WO2010061418A1 - Écran d'affichage plasma - Google Patents

Écran d'affichage plasma Download PDF

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Publication number
WO2010061418A1
WO2010061418A1 PCT/JP2008/003455 JP2008003455W WO2010061418A1 WO 2010061418 A1 WO2010061418 A1 WO 2010061418A1 JP 2008003455 W JP2008003455 W JP 2008003455W WO 2010061418 A1 WO2010061418 A1 WO 2010061418A1
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WO
WIPO (PCT)
Prior art keywords
sealing material
plasma display
display panel
frit glass
substrate
Prior art date
Application number
PCT/JP2008/003455
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English (en)
Japanese (ja)
Inventor
高浦真琴
田中伸芳
黒木正軌
Original Assignee
日立プラズマディスプレイ株式会社
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Application filed by 日立プラズマディスプレイ株式会社 filed Critical 日立プラズマディスプレイ株式会社
Priority to PCT/JP2008/003455 priority Critical patent/WO2010061418A1/fr
Publication of WO2010061418A1 publication Critical patent/WO2010061418A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
    • H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/48—Sealing, e.g. seals specially adapted for leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/54—Means for exhausting the gas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/26—Sealing together parts of vessels
    • H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/38—Exhausting, degassing, filling, or cleaning vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/40—Closing vessels

Definitions

  • the present invention relates to a display device, and more particularly to a plasma display panel that can reduce the thickness of the plasma display device by eliminating an exhaust pipe.
  • the plasma display device includes a plasma display panel, a front panel disposed on the front surface of the plasma display panel, a drive circuit disposed on the back surface of the plasma display panel, and a frame for housing them.
  • a discharge gas such as Ne or Xe is sealed in a front substrate, a rear substrate, and a seal material formed around the front substrate and the rear substrate. That is, when the plasma display panel is operated, the discharge gas is discharged, and the phosphor is lit for each pixel by ultraviolet rays generated by the discharge, thereby forming an image.
  • the inside of the panel is evacuated and then the discharge gas is introduced. Whether the inside of the panel is evacuated or the discharge gas is introduced, it is performed through an exhaust pipe connected to the exhaust hole of the rear substrate. After introducing the discharge gas, the exhaust pipe is chipped off. However, the exhaust pipe is present on the back surface of the plasma display panel in a chip-off state, which has been an obstacle to making the plasma display device thinner.
  • Patent Document 1 describes a configuration in which the exhaust pipe is omitted and the inside is sealed with a sealing plate formed of frit glass instead to reduce the thickness of the plasma display panel.
  • FIG. 10 is a view showing the appearance of a conventional plasma display panel
  • FIG. 10 (a) is a plan view
  • FIG. 10 (b) is a side view.
  • the front substrate 1 and the rear substrate 2 are overlapped with each other with a sealing material 40 interposed therebetween.
  • a discharge gas such as Ne or Xe is enclosed in the interior surrounded by the front substrate 1, the back substrate 2, and the sealing material 40.
  • Exhaust holes 60 and exhaust pipes 61 are provided in the back substrate 2 for exhausting and evacuating before introducing the discharge gas into the plasma display panel, and for introducing the discharge gas.
  • the exhaust pipe 61 is chipped off after the discharge gas is introduced.
  • the exhaust pipe 61 needs to have a predetermined length.
  • the length h of the exhaust pipe 61 after chip-off is about 25 mm.
  • the thicknesses of the back substrate 2 and the front substrate 1 are 1.8 mm or 2, 8 mm.
  • the thickness of the back substrate 2 and the front substrate 1 is 2.8 mm, the total length is 5.8 mm. Therefore, the length h of the exhaust pipe 61 after chip-off is very large, and the plasma display device is thinned. It was an obstacle to do. Further, since the exhaust pipe 61 is a glass tube, mechanical strength is also a problem, and a mechanism for protecting the exhaust pipe 61 is required in the plasma display device.
  • the thickness of the plasma display device can be reduced by using a sealing plate formed of frit glass instead of the exhaust pipe.
  • a complicated apparatus is required to seal the structure.
  • the sealing plate is formed outside the back substrate, it is necessary to mechanically protect the sealing plate.
