WO2016197699A1 - 封装件及其封装方法、oled装置 - Google Patents

封装件及其封装方法、oled装置 Download PDF

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Publication number
WO2016197699A1
WO2016197699A1 PCT/CN2016/079270 CN2016079270W WO2016197699A1 WO 2016197699 A1 WO2016197699 A1 WO 2016197699A1 CN 2016079270 W CN2016079270 W CN 2016079270W WO 2016197699 A1 WO2016197699 A1 WO 2016197699A1
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WIPO (PCT)
Prior art keywords
substrate
sealing structure
cavity
sealing
package
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PCT/CN2016/079270
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English (en)
French (fr)
Inventor
李艺
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京东方科技集团股份有限公司
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Priority to US15/321,856 priority Critical patent/US20170133625A1/en
Publication of WO2016197699A1 publication Critical patent/WO2016197699A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing

Definitions

  • the present disclosure relates to a package and a method of packaging the same, an OLED device.
  • OLED Organic Light-Emitting Diode
  • An OLED device packaging technology uses a glass paste (slurry frit) packaging process.
  • a glass paste slurry frit
  • FIG. 1 in an OLED device, an OLED structure 03 is disposed between a glass cover plate 01 and a glass back plate 02, and the OLED body is provided.
  • the structure specifically includes an organic light-emitting functional layer, etc., since the organic light-emitting functional layer may undergo an irreversible photo-oxidation reaction in the presence of moisture and oxygen, therefore, in order to ensure the sealing property of the OLED device, the glass cover 01 and the glass back After the plate 02 is aligned, the glass paste is melted by a laser to form a frit sealing layer 04 to complete the packaging of the OLED device.
  • the glass paste used in the frit packaging process is mostly a hard material, and thus, the OLED device has poor drop resistance and compression resistance, and affects the mechanical properties of the entire OLED device.
  • a package includes: a first substrate and a second substrate disposed opposite to each other; a first sealing structure disposed between the first substrate and the second substrate, the first a sealing structure, the first substrate and the second substrate enclosing a first cavity; a second sealing structure disposed between the first substrate and the second substrate, the second sealing structure is located The outer side of the first sealing structure encloses a second cavity with the first sealing structure, the first substrate and the second substrate.
  • an OLED device comprising: a package as described above, and an OLED structure disposed within the first cavity of the package.
  • a packaging method comprising: coating a UV paste on a first substrate having a sintered glass paste; the glass paste being located in a first sealing region of the first substrate, The UV glue is located in a second sealing area of the second substrate, the second sealing area Located on an outer side of the first sealing region; aligning the first substrate with a second substrate provided with an OLED structure; the first between the first substrate and the second substrate The sealing region forms a first sealing structure, and forms a second sealing structure in the second sealing region, wherein the first sealing structure, the first substrate and the second substrate enclose a first cavity; The second sealing structure is located outside the first sealing structure and encloses a second cavity with the first sealing structure, the first substrate and the second substrate.
  • 1 is a schematic structural view of a packaged OLED device
  • FIG. 2a is a cross-sectional view 1 of a package according to an embodiment of the present disclosure
  • 2b is a top view of a package provided by an embodiment of the present disclosure.
  • FIG. 3 is a cross-sectional view 2 of a package according to an embodiment of the present disclosure.
  • FIG. 4 is a cross-sectional view 3 of a package according to an embodiment of the present disclosure.
  • FIG. 5 is a flowchart 1 of a packaging method according to an embodiment of the present disclosure.
  • FIG. 6 is a second flowchart of a packaging method according to an embodiment of the present disclosure.
  • first and second are used for descriptive purposes only, and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining “first” and “second” may include one or more of the features either explicitly or implicitly. In the description of the present invention, "a plurality” means two or more unless otherwise stated.
  • an embodiment of the present disclosure provides a package 100 (wherein Figure 2a is a cross-sectional view of the package 100 and Figure 2b is a top view of the package 100).
  • the package 100 includes a first substrate 101 and a second substrate 102 disposed opposite to each other; and a first sealing structure 103 disposed between the first substrate 101 and the second substrate 102.
  • the first sealing structure 103, the first substrate 101 and the second substrate 102 enclose a first cavity 200, which can be used to place an OLED structure.
