WO2016067709A1 - 基板検査装置、及び基板検査方法 - Google Patents
基板検査装置、及び基板検査方法 Download PDFInfo
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- WO2016067709A1 WO2016067709A1 PCT/JP2015/072558 JP2015072558W WO2016067709A1 WO 2016067709 A1 WO2016067709 A1 WO 2016067709A1 JP 2015072558 W JP2015072558 W JP 2015072558W WO 2016067709 A1 WO2016067709 A1 WO 2016067709A1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/08—Measuring resistance by measuring both voltage and current
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2839—Fault-finding or characterising using signal generators, power supplies or circuit analysers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/0418—Control or interface arrangements specially adapted for digitisers for error correction or compensation, e.g. based on parallax, calibration or alignment
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2605—Measuring capacitance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2829—Testing of circuits in sensor or actuator systems
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Definitions
- the present invention relates to a substrate inspection apparatus and a substrate inspection method for inspecting a substrate.
- Patent Document 1 is known as an inspection method for such a resistive film type touch panel.
- capacitive touch panels have been widely used in which transparent electrodes arranged in a lattice pattern are arranged on the touch surface and the touch position is detected based on the capacitance generated when the user touches the panel with a finger.
- the capacitive touch panel has a XY two-dimensional coordinate set on the panel surface, and a plurality of transparent electrodes extending in the X direction on a transparent substrate such as glass to correspond to the XY coordinate, A plurality of transparent electrodes extending in the Y direction are arranged to be opposed to each other.
- a capacitance measuring device is used for measuring the capacitance, and a resistance measuring device such as a tester is used for measuring the resistance value. For this reason, a capacitance measuring step and a resistance measuring step are required, which increases the number of inspection steps.
- An object of the present invention is such that a plurality of first electrodes extending along a predetermined first direction and a plurality of second electrodes extending along a second direction intersecting the first direction face each other, such as a touch panel.
- An object of the present invention is to provide a substrate inspection apparatus and a substrate inspection method that can easily reduce the man-hours for measuring capacitance and resistance when inspecting a substrate formed in such a manner.
- a plurality of first electrodes extending along a predetermined first direction and a plurality of second electrodes extending along a second direction intersecting the first direction are opposed to each other.
- the first and second connection terminals corresponding to a plurality of combinations obtained in the above-described manner are supplied to the second connection terminal by the AC voltage output unit with respect to the second connection terminals, and the first connection is performed.
- Flow to terminal By causing the current detection unit to detect a current, a measurement processing unit that executes a measurement process for obtaining a current corresponding to each combination, and a magnitude and a phase of the current detected by the current detection unit in the measurement process And a calculation unit that executes a calculation process for calculating a capacitance and a resistance value corresponding to each combination based on the information shown.
- a plurality of first electrodes extending along a predetermined first direction and a plurality of second electrodes extending along a second direction intersecting the first direction are opposed to each other.
- the alternating current voltage is supplied with respect to the 2nd connection terminal, and the measurement process which acquires the electric current corresponding to each said combination is performed by detecting the electric current which flows into the 1st connection terminal Measurement And a calculation step of executing a calculation process of calculating a capacitance and a resistance value corresponding to each combination based on the processing step and information indicating the magnitude and phase of the current detected in the measurement process.
- the plurality of first electrodes extending along the predetermined first direction and the plurality of second electrodes extending along the second direction intersecting the first direction are formed to face each other.
- a plurality of combinations obtained by combining a plurality of first connection terminals and a plurality of second connection terminals respectively, that is, each combination of a plurality of first electrodes and a plurality of second electrodes
- each combination is supported based on information indicating the magnitude and phase of the detected current.
- a capacitance and a resistance value are calculated. As a result, it is not necessary to separately execute the capacitance measurement step and the resistance value measurement step.
- the substrate formed so that the plurality of first electrodes extending along the predetermined first direction and the plurality of second electrodes extending along the second direction intersecting the first direction are opposed to each other is inspected. In this case, it becomes easy to reduce the man-hours for measuring the capacitance and the resistance value.
- the substrate includes a plurality of first substrate terminals that respectively conduct with the plurality of first electrodes, and a plurality of second substrate terminals that respectively conduct with the plurality of second electrodes, and the plurality of first connections.
- the terminals are respectively connected to the plurality of first substrate terminals, are electrically connected to the plurality of first electrodes through the plurality of first substrate terminals, and the plurality of second connection terminals are connected to the plurality of first substrate terminals. It is preferable that each of the second substrate terminals is electrically connected to the plurality of second electrodes via the plurality of second substrate terminals.
- the first and second connection terminals are connected to the first and second substrate terminals without directly connecting the first and second connection terminals to the first and second electrodes. Since the first and second electrodes can be inspected via the two substrate terminals, it is easy to perform the substrate inspection while reducing the possibility of causing damage by scratching the first and second electrodes. Become.
- the substrate supplies an alternating current signal having a preset read frequency to each of the first and second electrodes in order to read a capacitance at a position where each of the first electrodes and each of the second electrodes intersects. It is preferable that the frequency of the alternating voltage is substantially equal to the reading frequency.
- the touch panel since the touch panel is inspected using an AC voltage having a frequency substantially equal to the reading frequency used when the touch panel is used, the touch panel can be inspected under conditions close to actual use conditions.
- an internal parameter storage unit that stores an electrostatic capacitance and a resistance value generated inside the substrate inspection apparatus corresponding to each combination as an internal electrostatic capacitance and an internal resistance value
- the calculation unit further includes The internal parameter correction process for correcting the capacitance and the resistance value corresponding to each combination based on the internal capacitance and the internal resistance value stored in the internal parameter storage unit corresponding to each combination. Is preferably performed.
- the influence of the capacitance and the resistance value generated inside the substrate inspection apparatus is reduced from the capacitance and the resistance value measured and calculated corresponding to the combination of the first and second electrodes. Therefore, it is possible to improve the acquisition accuracy of the capacitance and the resistance value of the inspection target location.
- the measurement processing and the calculation processing are executed by the measurement processing unit and the calculation unit in a state where the plurality of first and second electrodes and the plurality of first and second connection terminals are not connected.
- An internal parameter acquisition processing unit that stores the capacitance and the resistance value obtained corresponding to each combination in the internal parameter storage unit as the internal capacitance and the internal resistance value corresponding to each combination. It is preferable to further provide.
- a stray capacitance storage unit that stores stray capacitance generated in the substrate corresponding to each combination is further included, and the calculation unit calculates a capacitance corresponding to each combination corresponding to the combination. It is preferable to execute a stray capacitance correction process in which correction is performed based on the stray capacitance stored in the stray capacitance storage unit.
