WO2011007604A1 - ループ型ヒートパイプ及びその起動方法 - Google Patents
ループ型ヒートパイプ及びその起動方法 Download PDFInfo
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- WO2011007604A1 WO2011007604A1 PCT/JP2010/056093 JP2010056093W WO2011007604A1 WO 2011007604 A1 WO2011007604 A1 WO 2011007604A1 JP 2010056093 W JP2010056093 W JP 2010056093W WO 2011007604 A1 WO2011007604 A1 WO 2011007604A1
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- pipe
- working fluid
- liquid
- phase
- condensing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/06—Derivation channels, e.g. bypass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a loop heat pipe and a starting method thereof.
- a heat pipe is a heat transfer device that transports heat using a phase change of a working fluid sealed inside.
- a loop type heat pipe has been developed as a heat pipe having an increased heat transport amount and an increased heat transport distance.
- the loop heat pipe includes an evaporation unit that receives heat from the heating element and evaporates the liquid-phase working fluid, and a condensing unit that condenses the gas-phase working fluid by heat dissipation.
- the loop heat pipe includes a vapor pipe that circulates the working fluid that has changed to a gas phase in the evaporation section to the condensation section, and a liquid pipe that circulates the working fluid that has changed to the liquid phase in the condensation section to the evaporation section. Yes.
- the loop heat pipe has a loop structure in which an evaporation section, a steam pipe, a condensation section, and a liquid pipe are connected in series, and a working fluid is sealed inside.
- the blade-type server was originally developed as a server having a more compact volume than a conventional server, and electronic devices such as CPUs are arranged on the substrate with high density.
- This loop heat pipe 110 is shown in FIG.
- the loop heat pipe 110 includes a first evaporator 111A and a condenser 112.
- the loop heat pipe 110 includes a first liquid pipe 114A that causes the working fluid that has changed to a liquid phase in the condensing unit 112 to flow to the first evaporation unit 111A, and a working fluid that has changed to a gas phase in the first evaporation unit 111A.
- a steam pipe 113 that is circulated to the condensing unit 112.
- the loop heat pipe 110 includes a second evaporator 111 ⁇ / b> B for assisting the circulation of the liquid-phase working fluid in the first evaporator 111 ⁇ / b> A when activated. Yes.
- Part of the liquid-phase differential fluid that has flowed through the first liquid pipe 114A flows through the second evaporation section 111B via the second liquid pipe 114B and the condenser section 112.
- the working fluid that has changed to a gas phase in the second evaporation unit 111B joins the steam pipe 113 and then flows to the condensing unit 112.
- the working fluid flowing through the second liquid pipe 114B flows through the condensing unit 112 to the second evaporation unit 111B without joining the working fluid flowing through the first liquid pipe 114.
- the second evaporation unit 111B disposed in the vicinity of the condensing unit 112 is immediately supplied with a liquid-phase differential fluid when the loop heat pipe 110 is started, and starts circulation of the differential fluid in the loop.
- a liquid-phase working fluid is circulated through the first evaporator 111A.
- the second evaporator 111 ⁇ / b> B is an auxiliary evaporator provided to start the loop heat pipe 110. Therefore, the second evaporator 111B is smaller in size and lower in cooling capacity than the first evaporator 111A.
- the loop heat pipe 110 including the two evaporation units 111A and 111B is used to cool two CPUs having the same heat generation amount, the cooling of the two evaporation units 111A and 111B is performed. Due to the different capacities and the structure of the piping, the flow of the working fluid in the loop tends to be unstable.
- This specification aims to provide a loop heat pipe having a small size and capable of cooling two heating elements.
- a liquid-phase working fluid is evaporated to change a phase to a gas-phase working fluid.
- the first evaporation unit and the second evaporation unit, the first condensation unit and the second condensation unit that condense the gas-phase working fluid by heat radiation and change the phase into a liquid-phase working fluid, and the first evaporation unit.
- the second vapor pipe for flowing the working fluid changed to the gas phase in the second evaporator to the second condenser, and the working fluid changed to the liquid phase in the second condenser And a second liquid pipe to be circulated to.
- the two heat generating elements can be cooled with a small size.
- FIG. 3 is a diagram illustrating a state where the balance of the amount of heat received is broken in the loop heat pipe of FIG. 2.
- FIG. 5 is a diagram illustrating Examples 1 to 14 of a loop heat pipe disclosed in the present specification. It is a figure explaining Example 15 of the loop type heat pipe disclosed in this specification. It is a figure explaining Example 16 of the loop type heat pipe disclosed in this specification. It is a figure explaining Example 17 of the loop type heat pipe disclosed in this specification. It is a figure explaining Example 18 of the loop type heat pipe disclosed in this specification.
- FIG. 2 is a diagram illustrating a first embodiment of a loop heat pipe disclosed in the present specification.
- FIG. 3 is a diagram showing a blade server in which the loop heat pipe of FIG. 2 is incorporated.
- FIG. 4 is an enlarged cross-sectional view in the longitudinal direction of the evaporation portion of the loop heat pipe of FIG.
- FIG. 5 is an enlarged cross-sectional view in the width direction of the evaporation portion of the loop heat pipe of FIG.
- the loop heat pipe 10 of the present embodiment receives a heat from a heating element, evaporates the liquid-phase working fluid 16, and changes the phase to the gas-phase working fluid 16. And a second evaporator 11B.
- the loop heat pipe 10 includes a first condensing unit 12A and a second condensing unit 12B that condense the gas-phase working fluid 16 by heat dissipation and change the phase to the liquid-phase working fluid 16. Further, the loop heat pipe 10 is changed into a liquid phase at the first steam pipe 13A for flowing the working fluid 16 changed into the gas phase at the first evaporator 11A to the first condenser 12A and the first condenser 12A.
- the first evaporator 11A, the first steam pipe 13A, the first condensing part 12A, the first liquid pipe 14A, the second evaporator 11B, the second steam pipe 13B, The 2 condensing part 12B and the 2nd liquid pipe 14B are connected in series, and the loop-shaped flow path is formed.
- the working fluid is sealed in the loop-shaped flow path.
