WO2015182081A1 - フィルムコンデンサ - Google Patents
フィルムコンデンサ Download PDFInfo
- Publication number
- WO2015182081A1 WO2015182081A1 PCT/JP2015/002559 JP2015002559W WO2015182081A1 WO 2015182081 A1 WO2015182081 A1 WO 2015182081A1 JP 2015002559 W JP2015002559 W JP 2015002559W WO 2015182081 A1 WO2015182081 A1 WO 2015182081A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- bus bar
- lid member
- capacitor
- film capacitor
- capacitor element
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 89
- 239000011347 resin Substances 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 33
- 238000007789 sealing Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 description 37
- 239000007788 liquid Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000011104 metalized film Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/258—Temperature compensation means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/04—Mountings specially adapted for mounting on a chassis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/106—Fixing the capacitor in a housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
Definitions
- the present invention relates to a film capacitor in which a capacitor element is accommodated in a case.
- film capacitors mounted on electrical equipment, electronic equipment, industrial equipment, automobiles, and the like are required to increase the reliability of film capacitors by releasing heat generated during charging and discharging.
- Patent Document 1 includes a plurality of capacitor elements and a bus bar connected to the capacitor elements, and the heat radiation performance is superior to other parts in the part closest to the external connection terminal provided on the bus bar.
- a film capacitor provided with a heat dissipating means is disclosed. This will be specifically described below.
- FIG. 6 is a perspective view showing a configuration of a conventional film capacitor
- FIG. 7 is a plan view showing a state in which a positive electrode bus bar 92A on the upper surface side is removed.
- the film capacitor houses a plurality of capacitor elements 91, a positive electrode bus bar 92A, and a negative electrode bus bar 92B in a case 93.
- Metallicon electrodes formed on both end faces of each capacitor element 91 are connected to a positive electrode bus bar 92A and a negative electrode bus bar 92B, respectively.
- the capacitor element 91 is disposed in a portion closest to the external connection positive external terminal portion 92A2 provided on the positive bus bar 92A and the external connection negative external terminal portion 92B2 provided on the negative bus bar 92B. Instead, only the mold resin 96 is arranged. Even when heat is conducted together with the current applied from the input side to the positive external terminal portion 92A2 and the negative external terminal portion 92B2, the heat is transmitted from the positive external terminal portion 92A2 and the negative external terminal portion 92B2 to the positive bus bar 92A. Before being conducted to the capacitor element 91 via the negative electrode bus bar 92B, it is first conducted to the mold resin 96, so that heat can be radiated from the mold resin 96 to the outside. Therefore, in the conventional film capacitor, it is possible to suppress conduction of large heat that causes damage to the capacitor element 91.
- Patent Document 1 As described above, the conventional technique disclosed in Patent Document 1 can suppress heat generation to some extent, but in recent years, it has been required to further improve the heat dissipation performance of the film capacitor.
- the film capacitor includes a capacitor element having a metallicon electrode formed at an end thereof, a bus bar connected to the metallicon electrode, a case having a receiving portion for receiving the capacitor element and the bus bar, and a lid that covers the opening of the receiving portion
- a heat conductive member disposed between the member and the bus bar and the lid member, the lid member has a convex portion on the side facing the heat conductive member, and the convex portion is in contact with the heat conductive member, The heat conducting member is in contact with the bus bar.
- FIG. 1 is a perspective view of the film capacitor of the first embodiment.
- FIG. 2 is an exploded perspective view of the film capacitor of the first embodiment.
- FIG. 3 is a cross-sectional view of the film capacitor of the first embodiment.
- FIG. 4 is a perspective view showing a state where the first lid member and the second lid member of the first embodiment are separated.
- FIG. 5 is a schematic perspective view illustrating resin liquid injection according to the first embodiment. It is a perspective view of the conventional film capacitor. It is a top view of the state which excluded the positive electrode bus bar of the upper surface side of the conventional film capacitor.