- the influence of the stray capacitance generated on the substrate can be reduced from the measured and calculated capacitance corresponding to the combination of the first and second electrodes.
- the acquisition accuracy can be improved.
- a reference capacitance storage unit that stores the reference capacitance corresponding to each combination of the reference substrates in which a reference capacitance that is a capacitance generated inside the substrate corresponding to each combination is known in advance; In the state in which the plurality of first and second connection terminals are connected to the reference substrate, the measurement processing and the calculation processing are executed by the measurement processing unit and the calculation unit, so that each combination is performed. Based on the capacitance obtained correspondingly and the reference capacitance stored corresponding to each combination by the reference capacitance storage unit, the stray capacitance corresponding to each combination is calculated, It is preferable to further include a stray capacitance acquisition processing unit to be stored in the stray capacitance storage unit.
- the stray capacitance generated in the substrate corresponding to each combination can be measured and calculated, and stored in the stray capacitance storage unit.
- a display unit that displays an image representing the resistance value calculated by the calculation process and corresponding to each combination in a three-dimensional graph.
- each combination corresponds to a combination of a plurality of first electrodes and a plurality of second electrodes, that is, corresponds to a coordinate position on the substrate.
- the user can visually confirm the resistance value corresponding to the position on the substrate.
- a display unit that displays an image representing the capacitance corresponding to each combination calculated by the calculation process in a three-dimensional graph.
- each combination corresponds to a combination of a plurality of first electrodes and a plurality of second electrodes, that is, corresponds to a coordinate position on the substrate.
- the user can visually confirm the capacitance corresponding to the position on the substrate.
- a display unit that displays an image representing a difference corresponding to each combination calculated by the determination unit in a three-dimensional graph.
- each combination corresponds to a combination of a plurality of first electrodes and a plurality of second electrodes, that is, corresponds to a coordinate position on the substrate.
- a determination value storage unit that stores in advance a determination value serving as a criterion for determining whether or not the resistance value corresponds to each combination, a resistance value corresponding to each combination obtained by the calculation unit, and each combination
- a determination value storage unit that stores in advance a determination value serving as a criterion for determining whether or not the resistance value corresponds to each combination, a resistance value corresponding to each combination obtained by the calculation unit, and each combination
- the substrate inspection apparatus and the substrate inspection method having such a configuration include a plurality of first electrodes extending along a predetermined first direction, and a plurality of second electrodes extending along a second direction intersecting the first direction. In inspecting the substrates formed so as to face each other, it becomes easy to reduce the man-hours for measuring the capacitance and the resistance value.
- FIG. 1 It is a block diagram which shows notionally an example of composition of a substrate inspection device concerning one embodiment of the present invention. It is the conceptual diagram which simplifies and shows notionally the board
- FIG. 1 is a block diagram conceptually showing an example of the configuration of a substrate inspection apparatus according to an embodiment of the present invention.
- a substrate inspection apparatus 1 shown in FIG. 1 includes an AC power supply 2 (AC voltage output unit), an ammeter 3 (current detection unit), a control unit 4, a display unit 5 (notification unit), an operation unit 6, and connection terminals Tx1 to Tx4. (First connection terminal), connection terminals Ty1 to Ty4 (second connection terminal), and changeover switches SW1 and SW2.
- the connection terminals Tx1 to Tx4 may be the second connection terminals, and the connection terminals Ty1 to Ty4 may be the first connection terminals.
- a touch panel substrate P (substrate) to be inspected is connected to the substrate inspection apparatus 1 shown in FIG.
- XY coordinates are set.
- the horizontal direction is the X axis and the vertical direction is the Y axis.
- the touch panel substrate P has a plurality of X electrodes X1 to X4 (first electrodes) that are spaced apart from each other and extend along the Y-axis direction (first direction) on the surface of a transparent substrate Pa such as glass.
- a plurality of Y electrodes Y1 to Y4 (second electrodes) extending along the X-axis direction (second direction) that are spaced apart from each other and perpendicularly intersect the Y-axis direction are the thickness direction of the touch panel substrate P (the depth direction in the drawing) ) To face each other.
- the X electrodes X1 to X4 correspond to the X coordinate
- the Y electrodes Y1 to Y4 correspond to the Y coordinate.
- the combination of the X electrode X1 and the Y electrode Y1 corresponds to the coordinate position (X1, Y1) on the touch panel substrate P
- the combination of the X electrode Xm and the Y electrode Yn is the coordinate position (Xm, Yn) on the touch panel substrate P.
- M and n are arbitrary integers).
- the substrate does not necessarily have to be a touch panel substrate.
- a touch panel substrate For example, a printed wiring board, a flexible substrate, a ceramic multilayer wiring board, an electrode plate for a liquid crystal display or a plasma display, a package substrate for a semiconductor package, a film carrier, etc.
- Various substrates may be used.
- the X electrodes X1 to X4 and the Y electrodes Y1 to Y4 are so-called transparent electrodes, and are made of, for example, indium tin oxide (Indium Tin Oxide, ITO), indium zinc oxide (Indium Zinc Oxide, IZO), or the like.
- ITO Indium Tin Oxide
- IZO indium zinc oxide
- Various materials can be used for the X electrodes X1 to X4 and the Y electrodes Y1 to Y4, and they are not necessarily transparent electrodes.
- an insulating film is formed between the X electrodes X1 to X4 and the Y electrodes Y1 to Y4 to be electrically insulated from each other. Further, a slight gap is generated between the X electrodes X1 to X4 and the Y electrodes Y1 to Y4 depending on the thickness of the insulating coating.
- the shapes of the X electrodes X1 to X4 and the Y electrodes Y1 to Y4 are each a pattern in which a plurality of small rhombuses having a certain size are skewed, and the wide portions and the narrow portions are alternately repeated in the longitudinal direction. Appears.
- the X electrodes X1 to X4 and the Y electrodes Y1 to Y4 intersect each other in plan view at the narrow portion. Thereby, almost all of the area where the touch position can be detected (hereinafter referred to as the touch area) is covered by any one of the X electrodes X1 to X4 and the Y electrodes Y1 to Y4.
- the touch panel substrate P includes substrate terminals Px1 to Px4 (first substrate terminals) electrically connected to the X electrodes X1 to X4 and substrate terminals Py1 to Py4 (second substrate terminals) electrically connected to the Y electrodes Y1 to Y4. And are formed.
