WO2013108725A1 - ガラス板の製造方法、ディスプレイ用ガラス基板の製造方法及びガラス板 - Google Patents
ガラス板の製造方法、ディスプレイ用ガラス基板の製造方法及びガラス板 Download PDFInfo
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- WO2013108725A1 WO2013108725A1 PCT/JP2013/050456 JP2013050456W WO2013108725A1 WO 2013108725 A1 WO2013108725 A1 WO 2013108725A1 JP 2013050456 W JP2013050456 W JP 2013050456W WO 2013108725 A1 WO2013108725 A1 WO 2013108725A1
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- Prior art keywords
- glass plate
- grinding
- face
- polishing
- wheel
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
- B24B9/102—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass for travelling sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
Definitions
- the present invention relates to a method for producing a glass plate including a step of grinding an end face of a molded glass plate, a method for producing a glass substrate for display, and a glass plate.
- the formed glass plate is cut into a predetermined size.
- mechanical cutting using a cutter and cutting using a laser are generally used.
- the glass plate is mechanically cut and cut, so that the cut end surface has a crack having a depth of about several ⁇ m to 100 ⁇ m, for example, the thickness of the glass plate. Cracks extending from the surface to the inside from 7% to 10% are generated. This crack causes deterioration of the mechanical strength of the glass plate.
- the present invention provides a method for producing a glass plate, a method for producing a glass substrate for display, and a glass plate, which can reduce the unevenness of the end face of the glass plate as compared with the conventional method while securing the production amount of the glass plate.
- One embodiment of the present invention is a method for manufacturing a glass plate.
- the manufacturing method is Grinding the end face of the glass plate; Polishing the end face of the glass plate after grinding.
- the step of grinding the end face of the glass plate A first grinding step of grinding an end face of the glass plate using a first grinding wheel in which abrasive grains are hardened with a first binder; After the first grinding step, the end face of the glass plate is ground using a second grinding wheel in which abrasive grains are hardened with a second binder having lower hardness and rigidity than the first binder. 2 grinding processes.
- the first binder is a metal binder
- the second binder is a resin binder
- the end face of the glass plate is ground so that the maximum height Rmax defined in JIS B 0601-1982 is 10 ⁇ m or more and 18 ⁇ m or less.
- the end surface of the glass plate is preferably ground so that the maximum height Rmax is 4 ⁇ m or more and 8 ⁇ m or less.
- the end surface of the glass plate is preferably polished so that the maximum height Rmax is less than 4 ⁇ m.
- the grinding amount of the end face of the glass plate in the first grinding step is 40 ⁇ m or more and 60 ⁇ m or less
- the grinding amount of the end face of the glass plate in the second grinding step is 10 ⁇ m or more and 30 ⁇ m or less. It is.
- the conveyance direction of the glass plate in the second grinding step is opposite to the conveyance direction of the glass plate in the first grinding step.
- the rotation direction of the first grinding wheel at the point where the first grinding wheel contacts the glass plate is opposite to the conveying direction of the glass plate, and the second grinding wheel is The rotation direction of the second grinding wheel at the point of contact with the glass plate is preferably the same direction as the conveying direction of the glass plate.
- the conveyance speed of the said glass plate is 10 m / min or more, for example.
- the conveyance speed of the glass plate in the second grinding step is, for example, 15 m / min or more.
- the abrasive grains of the first grinding wheel and the second grinding wheel are diamond abrasive grains,
- the grain size of the abrasive grains of the first grinding wheel is preferably equal to or coarser than the grain size of the abrasive grains of the second grinding wheel.
- the binder of the polishing wheel for polishing the end surface of the glass plate is a foamed elastic material
- the abrasive is one or more selected from SiC, Al 2 O 3 , or CeO 2 It is preferable to be formed of the material.
- the glass plate is used for a substrate of a display device of a flat panel display or a cover glass of a display screen of an electronic device, and the glass plate is preferably formed by a down draw method or a float method.
- mode of this invention is the glass plate manufactured by the manufacturing method of the said glass plate.
- the glass plate The cross-sectional shape of the end surface of the glass plate is formed into a convex shape with a curvature, and the maximum height Rmax defined by JIS B 0601-1982 of the end surface of the glass plate is less than 4 ⁇ m, and JIS B 0601-1982
- the arithmetic average roughness Ra specified by is 0.06 ⁇ m or less.
- mode of this invention is a manufacturing method of the glass substrate for displays.
- the manufacturing method is Grinding the end face of the glass substrate and grinding the end face into a convex shape with a curvature; Polishing without substantially changing the shape of the end face of the glass substrate after grinding; including.
- the grinding amount of the end face of the glass plate in the second grinding step is 10 ⁇ m or more and 30 ⁇ m or less.
- the thickness of the glass substrate is preferably 0.25 mm to 0.7 mm.
- the unevenness of the end face of the glass plate can be reduced as compared with the conventional method while securing the manufacturing amount of the glass plate.
- the manufacturing method of the glass plate of this invention is not particularly limited, for example, it is suitable for a cover glass used for a display screen of an electronic device such as a portable electronic device, a display glass substrate for a display device such as a flat panel display, and the like. Used.
