WO2011136262A1 - 有機el照明装置 - Google Patents
有機el照明装置 Download PDFInfo
- Publication number
- WO2011136262A1 WO2011136262A1 PCT/JP2011/060239 JP2011060239W WO2011136262A1 WO 2011136262 A1 WO2011136262 A1 WO 2011136262A1 JP 2011060239 W JP2011060239 W JP 2011060239W WO 2011136262 A1 WO2011136262 A1 WO 2011136262A1
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- Prior art keywords
- organic
- lighting device
- anode
- cathode
- electrode
- Prior art date
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Images
Classifications
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- H—ELECTRICITY
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- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/06—Electrode terminals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
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- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
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- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10165—Functional features of the laminated safety glass or glazing
- B32B17/10541—Functional features of the laminated safety glass or glazing comprising a light source or a light guide
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K50/80—Constructional details
- H10K50/805—Electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H10K59/179—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
- F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/20—Electroluminescent [EL] light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/09027—Non-rectangular flat PCB, e.g. circular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/09836—Oblique hole, via or bump
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
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- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
Definitions
- the present invention relates to an organic EL lighting device.
- organic electroluminescent (hereinafter referred to as organic EL) lighting device As shown in FIGS. 39 and 40, anode terminal electrodes are respectively provided on four sides of a glass substrate 10 in order to cause a large area organic EL lighting panel to emit light uniformly. 11 are formed, and cathode terminal electrodes 12 are formed at four corners on the glass substrate 10, respectively.
- the solder is coated (hereinafter referred to as base solder) over the entire surface of the anode terminal electrode 11 and the surface of the cathode terminal electrode 12.
- a sealing can 14 for preventing the performance deterioration of the organic EL element 13 due to oxygen, water or the like is formed so as to cover the organic EL element 13.
- the anode terminal electrodes 11 are connected by anode lead wires 20 and the cathode terminal electrodes 12 are connected by cathode lead wires 21 by soldering.
- the anode lead wire 22 is connected to one place of the anode terminal electrode 11
- the cathode lead wire 23 is connected to one place of the cathode terminal electrode 12
- the anode lead wire 22 and the cathode lead wire A connector 24 is attached to the end of the connector 23. Then, a current is supplied from the connector 24 to the organic EL element 13.
- Patent Document 1 in an organic EL element comprising at least a transparent anode layer, an organic light emitting medium layer, and a cathode layer, the cathode layer side via an insulating layer
- An organic EL lighting device which comprises an auxiliary electrode layer laminated to and in contact with a transparent anode layer.
- Patent Document 2 as a conventional organic EL lighting device, an insulating protective film for protecting an organic EL element from oxygen and moisture is formed, and insulation with the upper electrode is secured by this protective film. In this state, connect the conductive film covering the upper electrode with the connection terminal of the lower electrode or a part of the end on the connection terminal side, and connect the other part to the end opposite to the connection terminal of the lower electrode.
- An organic EL lighting device is disclosed, wherein a conductive film is formed of a metal film, and a conductive film is formed on an insulating film.
- the auxiliary electrode for reducing the wiring resistance is formed only on one side of a transparent electrode such as indium tin oxide (hereinafter referred to as ITO) having high resistance.
- ITO indium tin oxide
- the four anode terminals 11 and the four cathode terminals 12 are connected by soldering using lead wires, but the four anode terminals 11 and the cathode are respectively connected. Since the work of connecting the terminal electrode 12 with the lead wire by the soldering method is very skillful, it is difficult to automate the wiring work. For this reason, it is difficult to improve productivity. Also, since solder is not easily placed on the anode terminal electrode 11 and the cathode terminal electrode 12 formed on the glass substrate 10, soldering is performed using ultrasonic solder. At this time, glass is used for ultrasonic soldering. The substrate 10 may be chipped off.
- a large-sized glass substrate is cut by scribing or breaking to obtain a desired panel size, and then base solder is formed on the entire surface of the anode terminal electrode 11 and the cathode terminal electrode 12 Manufactures organic EL lighting panels. For this reason, the cut surface of the four-direction end of the glass substrate 10 is sharp, and there is a possibility that the base solder may be exposed or the base solder may protrude. For this reason, when holding the organic EL lighting device, there is a problem in safety, such as a risk of injury due to a hand being cut or an electric shock.
- a protective film is formed on the cathode, the auxiliary electrode wiring and the like are laminated over the entire surface of the cathode, and the end of the auxiliary electrode wiring and the anode ITO are connected.
- the protective film is broken and the probability of occurrence of a short circuit between the cathode and the anode ITO becomes very high.
- the probability of occurrence of a short circuit between the cathode and the anode ITO is significantly increased, which is a major cause of yield reduction.
- an organic EL lighting device including a terminal electrode, a wiring substrate on which a circuit having an electrode corresponding to the position of each anode terminal electrode and a circuit having an electrode corresponding to the position of each cathode terminal electrode are formed And the like.
- An organic EL lighting device for solving the above problems is the organic EL lighting device according to the first invention, wherein the wiring substrate is formed so as to surround a part or all of the organic EL element. It is characterized by being done.
- An organic EL lighting device for solving the above-mentioned problems is the organic EL lighting device according to the second aspect, comprising a heat equalizing heat dissipation plate on the back surface, and the outer circumference of the heat equalizing heat dissipation plate It is characterized in that it is larger than the outer periphery of the glass substrate.
- An organic EL lighting device for solving the above-mentioned problems is characterized in that, in the organic EL lighting device according to the second invention, an outer periphery of the wiring substrate is made larger than an outer periphery of the glass substrate. I assume.
- An organic EL lighting device for solving the above problems is the organic EL lighting device according to the second aspect, wherein a feeding terminal portion for supplying current to the wiring substrate is formed. It features.
- An organic EL lighting device for solving the above-mentioned problems is characterized in that, in the organic EL lighting device according to the second aspect, a resin frame is provided around the substrate.
- the organic EL lighting device for solving the above-mentioned problems is the organic EL lighting device according to the first aspect, wherein the wiring substrate is an electrode corresponding to the position of each of the anode terminal electrodes. And a cathode flexible printed circuit board on which a circuit having an electrode corresponding to the position of each of the cathode terminal electrodes is formed.
- An organic EL lighting device for solving the above-mentioned problems is characterized in that in the organic EL lighting device according to the seventh invention, the side surface and the back surface end portion of the glass substrate are covered with an insulating film. I assume.
- An organic EL lighting device for solving the above problems is the organic EL lighting device according to the seventh invention, for supplying current to the anode flexible printed circuit and the cathode flexible printed circuit. A feed terminal portion is formed.
- An organic EL lighting device for solving the above-mentioned problems is characterized in that, in the organic EL lighting device according to the seventh aspect, a heat equalizing radiation plate is provided on the back surface.
- An organic EL lighting device for solving the above-mentioned problems is the organic EL lighting device according to any one of the first to tenth aspects of the present invention, wherein the organic EL element is sealed. It is characterized by sealing.
