WO2011077886A1 - 配線用電子部品及びその製造方法 - Google Patents
配線用電子部品及びその製造方法 Download PDFInfo
- Publication number
- WO2011077886A1 WO2011077886A1 PCT/JP2010/070920 JP2010070920W WO2011077886A1 WO 2011077886 A1 WO2011077886 A1 WO 2011077886A1 JP 2010070920 W JP2010070920 W JP 2010070920W WO 2011077886 A1 WO2011077886 A1 WO 2011077886A1
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- Prior art keywords
- wiring
- electronic component
- vertical
- substrate
- horizontal
- Prior art date
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Images
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Definitions
- the present invention relates to an electronic component for wiring to be used by arranging a circuit element including a semiconductor chip and incorporating the circuit element into an electronic device package connected to an external electrode through vertical wiring and horizontal wiring. .
- DFP double-sided electrode package
- IC-embedded substrate in which ICs and LSIs are mounted in a substrate
- DFP and IC-embedded substrates need to have a structure that includes electrodes on the other side away from the LSI chip mounting substrate, vertical wiring for connection to the upper substrate, and horizontal wiring for wiring.
- DFP vertical wiring has a structure built in advance on the substrate, a method in which resin is opened after resin sealing and filled with plating, and a structure in which electrodes are taken out on both sides of the substrate through a silicon substrate is adopted.
- the formation of the vertical wiring and the rewiring has a structure in which the process is complicated and the cost is likely to increase.
- Patent Document 1 discloses an IC-embedded substrate structure using an organic substrate.
- This IC-embedded substrate structure uses solder balls and metal post structures as vertical wiring, but the upper and lower substrates are provided with a thick metal layer corresponding to the support plate during the manufacturing process, and the upper and lower substrates are connected. A process for removing the thick metal layer later is necessary. This makes the process complex and a major cost factor.
- Patent Document 2 uses vertical wiring and rewiring as an additional process for forming a structure of a double-sided electrode package DFP or a wafer level chip size package (hereinafter referred to as WLCSP) as a component.
- WLCSP wafer level chip size package
- This electronic component for wiring is constituted by integrally connecting a plurality of vertical wirings and horizontal wirings connected thereto by a support plate made of a conductive material using an electroforming method.
- the wiring part such as horizontal wiring and vertical wiring and the support plate can be easily peeled off by heat and pressure in the process after the electronic components for wiring are incorporated into the electronic device package. Can be done. Thereby, a plurality of vertical wirings and horizontal wirings are wired at predetermined positions.
- the semiconductor manufacturing process is divided into a pre-process for creating an LSI and a post-process for packaging the LSI.
- a pre-process for creating an LSI there are few specialized manufacturers that can cover the pre-process in the post-process manufacturers.
- Manufacturing of an electronic device package such as a conventional wafer level chip size package (WLCSP) requires processes such as rewiring and vertical wiring plating on the wafer, that is, a facility close to the previous process, and the conventional post process.
- WLCSP wafer level chip size package
- the present invention consolidates vertical wiring and rewiring, which are formed as an additional process of the double-sided electrode package DFP and the wafer level chip size package WLCSP, as a part, and at that time, manufacture
- the purpose is to simplify the process and realize cost reduction.
- the electronic component for wiring according to the present invention is used by arranging a circuit element including a semiconductor chip and incorporating the circuit element into an electronic device package connected to an external electrode through a vertical wiring and a horizontal wiring.
- the wiring substrate including the horizontal wiring and the vertical wiring connected to the horizontal wiring and extending in the vertical direction from the wiring substrate and the wiring substrate including the horizontal wiring and the vertical wiring are separated by water. And a support plate that is bonded using a possible adhesive.
- Horizontal wiring consists of inner wiring directly connected to vertical wiring on one side of the wiring substrate, outer wiring formed on the opposite surface, and inner wiring and outer wiring passing through the wiring substrate. Consists of connecting via wiring.
- the horizontal wiring is constituted by an inner wiring that is directly connected to the vertical wiring on one surface of the wiring substrate.
- ⁇ A solder resist is applied to the outside of the wiring substrate having the outer wiring, and a support plate is bonded thereon.
- the support plate is formed of a conductive or insulating material capable of imparting rigidity to the wiring substrate and maintaining flatness, and the wiring substrate is formed of a polyimide material or a glass epoxy material.
- the method for manufacturing an electronic component for wiring according to the present invention includes forming a via wiring penetrating the wiring base material and connecting the via wiring to the inner side and the outer side of the wiring base material.
- a wiring and an outer wiring are formed, and a horizontal wiring is constituted by the inner wiring, the via wiring, and the outer wiring.