- the substrate terminals Px1 to Px4 and the substrate terminals Py1 to Py4 are formed by screen printing using a conductive paste material such as silver paste or copper paste.
- the substrate terminals Px1 to Px4 and Py1 to Py4 may be connectors or other connection means, for example.
- the substrate terminals Px1 to Px4 and Py1 to Py4 are not limited to the above-described example as long as they electrically connect the X electrodes X1 to X4 and Y electrodes Y1 to Y4 and the connection terminals Tx1 to Tx4 and Ty1 to Ty4. .
- the substrate terminals Px1 to Px4, Py1 to Py4 may not be provided, and the X electrodes X1 to X4 and Y electrodes Y1 to Y4 may be directly connected to the connection terminals Tx1 to Tx4 and Ty1 to Ty4.
- FIG. 2 is a conceptual diagram conceptually showing the substrate inspection apparatus 1 shown in FIG. 1 in a simplified manner.
- the substrate inspection apparatus 1 shown in FIG. 2 an example including seven X electrodes X1 to X7 and five Y electrodes Y1 to Y5 is shown.
- the substrate inspection apparatus 1 includes substrate terminals Px1 to Px7 (first substrate terminals) and connection terminals Tx1 to Tx7 (first substrate) corresponding to the X electrodes X1 to X7.
- Board terminal Py1 to Py5 second board terminal
- connection terminals Ty1 to Ty7 second connection terminal
- a switch Description will be made assuming that the switch SW2 is provided.
- connection terminals Tx1 to Tx7 and Ty1 to Ty5 are collectively referred to as connection terminals Tx and Ty, respectively.
- the touch panel substrate P When the touch panel substrate P is incorporated into a product and used, the touch panel substrate P is an AC signal having a reading frequency f0 set in advance to read the capacitance at the position where the X electrode X and the Y electrode Y intersect. Is supplied to the Y electrode Y through the connection terminal Ty and the substrate terminal Py, and is supplied to the X electrode X through the capacitance at the intersecting position. As the reading frequency f0 increases, the position detection speed of the touch panel can be increased, and the responsiveness of the touch panel is improved.
- the reading frequency f0 at which appropriate responsiveness of the touch panel is obtained is, for example, a frequency of 100 kHz to 1 MHz, more preferably about 300 kHz to 500 kHz. Are used.
- connection terminals Tx1 to Tx7 and Ty1 to Ty5 are connection terminals configured to be connectable to the substrate terminals Px1 to Px7 and Py1 to Py5.
- the connection terminals Tx1 to Tx7 and Ty1 to Ty5 are connected to the substrate terminals Px1 to Px7 and Py1 to Py5 when the user attaches the touch panel substrate P to be inspected to a predetermined attachment position of the substrate inspection apparatus 1, for example.
- Tx1 to Tx7 and connection terminals Ty1 to Ty5 are electrically connected to the X electrodes X1 to X7 and the Y electrodes Y1 to Y5.
- the changeover switch SW1 switches the connection destinations of the connection terminals Tx1 to Tx7 between the ammeter 3 and the circuit ground, respectively, according to a control signal from the control unit 4.
- the changeover switch SW2 switches the connection destinations of the connection terminals Ty1 to Ty5 between the AC power supply 2 and the circuit ground, respectively, according to a control signal from the control unit 4.
- the AC power supply 2 supplies the AC signal SA of the output voltage V with an effective value, for example, to the connection terminal Ty selected by the changeover switch SW2.
- the AC signal SA is, for example, a sine wave or a rectangular wave.
- the frequency f of the AC signal SA is set to a frequency substantially equal to the reading frequency f0, for example, a frequency range of f0 ⁇ 0.9 to f0 ⁇ 1.1. By setting the frequency f to be a frequency substantially equal to the reading frequency f0, the touch panel substrate P can be inspected under the same conditions as the use conditions of the touch panel substrate P, so that the reliability of the inspection can be improved.
- the ammeter 3 detects the current flowing through the connection terminal Tx selected by the changeover switch SW1, and outputs information indicating the current value I and the phase difference ⁇ to the control unit 4.
- the phase difference ⁇ indicates the difference in the phase of the detected current with respect to the AC signal SA.
- the control unit 4 may calculate the phase difference ⁇ between the AC signal SA and the detected current.
- the display unit 5 is a display device such as a liquid crystal display device or an organic EL (ElectroLuminescence) display.
- the operation unit 6 is an operation device that receives a user operation input.
- an operation switch, a keyboard, a touch panel, or the like is used as the operation unit 6, for example.
- the control unit 4 includes, for example, a CPU (Central Processing Unit) that executes predetermined arithmetic processing, a RAM (Random Access Memory) that temporarily stores data, and a nonvolatile ROM (Read Only Memory) that stores a predetermined control program. And a storage device such as HDD (Hard Disk Drive), an internal parameter storage unit 45 configured by a storage device such as HDD, a floating parameter storage unit 46 (floating capacity storage unit), a reference parameter storage unit 47 (reference capacity storage unit) , And a storage unit such as a determination value storage unit 48 and peripheral circuits thereof.
- a CPU Central Processing Unit
- RAM Random Access Memory
- ROM Read Only Memory
- control unit 4 executes, for example, a control program stored in the above-described storage device, thereby measuring the measurement processing unit 41, the calculation unit 42, the internal parameter acquisition processing unit 43, and the floating parameter acquisition processing unit 44 (floating capacitance acquisition processing). And a determination unit 49.
- the measurement processing unit 41 corresponds to a plurality of combinations obtained by combining the connection terminals Tx1 to Tx7 and the connection terminals Ty1 to Ty5, and the connection terminal Txm and the connection terminal Tyn corresponding to each of the combinations are connected.
- An AC signal SA is supplied to the terminal Tyn by the AC power supply 2 and the current flowing through the connection terminal Txm is detected by the ammeter 3.
- the measurement process part 41 performs the measurement process which acquires the electric current value I and phase difference (theta) of the electric current corresponding to those each combination.
- the measurement processing unit 41 selects the connection terminal Txm
- the connection terminal Txm is connected to the ammeter 3 by the changeover switch SW1, and the connection terminals Tx other than the connection terminal Txm are connected to the circuit ground.
- the measurement processing unit 41 connects the connection terminal Tyn to the AC power supply 2 by the changeover switch SW2, and connects the connection terminals Ty other than the connection terminal Tyn to the circuit ground.
- measurement processing unit 41 and the changeover switches SW1 and SW2 may be configured to open (open) connection terminals other than the selected connection terminal.