- An organic EL lighting device for solving the above-mentioned problems is a glass for sealing the organic EL element according to any one of the first to tenth aspects of the present invention. It seals by a substrate.
- An organic EL lighting device for solving the above-mentioned problems is the organic EL lighting device according to any one of the first to tenth aspects, wherein the organic EL element is formed of a sealing film. It is characterized by sealing.
- an organic EL lighting device capable of achieving automation of connection work and improvement of productivity.
- FIG. 2 is a cross-sectional view taken along the line AA in FIG.
- FIG. 2 is a cross-sectional view in a cross section shown by BB in FIG. 1
- FIG. 2 is a cross-sectional view in a cross section shown by CC in FIG. 1
- FIG. 8 is a cross-sectional view taken along the line AA in FIG. 7; It is a top view of the organic electroluminescent illuminating device based on the 3rd Example of this invention.
- FIG. 10 is a cross-sectional view taken along the line AA in FIG. 9; It is a top view of the organic electroluminescent illuminating device which concerns on the 4th Example of this invention.
- FIG. 12 is a cross-sectional view taken along the line AA in FIG. It is a top view of the organic electroluminescent illuminating device based on the 5th Example of this invention.
- FIG. 8 is a cross-sectional view taken along the line AA in FIG. 7; It is a top view of the organic electroluminescent illuminating device based on the 3rd Example of this invention.
- FIG. 10 is a cross-sectional view taken along the line AA in FIG. 9; It is a top view of the organic electroluminescent illuminating device which concerns
- FIG. 14 is a cross-sectional view taken along the line AA in FIG. It is a top view of the organic electroluminescent illuminating device based on the 6th Example of this invention.
- FIG. 16 is a cross-sectional view taken along the line AA in FIG. It is a top view of the organic electroluminescent illuminating device based on the 7th Example of this invention.
- FIG. 18 is a cross-sectional view taken along the line AA in FIG. It is a top view of the organic electroluminescent illuminating device based on the 8th Example of this invention.
- FIG. 20 is a cross-sectional view taken along the line AA in FIG.
- FIG. 20 is a cross-sectional view taken along a line BB in FIG.
- FIG. 23 is a cross-sectional view taken along the line AA in FIG.
- FIG. 23 is a cross-sectional view taken along a line BB in FIG.
- FIG. 26 is a cross-sectional view taken along the line AA in FIG.
- FIG. 26 is a cross sectional view taken along a line BB in FIG. 25.
- FIG. 29 is a cross sectional view taken along a line AA in FIG. FIG.
- FIG. 29 is a cross sectional view taken along a line BB in FIG. 28. It is a top view of the organic electroluminescent illuminating device based on the 12th Example of this invention. It is a top view of the organic electroluminescent illuminating device based on the 13th Example of this invention. It is a top view of the organic electroluminescent illuminating device based on the 14th Example of this invention.
- FIG. 34 is a cross sectional view taken along the line AA in FIG.
- FIG. 34 is a cross sectional view taken along a line BB in FIG. 33. It is a top view of the organic electroluminescent illuminating device based on the 15th Example of this invention.
- FIG. 34 is a cross sectional view taken along the line AA in FIG.
- FIG. 34 is a cross sectional view taken along a line BB in FIG. 33. It is a top view of the organic electroluminescent illuminating device based on the 15th Example of
- FIG. 37 is a cross sectional view taken along a line AA in FIG. 36.
- FIG. 37 is a cross sectional view taken along a line BB in FIG. 36.
- It is a top view of the conventional organic electroluminescent illuminating device.
- FIG. 39 is a cross sectional view taken along a line AA in FIG. 39. It is the top view which showed the wiring connection method using the lead wire in the conventional organic electroluminescent illuminating device. It is the top view which showed the electric power feeding terminal lead-out method using the lead wire in the conventional organic electroluminescent illuminating device.
- the organic EL lighting device according to the first embodiment of the present invention will be described below. First, an outline of the configuration of the organic EL lighting device according to the present embodiment will be described.
- the anode terminal electrode 11 and the four corners on the glass substrate 10 are provided on the four sides on the glass substrate 10 shown in FIGS.
- a cathode terminal electrode 12 and a sealing can 14 for preventing the performance deterioration of the organic EL element 13 due to oxygen, water or the like are provided so as to cover the organic EL element 13 on the glass substrate 10.
- the glass substrate 10 is used as the substrate in the present embodiment, it is also possible to use materials such as plastic, metal, ceramic and the like as the substrate.
- FIG. 1 is a plan view of the organic EL lighting device according to the present embodiment.
- FIG. 2 is a cross-sectional view taken along the line AA in FIG.
- FIG. 3 is a cross-sectional view in a cross section shown by BB in FIG.
- FIG. 4 is a cross-sectional view in a cross section shown by CC in FIG.
- the power supply terminal portion is omitted in FIGS. 1 to 4, the power supply terminal portion is actually formed.
- the organic EL lighting device As shown in FIG. 1, in the organic EL lighting device according to the present embodiment, power is equally supplied to the anode wiring 1a for supplying power equally to the four anode terminal electrodes 11 and to the cathode terminal electrodes 12 of four positions.
- the wiring substrate 1 is installed so as to surround the sealing can 14.
- the wiring board 1 is composed of a plurality of components, but the specific configuration will be described in detail later. Further, in the present embodiment, a glass epoxy substrate or a flexible printed substrate is used as the material of the wiring substrate 1. Further, in the present embodiment, the thickness of the wiring board 1 is about 0.2 to 0.5 mm.
- an anode electrode 1c connected to the anode terminal electrode 11 is formed at a position corresponding to the anode terminal electrode 11. Further, on the back surfaces of the four corners of the wiring substrate 1, cathode electrodes 1 d connected to the cathode terminal electrode 12 are formed at positions corresponding to the cathode terminal electrode 12.
- an anisotropic conductive film (hereinafter referred to as ACF; hereinafter referred to as an anisotropic conductive film) is attached to the anode electrode 1c and the cathode electrode 1d, or an anisotropic conductive paste (hereinafter referred to as an ACP; anisotropic conductive paste).
- ACF anisotropic conductive film
- ACP anisotropic conductive paste
- the anode wiring 1 a and the anode electrode 1 c are connected by an anode connection wiring 1 e passing through the through hole.
- the cathode wire 1 b and the cathode electrode 1 d are connected by a cathode connection wire 1 f which passes through the through hole. Therefore, circuits are formed by the wiring substrate 1 without the positive current and the negative current being short-circuited.
- anode terminal electrodes 11 and cathode terminal electrodes 12 are provided to supply current uniformly to the rectangular organic EL elements 13, four wiring boards 1 are provided.
- the anode electrode 1c at four locations and the cathode electrode 1d at four locations are formed.