- composition of a glass plate is not specifically limited, For example, it can apply to the glass plate of the following composition ratios.
- P RO: 5 to 20% by mass (wherein R is at least one selected from Mg, Ca, Sr and Ba, and is the total content of RO),
- the glass plate cut to a predetermined length is conveyed at a conveyance speed of 10 m / min or more, and the end surface of the glass plate is ground and polished.
- the glass forming method is not limited to the downdraw method, and may be formed by other methods such as a float method.
- FIG. 1 is a diagram showing a flow of processing of an end face of a glass plate in one line during a manufacturing process of a glass plate manufacturing method or a display glass substrate manufacturing method of the present embodiment.
- the glass plate end face processing line 10 is provided with a first chamfering machine 12, a second chamfering machine 14, a corner cutting machine 16, and a reversing machine 18.
- the 1st chamfering machine 12, the reversing machine 18, the 2nd chamfering machine 14, and the corner cutting machine 16 are arrange
- FIG. 2 is a perspective view showing the first grinding wheel and the second grinding wheel in the first chamfering machine 12 and the second chamfering machine 14.
- the first chamfering machine 12 uses the diamond wheel 12a for grinding provided on both sides of the conveyance path on the short side end surface of the rectangular glass plate G. Is used for grinding. As shown in FIG. 2, diamond wheel 12a in the direction of the rotation axis Z, and is configured in the first grinding wheel 12a 1 and second 2-stage grinding wheel 12a 2.
- the first grinding wheel 12a 1 is a grinding wheel in which diamond abrasive grains are hardened with a metallic binder containing iron.
- First binding agent of the grinding wheel 12a 1 are those hardness and rigidity higher than the second binding agent of the grinding wheel 12a 2 are used.
- the hardness is Shore hardness
- the rigidity is Young's modulus.
- the binder of the first grinding wheel 12a 1 is a metal, other metal binders such as cobalt and bronze may be used.
- the higher the second hardness and rigidity than the binding agent of the grinding wheel 12a 2 is a binder of the ceramic membrane may be used as the first binding agent of the grinding wheel 12a 1.
- first grinding wheel 12a 1 diamond abrasive grains having a particle size of about # 300 to # 400 defined by JIS R6001-1987 can be used, for example.
- the first grinding wheel 12a 1 uses a diamond abrasive grains of grain size of # 400.
- the abrasive grains are not limited to diamond but may be CBN (borazone).
- First granularity of the grinding wheel 12a 1 may be the second grinding wheel 12a whether or rougher than equal the diamond abrasive particle size 2.
- the second grinding wheel 12a 2 is a grinding wheel in which diamond abrasive grains are hardened with a resin-based binder containing epoxy. Binding agent of the second grinding wheel 12a 2 of the diamond abrasive grains as hardness and rigidity is lower than the first binding agent of the grinding wheel 12a 1 is used. A low second binding agent of the grinding wheel 12a 2 has hardness and synthetic than the first binding agent of the grinding wheel 12a 1, it may be used a binder of the ceramic electrolyte. As long as the binder of the second grinding wheel 12a 2 is resin-based, for example, a polyimide-based material may be used.
- the second abrasive grinding wheel 12a 2 is not limited to diamond, it may be CBN.
- the second grinding wheel 12a 2 uses a diamond abrasive grain size of ⁇ 400 defined by JIS R6001-1987.
- the first abrasive grain size of the grinding wheel 12a 1 is preferable for the second whether or coarser than equal abrasive grain of the grinding wheel 12a 2, it is performed efficiently grinding.
- the glass plate G is conveyed in the conveying direction indicated by the arrow in FIG. 1, and the grinding groove W indicated by the dotted line in FIG. 2 of the first grinding wheel 12a1.
- the first grinding wheel 12a 1 grinds the end surface of the glass plate G by a predetermined grinding amount.
- the end surface of the glass plate G retreats to the center side of the glass plate from the original end surface, and the cross-sectional shape of the end surface has a curvature corresponding to the cross-sectional shape of the grinding groove W of the first grinding wheel 12a1. It is ground into a convex shape.
- the grinding amount is the distance from the position of the original end face before grinding to the position of the apex of the convex end face after grinding which has been ground and retreated. That is, the amount of the end face of the glass plate G ground in a direction parallel to the main surface of the glass plate G.
- Grinding amount of the first glass sheet G by the grinding wheels 12a 1 is, for example, in the range from 40 ⁇ m to 60 [mu] m. It is preferable that the conveyance speed of the glass plate G in a 1st grinding process is 10 m / min or more from a viewpoint of ensuring productivity. In this embodiment, the conveyance speed of the glass plate G is 10 m / min.
- the glass plate G has a maximum height Rmax defined by JIS B B0601-1982 of at least 10 ⁇ m and 18 ⁇ m, more preferably 13 ⁇ m and 14 ⁇ m.
- the end face of G is ground.
- the arithmetic average roughness Ra of the end face of the glass plate G defined by JIS B 0601-1982 is, for example, about 0.5 ⁇ m.
