WO2010061736A1 - 印刷回路用銅箔 - Google Patents
印刷回路用銅箔 Download PDFInfo
- Publication number
- WO2010061736A1 WO2010061736A1 PCT/JP2009/069345 JP2009069345W WO2010061736A1 WO 2010061736 A1 WO2010061736 A1 WO 2010061736A1 JP 2009069345 W JP2009069345 W JP 2009069345W WO 2010061736 A1 WO2010061736 A1 WO 2010061736A1
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- WIPO (PCT)
- Prior art keywords
- copper foil
- particles
- copper
- cobalt
- nickel
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12049—Nonmetal component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12458—All metal or with adjacent metals having composition, density, or hardness gradient
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
- Y10T428/12514—One component Cu-based
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12868—Group IB metal-base component alternative to platinum group metal-base component [e.g., precious metal, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
Definitions
- the present invention relates to a copper foil for a printed circuit, and more particularly to a copper for a printed circuit capable of reducing the occurrence of powdering off and uneven processing of a roughened layer by copper-cobalt-nickel alloy plating on the surface of the copper foil.
- the copper foil for printed circuit of the present invention is particularly suitable for fine pattern printed circuit and magnetic head FPC (Flexible Printed Circuit).
- Copper and copper alloy foils have greatly contributed to the development of electrical and electronic industries, and are indispensable particularly as printed circuit materials.
- Copper foil for printed circuit is generally used to produce a copper-clad laminate by laminating and bonding to a base material such as a synthetic resin board or film through an adhesive or under high temperature and high pressure without using an adhesive.
- a necessary circuit is printed through a resist coating and exposure process, and then an etching process for removing unnecessary portions is performed. Finally, the required elements are soldered to form various printed circuit boards for the electronic device.
- the copper foil for printed circuit boards differs in the surface (roughening surface) adhere
- the requirements for the roughened surface formed on the copper foil are as follows: 1) No oxidation discoloration during storage, 2) High peel strength with substrate, high temperature heating, wet processing, soldering, chemicals It is sufficient even after treatment or the like, and 3) that there is no so-called lamination stain that occurs after lamination with the substrate and etching.
- the roughening treatment of the copper foil plays a major role as determining the adhesiveness between the copper foil and the base material.
- a copper roughening treatment in which electrodeposition of copper was initially employed was adopted, but various techniques were proposed thereafter, and copper--for the purpose of improving the heat-resistant peel strength, hydrochloric acid resistance and oxidation resistance.
- Nickel roughening is established as one typical processing method.
- the present applicant has proposed a copper-nickel roughening treatment (see Patent Document 1) and has achieved results.
- the surface of the copper-nickel treatment is black, and particularly in the rolled foil for flexible substrates, this copper-nickel treatment black has been recognized as a symbol as a product.
- the copper-nickel roughening treatment is excellent in heat-resistant peel strength, oxidation resistance, and hydrochloric acid resistance, it is difficult to etch with an alkaline etchant that has recently become important as a fine pattern treatment, and has a pitch of 150 ⁇ m.
- an alkaline etchant that has recently become important as a fine pattern treatment, and has a pitch of 150 ⁇ m.
- the processing layer becomes an etching residue. Therefore, the applicant has previously developed a Cu—Co treatment (see Patent Documents 2 and 3) and a Cu—Co—Ni treatment (see Patent Document 4) as fine pattern treatments.
- the tendency of the circuit to be easily peeled off by the hydrochloric acid etching solution becomes stronger, and the prevention thereof is necessary.
- the circuit becomes thinner, the circuit is also easily peeled off due to a high temperature during processing such as soldering, and the prevention thereof is also necessary.
- As fine patterning progresses it is no longer an essential requirement to be able to etch a printed circuit having a pitch of 150 ⁇ m or less with a CuCl 2 etchant, for example, and alkali etching is becoming a necessary requirement with diversification of resists and the like.
- the black surface is also important from the viewpoint of copper foil fabrication and chip mounting in terms of increasing alignment accuracy and heat absorption.
- the present applicant formed a cobalt plating layer or a cobalt-nickel alloy plating layer on the surface of the copper foil and then formed a cobalt plating layer or a cobalt-nickel alloy plating layer as a printed circuit copper foil.
- a cobalt plating layer or a cobalt-nickel alloy plating layer has many of the above-mentioned general characteristics, especially the above-mentioned characteristics comparable to the Cu-Ni treatment, and does not reduce the heat-resistant peel strength when an acrylic adhesive is used.
- rust prevention represented by chromium oxide single coating treatment or mixed coating treatment of chromium oxide and zinc and / or zinc oxide. Processing is performed.
- the present inventor is concerned with the treatment of a copper foil for printed circuits in which a cobalt-nickel alloy plating layer is formed on the surface of the copper foil after a roughening treatment by copper-cobalt-nickel alloy plating, and further a zinc-nickel alloy plating layer is formed.
- a cobalt-nickel alloy plating layer is formed on the surface of the copper foil after a roughening treatment by copper-cobalt-nickel alloy plating, and further a zinc-nickel alloy plating layer is formed.
- Patent Document 7 and Patent Document 8 disclose initial techniques of roughening treatment by copper-cobalt-nickel alloy plating.
- the subject of the present invention is a phenomenon that is generally referred to as powder falling, in the most basic roughening treatment comprising copper-cobalt-nickel alloy plating, the roughened particles formed in a dendritic shape peel off from the surface of the copper foil. In addition, processing unevenness is suppressed. Along with the development of electronic equipment, the miniaturization and high integration of semiconductor devices have further progressed, and the processing performed in the manufacturing process of these printed circuits is becoming more severe. It is an object of the present invention to provide a technique that meets these requirements.