- a vertical wiring connected to the inner wiring and extending vertically therefrom is formed.
- a solder resist is applied to the outer wiring formation side of the wiring substrate except for the opening position for external connection.
- the wiring substrate coated with the solder resist is bonded to a support plate using an adhesive that can be peeled off by moisture.
- a horizontal wiring is formed on a wiring substrate surface, a vertical wiring connected to the horizontal wiring and extending vertically therefrom is formed, and the horizontal wiring and the vertical wiring are arranged.
- the formed wiring substrate is bonded to the support plate using an adhesive that can be peeled off with water.
- a metal laminate composed of at least three metal layers composed of a lower layer metal for horizontal wiring, an upper layer metal for horizontal wiring, and a metal for vertical wiring is formed.
- a lower wiring metal pattern for horizontal wiring is formed, and a metal laminated material on which the lower wiring metal pattern for horizontal wiring is formed is attached on a wiring substrate, and then a vertical wiring portion is formed by patterning.
- the horizontal wiring upper layer metal using the vertical wiring portion as a mask, the horizontal wiring portion is formed of the patterned horizontal wiring lower layer metal and horizontal wiring upper layer metal.
- the wiring substrate on which the vertical wiring portion and the horizontal wiring portion are formed is bonded to the support plate using an adhesive that can be peeled off with water.
- Adhesion of the wiring substrate to the support plate is carried out by hanging or applying a required amount of liquid adhesive on the support plate, irradiating with ultraviolet UV, pressing and bonding, and heating. . Alternatively, it is applied in the form of a sheet and heated after being irradiated with ultraviolet rays UV.
- a resist is applied to the inner wiring forming side of the wiring substrate, exposed and developed to form an opening for vertical wiring, and then the inner wiring is used as a current path for plating, and the inside of the opening is formed. Is filled with a plating metal.
- This completed electronic component for wiring is used by being coupled to a substrate on which LSI or passive components are mounted. Ultimately, the supporting plate for the electronic component for wiring is peeled off to complete the electronic device package.
- This peelable adhesive contains, for example, an epoxy resin having an ethylene glycol skeleton and an epoxy group at both ends, an epoxy resin having a propylene glycol skeleton and an epoxy group at both ends, and a cationic polymerization initiator If an adhesive is used, it can be easily removed with moisture. This adhesive has excellent heat resistance in addition to the feature that it can be easily peeled off by moisture. In the process of manufacturing the electronic component device, for example, solder reflow may be performed. However, the electronic component for wiring goes through this reflow temperature, and the adhesive can withstand the reflow temperature. Furthermore, if water is heated when the support plate is finally peeled off, the peeling time can be shortened.
- the support plate can be peeled off with water, it is hardly stressed and can be reused, and the cost can be reduced in this aspect as compared to the conventional support plate that is disposable.
- the support plate is attached in the final process of the electronic component for wiring with a liquid adhesive, so that it does not require special know-how such as electroforming, and the double-sided electrode package DFP or the wafer level chip size package.
- the manufacturing process of electronic components for wiring for WLCSP or IC-embedded substrates can be simplified, and the support plate can be peeled off with water, eliminating the need for a dedicated peeling device, etc.
- the package manufacturing process is simplified, which can contribute to cost reduction.
- FIG. 2A and 2B are views showing a state in which an LSI chip is bonded and connected to a substrate, in which FIG. 3A shows a cross-sectional view and FIG. 2B shows a perspective view.
- FIG. 3A shows a cross-sectional view
- FIG. 2B shows a perspective view.
- FIG. 3A shows a cross-sectional view
- FIG. 2B shows a perspective view.
- FIG. 3A shows a cross-sectional view
- FIG. 2B shows a perspective view.
- FIG. 1 is a diagram showing a first example of an electronic component for wiring embodying the present invention
- FIGS. 1A and 1B are side sectional views of a single pattern for one electronic device package. And a perspective view respectively.
- FIGS. 1A and 1B are side sectional views of a single pattern for one electronic device package. And a perspective view respectively.
- FIGS. 1A and 1B are side sectional views of a single pattern for one electronic device package. And a perspective view respectively.
- FIG. 1 is a diagram showing a first example of an electronic component for wiring embodying the present invention
- FIGS. 1A and 1B are side sectional views of a single pattern for one electronic device package. And a perspective view respectively.
- a horizontal wiring and a vertical wiring connected thereto are provided on the wiring board.
- the horizontal wiring in the illustrated example is composed of an inner wiring formed on the inner side of the wiring board, an outer wiring formed on the opposite side, and a via wiring that penetrates the wiring board and connects the inner wiring and the outer wiring. ing.
