WO2011037412A3 - 전자부품용 냉각장치 - Google Patents

전자부품용 냉각장치 Download PDF

Info

Publication number
WO2011037412A3
WO2011037412A3 PCT/KR2010/006507 KR2010006507W WO2011037412A3 WO 2011037412 A3 WO2011037412 A3 WO 2011037412A3 KR 2010006507 W KR2010006507 W KR 2010006507W WO 2011037412 A3 WO2011037412 A3 WO 2011037412A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
cooling device
electronic parts
heat pipe
contact
Prior art date
Application number
PCT/KR2010/006507
Other languages
English (en)
French (fr)
Other versions
WO2011037412A2 (ko
Inventor
윤선규
정상준
정경채
부성덕
Original Assignee
잘만테크㈜
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 잘만테크㈜ filed Critical 잘만테크㈜
Publication of WO2011037412A2 publication Critical patent/WO2011037412A2/ko
Publication of WO2011037412A3 publication Critical patent/WO2011037412A3/ko

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

본 발명은 전자부품용 냉각장치에 관한 것이다. 이러한 전자부품용 냉각장치는, 발열부품과 접촉하는 접촉면과, 상기 접촉면에 형성된 적어도 하나의 수용홈을 구비하며, 내주면에 윅이 형성된 제1 히트파이프와; 상기 수용홈에 삽입되며 상기 발열부품과 접촉하는 접촉부를 구비하며, 상기 윅이 내주면에 형성된 제2 히트파이프와; 상기 발열부품의 상측에 서로 이격배치되며, 상기 제1 히트파이프와 상기 제2 히트파이프에 결합되는 복수의 방열핀을 포함하는 것을 특징으로 한다.
PCT/KR2010/006507 2009-09-25 2010-09-20 전자부품용 냉각장치 WO2011037412A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0091154 2009-09-25
KR1020090091154A KR20110033596A (ko) 2009-09-25 2009-09-25 전자부품용 냉각장치

Publications (2)

Publication Number Publication Date
WO2011037412A2 WO2011037412A2 (ko) 2011-03-31
WO2011037412A3 true WO2011037412A3 (ko) 2011-07-21

Family

ID=43796389

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/006507 WO2011037412A2 (ko) 2009-09-25 2010-09-20 전자부품용 냉각장치

Country Status (2)

Country Link
KR (1) KR20110033596A (ko)
WO (1) WO2011037412A2 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101339593B1 (ko) * 2012-07-09 2014-01-02 윤국영 전자부품용 냉각장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020080582A1 (en) * 2000-12-27 2002-06-27 Kai-Cheng Chang Heat pipe heat dissipating device
JP2005203665A (ja) * 2004-01-19 2005-07-28 Kiko Kagi Kofun Yugenkoshi 放熱モジュールの構造およびその製造方法
JP2006196786A (ja) * 2005-01-14 2006-07-27 Furukawa Electric Co Ltd:The ヒートパイプ付ヒートシンク
KR20090007194U (ko) * 2008-01-11 2009-07-15 충-시엔 후앙 베이스 패널이 없는 쿨러 모듈

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020080582A1 (en) * 2000-12-27 2002-06-27 Kai-Cheng Chang Heat pipe heat dissipating device
JP2005203665A (ja) * 2004-01-19 2005-07-28 Kiko Kagi Kofun Yugenkoshi 放熱モジュールの構造およびその製造方法
JP2006196786A (ja) * 2005-01-14 2006-07-27 Furukawa Electric Co Ltd:The ヒートパイプ付ヒートシンク
KR20090007194U (ko) * 2008-01-11 2009-07-15 충-시엔 후앙 베이스 패널이 없는 쿨러 모듈

Also Published As

Publication number Publication date
WO2011037412A2 (ko) 2011-03-31
KR20110033596A (ko) 2011-03-31

Similar Documents

Publication Publication Date Title
WO2006133211A3 (en) Heat transfer surface for electronic cooling
GB2454152A8 (en) Heat transfer oil with high auto ignition temperature
TWM363618U (en) Thermal conducting structure of heat sink fins
WO2011066178A3 (en) Diode leadframe for solar module assembly
WO2009074788A3 (en) Apparatus for hot and cold processing
WO2011008101A3 (en) Subsea cooler
EP2345862A3 (en) Fin for heat exchanger and heat exchanger having the same
WO2011109501A3 (en) Electronic device provided with socket for card-shaped component
WO2012040281A3 (en) Micro-channel heat exchanger including independent heat exchange circuits and method
TW200802762A (en) Heat sink, electronic device, and tuner apparatus
WO2008114381A1 (ja) ヒートシンク及び電子装置及び電子装置の製造方法
WO2014170596A3 (fr) Brasage sans outillage
TW200801433A (en) Heat dissipation module and heat column thereof
EP2469214A3 (en) Surface cooler having channeled fins
TW200721945A (en) Dissipating heat device of fin-type
WO2011163674A3 (en) A led package and method of making the same
US20120241132A1 (en) Non-base block heat sink
WO2010016980A3 (en) Method and system for an integrated gasifier and syngas cooler
WO2011037412A3 (ko) 전자부품용 냉각장치
WO2011109310A3 (en) Thermal vias in an integrated circuit package with an embedded die
FR2918166B1 (fr) Echangeur de chaleur a structure optimisee.
WO2010090432A3 (ko) 베이스 블록을 구비한 히트파이프 및 이를 제조하는 방법
US9347712B2 (en) Heat dissipating device
WO2011099788A3 (ko) 방열판 구조
TWI265267B (en) Heat dissipation device with heat pipe

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10819053

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10819053

Country of ref document: EP

Kind code of ref document: A2