- three anode terminal electrodes 11 and a cathode terminal electrode When the wiring board 12 is provided, three anode electrodes 1 c and three cathode electrodes 2 d may be formed on the wiring substrate 1.
- the wiring substrate 1 has five. It is also possible to form the anode electrode 1c at more than the location and the cathode electrode 1d at more than five locations.
- FIG. 5 is a schematic view showing the configuration of the wiring board 1 in the organic EL lighting device according to the present example.
- the wiring substrate 1 in the organic EL lighting device according to the present embodiment connects two L-shaped L-shaped wiring substrates 2 and two L-shaped L-shaped wiring substrates 2 And two L-shaped connecting L-shaped wiring boards 3 for connection.
- An anode 2 a and a cathode 2 b are formed at the end of the surface of the L-shaped wiring substrate 2.
- the anode electrode 1c and the anode electrode 2a are connected by the anode connection wiring 2c which passes through the through hole.
- the cathode electrode 1d and the cathode electrode 2b are connected by a cathode connection wiring 2d which passes through holes.
- the wiring board 1 is formed in a square shape by combining two L-shaped wiring boards 2 and two L-shaped wiring boards 3 for connection.
- the present invention is not limited to this, and a wiring board formed in a square shape from the beginning may be used.
- the wiring substrate 1 is not limited to a square shape, but may have a U-shape or a V-shape, and it may be formed so as to surround a part or all of the organic EL elements as necessary. Good.
- FIG. 6 is a schematic view showing the structure of the L-shaped wiring substrate 3 for connection in the organic EL lighting device according to this example.
- 6 (a) is a schematic view showing the structure on the front side of the L-shaped wiring board 3 for connection
- FIG. 6 (b) is a schematic view showing the structure on the back side of the L-shaped wiring board 3 for connection.
- FIG. 6 (a) is a schematic view showing the structure on the front side of the L-shaped wiring board 3 for connection
- FIG. 6 (b) is a schematic view showing the structure on the back side of the L-shaped wiring board 3 for connection.
- the anode wiring 3a is formed on the front surface side of the L-shaped wiring substrate 3 for connection. Further, as shown in FIG. 6B, the cathode wiring electrode 3b and the anode electrode 3c are formed on the back surface side of the L-shaped wiring substrate 3 for connection. As shown in FIG. 3, the anode wiring 3a and the anode electrode 3c are connected by the anode connection wiring 3d which passes through the through hole.
- the anode electrode 2a and the anode electrode 3c, and the cathode electrode 2b and the cathode wiring electrode 3b are connected by soldering.
- the anode electrode 2a and the anode electrode 3c and the cathode electrode 2b and the cathode wiring electrode 3b are connected by soldering, they may be connected by thermocompression bonding using ACF or ACP. .
- anode wiring 1a, the cathode wiring 1b and the anode wiring 3a are exposed to the outside for the sake of simplicity, they are made of a non-electrically conductive material to prevent short circuit and electric shock. It is desirable to coat as needed.
- wiring is performed by the wiring substrate 1 so that ACF is attached or ACP is applied using an automatic pressure bonding machine, and then wiring is performed by the wiring substrate 1 As a result, the yield and productivity can be improved.
- a thin insulating film (for example, 100 nm to 1000 nm) is coated on the upper electrode in contact with the organic EL element, and the insulating film is formed.
- An insulating film with a conductive film is formed thereon.
- the insulating film is a thin film, a short circuit occurs due to conductive foreign matter or the like, which causes a decrease in yield.
- the organic EL lighting device according to the present embodiment, shorting with the electrode formed on the organic EL element 13 is achieved by wiring around the sealing can 14 using the wiring substrate 1. Since no occurrence occurs, the yield can be greatly improved.
- thickness of an organic electroluminescent illuminating panel can be made thin compared with the past by using the thin wiring board 1.
- FIG. 7 is a plan view of the organic EL lighting device according to the present embodiment.
- FIG. 8 is a cross-sectional view taken along the line AA in FIG.
- the structure of the organic EL lighting device according to the present embodiment is almost the same as the structure of the organic EL lighting device according to the first embodiment, but as shown in FIGS. 7 and 8, the size of the wiring substrate 1 is enlarged. The point is different. As a result, the end face of the anode terminal electrode 11, the cathode terminal electrode 12, the glass substrate 10 and the like can be prevented from being directly touched by the operator.
- the outer periphery of the wiring substrate 1 is made larger than the outer periphery of the glass substrate 10 by about 0.5 to 3.0 mm.
- the anode terminal electrode 11, the cathode terminal electrode 12, the lead wire connection portion, the end face of the glass substrate 10, etc. are exposed.
- the organic EL lighting device in addition to the effects of the organic EL lighting device according to the first embodiment, the anode terminal electrode 11, the cathode terminal electrode 12 and Since the end face and the like of the glass substrate 10 can be protected so that the operator does not directly touch it, safety can be improved. Further, the end face of the glass substrate 10 can be protected from external impact by enlarging the size of the wiring board 1.
- FIG. 9 is a plan view of the organic EL lighting device according to this example.
- FIG. 10 is a cross-sectional view taken along the line AA in FIG. Although the connector is omitted in FIGS. 9 and 10, the connector is actually attached.
- the structure of the organic EL lighting device according to the present embodiment is substantially the same as the structure of the organic EL lighting device according to the first embodiment, but as shown in FIGS.
- the difference is that an anode feed terminal portion 4a formed from the anode wire 1a and a cathode feed terminal portion 4b protruded from the cathode wire 1b are formed in the protruding portion 4.
- the connector 24 can be directly connected to the anode feed terminal portion 4a and the cathode feed terminal portion 4b without using the anode lead wire 22 and the cathode lead wire 23 shown in FIG.
- the anode wiring 1a, the cathode wiring 1b, the anode wiring 3a, the anode feeding terminal portion 4a and the cathode feeding terminal portion 4b are exposed to the outside for the sake of simplicity. It is desirable to coat as needed with a non-electrically conductive material to avoid electrical shock.
- a lead wire having an outer diameter of 1.3 mm is drawn from the anode terminal electrode 11 and the cathode terminal electrode 12 at one of the anode terminal electrode 11 and the cathode terminal electrode 12 respectively.
- the lead wire protrudes by 0.3 mm or more, and it has not been possible to achieve sufficient thinning.
- the protruding portion 4 is formed on the wiring substrate 1 and the anode is formed on the protruding portion 4 Since the lead wire can be omitted by forming the anode feed terminal portion 4a protruding from the wiring 1a and the cathode feed terminal portion 4b protruding from the cathode wiring 1b, thinning of the organic EL lighting device or narrowing of the frame is achieved. Can be Furthermore, since the connector 24 can be used for simple connection, productivity can be improved and the manufacturing process can be simplified.
- FIG. 11 is a plan view of the organic EL lighting device according to the present example.
- FIG. 12 is a cross-sectional view taken along the line AA in FIG. Although the power supply terminal portion is omitted in FIGS. 11 and 12, the power supply terminal portion is actually formed.
