WO2015141114A1 - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- WO2015141114A1 WO2015141114A1 PCT/JP2015/000385 JP2015000385W WO2015141114A1 WO 2015141114 A1 WO2015141114 A1 WO 2015141114A1 JP 2015000385 W JP2015000385 W JP 2015000385W WO 2015141114 A1 WO2015141114 A1 WO 2015141114A1
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- WO
- WIPO (PCT)
- Prior art keywords
- terminal
- resin case
- plated
- push switch
- plating
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/81—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by electrical connections to external devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2203/00—Form of contacts
- H01H2203/036—Form of contacts to solve particular problems
- H01H2203/038—Form of contacts to solve particular problems to be bridged by a dome shaped contact
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2203/00—Form of contacts
- H01H2203/036—Form of contacts to solve particular problems
- H01H2203/04—Form of contacts to solve particular problems to facilitate connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2207/00—Connections
Definitions
- the present invention relates to an electronic component on which a terminal protruding from a resin case is mounted by soldering.
- FIG. 11 is a perspective view of a conventional push switch
- FIG. 12 is an exploded perspective view of the conventional push switch
- FIG. 13 is a sectional view of a conventional push switch.
- the resin case 1 is a case having a substantially rectangular shape when viewed from above and having a concave portion with an upper opening, and is made of an insulating synthetic resin. As shown in FIG. 12, the resin case 1 is insert-molded so that the first member 2 and the second member 3 made of sheet metal formed in a predetermined shape are electrically independent. In addition, the detail about the production method of the resin case 1 is mentioned later.
- the first member 2 protrudes from the center of the inner bottom surface of the recess of the resin case 1 and a contact portion 2A (center fixed contact) that is formed in a substantially circular truncated cone shape when viewed from above and slightly protrudes upward. It has a terminal 2B. An intermediate portion (not shown) that connects the contact portion 2A and the terminal 2B is embedded in the resin case 1.
- the second member 3 protrudes from the outer peripheral side of the inner bottom surface of the recess of the resin case 1 with two contact portions 3A (outer fixed contacts) formed to protrude slightly upward in a substantially rectangular shape when viewed from above, and from the side surface of the resin case 1. It has a terminal 3B. An intermediate portion (not shown) that connects the contact portion 3A and the terminal 3B is embedded in the resin case 1.
- the two contact portions 3A (outer fixed contacts) described above are formed on the inner bottom surface of the recess of the resin case 1 at positions that are symmetric with respect to the contact portion 2A (center fixed contact).
- the movable member 5 is circular in top view.
- the movable member 5 has an upward convex dome shape and is made of an elastic thin metal plate. As shown in FIG. 13, the lower edge of the outer edge of the movable member 5 is placed on the upper surface of the contact portion 3 ⁇ / b> A, and the movable member 5 is accommodated in the recess of the resin case 1.
- the lower surface of the central portion of the movable member 5 is spaced from the upper surface of the contact portion 2A and faces the contact portion 2A.
- the movable member 5 is a movable contact body having a contact point that contacts the contact part 2A (central fixed contact point).
- the protective sheet 6 is provided with an adhesive 6A on the lower surface and is formed of a flexible insulating film.
- the protective sheet 6 is adhesively fixed to the upper surface of the resin case 1 with an adhesive 6 ⁇ / b> A on the lower surface so as to cover the concave portion of the resin case 1.
- the conventional push switch is configured.
- the dome-shaped central portion of the movable member 5 When a pressing force is applied to the dome-shaped central portion of the movable member 5 from above the protective sheet 6 and the pressing force exceeds a predetermined force, the dome-shaped central portion of the movable member 5 is lowered with a click feeling. It is elastically inverted to a convex shape. Then, the lower surface of the central portion of the movable member 5 comes into contact with the upper surface of the contact portion 2A located below the movable member 5. Thereby, the contact portion 2A (center fixed contact) and the contact portion 3A (outer fixed contact) are brought into conduction via the movable member 5, and the corresponding terminals 2B and 3B are brought into conduction to be switched on.