- FIG. 1 is a perspective view of the film capacitor according to the first embodiment
- FIG. 2 is an exploded perspective view of the main part of the film capacitor
- FIG. 3 is a cross-sectional view taken along the line II in FIG.
- the film capacitor includes six capacitor elements 1 for current smoothing.
- Metallicon electrodes 11 are formed at both ends of each capacitor element 1.
- the capacitor element 1 has two end surfaces facing each other and a side surface connecting the two end surfaces, and has a flat shape (a shape having two planes and two curved surfaces) in an end view.
- the capacitor element 1 includes a pair of metallized films.
- the metallized film is formed by depositing aluminum on at least one surface of a dielectric film made of polypropylene (hereinafter referred to as “PP”) to form a deposited metal layer (deposited electrode). And this pair of metallized film is piled up and wound (winding body). Further, metallicon electrodes 11 made of zinc are formed on both end faces of the wound body.
- PP polypropylene
- the bus bar 2 made of metal such as copper is composed of a positive electrode bus bar 2A and a negative electrode bus bar 2B. Insulating paper 33 is attached to the surface of the negative electrode bus bar 2B facing the positive electrode bus bar 2A in order to insulate it from the positive electrode bus bar 2A.
- a positive electrode bus bar 2A is connected to one metallicon electrode 11 of each capacitor element 1, and a negative electrode bus bar 2B is connected to the other metallicon electrode 11 by soldering or resistance welding.
- the plurality of capacitor elements 1 connected to the positive electrode bus bar 2A and the negative electrode bus bar 2B are accommodated in an accommodating portion 3A provided in a case 3 made of an insulating resin such as polyphenylene sulfide (hereinafter referred to as “PPS”).
- the case 3 is an upper opening type and has a substantially rectangular opening, and a rectangular annular end surface 3B having a substantially rectangular shape is formed so as to surround the opening of the accommodating portion 3A.
- a holding portion 2A1 and a holding portion 2B1 are provided at the end portion of the positive electrode bus bar 2A and the both end portions of the negative electrode bus bar 2B in the arrangement direction (X direction) of the capacitor element 1, respectively.
- 3 is hooked at a predetermined position on the rectangular annular end surface 3B.
- a heat conductive sheet 4 made of insulating paper or acrylic resin is arranged on the surface (heat conductive member arrangement surface) opposite to the connection surface (metallicon electrode connection surface) of the negative electrode bus bar 2B with the metallicon electrode 11, The conductive sheet 4 is in contact with the negative electrode bus bar 2B.
- the heat conductive sheet 4 preferably has a small thickness as long as there is no problem in insulation, and for example, a sheet having a thickness of 0.5 to 1.0 mm can be used.
- a sheet having a thickness of 0.5 to 1.0 mm can be used.
- an insulating paper in which a polyamide paper is attached to a polyethylene terephthalate (PET) film is used as the heat conductive sheet 4.
- PET polyethylene terephthalate
- the insulating paper has good handling properties and is thin.
- the heat conductive sheet 4 is an example of a heat conductive member.
- a metal lid member 5 such as aluminum is disposed on the rectangular annular end surface 3B of the case 3 so as to cover the opening of the housing portion 3A of the case 3, and is attached to the rectangular annular end surface 3B of the case 3 by screws 8. Screwed.
- the positive external terminal portion 2A2 of the positive bus bar 2A is provided at a position farther from the case 3 than the holding portion 2A1 of the positive bus bar 2A.
- the negative electrode external terminal portion 2B2 of the negative electrode bus bar 2B is provided at a position farther from the case 3 than the holding portion 2B1 of the negative electrode bus bar 2B.
- the lid member 5 includes a first lid member 5A and a second lid member 5B. As shown in FIG. 2, the first lid member 5A is larger than the second lid member 5B.
- FIG. 4 is a perspective view of the lid member 5 in a state where the first lid member 5A and the second lid member 5B are separated from the heat conductive sheet 4 side.
- the first lid member 5A has a notch 5A2.