- the side to which the vertical wiring is connected is referred to as the inner side of the wiring board, and the side to which the opposite support plate is connected is referred to as the outer side.
- the support plate side is the outside.
- These inner wiring, via wiring, and outer wiring constitute a horizontal wiring for rewiring from a vertical wiring position to an arbitrary position outside the wiring board.
- An epoxy resin A, propylene glycol having an ethylene glycol skeleton that is easily peeled off by warm water and having an epoxy group at both ends is coated on the outside of the wiring board having such outer wiring.
- the support plate is bonded using an adhesive containing an epoxy resin B having a skeleton and epoxy groups at both ends and a cationic polymerization initiator C.
- polyethylene glycol or polypropylene glycol D having a molecular weight of 200 to 10,000 may be added.
- the component ratio of A, B, C, and D is not particularly limited, but when component A is 100 parts by weight, B is 10 to 70 parts by weight and D is 10 to 80 parts by weight.
- the photocationic initiator C is 0.1 to 10 parts by weight based on the total of A and B.
- the temperature of water to be touched when the adhesive is peeled is 30 to 85 ° C., particularly preferably 40 to 80 ° C.
- the support plate is a material that can impart rigidity to the wiring board and maintain flatness
- any material that is conductive or insulating, for example, a stainless plate with good flatness can be used.
- Such a wiring board is used by being incorporated in an electronic device package. At that time, a large number of wiring boards as shown in the figure are assembled and connected to individual devices in the final manufacturing process or near the final process. It is separated by dividing into pieces. Therefore, when the electronic device package is assembled in a connected state, a support board having a certain degree of rigidity is required for the wiring board.
- FIG. 2 is a diagram showing a state in which double-sided wiring is formed on the wiring board.
- the wiring board that functions as a wiring substrate is, for example, a polyimide material or a glass epoxy material (a prepreg material made of glass fiber impregnated with an epoxy resin or the like).
- a via wiring penetrating the wiring board is formed of, for example, copper Cu.
- an inner wiring and an outer wiring connected to the via wiring are formed of, for example, copper Cu on the inner side and the outer side of the wiring board, respectively.
- the inner wiring, the via wiring, and the outer wiring constitute a horizontal wiring.
- a resist for forming a vertical wiring is applied, exposed and developed to form an opening for the vertical wiring.
- the inner wiring is used as a current path for plating, the vertical wiring is plated, and the inside of the opening is plated with a metal (for example, copper Cu of the same material as the horizontal wiring) fill in.
- a metal for example, copper Cu of the same material as the horizontal wiring
- the resist for vertical wiring is removed.
- the vertical wiring can be formed by lithography.
- a mask for example, a resist mask, plastic or metal material
- a conductive paste for example, copper paste is used in the opening. Then, it is also formed by plating around the vertical wiring for reinforcement and low resistance.
- solder resist is applied to the outside of the wiring board, but openings are formed at positions where bump electrodes (see FIG. 33) are formed.
- Solder resist is a heat-resistant coating material applied to a specific area on the surface of an electronic circuit board. Is.
- a support plate is adhered and attached to the outside of the wiring board. For this reason, first, as shown in FIG. 7, a required amount of liquid adhesive is hung or applied on a support plate such as stainless steel SUS.
- irradiation with ultraviolet rays UV is performed to develop the ability to peel with moisture.
- the lamp used is a high-pressure mercury lamp or a metal halide lamp.
- the irradiation dose at this time is 1500 to 4500 mj in terms of 365 nm.
- the position of the wiring board on which the solder resist has been applied is aligned on the support plate onto which the adhesive has been dropped, and then pressed and bonded and heated.
- the heating temperature for the purpose of curing the adhesive may be around 85 degrees.
- the wiring board and the support plate are attached in the form of a sheet, irradiated with ultraviolet rays UV, and then heated.
- FIG. 9 shows a state before pasting, and FIG.
- the liquid adhesive is stretched over the entire surface between the support plate and the wiring board.
- the solder resist layer provided on the wiring board has concavo-convex portions of several tens of ⁇ m or more due to openings for external electrodes. In order to absorb the irregularities, liquid is better.
- a spherical spacer (for example, Sekisui Chemical Micropearl) may be placed in the adhesive solution.
- the size of the spacer is about 10 ⁇ m to 100 ⁇ m.
- the amount of added spacer is 0.01 to 5 parts by weight with respect to 100 parts by weight of the adhesive.
- the first example of the electronic component for wiring is completed.
- the used adhesive has the property of swelling with moisture after it has hardened. Specifically, when it touches moisture, it absorbs moisture and swells.