- the diamond wheel 12 a moves in the direction of the rotation axis Z so that the grinding groove W of the second grinding wheel 12 a 2 corresponds to the position of the end face of the glass plate G.
- the glass plate G is conveyed in the direction opposite to the arrow in FIG. 1, and the end surface is ground by the grinding groove W of the second grinding wheel 12a 2 during this conveyance.
- the cross-sectional shape of the end surface of the glass plate G is ground into a convex shape with a curvature corresponding to the cross-sectional shape of the grinding groove W of the second grinding wheel 12a2.
- the grinding amount of the glass plate G by the second grinding wheel 12a 2 is in the range of 10 ⁇ m to 30 ⁇ m, for example.
- the conveyance speed of the glass plate G in the second grinding step is preferably 10 m / min or more, and more preferably 15 m / min or more from the viewpoint of ensuring productivity. In this embodiment, the conveyance speed of the glass plate G is 15 m / min. It is preferable that the conveyance speed of the glass plate G in a 2nd grinding process is larger than the conveyance speed of the glass plate G in a 1st grinding process.
- the end surface of the glass plate G is adjusted so that the maximum height Rmax defined by JIS B B0601-1982 of the end surface of the glass plate G is at least 4 ⁇ m and not more than 8 ⁇ m, more preferably about 6 ⁇ m. Grind. Further, the arithmetic average roughness Ra of the end surface of the glass plate G is, for example, about 0.1 ⁇ m to 0.2 ⁇ m.
- the rotation direction of the outer peripheral surface of the grinding wheel 12a in the point which contacts the glass plate G may be set so that it may become the same as the conveyance direction of the glass plate G, and vice versa. May be set in the direction.
- the rotation direction of the outer peripheral surface of the grinding wheel 12a at the point of contact with the glass plate G in the first grinding step is opposite to the conveying direction of the glass plate G, and the glass in the second grinding step.
- the grinding wheel 12a is rotated in one direction so as to be in the same direction as the conveying direction of the plate G.
- the end face of the glass G ground in the second grinding process is polished by the polishing wheels 12b provided on both sides of the conveyance path.
- the polishing wheel 12b for example, a resin-bonded polishing wheel having flexibility and elasticity as disclosed in JP-A-2001-259978 can be used.
- the resin bonded grinding wheel in terms of ensuring the flexibility and elasticity the elastic coefficient of the resin bonded abrasive wheel is preferably for example, 50 ⁇ 10000kg / cm 2, alternatively from 500 ⁇ 7000kg / cm 2.
- the Shore D hardness of the resin bonded polishing wheel is preferably 10 to 95 or 40 to 80, for example, and the density of the resin bonded polishing wheel is preferably 0.4 to 2.5 g / cm 3 , for example. preferable.
- This application refers to Japanese Patent Laid-Open No. 2001-259978.
- the polishing wheel 12b which is a resin-bonded polishing wheel, is obtained by hardening abrasive grains normally used for polishing materials such as SiC, Al 2 O 3 and CeO 2 with a resin binder having flexibility and elasticity.
- abrasive grains normally used for polishing materials such as SiC, Al 2 O 3 and CeO 2
- a resin binder having flexibility and elasticity.
- the grain size of the abrasive grains of the polishing wheel 12b for example, about # 300 to # 500 defined by JIS R6001-1987 can be used.
- the particle size of the polishing wheel 12b is # 400.
- the resin binder for example, a polyurethane or polyimide binder can be used.
- polishing process is 15 m / min or more from a viewpoint of ensuring productivity.
- the conveyance speed of the glass plate G is 20 m / min, for example.
- the rotation direction of the polishing wheel 12b may be set so that the rotation direction of the outer peripheral surface of the grinding wheel 12b at the point of contact with the glass plate G is the same as the conveyance direction of the glass plate G.
- the reverse direction may be set.
- the rotation direction of the polishing wheel 12b is set so that the rotation direction of the outer peripheral surface of the polishing wheel 12b at the point of contact with the glass plate G is opposite to the conveyance direction of the glass plate G. .
- the end surface of the glass plate G is polished so that the maximum height Rmax of the end surface of the glass plate G is less than 4 ⁇ m, preferably 3.5 ⁇ m or less.
- the average roughness Ra of the end face of the glass plate G is, for example, about 0.03 ⁇ m to 0.06 ⁇ m.
- grinding and polishing of the end face of the glass plate G are clearly distinguished. That is, the grinding is a process of forming the cross-sectional shape of the end face of the glass plate G into a desired shape by scraping the glass, and involves a grinding amount of at least several ⁇ m.
- the polishing is a process for improving the surface quality of the end face of the glass plate G by reducing or removing the fine unevenness by leveling the fine unevenness of the end face of the glass plate G. Therefore, there is almost no change in the cross-sectional shape of the end face of the glass plate G depending on the polishing, which is a process including a surface treatment called so-called mirror finish. That is, the polishing step polishes the end surface of the glass plate G while maintaining the shape of the end surface of the glass plate G without substantially changing the shape of the end surface of the glass plate G ground by the grinding step. .
