WO2014030599A1 - Verre protecteur intégré au capteur - Google Patents

Verre protecteur intégré au capteur Download PDF

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Publication number
WO2014030599A1
WO2014030599A1 PCT/JP2013/072019 JP2013072019W WO2014030599A1 WO 2014030599 A1 WO2014030599 A1 WO 2014030599A1 JP 2013072019 W JP2013072019 W JP 2013072019W WO 2014030599 A1 WO2014030599 A1 WO 2014030599A1
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WO
WIPO (PCT)
Prior art keywords
transparent conductive
conductive film
sensor
film
cover glass
Prior art date
Application number
PCT/JP2013/072019
Other languages
English (en)
Japanese (ja)
Inventor
玉井　喜芳
文 中川
仁 齊木
直己 上村
Original Assignee
旭硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旭硝子株式会社 filed Critical 旭硝子株式会社
Priority to JP2014531610A priority Critical patent/JPWO2014030599A1/ja
Priority to KR20157004438A priority patent/KR20150046047A/ko
Priority to CN201380043790.5A priority patent/CN104583918A/zh
Publication of WO2014030599A1 publication Critical patent/WO2014030599A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

Definitions

  • the present invention relates to a sensor-integrated cover glass used for a capacitive touch panel or the like.
  • a capacitive touch panel is generally a transparent conductive film (transparent electrode) for detecting an input position extending on, for example, an x direction and a y direction on a glass substrate called a sensor glass. Etc. are formed to form the sensor function unit.
  • a general capacitive touch panel is configured by adhering a sensor glass on which a transparent conductive film or the like is formed and a glass called a cover glass.
  • a capacitive touch panel eliminates the sensor glass to reduce the number of parts, and reduce the thickness and weight. That is, this capacitive touch panel uses a tempered glass as a cover glass, and the cover glass and the sensor unit are integrated by forming a transparent conductive film for detecting an input position on the cover glass. (Sensor-integrated cover glass).
  • the tempered glass is a glass whose strength is increased by forming a tempered layer (compressive stress layer) on the surface and applying a compressive stress.
  • the tempered glass is manufactured by a physical tempering method (air-cooling tempering method) that forms a tempered layer using the expansion and contraction of the glass by heating and cooling, as well as alkali ions in the glass with a larger ionic radius.
  • a chemical strengthening method is known in which a reinforcing layer is formed by exchanging with alkali ions.
  • tempered glass by a chemical tempering method so-called chemically tempered glass is generally used.
  • the sensor-integrated cover glass in order to realize a touch panel with excellent durability, it is important that the cover glass to be operated has sufficient strength. For this reason, the sensor-integrated cover glass is required to have a strength equal to or higher than that of the cover glass.
  • An object of the present invention is a sensor-integrated cover glass used for a capacitive touch panel, in which a transparent conductive film for position detection, etc. is formed on a cover glass, and the capacitive touch panel having excellent durability.
  • the object is to provide a sensor-integrated cover glass that can be realized.
  • the sensor-integrated cover glass of one embodiment of the present invention includes a glass plate, a first transparent conductive film formed on one surface of the glass plate, and extending in a first direction, and the first direction.
  • the first transparent conductive film and the second transparent conductive film form an intersection where one of the first transparent conductive film and the second transparent conductive film covers the other, and the first transparent conductive film covers the first transparent conductive film. It is preferable to have an intersection insulating film between the transparent conductive film and the second transparent conductive film.
  • the base insulating film is formed only between the glass plate and the first transparent conductive film and the second transparent conductive film.
  • the base insulating film is formed so as to cover the glass plate entirely in at least a region where the first transparent conductive film and the second transparent conductive film are formed. It is preferable that
  • the base insulating film is not formed between the glass plate and the intersection where the first transparent conductive film and the second transparent conductive film intersect.
  • intersection insulating film is formed to extend between the glass plate other than the intersection and the first transparent conductive film and the second transparent conductive film.
  • the sensor-integrated cover glass of the present invention having the above-described configuration is a sensor-integrated cover glass that is used in a capacitive touch panel and is formed by forming a transparent conductive film for position detection on the cover glass, and has durability. It is possible to provide a sensor-integrated cover glass that can realize an excellent capacitive touch panel.