- the electronic component for wiring is brought into contact with moisture in the process after being incorporated into the electronic device package, and is swollen so that the adhesive force is lost. At this time, if the temperature of the water is raised, the time until peeling becomes shorter.
- the adhesive used for attaching the support plate to the outside of the wiring board does not come into contact with moisture during the process of manufacturing the component in order to peel off with moisture. For this reason, it is desirable to bond them at the end after processing of the horizontal wiring and the vertical wiring.
- an adhesive may be applied or immersed in advance on both the front and back surfaces of the support plate, and heat dried after UV irradiation. This is because when the resin is sealed (see FIG. 31), if the sealing resin wraps around the side surface of the support plate, the adhesive is not exposed to the surface, and there is a possibility of not touching moisture during peeling, thus avoiding it. Because. That is, by covering the side surface and top surface of the support plate with an adhesive that can be easily peeled off, even if the sealing resin wraps around the side surface or part of the top surface of the support plate, a surface that is always in contact with water is ensured. This is to make it easier.
- FIG. 11 is a diagram showing a second example of an electronic component for wiring embodying the present invention, and is a side sectional view of a single pattern for one electronic device package.
- the second example of the wiring electronic component shown in the drawing includes the inner wiring on the inner side of the wiring board, but does not include the outer wiring on the outer side. It is different from the example. That is, the horizontal wiring is composed only of the inner wiring.
- a vertical wiring is connected to the inner wiring, as in the first example.
- a support plate is bonded to the outside of such a wiring board using an adhesive that can be easily peeled off with hot water.
- a wiring substrate for example, a polyimide substrate with a copper foil
- a lower metal layer is formed
- the upper metal layer made of a different material (for example, nickel Ni for copper foil) is processed.
- the upper metal layer only needs to be usable as an etching mask for the lower copper foil.
- the combination of the lower metal and the upper metal is not limited to the exemplified combination of copper and nickel. And Au, Ag, Cr and Cu, Cr and Ni, etc. may be used in combination.
- the upper metal layer is processed in the same manner as the vertical wiring formation process described below, by applying a resist on the lower metal layer (copper foil), exposing, developing, and forming a horizontal wiring pattern opening in the resist. Furthermore, the lower metal layer can be used as a current path for plating, and the opening can be filled with metal by plating. At this stage, openings for bump electrodes (see FIG. 39) may be provided in advance in the wiring board.
- a resist for forming a vertical wiring is applied, exposed, and developed to form an opening for the vertical wiring.
- the upper metal layer is used as a current path for plating, vertical wiring is plated, and the inside of the opening is filled with a plating metal (for example, nickel Ni, which is the same as the upper metal).
- a plating metal for example, nickel Ni, which is the same as the upper metal.
- the lower metal layer is etched using the upper metal layer pattern as a mask.
- an etchant it is possible to etch only the lower metal layer without etching the metal for vertical wiring or the upper metal.
- the patterns of both the lower metal layer and the upper metal layer are exactly the same pattern and overlap each other, and both form an inner wiring (horizontal wiring).
- a support plate is adhered and attached to the outside of the wiring board. For this reason, first, as shown in FIG. 18, a required amount of liquid adhesive is dropped or applied onto a support plate such as stainless steel SUS.
- FIG. 20 shows a state before pasting
- FIG. 21 shows a state after pasting.
- the liquid adhesive is stretched over the entire surface between the support plate and the wiring board.
- a second example of the wiring electronic component is completed. This is the same as described above with reference to FIG.
- the adhesive used here is the same as that described in the first example, and is an adhesive that can be easily peeled off with hot water.
- FIG. 22 first, at least 3 made of a lower layer metal for horizontal wiring (for example, thin film copper), an upper layer metal for horizontal wiring (for example, thin film nickel), and a metal for vertical wiring (for example, thick film copper).
- a metal laminate comprising the metal layers is formed.
- This is, for example, a clad material formed by bonding three metal layers.
- the clad material is a material in which different kinds of metals are bonded together by pressure welding.
- Such a metal laminated material is not limited to a clad material, and any metal laminated material can be used as long as it is formed by integrally laminating three metal layers, for example, a metal laminated material laminated by plating. Is possible.
- the lower layer metal for horizontal wiring can be used as an etching mask for the upper layer metal for horizontal wiring.
- the combination of the lower layer metal and the upper layer metal for horizontal wiring may be a combination of materials having high selective etching properties such as Cu and Au, Ag, Cr and Cu, and Cr and Ni, in addition to the exemplified combination of copper and nickel. .
- the metal for vertical wiring is different from the upper layer metal for horizontal wiring, there is no problem even if it is the same as the lower layer metal for horizontal wiring.