- polishing is performed using the polishing wheel 12b.
- polishing may be performed using a known tape polishing technique, pad polishing technique, brush polishing technique, or magnetic fluid finishing technique instead of the polishing wheel 12b. it can.
- the end face is ground and polished without moving the diamond wheel 12a and the polishing wheel 12b in the conveying direction of the glass plate G.
- the end face of the glass plate G may be ground and polished by moving the diamond wheel 12a and / or the polishing wheel 12b.
- the second chamfering machine 14 includes a diamond wheel 14 a similar to the diamond wheel 12 a of the first chamfering machine 12. As shown in FIG. 2, the diamond wheel 14 a is similar to the first grinding wheel 12 a 1 and the second grinding wheel 12 a 2 of the first chamfering machine 12, and the first grinding wheel 14 a 1 and the second grinding wheel 14 a 2. And.
- the rectangular glass plate G with respect to the end face of the long side, the first grinding wheel 14a 1 of the diamond wheel 14a provided on both sides of the conveyance path similar to the first chamfering machine 12 A first grinding step is performed. Then, the end face of the long sides of the rectangular glass plate G, a second grinding step similar to the first chamfering machine 12 is performed by the second grinding wheel 14a 2.
- the end face of the glass plate G that has been ground using the polishing wheels 14b provided on both sides of the conveyance path is polished.
- the grinding wheel 14 b is configured in the same manner as the grinding wheel 12 b of the first chamfering machine 12.
- the glass plate G is conveyed to the corner cutting machine 16, and the corners of the glass plate G are ground and polished using the corner cutting diamond wheel 16a.
- the glass plate G is shipped as a product through a cleaning process and an inspection process.
- the end face of the glass plate G is ground by grinding with the first grinding wheels 12a 1 and 14a 1 which are metal bond diamond wheels in which diamond abrasive grains are hardened with a metal binder, and the diamond abrasive grains are heated. This is performed in two stages: grinding with the second grinding wheels 12a 2 and 14a 2 which are resin bond diamond wheels hardened with a curable resin binder.
- Metal-bonded diamond wheels that is, grinding wheels that use metal binders, can grind with an emphasis on the grinding quality depending on the particle size and binder specifications, and can perform high-speed grinding with an emphasis on the grinding processing capacity. Any grinding specification can be set. With wheel specifications that focus on grinding processing capacity, damage to the glass plate increases as the processing capacity to grind the glass plate increases, and the quality of the end surface of the glass plate, such as surface roughness and chipping, may be sacrificed. is there. Therefore, when it is going to maintain the quality of the end surface of a glass plate, the metal bond diamond wheel of the specification which attached importance to the grinding quality will be used.
- Resin bond diamond wheel that is, a grinding wheel using a thermosetting resin binder is rich in cushioning and high in flexibility as compared with a grinding wheel using a metal binder. Therefore, the damage given to the end surface of the glass plate G is suppressed as much as possible, and delicate grinding is possible. Therefore, the surface roughness of the end surface of the glass plate G becomes smaller than that of a grinding wheel using a metal binder.
- the above-mentioned grinding can suppress the glass particles which generate
- a wiring / electrode material with low adhesion in a panel of an organic EL (Elector-Luminescence) TFT (Thin Film Transistor) panel display or a TFT panel display for high-definition liquid crystal.
- a low-resistance Cu-based electrode material can be used although the adhesion is lower than that of an Al-based electrode, Cr, or Mo electrode.
- the maximum height Rmax is used as an index of surface roughness.
- minute unevenness is formed on the end face of the glass plate G, but the recess is considered to be dominant over the protrusion. Therefore, by using the maximum height Rmax as an index of surface roughness, it is possible to prevent an extremely deep recess from being formed. Thereby, the amount of particles clogged in the recesses on the end face of the glass plate G can be reduced, the amount of particles adhering to the surface of the glass plate G can be reduced, and the quality of the glass plate G can be improved. Moreover, the strength of the glass plate can be improved by preventing an extremely deep recess from being formed on the end face of the glass plate G.
- the conveyance direction of the glass plate G in a 2nd grinding process is a reverse direction with the conveyance direction of the glass plate G in a 1st grinding process. Therefore, compared with the case where the glass plate G is conveyed in one direction, a conveyance line can be shortened and grinding apparatuses, such as the 1st chamfering machine 12 and the 2nd chamfering machine 14, can be made compact.
- the first rotational direction of the grinding wheel 12a 1 at the point where the first grinding wheel 12a 1 comes in contact with the glass sheet G is the direction of the conveying direction opposite the glass sheet G. Thereby, the speed difference between the glass plate G and the first grinding wheel 12a 1 is increased, and the end face shape can be processed more quickly.
- the second rotational direction of the grinding wheel 12a 2 at the point where the second grinding wheel 12a 2 is in contact with the glass sheet G is in the same direction as the conveying direction of the glass sheet G.
- the glass plate used in the present embodiment has a thickness of 0.25 mm to 0.7 mm, preferably 0.3 to 0.5 mm.