- the dome-shaped central portion of the movable member 5 is elastically restored to the original upward convex shape with a click feeling, and the lower surface of the central portion of the movable member 5 is separated from the upper surface of the contact portion 2A. Then, the corresponding terminals 2B and 3B are switched off in an insulated state.
- Patent Document 1 is known as such a conventional push switch.
- FIG. 14 is a top view of the metal hoop 11 of the conventional push switch.
- the metal hoop 11 is formed into a predetermined shape after a metal material formed in a long strip shape, which has been plated on the upper and lower surfaces in advance to improve solder wettability, is punched into a predetermined shape by a pressing process or the like. Bending and drawing are applied.
- the metal hoop 11 is formed with a first member portion 12 to be the first member 2 (shown in FIG. 12) and a second member portion 13 to be the second member 3 (shown in FIG. 12) after the insert molding. Yes.
- the first member portion 12 is formed with a contact portion 12A to be a contact portion 2A (shown in FIG. 12) and a terminal portion 12B to be a terminal 2B (shown in FIG. 12) after insert molding.
- the terminal portion 12B is connected to the frame portion 14 of the metal hoop 11.
- the first member portion 12 is integrated with the metal hoop 11.
- the second member portion 13 is formed with a contact portion 13A to be a contact portion 3A (shown in FIG. 12) and a terminal portion 13B to be a terminal 3B (shown in FIG. 12) after insert molding.
- the terminal portion 13B is connected to the frame portion 14 of the metal hoop 11.
- the second member portion 13 is integrated with the metal hoop 11.
- the metal hoop 11 described above is insert-molded into the resin case 1 (shown in FIG. 12) by injection molding.
- a method of insert-molding the metal hoop 11 will be described with reference to FIGS. 15 and 16.
- FIG. 15 and 16 are diagrams for explaining a state in which the metal hoop is accommodated in the cavity.
- FIG. 15 is a side view of the terminal portions 12B and 13B as viewed from the front end side.
- FIG. 16 is a top view in which the upper mold 22 is omitted.
- the first member portion 12 and the second member portion 13 of the metal hoop 11 are accommodated in a cavity 20A of a mold 20 configured by fitting the lower die 21 and the upper die 22 together. At this time, the terminal portions 12B and 13B of the metal hoop 11 protrude from the opening 20B of the mold 20 to the outside of the cavity 20A.
- the metal hoop 11 represents only the first member portion 12 and the second member portion 13 and is a frame located outside the terminal portions 12B and 13B in order to clarify the main points of the conventional technology.
- the part 14 is omitted from the illustration.
- thermoplastic insulating resin melted at a high temperature is filled into the cavity 20A, and so-called injection molding is performed, whereby the first member portion 12 and the second member portion 13 are insert-molded to form the resin case 1. .
- the gap 20C between the opening 20B of the mold 20 and the side surfaces of the terminal portions 12B and 13B is designed to be as small as possible so that the resin melted during the above-described injection molding does not leak out of the cavity 20A. ing. In FIGS. 15 and 16, the dimension of the gap 20C is shown enlarged.
- the terminal portions 12B and 13B are cut from the frame portion 14 (shown in FIG. 14) of the metal hoop 11 to form the resin case 1 (shown in FIGS. 11 and 12).
- the upper and lower surfaces of the terminals 2B and 3B protruding from the resin case 1 are plated.
- the side surfaces at the tips of the terminals 2B and 3B are cut surfaces when cut from the frame portion 14.
- the side surfaces along the direction in which the terminals 2B and 3B protrude are cut surfaces during the pressing process. Therefore, all the regions on the side surfaces are non-plated surfaces. For this reason, the solder wettability of the side surfaces of the terminals 2B and 3B is smaller than the upper and lower surfaces of the terminals 2B and 3B.
- the creation method of the push switch is as follows. First, a long belt-shaped metal material that has not been plated is punched. Thereafter, a plating layer is formed on the first member portion 12 and the second member portion 13 by plating, and the plating layer can be formed on the side surfaces of the terminals 2B and 3B by insert molding.
- Patent Document 2 is known as prior art document information related to the invention of this application.