  • FIGS. 1 (A) to 1 (D) are diagrams conceptually showing an example of the sensor-integrated cover glass of the present invention
  • FIG. 1 (A) is a plan view
  • FIG. 1 (B) is FIG. 1 (A).
  • FIG. 1C is a cross section taken along the line cc of FIG. 1A
  • FIG. 1D is a cross section near the end.
  • FIG. 2 is a plan view for explaining the configuration of the sensor-integrated cover glass shown in FIGS. 1 (A) to 1 (D).
  • FIG. 3 is a flowchart showing an example of a method for manufacturing the sensor-integrated cover glass shown in FIGS. 1 (A) to 1 (D).
  • FIG. 4 (A) to 4 (C) are diagrams conceptually showing another embodiment of the sensor-integrated cover glass
  • FIG. 4 (A) is a plan view
  • FIG. 4 (B) is FIG. 4 (A).
  • FIG. 4C is a cross-sectional view taken along the line cc of FIG. 4A.
  • 5 (A) and 5 (B) are diagrams conceptually showing a test method for measuring the surface strength of each sample in the example of the present invention.
  • FIG. 5 (A) is a plan view
  • FIG. B) is a side view.
  • FIG. 1A to 1D conceptually show an example of a sensor-integrated cover glass of the present invention.
  • FIG. 1A is a plan view, that is, a sensor-integrated cover glass 10 in a surface direction of a glass plate 12 (hereinafter, this direction is simply referred to as a surface direction).
  • FIG. 1B is a cross-sectional view taken along line bb in FIG. 1A
  • FIG. 1C is a cross-sectional view taken along line cc in FIG. 1A. It is a figure which shows a line cross section, respectively.
  • FIG. 1D is a diagram conceptually showing a cross section in the x direction of the sensor integrated cover glass 10 in the vicinity of the end portion in the x direction.
  • the sensor-integrated cover glass 10 is basically formed using the glass plate 12 as a substrate, and is formed on the first transparent conductive film 14, the second transparent conductive film 16, the light shielding film 18, and the light shielding film 18.
  • the metal wiring 20 to be formed and the protective insulating film 24 that covers these and is formed on the glass plate 12 are configured (in FIG. 1A, the protective insulating film 24 is omitted).
  • the light shielding film 18 and the metal wiring 20 are described in FIG. 2 described later).
  • An intersection insulating film 28 is provided between the first transparent conductive film 14 and the second transparent conductive film 16.
  • the sensor-integrated cover glass 10 of the present invention has a base insulating film 26 between the glass plate 12 and the first transparent conductive film 14 and the second transparent conductive film 16.
  • the sensor-integrated cover glass of the present invention is not limited to the configuration of the illustrated example, and is formed by forming a transparent conductive film or the like that constitutes the sensor on a glass plate that constitutes a surface on which the capacitive touch panel is operated. Various configurations of known sensor-integrated cover glass can be used.
  • the sensor-integrated cover glass 10 of the present invention constitutes a capacitive touch panel.
  • the surface (main surface) of the glass plate 12 on the side where the first transparent conductive film 14, the second transparent conductive film 16 and the like are not formed. ) 12a is the surface on which the operation is performed.
  • the operation surface 12a the surface on which the operation is performed
  • the sensor surface 12b the surface on which the first transparent conductive film 14, the second transparent conductive film 16, and the like are formed
  • the glass plate 12 functions as a cover glass that constitutes the operation surface 12a of the capacitive touch panel, and the first transparent conductive film 14 and the second transparent conductive film that function as sensors.
  • 16 has a function as a sensor glass on which 16 or the like is formed.
  • the glass plate 12 is not limited in terms of composition, manufacturing method such as a float method or a fusion method.
  • the glass plate 12 examples include tempered glass such as the above-described chemically tempered glass and physical tempered glass, soda lime glass, alkali-free glass, and the like. Among these, aluminosilicate chemically tempered glass, soda lime chemically tempered glass, and the like are preferably used.
  • the thickness of the glass plate 12 may be the same as that of a cover glass used for a known touch sensor.
  • the thickness of the glass plate 12 is usually 0.3 to 1.5 mm, preferably 0.5 to 1.1 mm.
  • the first transparent conductive film 14, the second transparent conductive film 16, and the light shielding film 18 are formed on the sensor surface 12b using such a glass plate 12 as a substrate.