  • the OLED structure herein may be an integral structure of an OLED or a part of an OLED, such as an organic light-emitting functional layer, a hole transport layer, an electron transport layer, etc., and these layers may also be referred to as a main structure of an OLED.
  • a second sealing structure 104 is further disposed between the first substrate 101 and the second substrate 102, and the second sealing structure 104 is located outside the first sealing structure 103, and is opposite to the first sealing structure 103, the first substrate 101, and the second The substrate 102 encloses a second cavity 300.
  • the second cavity can mitigate the impact force experienced by the first sealing structure 103.
  • first sealing structure 103 there may be a plurality of second cavities 300 disposed between the first substrate 101 and the second substrate 102, which are not limited in the present invention.
  • the second cavity 300 serves to slow the impact force received by the first sealing structure 103.
  • the second cavity 300 can serve as a buffer layer between the first sealing structure 103 and the second sealing structure 104, so that the packaging material in the first cavity 200 is subjected to the impact force exerted by the outside as little as possible.
  • the anti-drop and anti-pressure performance of the entire package 100 is improved.
  • the cross-sections of the first sealing structure 103 and the second sealing structure 104 parallel to the first substrate are both annular shapes, such that the first sealing structure 103 and the second sealing structure 104 can cooperate with the first A substrate and a second substrate form a first cavity and a second cavity.
  • An OLED main structure such as a hole transport layer, an organic light emitting layer or an electron transport layer, of the OLED device may be disposed in the first cavity 200, and an irreversible photooxidation reaction may occur due to the presence of water vapor and oxygen in the OLED main body structure. Therefore, the multiple sealing structure in the package 100 The water-proofing of the OLED main body structure can be prevented, and the anti-drop and anti-pressure performance of the package 100 can be improved by the buffer layer between the first sealing structure 103 and the second sealing structure 104.
  • the second cavity 300 is filled with a foaming agent and/or an organic glue.
  • the foaming agent is a kind of surface active material, which mainly reduces the interfacial tension at the gas-water interface, promotes the formation of small bubbles in the slurry, expands the sorting interface, and ensures that the bubbles rise to form a foam layer.
  • the organic gum refers to a compound containing a Si-C bond and at least one organic group is directly bonded to a silicon atom. Both the organic glue and the foaming agent having a low modulus of elasticity can be used as an effective cushioning material. Therefore, by filling the second cavity 300 with a foaming agent and/or an organic glue, the first sealing structure 103 and the second can be added. The buffering effect of the buffer layer between the sealing structures 104 further improves the anti-drop and pressure resistance properties of the package 100.
  • a desiccant such as calcium sulfate or the like which reacts with water and oxygen may be added to the above-mentioned foaming agent and/or organic rubber, so that an effective environment around the encapsulating material in the first cavity 200 can be formed.
  • a protective layer that prevents water oxygen from entering the encapsulating material.
  • the first substrate 101 is further provided with a connection with the second cavity 300.
  • the connection hole 105 is such that the above-mentioned foaming agent and/or organic glue can be injected into the second cavity 300 through the connection hole 105.
  • connection hole 105 may further be provided with a filling melt (meltable) 106, which is fusible.
  • the body 106 is a glass mixture that absorbs microwaves or lasers, and the melt 106 can be used to seal the connection holes 105, so that after the above-mentioned foaming agent and/or organic glue is injected into the second cavity 300, laser or microwave heating can be used.
  • the meltable 106 on the connection hole 105 is such that the meltable 106 is heated and melted and then the connection hole 105 is packaged.
  • the heat affected zone of the packaging process is small, and excessive residual stress is not generated to cause the first substrate 101 to be warped. song.
  • the first sealing structure 103 in the package 100 may be a sealing structure formed by sintering and laser scanning after the glass paste is cured by a frit packaging process; and the second sealing structure 104 in the package 100 may be Specifically, the sealing structure formed by curing the UV adhesive by the UV encapsulation process, that is, the cured UV adhesive.
  • the sealed structure formed by the frit packaging process has a strong ability to resist water and oxygen, but the mechanical properties are poor, and the UV packaging process is relatively simple. Therefore, the package 100 having the multiple sealing structure formed by the above process can simplify the manufacturing process and Improvement The ability of the package 100 to resist oxygen.