  • An object of the present invention is to realize a plasma display panel having no exhaust pipe at the time of completion. Another object is to realize such a configuration without using a complicated manufacturing apparatus. Further, a mechanism enabling such a configuration is to provide a mechanically reliable configuration without disposing an exhaust hole, for example, outside the back substrate. According to the present invention, the exhaust holes can be formed not only on the rear substrate but also on the front substrate. Therefore, the reason for the process can be increased.
  • the present invention solves the above-described problems, and specific means are as follows.
  • a plasma display panel in which a pair of substrates arranged opposite to each other are pasted through a sealing material formed of frit glass, and discharge gas is sealed through an exhaust hole formed in one substrate of the pair of substrates.
  • a sealing material formed of frit glass is provided around the exhaust hole between the pair of substrates, and after the discharge gas is introduced into the panel, the sealing material is fused and exhausted in the previous period.
  • the fusing temperature of the frit glass forming the sealing material is lower than the fusing temperature of the frit glass forming the sealing material, and the activation temperature of the getter is the frit glass forming the sealing material.
  • a manufacturing method comprising: applying a frit glass for forming a sealing material on one substrate of the substrate pair; and forming a sealing material around the exhaust holes on the opposing surfaces of the substrate pair. Coating the substrate pair so as to face each other, heating the combined structure of the substrate pair to melt the sealing material at a first temperature, and forming the sealing material After the frit glass to be melted, the inside of the combined structure of the substrate pair is exhausted through an exhaust pipe connected to the exhaust hole, and then a discharge gas is introduced through the exhaust pipe. And further heating the combined structure of the substrate pair after sealing the discharge gas to a second temperature to melt the frit glass forming the sealing material to seal the combined structure of the substrate pair A method for manufacturing a plasma display panel, comprising a step of removing the sealing tube later.
  • the thickness of the plasma display panel can be reduced, and as a result, the plasma using the plasma display panel can be reduced.
  • the thickness of the display device can be reduced.
  • the present invention it is possible to manufacture a plasma display panel having no exhaust pipe in a finished product by substantially the same process as before without using complicated manufacturing equipment. Furthermore, according to the present invention, since the sealing mechanism that replaces the exhaust pipe is not formed outside the rear substrate, a mechanism for mechanically protecting the sealing portion is not necessary, and the manufacturing cost of the plasma display device can be reduced. I can do it.
  • FIG. 9 is an exploded perspective view of the display area of the plasma display panel.
  • the plasma display panel is composed of two glass substrates, a front substrate 1 and a rear substrate 2 that are arranged to face each other via a discharge space.
  • a scanning electrode 20 hereinafter also referred to as a Y electrode 20
  • a discharge sustaining electrode 10 hereinafter also referred to as an X electrode 10.
  • the scan electrode 20 includes a scan discharge electrode 21 formed of ITO (Indium Tin Oxide) serving as a discharge portion, and a bus electrode formed of a metal that supplies a voltage from the terminal portion.
  • ITO Indium Tin Oxide
  • the bus electrode of the scan electrode is referred to as a scan bus electrode or Y bus electrode 22
  • the discharge electrode is referred to as a scan discharge electrode or Y discharge electrode 21.
  • the Y electrode 20 includes the Y bus electrode 22 and the Y discharge electrode 21.
  • the sustain electrode 10 includes a discharge electrode 11 formed of ITO (Indium Tin Oxide) serving as a discharge portion, and a bus electrode 12 that supplies a voltage from the terminal portion.
  • ITO Indium Tin Oxide
  • the bus electrode of the sustain electrode is referred to as a sustain bus electrode or X bus electrode 12
  • the discharge electrode is referred to as a sustain discharge electrode or X discharge electrode 11.
  • the X electrode 10 includes the X bus electrode 12 and the X discharge electrode 11.
  • the X bus electrode 12 and the Y bus electrode 22 both have a metal laminated structure, and have a laminated structure of chromium, copper, and chromium from the front substrate 1 side.
  • Chromium formed on the ITO of the front substrate 1 has excellent adhesion to ITO and has a black surface, so that it has an effect of improving contrast. Copper is used to reduce the resistance of the bus electrode.
  • the chromium is further coated on the copper, but this chromium prevents the resistance of the copper surface from being changed due to oxidation.