  • a base insulating film 26 is formed between the first transparent conductive film 14 and the second transparent conductive film 16 and the glass plate 12.
  • the underlying insulating film 26 will be described in detail later.
  • another film may be provided between the base insulating film 26 and the first transparent conductive film 14 and the second transparent conductive film 16.
  • an inorganic film such as SiO 2 may be provided.
  • the first transparent conductive film 14 and the second transparent conductive film 16 are for detecting an input position (transparent electrode for input position detection). That is, the 1st transparent conductive film 14 and the 2nd transparent conductive film 16 comprise the sensor which detects an input position.
  • transparent conductive films 14 and 16 both are collectively referred to as transparent conductive films 14 and 16.
  • the first transparent conductive film 14 extends in the x direction in the drawing, and a plurality of first transparent conductive films 14 are arranged in the y direction orthogonal to the x direction.
  • the second transparent conductive film 16 extends in the y direction in the drawing, and a plurality of the second transparent conductive films 16 are arranged in the x direction.
  • the first transparent conductive film 14 includes rectangular large area portions (pad portions) 14a arranged at predetermined intervals in the extending direction, that is, the x direction, and connected by a connecting portion 14b. You may have the structure which becomes.
  • the second transparent conductive film 16 may have a configuration in which rectangular large-area portions 16a are arranged at predetermined intervals in the extending direction, that is, the y direction, and are connected by the connection portions 16b. .
  • the large area portion 14a and the large area portion 16a are arranged to be spaced apart from each other and alternately arranged in the x direction and the y direction, and are provided to improve input position detection. Accordingly, the first transparent conductive film 14 and the second transparent conductive film 16 are formed so as to intersect at the connection portion 14b and the connection portion 16b.
  • the second transparent conductive film is formed at the intersection of the first transparent conductive film 14 and the second transparent conductive film 16, that is, at the intersection of the connection portion 14b and the connection portion 16b.
  • An intersection insulating film 28 is formed so as to straddle the film 16 in the x direction.
  • the first transparent conductive film 14 is formed on the intersection insulating film 28 so as to straddle the intersection insulating film 28 and the second transparent conductive film 16 in the x direction.
  • the material for forming the transparent conductive films 14 and 16 is a known transparent (having light transmittance) used for forming a sensor portion in a capacitive touch sensor.
  • Various kinds of conductive materials can be used. Specific examples include ITO (indium tin oxide) and IZO (indium zinc oxide). Among these, ITO is preferably used.
  • the thickness of the transparent conductive films 14 and 16 may be appropriately determined according to the forming material or the like. The thickness of the transparent conductive films 14 and 16 is usually about 20 to 100 nm.
  • the material for forming the crossing insulating film 28 various known transparent insulating materials can be used. Specifically, various photoresists such as acrylic and polyimide are exemplified.
  • the thickness of the intersection insulating film 28 may be appropriately determined according to the forming material or the like. Note that the thickness of the intersection insulating film 28 is usually about 0.8 to 2.0 ⁇ m.
  • FIG. 2 is a plan view for explaining the configuration of the sensor-integrated cover glass 10.
  • the light shielding film 18 is an insulating film having a light shielding property formed on the outer peripheral portion of the sensor surface of the glass plate 12.
  • the light shielding film 18 is provided for shielding light leaked from the display combined with the sensor-integrated cover glass 10, concealing wiring and IC for driving the display, concealing metal wiring 20 described later, and the like.
  • the thickness of the light shielding film 18 can be changed as appropriate.
  • the thickness of the light shielding film 18 is usually about 0.8 to 2.0 ⁇ m.
  • the light shielding film 18 is provided as a preferred embodiment.
  • the metal wiring 20 is formed on the light shielding film 18 (the base insulating film 26 on the light shielding film 18) (sensor surface 12b).
  • a plurality of metal wirings 20 are formed according to the number of the first transparent conductive film 14 and the second transparent conductive film 16, and one end of each metal wiring 20 is the first transparent conductive film 14 or the second transparent conductive film 14. Connected to the transparent conductive film 16.