  • An embodiment of the present disclosure provides a package including a first substrate and a second substrate disposed opposite to each other, wherein a first sealing structure is disposed between the first substrate and the second substrate, The first sealing structure, the first substrate and the second substrate enclose a first cavity, the first cavity is for placing an OLED main body structure; and the first substrate and the second substrate are further disposed
  • the second sealing structure is located outside the first sealing structure, and encloses a second cavity with the first sealing structure, the first substrate and the second substrate, and the second cavity is available
  • the second cavity can serve as a buffer layer between the first sealing structure and the second sealing structure, so that the OLED main structure in the first cavity is as The impact force exerted by the outside is less, thereby improving the anti-drop and anti-pressure performance of the entire package.
  • FIG. 5 is a packaging method according to an embodiment of the present invention.
  • the packaging method provided by the embodiment of the present disclosure is used to fabricate the package 100 shown in FIG. 1 to FIG. 4 .
  • FIG. 5 For the convenience of description, only the implementation of the present invention is shown. For the relevant parts of the examples, the specific technical details are not disclosed, please refer to the embodiments of the present invention shown in FIGS.
  • the above packaging method includes:
  • the OLED device includes, for example, a first substrate, and a second substrate formed with an OLED body structure.
  • the first substrate and the second substrate need to be aligned and packaged to form an OLED main body structure in the OLED device. It is enclosed in a waterproof and oxygen-proof enclosure.
  • the glass paste is located in a first sealing area of the first substrate, the UV glue is located in a second sealing area of the second substrate, and the second sealing area is located outside the first sealing area.
  • the glass paste may be coated on the first sealing area of the first substrate to be packaged by screen printing, and then the first substrate coated with the glass paste is placed in a sintering furnace for sintering, and finally the first after sintering.
  • the second sealing area of the substrate is coated with UV glue, wherein the UV glue can be cured and used as an adhesive under ultraviolet light irradiation.
  • the first sealing structure, the first substrate and the second substrate enclose a first cavity; the second sealing structure is located outside the first sealing structure, and is surrounded by the first sealing structure, the first substrate and the second substrate Cavity.
  • the first substrate and the second substrate may be first packaged to form the second sealing structure by using a UV encapsulation process to irradiate the position of the UV coating on the first substrate (ie, the second sealing region) with ultraviolet rays. Further, using the frit packaging process, the position where the glass paste is sintered on the first substrate (ie, the first sealing region) is subjected to the second encapsulation to form the first sealing structure.
  • the first sealing structure, the first substrate and the second substrate enclose a first cavity; the first sealing structure, the second sealing structure, the first substrate and the second substrate enclose a second space Cavity.
  • the second cavity can serve as a buffer layer between the first sealing structure and the second sealing structure, so that the OLED main body structure in the first cavity is subjected to an impact force applied by the outside as little as possible, thereby improving the protection of the entire package. Drop, compression performance.
  • the first substrate may further be provided with a connection hole communicating with the second cavity, and the connection hole is further provided with a meltable portion, wherein the meltable material is a glass mixture for absorbing microwave or laser light.
  • the embodiment of the present invention provides a packaging method, as shown in FIG. 6, which includes:
  • a screen printing process may be used to apply a glass paste to a first sealing region of the first substrate according to a pre-designed pattern on the screen, and then the first substrate coated with the glass paste is placed in the sintering furnace. The medium is sintered, and finally, the second sealing region on the sintered first substrate is coated with UV glue.
  • the UV sealing process can be used to irradiate the UV-coated position on the first substrate with ultraviolet rays, and the first sealing structure is formed separately from the first The substrate and the second substrate are pasted.
  • Form a first sealing structure by using a glass paste encapsulation process to sinter the glass paste on the first substrate.
  • the second sealing structure is respectively adhered to the second sealing structure, the first substrate and the second substrate to form a second cavity.
  • the connecting hole can be Injecting a foaming agent and/or an organic glue into the second cavity, since both the organic glue and the foaming agent can be used as an effective buffering material, the foaming agent and/or the organic glue is filled in the second cavity, and The buffering effect of the buffer layer between the first sealing structure and the second sealing structure is increased to further improve the anti-drop and anti-pressure performance of the package.