  • the chromium of the front substrate may further have a laminated structure of chromium oxide and chromium. Since the chromium oxide is black and has a smaller reflectance than the chromium, the contrast of the image can be further improved. Chromium oxide also has excellent adhesion with ITO.
  • the discharge electrode uses ITO, which is a transparent conductive film
  • the bus electrode uses a metal laminated film with low resistance. This is because when the transparent conductive film is used, more light emitted from the phosphor 8 can be extracted outside.
  • the discharge electrode may be formed of the same metal as the bus electrode. In this case, the process is completed once and the manufacturing cost is greatly reduced.
  • the dielectric layer 5 is formed so as to cover the X electrode 10 and the Y electrode 20.
  • a low-melting glass having a softening point of about 500 ° C. is used for the dielectric layer 5.
  • a protective film 6 is formed thereon.
  • the protective film 6 is mainly made of magnesium oxide (MgO) and is formed by sputtering or vapor deposition.
  • a black belt may be formed. Since the black belt improves the contrast, it needs to be black.
  • a metal laminated film having the same structure as that of the X electrode 10 or the Y electrode 20 is used. Therefore, the black belt and the X electrode 10 or the Y electrode 20 can be formed simultaneously.
  • the metal in contact with the ITO on the front substrate 1 made of glass is black because it is Cr or CrO, and the contrast can be improved.
  • An address electrode 30 (hereinafter also referred to as an A electrode) is formed on the rear substrate 2 so as to be orthogonal to the X electrode 10 and the Y electrode 20.
  • the structure of the address electrode 30 is the same as that of the X bus electrode 12 or the Y bus electrode 22, and is a laminated structure of chromium, copper, and chromium.
  • the dielectric layer 5 covers the address electrode 30.
  • the same material as that of the dielectric layer 5 formed on the front substrate 1 is used for the dielectric layer 5 formed on the rear substrate 2.
  • the partition wall 7 is formed to extend in the same direction as the address electrode 30 so as to sandwich the address electrode 30.
  • horizontal barrier ribs 71 are formed in a direction perpendicular to the address electrodes 30, and subpixels (subpixels are also referred to as cells) are formed in a region surrounded by the barrier ribs 7 and the horizontal barrier ribs 71.
  • subpixels are also referred to as cells
  • three color phosphors 8 are applied in different colors.
  • the phosphors 8 are red, green, and blue phosphors 8 having the same color in the respective cells arranged in the column direction in the direction in which the partition walls 7 in FIG. 9 extend, and 1 in the extension direction of the display electrodes. The colors are applied in parallel.
  • a space corresponding to the cell surrounded by the front substrate 1, the rear substrate 2, the partition walls 7, and the horizontal partition walls 71 is a discharge space for enclosing a discharge gas.
  • three subpixels form one pixel (pixel) corresponding to each of the three primary colors (R, B, G).
  • the light emission principle of the plasma display panel is as follows. First, a voltage (discharge start voltage) of about 200 V is applied between the address electrode 30 corresponding to the cell desired to emit light during the address period and the scan electrode 20 corresponding to the cell. Since the address electrode 30 and the scan electrode 20 are orthogonal to each other, a single cell at the intersection can be selected. An address discharge is generated in the selected cell, and charges (wall charges) are accumulated in the dielectric layer 5 corresponding to the cell on the front substrate 1 side by this discharge.
  • a voltage (discharge start voltage) of about 200 V is applied between the address electrode 30 corresponding to the cell desired to emit light during the address period and the scan electrode 20 corresponding to the cell. Since the address electrode 30 and the scan electrode 20 are orthogonal to each other, a single cell at the intersection can be selected. An address discharge is generated in the selected cell, and charges (wall charges) are accumulated in the dielectric layer 5 corresponding to the cell on the front substrate 1 side by this discharge.
  • the sustain discharge is performed only in the cells in which wall charges are accumulated according to the previous address. Will occur.
  • Ultraviolet rays are generated by the sustain discharge, and the phosphor 8 emits light by the ultraviolet rays. Visible light emitted from the phosphor 8 is emitted from the front substrate 1 and is visually recognized by a human. Since the phosphor 8 emits light only in the cells in which charges are accumulated in the address period, an image is formed.
