corp Receptacle connector

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108736258A (en) * 2017-04-24 2018-11-02 矽玛科技股份有限公司 Connector for reducing signal interference between double rows of terminals by using grounding pin of grounding piece
JP2019117837A (en) * 2017-12-26 2019-07-18 シーシーエス株式会社 Light-emitting device
JP7007180B2 (en) 2017-12-26 2022-01-24 シーシーエス株式会社 Luminescent device
CN110391538A (en) * 2018-04-20 2019-10-29 安波福中央电气（上海）有限公司 Electrical cnnector and its manufacturing method
CN112838444A (en) * 2019-11-05 2021-05-25 沈晓萱 Connector capable of reducing signal interference
JP2021190244A (en) * 2020-05-28 2021-12-13 ヒロセ電機株式会社 Charging connector unit
JP7402746B2 (en) 2020-05-28 2023-12-21 ヒロセ電機株式会社 Charging connector unit

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