- a conductive metal such as copper can be used.
- FIG. 23 is a diagram showing formation of a lower layer metal pattern for horizontal wiring.
- This lower layer metal pattern is formed by lithography.
- the horizontal wiring upper layer metal for example, nickel
- the horizontal wiring lower layer metal for example, copper
- the upper wiring metal for horizontal wiring functions as an etching stopper, even if the vertical wiring metal and the lower wiring metal are formed of the same metal (for example, copper), the vertical wiring metal is etched. None happen.
- the metal laminated material on which the lower layer metal pattern is formed is pasted onto the thin film tape functioning as the wiring substrate using an adhesive having a high adhesive strength.
- the thin film tape functions as a protective film that covers the horizontal wiring portion (rewiring) in the finished product (electronic device package).
- the bump electrode (see FIG. 39) formation position of the thin film tape may be opened in advance.
- this opening may be performed before the last solder ball (bump electrode) attachment in the package manufacturing process.
- the vertical wiring portion is patterned. Patterning of the vertical wiring portion is performed by lithography. Therefore, a resist for forming a vertical wiring portion is applied to the surface of the metal for vertical wiring, the pattern is exposed, developed, and further etched to remove the resist, thereby completing a wiring pattern for the metal for vertical wiring. . By selecting the etching solution, it is possible to etch only the metal for vertical wiring without etching the upper layer metal for horizontal wiring.
- patterning of the upper layer metal of the horizontal wiring portion is performed.
- the patterning of the upper layer metal in the horizontal wiring portion is performed by etching the entire upper layer metal using the vertical wiring portion as a mask.
- the upper layer metal other than directly below the vertical wiring portion is deleted.
- the horizontal wiring portion is formed by the lower layer metal patterned as described above and the upper layer metal immediately below the vertical wiring portion.
- a support plate is adhered and pasted to the outside of the thin film tape (functioning as a wiring substrate).
- a necessary amount of liquid adhesive is hung on or applied to a support plate such as stainless steel SUS, and then irradiated with ultraviolet rays UV. .
- the position of the thin film tape is aligned on the support plate onto which the adhesive has been dropped, and the film is pressed and bonded and heated. Or it pastes in a sheet form and heats it after irradiating with ultraviolet UV.
- FIG. 27 shows a state before pasting
- FIG. 28 shows a state after pasting.
- the liquid adhesive is stretched over the entire surface between the support plate and the wiring board. As a result, as shown in FIG.
- the adhesive used here is the same as that described in the first example or the second example, and is an adhesive that can be easily peeled off with hot water. This support plate is peeled off and removed after the resin sealing step for manufacturing the electronic device package.
- the wiring electronic component of the present invention as described above can be used by being incorporated into various electronic device packages.
- Example 1 an example in which the electronic component for wiring of the first example is incorporated into an organic substrate type electronic device package is referred to as Example 1, and the electronic component for wiring of the second example is integrated into an electronic device package of single-sided wiring substrate type.
- a built-in example will be described as a second embodiment.
- the wiring electronic component of the present invention is, for example, a lead frame type electronic device package as disclosed in Patent Document 1, or a wafer level chip size package. It can be used by incorporating it into various types of electronic device packages.
- FIG. 29 is a diagram showing a state in which an LSI chip is bonded and connected on a multilayer organic substrate.
- the LSI chip is illustrated as being bonded to a multilayer organic substrate with a die bond material and connected to the uppermost wiring pattern (wiring layer) of the organic substrate by a bonding wire.
- a bonding metal pad portion to be a bonding wire connection electrode is formed, and wiring to the pad portion is formed.
- the metal pad portion inside the multilayer or single layer organic substrate and the LSI chip are connected by an Au bonding wire.
- the LSI chip can be flip-chip bonded to the organic substrate (not shown).
- Multi-layer or single-layer organic substrates are used to form a wiring pattern on each layer of a single-layer two-layer wiring structure or a substrate composed of a plurality of layers, and then bond these substrates together to connect the wiring patterns of each layer as necessary.
- Through-holes are formed.
- a conductor layer is formed inside the through hole, and the conductor layer is connected to a land which is an end face electrode portion formed on the outer surface.
- FIG. 30 is a diagram showing a state in which the vertical wiring of the wiring electronic component shown in FIG. 1 is fixed and connected on the multilayer organic substrate to which the LSI chip is bonded and connected.
- the vertical wiring is fixed and electrically connected to a predetermined position of the wiring pattern of the organic substrate by solder connection or connection with a conductive paste such as silver paste.
- the entire electronic device package is integrally connected by a plate-like support plate.