- the present invention is 1) A copper foil for printed circuit in which a ternary alloy electroplating layer made of copper, cobalt and nickel is formed on the surface of the copper foil, and the electroplating layer is formed from dendritic particles grown from the copper foil surface. becomes, the particles of the area 0.1-0.5 2 as viewed from above the copper foil surface 1000/10000 2 below, particles greater than 0.5 [mu] m 2 is 100/10000 2 or less, the balance being less than 0.1 [mu] m 2 particles, printed circuit copper foil 2, characterized in that coating the entire surface of the copper foil) particles of an area 0.1-0.5 2 as viewed from above the copper foil surface 300/10000 2 below is there the 1, characterized in that) printed circuit copper foil 3 according) dendritic particles area 0.1-0.5 2 as viewed from above the copper foil surface for the particles are 100/10000 2 below, 0 more than .5 ⁇ m 2 particles 30/100 Above 1) or 2) printed circuit copper foil 4 according) in a copper foil for the printed circuit, the amount adhering to
- a cobalt-nickel alloy plating layer is formed on the roughening layer by copper-cobalt-nickel alloy plating, and a zinc-nickel alloy plating layer is further formed on the cobalt-nickel alloy plating layer.
- Copper foil can be provided.
- the cobalt-nickel alloy plating layer may have a cobalt adhesion amount of 200 to 3000 ⁇ g / dm 2 and a cobalt ratio of 60 to 66 mass%.
- the zinc-nickel alloy plating layer has a total amount in the range of 150 to 500 ⁇ g / dm 2 , a nickel amount in the range of 50 ⁇ g / dm 2 or more, and a nickel ratio in the range of 0.16 to 0.40.
- -A nickel alloy plating layer can be formed.
- a rust-proofing layer can be formed on the zinc-nickel alloy plating layer or the cobalt-nickel alloy plating layer.
- the independent film processing of chromium oxide or the mixed film processing layer of chromium oxide, zinc, and / or zinc oxide can be formed, for example.
- a silane coupling layer can be formed on the mixed film treatment layer.
- the printed circuit copper foil can produce a copper-clad laminate bonded to a resin substrate by thermocompression bonding without using an adhesive.
- the roughening treatment comprising copper-cobalt-nickel alloy plating causes the dendritic roughening particles to peel off from the surface of the copper foil, and to suppress the phenomenon generally called powdering and processing unevenness.
- the miniaturization and high integration of semiconductor devices have further progressed, and the processing performed in the manufacturing process of these printed circuits has been made more severe. Has a technical effect to answer.
- the copper foil used in the present invention may be either an electrolytic copper foil or a rolled copper foil.
- the surface of the copper foil that adheres to the resin base material that is, the roughened surface, has a “fisture” on the surface of the copper foil after degreasing for the purpose of improving the peel strength of the copper foil after lamination.
- a roughening treatment is performed to perform electrodeposition.
- the electrolytic copper foil has irregularities at the time of manufacture, the irregularities are further increased by enhancing the convex portions of the electrolytic copper foil by roughening treatment. In the present invention, this roughening treatment is performed by copper-cobalt-nickel alloy plating.
- normal plating of copper or the like is performed as a pretreatment before roughening
- normal plating of copper or the like is performed as a finishing treatment after roughening in order to prevent electrodeposits from dropping off.
- the present invention includes all of these.
- the content of treatment may be somewhat different between the rolled copper foil and the electrolytic copper foil.
- known treatments related to copper foil roughening are included as necessary, and are collectively referred to as roughening treatment.
- Co adhesion amount is less than 100 ⁇ g / dm 2 , the heat resistance is deteriorated and the etching property is also deteriorated.
- the amount of Co deposition exceeds 3000 ⁇ g / dm 2 , it is not preferable when the influence of magnetism must be taken into consideration, etching spots occur, and deterioration of acid resistance and chemical resistance can be considered.
- Ni adhesion amount When the Ni adhesion amount is less than 100 ⁇ g / dm 2 , the heat resistance deteriorates. On the other hand, when the Ni adhesion amount exceeds 500 ⁇ g / dm 2 , the etching property is lowered. That is, although it is not at a level where etching remains and etching cannot be performed, it becomes difficult to form a fine pattern.
- Preferred Co deposition amount is 2000 ⁇ 3000 ⁇ g / dm 2, and preferably nickel coating weight is 200 ⁇ 400 ⁇ g / dm 2.
- copper - cobalt - deposition of nickel alloy plating it may be desirable is 15 ⁇ 40mg / dm 2 of copper -100 ⁇ 3000 ⁇ g / dm 2 of cobalt -100 ⁇ 500 ⁇ g / dm 2 of nickel.
- Each adhesion amount of the ternary alloy layer is a desirable condition, and a range exceeding this amount is not denied.
- the etching stain means that Co remains without being dissolved when etched with copper chloride, and the etching residue means that Ni remains undissolved when alkaline etching is performed with ammonium chloride. It means to end.
- an alkaline etching solution and a copper chloride based etching solution as described in the following examples are used.
- this etching solution and etching conditions are versatile, it should be understood that they are not limited to these conditions and can be arbitrarily selected.
- a general plating bath and plating conditions for forming the ternary copper-cobalt-nickel alloy plating are as follows. (Copper-cobalt-nickel alloy plating) Cu: 10 to 20 g / liter Co: 1 to 10 g / liter Ni: 1 to 10 g / liter pH: 1 to 4 Temperature: 30-40 ° C Current density D k : 20 to 30 A / dm 2 Time: 1-5 seconds
- This invention is the copper foil for printed circuits which formed the ternary system alloy electroplating layer which consists of copper, cobalt, and nickel on the surface of copper foil as above-mentioned, and this electroplating layer grew from the copper foil surface dendritic particles, the particles of area 0.1-0.5 2 as viewed from above the copper foil surface 1000/10000 2 below, the particles greater than 0.5 [mu] m 2 and 100/10000 2 or less, the balance being The particles having a size of less than 0.1 ⁇ m 2 cover the entire surface of the copper foil. This can be achieved by arbitrarily selecting and adjusting the plating conditions according to the thickness of the plating. . In particular, it is effective to reduce the current density and perform plating at a relatively low temperature.