  • the other end side of each metal wiring 20 is connected to the flexible wiring board 30 connected to the display combined with the sensor integrated cover glass 10, for example.
  • various metal materials can be used for the metal wiring 20 in the touch panel.
  • a three-layer metal material (MAM) of Mo / Al / Mo a three-layer metal material of Mo—Nb alloy / Al / Mo—Nb alloy, Mo—Nb alloy / Al—Nb alloy / Mo— Examples of the metal material include three layers of Nb alloy.
  • the thickness of the metal wiring 20 is usually about 0.3 to 0.5 ⁇ m. In the sensor-integrated cover glass of the present invention, this metal wiring 20 is also provided as a preferred embodiment.
  • the protective insulating film 24 is provided on the metal wiring 20 described above, not all of the protective insulating film 24 is covered with the protective insulating film 24, and necessary portions are exposed to the outside.
  • the metal wiring 20 is not covered with the protective insulating film 24 but exposed only at the connection portion with the flexible wiring substrate 30 connected to a display or the like.
  • the protective insulating film 24 various known transparent insulating materials used for forming the protective film of the sensor-integrated cover glass can be used. A material similar to that of the partial insulating film 28 can be used. Further, the thickness of the protective insulating film 24 is a thickness that sufficiently covers the material and functions as a protective layer according to the forming material, the thickness of various portions formed on the sensor surface of the glass plate 12, and the like. What is necessary is just to set suitably. The thickness of the protective insulating film 24 is usually 0.8 to 2.0 ⁇ m.
  • the base insulating film 26 is formed between the glass plate 12 and the first transparent conductive film 14 and the second transparent conductive film 16.
  • the base insulating film 26 is formed not only between the glass plate 12 and the transparent conductive films 14 and 16 but also on the light shielding film 18.
  • the base insulating film 26 is a characteristic part of the present invention, and is a film made of an organic compound that is transparent and has an insulating property.
  • the sensor-integrated cover glass 10 according to the present invention has the underlying insulating film 26 to significantly improve the strength of the glass plate 12 and realize a touch sensor such as a smartphone or a tablet computer that has excellent durability. Yes.
  • the present inventor has found that the surface strength of the sensor surface of the glass plate is weak in the conventional sensor-integrated cover glass.
  • the operation of the device in which the sensor-integrated cover glass is incorporated is performed on the operation surface on the side opposite to the sensor surface on which the transparent conductive film is formed. That is, the glass plate usually receives a pressing force from the operation surface side, and a tensile stress is applied to the sensor surface. Therefore, in the glass plate, the low surface strength of the sensor surface to which tensile stress is applied can be a serious problem in the sensor-integrated cover glass.
  • the present invention is made in order to cope with the above-described problem.
  • the glass plate 12 and the transparent conductive films 14 and 16 are made of an organic compound
  • the base insulating film 26 is transparent and has an insulating property.
  • the base insulating film 26 is made of an organic compound and has sufficient transparency and insulation.
  • transparent epoxy resin, acrylic resin, other photo-curing resin, thermosetting resin, various photoresists and the like are exemplified.
  • sufficient transparency means that the transmittance in the visible light region (wavelength 400 nm to 700 nm) is 85% or more.
  • sufficient insulation means that the resistivity is 1E12 ( ⁇ / ⁇ ) or more, more preferably 1E14 ( ⁇ / ⁇ ) or more.
  • the thickness of the base insulating film 26 can be set as appropriate. According to the study of the present inventor, the thickness of the base insulating film 26 is preferably 0.8 to 2.0 ⁇ m, and more preferably 1.0 to 1.5 ⁇ m.
  • the base insulating film 26 is formed not only between the glass plate 12 and the transparent conductive films 14 and 16 but also on the light shielding film 18.
  • the present invention is not limited to this, and the base insulating film 26 may be provided only inside the light shielding film 18 without being formed on the light shielding film 18.
  • the base insulating film 26 is entirely formed on the sensor surface 12b.
  • the present invention is not limited to this, and the base insulating film 26 is not formed on the portion of the sensor surface 12b where the transparent conductive films 14 and 16 are absent, and the transparent conductive films 14 and 16 and the glass plate are not formed. You may form only between 12. That is, in the present invention, the base insulating film 26 may be formed at least between the transparent conductive films 14 and 16 and the glass plate 12. Note that, when it is necessary to pattern the base insulating film 26 as described above, the base insulating film 26 is preferably formed of a photoresist.