- the working fluid 16 is responsible for heat transfer in the loop heat pipe 10 while undergoing a phase change between the liquid phase and the gas phase.
- the working fluid 16 is enclosed in the loop heat pipe 10 at a saturated vapor pressure.
- water, alcohol, ammonia, or chlorofluorocarbon can be used as the working fluid 16.
- water, alcohol, ammonia, or chlorofluorocarbon can be used as the working fluid 16.
- the loop heat pipe 10 is used by being incorporated in a blade server 20 as shown in FIG. 3, for example.
- the blade server 20 includes two CPUs 21A and 21B.
- the first evaporator 11A of the loop heat pipe 10 is disposed so as to be in thermal contact with the CPU 21A. Further, the second evaporator 11B is disposed so as to be in thermal contact with the CPU 21B.
- the blade server 20 often has a vertically long rectangular shape.
- the blade type server 20 is usually arranged with the width direction orthogonal to the longitudinal direction thereof aligned with the vertical direction.
- the CPU 21A is typically arranged above the CPU 21B in the vertical direction.
- the first evaporator 11A that receives heat from the CPU 21A is disposed above the second evaporator 11B that receives heat from the CPU 21B in the vertical direction.
- Wind is sent to the first condensing unit 12A and the second condensing unit 12B by the main fan 22 to promote heat dissipation.
- the loop heat pipe 10 may be incorporated in another electronic device having a heating element to be cooled.
- the first evaporator 11A will be further described below with reference to FIGS. Since the second evaporation unit 11B has the same structure as the first evaporation unit 11A, the description given to the first evaporation unit 11A is also appropriately applied to the second evaporation unit 11B.
- the first evaporator 11A has a vertically long shape as shown in FIG.
- the longitudinal direction of the first evaporator 11 ⁇ / b> A coincides with the direction in which the working fluid 16 flows through the flow path of the loop heat pipe 10.
- the direction in which the working fluid 16 flows is indicated by arrows.
- the first evaporator 11 ⁇ / b> A is disposed in a vertically long casing 30, a metal block 31 disposed in the center of the casing 30, and a cavity in the metal block 31. And a wick 33 disposed in the metal tube 32.
- the housing 30, the metal block 31, and the metal tube 32 are formed using a metal having high thermal conductivity such as copper.
- the longitudinal direction of the housing 30 coincides with the longitudinal direction of the first evaporator 11A.
- the second liquid pipe 14 ⁇ / b> B is connected to one end of the casing 30 in the longitudinal direction.
- the first steam pipe 13 ⁇ / b> A is connected to the other end in the longitudinal direction of the housing 30.
- the heating element such as the CPU 21A is thermally connected to the housing 30 via a thermal bonding material (not shown) such as thermal grease.
- the metal block 31 is disposed in close contact with the inner surface of the housing 30 and is thermally connected to the housing 30.
- the metal block 31 has a cylindrical cavity inside. The longitudinal direction of this cavity coincides with the longitudinal direction of the first evaporator 11A.
- the metal block 31 quickly conducts the heat received from the heating element 21A through the housing 30 to the metal tube 32 disposed in the internal cavity.
- the metal tube 32 has a vertically long cylindrical shape.
- the metal tube 32 is disposed in the cavity of the metal block 31.
- the longitudinal direction of the metal tube 32 coincides with the longitudinal direction of the first evaporator 11A.
- the outer surface of the metal tube 32 is in close contact with the inner surface of the cavity of the metal block 31, and the metal tube 32 is thermally connected to the metal block 31.
- a plurality of convex portions 34a and concave portions 34b are formed on the inner surface of the metal tube 32 at a predetermined pitch in the circumferential direction.
- the convex portion 34 a and the concave portion 34 b are formed over the entire length of the metal tube 32.
- a groove-like space formed between the recess 34 b and the wick 33 serves as a passage for the working fluid 16.
- the wick 33 has a vertically long cylindrical shape as shown in FIG.
- the end of the wick 33 on the second liquid pipe 14B side is open, and the end of the first steam pipe 13A side is closed.
- the wick 33 is inserted inside the metal pipe 32 with its closed end directed toward the first steam pipe 13A. As shown in FIG. 5, the outer surface of the wick 33 is in contact with the tips of a plurality of convex portions 34 a formed on the inner surface of the metal tube 32, and the wick 33 is thermally connected to the metal tube 32.
- the wick 33 is formed using a porous material.
- the wick 33 is formed using, for example, a porous body obtained by sintering copper powder. It is preferable that the inner cavity and the outer side of the wick 33 communicate with each other through a large number of fine pores having a diameter of about 10 ⁇ m to 50 ⁇ m.
- the working fluid 16 flows into the first evaporator 11A from the second liquid pipe 14B, the working fluid 16 soaks into the wick 33 by capillary action, and the wick 33 is wet with the working fluid 16 become.
- the liquid-phase working fluid 16 soaked in the wick 33 is heated (heated) by heat supplied from a heating element such as the CPU 21A.
- the vapor-phase working fluid 16 existing in the wick 33 itself, the surface thereof, or the cavity inside the wick 33 flows from the inside cavity to the outside through the pores of the wick 33.
- the first evaporation unit 11A having the above-described structure is, for example, a CPU that is a heating element having dimensions of 30 mm in length ⁇ 30 mm in width, and the size of the housing 30 is 50 mm in length ⁇ 50 mm in width ⁇ 20 mm in height. It can be. Moreover, the dimension of the metal block 31 can be made into length 40mm x width 40mm x height 20mm.
- the dimensions of the metal tube 32 can be set to an outer diameter of 14 mm and an inner diameter of 10 mm (tube wall thickness of 2 mm). Then, on the inner surface of the metal tube 32, for example, recesses 34b having a depth of 1 mm are formed at a pitch of 2 mm. Furthermore, the dimensions of the wick 33 can be an outer diameter of 10 mm and an inner diameter of 4 mm.
- the first condensing unit 12A will be further described below with reference to FIGS. Since the second condensing unit 12B has the same structure as the first condensing unit 12A, the description given to the first condensing unit 12A is also applied to the second condensing unit 12B as appropriate.
- the first condensing unit 12A includes a first condensing tube 40A and a plurality of first heat radiation plates 41A connected to the first condensing tube 40A.