- the shape of the dendritic particles grown from the copper foil surface is important. Conventionally, rough particles have not been studied from such a point of view, and the development of dendritic particles has only been promoted, and the problem has been involved. The present invention can solve this problem and is more effective in forming a fine pattern printed circuit.
- Area the roughening particles are particles of an area 0.1-0.5 2 as viewed from above the copper foil surface is 300/10000 2 or less, more viewed from the copper foil surface for dendritic particles 0.1-0.5 2 particles 100/10000 2 or less, it is desirable particles of greater than 0.5 [mu] m 2 is 30 pieces / 10000 2 below.
- the height of the dendritic particles from the copper foil surface is 0.1 ⁇ m to 1.0 ⁇ m, and further the height is 0.2 ⁇ m to 0.6 ⁇ m.
- particles on a tree branch have side branches having a length equal to or larger than the main trunk diameter of the tree branch grown from the copper foil surface is 100/10000 ⁇ m 2 or less, and more preferably 30/10000 ⁇ m 2 or less.
- the abnormally grown particles are reduced, the particle diameters are uniform and the entire surface is covered, so that the etching property is improved, and there is no etching residue and unevenness, and a circuit with good cutting can be formed.
- a cobalt-nickel alloy plating layer can be formed on the roughened surface after the roughening treatment.
- the cobalt-nickel alloy plating layer preferably has a cobalt adhesion amount of 200 to 3000 ⁇ g / dm 2 and a cobalt ratio of 60 to 66 mass%.
- This treatment can be regarded as a kind of rust prevention treatment in a broad sense.
- This cobalt-nickel alloy plating layer needs to be performed to such an extent that the adhesive strength between the copper foil and the substrate is not substantially lowered.
- the amount of cobalt adhesion is less than 200 ⁇ g / dm 2 , the heat-resistant peel strength decreases, the oxidation resistance and chemical resistance deteriorate, and the treatment surface becomes reddish.
- the amount of cobalt deposition exceeds 3000 ⁇ g / dm 2 , it is not preferable when the influence of magnetism must be taken into consideration, etching spots occur, and deterioration of acid resistance and chemical resistance is considered.
- a preferable cobalt adhesion amount is 500 to 3000 ⁇ g / dm 2 .
- the cobalt ratio is preferably 60 to 66 mass%.
- the direct major cause of soft etching soaking is a heat-resistant rust-proof layer made of a zinc-nickel alloy plating layer, but cobalt can also cause the soaking of soft etching.
- the above adjustment is a more desirable condition.
- the nickel adhesion amount is small, the heat-resistant peel strength is lowered, and the oxidation resistance and chemical resistance are lowered. Further, when the nickel adhesion amount is too large, the alkali etching property is deteriorated, so it is desirable to determine the balance with the cobalt content.
- cobalt-nickel alloy plating Co: 1-20 g / liter Ni: 1-20 g / liter pH: 1.5-3.5 Temperature: 30-80 ° C Current density D k : 1.0 to 20.0 A / dm 2 Time: 0.5-4 seconds
- a zinc-nickel alloy plating layer can be further formed on the cobalt-nickel alloy plating.
- the total amount of the zinc-nickel alloy plating layer is 150 to 500 ⁇ g / dm 2 and the nickel ratio is 16 to 40% by mass. This has a role of a heat-resistant rust-proof layer.
- This condition is also a preferable condition, and other known zinc-nickel alloy plating can be used. It will be understood that this zinc-nickel alloy plating is a preferred additional condition in the present invention.
- the processing performed in the manufacturing process of the printed circuit becomes much higher, and there is heat generation during use of the device after it has become a product.
- Nickel has an effect of suppressing penetration of an etching agent (etching aqueous solution of H 2 SO 4 : 10 wt%, H 2 O 2 : 2 wt%) used in soft etching.
- the total amount of the zinc-nickel alloy plating layer is 150 to 500 ⁇ g / dm 2
- the lower limit of the nickel ratio in the alloy layer is 0.16
- the upper limit is 0.40
- the nickel The content of 50 ⁇ g / dm 2 or more serves as a heat-resistant and rust-proof layer, suppresses the penetration of the etching agent used during soft etching, and prevents weakening of the joint strength of the circuit due to corrosion It has the effect that it can be done.
- the total amount of the zinc-nickel alloy plating layer is less than 150 ⁇ g / dm 2 , the heat and rust prevention ability is lowered and it becomes difficult to play a role as a heat and rust prevention layer, and if the total amount exceeds 500 ⁇ g / dm 2 The hydrochloric acid resistance tends to deteriorate.
- the lower limit of the nickel ratio in the alloy layer is less than 0.16, the penetration amount during soft etching exceeds 9 ⁇ m, which is not preferable.
- the upper limit value of nickel ratio 0.40 is a technical limit value for forming a zinc-nickel alloy plating layer.
- Zinc-nickel alloy plating Zn: 0-30 g / liter Ni: 0-25 g / liter pH: 3-4 Temperature: 40-50 ° C Current density D k : 0.5 to 5 A / dm 2 Time: 1 to 3 seconds
- a cobalt-nickel alloy plating layer and further a zinc-nickel alloy plating layer can be sequentially formed on a copper-cobalt-nickel alloy plating layer as a roughening treatment as necessary. .
- the total amount of cobalt and nickel deposited in these layers can also be adjusted.
- the total coating weight of 300 ⁇ 5000 ⁇ g / dm 2 of cobalt, the total deposition amount of nickel is preferably set to 260 ⁇ 1200 ⁇ g / dm 2.
- the total coating weight is less than 300 [mu] g / dm 2 of cobalt, heat resistance and chemical resistance is lowered, the total deposition amount of cobalt is more than 5000 [mu] g / dm 2, there is an etching stain may occur. Moreover, if the total adhesion amount of nickel is less than 260 ⁇ g / dm 2 , the heat resistance and chemical resistance are lowered. When the total adhesion amount of nickel exceeds 1200 ⁇ g / dm 2 , an etching residue is generated.