- the electronic component of the present invention includes a resin case and a terminal partly exposed from the resin case.
- the first side surface along the direction in which the terminal protrudes has a first plated surface and a first non-plated surface, and the first non-plated surface extends from a part of the upper end of the first side surface to the first side surface. It extends to a part of the lower end of.
- the first non-plated surface has a first region exposed from the resin case and a second region embedded in the resin case.
- This configuration can suppress the peeling of the plating layer during insert molding.
- FIG. 1 is a perspective view of a push switch according to a first embodiment.
- FIG. 2 is an enlarged view of a main part of FIG.
- FIG. 3 is an exploded perspective view of the push switch according to the first embodiment.
- FIG. 4 is a cross-sectional view of the push switch according to the first embodiment.
- FIG. 5 is a top view of the metal hoop after the first press working.
- FIG. 6A is an enlarged view of a main part of the metal hoop after the second press working.
- FIG. 6B is an enlarged view of a main part of the metal hoop after the second press working.
- FIG. 6C is an enlarged view of a main part of the metal hoop after the second press working.
- FIG. 6A is an enlarged view of a main part of the metal hoop after the second press working.
- FIG. 7 is a diagram illustrating a state in which the metal hoop is accommodated in the cavity.
- FIG. 8 is a diagram illustrating a state in which the metal hoop is accommodated in the cavity.
- FIG. 9 is a top view of the vicinity of the terminals of the push switch according to the second embodiment.
- FIG. 10 is a top view of the vicinity of the terminals of the push switch according to the third embodiment.
- FIG. 11 is a perspective view of a conventional push switch.
- FIG. 12 is an exploded perspective view of a conventional push switch.
- FIG. 13 is a cross-sectional view of a conventional push switch.
- FIG. 14 is a top view of the metal hoop.
- FIG. 15 is a view for explaining a state in which the metal hoop is accommodated in the cavity.
- FIG. 16 is a view for explaining a state in which the metal hoop is accommodated in the cavity.
- the opening portion 20B of the mold 20 is formed at the time of insert molding. It is considered that a phenomenon occurs that the side surfaces of the terminal portions 12B and 13B are rubbed and the plating layer is peeled off.
- the gap 20C between the opening 20B of the mold 20 and the terminal portions 12B and 13B is designed to be as small as possible. Therefore, when the first member portion 12 and the second member portion 13 are disposed in the cavity 20A, the side surfaces of the terminal portions 12B and 13B may rub against the opening 20B. Therefore, when the plating layer is formed on the side surfaces of the terminal portions 12B and 13B, the rubbed plating layer is peeled off.
- the push switch shown in FIG. 15 and FIG. 16 manufactured using the first member portion 12 and the second member portion 13 in which the plating layers are formed on the side surfaces of the terminal portions 12B and 13B has a plating waste of resin case 1
- a trouble such as a short circuit occurs between the terminal 2B and the terminal 3B (shown in FIG. 12). Therefore, in order to prevent a short circuit, it is necessary to sufficiently manage the insert molding of the push switch shown in FIGS.
- the push switch is an example of an electronic component, and will be described using a push switch in an embodiment of the present invention described later. Also, the same reference numerals are given to the same components as those shown in FIGS. 12 to 16, and the description may be simplified or omitted.
- FIG. 1 is a perspective view of a push switch according to a first embodiment of the present invention
- FIG. 2 is an enlarged view of a main part of FIG. 1
- FIG. 3 is an exploded perspective view of the push switch according to the first embodiment.
- FIG. 4 is a cross-sectional view of the push switch according to the first embodiment. In FIGS. 1 and 2, a part of the push switch is cut away for convenience of explanation.
- the push switch of the present embodiment has a resin case 31, a movable member 5, and a protective sheet 6.
- the movable member 5 and the protective sheet 6 are the same as the conventional push switch described with reference to FIG.
- the resin case 31 has a concave portion with an upper opening and is formed of an insulating resin.
- a first contact portion 32A center fixed contact
- two second contact portions 33 ⁇ / b> A outer fixed contacts
- formed in a substantially rectangular shape and slightly projecting are provided on the outer peripheral portion of the bottom surface of the recess of the resin case 31.
