WO2008114381A1 - ヒートシンク及び電子装置及び電子装置の製造方法 - Google Patents

ヒートシンク及び電子装置及び電子装置の製造方法 Download PDF

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Publication number
WO2008114381A1
WO2008114381A1 PCT/JP2007/055519 JP2007055519W WO2008114381A1 WO 2008114381 A1 WO2008114381 A1 WO 2008114381A1 JP 2007055519 W JP2007055519 W JP 2007055519W WO 2008114381 A1 WO2008114381 A1 WO 2008114381A1
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WIPO (PCT)
Prior art keywords
electronic device
heat sink
heat transfer
radiation fins
manufacturing
Prior art date
Application number
PCT/JP2007/055519
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English (en)
French (fr)
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WO2008114381A8 (ja
Inventor
Hisao Anzai
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Fujitsu Limited
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Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/055519 priority Critical patent/WO2008114381A1/ja
Priority to CN200780052112A priority patent/CN101627472A/zh
Priority to JP2009504981A priority patent/JPWO2008114381A1/ja
Publication of WO2008114381A1 publication Critical patent/WO2008114381A1/ja
Publication of WO2008114381A8 publication Critical patent/WO2008114381A8/ja
Priority to US12/461,620 priority patent/US20090310310A1/en

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    • H—ELECTRICITY
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    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

　本発明はヒートシンク及び電子装置及び電子装置の製造方法に係り、半導体チップに熱的に接続されるベースと複数の放熱フィンを備えたヒートシンクにおいて、前記放熱フィンの内、半導体チップからの熱伝導温度が高い中央位置に配設された放熱フィンを長く形成すると共に、これより熱伝導温度が低くなるに従い放熱フィンを漸次短く形成する。また、放熱フィンが、ベースより直立した直立部と、このから外側に向け略直角に折り曲げられた水平部とを有する構成とする。
PCT/JP2007/055519 2007-03-19 2007-03-19 ヒートシンク及び電子装置及び電子装置の製造方法 WO2008114381A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2007/055519 WO2008114381A1 (ja) 2007-03-19 2007-03-19 ヒートシンク及び電子装置及び電子装置の製造方法
CN200780052112A CN101627472A (zh) 2007-03-19 2007-03-19 散热器和电子装置以及电子装置的制造方法
JP2009504981A JPWO2008114381A1 (ja) 2007-03-19 2007-03-19 ヒートシンク及び電子装置及び電子装置の製造方法
US12/461,620 US20090310310A1 (en) 2007-03-19 2009-08-18 Heat sink, electronic device, and method of manufacturing electronic device

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Application Number Priority Date Filing Date Title
PCT/JP2007/055519 WO2008114381A1 (ja) 2007-03-19 2007-03-19 ヒートシンク及び電子装置及び電子装置の製造方法

Related Child Applications (1)

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US12/461,620 Continuation US20090310310A1 (en) 2007-03-19 2009-08-18 Heat sink, electronic device, and method of manufacturing electronic device

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WO2008114381A1 true WO2008114381A1 (ja) 2008-09-25
WO2008114381A8 WO2008114381A8 (ja) 2008-12-18

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JP (1) JPWO2008114381A1 (ja)
CN (1) CN101627472A (ja)
WO (1) WO2008114381A1 (ja)

Cited By (3)

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JP2014078563A (ja) * 2012-10-09 2014-05-01 Aps Japan Co Ltd ヒートシンク
JP2020533796A (ja) * 2017-09-21 2020-11-19 アマゾン テクノロジーズ インコーポレイテッド ヒートシンクを備えるプリント回路基板
US11083103B2 (en) 2018-03-27 2021-08-03 Brother Kogyo Ka Bush Iki Kaisha Electronic module

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012017967A (ja) * 2010-06-09 2012-01-26 Best-Thermal Co Ltd 空調装置
US9161478B2 (en) * 2012-02-24 2015-10-13 Futurewei Technologies, Inc. Apparatus and method for an active antenna heat sink
WO2013160956A1 (ja) * 2012-04-26 2013-10-31 三菱電機株式会社 熱交換器用ヘッダ及びこの熱交換器用ヘッダを備えた熱交換器
JP2013258387A (ja) * 2012-05-15 2013-12-26 Rohm Co Ltd パワーモジュール半導体装置
KR101388845B1 (ko) * 2012-07-10 2014-04-23 삼성전기주식회사 다단 히트 싱크를 구비한 냉각 시스템 및 그 제어방법
WO2015087626A1 (ja) * 2013-12-11 2015-06-18 Ｎｅｃライティング株式会社 照明器具
FR3036918B1 (fr) * 2015-05-29 2018-08-10 Thales Carte electronique et procede de fabrication associe
CN105704985A (zh) * 2016-03-22 2016-06-22 深圳市智汇十方科技有限公司 一种纳米散热片及制造方法
CN105916353B (zh) * 2016-05-17 2019-03-08 联想(北京)有限公司 一种散热装置、直立型***支架、处理设备及电子设备
US11175103B2 (en) * 2019-09-13 2021-11-16 Toshiba Memory Corporation Heat sink with dashed crosshatched fin pattern
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