  • FIG. 1 is an external view of a plasma display panel according to the present invention.
  • a front substrate 1 and a back substrate 2 are superposed via a sealant 40 formed in the periphery. Inside the sealing material 40, a discharge gas such as Ne or Xe is sealed.
  • the horizontal diameter of the front substrate 1 is larger than the horizontal diameter of the rear substrate 2, and the vertical diameter of the rear substrate 2 is larger than the vertical diameter of the front substrate 1.
  • An X electrode terminal 15 is formed at the right end of the front substrate 1, and a Y electrode terminal 25 is formed at the left end.
  • Address electrode terminals 35 are formed on the upper and lower ends of the back substrate 2.
  • a display area 100 Most of the area surrounded by the sealing material 40 is a display area 100.
  • an exhaust hole 60 and a sealing material 50 are formed between the sealing material 40 and the display region 100.
  • the exhaust hole 60 is formed in the back substrate 2, and the sealing material 50 is fused to the front substrate 1 and the back substrate 2.
  • Both the sealing material 40 and the sealing material 50 are formed of frit glass. However, as will be described later, the frit glass used in the sealing material 50 is melted more than the frit glass used in the sealing material 40. Wear temperature is high.
  • An exhaust hole 60 is formed in the back substrate 2, but the inside and outside air around the exhaust hole of the plasma display panel are blocked by a sealing material 50 existing between the front substrate 1 and the back substrate 2. . That is, the sealing structure of the plasma display panel does not exist outside the back substrate 2 or the front substrate 1.
  • FIG. 1 (b) is a side view of FIG. 1 (a).
  • the exhaust pipe 61 (described in FIG. 2 and subsequent figures) does not exist outside the back substrate 2. Therefore, the plasma display panel can be made thinner because the exhaust pipe 61 is not present.
  • a mechanism that replaces the exhaust pipe 61 does not exist outside the rear substrate 2 or the front substrate 1. Therefore, since the plasma display panel according to the present invention does not require a protective structure for the mechanism for exhaust or discharge gas sealing, the thickness of the entire plasma display device can be reduced and the manufacturing cost of the plasma display device can be reduced. .
  • FIG. 2 to 6 are views showing a manufacturing process of the plasma display panel for realizing the configuration of FIG.
  • FIG. 2A is an enlarged view of the upper right portion of FIG.
  • a sealing material 40 formed of frit glass is disposed around the front substrate 1 and the back substrate 2, and a sealing material 50 formed of frit glass is formed around the exhaust hole 60.
  • the state is shown.
  • the frit glass forming the sealing material 40 is often formed on the back substrate 2, but can also be formed on the front substrate 1. It is reasonable to apply the frit glass forming the sealing material 50 to the back substrate 2.
  • the exhaust hole 60 can also be formed in the front substrate 1.
  • the opening 51 is formed in the sealing material 50 around the exhaust hole 60 without surrounding the entire periphery of the exhaust hole 60. From the opening 51, the inside of the plasma display panel can be exhausted or a discharge gas can be introduced.
  • the sealing material 40, the sealing material 50, and the like are applied by a dispenser.
  • the melting temperature of the frit glass forming the sealing material 50 is higher than the melting temperature of the frit glass forming the sealing material 40.
  • the frit glass forming the sealing material 40 is vanadium-based frit glass and has a melting point of 410 ° C.
  • the frit glass forming the sealing material 40 is applied to a thickness of about 400 ⁇ m.
  • the frit glass forming the sealing material 50 is a bismuth-based frit glass and has a melting point of 450 ° C.
  • the frit glass forming the sealing material 50 is applied to a thickness of about 200 ⁇ m.
  • FIG. 2 (b) is a cross-sectional view taken along the line AA in FIG. 2 (a).
  • a sealing material 40 is formed near the end portions of the front substrate 1 and the back substrate 2.
  • a sealing material 50 is formed around the exhaust hole 60 formed in the back substrate 2.
  • An exhaust pipe 61 is installed outside the back substrate 2 at a portion corresponding to the exhaust hole 60.
  • the exhaust pipe 61 is bonded to the back substrate 2 by an exhaust pipe frit glass 62. Note that the exhaust pipe can be fixed to the substrate with a clip or the like without being bonded. In this case, it is possible to simplify the exhaust pipe removal work of the sealing word around the exhaust hole by the sealing material.