- the first steam pipe 13A is connected to one end of the first condensing pipe 40A.
- the first liquid pipe 14A is connected to the other end of the first condensing pipe 40A.
- the plurality of first heat radiating plates 41A are thermally connected to the first condensing pipe 40A, and the heat of the working fluid 16 flowing through the first condensing pipe 40A is radiated through the plurality of first heat radiating plates 41A. Is done.
- the plurality of first heat radiating plates 41 ⁇ / b> A in the first condensing unit 12 ⁇ / b> A are blown by the main fan 22 or the like to promote heat dissipation and change the gas phase working fluid 16 to the liquid phase. It is preferable for phase change.
- first steam pipe 13A will be further described below with reference to FIGS. Since the second steam pipe 13B has the same structure as the first steam pipe 13A, the description given to the first steam pipe 13A is also applied to the second steam pipe 13B as appropriate.
- One end of the first steam pipe 13A is connected to the first evaporator 11A.
- the other end of the first steam pipe 13A is connected to the first condensing part 12A.
- the gas-phase working fluid 16 is not necessarily circulated.
- the working fluid 16 may be in a liquid phase between the first evaporator 11A and the first condensing part 12A. In some cases, the gas-liquid mixed working fluid 16 may flow.
- the first steam pipe 13A is formed using a metal having high thermal conductivity such as copper.
- first liquid pipe 14A will be further described below with reference to FIGS. Since the second liquid pipe 14B has the same structure as the first liquid pipe 14A, the description given to the first liquid pipe 14A is also appropriately applied to the second liquid pipe 14B.
- One end of the first liquid pipe 14A is connected to the first condensing part 12A.
- the other end of the first liquid pipe 14A is connected to the second evaporator 11B.
- the working fluid 16 may be in a gas phase between the first condensing unit 12A and the second evaporating unit 11B. In some cases, the liquid mixed working fluid 16 may flow.
- the first liquid tube 14A is formed using a metal having high thermal conductivity such as copper.
- the amount of the working fluid 16 enclosed in the loop heat pipe 10 is such that the liquid-phase working fluid 16 includes the first evaporator 11A and the second liquid pipe 14B, the second evaporator 11B and the first liquid pipe 14A, and the like. It is preferable that the amount satisfies the above. It is also preferable that the amount of the working fluid 16 is slightly larger than half the volume of the flow path of the loop heat pipe 10. If the amount of the working fluid 16 is larger than this amount, the flow resistance increases and the thermal resistance increases. On the other hand, if the amount of the working fluid 16 is less than this amount, the operation of the loop heat pipe 10 becomes unstable.
- 6A to 6D are diagrams for explaining the operation of the loop heat pipe.
- the first evaporator 11A is disposed above the second evaporator 11B in the vertical direction. Therefore, the liquid-phase working fluid 16 is accumulated below the loop heat pipe 10 in the state before starting, and the inside of the second evaporator 11B is filled with the liquid-phase working fluid 16. The liquid-phase working fluid 16 is immersed in the pores of the wick 33 inside the second evaporator 11B.
- the upper part of the loop heat pipe 10 is filled with a gas-phase working fluid 16. Therefore, the inside of the first evaporation unit 11A is filled with the gas-phase working fluid 16. That is, the wick 33 in the first evaporator 11A is in a dry state, and the first evaporator 11A is in a so-called dry-out state.
- the 2nd evaporation part 11B starts receiving heat.
- the 2nd evaporation part 11B receives heat from the CPU 21 ⁇ / b> B that is a heating element.
- the first evaporator 11A starts to receive heat after a predetermined time has elapsed since the second evaporator 11B started to receive heat. This predetermined time is determined based on the time required for the liquid-phase working fluid 16 to start flowing to the first evaporator 11A.
- the casing 30 is first heated by the heating element, and the heat applied to the casing 30 is transmitted to the metal block 31.
- the heat transmitted to the metal block 31 is transmitted to the metal tube 32, and the heat transmitted to the metal tube 32 is transmitted to the wick 33 through the convex portion 34a of the metal tube 32, so that the wick 33 is heated.
- the vapor-phase working fluid 16 pushed out to the outer surface of the wick 33 flows, for example, through the concave portion 34b of the metal tube 32 and into the housing 30 on the second steam tube 13B side. Then, the gas-phase working fluid 16 flows into the second steam pipe 13B.
- the gas-phase working fluid 16 pushed by the liquid-phase working fluid 16 flows through the first evaporator 11A and further through the first vapor pipe 13A, and then flows into the first condenser 12A.
- the gas-phase working fluid 16 that has reached the first condensing part 12A is condensed by heat radiation and changed into a liquid phase.
- the heat of the working fluid 16 is transmitted to the first heat radiating plate 41A via the first condenser tube 40A, and the heat transmitted to the first heat radiating plate 41A is radiated from the first heat radiating plate 41A.
- the gas-phase working fluid 16 is cooled, and all or part thereof changes to the liquid phase.
- the liquid phase working fluid 16 accumulates in the first condensing part 12A and the first steam pipe 13A, and the liquid level rises.
- the liquid-phase working fluid 16 in the second liquid pipe 14B pushed from the second condensing unit 12B side starts to flow into the first evaporation unit 11A.
- heat reception to the first evaporator 11A is started for the first time.
- the operation of the CPU 21A is started, and the first evaporation unit 11A receives heat from the CPU 21A that is a heating element.
- the liquid-phase working fluid 16 circulated in the first evaporator 11A changes to a gas phase, and the gas-phase working fluid 16 flows into the first steam pipe 13A.
- the liquid-phase working fluid 16 almost fills the inside of the wick 33 of the first evaporator 11A, and the operation of the loop heat pipe 10 is stabilized.
- the liquid-phase working fluid 16 substantially passes through the first evaporator 11A, the second evaporator 11B, the first liquid pipe 14A, and the second liquid pipe 14B. Satisfied.
- the other part of the loop heat pipe 10 is filled with a gas-phase working fluid 16.
- the loop heat pipe 10 since the loop heat pipe is formed by one loop-shaped flow path, it has a small size. Moreover, since the loop heat pipe 10 has two evaporation parts, it can cool two heat generating bodies.