- a step portion 5A5 is provided in the vicinity of the three outer edges constituting the cutout portion 5A2 of the first lid member 5A.
- a step portion 5B1 is also provided in the vicinity of three of the four sides of the second lid member 5B that is rectangular in top view.
- the second lid member 5B is fixed by fitting the stepped portion 5B1 of the second lid member 5B into the stepped portion 5A5 of the first lid member 5A, and the first lid member 5A and the second lid member 5B are combined to form the lid member 5. Is configured.
- the first lid member 5A includes an outer surface 5A3 constituting the surface of the film capacitor, and an inner surface 5A4 opposite to the outer surface 5A3 and facing the housing portion 3A of the case 3.
- the inner side surface 5A4 has a convex portion 5A1, and the end portion of the convex portion 5A1 is in contact with the heat conductive sheet 4. That is, the heat conductive sheet 4 is sandwiched between the negative electrode bus bar 2B and the lid member 5 (the convex portion 5A1 of the first lid member 5A).
- two Y capacitors 7 connected in parallel are connected in series to the capacitor element 1 adjacent to the capacitor element 1 on the left side of the drawing in FIG. These two Y capacitors 7 are arranged for noise removal.
- the space defined by the inner surface of the lid member 5 facing the housing portion 3A of the case 3 and the surface 3A1 of the housing portion 3A of the case 3 has a capacitor except for its upper portion.
- a resin layer 6 for sealing the element 1 is formed.
- the resin layer 6 covers the entire heat conductive sheet 4, and the end of the protrusion 5 ⁇ / b> A ⁇ b> 1 on the heat conductive sheet 4 side is embedded in the resin layer 6.
- the end portion (lower end portion) on the heat conductive sheet 4 side of the side surface of the convex portion 5A1 of the first lid member 5A is covered (embedded) with the resin layer 6, and the convex portion 5A1.
- the first lid member 5 ⁇ / b> A can be securely and firmly fixed in a state where the first lid member 5 ⁇ / b> A is in contact with the heat conductive sheet 4.
- the first lid member 5A is screwed to the rectangular annular end surface 3B of the case 3 with two screws 8.
- the screw 8 is rectangular annular end surface 3B. It is fastened to only one side of and in close proximity.
- the first lid member 5A is not fixed on both sides in which the opposite sides of the rectangular annular end surface 3B are fixed, but fixed on one side, and the Y direction perpendicular to the X direction is not fixed at two points but fixed at one point. It becomes a state close to.
- the resin layer 6 is in a state where the end portion of the convex portion 5A1 on the heat conductive sheet 4 side is in contact with the heat conductive sheet 4. Therefore, the stability of contact between the convex portion 5A1 and the heat conductive sheet 4 can be enhanced.
- the end of the convex portion 5A1 on the heat conductive sheet 4 side is Since it is embed
- the metallized film for one polarity and the metallized film for the other polarity are overlapped and wound with their end portions in the width direction being slightly shifted to produce a cylindrical wound body.
- the curved outer peripheral surface of the wound body is pressed from both sides in the radial direction of the wound body to be processed into a flat shape (a shape having two planes and two curved surfaces).
- the metallicon electrode 11 is formed by thermally spraying zinc on two opposing end faces of the wound body processed into a flat shape.
- the holding portions 2A1 and 2B1 provided at the end portion of the positive electrode bus bar 2A and the end portion of the negative electrode bus bar 2B in the capacitor element arrangement direction (X direction) are hooked at predetermined positions on the rectangular annular end surface 3B of the case 3, respectively.
- the six capacitor elements 1 and the two Y capacitors 7 to which the positive electrode bus bar 2A and the negative electrode bus bar 2B are connected are accommodated in the accommodating portion 3A of the case 3.
- the other end portion of the GND terminal 7A connected to one metallicon electrode of the Y capacitor 7 is also in contact with the rectangular annular end surface 3B so that the through hole overlaps with a screw hole provided in the rectangular annular end surface 3B.