  • the sensor-integrated cover glass 10 of the present invention is not limited to be manufactured by this procedure.
  • the base insulating film 26 can be formed between the transparent conductive films 14 and 16 and the glass plate 12, such as forming a metal wiring after the formation of the transparent conductive film, various types used in known sensor-integrated cover glasses.
  • the manufacturing method according to the procedure can be used.
  • the method for forming each film is not limited to the examples shown below, and various methods used in known sensor-integrated cover glasses can be used depending on the film forming material and the like.
  • the glass plate used as a raw material is prepared, and this glass plate is chemically strengthened to produce the glass plate 12. Chemical strengthening may be performed by a known method.
  • a light shielding film 18 is printed on the glass plate 12 so as to surround an area to be the active area A (see FIG. 2).
  • the light shielding film 18 may be printed by a known method used in the manufacture of touch panels. As described above, the light shielding film 18 may be formed as necessary.
  • a film to be the base insulating film 26 is formed, and patterning or the like is performed as necessary to form the base insulating film 26.
  • the method for forming the base insulating film 26 is not particularly limited, and various methods for forming a film made of a known organic compound can be used. Further, when patterning is performed, a known method corresponding to the material for forming the base insulating film 26 may be used.
  • ITO or the like which will later become a part of the second transparent conductive film 16, which will become the intersection transparent conductive film 16 c, is formed on the entire surface of the base insulating film 26 and patterned.
  • the ITO film may be formed by a known method such as sputtering. Patterning may be performed by a known method such as a method using photolithography.
  • an insulating film is formed on the intersection transparent conductive film 16c, and patterning is performed so as to expose a region other than the intersection transparent conductive film 16c and a part of the intersection transparent conductive film 16c. 28 is formed.
  • the film forming method and patterning may be performed by a known method according to the material for forming the intersection insulating film 28.
  • ITO etc. used as the 2nd transparent conductive film 16 except the 1st transparent conductive film 14 and the crossing part transparent conductive film 16c are formed into a film, and a transparent sensor wiring part is completed by performing patterning.
  • film formation of ITO or the like may be performed by a known method such as sputtering, and patterning may be performed by a known method.
  • a metal wiring 20 is formed on the light shielding film 18 and patterned. As described above, this step may be performed as necessary.
  • this embodiment although implemented during the process of forming the crossing part transparent conductive film 16c and the crossing insulating film 28, it is not restricted to this.
  • a protective insulating film 24 is formed so as to cover the entire sensor surface 12 b of the glass plate 12, and patterning is performed so that necessary portions of the metal wiring 20 such as a connection portion with the flexible wiring substrate 30 are exposed. I do.
  • the film forming method and patterning may be performed by a known method corresponding to the material for forming the protective insulating film 24.
  • FIGS. 4 (A) to 4 (C) are views conceptually showing another embodiment of the sensor-integrated cover glass of the present invention.
  • 4A is a plan view of the same portion as FIG. 1A
  • FIG. 4B is a cross-sectional view taken along the line bb of FIG. 4A
  • FIG. FIG. 5 is a view showing a cross section taken along line cc of FIG.
  • the sensor-integrated cover glass 10a shown in FIGS. 4 (A) to 4 (C) has many of the same members as the sensor-integrated cover glass 10 described above. Do different parts mainly.
  • the sensor-integrated cover glass 10a shown in FIGS. 4A to 4C does not have the base insulating film 26, and uses an organic compound as a transparent insulating film for forming the jumper portion.
  • the insulating film is formed not only on the jumper portion but also on the entire sensor surface 12b of the glass plate 12 to form the intersection / underlying insulating film 32. That is, in the sensor-integrated cover glass 10a, when forming the intersection insulating film 28 of the sensor-integrated cover glass shown in FIGS. 1 (A) and 1 (C), a transparent insulating film made of an organic compound is used as the sensor.