- the two evaporation units are both in a liquid phase working fluid when the loop heat pipe is started. Can be satisfied.
- such an arrangement is often difficult because it imposes great restrictions on the structure of the blade server.
- the two CPUs are often arranged at different positions in the vertical direction.
- the liquid phase at the start-up is in the evaporation section thermally connected to the CPU arranged on the upper side in the vertical direction. It may not be possible to fill the working fluid.
- the evaporation section is in a dry-out state, so the liquid-phase working fluid cannot be changed to the gas phase.
- the mold heat pipe is not activated.
- the liquid phase working fluid is filled in the evaporator disposed on the lower side in the vertical direction at the time of startup. It is easy to keep.
- the loop heat pipe 10 described above operates stably when the amount of heat received in the first evaporator 11A and the second evaporator 11B is equal. However, when the amounts of heat received by the first evaporator 11A and the second evaporator 11B are not equal, the amount of change from the liquid phase to the gas phase of the working fluid 16 in the first evaporator 11A and the second evaporator 11B is different. Therefore, the distribution of the working fluid 16 in the flow path is biased, and the circulation of the working fluid 16 may become unstable or stop.
- FIG. 7 is a diagram for explaining a state in which the balance of the amount of heat received is lost in the loop heat pipe 10.
- the amount of heat received by the first evaporator 11A is increased, while the amount of heat received by the second evaporator 11B is decreased, and the balance of the amount of heat received is lost.
- this corresponds to a case where the operating rate of the CPU 21A increases and the amount of generated heat increases, while the operating rate of the CPU 21B decreases and the amount of generated heat decreases.
- the vaporization rate of the working fluid 16 in the first evaporator 11A having a large amount of heat received is higher than the vaporization rate of the working fluid 16 in the second evaporator 11B having a small amount of heat received.
- FIG. 7 shows a state in which the liquid level of the liquid-phase working fluid 16 has risen to the inside of the first steam pipe 13A.
- Such a phenomenon occurs particularly when the flow resistance of the working fluid 16 is relatively large, such as when the distance between the evaporation section and the condensation section is long, or when the evaporation section is at a lower position than the condensation section. It is easy to happen.
- the loop heat pipe can operate stably even when the balance of the amount of heat received by the two evaporators is lost.
- FIG. 8 shows a loop heat pipe 50 according to a second embodiment disclosed in the present specification.
- the loop heat pipe 50 includes a bypass pipe 15 that connects the first steam pipe 13A and the second steam pipe 13B.
- the bypass pipe 15 circulates the working fluid 16 and causes the loop heat pipe 50 to flow when the distribution of the working fluid 16 in the flow path is biased due to, for example, the balance of the amount of heat received in the two evaporators is lost. Has a function to return to a stable operating state.
- the bypass pipe 15 preferably connects a portion of the first steam pipe 13A in the vicinity of the first condensing part 12A and a part of the second steam pipe 13B in the vicinity of the second condensing part 12B.
- the bypass pipe 15 connects a part of the first steam pipe 13A in the range of 1 to 3 cm from the first condensing part 12A and a part of the second steam pipe 13B in the range of 1 to 3 cm from the second condensing part 12B. It is preferable to do.
- the cross-sectional area of the flow portion of the working fluid 16 in the bypass pipe 15 is preferably equal to or less than the cross-sectional area of the flow portion of the working fluid 16 in the first steam pipe 13A and the second steam pipe 13B.
- the pressure loss of the working fluid 16 in the bypass pipe 15 is preferably larger than that of the liquid pipe or the steam pipe.
- the ratio of the cross-sectional area of the flow part of the bypass pipe 15 and the cross-sectional areas of the flow parts of the first steam pipe 13A and the second steam pipe 13B is in the range of 0.1 to 1, particularly 0.4 to 0.00. Preferably it is in the range of 6.
- the ratio of the cross-sectional areas is 0.1 or more, when the distribution of the working fluid 16 in the flow path is biased, the working fluid 16 is circulated promptly to operate the loop heat pipe. It is preferable for returning to a stable state.
- the ratio of the cross-sectional areas is smaller than 0.1, the pressure loss in the bypass pipe 15 increases, and the flow of the working fluid 16 in the bypass pipe 15 is hindered.
- the ratio of the cross-sectional areas being 1 or less prevents the working fluid 16 from preferentially flowing toward the bypass pipe 15 when the loop heat pipe 50 is operating stably. This is preferable.
- the ratio of the cross-sectional areas is 1 or less, the liquid-phase working fluid 16 can be circulated in the bypass pipe 15 using a capillary force.
- the length of the bypass pipe 15 is appropriately set depending on the structure in which the loop heat pipe 50 is arranged.
- bypass pipe 15 may be provided with a loop portion, a bent portion or the like.
- the structure of the other part of the loop heat pipe 50 is the same as that of the first embodiment described above.
- 9A to 9D are diagrams for explaining the operation of the loop heat pipe 50.
- the loop heat pipe 50 in the state shown in FIG. 9A operates in a stable state.
- the process from the start of the loop heat pipe 50 to the stable operation is the same as in the first embodiment described above.
- the amount of heat received by the first evaporator 11A increases, while the amount of heat received by the second evaporator 11B decreases, and the balance of the amount of heat received. Assume that the state has changed to a collapsed state.
- the vaporization rate of the working fluid 16 in the first evaporation unit 11A having a large amount of heat received is greater than the vaporization rate of the working fluid 16 in the second evaporation unit 11B having a small amount of heat reception.
- the liquid-phase working fluid 16 in the second liquid pipe 14B decreases. Since the amount of the working fluid 16 in the flow path is constant, the liquid-phase working fluid 16 in the first liquid pipe 14A increases. In the state shown in FIG. 9B, the liquid level of the liquid-phase working fluid 16 rises to the inside of the first condensing unit 12A.
- the gas-phase working fluid 16 in the first steam pipe 13A flows through the bypass pipe 15 and flows into the second steam pipe 13B.
- the working fluid 16 that has flowed into the second steam pipe 13B changes to the liquid phase at the second condensing unit 12B, and then flows into the second liquid pipe 14B.
