JP6728057B2 - 合金材料、コンタクトプローブおよび接続端子 - Google Patents
合金材料、コンタクトプローブおよび接続端子 Download PDFInfo
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- JP6728057B2 JP6728057B2 JP2016563015A JP2016563015A JP6728057B2 JP 6728057 B2 JP6728057 B2 JP 6728057B2 JP 2016563015 A JP2016563015 A JP 2016563015A JP 2016563015 A JP2016563015 A JP 2016563015A JP 6728057 B2 JP6728057 B2 JP 6728057B2
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- Prior art keywords
- contact
- alloy material
- plunger
- probe
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000523 sample Substances 0.000 title claims description 58
- 239000000956 alloy Substances 0.000 title claims description 42
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 17
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 12
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 229910052741 iridium Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052707 ruthenium Inorganic materials 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims 1
- 238000007689 inspection Methods 0.000 description 25
- 230000000052 comparative effect Effects 0.000 description 24
- 238000005260 corrosion Methods 0.000 description 23
- 230000007797 corrosion Effects 0.000 description 23
- 239000004065 semiconductor Substances 0.000 description 21
- 239000000203 mixture Substances 0.000 description 14
- 238000012360 testing method Methods 0.000 description 10
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- 238000004804 winding Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 230000032683 aging Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004881 precipitation hardening Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Measuring Leads Or Probes (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Description
2 コンタクトプローブ(プローブ)
3 プローブホルダ
4 ホルダ部材
21 第1プランジャ
22 第2プランジャ
23 コイルばね
23a 密着巻き部
23b 粗巻き部
31 第1部材
32 第2部材
33,34 ホルダ孔
100 半導体集積回路
101 接続用電極
200 回路基板
201 電極
Claims (4)
- 銀(Ag)を10〜30wt%、ニッケル(Ni)を0.5〜10wt%、イリジウム(Ir)を0.01〜0.1wt%、パラジウム(Pd)を5〜20wt%、スズ(Sn)を0.5〜5wt%、ルテニウム(Ru)を、Irとの組み合わせで0.1wt%を上限として0〜0.09wt%含み、残部が銅(Cu)および不可避不純物からなることを特徴とする合金材料。
- 長手方向の両端で接触対象とそれぞれ接触する導電性のコンタクトプローブであって、
少なくとも一部が、請求項1に記載の合金材料を用いて形成されたことを特徴とするコンタクトプローブ。 - 一端で一方の接触対象と接触する導電性の第1プランジャと、
一端で他方の接触対象と接触する導電性の第2プランジャと、
前記第1および第2プランジャの間に設けられて該第1および第2プランジャを伸縮自在に連結するコイルばねと、
を有し、
前記第1プランジャ、前記第2プランジャおよび前記コイルばねのうち、少なくとも一つが前記合金材料からなることを特徴とする請求項2に記載のコンタクトプローブ。 - 長手方向の両端で接触対象とそれぞれ接触する導電性の接続端子であって、
少なくとも一部が、請求項1に記載の合金材料を用いて形成されたことを特徴とする接続端子。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015074331 | 2015-03-31 | ||
JP2015074331 | 2015-03-31 | ||
PCT/JP2016/060830 WO2016159316A1 (ja) | 2015-03-31 | 2016-03-31 | 合金材料、コンタクトプローブおよび接続端子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016159316A1 JPWO2016159316A1 (ja) | 2018-03-08 |
JP6728057B2 true JP6728057B2 (ja) | 2020-07-22 |
Family
ID=57004414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016563015A Active JP6728057B2 (ja) | 2015-03-31 | 2016-03-31 | 合金材料、コンタクトプローブおよび接続端子 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6728057B2 (ja) |
TW (1) | TW201702392A (ja) |
WO (1) | WO2016159316A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6809978B2 (ja) * | 2017-04-28 | 2021-01-06 | 株式会社アドバンテスト | 電子部品試験装置用のキャリア |
TWI668459B (zh) * | 2017-06-14 | 2019-08-11 | 日商日本發條股份有限公司 | 導電性接觸子單元 |
TWI787302B (zh) * | 2017-07-10 | 2022-12-21 | 日商聯合精密科技股份有限公司 | 一種二元銅銀合金體的製造方法、觸頭引腳以及使用二元銅銀合金的裝置 |
JP2023145888A (ja) * | 2022-03-29 | 2023-10-12 | 石福金属興業株式会社 | プローブピン用合金材料 |
JP2023145917A (ja) * | 2022-03-29 | 2023-10-12 | 株式会社ヨコオ | プローブ |
JP7507320B2 (ja) | 2022-06-08 | 2024-06-27 | Swcc株式会社 | 電気特性検査用導線およびその製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56133442A (en) * | 1980-03-24 | 1981-10-19 | Tanaka Kikinzoku Kogyo Kk | Electrical contact material |
JPS57171599A (en) * | 1981-04-13 | 1982-10-22 | Mitsubishi Metal Corp | Low melting point cu-ag system alloy solder with excellent wetting property |
JPS6293327A (ja) * | 1985-10-21 | 1987-04-28 | Tanaka Kikinzoku Kogyo Kk | コンミテ−タ用材料 |
JP2004061265A (ja) * | 2002-07-29 | 2004-02-26 | Sumitomo Electric Ind Ltd | 電気接点用微細部品およびその製造方法 |
JP4446479B2 (ja) * | 2005-01-31 | 2010-04-07 | 日鉱金属株式会社 | 電子機器用銅合金 |
JP4708833B2 (ja) * | 2005-04-08 | 2011-06-22 | 昭和電線ケーブルシステム株式会社 | 耐へたり性に優れた電気・電子部品精密導電性ばね用高強度銅合金材料とその製造方法 |
JP4801757B2 (ja) * | 2009-05-29 | 2011-10-26 | 田中貴金属工業株式会社 | 接触抵抗、防汚特性に優れるプローブピン |
MY184937A (en) * | 2012-08-03 | 2021-04-30 | Yamamoto Precious Metal Co Ltd | Alloy material, contact probe, and connection terminal |
KR20150056556A (ko) * | 2012-09-28 | 2015-05-26 | 가부시키가이샤 토쿠리키 혼텐 | 전기·전자기기 용도의 Ag-Pd-Cu-Co 합금 |
-
2016
- 2016-03-31 TW TW105110500A patent/TW201702392A/zh unknown
- 2016-03-31 WO PCT/JP2016/060830 patent/WO2016159316A1/ja active Application Filing
- 2016-03-31 JP JP2016563015A patent/JP6728057B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JPWO2016159316A1 (ja) | 2018-03-08 |
WO2016159316A1 (ja) | 2016-10-06 |
TW201702392A (zh) | 2017-01-16 |
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