- the total deposition amount of cobalt is 2500 ⁇ 5000 ⁇ g / dm 2, and the total deposition amount of nickel 580 ⁇ 1200 ⁇ g / dm 2, particularly preferably 600 ⁇ 1000 ⁇ g / dm 2. If the above conditions are satisfied, the conditions described in this paragraph need not be particularly limited.
- a rust prevention treatment is performed as necessary.
- a preferable antirust treatment is a coating treatment of chromium oxide alone or a mixture coating treatment of chromium oxide and zinc / zinc oxide.
- Chromium oxide and zinc / zinc oxide mixture film treatment is a method of forming zinc or zinc oxide comprising zinc oxide and chromium oxide by electroplating using a plating bath containing zinc salt or zinc oxide and chromate. It is the process which coat
- At least one kind of dichromate such as K 2 Cr 2 O 7 and Na 2 Cr 2 O 7 and CrO 3 and a water-soluble zinc salt such as ZnO 4 and ZnSO 4 ⁇ 7H are used.
- a mixed aqueous solution of at least one kind such as 2 O and an alkali hydroxide is used.
- a typical plating bath composition and electrolysis conditions are as follows.
- Chromium rust prevention treatment K 2 Cr 2 O 7 (Na 2 Cr 2 O 7 or CrO 3 ): 2 to 10 g / liter NaOH or KOH: 10 to 50 g / liter ZnO or ZnSO 4 ⁇ 7H 2 O: 0.05 to 10 g / liter pH: 3-13 Bath temperature: 20-80 ° C Current density D k : 0.05 to 5 A / dm 2 Time: 5-30 seconds Anode: Pt—Ti plate, stainless steel plate, etc. Chromium oxide requires a coating amount of 15 ⁇ g / dm 2 or more, and zinc requires a coating amount of 30 ⁇ g / dm 2 or more.
- the copper foil thus obtained has excellent heat resistance peel strength, oxidation resistance and hydrochloric acid resistance.
- a printed circuit having a pitch of 150 ⁇ m or less can be etched with a CuCl 2 etching solution, and alkali etching can be performed. In addition, penetration into the circuit edge portion during soft etching can be suppressed.
- the soft etching solution an aqueous solution of H 2 SO 4 : 10 wt% and H 2 O 2 : 2 wt% can be used. Processing time and temperature can be adjusted arbitrarily.
- alkaline etching liquids for example, liquids such as NH 4 OH: 6 mol / liter, NH 4 Cl: 5 mol / liter, CuCl 2 : 2 mol / liter (temperature: 50 ° C.) are known.
- the copper foil obtained in all the above steps has a black color as in the case of the Cu—Ni treatment.
- Black is meaningful in terms of alignment accuracy and high heat absorption rate.
- printed circuit boards including rigid boards and flexible boards are mounted with components such as ICs, resistors, and capacitors in an automatic process, and chip mounting is performed while reading circuits with sensors.
- alignment on the copper foil treated surface may be performed through a film such as Kapton.
- Kapton This also applies to positioning when forming a through hole.
- the closer the processing surface is to black the better the light absorption and the higher the positioning accuracy.
- the copper foil and the film are often cured and bonded together while applying heat. At this time, when heating is performed by using long waves such as far infrared rays and infrared rays, the heating efficiency is improved when the color tone of the treated surface is black.
- silane treatment for applying a silane coupling agent to at least the roughened surface on the rust preventive layer is performed mainly for the purpose of improving the adhesive force between the copper foil and the resin substrate.
- the silane coupling agent used for the silane treatment include olefin silane, epoxy silane, acrylic silane, amino silane, and mercapto silane, which can be appropriately selected and used.
- the application method may be any of spraying a silane coupling agent solution by spraying, coating with a coater, dipping, pouring and the like.
- 60-15654 describes that the adhesion between a copper foil and a resin substrate is improved by subjecting the rough surface of the copper foil to a chromate treatment followed by a silane coupling agent treatment. . Refer to this for details. Thereafter, if necessary, an annealing treatment may be performed for the purpose of improving the ductility of the copper foil.
- Example 2 The rolled copper foil was subjected to a roughening treatment by copper-cobalt-nickel alloy plating under the conditions shown below. Copper 17 mg / dm 2, cobalt 2000 [mu] g / dm 2, and after was 500 [mu] g / dm 2 deposited nickel, washed with water, cobalt thereon - to form a nickel alloy plating layer. In this case, the cobalt coating weight 800 ⁇ 1400 ⁇ g / dm 2, and a nickel deposition amount 400 ⁇ 600 ⁇ g / dm 2.
- the bath composition and plating conditions used are as follows. [Bath composition and plating conditions]
- the bath composition and plating conditions used are as follows.
- B Roughening treatment (Cu—Co—Ni alloy plating Cu: 15.5 g / liter Co: 8 g / liter Ni: 8 g / liter pH: 2.5 Temperature: 40 ° C Current density D k : 45 A / dm 2 Time: 2 seconds Copper adhesion amount: 25 mg / dm 2 Cobalt adhesion amount: 2500 ⁇ g / dm 2 Nickel adhesion amount: 500 ⁇ g / dm 2
- the number of particles of 0.1 to 0.5 ⁇ m 2 is 63 in the B treatment of the comparative example and 4 in the A treatment of the example.
- the number of particles exceeding 0.5 ⁇ m 2 was 12 in the B treatment of the comparative example and 0 in the A treatment of the example. From the results of other fields of view, in the case of the A treatment, the roughened particles were at most less than 0.5 ⁇ m 2 .
- the number of particles of 0.1 to 0.5 ⁇ m 2 can be reduced to 300, and the number of particles exceeding 0.5 ⁇ m 2 or more can be reduced to about 30.
- the main trunk that grows from the copper foil surface branches as it extends from the copper foil surface, and spreads in a dendritic shape.
- the surface of the copper foil having the roughened particles has an advantage of providing a high adhesive strength as an anchor effect when adhering to the resin, but conversely, the problem that the dendritic part drops off during the treatment. occured.