- the liquid-phase working fluid 16 may flow through the bypass pipe 15.
- the liquid-phase working fluid 16 in the second liquid pipe 14B increases, while the liquid-phase working fluid 16 in the first liquid pipe 14A decreases.
- the distribution of the working fluid 16 in the loop heat pipe 50 is automatically returned to the state shown in FIG. As a result, the loop heat pipe 50 recovers a stable operating state.
- the liquid-phase working fluid 16 in the second liquid pipe 14B is further reduced, while the liquid-phase working fluid 16 in the first liquid pipe 14A is further increased.
- the liquid level of the liquid-phase working fluid 16 rises to the inside of the first steam pipe 13A.
- the working fluid 16 that has flowed into the second steam pipe 13B flows through the second condensing unit 12B and flows into the second liquid pipe 14B.
- the liquid-phase working fluid 16 in the second liquid pipe 14B increases, while the liquid-phase working fluid 16 in the first liquid pipe 14A decreases.
- the distribution of the working fluid 16 in the loop heat pipe 50 is automatically returned to the state shown in FIG. Therefore, the loop heat pipe 50 recovers a stable operating state.
- the case where the amount of heat received by the first evaporator 11A increases while the amount of heat received by the second evaporator 11B decreases is taken as an example.
- the loop heat pipe 50 similarly recovers to a stable operating state.
- the loop heat pipe 50 has a distribution of the working fluid 16 in the flow path when a relative change occurs in the amount of heat received between the first evaporator 11A and the second evaporator 11B. Return to normal state and restore stable operating state.
- loop type heat pipe 50 has a normal distribution in the flow path of the working fluid 16 even when a relative change occurs in the cooling capacity between the first condensing unit 12A and the second condensing unit 12B. To return to a stable operating state.
- the loop heat pipe 50 when the distribution of the working fluid 16 in the flow path is uneven, the working fluid 16 passes through the bypass pipe 15 and passes from the first steam pipe 13A to the second steam pipe. Since it is distributed to 13B, the loop heat pipe 50 can recover a stable operating state.
- the loop heat pipe 50 can operate stably even when the balance of the amount of heat received in the two evaporators is lost.
- the loop heat pipe 50 is energy saving because the uneven distribution of the working fluid 16 generated in the flow path can be eliminated without using external energy such as electric power.
- FIG. 10 is a diagram illustrating a loop heat pipe 60 according to a third embodiment disclosed in this specification.
- the dimensions of the first evaporator 11A and the second evaporator 11B are different.
- the length of the second evaporator 11B may be twice that of the first evaporator 11A.
- the loop heat pipe 60 can be used to cool two heating elements having different heating values.
- the loop heat pipe 60 can be used to cool two heat generating elements having different dimensions.
- the loop heat pipe 60 is used for cooling a CPU and a chip controller mounted on a server.
- the CPU has a larger size and heat generation than a chip controller.
- the 11A of 1st evaporation parts can make the dimension of the metal block 31 into 30 mm long x 30 mm wide x 20 mm in height with respect to the chip controller which is a heat generating body which has the dimension of 20 mm long x 20 mm wide, for example.
- the second evaporation unit 11B can set the size of the metal block 31 to 50 mm long ⁇ 50 mm wide ⁇ 20 mm high with respect to the CPU that is a heating element having dimensions of 30 mm long ⁇ 30 mm wide. .
- the structure of the other part of the loop heat pipe 60 is the same as that of the second embodiment described above.
- the heating element can be efficiently cooled using the evaporation section corresponding to the size and the amount of heat generation of the heating element.
- FIG. 11 is a diagram showing a blade server 80 in which the loop heat pipe 70 according to the fourth embodiment disclosed in the present specification is incorporated.
- the first condensing part and the second condensing part are integrally formed.
- a plurality of common heat radiation plates 41 are joined to the first condensing tube 40A of the first condensing unit and the second condensing tube 40B of the second condensing unit.
- the structure of the other part of the loop heat pipe 70 is the same as that of the second embodiment described above.
- the first evaporation unit 11A is disposed above the second evaporation unit 11B in the vertical direction, but the second evaporation unit 11B is disposed above the first evaporation unit 11A in the vertical direction. It may be arranged.
- the following components may be provided. 1. An acceleration sensor is installed in the loop heat pipe 10 so that the vertical direction can be determined. 2. Immediately after the loop heat pipe 10 is started, the temperatures of the two heating elements such as the CPU are monitored to identify the heating element with the larger temperature rise. Then, the power supply to the heat generating element having the larger temperature rise is slowed down for a predetermined time, thereby providing a time difference in the activation of the two heat generating elements. By providing such a component, it is possible to start only the heat reception to the evaporation unit located on the lower side in the vertical direction first.
- the 1st steam pipe 13A, the 2nd steam pipe 13B, the 1st liquid pipe 14A, and the 2nd liquid pipe 14B were formed by the pipe
- each embodiment mentioned above it demonstrates using the loop-type heat pipe shown typically, and the structure of each component, arrangement
- the arrangement of the evaporating part or the condensing part, and the shape of the steam pipe and liquid pipe (piping layout) connecting them can be arbitrarily set according to the internal configuration of an electronic device or the like in which a loop heat pipe is incorporated. is there.
- the arrangement of other elements such as the starting heat radiation fin and the starting fan can be arbitrarily set according to the arrangement and shape of the evaporation section, the condensation section, the steam pipe or the liquid pipe.
- Example 1 First, a loop heat pipe having the structure shown in FIG. 8 was formed.
- the loop heat pipe was incorporated in a blade server as shown in FIG. Then, the substrate surface of the blade type server was oriented perpendicular to the vertical direction so that the two evaporation units were horizontally arranged.
- the heat generation amount of CPU A that receives heat by the first evaporation unit is 0 W
- the heat generation amount of CPU B that receives heat by the second evaporation unit is 60 W.
- Example 2 was the same as Example 1 except that the amount of heat generated by CPU A receiving heat by the first evaporator was 20 W and the amount of heat generated by CPU B receiving heat by the second evaporator was 60 W.
