WO2011037412A3 - Dispositif de refroidissement pour composants électroniques - Google Patents

Dispositif de refroidissement pour composants électroniques Download PDF

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Publication number
WO2011037412A3
WO2011037412A3 PCT/KR2010/006507 KR2010006507W WO2011037412A3 WO 2011037412 A3 WO2011037412 A3 WO 2011037412A3 KR 2010006507 W KR2010006507 W KR 2010006507W WO 2011037412 A3 WO2011037412 A3 WO 2011037412A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
cooling device
electronic parts
heat pipe
contact
Prior art date
Application number
PCT/KR2010/006507
Other languages
English (en)
Korean (ko)
Other versions
WO2011037412A2 (fr
Inventor
윤선규
정상준
정경채
부성덕
Original Assignee
잘만테크㈜
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 잘만테크㈜ filed Critical 잘만테크㈜
Publication of WO2011037412A2 publication Critical patent/WO2011037412A2/fr
Publication of WO2011037412A3 publication Critical patent/WO2011037412A3/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un dispositif de refroidissement pour composants électroniques, comportant : un premier caloduc muni d'une mèche sur sa surface circonférentielle intérieure et présentant une surface de contact en contact avec un composant émettant de la chaleur ainsi qu'au moins un évidement de logement formé sur la surface de contact ; un deuxième caloduc muni de la mèche sur sa surface circonférentielle intérieure et doté d'une partie de contact qui est insérée dans l'évidement de logement et entre en contact avec le composant émettant de la chaleur ; et une pluralité d'ailettes dissipatrices de chaleur qui sont disposées de façon espacée les unes par rapport aux autres sur la face supérieure du composant émettant de la chaleur et qui sont jointes au premier caloduc et au deuxième caloduc.
PCT/KR2010/006507 2009-09-25 2010-09-20 Dispositif de refroidissement pour composants électroniques WO2011037412A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0091154 2009-09-25
KR1020090091154A KR20110033596A (ko) 2009-09-25 2009-09-25 전자부품용 냉각장치

Publications (2)

Publication Number Publication Date
WO2011037412A2 WO2011037412A2 (fr) 2011-03-31
WO2011037412A3 true WO2011037412A3 (fr) 2011-07-21

Family

ID=43796389

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/006507 WO2011037412A2 (fr) 2009-09-25 2010-09-20 Dispositif de refroidissement pour composants électroniques

Country Status (2)

Country Link
KR (1) KR20110033596A (fr)
WO (1) WO2011037412A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101339593B1 (ko) * 2012-07-09 2014-01-02 윤국영 전자부품용 냉각장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020080582A1 (en) * 2000-12-27 2002-06-27 Kai-Cheng Chang Heat pipe heat dissipating device
JP2005203665A (ja) * 2004-01-19 2005-07-28 Kiko Kagi Kofun Yugenkoshi 放熱モジュールの構造およびその製造方法
JP2006196786A (ja) * 2005-01-14 2006-07-27 Furukawa Electric Co Ltd:The ヒートパイプ付ヒートシンク
KR20090007194U (ko) * 2008-01-11 2009-07-15 충-시엔 후앙 베이스 패널이 없는 쿨러 모듈

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020080582A1 (en) * 2000-12-27 2002-06-27 Kai-Cheng Chang Heat pipe heat dissipating device
JP2005203665A (ja) * 2004-01-19 2005-07-28 Kiko Kagi Kofun Yugenkoshi 放熱モジュールの構造およびその製造方法
JP2006196786A (ja) * 2005-01-14 2006-07-27 Furukawa Electric Co Ltd:The ヒートパイプ付ヒートシンク
KR20090007194U (ko) * 2008-01-11 2009-07-15 충-시엔 후앙 베이스 패널이 없는 쿨러 모듈

Also Published As

Publication number Publication date
WO2011037412A2 (fr) 2011-03-31
KR20110033596A (ko) 2011-03-31

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