- the unevenness of the end face of the glass plate G can be sufficiently reduced and the quality of the product can be improved while ensuring the productivity.
- the end surface processing line 10 of the glass plate G is not limited to said structure.
- the first chamfering machine 12 may have the functions of the corner cutting machine 16 and the reversing machine 18, and the corner cutting machine 16 and the reversing machine 18 may be omitted.
- the following (1) to (5) can be performed in one chamfering machine. (1) After conveying the glass plate G in the conveyance direction and performing a corner cut, the first grinding process of the long side of the glass plate G is performed, and further the corner cut is performed.
- the glass plate G is conveyed in the direction opposite to the conveying direction, and the second grinding step for the long side of the glass plate G is performed.
- the glass plate G is rotated by 90 °.
- the first grinding step of the short side of the glass plate is performed, and further the corner cut is performed.
- the glass plate G is conveyed in the direction opposite to the conveying direction, and the second grinding step of the short side of the glass plate G is performed.
- the corner cut of the process of (4) is performed only when the dimension to cut is large.
- the first grinding wheel 12a 1 used in the first grinding process can be used.
- the chamfering machine that performs grinding and the polishing machine that performs polishing may be separate devices.
- Examples and comparative examples Hereinafter, the Example based on said embodiment and the comparative example different from this embodiment are demonstrated.
- the first grinding step, the second grinding step, and the polishing step were performed on the end face of the glass plate G having a thickness of 0.5 mm.
- the above polishing process was performed after grinding using only the diamond wheel using the same metal binder as the first grinding wheel 12a1 in the above embodiment. .
- the outer diameter of the diamond wheel 12a used in the examples and comparative examples was 250 mm, and the outer diameter of the polishing wheel 14b was 150 mm.
- the rotation speed of the grinding wheel 12a in the first grinding process is 2298 rpm
- the rotation speed of the grinding wheel 12a in the second grinding process is 3000 rpm
- the rotation speed of the polishing wheel 14b in the polishing process is 2500 rpm. did.
- the diamond abrasive grain size of the diamond wheel used in the first grinding step was # 400 in the example and # 500 in the comparative example, and an iron-based binder was used as the metal binder.
- the diamond wheel used in the second grinding step had a diamond abrasive grain size of # 400, and an epoxy binder was used as the resin binder.
- the abrasive used in the polishing step was SiC, the particle size was # 400, and a polyurethane binder was used as the resin binder having flexibility and elasticity. Under this condition, the end face of the glass plate was ground and polished.
- the conveyance speed of the glass plate was 10 m / min in the first grinding process, 15 m / min in the second grinding process, and 20 m / min in the polishing process.
- the conveying speed of the glass plate was 7 m / min in the grinding process, and 20 m / min in the polishing process in the polishing process.
- the grinding amount of the end face of the glass plate was 40 ⁇ m to 60 ⁇ m in the first grinding process of the example, and 90 ⁇ m to 110 ⁇ m in the grinding process of the comparative example. Thereafter, in the second grinding step performed in the example, the grinding amount of the end face of the glass plate was 10 ⁇ m to 30 ⁇ m. In the examples and comparative examples, thereafter, polishing was performed using a polishing wheel similar to the polishing wheel 14b in the above embodiment.
- the amount of particles on the end face of the glass plate subjected to grinding and polishing based on the above example and the amount of particle on the end face of the glass plate subjected to grinding and polishing based on the above comparative example were measured and compared.
- the amount of particles was measured by sucking the end surface of the glass plate using a particle counter having a suction device. Specifically, by sliding against the end face of the glass plate while pressing a soft scraping member softer than the glass plate, the end face of the glass plate is rubbed to scrub particles on the end face, and the scraped particles
- the particles on the end face of the glass plate were measured by sucking and counting the number with a particle counter.
- Such a measuring method is described in detail in, for example, Japanese Patent Application Laid-Open No. 2010-230646.
- the amount of particles was reduced by about 30% compared to the sample of the comparative example.
- Arithmetic average roughness Ra specified in JIS B1-0601-1982 of the end face of the glass plate ground and polished according to the above example, and the arithmetic average of the end face of the glass plate ground and polished according to the above comparative example The roughness Ra was compared. In the sample of the above example, Ra was around 0.05 ⁇ m, and Ra was reduced by about 37% compared to the sample of the above comparative example.
- arithmetic mean roughness Ra is the result measured using the Tokyo Seimitsu Co., Ltd. product, a roughness measuring device, and Surfcom (brand name). Note that the maximum height Rmax is also measured by the same method.
- the bending strengths of the glass plate subjected to grinding and polishing based on the above example and the glass plate subjected to grinding and polishing based on the above comparative example were compared.
- the 0.1% breakage rate was improved by about 5 to 10 MPa compared with the glass plate sample of the comparative example, and it was confirmed that the mechanical strength of the glass plate was improved.
- the bending strength of the glass plate was measured by a 4-point bending test.