- FIG. 31 is a diagram showing a resin-sealed state. After the vertical wiring of the wiring electronic parts connected together is fixed, in this state, the upper surface of the organic substrate is transfer-molded to the lower surface of the wiring substrate, or liquid resin (the material is, for example, epoxy) Used for resin sealing.
- liquid resin the material is, for example, epoxy
- FIG. 32 is a diagram showing the state after the support plate is peeled off.
- the entire configuration shown in FIG. 31 is submerged in water or warm water, By swelling, the adhesive force is lost and the support plate is self-peeled. At this time, if the temperature of the water is raised, the time until peeling becomes shorter.
- Table 1 shows the composition of the adhesive used in Example 1.
- This stage can be used as a finished product.
- a wiring electronic component integrated with a support plate having a predetermined rigidity is formed, and after connecting the electronic component to the multilayer substrate on which the LSI chip is mounted, the support plate and the multilayer substrate are connected. After the resin is filled in between, the support plate that does not require rigidity is peeled off after the resin is solidified.
- the solder resist of the wiring electronic component functions as a protective film for the finished product.
- the outer wiring exposed in the opening provided in the solder resist can be used as the external electrode.
- bump electrodes (external electrodes) for external connection are formed on the end surface electrode portions (lands) formed there. Can do. Thereafter, cutting for chip separation is further performed to complete the product.
- FIGS. 34 to 39 the production of the electronic component for wiring (see FIG. 11) of the second example will be described by taking as an example a case where the electronic device package of the single-sided wiring board type is incorporated.
- . 34A and 34B are diagrams showing a semiconductor chip (LSI chip) as an electronic component bonded and connected to a substrate, where FIG. 34A is a cross-sectional view and FIG. 34B is a perspective view.
- the illustrated substrate is exemplified as a silicon substrate (semiconductor substrate) having a wiring layer (wiring pattern) formed on the upper surface.
- a metal seed layer to be a wiring pattern is formed on the entire surface of the semiconductor substrate (for example, a sputtered layer or a nano metal material is coated).
- the seed layer for example, gold, silver, copper, or palladium foil that enables copper plating can be used.
- the wiring layer pattern is completed by applying a resist on the seed layer, exposing and developing the pattern, further etching, removing the resist.
- a wiring layer is grown on the seed layer by plating.
- the lithography process can be omitted by patterning the seed layer directly with nano metal particles. This direct patterning is a method in which nano metal particles such as copper are contained in an organic solvent and a desired pattern is drawn by an ink jet method which is practically used in a printer.
- the semiconductor LSI chip is illustrated as being flip-chip bonded to the wiring layer on the substrate.
- a bonding metal pad portion it is also possible to form a bonding metal pad portion to be a bonding wire connection electrode on the wiring layer on the substrate and connect it by a bonding wire.
- the metal pad portion on the wiring layer and the semiconductor LSI chip are connected by, for example, an Au bonding wire.
- FIG. 35 is a diagram showing a second example (see FIG. 11) of the above-described wiring electronic component placed on a substrate (see FIG. 34) on which a semiconductor LSI chip is mounted.
- FIG. 35 is a diagram showing a second example (see FIG. 11) of the above-described wiring electronic component placed on a substrate (see FIG. 34) on which a semiconductor LSI chip is mounted.
- the 1st example (refer FIG. 1) or the 3rd example (refer FIG. 28) of the electronic component for wiring is used similarly. be able to.
- FIG. 36 is a diagram showing a state in which the wiring electronic components are connected to the semiconductor substrate on which the semiconductor LSI chip is mounted.
- the substrate side is referred to as the back surface
- the wiring electronic component side disposed thereon is referred to as the front surface.
- the vertical wiring of the wiring electronic component is fixed and electrically connected to a predetermined position of the wiring layer formed on the upper surface of the substrate.
- the metal pad portion is provided with a concave portion
- the wiring electronic component side can be formed by a method of providing a convex portion and inserting / crimping or crimping.
- FIG. 37 is a diagram showing a resin-sealed state. After the integrally connected vertical wiring is fixed at a predetermined position of the wiring layer, in this state, the upper surface of the substrate is transfer-molded to the lower surface of the support plate, or liquid resin (the material is, for example, epoxy) Is sealed with resin.
- liquid resin the material is, for example, epoxy
- FIG. 38 is a diagram showing the state after the support plate is peeled off.
- the support plate is peeled off by submerging the entire configuration shown in FIG. 37 in water or warm water.
- the composition of the adhesive used in Example 2 is shown in Table 2.
- the wiring board exposed on the upper side of FIG. 38 (or the thin film tape shown in FIG. 28) functions as a protective film for the finished product.