- the structure of the organic EL lighting device according to the present embodiment is substantially the same as the structure of the organic EL lighting device according to the first embodiment, but as shown in FIGS.
- the point which provided 5 is different.
- the end face of the anode terminal electrode 11, the cathode terminal electrode 12, the glass substrate 10 and the like can be prevented from being directly touched by the operator.
- the resin frame 5 is attached to the glass substrate 10 with an acrylic double-sided tape, but an adhesive may be applied and attached.
- the anode terminal electrode 11, the cathode terminal electrode 12, the lead wire connection portion, the end face of the glass substrate 10, etc. are exposed.
- the organic EL lighting device in addition to the effects of the organic EL lighting device according to the first embodiment, the anode terminal electrode 11, the cathode terminal electrode 12 and the glass substrate by the resin frame 5 Since the end face and the like of 10 can be protected so that the operator does not touch it directly, safety can be improved. Further, the end face of the glass substrate 10 can be protected from external impact by enlarging the size of the wiring board 1.
- FIG. 13 is a plan view of the organic EL lighting device according to this example.
- FIG. 14 is a cross-sectional view taken along the line AA in FIG. Although the power supply terminal portion is omitted in FIGS. 13 and 14, the power supply terminal portion is actually formed.
- the structure of the organic EL lighting device according to the present embodiment is substantially the same as the structure of the organic EL lighting device according to the first embodiment, but as shown in FIGS.
- the point which installed the thermal radiation board 6 differs.
- the material of the soaking heat dissipation plate 6 a material having good thermal conductivity such as aluminum, copper, ceramic, graphite sheet or the like is used, but besides this, the thermal conductivity is also good. Any material can be used.
- the soaking heat dissipation plate 6 is formed in a single layer on the upper portion of the sealing can 14, but in the case of a plurality of layers, an acrylic or thermosetting epoxy resin film or a liquid may be used. Bonding is performed using an adhesive.
- the heat generated in the organic EL element 13 is made uniform, and the entire organic EL element 13 is obtained.
- the light emission distribution in the surface of the organic EL element 13 can be improved by soaking the heat.
- the anode terminal electrode 11, the cathode terminal electrode 12, the lead wire connection portion, the end face of the glass substrate 10, etc. are exposed.
- the outer periphery of the heat soaking radiator plate 6 is made larger than the outer periphery of the glass substrate 10.
- the soaking heat dissipation plate 6 is indicated by a broken line.
- the organic EL lighting device in addition to the effects exhibited by the organic EL lighting device according to the first embodiment, the anode terminal electrode 11, the cathode terminal electrode 12 and the glass by the heat spreader plate 6 Since the end face or the like of the substrate 10 can be protected so that the operator does not directly touch it, safety can be improved. Further, the end face of the glass substrate 10 can be protected from external impact by enlarging the size of the wiring board 1.
- FIG. 15 is a plan view of the organic EL lighting device according to this embodiment.
- FIG. 16 is a cross-sectional view taken along the line AA in FIG. Although the power supply terminal portion is omitted in FIGS. 15 and 16, the power supply terminal portion is actually formed.
- the structure of the organic EL lighting device according to this embodiment is substantially the same as the structure of the organic EL lighting device according to the first embodiment, but as shown in FIGS.
- the sealing glass substrate 7 was bonded to the glass substrate 10 by the adhesive layer 8 to seal the organic EL element 13.
- solid sealing using a resin for the adhesive layer 8 is described as an example, but gel sealing using a gel agent for the adhesive layer 8 is also possible.
- gel sealing it is necessary to harden the glass substrate 10 and the sealing glass substrate 7 with an adhesive so that the gel agent does not flow out.
- the sealing glass substrate 7 is used as the sealing substrate, but it is also possible to use materials such as plastic, metal, ceramic and the like as the substrate.
- the organic EL lighting device concerning a present Example in addition to the effect which the organic EL lighting device concerning a 1st example plays, thickness of an organic EL lighting panel can be made thinner.
- FIG. 17 is a plan view of the organic EL lighting device according to the present example.
- FIG. 18 is a cross-sectional view taken along the line AA in FIG. In FIGS. 17 and 18, although the power supply terminal portion is omitted, the power supply terminal portion is actually formed.
- the structure of the organic EL lighting device according to the present embodiment is substantially the same as the structure of the organic EL lighting device according to the first embodiment, but as shown in FIGS. 17 and 18, instead of the sealing can 14 A sealing film 9 is formed to prevent the performance deterioration of the organic EL element 13 due to oxygen, water or the like.
- a polyimide film of about 10 ⁇ m and an adhesive of about 20 ⁇ m are used for the sealing film 9.
- the organic EL lighting device concerning a present Example in addition to the effect which the organic EL lighting device concerning a 1st example plays, thickness of an organic EL lighting panel can be made thinner.
- FIG. 19 is a plan view of the organic EL lighting device according to the present example.
- FIG. 20 is a cross-sectional view taken along the line AA in FIG.
- FIG. 21 is a cross-sectional view taken along the line BB in FIG.
- the power supply terminal portion is omitted, the power supply terminal portion is actually formed.
- the organic EL lighting device supplies electric power equally to the four anode terminal electrodes 11 and the four cathode terminal electrodes 12, so that the four anode terminal electrodes 11 are provided.
- An anode FPC board 101 which is a flexible printed board (hereinafter referred to as an FPC) on which a corresponding anode wiring pattern is formed is provided.
- Anode FPC electrodes 101 a are formed on the four sides of the anode FPC substrate 101.
- the specific structure of the circuit of the FPC, the electrode, and the like is the same as that of the conventional FPC, and thus the description thereof is omitted here.
- the organic EL lighting device includes the cathode FPC substrate 102 that is an FPC on which cathode wiring patterns corresponding to the four cathode terminal electrodes 12 are formed. At four corners of the cathode FPC substrate 102, cathode FPC electrodes 102a are formed. That is, the organic EL lighting device according to the present embodiment is a can-sealed organic EL lighting device in which the anode FPC substrate 101 and the cathode FPC substrate 102 cover the entire light emitting surface of the organic EL element 13.
- the anode FPC board 101 and the cathode FPC board 102 have an anode wiring pattern and a cathode wiring pattern formed through the insulating member, and both sides of the anode wiring pattern and the cathode wiring pattern are covered with the insulating member. . Also, the insulating material on the anode terminal electrode 11 at the position where it is connected to the anode FPC electrode 101a is removed. Similarly, the insulating material on the cathode terminal electrode 12 at a position to be connected to the cathode FPC electrode 102a is also removed.
- the anode FPC board 101 is provided.
- Four anode FPC electrodes 101a are formed, and four cathode FPC electrodes 102a are formed on the cathode FPC substrate 102.
- current is equally supplied to organic EL elements formed in a triangular shape.