- the resin case 31 is insert-molded so that the first member 32 and the second member 33, which are formed of a thin metal material in a predetermined shape, are electrically independent.
- the intermediate portion of the member 32 and the intermediate portion (not shown) of the second member 33 are respectively embedded in the resin case 31. The insert molding will be described later.
- a plating layer is formed in a predetermined area on the side surfaces of the first member 32 and the second member 33. That is, a plating layer is formed in a predetermined region on the side surfaces of the terminals 32B and 33B. Details of the formation region of the plating layer formed on the side surfaces of the terminals 32B and 33B will be described later. In addition, it is the same as that of the conventional push switch that the plating layer is formed in the upper surface and lower surface of the 1st member 32 and the 2nd member 33.
- the movable member 5 is accommodated in the recess of the resin case 31, and the lower edge of the outer edge of the movable member 5 is placed on the upper surface of the second contact portion 33A.
- the lower surface of the central portion of the movable member 5 is spaced from the upper surface of the first contact portion 32A and faces the first contact portion 32A.
- the protective sheet 6 is bonded to the upper surface of the resin case 31 with an adhesive 6A on the lower surface so as to cover the concave portion of the resin case 31.
- the push switch according to the first embodiment of the present invention is configured. Since the switch operation is the same as the conventional one, the description is omitted.
- the terminals 32B and 33B protrude outward from the resin case 31.
- Part of the terminals 32 ⁇ / b> B and 33 ⁇ / b> B is embedded in the resin case 31.
- the tip portion is narrow and the base portion on the resin case 31 side is slightly wide. Furthermore, the terminals 32B and 33B in the portion embedded in the resin case 31 are also slightly wider.
- the terminals 32B and 33B are made of a thin plate metal such as phosphor bronze, brass or SUS. On the upper and lower surfaces of the terminals 32B and 33B, plating layers made of a metal or alloy having high solder wettability such as silver are formed. The plating layer is formed on a base plating layer after a base plating layer such as nickel is formed on a thin metal substrate. In addition, the formation method of a plating layer is not limited to the method mentioned above.
- the terminal 32B of the present embodiment has at least three side surfaces. At least three side surfaces are a side surface 32T located at the tip of the terminal 32B and two side surfaces 32S along the direction in which the terminal 32B protrudes.
- the side surface of the terminal 33B has at least three side surfaces. At least three side surfaces are a side surface 33T positioned at the tip of the terminal 33B and two side surfaces 33S along the direction in which the terminal 33B protrudes.
- Each of the side surfaces 32S and 33S is formed with a first plating surface P1 on which a plating layer is formed and a first non-plating surface N1 on which no plating layer is formed.
- the first non-plated surface N1 formed on each of the side surfaces 32S and 33S has a first region N11 exposed to the outside of the resin case 31, and a second region N12 embedded in the resin case 31.
- the side surface 32T and the side surface 33T described above are the second non-plated surface N2 on which no plating layer is formed.
- the side surfaces 32S and 33S of the terminals 32B and 33B protruding outward from the resin case 31 have the first plating surface P1 on which the plating layer is formed. is doing. Therefore, it is possible to improve the mounting strength when soldering and mounting the push switch of the present embodiment.
- the resin case 31 (shown in FIG. 3) is formed by insert-molding a metal hoop 41, as in the conventional resin case 1.
- the formation process of the metal hoop 41 of this Embodiment differs from the conventional formation method.
- FIG. 5 is a top view of the metal hoop 41 after the first press working
- FIG. 6 is an enlarged view of a main part of the metal hoop 41 after the second press working.
- first pressing step a long band-shaped metal material that has not been plated is pressed (first pressing step), and as shown in FIG. 5, the first member portion 42 that becomes the first member 32 (shown in FIG. 3) and The work in process in which the 2nd member part 43 used as the 2nd member 33 (shown in FIG. 3) was formed is formed.
- the first member portion 42 includes a first contact portion 42A (center fixed contact portion), a terminal portion 42B, and a dummy portion 42D extending with a predetermined width on both sides of the terminal portion 42B. Is formed.
