TWM363618U - Thermal conducting structure of heat sink fins - Google Patents

Thermal conducting structure of heat sink fins

Info

Publication number
TWM363618U
TWM363618U TW098207615U TW98207615U TWM363618U TW M363618 U TWM363618 U TW M363618U TW 098207615 U TW098207615 U TW 098207615U TW 98207615 U TW98207615 U TW 98207615U TW M363618 U TWM363618 U TW M363618U
Authority
TW
Taiwan
Prior art keywords
heat
dissipating fin
protrusions
heat sink
conducting structure
Prior art date
Application number
TW098207615U
Other languages
Chinese (zh)
Inventor
Guo-Ren Lin
zhi-hong Zheng
Guan-Da Pan
Original Assignee
Cpumate Inc
Golden Sun News Tech Co Ltd
Guan Din Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cpumate Inc, Golden Sun News Tech Co Ltd, Guan Din Technology Co Ltd filed Critical Cpumate Inc
Priority to TW098207615U priority Critical patent/TWM363618U/en
Priority to CN2009201544943U priority patent/CN201429360Y/en
Priority to US12/512,341 priority patent/US20100282444A1/en
Publication of TWM363618U publication Critical patent/TWM363618U/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F28F1/325—Fins with openings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Geometry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a heat-dissipating fin capable of increasing surface turbulence, which includes a first heat-dissipating fin and a second heat-dissipating fin. A first surface of the first heat-dissipating fin is provided with a plurality of first protrusions arranged at intervals. The second heat-dissipating fin has a second surface toward the first surface. The second surface is also provided with a plurality of second protrusions arranged at intervals. The second protrusions are arranged to correspond to the first protrusions. The second heat-dissipating fin is overlapped with the first heat-dissipating fin. With the arrangement of the first protrusions and the second protrusions, the heat-dissipating area of the first heat-dissipating fin and the second heat-dissipating fin can be increased so as to increase the surface turbulence. Thus, the heat-exchange efficiency can be enhanced.
TW098207615U 2009-05-05 2009-05-05 Thermal conducting structure of heat sink fins TWM363618U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW098207615U TWM363618U (en) 2009-05-05 2009-05-05 Thermal conducting structure of heat sink fins
CN2009201544943U CN201429360Y (en) 2009-05-05 2009-05-14 Heat conduction structure of radiating fins
US12/512,341 US20100282444A1 (en) 2009-05-05 2009-07-30 Heat-dissipating fin assembly with heat-conducting structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW098207615U TWM363618U (en) 2009-05-05 2009-05-05 Thermal conducting structure of heat sink fins
CN2009201544943U CN201429360Y (en) 2009-05-05 2009-05-14 Heat conduction structure of radiating fins

Publications (1)

Publication Number Publication Date
TWM363618U true TWM363618U (en) 2009-08-21

Family

ID=49626683

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098207615U TWM363618U (en) 2009-05-05 2009-05-05 Thermal conducting structure of heat sink fins

Country Status (3)

Country Link
US (1) US20100282444A1 (en)
CN (1) CN201429360Y (en)
TW (1) TWM363618U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI420336B (en) * 2009-12-30 2013-12-21 Taiwan Semiconductor Mfg Semiconductor integrated circuit, method for designing the same, and corresponding computer readable storage memory medium
CN106200226A (en) * 2014-12-22 2016-12-07 中强光电股份有限公司 Heat radiation module with turbulent flow structure
US10281807B2 (en) 2017-01-12 2019-05-07 Coretronic Corporation Projector, heat dissipation module, and heat dissipation fin set
TWI746280B (en) * 2020-11-23 2021-11-11 邁萪科技股份有限公司 Air-guiding heat dissipation module

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102345844A (en) * 2010-07-30 2012-02-08 欧司朗有限公司 Cooling device and manufacturing method thereof as well as LED (light emitting diode) illumination device with cooling device
CN203327467U (en) * 2013-07-11 2013-12-04 酷码科技股份有限公司 Heat-dissipating module
CN105431013B (en) * 2015-12-15 2017-08-25 肥东凯利电子科技有限公司 A kind of Turbulent Flow Type electric machine controller radiating bottom plate
US10396413B2 (en) * 2016-01-22 2019-08-27 Ford Global Technologies, Llc Battery cooling fin
USD840958S1 (en) * 2016-11-15 2019-02-19 Borgwamer Emissions Systems Spain, S.L.U. Shaped tube with a pattern
CN208834080U (en) 2018-07-23 2019-05-07 中强光电股份有限公司 Projection arrangement, radiating module and radiating fin
US10739832B2 (en) * 2018-10-12 2020-08-11 International Business Machines Corporation Airflow projection for heat transfer device
CN112698541A (en) * 2019-10-22 2021-04-23 中强光电股份有限公司 Heat dissipation module and projection device using same
EP3859261B1 (en) * 2020-01-29 2022-11-09 Cooler Master Co., Ltd. Heat exchanger fin and manufacturing method of the same
CN114585211A (en) * 2020-11-30 2022-06-03 惠州惠立勤电子科技有限公司 Air guide type heat radiation module
US20220243991A1 (en) * 2021-02-02 2022-08-04 Taiwan Microloops Corp. Wind-guiding type heat dissipation module
TWI808563B (en) * 2021-12-10 2023-07-11 訊凱國際股份有限公司 Heat dissipation device and graphics card assembly
CN114597698B (en) * 2022-02-28 2024-04-16 中航光电科技股份有限公司 LRM module capable of being quickly assembled and disassembled and preventing rain and electromagnetic shielding