- the heat conductive sheet 4 made of insulating paper or acrylic resin is disposed on the heat conductive member disposition surface opposite to the metallicon electrode connection surface of the negative electrode bus bar 2B.
- the first lid member 5A made of metal such as aluminum is disposed on the rectangular annular end surface 3B of the case 3 so as to cover the opening of the housing portion 3A of the case 3, and the heat conduction of the first lid member 5A.
- the convex portion 5A1 provided on the side facing the sheet 4 is brought into contact with the heat conductive sheet 4.
- the first lid member 5 ⁇ / b> A and the GND terminal 7 ⁇ / b> A are screwed to the case 3 using nuts and screws 8 embedded in the case 3.
- the positive electrode external terminal portion 2A2 of the positive electrode bus bar 2A and the negative electrode external terminal portion 2B2 of the negative electrode bus bar 2B are exposed to the outside of the case 3 and the first lid member 2A.
- FIG. 5 is a schematic perspective view for explaining the injection of the resin liquid for forming the resin layer 6 for sealing the capacitor element.
- members such as the capacitor element 1 housed in the housing portion 3A of the case 3 are omitted.
- high-temperature resin liquid is injected into the housing 3A from the opening (resin liquid injection port) 6A formed by a part of the rectangular annular end surface 3B of the case 3 and the cutout 5A2 of the first lid member 5A. Then, as shown in FIG.
- a resin liquid is filled in a gap between the surface 3 ⁇ / b> A ⁇ b> 1 of the housing 3 ⁇ / b> A of the case 3 and the capacitor element 1, the bus bar 2, and the like, and the resin layer 6 is formed by cooling.
- the resin layer 6 covers the entire heat conductive sheet 4 and at least covers the end of the convex portion 5A1 on the heat transfer sheet 4 side. That is, the convex portion 5A1 of the first lid member 5A has a portion embedded in the resin layer 6.
- the second lid member is placed on the step portion 5A5 provided in the notch 5A2 of the first lid member 5A so as to block the resin liquid inlet 6A with the second lid member 5B.
- the film capacitor of this embodiment is completed by fitting the step portion 5B1 of 5B and fixing the second lid member 5B.
- the lid member 5 is divided into the first lid member 5A and the second lid member 5B, when forming the resin layer 6, one of the rectangular annular end surfaces 3B of the case 3 is formed.
- the resin liquid injection port 6A can be provided by the opening formed by the portion and the notch 5A2 of the first lid member 5A, and the resin liquid can be injected efficiently. Further, the resin liquid injection port 6A can be closed by fixing the second lid member 5B to the case 3, so that the moisture resistance can be improved, and the second lid member 5B also functions as a heat radiating member. Therefore, the heat conducted from the capacitor element 1 can be efficiently released by the second lid member 5B.
- the second lid member 5B has a convex portion 5B2 protruding toward the capacitor element 1, and the convex portion 5B2 of the second lid member 5B is more than the stepped portion 5B1 of the second lid member 5B. It arrange
- poured resin liquid is the surface 3A1 of the accommodating part 3A of case 3, and capacitor element 1 or bus bar 2 It is possible to efficiently and reliably fill the gaps formed therebetween.
- the heat conducting member is composed of one heat conducting sheet, but is not limited thereto.
- a stack of two heat conductive sheets of the same material may be used.
- members having different materials and shapes, for example, one in which one insulating paper and one metal plate are overlapped, and one in which one insulating paper and one acrylic resin plate are overlapped are also within the technical scope of the heat conducting member of the present invention. Belonging to.
- a film capacitor with improved heat dissipation performance can be provided.