- Example 3 was the same as Example 1 except that the heat generation amount of CPU A receiving heat by the first evaporation unit was 40 W and the heat generation amount of CPU B receiving heat by the second evaporation unit was 60 W.
- Example 4 was performed in the same manner as in Example 1 except that the heat generation amount of CPU A received by the first evaporation unit was 60 W and the heat generation amount of CPU B received by the second evaporation unit was 60 W.
- Example 5 was performed in the same manner as Example 1 except that the heat generation amount of CPU A received by the first evaporation unit was 60 W and the heat generation amount of CPU B received by the second evaporation unit was 40 W.
- Example 6 was performed in the same manner as Example 1 except that the heat generation amount of CPU A received by the first evaporation unit was 60 W and the heat generation amount of CPU B received by the second evaporation unit was 20 W.
- Example 7 was made in the same manner as Example 1 except that the heat generation amount of CPU A receiving heat by the first evaporation unit was 60 W and the heat generation amount of CPU B receiving heat by the second evaporation unit was 0 W.
- Example 8 The substrate surface of the blade type server was oriented parallel to the vertical direction, and the two evaporators were arranged vertically.
- the heat generation amount of CPU A that receives heat by the first evaporation unit disposed on the upper side in the vertical direction is 0 W
- the heat generation amount of CPU B that receives heat by the second evaporation unit that is disposed on the lower side in the vertical direction is 60 W. did. Otherwise in the same manner as in Example 1, Example 8 was obtained.
- Example 9 The amount of heat generated by CPU A receiving heat by the first evaporator disposed on the upper side in the vertical direction was 20 W, and the amount of heat generated by CPU B receiving heat by the second evaporator disposed on the lower side in the vertical direction was 60 W. Except for this, Example 9 was carried out in the same manner as Example 8.
- Example 10 The amount of heat generated by CPU A receiving heat by the first evaporator disposed on the upper side in the vertical direction was 40 W, and the amount of heat generated by CPU B receiving heat by the second evaporator disposed on the lower side in the vertical direction was 60 W. Otherwise in the same manner as in Example 8, Example 10 was obtained.
- Example 11 The amount of heat generated by CPU A receiving heat by the first evaporator disposed on the upper side in the vertical direction was 60 W, and the amount of heat generated by CPU B receiving heat by the second evaporator disposed on the lower side in the vertical direction was 60 W. Otherwise in the same manner as in Example 8, Example 11 was obtained.
- Example 12 The amount of heat generated by CPU A receiving heat by the first evaporator disposed on the upper side in the vertical direction was 60 W, and the amount of heat generated by CPU B receiving heat by the second evaporator disposed on the lower side in the vertical direction was 40 W. Otherwise in the same manner as in Example 8, Example 12 was obtained.
- Example 13 The amount of heat generated by CPU A receiving heat by the first evaporator disposed on the upper side in the vertical direction was 60 W, and the amount of heat generated by CPU B receiving heat by the second evaporator disposed on the lower side in the vertical direction was 20 W. Otherwise in the same manner as in Example 8, Example 13 was obtained.
- Example 14 The amount of heat generated by CPU A receiving heat by the first evaporator disposed on the upper side in the vertical direction was 60 W, and the amount of heat generated by CPU B receiving heat by the second evaporator disposed on the lower side in the vertical direction was 0 W. Otherwise in the same manner as in Example 8, Example 14 was obtained.
- Example 1 to Example 14 were operated as follows, and the temperatures of CPU A and CPU B were measured.
- Example 14 the temperature of CPU A reached 80 ° C. about 1 minute after the start of power supply to the blade server. It was found that the loop type heat pipe does not operate when the evaporation unit is vertically arranged and the second evaporation unit arranged on the lower side in the vertical direction does not receive heat.
- the temperatures reached by CPU A and CPU B were all less than 60 ° C. That is, even when the two evaporators are arranged vertically, if the second evaporator arranged on the lower side in the vertical direction receives heat, the loop heat pipe is operated and the CPU A and CPU B are cooled. I understood. Further, it was found that when the evaporation unit is horizontally arranged, the CPU A and the CPU B are cooled by operating the loop heat pipe even if one of the evaporation units does not receive heat.
- Example 15 A loop heat pipe having the structure shown in FIG. 2 was used.
- R141b of specific chlorofluorocarbon HCFC (hydrochlorofluorocarbon) was used as the refrigerant.
- the inner diameters of the first liquid pipe and the second liquid pipe, and the first steam pipe and the second steam pipe were 4.5 mm.
- the length of the 1st liquid pipe and the 2nd liquid pipe was 1.0 m, and the length of the 1st steam pipe and the 2nd steam pipe was 1.0 m.
- the length of the 1st condensation part and the 2nd condensation part was 1.0 m.
- Each of the first evaporation unit and the second evaporation unit was heated by a heating body having an output of 150 W.
- the first evaporator and the second evaporator were disposed horizontally with respect to the vertical direction.
- the loop heat pipe includes a first set formed by a second condensing part, a second liquid pipe, a first evaporating part, and a first steam pipe, a first condensing part, a first liquid pipe, and a second evaporating part. And a second set formed by a second steam pipe.
- the liquid pipe was divided into 8 grids
- the evaporation section was divided into 2 grids
- the steam pipe was divided into 12 grids
- the condensation section was divided into 8 grids. Then, in the steady state of the loop heat pipe, the ratio of the gas phase of the working fluid in each set of grids was determined. The calculation results are shown in FIG.
- Example 16 was made in the same manner as Example 15 except that a loop heat pipe having the structure shown in FIG. 8 was used.
- the inner diameter of the bypass pipe was 4.5 mm, and the length of the bypass pipe was 1.4 m.
- the calculation results are shown in FIG.
- Example 17 Example 15 with the exception that the first set of first evaporators was heated by a heater having an output of 50 W and the second set of second evaporators was heated by a heater having an output of 150 W. Similarly, Example 17 was obtained. The calculation results are shown in FIG.
- Example 18 A loop heat pipe having the structure shown in FIG. 8 is used, and the first set of first evaporators is heated by a heater having an output of 50 W, and the second set of second evaporators is heated by an output of 150 W.
- Example 18 was made in the same manner as Example 16 except that it was heated by the body. The calculation results are shown in FIG.