- the second member portion 43 is formed with a second contact portion 43A (outer fixed contact portion), a terminal portion 43B, and a dummy portion 43D extending with a predetermined width on both sides of the terminal portion 43B.
- the terminal parts 42B and 43B are connected to the frame part 44 of the metal hoop 41, and the first member part 42 and the second member part 43 are integrated with the metal hoop 41.
- a plating layer is formed on the work-in-process over the entire upper and lower surfaces and side surfaces.
- the dummy portions 42D and 43D are cut by pressing along the one-dot chain line in FIG. 5 (second pressing step).
- the dummy portions 42D and 43D are cut off, and the metal hoop 41 is completed.
- the cut surface is the first non-plated surface N1 on which no plating layer is formed.
- the hatched portion shown in FIG. 6A is a first non-plated surface N1 formed in the terminal portion 42B.
- hatching is shown only for one side surface 42S, but the first non-plated surface N1 is formed similarly for the other side surface 42S.
- the first non-plated surface N1 reaches each of the upper surface and the lower surface of the terminal portion 42B.
- the first non-plated surface N1 is located at both ends in the width direction of the terminal portion 42B.
- the first non-plated surface N1 extends from the upper end of the side surface 42S to the lower end of the side surface 42S.
- the first non-plated surface N1 reaches the upper surface and the lower surface of the terminal 32B.
- the first non-plated surface N1 extends from a part of the upper end of the side surface 32S (first side surface) to a part of the lower end of the side surface 32S (first side surface).
- the same 1st non-plating surface N1 is formed also about the terminal part 43B. That is, in the push switch according to the first embodiment shown in FIG. 1, the first non-plated surface N1 of the terminal 33B reaches the upper surface and the lower surface of the terminal 33B in the same manner as the terminal 32B.
- the cut surfaces of the dummy portions 42D and 43D become the first non-plated surface N1, and the plating layer is formed on all the side surfaces of the metal hoop 41 other than the cut surface. .
- the first plating surface P1 on which the plating layer is formed and the first non-plating surface N1 on which the plating layer serving as the cut surface of the dummy portion 42D is not formed on the side surface 42S of the terminal portion 42B.
- the side surface (not shown) of the terminal portion 43B is a first plated surface on which a plated layer is formed and a plated layer that is a cut surface of the dummy portion 43D is not formed.
- One non-plated surface is formed.
- the side surface 32S of the terminal 32B is formed with a first plated surface P1 on which a plated layer is formed and a first non-plated surface N1 on which a plated layer is not formed. ing.
- the terminal 33B has a first plating surface P1 on which a plating layer is formed and a first non-plating surface N1 on which no plating layer is formed on the side surface 33S of the terminal 33B. ing.
- the dummy portions 42D and 43D in the second press working described with reference to FIGS. 5 and 6A are cut at positions slightly protruding from the first plating surface P1 of the terminal portions 42B and 43B. That is, it is preferable that the cut surface (the first non-plated surface N1) is cut so that it slightly protrudes from the first plated surface P1 because the processing can be easily performed.
- the configuration of the side surface 42S is not limited to the configuration of FIG. 6A.
- the dummy portions 42D and 43D may be cut such that the cut surface (first non-plated surface N1) is flush with the first plated surface P1.
- the dummy portions 42D and 43D may be cut so that the cut surface (first non-plated surface N1) has a concave shape with respect to the first plated surface P1.
- FIGS. 5 and 6 are views for explaining a state in which the metal hoop 41 described with reference to FIGS. 5 and 6 is accommodated in the cavity.
- FIG. 7 is a side view of the terminal portions 42B and 43B viewed from the front end side.
- FIG. 8 is a top view in which the upper mold 52 is omitted.
- the metal hoop 41 is accommodated in the cavity 50A of the mold 50 as in the conventional case.
- the first member portion 42 and the second member portion 43 are insert-molded by filling the cavity 50A with a thermoplastic insulating resin melted at a high temperature and performing so-called injection molding.
- the resin case 31 (shown in FIG. 3) is formed.