- the solder resist serves as a protective film.
- FIG. 39 is a cross-sectional view showing a completed electronic device package. As shown in FIG. 39, on the front surface side, a hole is formed in the protective film (wiring substrate), and external connection electrodes (bump electrodes) connected to the horizontal wiring exposed through the openings are formed. With this horizontal wiring, an external connection electrode can be provided at a position different from the tip of the vertical wiring.
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Abstract
Description
Claims (19)
- 半導体チップを含む回路素子を配置し、該回路素子から垂直配線及び水平配線を介して外部電極に接続される電子デバイスパッケージに組み込んで用いるための配線用電子部品において、
前記水平配線、及び該水平配線に接続されてそこから垂直方向に伸びる前記垂直配線を備えた配線基材と、
前記水平配線及び垂直配線を備えている前記配線基材が水で剥離可能の接着剤を用いて接着されている支持板と、
から成る配線用電子部品。 - 前記接着剤は、エチレングリコール骨格を有し両末端にエポキシ基を有するエポキシ樹脂、プロピレングリコール骨格を有し両末端にエポキシ基を有するエポキシ樹脂、及び、カチオン重合開始剤を含有する請求項1に記載の配線用電子部品。
- 前記エチレングリコール骨格を有し両末端にエポキシ基を有するエポキシ樹脂をA、前記プロピレングリコール骨格を有し両末端にエポキシ基を有するエポキシ樹脂をB、及び、前記カチオン重合開始剤をCとして、成分Aを100重量部とすると成分Bが10~70重量部、成分CはAとBの合計に対し0.1から10重量部含有する請求項2に記載の配線用電子部品。
- 前記水平配線は、前記配線基材の一方の面上で前記垂直配線に直接接続される内側配線と、その反対面上に形成された外側配線と、該配線基材を貫通して前記内側配線と前記外側配線を接続するビア配線により構成されている請求項2に記載の配線用電子部品。
- 前記外側配線を備えた前記配線基材の外側には、ソルダーレジストを塗布し、さらにその上に、前記支持板が接着されている請求項2に記載の配線用電子部品。
- 前記接着剤は、膜厚が必要な箇所で一定となるように球状のスペーサを混入させた請求項2に記載の配線用電子部品。
- 前記支持板は前記配線基材に剛性を付与して平坦性を維持することのできる導電性或いは絶縁性の材料によって形成され、かつ、前記配線基材はポリイミド材或いはガラスエポキシ材によって形成される請求項1に記載の配線用電子部品。
- 前記接着剤は、前記支持板の側面及び表裏両面に塗布されている請求項1に記載の配線用電子部品。
- 半導体チップを含む回路素子を配置し、該回路素子から垂直配線及び水平配線を介して外部電極に接続される電子デバイスパッケージに組み込んで用いるための配線用電子部品の製造方法において、
配線基材に、これを貫通するビア配線を形成し、かつ、この配線基材の内側及び外側のそれぞれに、前記ビア配線に接続される内側配線及び外側配線を形成して、この内側配線、ビア配線、及び外側配線により前記水平配線を構成し、
前記内側配線に接続されてそこから垂直方向に伸びる前記垂直配線を形成し、
前記配線基材の最外側配線形成側に、外部接続用の開口位置を除いて、ソルダーレジストを塗布し、
該ソルダーレジストを塗布した前記配線基材を、水で剥離可能の接着剤を用いて支持板に接着する、
ことから成る配線用電子部品の製造方法。 - 前記配線基材の前記支持板への接着は、エチレングリコール骨格を有し両末端にエポキシ基を有するエポキシ樹脂、プロピレングリコール骨格を有し両末端にエポキシ基を有するエポキシ樹脂、及び、カチオン重合開始剤を含有する液体状の前記接着剤を支持板の上に必要量を垂らすか或いは塗布して、紫外線UVの照射を行なった後に押し付けて貼り合わせるか或いは貼り付けた後に紫外線UVの照射を行ない、加熱することにより行う請求項9に記載の配線用電子部品の製造方法。
- 前記垂直配線は、前記配線基材の内側配線形成側にレジストを塗布し、露光、現像して、垂直配線用の開口を形成した後、前記内側配線をメッキのための電流パスとして利用して、開口内をメッキ金属によって埋めることにより形成される請求項9に記載の配線用電子部品の製造方法。