- connection terminals Tx1 to Tx7 and the connection terminals Ty1 to Ty5 are electrically connected to the X electrodes X1 to X7 and the Y electrodes Y1 to Y5, respectively, the combination of the connection terminal Txn and the connection terminal Tym is an X electrode. This corresponds to a combination of Xn and Y electrode Ym. That is, the combination of the connection terminal Txn and the connection terminal Tym corresponds to the coordinate position (Xm, Yn).
- the measurement processing unit 41 acquires the current value I and the phase difference ⁇ corresponding to all the coordinate positions (X1, Y1) to (X7, Y5) of the touch panel substrate P in the measurement process.
- the current value I corresponding to the coordinate position (Xm, Yn) is referred to as current value I (m, n)
- the phase difference ⁇ corresponding to the coordinate position (Xm, Yn) is referred to as phase difference ⁇ (m, n).
- the measurement processing unit 41 causes the connection terminals Txm and Tyn to be selected by the changeover switches SW1 and SW2 in the measurement process, and causes the ammeter 3 to measure the current value I (m, n) and the phase difference ⁇ (m, n). This is simply referred to as measuring the current value I (m, n) and the phase difference ⁇ (m, n).
- the calculation unit 42 Based on the current value I, which is the magnitude of the current detected by the ammeter 3 in the measurement processing of the measurement processing unit 41, and the phase difference ⁇ , which is information indicating the phase, the calculation unit 42 combines each connection terminal. That is, the capacitance C corresponding to all coordinate positions (X1, Y1) to (X7, Y5) of the touch panel substrate P and the resistance values R of the X electrode and the Y electrode are calculated.
- the capacitance C corresponding to the coordinate position (Xm, Yn) is referred to as capacitance C (m, n)
- the resistance value R corresponding to the coordinate position (Xm, Yn) is referred to as the resistance value R (m, n).
- connection terminals Txm and Tyn are selected in the measurement process of the measurement processing unit 41 shown in FIG. 1, that is, when the measurement process of the coordinate position (Xm, Yn) is executed. It is the equivalent circuit shown.
- the resistance value in the section from the connection point between the connection terminal Tyn and the substrate terminal Pyn to the Y electrode Yn intersecting the X electrode Xm is the resistance value Ry (m, n), and the Y electrode Yn
- the capacitance formed at the intersection between the X electrode Xm and the X electrode becomes the capacitance C (m, n)
- the connection point between the substrate terminal Pxm and the connection terminal Txm from the intersection between the Y electrode Yn and the X electrode Xm The resistance value in the section until reaching the value becomes the resistance value Rx (m, n).
- the circuit to be measured includes a resistance value Ry (m, n), a capacitance C (m, n), and a resistance value Rx (m, n). It is represented by a series circuit. Furthermore, an internal resistance value Ri (m, n), which is a resistance value inside the board inspection apparatus 1 (not shown), and an internal capacitance Ci (m, n) inside the board inspection apparatus 1 are generated.
- a floating capacitance Cf (m, n) and a floating resistance value Rf (m, n) generated accompanying the floating capacitance Cf (m, n) are formed on the touch panel substrate P.
- the floating capacitance Cf (m, n) and the floating resistance value Rf (m, n) are the same as the capacitance C (m, n) and the resistance value Rx (m, n).
- the floating capacitance Cf (m, n) and the floating resistance value Rf (m, n) are generated in the entire circuit to be measured. .
- the measured impedance Z (m, n) is calculated using the equation (1).
- FIG. 4 is a waveform diagram showing the relationship between the voltage waveform of the AC signal SA and the current waveform detected by the ammeter 3.
- FIG. 5 illustrates a method for calculating the resistance value R (m, n) and the capacitance C (m, n) from the measured impedance Z (m, n) and the phase difference ⁇ (m, n). It is explanatory drawing of.
- the frequency f of the AC signal SA is substantially equal to the reading frequency f0.
- the reading frequency f0 is a relatively low frequency because it is a frequency at which a person moves his / her finger on the touch panel. Therefore, the inductance component included in the measurement impedance Z (m, n) generated according to the frequency f of the AC signal SA is very small, and the measurement circuit can be approximated by an RC circuit as shown in FIG.
- the measured impedance Z (m, n) can be decomposed into a resistance component and a capacitance component by vector calculation based on the phase difference ⁇ (m, n).
- the calculation unit 42 calculates the measurement resistance value Rmes (m, n) and the measurement capacitance Cmes (m, n) based on the following formulas (2) and (3). Execute the process.
- the measured resistance value Rmes (m, n) includes the above-described internal resistance value Ri (m, n) and the floating resistance value Rf (m, n).
- the measurement capacitance Cmes (m, n) includes the above-described internal capacitance Ci (m, n) and the floating capacitance Cf (m, n).
- an internal parameter acquisition processing unit 43 and a floating parameter acquisition processing unit 44 are provided.
- the internal parameter acquisition processing unit 43 is not necessarily provided.
- the floating parameter acquisition processing unit 44 attaches the reference substrate Pref to the substrate inspection apparatus 1, and the substrate terminals Px1 to Px7, Py1 to Py5 and the connection terminals Tx1 to Tx7, Ty1 to Ty5 are connected.
- the measurement processing unit 41 and the calculation unit 42 execute the above measurement process and calculation process.
- the floating parameter acquisition processing unit 44 measures the measured capacitance Cmes (m, n) and the measured resistance value Rmes (m, n) obtained in this way, and the reference stored in the reference parameter storage unit 47.
- the calculation unit 42 for example, based on the following formulas (6) and (7), the capacitance C (m, n) and the resistance value R (m, n) of the touch panel substrate P to be inspected.
- Capacitance C (m, n) Cmes (m, n) ⁇ Ci (m, n) ⁇ Cf (m, n) (6)
- the calculation unit 42 does not use the stray capacitance Cf (m, n) and the stray resistance value Rf (m, n) for correction, and may perform correction based on the following equations (8) and (9).
- Capacitance C (m, n) Cmes (m, n) ⁇ Ci (m, n) (8)
- the calculation unit 42 does not use the internal capacitance Ci (m, n) and the internal resistance value Ri (m, n) for correction, and performs correction based on the following equations (10) and (11). Good.
- Capacitance C (m, n) Cmes (m, n) ⁇ Cf (m, n) (10)
- calculation unit 42 does not have to perform correction.
- a resistance determination value Rj (m, n) and a capacitance which are determination values serving as a criterion for pass / fail determination corresponding to the resistance value R (m, n) and the capacitance C (m, n).
- Determination value Cj (m, n) is stored in advance.