- FIG. 2 shows a micrograph of current density and Cu—Co—Ni alloy plating. From FIG. 2, it can be seen that when the current density is 20 A / dm 2 , the growth of the coarse particles is not sufficient. On the other hand, when the current density exceeds 30 A / dm 2 , it can be seen that the growth of particles is enlarged and irregular. It can be seen that the preferred range is current density D k : 20-30 A / dm 2 . Further, FIG. 3 shows a representative micrograph of Cu—Co—Ni alloy plating in which powder falling does not occur according to the present invention and a micrograph of a comparative example in which powder falling occurs. The left side of FIG.
- FIG. 3 shows a typical example of the present invention, and it can be seen that Cu—Co—Ni alloy plating of uniform fine particles is formed.
- the right side of FIG. 3 is a comparative example, in which dendritic particles are developed and expanded into petals. In this case, there is a problem that powder falling increases.
- the dendritic roughened particles are peeled off from the surface of the copper foil, and it is possible to suppress the phenomenon generally called powdering and processing unevenness. Therefore, it is useful as a printed circuit material for electronic equipment in which semiconductor devices are increasingly miniaturized and highly integrated.
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Abstract
Description
最終的に、所要の素子が半田付けされて、エレクトロニクスデバイス用の種々の印刷回路板を形成する。印刷回路板用銅箔は、樹脂基材と接着される面(粗化面)と非接着面(光沢面)とで異なるが、それぞれ多くの方法が提唱されている。
銅箔の粗化処理は、銅箔と基材との接着性を決定するものとして、大きな役割を担っている。この粗化処理としては、当初銅を電着する銅粗化処理が採用されていたが、その後、様々な技術が提唱され、耐熱剥離強度、耐塩酸性及び耐酸化性の改善を目的として銅-ニッケル粗化処理が一つの代表的処理方法として定着するようになっている。
本件出願人は、銅-ニッケル粗化処理を提唱し(特許文献1参照)、成果を納めてきた。銅-ニッケル処理表面は黒色を呈し、特にフレキシブル基板用圧延処理箔では、この銅-ニッケル処理の黒色が商品としてのシンボルとして認められるに至っている。
そこで、ファインパターン用処理として、本件出願人は、先にCu-Co処理(特許文献2及び特許文献3参照)及びCu-Co-Ni処理(特許文献4参照)を開発した。これら粗化処理は、エッチング性、アルカリエッチング性及び耐塩酸性については、良好であったが、アクリル系接着剤を用いたときの耐熱剥離強度が低下することが改めて判明し、また耐酸化性も所期程充分ではなくそして色調も黒色までには至らず、茶乃至こげ茶色であった。
好ましくは、前記コバルトめっき層或いはコバルト-ニッケル合金めっき層を形成した後に、クロム酸化物の単独皮膜処理或いはクロム酸化物と亜鉛及び(又は)亜鉛酸化物との混合皮膜処理を代表とする防錆処理が施される。
このようなことから、特許文献5において確立された銅箔の表面に銅-コバルト-ニッケル合金めっきによる粗化処理後、コバルトめっき層或いはコバルト-ニッケル合金めっき層を形成する印刷回路用銅箔の処理方法において、耐熱剥離性を改善する発明を行った。
銅箔回路は、一段と細線化されているが、基板上で一旦回路を形成した後、銅回路の上表面を硫酸と過酸化水素を含有するエッチング液によりソフトエッチングする工程が行われているが、この工程において、ポリイミド等の樹脂基板と銅箔の接着部のエッジ部にエッチング液が染み込むという問題が生じた。
これは、銅箔の処理面の一部が侵食されているとも言える。このような侵食は、微細な回路においては、銅箔と樹脂との接合力を低下させるので、重要な問題である。これを解決することも要求されている。
しかし、このような最も基本的な、銅-コバルト-ニッケル合金めっきからなる粗化処理において、粗化粒子の形状が樹枝状であるために、この樹枝の上部が銅箔の表面から剥がれ落ち、一般に粉落ち現象と言われる問題が発生した。また、このような粗化処理面にさらにめっき処理を行うと、処理ムラが発生することがあった。これは、回路パターンの微細化に伴い、エッチング残などの問題を発生する原因となった。
1)銅箔の表面に、銅、コバルト及びニッケルからなる3元系合金電気めっき層を形成した印刷回路用銅箔であって、該電気めっき層が銅箔表面から成長した樹枝状の粒子からなり、銅箔面上から見た面積0.1-0.5μm2の粒子が1000個/10000μm2以下、0.5μm2を超える粒子が100個/10000μm2以下、残部が0.1μm2未満である粒子が、銅箔の全面を被覆することを特徴とする印刷回路用銅箔
2)銅箔面上から見た面積0.1-0.5μm2の粒子が300個/10000μm2以下であることを特徴とする上記1)記載の印刷回路用銅箔
3)樹枝状の粒子について銅箔面上から見た面積0.1-0.5μm2の粒子が100個/10000μm2以下、0.5μm2を超える粒子が30個/10000μm2以下であることを特徴とする上記1)又は2)記載の印刷回路用銅箔
4)前記印刷回路用銅箔において、銅箔の表面に付着量が15~40mg/dm2銅-100~3000μg/dm2コバルト-100~1000μg/dm2ニッケルの、銅-コバルト-ニッケル合金めっきによる粗化処理層を備えていることを特徴とする上記1)~3)のいずれか一項に記載の印刷回路用銅箔
