WO2011004764A1 - 板状体の研磨装置及び板状体の研磨方法 - Google Patents
板状体の研磨装置及び板状体の研磨方法 Download PDFInfo
- Publication number
- WO2011004764A1 WO2011004764A1 PCT/JP2010/061283 JP2010061283W WO2011004764A1 WO 2011004764 A1 WO2011004764 A1 WO 2011004764A1 JP 2010061283 W JP2010061283 W JP 2010061283W WO 2011004764 A1 WO2011004764 A1 WO 2011004764A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing
- plate
- back pad
- glass substrate
- pad
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
- B24B7/245—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass discontinuous
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Definitions
- FIG. 1 is a perspective view of a polishing apparatus 10 for a glass substrate G according to the embodiment.
- FIG. 2 is a schematic plan view of the polishing apparatus 10 shown in FIG. 1, in which the contents relating to the shape, arrangement position, and operation of the polishing pad 12 are shown.
- the polishing apparatus 10 for example, continuously conveys a glass substrate G for liquid crystal display having a size of 2200 mm (width) ⁇ 2600 mm (length) or more and a thickness of 0.1 to 1.1 mm along the conveyance path.
- the glass substrate G is continuously polished by a plurality of circular polishing pads 12, 12...
- the glass substrate G to be polished has a urethane resin back pad 16 bonded to the upper surface of the table 14 and a surface (second surface of the main surface) opposite to the surface to be polished (second surface of the main surface).
- the first surface) is held by suction.
- the table 14 is continuously conveyed in the horizontal direction indicated by the arrow X in FIGS. 1 and 2 by a conveying device (not shown).
- the surface to be polished has a flatness required for the glass substrate G for liquid crystal display by each of the polishing pads 12, 12... Of the plurality of polishing machines installed above the transfer path during transfer of the table 14. Polished.
- FIG. 6 is an overall perspective view of the leaf-type polishing apparatus 30 to which the plate-like polishing method of the present invention is applied.
- Each leaf type polishing apparatus 30 is an apparatus for polishing a single glass substrate G into a thin plate that satisfies the flatness required for a glass substrate for a liquid crystal display.
- a circular polishing pad 34 is disposed on a cylindrical polishing surface plate 32 so as to be rotatable around its center, and the polishing pad 34 is provided on the polishing surface plate 32. It is rotated in the direction of arrow A by a motor (not shown).
- the polishing pad 34 is configured to be larger than the size of the glass substrate G.
- FIG. 7 is an overall perspective view of another continuous polishing apparatus 50 to which the plate-like body polishing method of the present invention is applied, and is the same or similar member as the continuous polishing apparatus 10 shown in FIGS. 1 and 2. Will be described with the same reference numerals.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Description
:圧着固化温度 210 ℃
:線状ヒータ(富士インパルス株式会社製 型式:L-1000-10)
:圧着固化後の厚さ 0.4 mm、硬度 86.6°(デュロメータA硬度計による JIS K 7215 に準拠)
ガラス基板は以下のものを用いた。
研磨条件は以下の通りである。
:研磨スラリ
表1に各基板サイズについて、未圧着バックパッドと圧着バックパッドでの研磨パッドとのこすれによるバックパッド破損件数をまとめた。
本出願は、2009年7月6日出願の日本特許出願(特願2009-159537)に基づくものであり、その内容はここに参照として取り込まれる。
12…研磨パッド
14…テーブル
16…バックパッド
16A…バックパッド
18…研磨ヘッド
20…回転軸
22…隙間
24…線状ヒータ
30…毎葉式研磨装置
32…研磨定盤
34…研磨パッド
36…ヒンジ
38…ヘッド
40…バックパッド
40A…バックパッド
50…連続式研磨装置
52、54、56、58…研磨パッド
60、62…研磨パッド
Claims (5)
- 板状体の主表面における第1の面を吸着保持すべく構成されたバックパッドと、
前記板状体の前記主表面における第2の面に押し付けられ、該第2の面を研磨すべく構成された研磨パッドを備え、
前記板状体の辺部の外側近傍に位置するバックパッドが、該辺部に沿って熱収縮されて圧着されていることを特徴とする板状体の研磨装置。 - 複数枚の板状体の各々の第1の面を吸着保持すべく構成され、テーブルに接着されたバックパッドと、
テーブルに載置された前記板状体が連続的に搬送される搬送路の上方に設置され、前記板状体の第2の面を順次研磨すべく構成された複数台の研磨パッドを備え、
前記板状体の辺部の外側近傍に位置するバックパッドが、該辺部に沿って熱収縮されて圧着されていることを特徴とする板状体の研磨装置。 - 隣接する2枚の板状体間の隙間に位置する前記バックパッドが熱収縮されて圧着されている請求項2に記載の板状体の研磨装置。
- 線状ヒータによって前記バックパッドが熱収縮されて圧着される請求項1、2又は3のいずれか1項に記載の板状体の研磨装置。
- 請求項1、2、3又は4のいずれか1項に記載の板状体の研磨装置を用いて板状体を研磨することを特徴とする板状体の研磨方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010800301761A CN102548709A (zh) | 2009-07-06 | 2010-07-01 | 板状体的研磨装置以及板状体的研磨方法 |
JP2011521899A JPWO2011004764A1 (ja) | 2009-07-06 | 2010-07-01 | 板状体の研磨装置及び板状体の研磨方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009159537 | 2009-07-06 | ||
JP2009-159537 | 2009-07-06 |
Publications (1)
Publication Number | Publication Date |
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WO2011004764A1 true WO2011004764A1 (ja) | 2011-01-13 |
Family
ID=43429186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2010/061283 WO2011004764A1 (ja) | 2009-07-06 | 2010-07-01 | 板状体の研磨装置及び板状体の研磨方法 |
Country Status (5)
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JP (1) | JPWO2011004764A1 (ja) |
KR (1) | KR20120033327A (ja) |
CN (1) | CN102548709A (ja) |
TW (1) | TW201111113A (ja) |
WO (1) | WO2011004764A1 (ja) |
Families Citing this family (1)
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CN105397596A (zh) * | 2015-10-21 | 2016-03-16 | 无锡清杨机械制造有限公司 | 一种机械磨削设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0319758A (ja) * | 1989-06-16 | 1991-01-28 | Toshiba Corp | 研削方法 |
JP2000094308A (ja) * | 1998-09-22 | 2000-04-04 | Canon Inc | 矩形基板保持治具および矩形基板研磨方法 |
JP2007190657A (ja) * | 2006-01-20 | 2007-08-02 | Asahi Glass Co Ltd | 板状体の研磨方法及びその装置 |
JP2009095923A (ja) * | 2007-10-16 | 2009-05-07 | Sd Future Technology Co Ltd | 研磨装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004090119A (ja) * | 2002-08-30 | 2004-03-25 | Central Glass Co Ltd | 板状体の片面研磨装置および該装置に用いるバックパッドとその成形方法 |
CN100551624C (zh) * | 2005-01-31 | 2009-10-21 | 三芳化学工业股份有限公司 | 用以固定抛光基材的吸附片材及其制造方法及抛光装置 |
-
2010
- 2010-07-01 KR KR1020127000452A patent/KR20120033327A/ko not_active Application Discontinuation
- 2010-07-01 JP JP2011521899A patent/JPWO2011004764A1/ja not_active Withdrawn
- 2010-07-01 CN CN2010800301761A patent/CN102548709A/zh active Pending
- 2010-07-01 WO PCT/JP2010/061283 patent/WO2011004764A1/ja active Application Filing
- 2010-07-06 TW TW99122190A patent/TW201111113A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0319758A (ja) * | 1989-06-16 | 1991-01-28 | Toshiba Corp | 研削方法 |
JP2000094308A (ja) * | 1998-09-22 | 2000-04-04 | Canon Inc | 矩形基板保持治具および矩形基板研磨方法 |
JP2007190657A (ja) * | 2006-01-20 | 2007-08-02 | Asahi Glass Co Ltd | 板状体の研磨方法及びその装置 |
JP2009095923A (ja) * | 2007-10-16 | 2009-05-07 | Sd Future Technology Co Ltd | 研磨装置 |
Also Published As
Publication number | Publication date |
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TW201111113A (en) | 2011-04-01 |
JPWO2011004764A1 (ja) | 2012-12-20 |
KR20120033327A (ko) | 2012-04-06 |
CN102548709A (zh) | 2012-07-04 |
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