- an actual measurement value of a non-defective touch panel substrate P may be used, or a theoretical value in design may be used.
- the determination unit 49 calculates a difference Dr (m, n) between the resistance value R (m, n) obtained by the calculation unit 42 and the resistance determination value Rj (m, n) stored in the determination value storage unit 48. , Calculated for all the coordinate positions (X1, Y1) to (X7, Y5), respectively, and the difference Dr (m, n) corresponding to each coordinate position exceeds a preset difference determination value Drj At this time, the coordinate position (Xm, Yn) exceeding the difference determination value Drj is determined as a resistance defect position of the touch panel substrate P, and the resistance defect position is displayed on the display unit 5.
- the determination unit 49 also determines the difference Dc (m, n) between the capacitance C (m, n) obtained by the calculation unit 42 and the capacitance determination value Cj (m, n) stored in the determination value storage unit 48. n) is calculated for each of the coordinate positions (X1, Y1) to (X7, Y5), and a difference determination value Dcj in which a difference Dc (m, n) corresponding to each coordinate position is set in advance. Is exceeded, the coordinate position (Xm, Yn) exceeding the difference determination value Dcj is determined as a capacitance defect position of the touch panel substrate P, and the capacitance defect position is displayed on the display unit 5.
- FIG. 6 to 9 are flowcharts showing a substrate inspection method according to an embodiment of the present invention.
- the user operates the operation unit 6 to set internal parameters of the substrate inspection apparatus 1.
- an internal parameter acquisition instruction for instructing measurement is input, an internal parameter acquisition instruction is accepted by the operation unit 6 (YES in step S1), and the internal parameter acquisition processing unit 43 executes the internal parameter acquisition process shown in FIG. (Step S2).
- step S1 when the internal parameter acquisition instruction is not accepted by the operation unit 6 (NO in step S1), the internal parameter acquisition processing unit 43 proceeds to step S3 without executing the internal parameter acquisition processing.
- the internal parameter acquisition process shown in FIG. 8 will be described.
- the variables m and n are initialized to 1 by the internal parameter acquisition processing unit 43 (step S101).
- the internal parameter acquisition processing unit 43 causes the measurement processing unit 41 to measure the current value I (m, n) and the phase difference ⁇ (m, n) (step S102).
- step S102 the touch panel substrate P is not attached to the substrate inspection apparatus 1.
- the current flowing in this way is measured in step S102, and the current value I (m, n) and phase difference ⁇ (m, n) of the current are obtained.
- the internal parameter acquisition processing unit 43 causes the calculation unit 42 to calculate the measured impedance Z (m, n) from the current value I (m, n) and the output voltage V, for example, based on the equation (1) (step) S103).
- the internal parameter acquisition processing unit 43 calculates the measurement capacitance Cmes (m, m) based on, for example, the equations (2) and (3) from the measurement impedance Z (m, n) and the phase difference ⁇ (m, n). n) and the measured resistance value Rmes (m, n) are calculated (step S104).
- the internal parameter acquisition processing unit 43 sets the measurement capacitance Cmes (m, n) as the internal capacitance Ci (m, n) and sets the measurement resistance value Rmes (m, n) as the internal resistance value Ri (m, n). n) is stored in the internal parameter storage unit 45 (step S105).
- step S106 If the variable m is not 7 (NO in step S106), that is, if there is an unprocessed X coordinate remaining in the coordinate Yn, the internal parameter acquisition processing unit 43 determines that the internal electrostatic capacitance corresponding to the new X coordinate. In order to obtain the capacitance Ci (m, n) and the internal resistance value Ri (m, n), 1 is added to the variable m (step S107), and steps S102 to S106 are repeated again.
- step S106 when the variable m is 7 (YES in step S106), that is, when the processing is completed for all the X coordinates of the coordinate Yn, the internal parameter acquisition processing unit 43 initializes the variable m to 1 (step S108), The variable n is compared with 5 (step S109).
- step S109 If the variable n is not 5 (NO in step S109), that is, if there is a Y coordinate that has not been processed yet, the internal parameter acquisition processing unit 43 determines that the internal capacitance Ci ( m, n) and 1 are added to the variable n to obtain the internal resistance value Ri (m, n) (step S110), and steps S102 to S109 are repeated again.
- step S109 when the variable n is 5 (YES in step S109), that is, for the combinations of the connection terminal Tx and the connection terminal Ty corresponding to all the coordinate positions (X1, Y1) to (X7, Y5) of the touch panel substrate P, the internal Since the capacitance Ci (m, n) and the internal resistance value Ri (m, n) are stored in the internal parameter storage unit 45, the internal parameter acquisition processing unit 43 ends the internal parameter acquisition processing. Then, the process proceeds to step S3 in FIG.
- the user attaches the reference substrate Pref to the substrate inspection apparatus 1 so that the substrate terminals Px1 to Px7, Py1 to Py5 and the connection terminals Tx1 to Tx7, Ty1 to Ty5 are connected. .
- the operation unit 6 receives the floating parameter acquisition instruction (YES in step S3), and the floating parameter is received.
- the acquisition processing unit 44 executes the floating parameter acquisition process shown in FIG. 9 (step S4).
- the floating parameter acquisition processing unit 44 proceeds to step S5 without executing step S4.
- steps S201 to S204 are executed by the floating parameter acquisition processing unit 44 in the floating parameter acquisition processing shown in FIG.
- Steps S201 to S204 are the same as steps S101 to S104 in FIG. 8 except that the floating parameter acquisition processing unit 44 performs processing instead of the internal parameter acquisition processing unit 43, and thus description thereof is omitted.
- step S205 the floating parameter acquisition processing unit 44 measures the measured capacitance Cmes (m, n) obtained in step S204 and the reference capacitance Cref (m, n) stored in the reference parameter storage unit 47. Based on the above, for example, the floating capacitance Cf (m, n) is calculated using the equation (4) and stored in the floating parameter storage unit 46 (step S205).
- the floating parameter acquisition processing unit 44 is based on the measured resistance value Rmes (m, n) obtained in step S204 and the reference resistance value Rref (m, n) stored in the reference parameter storage unit 47.
- the floating resistance value Rf (m, n) is calculated using the equation (5) and stored in the floating parameter storage unit 46 (step S206).
- step S207 If the variable m is not 7 (NO in step S207), that is, if there is an X coordinate that has not been processed yet in the coordinate Yn, the floating parameter acquisition processing unit 44 sets the floating electrostatic capacitance corresponding to the new X coordinate. In order to obtain the capacitance Cf (m, n) and the floating resistance value Rf (m, n), 1 is added to the variable m (step S208), and steps S202 to S207 are repeated again.
- step S207 when the variable m is 7 (YES in step S207), that is, when the processing is completed for all the X coordinates of the coordinate Yn, the floating parameter acquisition processing unit 44 initializes the variable m to 1 (step S209), The variable n is compared with 5 (step S210).
- step S210 If the variable n is not 5 (NO in step S210), that is, if there is a Y coordinate that has not yet been processed, the floating parameter acquisition processing unit 44 determines the floating capacitance Cf ( m, n) and 1 are added to the variable n to obtain the floating resistance value Rf (m, n) (step S211), and steps S202 to S210 are repeated again.
- step S210 when the variable n is 5 (YES in step S210), that is, the combinations of the connection terminals Tx and the connection terminals Ty corresponding to all the coordinate positions (X1, Y1) to (X7, Y5) of the touch panel substrate P are floating. Since the electrostatic capacitance Cf and the floating resistance value Rf are stored in the floating parameter storage unit 46, the floating parameter acquisition processing unit 44 ends the floating parameter acquisition processing, and proceeds to step S5 in FIG.
- the user When the user inspects the touch panel substrate P, the user attaches the touch panel substrate P to be inspected to the substrate inspection apparatus 1, and the substrate terminals Px1 to Px7, Py1 to Py5 and the connection terminals Tx1 to Tx7, Ty1 to Ty5 are connected.
- the operation start instruction is accepted by the operation unit 6 (YES in step S5), and the measurement processing unit 41
- the variables m and n are initialized to 1 to start the inspection of the touch panel substrate P (step S6).
- the current value I (m, n) and the phase difference ⁇ (m, n) are measured by the measurement processing unit 41 (step S7).
- the measurement unit Z (m, n) is calculated from the current value I (m, n) and the output voltage V by the calculation unit 42 based on, for example, the equation (1) (step S8).
- the calculation unit 42 calculates the measurement capacitance Cmes (m, n) from the measurement impedance Z (m, n) and the phase difference ⁇ (m, n) based on, for example, the equations (2) and (3).
- a measured resistance value Rmes (m, n) is calculated (step S9).
- the measured capacitance Cmes (m, n) and the measured resistance value Rmes (m, n) thus obtained include the capacitance C (m, n) and the resistance value R of the touch panel substrate P to be inspected.
- the calculation unit 42 calculates the measured capacitance Cmes (m, n) from the internal capacitance Ci (m, n) stored in the internal parameter storage unit 45 and the floating static storage stored in the floating parameter storage unit 46. Based on the capacitance Cf (m, n), correction is made using, for example, equation (6) to obtain the capacitance C (m, n) (step S10, internal parameter correction processing, stray capacitance correction processing).
- the calculation unit 42 sets the measured resistance value Rmes (m, n) to the internal resistance value Ri (m, n) stored in the internal parameter storage unit 45 and the floating resistance value stored in the floating parameter storage unit 46. Based on Rf (m, n), for example, correction is performed based on equation (7) to obtain a resistance value R (m, n) (step S11, stray capacitance correction processing).
- the determination unit 49 determines the difference Dr (m, n) between the resistance value R (m, n) obtained by the calculation unit 42 and the resistance determination value Rj (m, n) stored in the determination value storage unit 48. n) is calculated (step S21).
- the determination unit 49 compares the difference Dr (m, n) with a preset difference determination value Drj (step S22), and if the difference Dr (m, n) exceeds the difference determination value Drj ( YES in step S22), a message indicating that a resistance failure has occurred at the coordinate position (Xm, Yn) is displayed on the display unit 5 (step S23). On the other hand, if the difference Dr (m, n) does not exceed the difference determination value Drj (NO in step S22), the determination unit 49 proceeds to step S24 without executing step S23.
- the difference determination value Drj is appropriately set according to the performance required for the touch panel substrate P.
- step S24 the determination unit 49 determines the difference Dc () between the capacitance C (m, n) obtained by the calculation unit 42 and the capacitance determination value Cj (m, n) stored in the determination value storage unit 48. m, n) is calculated (step S24).
- the determination unit 49 compares the difference Dc (m, n) with a preset difference determination value Dcj (step S25), and if the difference Dc (m, n) exceeds the difference determination value Dcj ( YES in step S25), a message indicating that a capacitance defect has occurred at the coordinate position (Xm, Yn) is displayed on the display unit 5 (step S26). On the other hand, if the difference Dc (m, n) does not exceed the difference determination value Dcj (NO in step S25), the determination unit 49 proceeds to step S27 without executing step S26.
- the difference determination value Dcj is appropriately set according to the performance required for the touch panel substrate P.
- step S27 the measurement processing unit 41 determines that the variable m is not 7 (NO in step S27), that is, if there is an unprocessed X coordinate in the coordinate Yn, the inspection corresponding to the new X coordinate is performed. 1 is added to the variable m (step S28), and steps S7 to S27 are repeated again.
- step S27 when the variable m is 7 (YES in step S27), that is, when the processing is completed for all X coordinates of the coordinate Yn, the measurement processing unit 41 initializes the variable m to 1 (step S29), and the variable n Is compared with 5 (step S30).
- step S30 If the variable n is not 5 (NO in step S30), that is, if there is a Y coordinate that has not been processed yet, the measurement processing unit 41 sets the variable n to execute the inspection corresponding to the new Y coordinate. 1 is added (step S31), and steps S7 to S30 are repeated again.
- step S30 when the variable n is 5 (YES in step S30), that is, the combination of the connection terminal Tx and the connection terminal Ty corresponding to all the coordinate positions (X1, Y1) to (X7, Y5) of the touch panel substrate P is inspected. Since the process is completed, the process is terminated.
- the current value is once for each coordinate position.
- Capacitance and resistance values corresponding to each coordinate position can be obtained simply by measuring I and phase difference ⁇ , and therefore the capacitance measurement step and the resistance value measurement step are executed separately. It becomes easier to reduce the man-hours for measuring the capacitance and the resistance.
- 10 to 12 are explanatory diagrams illustrating an example of the relationship between the measurement capacitance Cmes corresponding to each coordinate position of the touch panel substrate P and the frequency f of the AC signal SA used for measurement.
- 10 shows an example of the substrate inspection apparatus 1 shown in FIG. 1 when the frequency f is a low frequency
- FIG. 11 shows a case where the frequency f is an intermediate frequency higher than FIG.
- An example in which the frequency f is a high frequency substantially equal to the reading frequency f0 is shown.
- the electrostatic capacitance C (m, n) corresponding to each coordinate position of the touch panel substrate P is basically equal to each other although there are some variations due to manufacturing variations.
- the frequency f is set to a low frequency, as shown in FIG. 10, the measured capacitances Cmes corresponding to the respective coordinate positions are substantially equal to each other, and are substantially equal to the actual capacitance C. It can be seen that (m, n) can be measured as it is.
- FIG. 13 is an explanatory diagram showing the capacitance C obtained as a result of correcting the measured capacitance Cmes shown in FIG. 12 by the process of step S10. As shown in FIG. 13, it was confirmed that the effects of the internal capacitance Ci and the floating capacitance Cf were reduced by the processing in steps S10 and S11, and the difference in the capacitance C depending on the coordinate position could be reduced.
- FIG. 14 is a graph showing a theoretical value of the resistance value R corresponding to each coordinate position of the touch panel substrate P.
- the resistance value R is different depending on the coordinate position due to the lengths of the X electrode X and the Y electrode Y of the resistance measurement path being different depending on the coordinate position. However, the value changes substantially linearly with respect to the coordinate position, as shown in FIG.
- FIG. 15 and 16 are graphs showing the relationship between the measurement resistance value Rmes corresponding to each coordinate position of the touch panel substrate P and the measurement frequency f. 15 and FIG. 16, the bottom surface indicates the coordinate position, and the height indicates the measured resistance value Rmes.
- FIG. 15 shows a case where the frequency f is a low frequency lower than the reading frequency f0
- FIG. 16 shows an example of the substrate inspection apparatus 1 shown in FIG. 1, where the frequency f is a high frequency substantially equal to the reading frequency f0. An example of the case is shown.
- FIG. 17 is an explanatory diagram for explaining a case where a defect F occurs in the X electrode X2 of the touch panel substrate P.
- the defect F occurs at the coordinate position (X2, Y1) and the coordinate position (X2, Y2).
- the bottom surface of FIG. 18 indicates the coordinate position, and the height indicates the difference Dr.
- a peak having a large resistance value can be confirmed at the coordinate position (X2, Y1) and the coordinate position (X2, Y2) where the defect F occurs, and thereby the location where the defect F occurs can be identified. It could be confirmed.
- FIG. 19 is an explanatory view showing a modification of the substrate inspection apparatus 1 shown in FIG.
- the ammeter 3 may be connected to both ends of the X electrode X
- the AC power supply 2 may be connected to both ends of the Y electrode Y.
- the graph of the measured resistance value Rmes corresponding to each coordinate position for the touch panel substrate P is not a flat shape as shown in FIG. Even in this case, the touch panel substrate P can be inspected by the processes of steps S1 to S211 shown in FIGS.
- the calculation unit 42 may cause the display unit 5 to display a graph representing the resistance value R instead of the measured resistance value Rmes in the graph illustrated in FIG. 16, for example.
- the X coordinate corresponding to the X electrodes X1 to X7, the Y coordinate corresponding to the Y electrodes Y1 to Y5, and the resistance value R (m) of the coordinate position (Xm, Yn) corresponding to the XY coordinate. , N) may be displayed on the display unit 5 as a three-dimensional graph such as the graph shown in FIG.
- the calculation unit 42 may display, for example, the graph shown in FIG. 13 on the display unit 5. Specifically, the X coordinate corresponding to the X electrodes X1 to X7, the Y coordinate corresponding to the Y electrodes Y1 to Y5, and the capacitance C (Xm, Yn) of the coordinate position (Xm, Yn) corresponding to the XY coordinates. m, n) may be displayed on the display unit 5 in a three-dimensional manner as shown in the graph of FIG.