- the film capacitor according to the present invention can improve the heat dissipation performance. Therefore, it can be suitably employed as a film capacitor for a hybrid vehicle used in a harsh external environment.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
(製造方法)
以下に、本実施形態のフィルムコンデンサの製造方法を説明する。
(コンデンサ素子形成工程)
コンデンサ素子形成工程を説明する。まず、PPからなる誘電体フィルムの片面にアルミニウムを蒸着させて、蒸着金属層(蒸着電極)が形成された金属化フィルムを形成する。なお、本実施形態ではこのように蒸着金属としてアルミニウムを用いたが、これ以外にも亜鉛やマグネシウムなどの金属、あるいはこれらの金属を混合させたものを用いてもよい。
(バスバー接続工程)
まず、正極バスバー2Aとの対向面に正極バスバー2Aとの絶縁を図るために絶縁紙33が貼り付けられた負極バスバー2Bと、正極バスバー2Aと、Yコンデンサ7と、GND端子7Aを用意する。次に、6つのコンデンサ素子1の一方のメタリコン電極11に正極バスバー2Aを、他方のメタリコン電極11に負極バスバー2Bを半田付けや抵抗接合により接続する。また、Yコンデンサ7の一方のメタリコン電極11とGND端子7Aの一端を半田付けや抵抗接合により接続し、Yコンデンサ7の他方のメタリコン電極と正極バスバー2Aを半田付けや抵抗接合により接続する。
(封止工程)
まず、収容部3Aを備えた上方開口型のPPS製のケース3を用意する。ケース3は収容部3Aの開口を取り囲むように略矩形状をした矩形環状端面3Bを有している。
11 メタリコン電極
2 バスバー
2A 正極バスバー
2B 負極バスバー
3 ケース
3A 収容部
3A1 収容部の表面
3B 矩形環状端面
4 熱伝導シート(熱伝導部材)
5 蓋部材
5A 第1蓋部材
5A1 凸部
5A2 切欠部
5A3 外側面
5A4 内側面
5A5 段差部
5B 第2蓋部材
5B1 段差部
6 モールド樹脂層
6A メールド樹脂注入口
7 Yコンデンサ
7A GND端子
8 ネジ
Claims (4)
- 端部にメタリコン電極が形成されたコンデンサ素子と、
前記メタリコン電極と接続しているバスバーと、
前記コンデンサ素子と前記バスバーを収容するための収容部を有するケースと、
前記収容部の開口を覆う蓋部材と、
前記バスバーと前記蓋部材との間に配設される熱伝導部材と、
を備え、
前記蓋部材は前記熱伝導部材と対向する側に凸部を有し、前記凸部は前記熱伝導部材と接すると共に、前記熱伝導部材は前記バスバーと接しているフィルムコンデンサ。 - 前記収容部内には、前記バスバーが接続された前記コンデンサ素子を封止する樹脂層が形成されており、
前記蓋部材は、前記凸部を備える第1蓋部材と、第2蓋部材とから構成され、前記第1蓋部材及び前記第2蓋部材はそれぞれ前記収容部の開口を覆っている請求項1に記載のフィルムコンデンサ。 - 前記凸部は前記樹脂層に埋設された部分を有する請求項2に記載のフィルムコンデンサ。
- 前記第2蓋部材は前記開口の長手方向の中央部に設けられている請求項2又は3に記載のフィルムコンデンサ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201580027573.6A CN106415756B (zh) | 2014-05-28 | 2015-05-21 | 薄膜电容器 |
DE112015002505.7T DE112015002505T5 (de) | 2014-05-28 | 2015-05-21 | Folienkondensator |
JP2016523130A JP6488464B2 (ja) | 2014-05-28 | 2015-05-21 | フィルムコンデンサ |
US15/351,114 US10109422B2 (en) | 2014-05-28 | 2016-11-14 | Film capacitor |
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Also Published As
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US10109422B2 (en) | 2018-10-23 |
DE112015002505T5 (de) | 2017-03-16 |
US20170062134A1 (en) | 2017-03-02 |
JP6488464B2 (ja) | 2019-03-27 |
JPWO2015182081A1 (ja) | 2017-04-20 |
CN106415756B (zh) | 2018-09-11 |
CN106415756A (zh) | 2017-02-15 |
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