- さらに、配線層、及び該配線層に接続されたLSIチップ接続領域及び垂直配線接続領域を上面に有し、かつ、前記LSIチップ接続領域との間で配線したLSIチップを上面に装着した基板を備え、かつ、この基板上の前記垂直配線接続領域に前記垂直配線を固定して電気的に接続し、樹脂封止した後、水あるいは温水に沈めて前記接着剤を膨潤させて前記支持板を剥離することにより構成される電子デバイスパッケージに組み込んで用いられる請求項9に記載の配線用電子部品の製造方法。
- 半導体チップを含む回路素子を配置し、該回路素子から垂直配線及び水平配線を介して外部電極に接続される電子デバイスパッケージに組み込んで用いるための配線用電子部品の製造方法において、
配線基材面上に前記水平配線を形成し、
前記水平配線に接続されてそこから垂直方向に伸びる前記垂直配線を形成し、
前記水平配線及び前記垂直配線を形成した前記配線基材を、水分で剥離可能の接着剤を用いて支持板に接着する、
ことから成る配線用電子部品の製造方法。 - 前記水平配線の形成のために、前記配線基材に下層金属層を形成し、
該下層金属層の上に、それとは異なる材質の上層金属層を形成した後、該上層金属層を水平配線パターンに加工し、
前記垂直配線を形成した後、前記上層金属層をエッチング用マスクとして使用して、前記下層金属層のエッチングを行なうことにより、同一パターンの下層金属層と上層金属層の両者により前記水平配線を構成する請求項13に記載の配線用電子部品の製造方法。 - 前記配線基材の前記支持板への接着は、エチレングリコール骨格を有し両末端にエポキシ基を有するエポキシ樹脂、プロピレングリコール骨格を有し両末端にエポキシ基を有するエポキシ樹脂、及び、カチオン重合開始剤を含有する液体状の前記接着剤を支持板の上に必要量を垂らすか或いは塗布して、紫外線UVの照射を行なった後に押し付けて貼り合わせるか或いは貼り付けた後に紫外線UVの照射を行ない、加熱することにより行う請求項13に記載の配線用電子部品の製造方法。
- さらに、配線層、及び該配線層に接続されたLSIチップ接続領域及び垂直配線接続領域を上面に有し、かつ、前記LSIチップ接続領域との間で配線したLSIチップを上面に装着した基板を備え、かつ、この基板上の前記垂直配線接続領域に前記垂直配線を固定して電気的に接続し、樹脂封止した後、水あるいは温水に沈めて前記接着剤を膨潤させて前記支持板を剥離することにより構成される電子デバイスパッケージに組み込んで用いられる請求項13に記載の配線用電子部品の製造方法。
- 半導体チップを含む回路素子を配置し、該回路素子から垂直配線及び水平配線を介して外部電極に接続される電子デバイスパッケージに組み込んで用いるための配線用電子部品の製造方法において、
水平配線用下層金属と、水平配線用上層金属と、垂直配線用金属から成る少なくとも3層の金属層からなる金属積層材を形成し、
水平配線用下層金属パターンを形成し、かつ、この水平配線用下層金属パターンを形成した金属積層材を、配線基材の上に貼り付けた後、パターニングを行うことにより垂直配線部を形成し、
垂直配線部をマスクとして、水平配線用上層金属のパターニングを行うことにより、パターニングした水平配線用下層金属及び水平配線用上層金属により水平配線部を形成し、
前記垂直配線部及び水平配線部を形成した前記配線基材を、水で剥離可能の接着剤を用いて支持板に接着する、
ことから成る配線用電子部品の製造方法。 - 前記配線基材の前記支持板への接着は、エチレングリコール骨格を有し両末端にエポキシ基を有するエポキシ樹脂、プロピレングリコール骨格を有し両末端にエポキシ基を有するエポキシ樹脂、及び、カチオン重合開始剤を含有する液体状の前記接着剤を支持板の上に必要量を垂らすか或いは塗布して、紫外線UVの照射を行なった後に押し付けて貼り合わせるか或いは貼り付けた後に紫外線UVの照射を行ない、加熱することにより行う請求項17に記載の配線用電子部品の製造方法。
- さらに、配線層、及び該配線層に接続されたLSIチップ接続領域及び垂直配線接続領域を上面に有し、かつ、前記LSIチップ接続領域との間で配線したLSIチップを上面に装着した基板を備え、かつ、この基板上の前記垂直配線接続領域に前記垂直配線を固定して電気的に接続し、樹脂封止した後、水あるいは温水に沈めて前記接着剤を膨潤させて前記支持板を剥離することにより構成される電子デバイスパッケージに組み込んで用いられる請求項17に記載の配線用電子部品の製造方法。
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CN110027902B (zh) * | 2018-01-12 | 2021-02-12 | 神讯电脑(昆山)有限公司 | 触控面板真空吸附装置 |
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