  • the frit glass for the sealing material 50 and the sealing material 40 is not yet melted, so the width is small.
  • the frit glass for the sealing material 50 and the sealing material 40 is heated and melted later, the frit glass is pushed by the front substrate 1 and the back substrate 2 to increase the width.
  • the inside of the plasma display panel is exhausted through the exhaust pipe 61, or a discharge gas is introduced into the interior.
  • the exhaust hole 60 seems to be surrounded by the sealing material 50, but actually has an opening 51 as shown in FIG. 2 (a) before melting, Exhaust gas and discharge gas can be introduced from the opening 51.
  • FIG. 6 shows a temperature profile for heating the plasma display panel in the state as shown in FIG. 2 to melt the frit glass forming the sealing material 40 or the sealing material 50, and exhausting or discharging the plasma display panel. It is a profile of the internal gas pressure when introducing gas.
  • the plasma display panel in the state of FIG. 2 is heated in a furnace to raise the temperature to 410.degree. Until the temperature reaches 410 ° C., the inside of the plasma display panel is the same as the outside air, and the pressure is 100 kPa.
  • FIG. 3 shows this state.
  • 3A is a plan view
  • FIG. 3B is a cross-sectional view taken along the line AA in FIG. 3A.
  • FIG. 3A is the same as FIG. 2A except for the shape of the sealing material 40.
  • FIG. The frit glass forming the sealing material 40 in FIG. 3A melts when the plasma display panel reaches 410 ° C.
  • FIG. 6 the inside of the plasma display panel is exhausted at the same time as the sealing material 40 is melted.
  • the space between the front substrate 1 and the rear substrate 2 constituting the panel becomes negative pressure.
  • the front substrate 1 and the rear substrate 2 are pushed by the pressure of the outside air, and the sealing material 40 is crushed and widened. .
  • FIG. 3A shows this state.
  • the frit glass forming the sealing material 50 is not yet melted, so that the original shape is maintained.
  • FIG. 3 (b) is a cross-sectional view taken along the line AA in FIG. 3 (a).
  • FIG. 3B is the same as FIG. 2B except that the sealing material 40 is melted and widened.
  • the distance between the front substrate 1 and the rear substrate 2 in FIG. 2B is about 400 ⁇ m
  • the distance between the front substrate 1 and the rear substrate 2 in FIG. 3B is about 200 ⁇ m.
  • the inside of the sealing material 40 is exhausted as indicated by an arrow through the exhaust pipe 61.
  • the inside of the sealing material 40 is exhausted to about several Pa.
  • a discharge gas is introduced.
  • the discharge gas is a mixed gas of Ne and Xe.
  • the discharge gas is introduced until the inside of the sealing material 40 reaches about 50 kPa. Since 50 kPa is half of the atmospheric pressure of 100 kPa, the inside of the inside is negative even after the discharge gas is sealed, and the front substrate 1 and the back substrate 2 are pushed by the atmosphere.
  • the temperature of the plasma display panel is raised to 450.degree.
  • the frit glass of the sealing material 50 formed around the exhaust hole 60 of the back substrate 2 is melted.
  • the front substrate 1 and the rear substrate 2 are pushed by the atmosphere, so that the sealing material 50 is crushed and the width is widened.
  • FIG. 4 shows this state.
  • FIG. 4 (a) is a plan view
  • FIG. 4 (b) is a cross-sectional view along the line AA in FIG. 4 (a).
  • the plasma display panel in FIG. 4 is at 450 ° C.
  • the frit glass forming the sealing material 40 has a further increased fluidity.
  • Ne and Xe are sealed inside at a pressure of 50 kPa, but since it is lower than the atmospheric pressure of 100 kPa, the front substrate 1 and the back substrate 2 are further pushed by the atmospheric pressure, The distance between the front substrate 1 and the rear substrate 2 is about 120 ⁇ m.