5)上記1)~4)のいずれか一項に記載の印刷回路銅箔を樹脂基板と接着させた銅張積層板、を提供する。
前記コバルト-ニッケル合金めっき層は、コバルトの付着量を200~3000μg/dm2とし、かつコバルトの比率が60~66質量%とすることができる。前記亜鉛-ニッケル合金めっき層においては、その総量を150~500μg/dm2の範囲とし、ニッケル量が50μg/dm2以上の範囲、かつニッケル比率が0.16~0.40の範囲にある亜鉛-ニッケル合金めっき層を形成することができる。
この防錆処理については、例えばクロム酸化物の単独皮膜処理若しくはクロム酸化物と亜鉛及び(又は)亜鉛酸化物との混合皮膜処理層を形成することができる。さらに、前記混合皮膜処理層上には、シランカップリング層を形成することができる。
上記の印刷回路銅箔は、接着剤を介さずに熱圧着により、樹脂基板と接着させた銅張積層板を製造することが可能である。
本発明においては、この粗化処理を、銅-コバルト-ニッケル合金めっきにより行なう。粗化前の前処理として銅の正常めっき等が、そして粗化後の仕上げ処理として電着物の脱落を防止するために銅の正常めっき等が行なわれることもある。本願発明は、これらを全て包含する。
圧延銅箔と電解銅箔とでは処理の内容を幾分異にすることもある。本発明においては、こうした前処理及び仕上げ処理をも含め、銅箔粗化と関連する公知の処理を必要に応じて含め、総称して粗化処理と云うものとする。
Co付着量が100μg/dm2未満では、耐熱性が悪くなり、またエッチング性も悪くなる。Co付着量が3000μg/dm2を超えると、磁性の影響を考慮せねばならない場合には好ましくなく、エッチングシミが生じ、また、耐酸性及び耐薬品性の悪化が考慮され得る。
以上から、銅-コバルト-ニッケル合金めっきの付着量は、15~40mg/dm2銅-100~3000μg/dm2コバルト-100~500μg/dm2ニッケルであることが望ましいと言える。この3元系合金層の各付着量はあくまで、望ましい条件であり、この量を超える範囲を否定するものではない。
ここで、エッチングシミとは、塩化銅でエッチングした場合、Coが溶解せずに残ってしまうことを意味し、そしてエッチング残とは塩化アンモニウムでアルカリエッチングした場合、Niが溶解せずに残ってしまうことを意味するものである。
一般に、回路を形成する場合には、下記の実施例の中で説明するようなアルカリ性エッチング液及び塩化銅系エッチング液を用いて行われる。このエッチング液及びエッチング条件は、汎用性のあるものであるが、この条件に限定されることはなく、任意に選択できることは理解されるべきことである。
(銅-コバルト-ニッケル合金めっき)
Cu:10~20g/リットル
Co:1~10g/リットル
Ni:1~10g/リットル
pH:1~4
温度:30~40°C
電流密度Dk :20~30A/dm2
時間:1~5秒
この粉落ちは、その後のめっき処理において、めっきむら、さらにはめっき不全を生ずるという問題を生ずることになる。したがって、銅箔表面から成長した樹枝状の粒子の形状は重要となる。
従来は、このような観点で、粗化粒子を検討したことはなく、単に、樹枝状粒子の発達を促進させていただけであり、問題を内包していたのである。本願発明によって、この問題を解決することが可能となり、さらにファインパターン印刷回路形成により有効である。
前記の通り、樹枝状粒子が大きく発達させることは、粉落ちの量が増加するので得策ではない。この意味から、樹枝状の粒子の銅箔面からの高さを0.1μmから1.0μm、さらには高さが0.2μmから0.6μmとすることが望ましい。また、樹枝上の粒子について、銅箔表面から成長した樹枝の主幹直径以上の長さの側枝があるものが100個/10000μm2以下、さらには30個/10000μm2以下とすることが望ましい。
以上によって、異常成長した粒子が少なくなり、粒子径が小さく揃い、かつ全面を覆うことになるので、エッチング性が良好となり、エッチング残、ムラがなく、切れが良い回路形成が可能となる。また、樹脂の塗布において、バブルの発生がなく、均一塗布が可能となる効果がある。
このコバルト-ニッケル合金めっき層は、銅箔と基板の接着強度を実質的に低下させない程度に行なう必要がある。コバルト付着量が200μg/dm2未満では、耐熱剥離強度が低下し、耐酸化性及び耐薬品性が悪くなり、また処理表面が赤っぽくなってしまうので好ましくない。また、コバルト付着量が3000μg/dm2を超えると、磁性の影響を考慮せねばならない場合には好ましくなく、エッチングシミが生じ、また、耐酸性及び耐薬品性の悪化が考慮される。好ましいコバルト付着量は500~3000μg/dm2である。
後述するように、ソフトエッチングの染み込み発生の直接の大きな原因は、亜鉛-ニッケル合金めっき層からなる耐熱防錆層であるが、コバルトもソフトエッチングの際の染み発生の原因になることもあるので、上記に調整することが、より望ましいとする条件である。
一方、ニッケル付着量が少ない場合には、耐熱剥離強度が低下し、耐酸化性及び耐薬品性が低下する。また、ニッケル付着量が多すぎる場合には、アルカリエッチング性が悪くなるので、上記コバルト含有量とのバランスで決めることが望ましい。
(コバルト-ニッケル合金めっき)
Co:1~20g/リットル
Ni:1~20g/リットル
pH:1.5~3.5
温度:30~80°C
電流密度Dk :1.0~20.0A/dm2
時間:0.5~4秒
印刷回路の製造工程で行われる処理が一段と高温となり、また製品となった後の機器使用中の熱発生がある。例えば、樹脂に銅箔を熱圧着で接合する、いわゆる二層材では、接合の際に300°C以上の熱を受ける。このような状況の中でも、銅箔と樹脂基材との間での接合力の低下を防止することが必要であり、この亜鉛-ニッケル合金めっきは有効である。
上記の通り、前記亜鉛-ニッケル合金めっき層の総量を150~500μg/dm2とすると共に、当該合金層中のニッケル比率の下限値を0.16に、上限値を0.40とし、かつニッケルの含有量を50μg/dm2以上とすることが、耐熱防錆層という役割を備えると共に、ソフトエッチングの際に使用するエッチング剤の染み込みを抑制し、腐食に回路の接合強度の弱体化を防止することができるという効果を有する。
また、合金層中のニッケル比率の下限値が0.16未満では、ソフトエッチングの際の染み込み量が9μmを超えるので、好ましくない。ニッケル比率の上限値0.40については、亜鉛-ニッケル合金めっき層を形成できる技術上の限界値である。
(亜鉛-ニッケル合金めっき)
Zn:0~30g/リットル
Ni:0~25g/リットル
pH:3~4
温度:40~50°C
電流密度Dk :0.5~5A/dm2
時間:1~3秒
コバルトの合計付着量が300μg/dm2未満では、耐熱性及び耐薬品性が低下し、コバルトの合計付着量が5000μg/dm2 を超えると、エッチングシミが生じることがある。また、ニッケルの合計付着量が260μg/dm2未満では、耐熱性及び耐薬品性が低下する。ニッケルの合計付着量が1200μg/dm2を超えると、エッチング残が生じる。