- anode terminal electrode 11 and the cathode terminal electrode 12 are provided at three locations, three anode FPC electrodes 101 a are formed on the anode FPC substrate 101, and three cathode FPCs are provided on the cathode FPC substrate 102.
- the electrode 102a may be formed.
- anode terminal electrode 11 and the cathode terminal electrode 12 are provided at five locations in order to uniformly supply the current to the organic EL element formed in a polygon having a pentagon shape or more, five anode FPC substrates 101 are provided. It is also possible to form the anode FPC electrodes 101a at more than locations, and to form the cathode FPC electrodes 102a at more than five locations on the cathode FPC substrate 102.
- the anode terminal electrode 11 is formed on the glass substrate 10.
- An organic EL element 13 is formed at the center of the anode terminal electrode 11. Further, on both ends of the anode terminal electrode 11, an anisotropic conductive film (hereinafter referred to as ACF; anisotropic conductive film) 103 is attached. Further, on the anode terminal electrode 11, a sealing can 14 for sealing the organic EL element 13 is formed.
- ACF anisotropic conductive film
- a lower insulating film 104 is formed on the sealing can 14.
- a film-like film such as polyimide is used for the lower insulating film 104.
- An anode FPC substrate 101 is provided on the lower insulating film 104, the sealing can 14 and the ACF 103.
- the anode FPC electrode 101a of the anode FPC board 101 and the ACF 103 are connected by a thermocompression bonding method using an ACF pressure bonding apparatus. Thereby, the anode FPC electrode 101a and the anode terminal electrode 11 are electrically connected.
- ACF 103 is used to connect anode FPC electrode 101a and anode terminal electrode 11 in the present embodiment, other materials such as solder, silver paste, conductive film, etc. can be used. It is not limited to these as long as the connection can be made.
- An interlayer insulating film 105 is formed on the anode FPC substrate 101.
- a cathode FPC substrate 102 is provided on the interlayer insulating film 105. That is, the interlayer insulating film 105 plays the role of insulating the anode FPC board 101 and the cathode FPC board 102.
- a film-like film such as polyimide is used as the interlayer insulating film 105, and an acrylic or thermosetting epoxy resin film or the like for bonding the anode FPC substrate 101 and the cathode FPC substrate 102 is further used.
- Use An upper insulating film 106 is formed on the cathode FPC substrate 102.
- the above is the structure of the organic EL lighting device according to the present example in the cross section AA shown in FIG.
- the organic EL element 13 is formed at the center of the glass substrate 10. Further, cathode terminal electrodes 12 are formed on both sides of the organic EL element 13 on the glass substrate 10. The ACF 103 is attached on the cathode terminal electrode 12. A sealing can 14 for sealing the organic EL element 13 is formed on the cathode terminal electrode 12.
- a lower insulating film 104 is formed on the sealing can 14.
- An anode FPC substrate 101 is provided on the lower insulating film 104.
- An interlayer insulating film 105 is formed on the sealing can 14 and the anode FPC substrate 101.
- a cathode FPC substrate 102 is provided on the interlayer insulating film 105, the sealing can 14 and the ACF 103.
- the negative electrode FPC electrode 102 a of the negative electrode FPC substrate 102 and the ACF 103 are connected by a thermal pressure bonding method using an ACF pressure bonding device. Thereby, the cathode FPC electrode 102a and the cathode terminal electrode 12 are electrically connected.
- An upper insulating film 106 is formed on the cathode FPC substrate 102.
- the wiring is performed by the anode FPC substrate 101 and the cathode FPC substrate 102 so that the ACF 103 is attached using an automatic machine, and then the anode FPC substrate 101 and the cathode Since wiring can be performed by the FPC board 102, yield and productivity can be improved.
- a thin insulating film (for example, 100 nm to 1000 nm) is coated on the upper electrode in contact with the organic EL element, and the insulating film is formed.
- An insulating film with a conductive film is formed thereon.
- the insulating film is a thin film, a short circuit occurs due to conductive foreign matter or the like, which causes a decrease in yield.
- the anode FPC board 101 and the cathode FPC board 102 are used to form the wiring on the sealing can 14 to form the organic EL element 13. Since a short circuit with the electrode does not occur at all, the yield can be greatly improved.
- FIG. 22 is a plan view of the organic EL lighting device according to the present example.
- FIG. 23 is a cross-sectional view taken along a line AA in FIG.
- FIG. 24 is a cross-sectional view taken along the line BB in FIG.
- the power supply terminal portion is omitted, the power supply terminal portion is actually formed.
- the upper insulating film 106 is indicated by a broken line.
- the structure of the organic EL lighting device according to the present embodiment is substantially the same as the structure of the organic EL lighting device according to the eighth embodiment, but as shown in FIGS. 11 and covers the surface of the cathode terminal electrode 12 and the side surface 10 a and the back surface end 10 b of the glass substrate 10.
- the upper insulating film 106, the anode terminal electrode 11 and the cathode terminal electrode 12, and the upper insulating film 106 and the glass substrate 10 are bonded with an adhesive.
- a solid adhesive is used as the adhesive.
- a film-like adhesive such as acrylic or epoxy resin or a liquid adhesive
- a gel adhesive film may be used.
- the organic EL lighting device in addition to the effects exhibited by the organic EL lighting device according to the eighth embodiment, the surfaces of the anode terminal electrode 11 and the cathode terminal electrode 12 by the upper insulating film 106 By covering the side surface 10 a or the back surface end 10 b of the glass substrate 10, the safety can be improved.
- FIG. 25 is a plan view of the organic EL lighting device according to the present example.
- FIG. 26 is a cross-sectional view taken along the line AA in FIG.
- FIG. 27 is a cross-sectional view taken along the line BB in FIG.
- the connector is omitted, the connector is actually attached.
- the upper insulating film 106 is indicated by a broken line.
- the structure of the organic EL lighting device according to the present embodiment is substantially the same as the structure of the organic EL lighting device according to the ninth embodiment, but as shown in FIGS. 25 to 27, an anode FPC substrate 101 and a cathode FPC substrate
- the wiring pattern of 102 is changed, and an anode FPC feed terminal portion 101b protruding from the anode terminal electrode is formed on the anode FPC electrode 101a of the anode FPC substrate 101, and the cathode FPC electrode 102a of the cathode FPC substrate 102 protrudes from the cathode terminal electrode 12.
- the negative electrode FPC feed terminal portion 102b was formed.
- the connector 24 can be directly connected to the anode FPC feed terminal portion 101b and the cathode FPC feed terminal portion 102b without using the anode lead wire 22 and the cathode lead wire 23 shown in FIG.
- the upper portion of the anode FPC feed terminal portion 101 b is covered with the convex portion 105 a of the interlayer insulating film 105
- the upper portion of the cathode FPC feed terminal portion 102 b is covered with the convex portion 106 a of the upper insulating film 106.