  • a desiccant such as calcium sulfate or the like, which is reactive with water and oxygen, may be added to the above-mentioned foaming agent and/or organic rubber, so that an effective protective layer can be formed around the OLED main structure in the first cavity. To prevent water oxygen from invading the OLED main structure.
  • the filling melt on the connecting hole may be heated by using a laser or a microwave, so that the filling melt is heated and melted, and the connecting hole is packaged.
  • the heat affected zone is small and does not generate excessive residual stress causing warpage of the first substrate.
  • Embodiments of the present disclosure provide a packaging method in which a first sealing structure is disposed between a first substrate and a second substrate disposed opposite to each other, and the first sealing structure, the first substrate and the second substrate are enclosed a first cavity for placing the OLED body structure; a second sealing structure disposed between the first substrate and the second substrate, the second sealing structure being located outside the first sealing structure, and the first cavity a sealing structure, the first substrate and the second substrate enclose a second cavity, the second cavity can be used to slow the impact force of the first sealing structure, so that the second cavity can As a buffer layer between the first sealing structure and the second sealing structure, the OLED main body structure in the first cavity is subjected to an impact force applied by the outside as little as possible, thereby improving the anti-drop and anti-pressure performance of the entire package.
  • an embodiment of the present disclosure further provides an OLED device, which specifically includes the package 100 described in the above embodiment, and an OLED main body structure disposed in the first cavity 200 of the package 100.