好ましくは、コバルトの合計付着量は2500~5000μg/dm2であり、そしてニッケルの合計付着量は580~1200μg/dm2、特に好ましくは600~1000μg/dm2である。上記の条件を満たせば、特にこの段落に記載する条件に制限される必要はない。
めっき浴としては、代表的には、K2Cr2O7、Na2Cr2O7等の重クロム酸塩やCrO3等の少なくとも一種と、水溶性亜鉛塩、例えばZnO 、ZnSO4・7H2Oなど少なくとも一種と、水酸化アルカリとの混合水溶液が用いられる。代表的なめっき浴組成と電解条件例は次の通りである。
K2Cr2O7(Na2Cr2O7或いはCrO3):2~10g/リットル
NaOH或いはKOH :10~50g/リットル
ZnO 或いはZnSO4・7H2O:0.05~10g/リットル
pH:3~13
浴温:20~80°C
電流密度Dk :0.05~5A/dm2
時間:5~30秒
アノード:Pt-Ti 板、ステンレス鋼板等
クロム酸化物はクロム量として15μg/dm2以上、亜鉛は30μg/dm2以上の被覆量が要求される。
ソフトエッチング液には、H2SO4:10wt%、H2O2:2wt%の水溶液が使用できる。処理時間と温度は任意に調節できる。
アルカリエッチング液としては、例えば、NH4OH:6モル/リットル、NH4Cl:5モル/リットル、CuCl2:2モル/リットル(温度50°C)等の液が知られている。
処理面が黒に近い程、光の吸収が良いため、位置決めの精度が高くなる。更には、基板を作製する際、銅箔とフィルムとを熱を加えながらキュワリングして接着させることが多い。このとき、遠赤外線、赤外線等の長波を用いることにより加熱する場合、処理面の色調が黒い方が、加熱効率が良くなる。
このシラン処理に使用するシランカップリング剤としては、オレフィン系シラン、エポキシ系シラン、アクリル系シラン、アミノ系シラン、メルカプト系シランを挙げることができるが、これらを適宜選択して使用することができる。
塗布方法は、シランカップリング剤溶液のスプレーによる吹付け、コーターでの塗布、浸漬、流しかけ等いずれでもよい。例えば、特公昭60-15654号は、銅箔の粗面側にクロメート処理を施した後シランカップリング剤処理を行なうことによって銅箔と樹脂基板との接着力を改善することを記載している。詳細はこれを参照されたい。この後、必要なら、銅箔の延性を改善する目的で焼鈍処理を施すこともある。
圧延銅箔に下記に示す条件範囲で銅-コバルト-ニッケル合金めっきによる粗化処理を施した。銅を17mg/dm2、コバルトを2000μg/dm2、そしてニッケルを500μg/dm2 付着した後に、水洗し、その上にコバルト-ニッケル合金めっき層を形成した。この場合、コバルト付着量800~1400μg/dm2、そしてニッケル付着量400~600μg/dm2とした。
使用した浴組成及びめっき条件は、次の通りである。
[浴組成及びめっき条件]
Cu:15.5g/リットル
Co:6g/リットル
Ni:11g/リットル
pH:2.5
温度:30°C
電流密度Dk :20A/dm2
時間:2秒
銅付着量:17mg/dm2
コバルト付着量:2000μg/dm2
ニッケル付着量:500μg/dm2
比較例において、使用した浴組成及びめっき条件は、次の通りである。
[浴組成及びめっき条件]
(B)粗化処理(Cu-Co-Ni合金めっき
Cu:15.5g/リットル
Co:8g/リットル
Ni:8g/リットル
pH:2.5
温度:40°C
電流密度Dk :45A/dm2
時間:2秒
銅付着量:25mg/dm2
コバルト付着量:2500μg/dm2
ニッケル付着量:500μg/dm2
また、0.5μm2を超える粒子は、比較例のB処理では12個、実施例のA処理では0個であった。他の視野の結果から見ても、A処理の場合、粗化粒子が高々0.5μm2未満であった。
これらの結果をまとめ、100μm角(10000μm2)に換算したとき、比較例のB処理では0.1~0.5μm2の粒子が6000個、0.5μm2を超える粒子は1000個程度となるのに対して、実施例のA処理では、多い場合でも0.1~0.5μm2の粒子は1000個、0.5μm2を超える粒子は100個程度であり、特に0.5μm2を超える大きな粒子の頻度が小さいことがわかる。
さらに、粗化粒子の形態を観察すると、比較例のB処理では、銅箔表面から成長する主幹が銅箔面から伸びるに従って枝分かれし、樹枝状に広がる。
この場合、粗化粒子を持つ銅箔表面が樹脂と接着する際にアンカー効果となって高い接着強度を与える利点があるが、逆に樹枝状に広がった部分が処理中に脱落するという問題を生じた。
また、本願発明の粉落ちが生じないCu-Co-Ni合金めっきの代表的な顕微鏡写真と粉落ちが生じた比較例の顕微鏡写真を図3に示す。
図3の左が、本願発明の代表的な例を示すもので、均一微細な粒子のCu-Co-Ni合金めっきが形成されているのが分かる。
これに対して、図3の右が、比較例であるが、樹枝状の粒子が発達し、花びら状に展開されている。この場合は、粉落ちが多くなるという問題を有するものである。
Claims (5)
- 銅箔の表面に、銅、コバルト及びニッケルからなる3元系合金電気めっき層を形成した印刷回路用銅箔であって、該電気めっき層が銅箔表面から成長した樹枝状の粒子からなり、銅箔面上から見た面積0.1-0.5μm2の粒子が1000個/10000μm2以下、0.5μm2を超える粒子が100個/10000μm2以下、残部が0.1μm2未満である粒子が、銅箔の全面を被覆することを特徴とする印刷回路用銅箔。
- 銅箔面上から見た面積0.1-0.5μm2の粒子が300個/10000μm2以下であることを特徴とする請求項1記載の印刷回路用銅箔。
- 樹枝状の粒子について銅箔面上から見た面積0.1-0.5μm2の粒子が100個/10000μm2以下、0.5μm2を超える粒子が30個/10000μm2以下であることを特徴とする請求項1又は2記載の印刷回路用銅箔。
- 前記印刷回路用銅箔において、銅箔の表面に付着量が15~40mg/dm2銅-100~3000μg/dm2コバルト-100~1000μg/dm2ニッケルの、銅-コバルト-ニッケル合金めっきによる粗化処理層を備えていることを特徴とする請求項1~3のいずれか一項に記載の印刷回路用銅箔。
- 請求項1~4のいずれか一項に記載の印刷回路銅箔を樹脂基板と接着させた銅張積層板。
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CN200980147329.8A CN102224281B (zh) | 2008-11-25 | 2009-11-13 | 印刷电路用铜箔 |
US13/129,848 US8524378B2 (en) | 2008-11-25 | 2009-11-13 | Copper foil for printed circuit |
EP09828984A EP2351876A1 (en) | 2008-11-25 | 2009-11-13 | Copper foil for printed circuit |