  • the partition wall 7 formed in the display area 100 Since the height of the partition wall 7 formed in the display area 100 is 120 ⁇ m, the partition wall 7 serves as a stopper, and the distance between the front substrate 1 and the back substrate 2 is determined. At this time, the sealing material 50 is also melted, and the distance between the front substrate 1 and the rear substrate 2 near the sealing material 50 is also 120 ⁇ m. When the sealing material 50 is pushed and crushed, the opening portion 51 originally formed in the sealing material 50 is closed, and the exhaust hole 60 and the outside air are blocked.
  • FIG. 4B is a cross-sectional view taken along the line AA of FIG. 4A, in which the frit glass forming the sealing material 40 and the frit glass forming the sealing material 50 are melted and widened. Show.
  • the exhaust pipe 61 is connected to the rear substrate 2, but becomes unnecessary after the sealing material 50 is melted and the inside of the plasma display panel is shut off from the outside air. However, since the plasma display panel is still in the heating furnace, the exhaust pipe 61 remains attached.
  • the temperature of the plasma display panel is gradually decreased.
  • the frit glass of the sealing material 50 and the frit glass of the sealing material 40 are solidified, and the inside of the plasma display panel is completely sealed. In this state, Ne and Xe as discharge gases are sealed in the plasma display panel at a pressure of 50 kPa.
  • the exhaust pipe 61 After exhausting the plasma display panel and sealing the discharge gas, the exhaust pipe 61 that is no longer needed is removed. At this time, since the exhaust hole 60 is sealed with the sealing material 50 inside the plasma display panel, the state of the internal discharge gas is maintained. After the exhaust pipe 61 is cut or broken by a cutter or the like, the periphery of the exhaust hole 60 is smoothed by mechanical polishing or the like.
  • the exhaust pipe 61 is attached to the plasma display panel until the middle of the manufacturing process, but after the plasma display panel is completed, the exhaust pipe 61 is completely removed.
  • a plasma display panel without the exhaust pipe 61 can be manufactured in a finished product by substantially the same process as before without using complicated manufacturing equipment.
  • the sealing mechanism that replaces the exhaust pipe 61 is not formed outside the rear substrate 2, a mechanism for mechanically protecting the sealing portion is not necessary, and the manufacturing cost of the plasma display device is reduced. It can be reduced.
  • the sealing with the outside air is performed by melting the sealing material 50 formed of frit glass.
  • frit glass There is also a solid frit glass from which organic substances have been removed in advance, but generally an organic substance is included in the frit glass as a binder, and organic gas may be generated when the frit glass is melted. If organic gas is mixed into MgO, Ne, Xe, or the like forming a protective layer inside the plasma display panel, the discharge characteristics may be adversely affected.
  • FIG. 7 is a diagram showing a first form of the present embodiment.
  • FIG. 7 is a view corresponding to FIG. 2 of the first embodiment, and shows a state before the frit glass forming the sealing material 40 or the sealing material 50 is still melted.
  • FIG. 7 (a) is a plan view
  • FIG. 7 (b) is a cross-sectional view taken along the line AA in FIG. 7 (a).
  • FIG. 7A is the same as FIG. 2 except that a getter 70 is disposed between the sealing material 50 and the display region 100.
  • the getter 70 when an organic gas is generated from the sealing material 50, the getter 70 extends linearly so that the organic gas is trapped by the getter 70 before reaching the display region 100. Yes.
  • the getter 70 is a getter that does not scatter, such as a Zr getter or a Va getter.
  • the height of the getter 70 is formed lower than the height of the partition wall 7 in the display area 100.
  • Such a getter 70 normally has no gas adsorbing action, and exhibits gas adsorbing action when activated at a high temperature.
  • the activation temperature of the getter 70 By setting the activation temperature of the getter 70 to 450 ° C., the frit glass for the sealing material 50 is melted to generate an organic gas, and at the same time, an adsorption action can be caused. That is, it is desirable that the activation temperature of the getter 70 is higher than the melting temperature of the frit glass for the sealing material 40.
  • Zr getter, Va getter, etc. have no adsorption action for inert gases such as Ne, Xe, etc., and show good getter action for organic gases such as methane. Is preferred.
  • FIG. 7B is a cross-sectional view of FIG. 7A, and the difference from FIG. 2B is that a getter 70 is arranged between the sealing material 50 and the display region 100.