- An image in which Dr (m, n) is three-dimensionally displayed may be displayed on the display unit 5.
- the difference Dc (m, n) may be displayed instead of the difference Dr (m, n) shown in FIG. That is, the X coordinate corresponding to the X electrodes X1 to X7, the Y coordinate corresponding to the Y electrodes Y1 to Y5, and the difference Dc (m, n) between the coordinate positions (Xm, Yn) corresponding to the XY coordinates and May be displayed on the display unit 5 in a three-dimensional manner.
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Abstract
Description
但し、m=1,2,3,4,5,6,7、n=1,2,3,4,5である。
(但し、m=1,2,3,4,5,6,7、n=1,2,3,4,5)
(但し、m=1,2,3,4,5,6,7、n=1,2,3,4,5)
静電容量C(m,n)=Cmes(m,n)-Ci(m,n)-Cf(m,n) ・・・(6)
抵抗値R(m,n)=Rmes(m,n)-Ri(m,n)-Rf(m,n) ・・・(7)
(但し、m=1,2,3,4,5,6,7、n=1,2,3,4,5)
静電容量C(m,n)=Cmes(m,n)-Ci(m,n) ・・・(8)
抵抗値R(m,n)=Rmes(m,n)-Ri(m,n) ・・・(9)
(但し、m=1,2,3,4,5,6,7、n=1,2,3,4,5)
静電容量C(m,n)=Cmes(m,n)-Cf(m,n) ・・・(10)
抵抗値R(m,n)=Rmes(m,n)-Rf(m,n) ・・・(11)
(但し、m=1,2,3,4,5,6,7、n=1,2,3,4,5)
2 交流電源(交流電圧出力部)
3 電流計(電流検出部)
4 制御部
5 表示部
6 操作部
41 測定処理部
42 算出部
43 内部パラメータ取得処理部
44 浮遊パラメータ取得処理部(浮遊容量取得処理部)
45 内部パラメータ記憶部
46 浮遊パラメータ記憶部(浮遊容量記憶部)
47 基準パラメータ記憶部
48 判定値記憶部
49 判定部
C 静電容量
Cf 浮遊静電容量
Ci 内部静電容量
Cj 容量判定値
Cmes 測定静電容量
Cref 基準静電容量
Dc 差分
Dcj 差分判定値
Dr 差分
Drj 差分判定値
f 周波数
f0 読取周波数
I 電流値
P タッチパネル基板(基板)
Pref 基準基板
Px,Px1~Px7 基板端子(第1基板端子)
Py,Py1~Py5 基板端子(第2基板端子)
R 抵抗値
Rf 浮遊抵抗値
Ri 内部抵抗値
Rj 抵抗判定値
Rmes 測定抵抗値
Rref 基準抵抗値
SA 交流信号
SW1,SW2 切替スイッチ
Tx1~Tx7 接続端子(第1接続端子)
Ty1~Ty5 接続端子(第2接続端子)
V 出力電圧
X1~X7 電極(第1電極)
Y1~Y5 電極(第2電極)
Z 測定インピーダンス
θ 位相差
Claims (12)
- 所定の第1方向に沿って延びる複数の第1電極と、前記第1方向と交差する第2方向に沿って延びる複数の第2電極とが互いに対向するように形成された基板を検査する基板検査装置であって、
所定の交流電圧を出力する交流電圧出力部と、
電流を検出する電流検出部と、
前記複数の第1電極とそれぞれ電気的に接続可能な複数の第1接続端子と、
前記複数の第2電極とそれぞれ電気的に接続可能な複数の第2接続端子と、
前記複数の第1接続端子と前記複数の第2接続端子とをそれぞれ組み合わせて得られる複数の組み合わせに対応し、前記各組み合わせに対応する第1及び第2接続端子について、その第2接続端子に対して前記交流電圧出力部によって前記交流電圧を供給させ、その第1接続端子に流れる電流を前記電流検出部によって検出させることにより、前記各組み合わせに対応する電流を取得する測定処理を実行する測定処理部と、
前記測定処理において前記電流検出部によって検出された電流の大きさと位相を示す情報とに基づいて、前記各組み合わせに対応する静電容量と抵抗値とを算出する算出処理を実行する算出部とを備える基板検査装置。 - 前記基板は、
前記複数の第1電極とそれぞれ導通する複数の第1基板端子と、
前記複数の第2電極とそれぞれ導通する複数の第2基板端子とを含み、
前記複数の第1接続端子は、前記複数の第1基板端子とそれぞれ接続され、当該複数の第1基板端子を介して前記複数の第1電極とそれぞれ電気的に接続され、
前記複数の第2接続端子は、前記複数の第2基板端子とそれぞれ接続され、当該複数の第2基板端子を介して前記複数の第2電極とそれぞれ電気的に接続される請求項1記載の基板検査装置。 - 前記基板は、前記各第1電極と前記各第2電極とが交差する位置の静電容量を読み取るために予め設定された読取周波数の交流信号が前記各第1及び第2電極に供給されることが予定されたタッチパネルであり、
前記交流電圧の周波数は、前記読取周波数と略等しい請求項1又は2記載の基板検査装置。 - 前記各組み合わせに対応して前記基板検査装置内部で生じる静電容量と抵抗値とを、内部静電容量と内部抵抗値として記憶する内部パラメータ記憶部をさらに備え、
前記算出部は、さらに、前記各組み合わせに対応する静電容量と抵抗値とを、当該各組み合わせに対応して前記内部パラメータ記憶部に記憶された内部静電容量と内部抵抗値とに基づいて補正する内部パラメータ補正処理を実行する請求項1~3のいずれか1項に記載の基板検査装置。 - 前記複数の第1及び第2電極と前記複数の第1及び第2接続端子とが接続されない状態で前記測定処理と前記算出処理とを前記測定処理部と前記算出部とによって実行させることにより前記各組み合わせに対応して得られる静電容量及び抵抗値を、当該各組み合わせに対応して前記内部静電容量及び前記内部抵抗値として前記内部パラメータ記憶部に記憶させる内部パラメータ取得処理部をさらに備える請求項4記載の基板検査装置。
- 前記各組み合わせに対応して前記基板に生じる浮遊容量を記憶する浮遊容量記憶部をさらに備え、
前記算出部は、前記各組み合わせに対応する静電容量を、当該各組み合わせに対応して前記浮遊容量記憶部に記憶された浮遊容量に基づいて補正する浮遊容量補正処理を実行する請求項1~5のいずれか1項に記載の基板検査装置。 - 前記各組み合わせに対応して基板内部で生じる静電容量である基準静電容量が予め判っている基準基板の前記各組み合わせに対応する前記基準静電容量を記憶する基準容量記憶部と、
前記基準基板に対して前記複数の第1及び第2接続端子が接続された状態で、前記測定処理と前記算出処理とを前記測定処理部と前記算出部とによって実行させることにより前記各組み合わせに対応して得られる静電容量と、前記基準容量記憶部によって前記各組み合わせに対応して記憶されている前記基準静電容量とに基づいて、前記各組み合わせに対応する浮遊容量を算出し、前記浮遊容量記憶部に記憶させる浮遊容量取得処理部とをさらに備える請求項6記載の基板検査装置。 - 前記各組み合わせに対応する前記抵抗値の良否判定の基準となる判定値を予め記憶する判定値記憶部と、
前記算出部により得られた前記各組み合わせに対応する抵抗値と、当該各組み合わせに対応して前記判定値記憶部に記憶された判定値との差を、前記各組み合わせに対応してそれぞれ算出し、当該各組み合わせに対応する差が予め設定された差分判定値を超えたとき、当該差分判定値を超えた組み合わせに対応する前記第1及び第2電極によって表される座標位置を、前記基板の不良位置と判定する判定部とを備える請求項1~7のいずれか1項に記載の基板検査装置。 - 前記算出処理により算出された、前記各組み合わせに対応する抵抗値を、三次元的なグラフで表した画像を表示する表示部をさらに備える請求項1~8のいずれか1項に記載の基板検査装置。
- 前記算出処理により算出された、前記各組み合わせに対応する静電容量を、三次元的なグラフで表した画像を表示する表示部をさらに備える請求項1~9のいずれか1項に記載の基板検査装置。
- 前記判定部により算出された、前記各組み合わせに対応する差を、三次元的なグラフで表した画像を表示する表示部をさらに備える請求項8に記載の基板検査装置。
- 所定の第1方向に沿って延びる複数の第1電極と、前記第1方向と交差する第2方向に沿って延びる複数の第2電極とが互いに対向するように形成された基板を検査する基板検査方法であって、
複数の第1接続端子を前記複数の第1電極とそれぞれ電気的に接続する工程と、
複数の第2接続端子を前記複数の第2電極とそれぞれ電気的に接続する工程と、
前記複数の第1接続端子と前記複数の第2接続端子とをそれぞれ組み合わせて得られる複数の組み合わせに対応し、前記各組み合わせに対応する第1及び第2接続端子について、その第2接続端子に対して交流電圧を供給し、その第1接続端子に流れる電流を検出することにより、前記各組み合わせに対応する電流を取得する測定処理を実行する測定処理工程と、
前記測定処理において前記検出された電流の大きさと位相を示す情報とに基づいて、前記各組み合わせに対応する静電容量と抵抗値とを算出する算出処理を実行する算出工程とを含む基板検査方法。
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