WO2011037412A3 - Cooling device for electronic parts - Google Patents

Cooling device for electronic parts Download PDF

Info

Publication number
WO2011037412A3
WO2011037412A3 PCT/KR2010/006507 KR2010006507W WO2011037412A3 WO 2011037412 A3 WO2011037412 A3 WO 2011037412A3 KR 2010006507 W KR2010006507 W KR 2010006507W WO 2011037412 A3 WO2011037412 A3 WO 2011037412A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
cooling device
electronic parts
heat pipe
contact
Prior art date
Application number
PCT/KR2010/006507
Other languages
French (fr)
Korean (ko)
Other versions
WO2011037412A2 (en
Inventor
윤선규
정상준
정경채
부성덕
Original Assignee
잘만테크㈜
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 잘만테크㈜ filed Critical 잘만테크㈜
Publication of WO2011037412A2 publication Critical patent/WO2011037412A2/en
Publication of WO2011037412A3 publication Critical patent/WO2011037412A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a cooling device for electronic parts. The cooling device for electronic parts comprises: a first heat pipe which is formed with a wick on its inner circumferential surface, and which has a contact surface making contact with a heat-emitting part and has at least one receiving recess formed on the contact surface; a second heat pipe which is formed with the wick on its inner circumferential surface, and which has a contact portion which is inserted in the receiving recess and makes contact with the heat-emitting part; and a plurality of heat-dissipating fins which are disposed spaced apart from each other on the upper side of the heat-emitting part and are joined to the first heat pipe and the second heat pipe.
PCT/KR2010/006507 2009-09-25 2010-09-20 Cooling device for electronic parts WO2011037412A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090091154A KR20110033596A (en) 2009-09-25 2009-09-25 Cooler for electronic parts
KR10-2009-0091154 2009-09-25

Publications (2)

Publication Number Publication Date
WO2011037412A2 WO2011037412A2 (en) 2011-03-31
WO2011037412A3 true WO2011037412A3 (en) 2011-07-21

Family

ID=43796389

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/006507 WO2011037412A2 (en) 2009-09-25 2010-09-20 Cooling device for electronic parts

Country Status (2)

Country Link
KR (1) KR20110033596A (en)
WO (1) WO2011037412A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101339593B1 (en) * 2012-07-09 2014-01-02 윤국영 Cooler for electronic parts

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020080582A1 (en) * 2000-12-27 2002-06-27 Kai-Cheng Chang Heat pipe heat dissipating device
JP2005203665A (en) * 2004-01-19 2005-07-28 Kiko Kagi Kofun Yugenkoshi Heat dissipating module structure and manufacturing method therefor
JP2006196786A (en) * 2005-01-14 2006-07-27 Furukawa Electric Co Ltd:The Heat sink with heat pipe
KR20090007194U (en) * 2008-01-11 2009-07-15 충-시엔 후앙 Cooler module without base panel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020080582A1 (en) * 2000-12-27 2002-06-27 Kai-Cheng Chang Heat pipe heat dissipating device
JP2005203665A (en) * 2004-01-19 2005-07-28 Kiko Kagi Kofun Yugenkoshi Heat dissipating module structure and manufacturing method therefor
JP2006196786A (en) * 2005-01-14 2006-07-27 Furukawa Electric Co Ltd:The Heat sink with heat pipe
KR20090007194U (en) * 2008-01-11 2009-07-15 충-시엔 후앙 Cooler module without base panel

Also Published As

Publication number Publication date
KR20110033596A (en) 2011-03-31
WO2011037412A2 (en) 2011-03-31

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