  • the OLED body structure may specifically include a hole transport layer, an organic light emitting layer or an electron transport layer of the OLED device. Since the OLED main structure has an irreversible photooxidation reaction in the presence of moisture and oxygen, the multiple sealing structure in the package 100 can prevent water oxygen from intruding into the OLED main structure while passing through the first sealing structure 103.
  • the buffer layer between the second sealing structures 104 improves the drop resistance and pressure resistance of the package 100.

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Abstract

一种封装件及其封装方法、OLED装置。该封装件包括：相对设置的第一基板(101)和第二基板(102)；其中，设置于第一基板(101)和第二基板(102)之间的第一密封结构(103)，第一密封结构(103)、第一基板(101)与第二基板(102)围成第一空腔(200)；设置于第一基板(101)和第二基板(102)之间的第二密封结构(104)，第二密封结构(104)位于第一密封结构(103)的外侧，且与第一密封结构(103)、第一基板(101)以及第二基板(102)围成第二空腔(300)。该封装件可应用于OLED器件的封装技术中，可提高OLED器件的防摔、抗压性能，增加整个OLED器件的机械性能。

Description

封装件及其封装方法、OLED装置 技术领域
本公开涉及一种封装件及其封装方法、OLED装置。
背景技术
有机发光二极管(Organic Light-Emitting Diode，OLED)因具有自发光、反应快、视角广、亮度高、色彩艳、轻薄等优点而被广泛应用在显示技术中。
一种OLED器件封装技术是使用玻璃浆料(浆料frit)封装工艺，如图1所示，在OLED器件中，玻璃盖板01和玻璃背板02之间设有OLED结构03，该OLED主体结构具体包括有机发光功能层等，由于有机发光功能层在有水汽和氧存在的条件下，都会发生不可逆的光氧化反应，因此，为保证OLED器件的密封性，在玻璃盖板01与玻璃背板02对位贴合后，用激光使玻璃浆料熔化形成frit密封层04，完成OLED器件的封装。
但是，frit封装工艺中使用的玻璃浆料大多为硬质材料，因此，导致OLED器件的防摔、抗压性能较差，影响整个OLED器件的机械性能。
发明内容
根据本公开的一个实施例提供一种封装件，包括：相对设置的第一基板和第二基板；设置于所述第一基板和所述第二基板之间的第一密封结构，所述第一密封结构、所述第一基板与所述第二基板围成第一空腔；设置于所述第一基板和所述第二基板之间的第二密封结构，所述第二密封结构位于所述第一密封结构的外侧，且与所述第一密封结构、所述第一基板以及所述第二基板围成第二空腔。
根据本公开的另一个实施例提供一种OLED装置，包括：如上所述的封装件，以及设置在所述封装件的第一空腔内的OLED结构。
根据本公开的另一个实施例提供一种封装方法，包括：在具有烧结的玻璃浆料的第一基板上涂覆UV胶；所述玻璃浆料位于所述第一基板的第一密封区域，所述UV胶位于所述第二基板的第二密封区域，所述第二密封区域 位于所述第一密封区域的外侧；将所述第一基板与设置有OLED结构的第二基板进行对位贴合；在所述第一基板和所述第二基板之间的所述第一密封区域形成第一密封结构，并在所述第二密封区域形成第二密封结构，其中，所述第一密封结构、所述第一基板与所述第二基板围成第一空腔；所述第二密封结构位于所述第一密封结构外侧，且与所述第一密封结构、所述第一基板以及所述第二基板围成第二空腔。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1为一种封装OLED器件的结构示意图；
图2a为本公开实施例提供的一种封装件的剖面图一；
图2b为本公开实施例提供的一种封装件的俯视图；
图3为本公开实施例提供的一种封装件的剖面图二；
图4为本公开实施例提供的一种封装件的剖面图三；
图5为本公开实施例提供的一种封装方法的流程图一；
图6为本公开实施例提供的一种封装方法的流程图二。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