- the mold 50 includes a lower mold 51 and an upper mold 52, and the terminal portions 42 ⁇ / b> B and 43 ⁇ / b> B of the metal hoop 41 protrude from the opening 50 ⁇ / b> B of the mold 50 to the outside of the cavity 50 ⁇ / b> A. ing.
- the metal hoop 41 represents only the first member portion 42 and the second member portion 43, and the structure of the metal hoop 41 located outside the terminal portions 42B and 43B is not shown and omitted. ing. That is, the frame portion 44 is omitted. Further, the first non-plated surface N1 is shown by a bold line for easy understanding of the region of the first non-plated surface N1 provided in the terminal portions 42B and 43B.
- the gap 50C between the opening 50B of the mold 50 and the first non-plated surface N1 of the terminal portions 42B and 43B is not leaked out of the cavity 50A as in the conventional case. Thus, it is designed to be as small as possible.
- the side surfaces of the terminal portions 42B and 43B may rub against the opening 50B of the mold 50.
- the metal hoop 41 of the present embodiment described above is used, the side regions of the terminal portions 42B and 43B that rub against the opening 50B are, as shown in FIG. 8, the first non-plated surface N1 on which no plating layer is formed. It is. Therefore, even if the terminal portions 42B and 43B are rubbed against the opening 50B of the mold 50, generation of plating scraps is suppressed.
- the metal hoop 41 is insert-molded with a part of the first non-plated surface N1 of the terminal portions 42B and 43B slightly entering the cavity 50A. Therefore, as shown in FIGS. 1 and 2, the first non-plated surface N ⁇ b> 1 of the push switch includes a second region N ⁇ b> 12 embedded in the resin case 31 and a first region N ⁇ b> 11 protruding outward from the resin case 31. Will be composed.
- the movable member 5 is mounted in the recess of the resin case 31 so that the lower edge of the outer edge of the movable member 5 is placed on the upper surface of the second contact portion 33A.
- the protective sheet 6 is attached to the upper surface of the resin case 31 with an adhesive 6 ⁇ / b> A formed on the lower surface of the protective sheet 6 so as to cover the concave portion of the resin case 31.
- the push switch of the first embodiment is completed by separating the terminal portions 42B and 43B from the frame portion 44 by the third press working.
- the tip (side surface 32T) of the terminal 32B shown in FIG. 1 is a second non-plated surface N2 on which a plated layer is not formed because it is a cut surface.
- the present embodiment it is possible to suppress the plating layer from peeling off during insert molding. Therefore, the malfunction of electronic components, such as a push switch which comprises the resin case 1 which passed insert molding, can be reduced.
- FIG. 9 is a top view of the vicinity of the terminals of the push switch according to the second embodiment of the present invention.
- a notch 62 is newly provided at the tip of the terminal 32B.
- the notch 62 is also provided in the terminal 33B, but the illustration and detailed description thereof are omitted.
- the notch 62 is notched so that the terminal 32B is L-shaped when viewed from above, and the side surface of the notch 62 constitutes a second plating surface P2 on which a plating layer is formed.
- the second plating surface P2 can be easily formed by providing a notch in the base material in advance and forming a plating layer thereon by the above-described first press working or the like.
- the area of the plated surface formed on the side surface of the terminal 32B is wider than that of the first embodiment. Therefore, in the push switch of the second embodiment, the same effects as those of the first embodiment can be obtained, and the mounting strength of the push switch on the wiring board can be further increased.
- FIG. 10 is a top view of the vicinity of the terminal of the push switch according to the third embodiment of the present invention, and a notch 72 is newly provided at the tip of the terminal 32B.
- the side surface at the tip of the terminal 32B is divided into two regions (a third region N21 and a fourth region N22).
- the notch 72 is also provided in the terminal 33B, the illustration and detailed description thereof are omitted.
- the notch 72 is notched in a U shape when viewed from above, and the side surface of the notch 72 constitutes a third plating surface P3 on which a plating layer is formed.
- tip of the terminal located in the both sides of the notch part 72 is a cut surface, the 3rd area
- region N22 are the 2nd non-plating surface N2 in which the plating layer is not formed.