  • the crossing portion / base insulating film 32 is formed by integrating the crossing portion insulating film 28 and the base insulating film 26 of the above-described example.
  • the sensor-integrated cover glass 10a shown in FIGS. 4A to 4C is formed after the chemical strengthening and printing of the light shielding film 18 in the flowchart shown in FIG. Without forming the film, the processes from the formation of the crossing transparent conductive film 16c and the formation of the metal wiring 20 (metal wiring etching) are performed. That is, in this example, the intersection transparent conductive film 16c is formed directly on the glass plate 12 (sensor surface 12b). Next, a transparent insulating film is formed on the entire surface, and both ends in the y direction of the crossing transparent conductive film 16c are exposed by etching or the like to form a crossing / base insulating film 32. Thereafter, similarly, the transparent conductive films 14 and 16 other than the intersection transparent conductive film 16c and the protective insulating film 24 are formed.
  • the sensor-integrated cover glass 10a shown in FIGS. 4A to 4C includes a first transparent conductive film extending in the x direction, a second transparent conductive film extending in the y direction, and a first transparent conductive film.
  • a crossing portion made of a transparent organic compound provided between the conductive films at the crossing portion of the conductive film and the second transparent conductive film, and between the first transparent conductive film and the second transparent conductive film and the glass plate. / Having a base insulating film.
  • the sensor-integrated cover glass shown in FIGS. 1A to 1D does not have a base insulating film under the transparent conductive film of the jumper portion, and the cross-section insulating film is other than the jumper portion. This extends between the first transparent conductive film and the second transparent conductive film and the glass plate, and acts as a base insulating film.
  • the sensor-integrated cover glass 10 shown in FIGS. 1A to 1D it is necessary to add a process of forming a base insulating film.
  • the sensor-integrated cover glass 10a shown in FIGS. 4A to 4C of this embodiment can be manufactured with the same number of processes as the conventional sensor-integrated cover glass without increasing the number of processes. it can.
  • the base insulating film can be provided between the transparent conductive film and the glass plate in almost all regions, the effect of preventing the surface strength of the sensor surface 12b of the glass plate 12 from being lowered can be sufficiently obtained.
  • the sensor-integrated cover glass 10 shown in FIGS. 1 (A) to 1 (D) is advantageous in terms of strength of the glass plate 12 because it has a base insulating film under the jumper portion.
  • aluminosilicate glass (aluminosilicate glass) having a thickness of 0.7 mm was prepared. After this glass was chemically strengthened, it was cut into 50 mm squares. In order to investigate the dependence of chemical strengthening conditions, chemical strengthening was performed using two different types of chemical strengthening conditions.
  • the glass plates obtained under each chemical strengthening condition had a CS (compressive stress) of 647 MPa, a DOL (depth of layer) of 21 ⁇ m, and a CS of 630 MPa and a DOL of 49 ⁇ m.
  • a glass plate having a CS of 647 MPa and a DOL of 21 ⁇ m is referred to as a glass plate A
  • a glass plate having a CS of 630 MPa and a DOL of 49 ⁇ m is referred to as a glass plate B.
  • Example 2 A sample in which only ITO is formed on the glass plate A is Comparative Example 1, a sample in which only ITO is formed on the glass plate B is Comparative Example 2, and a sample in which the base insulating film and ITO are formed on the glass plate A is Example 1.
  • a sample in which a base insulating film and ITO are formed on a glass plate B is referred to as Example 2.
  • FIGS. 5 (A) and 5 (B) are diagrams conceptually showing a surface strength test method of a glass plate called BOR (Ball on Ring), FIG. 5 (A) is a plan view, and FIG. 5 (B) is a side view.
  • BOR All on Ring
  • FIG. 5 (A) is a plan view
  • FIG. 5 (B) is a side view.
  • FIG. As shown in FIGS. 5 (A) and 5 (B), the sample G is placed on the ring-shaped support portion S so that the centers coincide with each other and the ITO formation surface faces the support portion S side.
  • the surface strength of each sample G was measured by applying a load by pressing a spherical load portion L having a radius of 5 mm from the center of the support portion S.
  • the diameter of the support portion S was 30 mm (referenced to the center of the support portion S).
  • the measurement results of the surface strength of each sample and glass plate are shown in Table 1 below.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
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  • Surface Treatment Of Glass (AREA)