- Example 17 the working fluid circulates in the loop heat pipe, but about 40% of the working fluid is in the gas phase in the first steam pipe of the first set. 60% is in the liquid phase. On the other hand, in the second set, the working fluid in the second steam pipe is all in the gas phase.
- Example 18 all working fluids are in the gas phase in the steam pipe, and all working fluids are in the liquid phase in the liquid pipe. Therefore, it was found that by providing the bypass pipe in the structure of the loop heat pipe of Example 17, all of the differential fluid becomes a gas phase even in the first set of steam pipes.
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Abstract
Description
まず、図8に示す構造のループ型ヒートパイプを形成した。そして、このループ型ヒートパイプを図3に示すようなブレード型サーバに組み込んだ。そして、ブレード型サーバの基板面を、鉛直方向に対して垂直な向きにして、2つの蒸発部が水平配置された状態とした。第1蒸発部に受熱させるCPU Aの発熱量を0Wとし、第2蒸発部に受熱させるCPU Bの発熱量を60Wとして、実施例1とした。
第1蒸発部に受熱させるCPU Aの発熱量を20Wとし、第2蒸発部に受熱させるCPU Bの発熱量を60Wとする以外は実施例1と同様にして実施例2とした。
第1蒸発部に受熱させるCPU Aの発熱量を40Wとし、第2蒸発部に受熱させるCPU Bの発熱量を60Wとする以外は実施例1と同様にして実施例3とした。
第1蒸発部に受熱させるCPU Aの発熱量を60Wとし、第2蒸発部に受熱させるCPU Bの発熱量を60Wとする以外は実施例1と同様にして実施例4とした。
第1蒸発部に受熱させるCPU Aの発熱量を60Wとし、第2蒸発部に受熱させるCPU Bの発熱量を40Wとする以外は実施例1と同様にして実施例5とした。
第1蒸発部に受熱させるCPU Aの発熱量を60Wとし、第2蒸発部に受熱させるCPU Bの発熱量を20Wとする以外は実施例1と同様にして実施例6とした。
第1蒸発部に受熱させるCPU Aの発熱量を60Wとし、第2蒸発部に受熱させるCPU Bの発熱量を0Wとする以外は実施例1と同様にして実施例7とした。
ブレード型サーバの基板面を、鉛直方向に対して平行な向きにして、2つの蒸発部が垂直に配置された状態とした。また、鉛直方向の上側に配置される第1蒸発部に受熱させるCPU Aの発熱量を0Wとし、鉛直方向の下側に配置される第2蒸発部に受熱させるCPU Bの発熱量を60Wとした。それ以外は、実施例1と同様にして、実施例8とした。
鉛直方向の上側に配置される第1蒸発部に受熱させるCPU Aの発熱量を20Wとし、鉛直方向の下側に配置される第2蒸発部に受熱させるCPU Bの発熱量を60Wとした。それ以外は、実施例8と同様にして、実施例9とした。
鉛直方向の上側に配置される第1蒸発部に受熱させるCPU Aの発熱量を40Wとし、鉛直方向の下側に配置される第2蒸発部に受熱させるCPU Bの発熱量を60Wとした。それ以外は、実施例8と同様にして、実施例10とした。
鉛直方向の上側に配置される第1蒸発部に受熱させるCPU Aの発熱量を60Wとし、鉛直方向の下側に配置される第2蒸発部に受熱させるCPU Bの発熱量を60Wとした。それ以外は、実施例8と同様にして、実施例11とした。
鉛直方向の上側に配置される第1蒸発部に受熱させるCPU Aの発熱量を60Wとし、鉛直方向の下側に配置される第2蒸発部に受熱させるCPU Bの発熱量を40Wとした。それ以外は、実施例8と同様にして、実施例12とした。
鉛直方向の上側に配置される第1蒸発部に受熱させるCPU Aの発熱量を60Wとし、鉛直方向の下側に配置される第2蒸発部に受熱させるCPU Bの発熱量を20Wとした。それ以外は、実施例8と同様にして、実施例13とした。
鉛直方向の上側に配置される第1蒸発部に受熱させるCPU Aの発熱量を60Wとし、鉛直方向の下側に配置される第2蒸発部に受熱させるCPU Bの発熱量を0Wとした。それ以外は、実施例8と同様にして、実施例14とした。
図2に示す構造のループ型ヒートパイプを用いた。冷媒として、特定フロンHCFC(hydrochlorofluorocarbon)のR141bを用いた。第1液管及び第2液管、並びに第1蒸気管及び第2蒸気管の内径は、4.5mmであった。第1液管及び第2液管の長さは、1.0mであり、第1蒸気管及び第2蒸気管の長さは、1.0mであった。第1凝縮部及び第2凝縮部の長さは、1.0mであった。第1蒸発部及び第2蒸発部それぞれは、150Wの出力を有する加熱体によって加熱された。第1蒸発部及び第2蒸発部は、鉛直方向に対して水平に配置された。ループ型ヒートパイプは、第2凝縮部と第2液管と第1蒸発部と第1蒸気管とで形成される第1セットと、第1凝縮部と第1液管と第2蒸発部と第2蒸気管とで形成される第2セットとを有する。各セットは、液管が8グリッド、蒸発部が2グリッド、蒸気管が12グリッド、凝縮部が8グリッドに分けられた。そして、ループ型ヒートパイプの定常状態において、各セットのグリッドそれぞれにおける作動流体の気相の割合が求められた。計算結果を図13に示す。
図8に示す構造のループ型ヒートパイプが用いられたことを除いては、実施例15と同様にして、実施例16とした。バイパス管の内径は、4.5mmであり、バイパス管の長さは、1.4mであった。計算結果を図14に示す。
第1セットの第1蒸発部が50Wの出力を有する加熱体によって加熱され、第2セットの第2蒸発部が150Wの出力を有する加熱体によって加熱されたことを除いては、実施例15と同様にして、実施例17とした。計算結果を図15に示す。
図8に示す構造のループ型ヒートパイプが用いられ、且つ第1セットの第1蒸発部が50Wの出力を有する加熱体によって加熱され、第2セットの第2蒸発部が150Wの出力を有する加熱体によって加熱されたことを除いては、実施例16と同様にして、実施例18とした。計算結果を図16に示す。