- a lead wire having an outer diameter of 1.3 mm is drawn from the anode terminal electrode 11 and the cathode terminal electrode 12 at one of the anode terminal electrode 11 and the cathode terminal electrode 12 respectively.
- the lead wire protrudes by 0.3 mm or more, and it has not been possible to achieve sufficient thinning.
- the pattern shapes of the anode FPC substrate 101 and the cathode FPC substrate 102 are changed, By forming the anode FPC feed terminal portion 101 b and the cathode FPC feed terminal portion 102 b protruding from the anode terminal electrode 11 and the cathode terminal electrode 12, lead wires can be omitted, so the thickness of the organic EL lighting device can be reduced or narrow. It is possible to make a frame. Furthermore, since the connector 24 can be used for simple connection, productivity can be improved and the manufacturing process can be simplified.
- FIG. 28 is a plan view of the organic EL lighting device according to this embodiment.
- FIG. 29 is a cross-sectional view taken along the line AA in FIG.
- FIG. 30 is a cross-sectional view taken along a line BB in FIG.
- the power supply terminal portion is omitted in FIGS. 28 to 30, the power supply terminal portion is actually formed.
- the structure of the organic EL lighting device according to this embodiment is substantially the same as the structure of the organic EL lighting device according to the eighth embodiment, but as shown in FIGS. 28 to 30, it is uniform on the upper insulating film 106.
- the point which installed the thermal radiation board 115 differs.
- the material of the heat equalizing heat dissipation plate 115 a material having good thermal conductivity such as aluminum, copper, ceramic, graphite sheet, etc. is used, but besides this, thermal conductivity is also good. Any material can be used.
- the soaking heat dissipation plate 115 is disposed on the upper portion of the upper insulating film 106, but may be disposed between the anode FPC substrate 101 and the lower insulating film 104 or both of them. Moreover, in the present embodiment, the soaking heat dissipation plate 115 is formed as a single layer on the upper insulating film 106, but in the case of a plurality of layers, an acrylic or thermosetting epoxy resin film or liquid may be used. Bonding is performed using an adhesive.
- the heat generated in the organic EL element 13 is made uniform, and the entire organic EL element 13 is obtained.
- the light emission distribution in the surface of the organic EL element 13 can be improved by soaking the heat.
- FIG. 31 is a plan view of the organic EL lighting device according to the present example. Although the power supply terminal portion is omitted in FIG. 31, the power supply terminal portion is actually formed.
- the structure of the organic EL lighting device according to the present embodiment is substantially the same as the structure of the organic EL lighting device according to the first embodiment, but as shown in FIG. It is different from the point that the anode FPC electrode 101a and the anode terminal electrode 11 are electrically connected by performing soldering with the solder 116 on the strip-shaped anode FPC electrode 101c as the anode anode FPC electrode 101c.
- the anode FPC electrode 101a has been described in the present embodiment, the cathode FPC electrode 102a and the cathode terminal electrode 12 can also be electrically connected by solder similarly to the cathode FPC electrode 102a.
- the anode FPC electrode 101a and the anode terminal are formed by forming the strip-shaped anode FPC electrode 101c.
- the electrode 11 can be easily connected by soldering.
- FIG. 32 is a plan view of the organic EL lighting device according to this embodiment. Although the power supply terminal portion is omitted in FIG. 32, the power supply terminal portion is actually formed.
- the structure of the organic EL lighting device according to this embodiment is substantially the same as the structure of the organic EL lighting device according to the eighth embodiment, but as shown in FIG. 32, an anode FPC substrate 101 and a cathode FPC substrate 102
- the connector 117 is placed on the upper insulating film 106 located in the portion where the second layer is stacked, and the anode terminal 117a of the connector 117 is partially removed from the upper insulating film 106, the cathode FPC substrate 102, and the interlayer insulating film 105.
- the organic EL lighting device according to the present embodiment in addition to the effects exhibited by the organic EL lighting device according to the eighth embodiment, lead wires are provided by installing the connector 117 on the upper insulating film 106. As a result, the organic EL lighting device can be thinned and the frame can be narrowed. Furthermore, since simple connection can be performed using the connector 117, productivity can be improved and the manufacturing process can be simplified.
- FIG. 33 is a plan view of the organic EL lighting device according to the present example.
- FIG. 34 is a cross-sectional view taken along the line AA in FIG.
- FIG. 35 is a cross sectional view taken along a line BB in FIG.
- the power supply terminal portion is omitted in FIGS. 33 to 35, the power supply terminal portion is actually formed.
- the structure of the organic EL lighting device according to the present embodiment is substantially the same as the structure of the organic EL lighting device according to the eighth embodiment, but as shown in FIGS. 33 to 35, instead of the sealing can 14
- the sealing glass substrate 7 was bonded to the glass substrate 10 by the adhesive layer 8 to seal the organic EL element 13.
- solid sealing using a resin for the adhesive layer 8 is described as an example, but gel sealing using a gel agent for the adhesive layer 8 is also possible.
- gel sealing it is necessary to harden the glass substrate 10 and the sealing glass substrate 7 with an adhesive so that the gel agent does not flow out.
- the sealing glass substrate 7 is used as the sealing substrate, but it is also possible to use materials such as plastic, metal, ceramic and the like as the substrate.
- the wiring patterns of the anode FPC substrate 101 and the cathode FPC substrate 102 are changed, and the anode projected from the anode terminal electrode to the anode FPC electrode 101a of the anode FPC substrate 101.
- the FPC feed terminal portion 101 b may be formed, and the cathode FPC feed terminal portion 102 b protruding from the cathode terminal electrode 12 may be formed on the cathode FPC electrode 102 a of the cathode FPC substrate 102.
- the sealing glass substrate 7 is bonded to the bottom of the anode FPC substrate 101.
- FIG. 36 is a plan view of the organic EL lighting device according to this embodiment.
- FIG. 37 is a cross sectional view taken along a line AA in FIG.
- FIG. 38 is a cross sectional view taken along the line BB in FIG.
- the power supply terminal portion is omitted in FIGS. 36 to 38, the power supply terminal portion is actually formed.
- the structure of the organic EL lighting device according to the present embodiment is substantially the same as the structure of the organic EL lighting device according to the eighth embodiment, but as shown in FIGS. 36 to 38, instead of the sealing can 14
- the sealing film 9 for preventing the performance degradation of the organic EL element 13 by oxygen, water, etc. was formed, and the organic EL element 13 was sealed.
- the wiring patterns of the anode FPC substrate 101 and the cathode FPC substrate 102 are changed, and the anode projected from the anode terminal electrode to the anode FPC electrode 101a of the anode FPC substrate 101.
- the FPC feed terminal portion 101 b may be formed, and the cathode FPC feed terminal portion 102 b protruding from the cathode terminal electrode 12 may be formed on the cathode FPC electrode 102 a of the cathode FPC substrate 102.
- sealing is performed using a thick sealing film 9 under the anode FPC substrate 101, for example, a polyimide film of about 10 ⁇ m and an adhesive of about 20 ⁇ m.