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3258832A (en) * 1962-05-14 1966-07-05 Gen Motors Corp Method of making sheet metal heat exchangers
JP3240408B2 (en) * 1998-04-09 2001-12-17 雅多有限公司 heatsink
US6199625B1 (en) * 1999-06-11 2001-03-13 Psc Computer Products, Inc. Stackable heat sink for electronic components
DE10220532A1 (en) * 2001-05-11 2002-11-14 Behr Gmbh & Co Heat-exchange radiator has protruberances on sheets from hollow plate plane facing inwards
US6862183B2 (en) * 2001-10-29 2005-03-01 Intel Corporation Composite fins for heat sinks
CN2594989Y (en) * 2001-11-29 2003-12-24 王清风 Heat exchange fin plate for improving heat exchange efficience
TW530993U (en) * 2002-01-14 2003-05-01 Chia Cherne Industry Co Ltd Dual tilted-side heat sink base structure to reduce the fan pressure reduction
TW587902U (en) * 2002-07-26 2004-05-11 Hon Hai Prec Ind Co Ltd Heat sink
USD478055S1 (en) * 2002-08-08 2003-08-05 Hon Hai Precision Ind. Co., Ltd. Heat dissipating fin
US20040256121A1 (en) * 2003-06-09 2004-12-23 Pollard Lorne R. Cultivator sweep assembly
US6944024B1 (en) * 2004-02-19 2005-09-13 Audioplex Technology Incorporated Heat sink bracket for powered loudspeaker
TW200528966A (en) * 2004-02-27 2005-09-01 Quanta Comp Inc Heat-dissipating module and structure thereof
CN2800719Y (en) * 2005-06-01 2006-07-26 鸿富锦精密工业（深圳）有限公司 Heat radiator
CN2842733Y (en) * 2005-06-10 2006-11-29 富准精密工业(深圳)有限公司 Radiating apparatus
CN100444714C (en) * 2006-02-10 2008-12-17 富准精密工业(深圳)有限公司 Radiator
US7215548B1 (en) * 2006-03-20 2007-05-08 Foxconn Technology Co., Ltd. Heat dissipating device having a fin also functioning as a fan duct
US7568518B2 (en) * 2006-07-21 2009-08-04 Furui Precise Component (Kunshan) Co., Ltd. Heat sink
US20080017350A1 (en) * 2006-07-21 2008-01-24 Foxconn Technology Co., Ltd. Heat sink

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI420336B (en) * 2009-12-30 2013-12-21 Taiwan Semiconductor Mfg Semiconductor integrated circuit, method for designing the same, and corresponding computer readable storage memory medium
US8813014B2 (en) 2009-12-30 2014-08-19 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and method for making the same using semiconductor fin density design rules
CN106200226A (en) * 2014-12-22 2016-12-07 中强光电股份有限公司 Heat radiation module with turbulent flow structure
US10114274B2 (en) 2014-12-22 2018-10-30 Coretronic Corporation Heat dissipating module having turbulent structures
CN106200226B (en) * 2014-12-22 2018-11-02 中强光电股份有限公司 Heat radiation module with turbulent flow structure
US10281807B2 (en) 2017-01-12 2019-05-07 Coretronic Corporation Projector, heat dissipation module, and heat dissipation fin set
TWI746280B (en) * 2020-11-23 2021-11-11 邁萪科技股份有限公司 Air-guiding heat dissipation module

Also Published As

Publication number Publication date
CN201429360Y (en) 2010-03-24
US20100282444A1 (en) 2010-11-11

Similar Documents

Publication Publication Date Title
TWM363618U (en) Thermal conducting structure of heat sink fins
TWI411383B (en)
EP2626899A3 (en) Heat dissipating module
WO2011013905A3 (en) Battery module having improved cooling efficiency
JP2011181882A5 (en)
WO2012142068A3 (en) Led lamp
WO2011094319A3 (en) Microfabricated pillar fins for thermal management
WO2013000713A3 (en) Solar installation with a solar collector and a photovoltaic or thermoelectric converter
CN203706120U (en) Efficient CPU radiator
CN203706117U (en) Air-cooling and water-cooling integrated radiator
EP2559938A3 (en) Heat sink for LED lamp
EA200970511A1 (en) DEVICE FOR CONVERSION OF ENERGY AND EQUIPMENT FOR CONVERSION OF ENERGY
CN203656870U (en) LED lamp sunflower radiator
WO2012070874A3 (en) Complex heat sink for an led light, and led light comprising same
TW201612434A (en) Ventilated brake disc of high-efficiency thermoelectric conversion system
CN204227373U (en) A kind of high-power LED radiator
CN202513812U (en) Heat radiator for inverter
TW200738114A (en) Heat sink
CN204099989U (en) High efficiency and heat radiation LED lamp
IT1396923B1 (en) HEAT EXCHANGER WITH INCREASED THERMAL EFFICIENCY.
CN203082846U (en) Combined cooling device
CN202092074U (en) Heat radiation apparatus for large power LED light source
WO2013027953A3 (en) Lighting lamp
WO2012067361A3 (en) Heat sink for led lamp
CN102384528A (en) Heating pipe plugging cap with heat radiating fins

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees