WO2010137690A1 - 接触抵抗、防汚特性に優れるプローブピン用途に好適な銀合金 - Google Patents
接触抵抗、防汚特性に優れるプローブピン用途に好適な銀合金 Download PDFInfo
- Publication number
- WO2010137690A1 WO2010137690A1 PCT/JP2010/059087 JP2010059087W WO2010137690A1 WO 2010137690 A1 WO2010137690 A1 WO 2010137690A1 JP 2010059087 W JP2010059087 W JP 2010059087W WO 2010137690 A1 WO2010137690 A1 WO 2010137690A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe pin
- probe pins
- silver alloy
- contact resistance
- alloy
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
- C22C5/08—Alloys based on silver with copper as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
Definitions
- the present invention relates to a silver alloy suitable for a wire constituting a probe pin for inspecting electrical characteristics of a semiconductor integrated circuit or the like.
- a probe card in which a plurality of probe pins are arranged is used when inspecting electrical characteristics of a semiconductor integrated circuit or a liquid crystal display device formed on a wafer. This inspection is usually performed by bringing probe pins into contact with a plurality of electrode pads such as a semiconductor integrated circuit element and a liquid crystal display device which are inspection objects formed on a wafer.
- probe pin materials include tungsten (W) and its alloys (W-Re alloy, etc.), beryllium copper (Be-Cu), phosphor bronze (Cu-Sn-P), and palladium alloys. (Pd—Ag alloy).
- the probe pin Since the probe pin is a member that contacts the inspection object millions of times, its constituent material is required to have high hardness so that wear due to repeated inspection is reduced. In addition, since the probe pin is used for inspection of electrical characteristics, it is preferable to apply a conductive material having a low specific resistance and good conductivity.
- the various materials described above are materials developed mainly from the viewpoints of hardness and specific resistance.
- the number of probe pins to be mounted on the probe card has been increased to increase the number of pins.
- the pushing amount (overdrive) for obtaining this stable contact resistance differs depending on the material, but if the pushing amount is large, the contact pressure becomes high. And the probe pin with a high contact pressure will increase the burden to a test object by multi-pinning. Therefore, as a material for the probe pin that can cope with the increase in the number of pins, it is required that the overdrive is small and a stable contact resistance can be obtained even at a low contact pressure.
- the present invention has been made in the background as described above, and provides a material improved in low contact pressure, improved high-temperature strength, and antifouling properties.
- the present inventors have conducted intensive research and found an alloy material for probe pins in which an alloy mainly composed of silver (Ag) and added with a predetermined range of copper has the above-mentioned characteristics. It was.
- the present invention is a silver alloy suitable for a probe pin wire made of an Au—Cu alloy, and is a silver alloy with Cu: 30 to 50% by weight and the balance Ag.
- Ag is a material suitable for probe pin use because it is a good conductor with a low specific resistance, but there is a lack in strength.
- a predetermined range of Cu is added as an alloying element for Ag to compensate for the lack of strength and achieve a balance.
- Cu has the effect of increasing the strength of the alloy, but Cu is selected because it has the effect of increasing the strength and has little effect on the conductivity of the alloy.
- As an alloy composition for probe pin use 30 to 50% by weight of Cu is added. The reason for limiting to this range is that if it is less than 30% by weight, the strength is insufficient, and if it exceeds 50% by weight, it tends to be oxidized.
- the alloy according to the present invention may further contain 2 to 10% by weight of Ni.
- Ni is further added in order to clarify the improvement effect in terms of strength.
- the reason why the amount of Ni added is 2 to 10% by weight is that if the amount is less than 2% by weight, the improvement effect due to the addition is small, and if it exceeds 10% by weight, there is a problem in workability.
- the entire pin is made of an alloy material so-called a muku material.
- the probe pin has sufficient hardness and conductivity, and is excellent in oxidation resistance.
- the silver alloy suitable for the probe pin application according to the present invention is excellent in stability and strength of contact resistance and in addition, antifouling properties. According to the present invention, a probe pin that can be used stably for a long period of time can be obtained.
- alloys having various compositions were manufactured, and basic characteristics such as hardness and specific resistance were measured, and then contact pressure, antifouling characteristics, and high temperature strength were evaluated.
- Samples were prepared by melting each metal used as a raw material in vacuum to produce an ingot (dimension: ⁇ 40 mm ⁇ 6 mm), and rolling this so that the cross-sectional reduction rate was about 80%. The thickness after rolling was about 1.2 mm. And the rolled material was cut
- a wire (a wire diameter of 0.2 mm) was made from the alloy ingot produced in the above process, and cut and processed to produce a probe pin. And antifouling property and creep property were evaluated about these.
- the antifouling property was evaluated by installing the probe pin in a simulation test apparatus as shown in FIG. 1 and measuring the resistance value while repeatedly contacting the probe pin and the aluminum pad (applied current was 100 mA per pin).
- the resistance value increased as the number of contacts increased, but the time when the resistance value exceeded 5 ⁇ was set as a contaminated state that required cleaning, and the number of contacts until 5 ⁇ was measured.
- the probe pins in each of the examples are extremely difficult to be contaminated because the number of contact times until contamination is recognized exceeds 300,000 times. It can also be seen that creep deformation is less likely to occur and is preferable from the viewpoint of strength. Conventional tungsten and its alloys are easily affected by contamination, and the resistance value increases with the number of contacts of about 10,000 times, and the creep characteristics are not particularly excellent.
- the probe pin in which the concentration of copper and nickel manufactured as a comparative example is outside the specified value shows a preferable characteristic as compared with the conventional product, it is inferior to each example, and the antifouling characteristic and the creep characteristic are low. It was a lack of balance.
- the contact pressure was further evaluated for the probe pins made of the alloys of Examples 1, 2, 5, 6 and Conventional Examples 1 and 2.
- the resistance value is measured while changing the push amount (overdrive) of the probe pin tip into the pad, and the overdrive until the resistance value is stabilized is measured. Is. The measurement results are shown in FIG.
- FIG. 3 shows that the probe pin according to each example has little overdrive until a stable contact resistance value is obtained. That is, it was confirmed that the probe pin according to each example is a thing that can obtain a stable contact resistance even when the contact pressure is low.
- the silver alloy according to the present invention is a material suitable for probe pin applications, has excellent antifouling properties and creep properties, and exhibits stable electrical properties at low contact pressure.
- the probe pin according to the present invention with these improved characteristics can flexibly respond to a demand for improving inspection efficiency and a demand for increasing the density of semiconductor integrated circuits.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (3)
- Au-Cu合金からなるプローブピン用途に適した銀合金であって、Cu:30~50重量%、残部Agである銀合金。
- 更に、Niを2~10重量%含む請求項1記載のプローブピン用途に適した銀合金。
- 請求項1又は請求項2記載の材料からなるプローブピン。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020117003906A KR101260135B1 (ko) | 2009-05-29 | 2010-05-28 | 접촉저항, 방오특성이 우수한 프로브 핀 |
EP10780644.0A EP2436790B1 (en) | 2009-05-29 | 2010-05-28 | Silver alloy that is appropriately usable in probe pins having excellent contact resistance and excellent anti-stain properties |
US13/057,370 US8591805B2 (en) | 2009-05-29 | 2010-05-28 | Silver alloy having excellent contact resistance and antifouling property and suitable for use in probe pin |
CN2010800025225A CN102137945A (zh) | 2009-05-29 | 2010-05-28 | 接触电阻和防污特性优良的适合用于探针用途的银合金 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-129992 | 2009-05-29 | ||
JP2009129992A JP4801757B2 (ja) | 2009-05-29 | 2009-05-29 | 接触抵抗、防汚特性に優れるプローブピン |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010137690A1 true WO2010137690A1 (ja) | 2010-12-02 |
Family
ID=43222795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/059087 WO2010137690A1 (ja) | 2009-05-29 | 2010-05-28 | 接触抵抗、防汚特性に優れるプローブピン用途に好適な銀合金 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8591805B2 (ja) |
EP (1) | EP2436790B1 (ja) |
JP (1) | JP4801757B2 (ja) |
KR (1) | KR101260135B1 (ja) |
CN (2) | CN105369049B (ja) |
TW (1) | TWI486461B (ja) |
WO (1) | WO2010137690A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101251926B1 (ko) * | 2011-10-14 | 2013-04-08 | 황귀순 | 프로브 유닛 |
TW201702392A (zh) * | 2015-03-31 | 2017-01-16 | 日本發條股份有限公司 | 合金材料、接觸探針及連接端子 |
TWI787302B (zh) * | 2017-07-10 | 2022-12-21 | 日商聯合精密科技股份有限公司 | 一種二元銅銀合金體的製造方法、觸頭引腳以及使用二元銅銀合金的裝置 |
KR102259743B1 (ko) | 2017-12-01 | 2021-06-02 | 주식회사 엘지화학 | 열가소성 수지 조성물 및 이를 이용한 열가소성 수지 성형품 |
RU2724301C2 (ru) * | 2018-12-17 | 2020-06-22 | Акционерное общество "НПО "Орион" | Способ увеличения прочности зондов многозондовых головок |
CN111411253A (zh) * | 2020-04-14 | 2020-07-14 | 紫金矿业集团黄金冶炼有限公司 | 一种高纯银铜合金异型丝材的制备方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6216896A (ja) * | 1985-07-17 | 1987-01-26 | Tanaka Kikinzoku Kogyo Kk | セラミツクス用ろう材 |
JPH05154719A (ja) | 1991-11-29 | 1993-06-22 | Tanaka Kikinzoku Kogyo Kk | プローブピンの製造装置 |
JPH1038922A (ja) | 1996-07-26 | 1998-02-13 | Iwaki Electron Corp Ltd | プローブピン装置 |
JP2002071714A (ja) * | 2000-08-31 | 2002-03-12 | Kanai Hiroaki | プローブカード用プローブピン |
JP2002311055A (ja) * | 2001-04-18 | 2002-10-23 | Tokyo Cathode Laboratory Co Ltd | プローブカード |
JP2004076055A (ja) * | 2002-08-13 | 2004-03-11 | Hitachi Metals Ltd | 導電性スペーサ用金属球 |
JP2004093355A (ja) | 2002-08-30 | 2004-03-25 | Toshiba Corp | Pd合金系プローブピンおよびそれを用いたプローブピン装置 |
JP2005066686A (ja) * | 2003-08-27 | 2005-03-17 | Toshiba Corp | 接合材、接合材の製造方法、およびこれを用いた真空バルブ |
WO2008149886A1 (ja) * | 2007-06-06 | 2008-12-11 | Tanaka Kikinzoku Kogyo K.K. | プローブピン用材料 |
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US2196303A (en) * | 1939-02-21 | 1940-04-09 | Mallory & Co Inc P R | Silver copper alloy |
US2303272A (en) * | 1941-09-18 | 1942-11-24 | Fansteel Metallurgical Corp | Metal alloy |
US2970248A (en) * | 1957-11-12 | 1961-01-31 | Pacific Semiconductors Inc | Pin material for glass seal semiconductor rectifier |
US3401024A (en) * | 1965-10-04 | 1968-09-10 | Mallory & Co Inc P R | Electrical contact material |
US6596229B2 (en) * | 2000-12-29 | 2003-07-22 | United Technologies Corporation | Silver braze alloy |
EP1737075B1 (de) * | 2005-06-23 | 2017-03-08 | Feinmetall GmbH | Kontaktiervorrichtung |
JP2008305630A (ja) * | 2007-06-06 | 2008-12-18 | Ushio Inc | 光源装置 |
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2009
- 2009-05-29 JP JP2009129992A patent/JP4801757B2/ja active Active
-
2010
- 2010-05-27 TW TW099116958A patent/TWI486461B/zh active
- 2010-05-28 EP EP10780644.0A patent/EP2436790B1/en active Active
- 2010-05-28 KR KR1020117003906A patent/KR101260135B1/ko active IP Right Grant
- 2010-05-28 CN CN201510672606.4A patent/CN105369049B/zh active Active
- 2010-05-28 US US13/057,370 patent/US8591805B2/en active Active
- 2010-05-28 WO PCT/JP2010/059087 patent/WO2010137690A1/ja active Application Filing
- 2010-05-28 CN CN2010800025225A patent/CN102137945A/zh active Pending
Patent Citations (9)
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---|---|---|---|---|
JPS6216896A (ja) * | 1985-07-17 | 1987-01-26 | Tanaka Kikinzoku Kogyo Kk | セラミツクス用ろう材 |
JPH05154719A (ja) | 1991-11-29 | 1993-06-22 | Tanaka Kikinzoku Kogyo Kk | プローブピンの製造装置 |
JPH1038922A (ja) | 1996-07-26 | 1998-02-13 | Iwaki Electron Corp Ltd | プローブピン装置 |
JP2002071714A (ja) * | 2000-08-31 | 2002-03-12 | Kanai Hiroaki | プローブカード用プローブピン |
JP2002311055A (ja) * | 2001-04-18 | 2002-10-23 | Tokyo Cathode Laboratory Co Ltd | プローブカード |
JP2004076055A (ja) * | 2002-08-13 | 2004-03-11 | Hitachi Metals Ltd | 導電性スペーサ用金属球 |
JP2004093355A (ja) | 2002-08-30 | 2004-03-25 | Toshiba Corp | Pd合金系プローブピンおよびそれを用いたプローブピン装置 |
JP2005066686A (ja) * | 2003-08-27 | 2005-03-17 | Toshiba Corp | 接合材、接合材の製造方法、およびこれを用いた真空バルブ |
WO2008149886A1 (ja) * | 2007-06-06 | 2008-12-11 | Tanaka Kikinzoku Kogyo K.K. | プローブピン用材料 |
Non-Patent Citations (1)
Title |
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See also references of EP2436790A4 * |
Also Published As
Publication number | Publication date |
---|---|
EP2436790A4 (en) | 2012-11-21 |
US8591805B2 (en) | 2013-11-26 |
KR101260135B1 (ko) | 2013-05-02 |
JP4801757B2 (ja) | 2011-10-26 |
TW201100563A (en) | 2011-01-01 |
EP2436790B1 (en) | 2013-12-18 |
US20110133767A1 (en) | 2011-06-09 |
JP2010275596A (ja) | 2010-12-09 |
TWI486461B (zh) | 2015-06-01 |
EP2436790A1 (en) | 2012-04-04 |
CN105369049B (zh) | 2018-04-10 |
KR20110036625A (ko) | 2011-04-07 |
CN105369049A (zh) | 2016-03-02 |
CN102137945A (zh) | 2011-07-27 |
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