以下描述中，为了说明而不是为了限定，提出了诸如特定***结构、接口、技术之类的具体细节，以便透彻理解本发明。然而，本领域的技术人员应当清楚，在没有这些具体细节的其它实施例中也可以实现本发明。在其它情况中，省略对众所周知的装置、电路以及方法的详细说明，以免不必要的细节妨碍本发明的描述。
另外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。
如图2a和2b所示，本公开的实施例提供一种封装件100(其中，图2a为该封装件100的剖面图，图2b为该封装件100的俯视图)。该封装件100包括相对设置的第一基板101和第二基板102；以及，设置于第一基板101和第二基板102之间的第一密封结构103。第一密封结构103、第一基板101与第二基板102围成第一空腔200，该第一空腔200可用于放置OLED结构。这里的OLED结构可以是OLED整体结构或OLED的一部分，例如有机发光功能层、空穴传输层和电子传输层等，这些层也可以称为OLED的主体结构。
第一基板101和第二基板102之间还设置有第二密封结构104，该第二密封结构104位于第一密封结构103的外侧，且与第一密封结构103、第一基板101以及第二基板102围成第二空腔300。该第二空腔可以减缓第一密封结构103受到的冲击力。
另外需要说明的是，为进一步减缓第一密封结构103受到的冲击力，设置在第一基板101和第二基板102之间的第二空腔300可以有多个，本发明对此不作限制。
可以看出，由于在该封装件100内的第一密封结构103和第二密封结构104之间形成第二空腔300，该第二空腔300用于减缓第一密封结构103受到的冲击力，这样一来，第二空腔300可以作为第一密封结构103与第二密封结构104之间的缓冲层，使第一空腔200内的封装材料尽可能少的受到外界施加的冲击力，进而提高整个封装件100的防摔、抗压性能。
例如，如图2所示，第一密封结构103和第二密封结构104的平行于所述第一基板的截面均为环形形状，这样，第一密封结构103和第二密封结构104可以配合第一基板和第二基板形成第一空腔和第二空腔。
第一空腔200内可以放置OLED主体结构，例如OLED装置的空穴传输层、有机发光层或电子传输层，由于OLED主体结构在有水汽和氧存在的条件下，都会发生不可逆的光氧化反应，因此，封装件100内的多重密封结构 可以防止水氧侵入OLED主体结构的同时，通过第一密封结构103与第二密封结构104之间的缓冲层提高封装件100的防摔、抗压性能。
进一步地，该第二空腔300内填充有起泡剂和/或有机胶。
起泡剂是一种表面活性物质，主要是在气-水界面上降低界面张力，促使空气在料浆中形成小气泡，扩大分选界面，并保证气泡上升形成泡沫层。而有机胶是指含有Si-C键、且至少有一个有机基是直接与硅原子相连的化合物。具有低弹性模量的有机胶和起泡剂都可以作为有效的缓冲材料，因此，将起泡剂和/或有机胶填充在第二空腔300内，可以增加第一密封结构103与第二密封结构104之间的缓冲层的缓冲作用，进一步提高封装件100的防摔、抗压性能。
在进一步地，还可以在上述起泡剂和/或有机胶中添加干燥剂，例如硫酸钙等与水氧反应活泼的物质，这样，可以在第一空腔200内封装材料的周围形成有效的保护层，防止水氧侵入封装材料。
示例性的，基于图2a和图2b提供的封装件100，如图3(图3为该封装件100的剖面图)所示，在第一基板101上还设有与第二空腔300连通的连接孔105，这样，可以通过该连接孔105将上述起泡剂和/或有机胶注入第二空腔300中。
进一步地，基于图3提供的封装件100，如图4(图4为该封装件100的剖面图)所示，连接孔105上还可以设置填充熔体(可熔体)106，该可熔体106为吸收微波或者激光的玻璃混合物，该可熔体106可用于密封连接孔105，这样，在将上述起泡剂和/或有机胶注入第二空腔300后，可以使用激光或微波加热连接孔105上的可熔体106，使可熔体106加热熔化后将连接孔105封装，这种封装工艺的热影响区域较小，不会产生过多的残余应力导致第一基板101发生翘曲。
另外，封装件100中的第一密封结构103，可以具体是通过frit封装工艺，将玻璃浆料经过烧结和激光扫描后固化形成的密封结构；而封装件100中的第二密封结构104，可以具体是通过UV封装工艺，将UV胶固化后形成的密封结构，也就是固化的UV胶。经过frit封装工艺形成的密封结构防水氧的能力较强，但机械性能较差，而UV封装工艺相对简单，因此，通过上述工艺形成多重密封结构的封装件100，可以简化制作工艺，并尽可能的提高 封装件100的防水氧的能力。
本公开的实施例提供一种封装件，该封装件包括相对设置的第一基板和第二基板，其中，所述第一基板和所述第二基板之间设置有第一密封结构，所述第一密封结构、所述第一基板与所述第二基板围成第一空腔，该第一空腔用于放置OLED主体结构；所述第一基板和所述第二基板之间还设置有第二密封结构，第二密封结构位于第一密封结构外侧，且与所述第一密封结构、所述第一基板以及所述第二基板围成第二空腔，该第二空腔可用于减缓所述第一密封结构受到的冲击力，这样一来，第二空腔可以作为第一密封结构与第二密封结构之间的缓冲层，使第一空腔内的OLED主体结构尽可能少的受到外界施加的冲击力，进而提高整个封装件的防摔、抗压性能。