- the third plating surface P3 can be easily formed by previously providing a through hole in the base material and forming a plating layer thereon by the above-described first press working or the like.
- the area of the plated surface formed on the side surface of the terminal 32B is wider than that of the first embodiment. Therefore, in the push switch of the third embodiment, the same effect as that of the first embodiment can be obtained, and the mounting strength of the push switch on the wiring board can be further increased.
- the push switches described in the first to third embodiments are examples of electronic components, and those according to the idea of the present invention are not limited to push switches.
- an electronic component having a resin case and a terminal partially exposed from the resin case such as an encoder, a variable resistor, and various switches other than the push switch having the above configuration, also belongs to the technical scope of the present invention.
- the electronic component according to the present invention is an electronic component in which a plating layer is formed on the side surface of the terminal, but the plating layer formed on the side surface of the terminal portion is prevented from peeling during insert molding.
- the present invention is useful for an electronic device for soldering and mounting an electronic component.
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Abstract
Description
図1は本発明の第1の実施形態によるプッシュスイッチの斜視図で、図2は図1の要部拡大図で、図3は第1の実施形態によるプッシュスイッチの分解斜視図である。図4は第1の実施形態によるプッシュスイッチの断面図である。なお、図1、図2は、説明の便宜のためにプッシュスイッチの一部を切り欠いて図示している。
次に、第1の実施形態のプッシュスイッチの製造方法について図5~図8を参照しながら説明する。なお、樹脂ケース31(図3に示す)は、従来の樹脂ケース1と同様に、金属フープ41をインサート成形することで形成される。しかしながら、本実施の形態の金属フープ41の形成工程は、従来の形成方法とは異なる。
次にインサート成形について説明する。図7、図8は、図5、図6を参照しながら説明した金属フープ41をキャビティ内に収容した状態を説明する図である。図7は端子部42Bと43Bの先端側から見た側面図である。図8は上型52を省略した上面図である。金属フープ41は、従来と同様に、金型50のキャビティ50A内に収容される。そして、高温で溶融した熱可塑性の絶縁性樹脂をキャビティ50A内に充填、所謂射出成形することで、第1部材部42と第2部材部43がインサート成形される。このように、樹脂ケース31(図3に示す)が形成される。
次に、第2の実施形態によるプッシュスイッチについて説明する。なお、第1の実施の形態と同一の構成には同一の符号を付している。さらに、第1の実施形態と共通する事項については説明を省略する。
次に、第3の実施形態によるプッシュスイッチについて説明する。なお、第1の実施の形態のものと同一構成の部分には同一符号を付している。さらに、第1の実施形態と共通する事項については説明を省略する。
6 保護シート
6A 粘着剤
31 樹脂ケース
32 第1部材
32A 第1接点部(中央固定接点)
32B,33B 端子
32T,33T 側面
32S,33S,42S 側面
33 第2部材
33A 第2接点部(外側固定接点)
41 金属フープ
42 第1部材部
42A 第1接点部(中央固定接点部)
42B,43B 端子部
42D,43D ダミー部
43 第2部材部
43A 第2接点部(外側固定接点部)
44 枠部
50 金型
50A キャビティ
50B 開口部
50C 隙間
51 下型
52 上型
62,72 切り欠き部
N1 第1非メッキ面
N11 第1領域
N12 第2領域
N2 第2非メッキ面
N21 第3領域
N22 第4領域
P1 第1メッキ面
P2 第2メッキ面
P3 第3メッキ面
Claims (5)
- 樹脂ケースと、
前記樹脂ケースから一部が露出した端子と、
を備え、
前記端子が突出する方向に沿った第1側面は、第1メッキ面と、第1非メッキ面とを有し、
前記第1非メッキ面は、前記第1側面の上端の一部から前記第1側面の下端の一部まで広がっており、
前記第1非メッキ面は、前記樹脂ケースから露出した第1領域と、前記樹脂ケースに埋設された第2領域とを有する
ことを特徴とする電子部品。 - 前記第1非メッキ面は前記端子の幅方向に対して、前記第1メッキ面より外側に位置する
ことを特徴とする請求項1に記載の電子部品。 - 前記第1非メッキ面は前記端子の幅方向に対して、前記第1メッキ面より内側に位置する
ことを特徴とする請求項1に記載の電子部品。 - 前記端子は端部に切り欠き部を有し、