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Abstract
Description
ガラス板の端面を研削する工程と、
研削後の前記ガラス板の端面を研磨する工程と、を含む。
前記ガラス板の端面を研削する工程は、
砥粒を第1の結合剤で固めた第1の研削ホイールを用いて前記ガラス板の端面を研削する第1の研削工程と、
前記第1の研削工程の後、砥粒を前記第1の結合材よりも硬度及び剛性が低い第2の結合剤で固めた第2の研削ホイールを用いて前記ガラス板の端面を研削する第2の研削工程と、を有する。
また、前記研磨工程は、前記研削工程により研削された端面を鏡面加工することが好ましい。
前記第2の研削工程における前記ガラス板の搬送方向が、前記第1の研削工程における前記ガラス板の搬送方向と逆方向である。
前記第2の研削工程における前記ガラス板の搬送速度は例えば15m/分以上である。
前記第1の研削ホイールの砥粒の粒度が、前記第2の研削ホイールの砥粒の粒度と等しいか又はそれよりも粗いことが好ましい。
前記ガラス板の端面の断面形状は曲率のついた凸形状に形成され、前記ガラス板の端面の、JIS B 0601-1982で規定される最大高さRmaxが4μm未満であり、JIS B 0601-1982で規定される算術平均粗さRaが0.06μm以下である。
ガラス基板の端面を研削して前記端面を曲率のついた凸形状に研削する工程と、
研削後の前記ガラス基板の端面を実質的に形状変化させることなく研磨する工程と、
を含む。
前記ガラス基板の端面を研削する工程は、
砥粒を第1の結合剤で固めた第1の研磨ホイールを用いて、前記ガラス基板の端面をJISB0601-1982で規定される最大高さRmaxが10μm以上かつ18μm以下になるよう研削する第1の研削工程と、
前記第1の研削工程の後、砥粒を前記第1の結合剤よりも硬度及び剛性が低い第2の結合剤で固めた第2の研削ホイールを用い、前記第2の研削ホイールによる研削量を、前記Rmaxとして測定された数値以上とする第2の研削工程と、を有する。
本実施形態で製造されるガラス板は、特に限定されないが、例えば、携帯電子機器等の電子機器の表示画面に用いるカバーガラスや、フラットパネルディスプレイ等の表示装置のディスプレイ用ガラス基板等に好適に用いられる。
(a)SiO2:50~70質量%、
(b)B2O3:5~18質量%、
(c)Al2O3:10~25質量%、
(d)MgO:0~10質量%、
(e)CaO:0~20質量%、
(f)SrO:0~20質量%、
(o)BaO:0~10質量%、
(p)RO:5~20質量%(ただしRはMg、Ca、SrおよびBaから選ばれる少なくとも1種であり、ROの含有量の合計である)、
(q)R’2O:0.20質量%を超え2.0質量%以下(ただしR’はLi、NaおよびKから選ばれる少なくとも1種であり、R’2Oの含有量の合計である)、
(r)酸化スズ、酸化鉄および酸化セリウムから選ばれる少なくとも1種の金属酸化物を合計で0.05~1.5質量%。
なお、第1の研削ホイール12a1の砥粒の粒度は、第2の研削ホイール12a2の砥粒の粒度と等しいか又はそれよりも粗い、ことが研削を効率よく行う上で好ましい。
面形状に対応して曲率のついた凸形状に研削される。ここで、研削量とは、研削前の元の端面の位置から、研削されて後退した研削後の凸形状の端面の頂点の位置までの距離である。すなわち、ガラス板Gの端面がガラス板Gの主表面と平行な方向に研削された量である。第1の研削ホイール12a1によるガラス板Gの研削量は、例えば40μmから60μmまでの範囲内である。第1の研削工程におけるガラス板Gの搬送速度は、生産性を確保する観点から10m/分以上であることが好ましい。本実施形態では、ガラス板Gの搬送速度は10m/分である。
なお、本実施形態では、ガラス板Gの端面の研削と研磨とを明確に区別している。すなわち、研削とは、ガラスを削り取ることによりガラス板Gの端面の断面形状を所望の形状に成形する加工であり、少なくとも数μmの研削量を伴う。したがって、研削によっては、最終的な製品となる板ガラスGの端面の上記のような表面品位を得ることはできない。
これに対して研磨とは、ガラス板Gの端面の微小な凹凸をならすことで、微小な凹凸を低減又は除去し、ガラス板Gの端面の表面品位を向上させる加工である。したがって、研磨によってはガラス板Gの端面の断面形状にほとんど変化はなく、いわゆる鏡面加工と呼ばれるような表面処理を含む加工である。すなわち、研磨工程は、研削工程により研削されたガラス板Gの端面の形状を実質的に変化させることなく、言い換えるとガラス板Gの端面の形状を維持しつつ、ガラス板Gの端面を研磨する。
また、本実施形態では、研磨ホイール12bを用いて研磨を行うが、研磨ホイール12bの代わりに公知のテープ研磨技術、パッド研磨技術、ブラシ研磨技術、磁性流体仕上げ技術を用いて研磨を行うこともできる。
また、第1の研削ホイール12a1がガラス板Gと接触する点における第1の研削ホイール12a1の回転方向は、ガラス板Gの搬送方向と逆の方向である。これにより、ガラス板Gと第1研削ホイール12a1との速度差を上昇させ、より迅速に端面形状を加工することが可能になる。
また、第2の研削ホイール12a2がガラス板Gと接触する点における第2の研削ホイール12a2の回転方向は、ガラス板Gの搬送方向と同じ方向である。これにより、生産性を確保しつつ、ガラス板Gと第2の研削ホイール12a2との速度差を減少させ、より高品位な端面に加工することが可能になる。