图5为本发明实施例提供的一种封装方法，本公开实施例提供的封装方法用于制作上述图1-图4所示的封装件100，为了便于说明，仅示出了与本发明实施例相关的部分，具体技术细节未揭示的，请参照图1-图4所示的本发明各实施例。
例如，以OLED装置为例，上述封装方法包括：
101、在具有烧结的玻璃浆料的第一基板上涂覆UV胶。
OLED器件例如包括第一基板，以及形成有OLED主体结构的第二基板，在封装OLED器件时，需要将第一基板与第二基板对位贴合后进行封装，使OLED器件内的OLED主体结构处于防水防氧的封闭空间内。
该玻璃浆料位于第一基板的第一密封区域，该UV胶位于第二基板的第二密封区域，该第二密封区域位于该第一密封区域的外侧。
例如，可以使用丝网印刷在第一基板需要封装的第一密封区域涂覆玻璃浆料，进而将涂覆有玻璃浆料的第一基板放入烧结炉中烧结，最终在烧结后的第一基板的第二密封区域上涂覆UV胶，其中，UV胶在紫外线光照射下，可以固化并作为黏贴剂使用。
102、将第一基板与形成有OLED主体结构的第二基板进行对位贴合。
103、在第一基板以和第二基板之间的第一密封区域形成第一密封结构，并在第二密封区域形成第二密封结构。
第一密封结构、第一基板与第二基板围成第一空腔；第二密封结构位于第一密封结构外侧，且与第一密封结构、第一基板以及第二基板围成第二空 腔。
例如，可以使用UV封装工艺，用紫外线照射第一基板上涂覆UV胶的位置(即第二密封区域)，将第一基板与第二基板进行第一次封装，形成所述第二密封结构；进而，使用frit封装工艺，在第一基板上烧结有玻璃浆料的位置(即第一密封区域)进行第二次封装，形成所述第一密封结构。
参见图2a或图2b，该第一密封结构、第一基板以及第二基板围成第一空腔；该第一密封结构、第二密封结构、第一基板以及第二基板围成第二空腔。该第二空腔可以作为第一密封结构与第二密封结构之间的缓冲层，使第一空腔内的OLED主体结构尽可能少的受到外界施加的冲击力，进而提高整个封装件的防摔、抗压性能。
示例性的，第一基板上还可以设有与第二空腔连通的连接孔，该连接孔上还设置有可熔体，其中，该可熔体为吸收微波或者激光的玻璃混合物，此时，本发明的实施例提供一种封装方法具体如图6所示，包括：
201、在烧结有玻璃浆料的第一基板上涂覆UV胶。
具体的，可以使用丝网印刷工艺，按照丝网上预先设计好的图案，在第一基板的第一密封区域涂覆玻璃浆料，进而将涂覆有玻璃浆料的第一基板放入烧结炉中烧结，最终，在烧结后的第一基板上的第二密封区域涂覆UV胶。
202、将第一基板与形成有OLED主体结构的第二基板进行对位贴合。
203、使用紫外线照射第一基板上涂覆UV胶的位置，形成第二密封结构。
由于UV胶在紫外线光照射下，可以固化并作为黏贴剂使用，因此，可以使用UV封装工艺，对第一基板上涂覆UV胶的位置照射紫外线，形成的第一密封结构分别与第一基板和第二基板黏贴。
204、使用玻璃浆料封装工艺在第一基板上烧结有玻璃浆料的位置形成第一密封结构。
例如，使用frit封装工艺，对第一基板上烧结有玻璃浆料的位置进行激光扫描，形成第一密封结构，其中，第一密封结构和步骤203中的第二密封结构之间设有间隙，这样，第二密封结构分别与第二密封结构、第一基板以及第二基板黏贴，形成第二空腔。
205、从第一基板上的连接孔向第二空腔内注入起泡剂和/或有机胶。
由于第一基板上预先设置有穿透的连接孔，因此，可以通过该连接孔向 第二空腔内注入起泡剂和/或有机胶，由于有机胶和起泡剂都可以作为有效的缓冲材料，因此，将起泡剂和/或有机胶填充在第二空腔内，可以增加第一密封结构与第二密封结构之间的缓冲层的缓冲作用，进一步提高封装件的防摔、抗压性能。
另外，还可以在上述起泡剂和/或有机胶中添加干燥剂，例如硫酸钙等与水氧反应活泼的物质，这样，可以在第一空腔内OLED主体结构的周围形成有效的保护层，防止水氧侵入OLED主体结构。
206、使用微波或者激光加热该连接孔上的填充熔体，使填充熔体熔化后密封连接孔。
最后，在将上述起泡剂和/或有机胶注入第二空腔后，可以使用激光或微波加热连接孔上的填充熔体，使填充熔体加热熔化后将连接孔封装，这种封装工艺的热影响区域较小，不会产生过多的残余应力导致第一基板发生翘曲。
本公开的实施例提供一种封装方法，在相对设置的第一基板和第二基板之间设置第一密封结构，所述第一密封结构、所述第一基板与所述第二基板围成第一空腔，该第一空腔用于放置OLED主体结构；在第一基板和第二基板之间还设置第二密封结构，第二密封结构位于第一密封结构外侧，且与所述第一密封结构、所述第一基板以及所述第二基板围成第二空腔，该第二空腔可用于减缓所述第一密封结构受到的冲击力，这样一来，第二空腔可以作为第一密封结构与第二密封结构之间的缓冲层，使第一空腔内的OLED主体结构尽可能少的受到外界施加的冲击力，进而提高整个封装件的防摔、抗压性能。