- a thick sealing film 9 under the anode FPC substrate 101, for example, a polyimide film of about 10 ⁇ m and an adhesive of about 20 ⁇ m.
- Example of the organic electroluminescent illuminating device based on this invention was described, it is possible to implement combining suitably the structure shown in each Example.
- the present invention can be used, for example, in an organic EL lighting device provided with a large-area organic EL lighting panel.
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Abstract
Description
また、ガラス基板10上に形成された陽極端子電極11及び陰極端子電極12には半田が載りにくいため、超音波半田を用いて半田付けを行うこととなるが、このとき、超音波半田によりガラス基板10が欠ける虞がある。
はじめに、本実施例に係る有機EL照明装置の構成の概要について説明する。
本実施例に係る有機EL照明装置は、従来の有機EL照明装置と同様に、図39および図40に示したガラス基板10上の四辺にそれぞれ陽極端子電極11と、ガラス基板10上の四隅にそれぞれ陰極端子電極12と、ガラス基板10上に有機EL素子13を覆うように、酸素や水等による有機EL素子13の性能劣化を防止するための封止缶14とを備えている。なお、本実施例においては、基板としてガラス基板10を用いたが、これ以外にも、プラスチックや金属やセラミック等の材料を基板として用いることも可能である。
図5は、本実施例に係る有機EL照明装置における配線基板1の構成を示した模式図である。
図5に示すように、本実施例に係る有機EL照明装置における配線基板1は、二つのL字状のL字型配線基板2と、二つのL字状のL字型配線基板2を接続するための二つのL字状の接続用L字型配線基板3とにより構成されている。L字型配線基板2の表面の端部には、陽極電極2aと陰極電極2bが形成されている。
なお、本実施例においては、陽極電極2aと陽極電極3c、及び陰極電極2bと陰極配線電極3bとを半田付けにより接続したが、ACFやACPを用いて熱圧着して接続することとしてもよい。
図7は、本実施例に係る有機EL照明装置の平面図である。図8は、図7にA-Aで示す断面における断面図である。
また、配線基板1の大きさを拡大することにより、ガラス基板10の端面を外部衝撃から保護することもできる。
図9は、本実施例に係る有機EL照明装置の平面図である。図10は、図9にA-Aで示す断面における断面図である。なお、図9,10においては、コネクタについては省略したが、実際にはコネクタが取り付けられる。
図11は、本実施例に係る有機EL照明装置の平面図である。図12は、図11にA-Aで示す断面における断面図である。なお、図11,12においては、給電端子部については省略したが、実際には給電端子部が形成される。
また、配線基板1の大きさを拡大することにより、ガラス基板10の端面を外部衝撃から保護することもできる。
図13は、本実施例に係る有機EL照明装置の平面図である。図14は、図13にA-Aで示す断面における断面図である。なお、図13,14においては、給電端子部については省略したが、実際には給電端子部が形成される。
また、配線基板1の大きさを拡大することにより、ガラス基板10の端面を外部衝撃から保護することもできる。
図15は、本実施例に係る有機EL照明装置の平面図である。図16は、図15にA-Aで示す断面における断面図である。なお、図15,16においては、給電端子部については省略したが、実際には給電端子部が形成される。
図17は、本実施例に係る有機EL照明装置の平面図である。図18は、図17にA-Aで示す断面における断面図である。なお、図17,18においては、給電端子部については省略したが、実際には給電端子部が形成される。
図19は、本実施例に係る有機EL照明装置の平面図である。図20は、図19にA-Aで示す断面における断面図である。図21は、図19にB-Bで示す断面における断面図である。なお、図19~21においては、給電端子部については省略したが、実際には給電端子部が形成される。
すなわち、本実施例に係る有機EL照明装置は、陽極FPC基板101及び陰極FPC基板102が有機EL素子13の発光面をほぼ全面に亘り覆う缶封止型の有機EL照明装置である。
図19,20に示すように、本実施例に係る有機EL照明装置は、ガラス基板10上に陽極端子電極11が形成されている。陽極端子電極11上の中央部には、有機EL素子13が形成されている。また、陽極端子電極11上の両端部には、異方性導電膜(以下、ACF;Anisotropic Conductive Filmという)103が貼付されている。また、陽極端子電極11上には、有機EL素子13を封止する封止缶14が形成されている。
以上が図19に示すA-A断面における本実施例に係る有機EL照明装置の構造である。
図19,21に示すように、本実施例に係る有機EL照明装置は、ガラス基板10上の中央部には、有機EL素子13が形成されている。また、ガラス基板10上の有機EL素子13の両側部には、陰極端子電極12が形成されている。陰極端子電極12上には、ACF103が貼付されている。また、陰極端子電極12上には、有機EL素子13を封止する封止缶14が形成されている。
以上が図19に示すB-B断面における本実施例に係る有機EL照明装置の構造である。
図22は、本実施例に係る有機EL照明装置の平面図である。図23は、図22にA-Aで示す断面における断面図である。図24は、図22にB-Bで示す断面における断面図である。
なお、図22~24においては、給電端子部については省略したが、実際には給電端子部が形成される。また、図22においては、上部絶縁膜106は破線により示した。
図25は、本実施例に係る有機EL照明装置の平面図である。図26は、図25にA-Aで示す断面における断面図である。図27は、図25にB-Bで示す断面における断面図である。
なお、図25~27においては、コネクタについては省略したが、実際にはコネクタが取り付けられる。また、図25においては、上部絶縁膜106は破線により示した。
図28は、本実施例に係る有機EL照明装置の平面図である。図29は、図28にA-Aで示す断面における断面図である。図30は、図28にB-Bで示す断面における断面図である。なお、図28~30においては、給電端子部については省略したが、実際には給電端子部が形成される。
図31は、本実施例に係る有機EL照明装置の平面図である。なお、図31においては、給電端子部については省略したが、実際には給電端子部が形成される。
図32は、本実施例に係る有機EL照明装置の平面図である。なお、図32においては、給電端子部については省略したが、実際には給電端子部が形成される。
図33は、本実施例に係る有機EL照明装置の平面図である。図34は、図33にA-Aで示す断面における断面図である。図35は、図33にB-Bで示す断面における断面図である。なお、図33~35においては、給電端子部については省略したが、実際には給電端子部が形成される。
図36は、本実施例に係る有機EL照明装置の平面図である。図37は、図36にA-Aで示す断面における断面図である。図38は、図36にB-Bで示す断面における断面図である。なお、図36~38においては、給電端子部については省略したが、実際には給電端子部が形成される。
1a 陽極配線
1b 陰極配線
1c 陽極電極
1d 陰極電極
1e 陽極接続配線
1f 陰極接続配線
2 L字型配線基板
2a 陽極電極
2b 陰極電極
2c 陽極接続配線
2d 陰極接続配線
3 接続用L字型配線基板
3a 陽極配線
3b 陰極配線電極
3c 陽極電極
3d 陽極接続配線
4 突き出し部
4a 陽極給電端子部
4b 陰極給電端子部
5 樹脂枠
6 均熱放熱板
7 封止用ガラス基板
8 接着層