11A 第1蒸発部
11B 第2蒸発部
12A 第1凝縮部
12B 第2凝縮部
13A 第1蒸気管
13B 第2蒸気管
14A 第1液管
14B 第2液管
15 バイパス管
16 作動流体
20 ブレード型サーバ
21A CPU
21B CPU
22 メインファン
30 筐体
31 金属ブロック
32 金属管
33 ウィック
34 溝
40A、40B 凝縮管
41 放熱板
80 ブレード型サーバ
81A CPU
81B CPU
Claims (11)
- 発熱体から受熱して、液相の作動流体を蒸発させて気相の作動流体に相変化させる第1蒸発部及び第2蒸発部と、
気相の作動流体を放熱により凝縮させて、液相の作動流体に相変化させる第1凝縮部及び第2凝縮部と、
前記第1蒸発部で気相に変化した作動流体を、前記第1凝縮部へ流通させる第1蒸気管と、
前記第1凝縮部で液相に変化した作動流体を、前記第2蒸発部へ流通させる第1液管と、
前記第2蒸発部で気相に変化した作動流体を、前記第2凝縮部へ流通させる第2蒸気管と、
前記第2凝縮部で液相に変化した作動流体を、前記第1蒸発部へ流通させる第2液管と、
を備えるループ型ヒートパイプ。 - 前記第1蒸気管と前記第2蒸気管とを接続するバイパス管を備える請求項1に記載のループ型ヒートパイプ。
- 前記バイパス管は、前記第1凝縮部近傍の前記第1蒸気管の部分と、前記第2凝縮部近傍の前記第2蒸気管の部分と、を接続する請求項2に記載のループ型ヒートパイプ。
- 前記バイパス管における作動流体の流通部分の断面積は、前記第1蒸気管及び第2蒸気管における作動流体の流通部分の断面積以下である請求項2又は3に記載のループ型ヒートパイプ。
- 前記バイパス管の前記断面積と、前記第1蒸気管及び第2蒸気管の前記断面積との比が、0.1~1の範囲にある請求項4に記載のループ型ヒートパイプ。
- 前記第1蒸発部は、鉛直方向において前記第2蒸発部よりも上側に配置される請求項1から5の何れか一項に記載のループ型ヒートパイプ。
- 前記第1凝縮部と前記第2凝縮部とは一体に形成される請求項1から6の何れか一項に記載のループ型ヒートパイプ。
- 前記第1凝縮部は、第1凝縮管を有し、前記第2凝縮部は、第2凝縮管を有し、
前記第1凝縮管及び前記第2凝縮管には共通の複数の放熱板が接合されている請求項7に記載のループ型ヒートパイプ。 - 発熱体から受熱して、液相の作動流体を蒸発させて気相の作動流体に相変化させる第1蒸発部及び第2蒸発部と、気相の作動流体を放熱により凝縮させて、液相の作動流体に相変化させる第1凝縮部及び第2凝縮部と、前記第1蒸発部で気相に変化した作動流体を、前記第1凝縮部へ流通させる第1蒸気管と、前記第1凝縮部で液相に変化した作動流体を、前記第2蒸発部へ流通させる第1液管と、前記第2蒸発部で気相に変化した作動流体を、前記第2凝縮部へ流通させる第2蒸気管と、前記第2凝縮部で液相に変化した作動流体を、前記第1蒸発部へ流通させる第2液管と、を備え、前記第1蒸発部が鉛直方向において前記第2蒸発部よりも上側に配置される、ループ型ヒートパイプの起動方法であって、
前記第2蒸発部が受熱を開始してから所定の時間が経過した後、前記第1蒸発部の受熱を開始させる、ループ型ヒートパイプの起動方法。 - 前記所定の時間は、液相の作動流体が前記第1蒸発部へ流通し始めるのに要する時間に基づいて定められる請求項9に記載のループ型ヒートパイプの起動方法。
- 前記ループ型ヒートパイプは、前記第1蒸気管と前記第2蒸気管とを接続するバイパス管を備える請求項9又は10に記載のループ型ヒートパイプの起動方法。
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Cited By (12)
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JP2013019634A (ja) * | 2011-07-13 | 2013-01-31 | Toyota Motor Corp | 冷却器および冷却装置 |
FR2984472A1 (fr) * | 2011-12-20 | 2013-06-21 | Astrium Sas | Dispositif de regulation thermique passif |
WO2013092386A1 (fr) | 2011-12-20 | 2013-06-27 | Astrium Sas | Dispositif de refroidissement |
CN104040280A (zh) * | 2011-12-20 | 2014-09-10 | 阿斯特里姆有限公司 | 冷却装置 |
US9625182B2 (en) | 2011-12-20 | 2017-04-18 | Aairbus Defence And Space Sas | Cooling device |
EP3355019A1 (fr) * | 2011-12-20 | 2018-08-01 | Airbus Defence and Space SAS | Dispositif de refroidissement |
WO2014147837A1 (ja) * | 2013-03-22 | 2014-09-25 | 富士通株式会社 | 冷却システム及び電子機器 |
JP2014187869A (ja) * | 2013-03-22 | 2014-10-02 | Alstom Transport Sa | 鉄道車両用の電力変換器 |
JPWO2014147837A1 (ja) * | 2013-03-22 | 2017-02-16 | 富士通株式会社 | 冷却システム及び電子機器 |
CN107208980A (zh) * | 2015-01-27 | 2017-09-26 | 欧热管公司 | 具有卫星式蒸发器的环路热管 |
CN107208980B (zh) * | 2015-01-27 | 2019-04-12 | 欧热管公司 | 具有卫星式蒸发器的环路热管 |
JP2018109718A (ja) * | 2017-01-06 | 2018-07-12 | セイコーエプソン株式会社 | 熱輸送装置及びプロジェクター |
Also Published As
Publication number | Publication date |
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JP5218660B2 (ja) | 2013-06-26 |
US20120132402A1 (en) | 2012-05-31 |
CN102472597A (zh) | 2012-05-23 |
JPWO2011007604A1 (ja) | 2012-12-27 |
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