进一步地，本公开的实施例还提供一种OLED装置，该OLED装置具体包括上述实施例中所述的封装件100，以及设置在所述封装件100的第一空腔200内的OLED主体结构，其中，该OLED主体结构可以具体包括OLED装置的空穴传输层、有机发光层或电子传输层。由于OLED主体结构在有水汽和氧存在的条件下，都会发生不可逆的光氧化反应，因此，封装件100内的多重密封结构可以防止水氧侵入OLED主体结构的同时，通过第一密封结构103与第二密封结构104之间的缓冲层提高封装件100的防摔、抗压性能。
在本说明书的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本申请要求于2015年6月8日递交的中国专利申请第201510312061.6号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (16)

  1. 一种封装件，包括：
    相对设置的第一基板和第二基板；
    设置于所述第一基板和所述第二基板之间的第一密封结构，所述第一密封结构、所述第一基板与所述第二基板围成第一空腔；
    设置于所述第一基板和所述第二基板之间的第二密封结构，所述第二密封结构位于所述第一密封结构的外侧，且与所述第一密封结构、所述第一基板以及所述第二基板围成第二空腔。
  2. 根据权利要求1所述的封装件，其中，所述第二空腔内填充有起泡剂和有机胶的至少一种。
  3. 根据权利要求2所述的封装件，其中，所述起泡剂和有机胶的至少一种中含有干燥剂。
  4. 根据权利要求2或3所述的封装件，其中，所述第一基板上还设有与所述第二空腔连通的连接孔，所述连接孔用于注入所述起泡剂和所述有机胶的至少一种。
  5. 根据权利要求4所述的封装件，其中，所述连接孔中还设置有可熔体，所述可熔体用于密封所述连接孔。
  6. 根据权利要求5所述的封装件，其中，所述可熔体为吸收微波或者激光的玻璃混合物。
  7. 根据权利要求1-7中任一项所述的封装件，其中，所述第一密封结构为玻璃浆料经过烧结和激光扫描后固化形成的。
  8. 根据权利要求1-8中任一项所述的封装件，其中，所述第二密封结构为固化的UV胶。
  9. 根据权利要求1-8中任一项的封装件，其中，所述第一密封结构和第二密封结构的平行于所述第一基板截取的截面均为环形形状。
  10. 一种OLED装置，包括：如权利要求1-9中任一项所述的封装件，以及设置在所述封装件的第一空腔内的OLED结构。
  11. 一种封装方法，包括：
    在具有烧结的玻璃浆料的第一基板上涂覆UV胶；所述玻璃浆料位于所 述第一基板的第一密封区域，所述UV胶位于所述第二基板的第二密封区域，所述第二密封区域位于所述第一密封区域的外侧；
    将所述第一基板与设置有OLED结构的第二基板进行对位贴合；
    在所述第一基板和所述第二基板之间的所述第一密封区域形成第一密封结构，并在所述第二密封区域形成第二密封结构，其中，所述第一密封结构、所述第一基板与所述第二基板围成第一空腔；所述第二密封结构位于所述第一密封结构外侧，且与所述第一密封结构、所述第一基板以及所述第二基板围成第二空腔。
  12. 根据权利要求11所述的方法，其中，在对位贴合中，所述第一基板的设置有所述玻璃浆料和所述UV胶的一侧和所述第二基板的设置有所述OLED结构的一侧彼此面对。
  13. 根据权利要求11或12所述的方法，其中，所述第一密封区域和所述第二密封区域均具有环形形状。
  14. 根据权利要求11-13中任一项所述的方法，其中，在所述第一基板和所述第二基板之间形成第一密封结构和第二密封结构，包括：
    使用紫外线照射所述第一基板上涂覆UV胶的位置，使所述UV胶固化形成所述第二密封结构；
    使用玻璃浆料封装工艺使所述第一基板上的烧结的玻璃浆料形成所述第一密封结构。
  15. 根据权利要求14所述的方法，其中，所述第一基板中设有与所述第二空腔连通的连接孔，
    在使用玻璃浆料封装工艺使所述第一基板上的烧结的玻璃浆料形成所述第一密封结构之后，还包括：
    从所述连接孔向所述第二空腔内注入起泡剂和/或有机胶。
  16. 根据权利要求15所述的方法，其中，在从所述连接孔向所述第二空腔内注入起泡剂和/或有机胶之后，还包括：
    在所述连接孔上设置可熔体，并使用微波或者激光加热所述可熔体，使所述可熔体熔化后密封所述连接孔。
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