本実施形態に用いられるガラス板の厚さは、0.25mm~0.7mmであり、好ましくは0.3~0.5mmである。
なお、ガラス板Gの端面加工処理ライン10は、上記の構成に限定されない。例えば、第1の面取り機12にコーナーカット機16及び反転機18の機能を持たせ、コーナーカット機16及び反転機18を省略することもできる。この場合、次の(1)から(5)を1つの面取り機において行うことができる。
(1)ガラス板Gを搬送方向に搬送し、コーナーカットを行った後、ガラス板Gの長辺の第1の研削工程を行い、さらにコーナーカットを行う。
(2)ガラス板Gを搬送方向と逆方向に搬送し、ガラス板Gの長辺の第2の研削工程を行う。
(3)ガラス板Gを90°回転させる。
(4)ガラス板Gを搬送方向に搬送し、コーナーカットを行った後、ガラス板の短辺の第1の研削工程を行い、さらにコーナーカットを行う。
(5)ガラス板Gを搬送方向と逆方向に搬送し、ガラス板Gの短辺の第2の研削工程を行う。
なお、(4)の工程のコーナーカットは、カットする寸法が大きい場合のみ行う。コーナーカットについては、第1の研削工程で使用した第1の研削ホイール12a1を使用することができる。なお、研削を行う面取り機と、研磨を行う研磨機とを別の装置としても良い。
以下、上記の実施形態に基づく実施例と、本実施形態と異なる比較例について説明する。
実施例及び比較例では、その後、上記の実施形態における研磨ホイール14bと同様の研磨ホイールを用いて研磨を行った。
12 第1面取り機
12a 第2面取り機
12a1,14a1 第1の研削ホイール
12a2,14a2 第2の研削ホイール
12b,14b 研磨ホイール
14 第2面取り機
14a ダイヤモンドホイール
16 コーナーカット機
16a コーナーカット用ダイヤモンドホイール
18 反転機
Claims (18)
- ガラス板の製造方法であって、
ガラス板の端面を研削する工程と、
研削後の前記ガラス板の端面を研磨する工程と、を含み、
前記ガラス板の端面を研削する工程は、
砥粒を第1の結合剤で固めた第1の研削ホイールを用いて前記ガラス板の端面を研削する第1の研削工程と、
前記第1の研削工程の後、砥粒を前記第1の結合材よりも硬度及び剛性が低い第2の結合剤で固めた第2の研削ホイールを用いて前記ガラス板の端面を研削する第2の研削工程と、
を有するガラス板の製造方法。 - 前記第1の結合剤は金属結合剤であり、前記第2の結合剤は樹脂結合剤である、
請求項1に記載のガラス板の製造方法。 - 前記第1の研削工程において、前記ガラス板の端面は、JIS B 0601-1982で規定される最大高さRmaxが10μm以上かつ18μm以下になるように研削され、
前記第2の研削工程において、前記ガラス板の端面は前記最大高さRmaxが4μm以上かつ8μm以下になるように研削される、
請求項1または2に記載のガラス板の製造方法。 - 前記ガラス板を研磨する工程において、前記ガラス板の端面は最大高さRmaxが4μm未満になるように研磨される、
請求項1~3のいずれか1項に記載のガラス板の製造方法。 - 前記第1の研削工程における前記ガラス板の端面の研削量が、40μm以上かつ60μm以下であり、
前記第2の研削工程における前記ガラス板の端面の研削量が、10μm以上かつ30μm以下である、
請求項1~4のいずれか1項に記載のガラス板の製造方法。 - 前記研磨工程は、前記研削工程により研削された前記ガラス基板の端面の形状を実質的に変化させることなく研磨する、請求項5に記載のガラス板の製造方法。
- 前記研磨工程は、前記研削工程により研削された端面を鏡面加工する、請求項5または6に記載のガラス板の製造方法。
- 前記ガラス板を搬送しながら前記第1の研削工程、前記第2の研削工程、及び前記ガラス板を研磨する工程を行い、
前記第2の研削工程における前記ガラス板の搬送方向が、前記第1の研削工程における前記ガラス板の搬送方向と逆方向である、
請求項1~7のいずれか1項に記載のガラス板の製造方法。 - 前記第1の研削ホイールが前記ガラス板と接触する点における前記第1の研削ホイールの回転方向は、前記ガラス板の搬送方向と逆の方向であり、
前記第2の研削ホイールが前記ガラス板と接触する点における前記第2の研削ホイールの回転方向は、前記ガラス板の搬送方向と同じ方向である、
請求項8に記載のガラス板の製造方法。 - 前記ガラス板の搬送速度は、10m/分以上である、
請求項8または9に記載のガラス板の製造方法。 - 前記第2の研削工程における前記ガラス板の搬送速度は15m/分以上である、
請求項10に記載のガラス板の製造方法。 - 前記第1の研削ホイール及び前記第2の研削ホイールの砥粒はダイヤモンド砥粒であり、
前記第1の研削ホイールの砥粒の粒度が、前記第2の研削ホイールの砥粒の粒度と等しいか又はそれよりも粗い、
請求項1~11のいずれか1項に記載のガラス板の製造方法。 - 前記ガラス板を研磨する工程において、前記ガラス板の端面を研磨する研磨ホイールの結合剤は発泡弾性体材料であり、砥粒はSiC、Al2O3、又はCeO2から選ばれる一種以上の材質により形成されている、
請求項1~12のいずれか1項に記載のガラス板の製造方法。 - 前記ガラス板は、フラットパネルディスプレイの表示装置の基板、あるいは、電子機器の表示画面のカバーガラスに用いられ、
前記ガラス板は、ダウンドロー法又はフロート法により成形される、