前記切り欠き部は第2メッキ面を有する
ことを特徴とする請求項1から3のいずれか1項に記載の電子部品。 - 前記端子は端部に
前記樹脂ケース側に向かって凹んだ切り欠き部と、
メッキされていない第2非メッキ面と、
を有し、
前記第2非メッキ面は、第3領域と第4領域を有し、
前記切り欠き部は、前記第3領域と前記第4領域との間に位置し、第3メッキ面を有する
ことを特徴とする請求項1から3のいずれか1項に記載の電子部品。
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CN201590000353.XU CN206003647U (zh) | 2014-03-19 | 2015-01-29 | 电子部件 |
US15/126,504 US20170110270A1 (en) | 2014-03-19 | 2015-01-29 | Electronic component |
JP2016508475A JPWO2015141114A1 (ja) | 2014-03-19 | 2015-01-29 | 電子部品 |
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JP2014-055931 | 2014-03-19 |
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WO2015141114A1 true WO2015141114A1 (ja) | 2015-09-24 |
Family
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PCT/JP2015/000385 WO2015141114A1 (ja) | 2014-03-19 | 2015-01-29 | 電子部品 |
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US (1) | US20170110270A1 (ja) |
JP (1) | JPWO2015141114A1 (ja) |
CN (1) | CN206003647U (ja) |
WO (1) | WO2015141114A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110268495A (zh) * | 2017-02-28 | 2019-09-20 | 松下知识产权经营株式会社 | 按压开关 |
CN110291605A (zh) * | 2017-02-28 | 2019-09-27 | 松下知识产权经营株式会社 | 按压开关 |
JP2022049315A (ja) * | 2020-09-16 | 2022-03-29 | 株式会社東芝 | 半導体装置及びその製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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DE112019005212T5 (de) * | 2018-10-18 | 2021-07-08 | Uchiya Thermostat Co., Ltd. | Verfahren zum Verbinden eines elektrischen Bauelements |
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- 2015-01-29 JP JP2016508475A patent/JPWO2015141114A1/ja active Pending
- 2015-01-29 CN CN201590000353.XU patent/CN206003647U/zh not_active Expired - Fee Related
- 2015-01-29 WO PCT/JP2015/000385 patent/WO2015141114A1/ja active Application Filing
- 2015-01-29 US US15/126,504 patent/US20170110270A1/en not_active Abandoned
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JPS6175553A (ja) * | 1984-09-21 | 1986-04-17 | Hitachi Tobu Semiconductor Ltd | 電子部品 |
JPS61115343A (ja) * | 1984-11-09 | 1986-06-02 | Mitsubishi Electric Corp | 半導体集積回路 |
JPH04333271A (ja) * | 1991-05-09 | 1992-11-20 | Nec Corp | リードフレーム及びその製造方法と半導体装置 |
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JP2011060627A (ja) * | 2009-09-11 | 2011-03-24 | Panasonic Corp | 電子部品 |
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CN110268495A (zh) * | 2017-02-28 | 2019-09-20 | 松下知识产权经营株式会社 | 按压开关 |
CN110291605A (zh) * | 2017-02-28 | 2019-09-27 | 松下知识产权经营株式会社 | 按压开关 |
CN110291605B (zh) * | 2017-02-28 | 2021-08-10 | 松下知识产权经营株式会社 | 按压开关 |
JP2022049315A (ja) * | 2020-09-16 | 2022-03-29 | 株式会社東芝 | 半導体装置及びその製造方法 |
JP7393312B2 (ja) | 2020-09-16 | 2023-12-06 | 株式会社東芝 | 半導体装置及びその製造方法 |
Also Published As
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US20170110270A1 (en) | 2017-04-20 |
JPWO2015141114A1 (ja) | 2017-04-06 |
CN206003647U (zh) | 2017-03-08 |
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