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CN101909877B (zh) | 2007-12-27 | 2013-03-06 | Jx日矿日石金属株式会社 | 双层覆铜层压板的制造方法及双层覆铜层压板 |
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- 2009-11-13 WO PCT/JP2009/069345 patent/WO2010061736A1/ja active Application Filing
- 2009-11-13 CN CN200980147329.8A patent/CN102224281B/zh active Active
- 2009-11-13 MY MYPI20112327 patent/MY150825A/en unknown
- 2009-11-13 JP JP2010540445A patent/JP5318886B2/ja active Active
- 2009-11-13 US US13/129,848 patent/US8524378B2/en active Active
- 2009-11-13 KR KR1020117011565A patent/KR101288641B1/ko active IP Right Grant
- 2009-11-24 TW TW098139854A patent/TWI498057B/zh active
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JP2013174017A (ja) * | 2008-11-25 | 2013-09-05 | Jx Nippon Mining & Metals Corp | 印刷回路用銅箔 |
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JP2014241447A (ja) * | 2010-09-27 | 2014-12-25 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔、プリント配線板、プリント配線板の製造方法、プリント配線板用樹脂基板 |
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JP2014508399A (ja) * | 2011-01-06 | 2014-04-03 | ソンギュングヮン ユニバーシティ ファウンデーション フォー コーポレート コラボレーション | スーパーキャパシタ用ナノ多孔性電極及びこれの製造方法 |
US20140057123A1 (en) * | 2011-03-30 | 2014-02-27 | Jx Nippon Mining & Metals Corporation | Copper foil for printed circuit |
WO2013108415A1 (ja) * | 2012-01-18 | 2013-07-25 | Jx日鉱日石金属株式会社 | 銅張積層板用表面処理銅箔及びそれを用いた銅張積層板 |
JPWO2013108415A1 (ja) * | 2012-01-18 | 2015-05-11 | Jx日鉱日石金属株式会社 | 表面処理銅箔及びそれを用いた銅張積層板 |
WO2013108414A1 (ja) * | 2012-01-18 | 2013-07-25 | Jx日鉱日石金属株式会社 | 銅張積層板用表面処理銅箔及びそれを用いた銅張積層板 |
JP2013213250A (ja) * | 2012-03-30 | 2013-10-17 | Jx Nippon Mining & Metals Corp | 金属箔 |
WO2013146088A1 (ja) * | 2012-03-30 | 2013-10-03 | Jx日鉱日石金属株式会社 | 金属箔 |
JP2017053034A (ja) * | 2012-09-28 | 2017-03-16 | Jx金属株式会社 | キャリア付銅箔及びキャリア付き銅箔を用いた銅張積層板 |
JP2015024515A (ja) * | 2013-07-24 | 2015-02-05 | Jx日鉱日石金属株式会社 | キャリア付銅箔及びそれを用いた銅張積層板 |
JP2015127136A (ja) * | 2013-11-27 | 2015-07-09 | Jx日鉱日石金属株式会社 | キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法 |
WO2023281776A1 (ja) * | 2021-07-09 | 2023-01-12 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
WO2023281775A1 (ja) * | 2021-07-09 | 2023-01-12 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
WO2023281774A1 (ja) * | 2021-07-09 | 2023-01-12 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
WO2023281777A1 (ja) * | 2021-07-09 | 2023-01-12 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
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Also Published As
Publication number | Publication date |
---|---|
JP5318886B2 (ja) | 2013-10-16 |
JPWO2010061736A1 (ja) | 2012-04-26 |
KR20110084518A (ko) | 2011-07-25 |
TW201021639A (en) | 2010-06-01 |
KR101288641B1 (ko) | 2013-07-22 |
TWI498057B (zh) | 2015-08-21 |
MY150825A (en) | 2014-02-28 |
CN102224281A (zh) | 2011-10-19 |
CN102224281B (zh) | 2014-03-26 |
US8524378B2 (en) | 2013-09-03 |
US20110262764A1 (en) | 2011-10-27 |
JP2013174017A (ja) | 2013-09-05 |
JP5932705B2 (ja) | 2016-06-08 |
EP2351876A1 (en) | 2011-08-03 |
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