9 封止膜
10 ガラス基板
11 陽極端子電極
12 陰極端子電極
13 有機EL素子
14 封止缶
20 陽極リード線
21 陰極リード線
22 陽極引き出し線
23 陰極引き出し線
24 コネクタ
101 陽極FPC基板
101a 陽極FPC電極
101b 陽極FPC給電端子部
101c 短冊状陽極FPC電極
101d 陽極取り出し部
102 陰極FPC基板
102a 陰極FPC電極
102b 陰極FPC給電端子部
102c 陰極取り出し部
103 異方性導電膜(ACF)
104 下部絶縁膜
105 層間絶縁膜
105a 凸部
106 上部絶縁膜
106a 凸部
115 均熱放熱板
116 半田
117 コネクタ
117a 陽極端子
117b 陰極端子
Claims (13)
- ガラス基板上に、有機EL素子と、前記有機EL素子に均等に電流を供給するための複数の陽極端子電極及び陰極端子電極とを備える有機EL照明装置において、
それぞれの前記陽極端子電極の位置に対応する陽極電極を有する回路と、それぞれの前記陰極端子電極の位置に対応する陰極電極を有する回路とが形成された配線基板を備える
ことを特徴とする有機EL照明装置。 - 前記配線基板が前記有機EL素子の一部または全部を囲むように形成された
ことを特徴とする請求項1に記載の有機EL照明装置。 - 裏面に均熱放熱板を備え、
前記均熱放熱板の外周を前記ガラス基板の外周よりも大きくする
ことを特徴とする請求項2に記載の有機EL照明装置。 - 前記配線基板の外周を前記ガラス基板の外周よりも大きくする
ことを特徴とする請求項2に記載の有機EL照明装置。 - 前記配線基板に電流を供給するための給電端子部を形成する
ことを特徴とする請求項2に記載の有機EL照明装置。 - 前記基板の周囲に樹脂枠を設置する
ことを特徴とする請求項2に記載の有機EL照明装置。 - 前記配線基板が、
それぞれの前記陽極端子電極の位置に対応する電極を有する回路が形成された陽極フレキシブルプリント基板と、
それぞれの前記陰極端子電極の位置に対応する電極を有する回路が形成された陰極フレキシブルプリント基板と
からなる
ことを特徴とする請求項1に記載の有機EL照明装置。 - 前記ガラス基板の側面及び裏面端部を絶縁膜で被覆する
ことを特徴とする請求項7に記載の有機EL照明装置。 - 前記陽極フレキシブルプリント基板及び前記陰極フレキシブルプリント基板に電流を供給するための給電端子部を形成する
ことを特徴とする請求項7に記載の有機EL照明装置。 - 裏面に均熱放熱板を備える
ことを特徴とする請求項7に記載の有機EL照明装置。 - 前記有機EL素子を封止缶により封止する
ことを特徴とする請求項1から請求項10のいずれか1項に記載の有機EL照明装置。 - 前記有機EL素子を封止用ガラス基板により封止する
ことを特徴とする請求項1から請求項10のいずれか1項に記載の有機EL照明装置。 - 前記有機EL素子を封止膜により封止する
ことを特徴とする請求項1から請求項10のいずれか1項に記載の有機EL照明装置。
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2011
- 2011-04-27 US US13/643,955 patent/US8836204B2/en active Active
- 2011-04-27 EP EP11775043.0A patent/EP2566298B1/en active Active
- 2011-04-27 CN CN2011800204978A patent/CN102860128A/zh active Pending
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JP5684370B2 (ja) * | 2011-03-29 | 2015-03-11 | Necライティング株式会社 | 有機el発光装置、有機el発光装置の製造方法及び有機el照明装置 |
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WO2013047742A1 (ja) * | 2011-09-30 | 2013-04-04 | パナソニック出光Oled照明 株式会社 | 面状発光装置 |
JP2013168531A (ja) * | 2012-02-16 | 2013-08-29 | Kaneka Corp | 有機elパネルの取り付け構造、有機elパネル、並びに、有機elパネルの取り付け装置 |
JP2013214363A (ja) * | 2012-03-30 | 2013-10-17 | Kaneka Corp | 有機elモジュール |
CN102695364A (zh) * | 2012-05-30 | 2012-09-26 | 昆山维信诺显示技术有限公司 | Oled光源用fpc、oled光源及oled光源引出电极的连接方法 |
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JP2016524305A (ja) * | 2013-07-24 | 2016-08-12 | エルジー・ケム・リミテッド | 有機発光素子 |
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JP2016539475A (ja) * | 2013-12-03 | 2016-12-15 | オーエルイーディーワークス ゲーエムベーハーOLEDWorks GmbH | 有機発光ダイオードデバイスでの電流分配 |
JP2016004910A (ja) * | 2014-06-17 | 2016-01-12 | キヤノン株式会社 | 有機発光装置 |
WO2016132870A1 (ja) * | 2015-02-20 | 2016-08-25 | 株式会社カネカ | 有機elパネル |
WO2017033630A1 (ja) * | 2015-08-26 | 2017-03-02 | 株式会社カネカ | 面状発光装置 |
JPWO2017033630A1 (ja) * | 2015-08-26 | 2018-06-07 | 株式会社カネカ | 面状発光装置 |
US10361386B2 (en) | 2015-08-26 | 2019-07-23 | Kaneka Corporation | Planar light emitting device |
JPWO2017149846A1 (ja) * | 2016-03-02 | 2018-12-27 | コニカミノルタ株式会社 | 発光装置 |
WO2017149846A1 (ja) * | 2016-03-02 | 2017-09-08 | コニカミノルタ株式会社 | 発光装置 |
US10381587B2 (en) | 2016-03-02 | 2019-08-13 | Konica Minolta, Inc. | Light emitting apparatus containing sealing member to cover planar light emitter |
JP2021536105A (ja) * | 2018-09-03 | 2021-12-23 | エルジー・ケム・リミテッド | 封止フィルム |
JP7195685B2 (ja) | 2018-09-03 | 2022-12-26 | エルジー・ケム・リミテッド | 封止フィルム |
Also Published As
Publication number | Publication date |
---|---|
KR20130069602A (ko) | 2013-06-26 |
EP2566298A4 (en) | 2015-12-16 |
JPWO2011136262A1 (ja) | 2013-07-22 |
US20130093308A1 (en) | 2013-04-18 |
US8836204B2 (en) | 2014-09-16 |
JP5856950B2 (ja) | 2016-02-10 |
EP2566298A1 (en) | 2013-03-06 |
CN102860128A (zh) | 2013-01-02 |
EP2566298B1 (en) | 2018-06-06 |
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