請求項1~13のいずれか1項に記載のガラス板の製造方法。 - 請求項1~14のいずれか1項に記載のガラス板の製造方法により製造されたガラス板であって、
前記ガラス板の端面の断面形状は曲率のついた凸形状に形成され、
前記ガラス板の端面の、JIS B 0601-1982で規定される最大高さRmaxが4μm未満であり、JIS B 0601-1982で規定される算術平均粗さRaが0.06μm以下である、
ガラス板。 - ディスプレイ用ガラス基板の製造方法であって、
ガラス基板の端面を研削して前記端面を曲率のついた凸形状に研削する工程と、
研削後の前記ガラス基板の端面を実質的に形状変化させることなく研磨する工程と、
を含み、
前記ガラス基板の端面を研削する工程は、
砥粒を第1の結合剤で固めた第1の研磨ホイールを用いて、前記ガラス基板の端面をJISB0601-1982で規定される最大高さRmaxが10μm以上かつ18μm以下になるよう研削する第1の研削工程と、
前記第1の研削工程の後、砥粒を前記第1の結合剤よりも硬度及び剛性が低い第2の結合剤で固めた第2の研削ホイールを用い、前記第2の研削ホイールによる研削量を、前記Rmaxとして測定された数値以上とする第2の研削工程と、
を有するディスプレイ用ガラス基板の製造方法。 - 前記第2の研削工程における前記ガラス板の端面の研削量が、10μm以上かつ30μm以下である、
請求項16に記載のディスプレイ用ガラス基板の製造方法。 - 前記ガラス基板の厚さは0.25mm~0.7mmである、
請求項16または17に記載のディスプレイ用ガラス基板の製造方法。
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- 2013-01-11 WO PCT/JP2013/050456 patent/WO2013108725A1/ja active Application Filing
- 2013-01-11 CN CN201380000779.0A patent/CN103492122B/zh active Active
- 2013-01-11 KR KR1020137022175A patent/KR101513825B1/ko active IP Right Grant
- 2013-01-18 TW TW102102092A patent/TWI488822B/zh active
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Publication number | Priority date | Publication date | Assignee | Title |
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WO2015118490A1 (en) * | 2014-02-07 | 2015-08-13 | Willem Mirani | Apparatus for working elements made of stone-like material, ceramic material, stone-resinoid agglomerate, glass and/or quartz-resinoid agglomerate and derivatives thereof or the like, even with high hardness |
WO2016098824A1 (ja) * | 2014-12-19 | 2016-06-23 | 旭硝子株式会社 | ガラス板の面取り装置、ガラス板の面取り方法、及びガラス板の製造方法 |
CN107107295A (zh) * | 2014-12-19 | 2017-08-29 | 旭硝子株式会社 | 玻璃板的倒角装置、玻璃板的倒角方法、以及玻璃板的制造方法 |
JPWO2016098824A1 (ja) * | 2014-12-19 | 2017-09-28 | 旭硝子株式会社 | ガラス板の面取り装置、ガラス板の面取り方法、及びガラス板の製造方法 |
CN107107295B (zh) * | 2014-12-19 | 2019-03-08 | Agc株式会社 | 玻璃板的倒角装置、玻璃板的倒角方法、以及玻璃板的制造方法 |
WO2016203914A1 (ja) * | 2015-06-19 | 2016-12-22 | バンドー化学株式会社 | 研磨材及び研磨材の製造方法 |
JP6085723B1 (ja) * | 2015-06-19 | 2017-02-22 | バンドー化学株式会社 | 研磨材及び研磨材の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI488822B (zh) | 2015-06-21 |
JP5456942B2 (ja) | 2014-04-02 |
TW201336792A (zh) | 2013-09-16 |
CN103492122B (zh) | 2016-05-04 |
SG192302A1 (en) | 2013-08-30 |
KR20130138819A (ko) | 2013-12-19 |
JPWO2013108725A1 (ja) | 2015-05-11 |
KR101513825B1 (ko) | 2015-04-20 |
CN103492122A (zh) | 2014-01-01 |
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