Abstract

La présente invention porte sur un verre protecteur intégré au capteur comprenant : un panneau de verre ; un premier film conducteur transparent s'étendant dans une première direction, et un second film conducteur transparent s'étendant dans une direction différente de la première direction, les films étant formés sur une surface du panneau de verre ; et un film isolant de base comprenant un composé organique transparent, formé entre le panneau de verre et le premier film conducteur transparent et le second film conducteur transparent.
PCT/JP2013/072019 2012-08-23 2013-08-16 Verre protecteur intégré au capteur WO2014030599A1 (fr)

Priority Applications (3)

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JP2014531610A JPWO2014030599A1 (ja) 2012-08-23 2013-08-16 センサ一体型カバーガラス
KR20157004438A KR20150046047A (ko) 2012-08-23 2013-08-16 센서 일체형 커버 유리
CN201380043790.5A CN104583918A (zh) 2012-08-23 2013-08-16 传感器一体型保护玻璃

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JP2012183832 2012-08-23
JP2012-183832 2012-08-23

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WO2016103991A1 (fr) * 2014-12-26 2016-06-30 富士フイルム株式会社 Composition durcissable, film de transfert, plaque avant d'un dispositif d'affichage d'image, capteur intégré à une plaque avant, dispositif d'affichage d'image, et procédé de fabrication pour plaque avant de dispositif d'affichage d'image
WO2019151321A1 (fr) 2018-01-31 2019-08-08 Ａｇｃ株式会社 Substrat en verre pourvu d'un film antireflet et élément optique
JP2019214492A (ja) * 2018-06-13 2019-12-19 東レ株式会社 ガラス強化基板
KR20200010212A (ko) 2017-05-24 2020-01-30 도레이 카부시키가이샤 네가티브형 감광성 수지 조성물 및 경화막
KR20200010213A (ko) 2017-05-24 2020-01-30 도레이 카부시키가이샤 투명 수지 조성물, 투명 피막 및 투명 수지 피복 유리 기판

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JP2016021235A (ja) * 2014-07-14 2016-02-04 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． タッチパネルを備えるフレキシブル表示装置
US10459588B2 (en) 2014-07-14 2019-10-29 Samsung Display Co., Ltd. Flexible display device with touch panel
WO2016103991A1 (fr) * 2014-12-26 2016-06-30 富士フイルム株式会社 Composition durcissable, film de transfert, plaque avant d'un dispositif d'affichage d'image, capteur intégré à une plaque avant, dispositif d'affichage d'image, et procédé de fabrication pour plaque avant de dispositif d'affichage d'image
JP2016124720A (ja) * 2014-12-26 2016-07-11 富士フイルム株式会社 硬化性組成物、転写フィルム、画像表示装置の前面板、前面板一体型センサー、画像表示装置および画像表示装置の前面板の製造方法
EP3239111A4 (fr) * 2014-12-26 2017-12-27 FUJIFILM Corporation Composition durcissable, film de transfert, plaque avant d'un dispositif d'affichage d'image, capteur intégré à une plaque avant, dispositif d'affichage d'image, et procédé de fabrication pour plaque avant de dispositif d'affichage d'image
KR20200010212A (ko) 2017-05-24 2020-01-30 도레이 카부시키가이샤 네가티브형 감광성 수지 조성물 및 경화막
KR20200010213A (ko) 2017-05-24 2020-01-30 도레이 카부시키가이샤 투명 수지 조성물, 투명 피막 및 투명 수지 피복 유리 기판
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WO2019151321A1 (fr) 2018-01-31 2019-08-08 Ａｇｃ株式会社 Substrat en verre pourvu d'un film antireflet et élément optique
US11964904B2 (en) 2018-01-31 2024-04-23 AGC Inc. Glass substrate with antireflection film, and optical member
JP2019214492A (ja) * 2018-06-13 2019-12-19 東レ株式会社 ガラス強化基板
JP7115054B2 (ja) 2018-06-13 2022-08-09 東レ株式会社 ガラス強化基板

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TW201415337A (zh) 2014-04-16
KR20150046047A (ko) 2015-04-29
CN104583918A (zh) 2015-04-29
JPWO2014030599A1 (ja) 2016-07-28

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