  • FIG. 7B the height of the getter 70 is formed lower than the height of the partition wall 7 formed in the display region 100. Therefore, at the time of FIG. There is a gap between them.
  • FIG. 8 is a diagram showing a second form of the present embodiment.
  • 8A is a plan view
  • FIG. 8B is a cross-sectional view taken along the line AA in FIG. 8A.
  • FIG. 8A is the same as FIG. 7A except that the periphery of the sealing material 50 is surrounded by a getter 70.
  • the getter 70 surrounds the sealing material 50, but the getter 70 is not formed at a location where the opening 51 of the sealing material 50 is formed. This is because the exhaust from the inside of the plasma display panel is efficiently performed.
  • the sealing material 50 is surrounded by the getter 70, when the frit glass forming the sealing material 50 is melted to generate organic gas, the organic gas is efficiently captured by the getter 70. It has the feature that it can.
  • the getter 70 in this case is a getter that does not scatter, such as a Zr getter or a Va getter.
  • FIG. 8B is a cross-sectional view taken along the line AA in FIG. 8A, and the difference from FIG. 7B is that the getter 70 exists on both sides of the sealing material 50.
  • the height of the getter 70 is formed lower than the height of the partition wall 7 in the display area 100. Therefore, at the time of FIG. 8, there is a gap between the getter 70 and the front substrate 1.
  • an exhaust pipe 61 is connected. This exhaust pipe 61 is used for exhausting the plasma display panel, introducing discharge gas, sealing material 40 or sealing material 50. After the frit glass forming the material is solidified, it is removed in the same manner as in Example 1.
  • FIG. 1 is an external view of a plasma display panel according to the present invention. It is a figure which shows the state of the 1st step in a manufacturing process. It is a figure which shows the state of the 2nd step in a manufacturing process. It is a figure which shows the state of the 3rd step in a manufacturing process. It is a figure which shows the state of the 4th step in a manufacturing process. It is the temperature profile in a manufacturing process, and the pressure profile inside a plasma display panel. It is a figure which shows the 1st form of Example 2. FIG. It is a figure which shows the 2nd form of Example 2. FIG. It is a disassembled perspective view of the display area of a plasma display panel. It is an external view of the conventional plasma display panel.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)

Abstract

L’invention concerne un substrat avant (1) et un substrat arrière (2) collés l'un à l'autre et séparés par un matériau d'étanchéité (40). Un trou d’échappement (60) formé sur le substrat avant (1) ou le substrat arrière (2) est scellé entre le substrat avant (1) et le substrat arrière (2) par un matériau d'étanchéité (50) constitué autour du trou d’échappement (60). Comme la température de fusion d'un verre pailleux, formant l’élément d'étanchéité (50), est supérieure à celle d’un verre pailleux constituant le matériau d'étanchéité (40), les substrats sont scellés par le matériau d'étanchéité (50) après avoir fait le vide à l'intérieur d'un écran d'affichage plasma et introduit un gaz de décharge. Ainsi, l'invention concerne un écran d'affichage plasma sans tuyau d’échappement pour étanchéifier le trou d’échappement.
PCT/JP2008/003455 2008-11-25 2008-11-25 Écran d'affichage plasma WO2010061418A1 (fr)

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CN104302592A (zh) * 2012-05-18 2015-01-21 松下知识产权经营株式会社 多层玻璃的制备方法
CN104302593A (zh) * 2012-05-18 2015-01-21 松下知识产权经营株式会社 多层玻璃的制备方法
JP2015129077A (ja) * 2008-05-30 2015-07-16 コーニング インコーポレイテッド フリットをガラス板に焼結する方法
WO2017169353A1 (fr) * 2016-03-31 2017-10-05 パナソニックＩｐマネジメント株式会社 Procédés de fabrication d'unités de panneaux de verre et de meubles les comprenant

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JPH042030A (ja) * 1990-04-11 1992-01-07 Mitsubishi Electric Corp プラズマディスプレイパネルおよびその製造方法
JPH10326572A (ja) * 1997-05-27 1998-12-08 Chugai Ro Co Ltd プラズマディスプレイパネルの製造方法

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US20110220384A1 (en) * 2010-03-09 2011-09-15 Hitachi Consumer Electronics Co., Ltd. Plasma display panel and chamber for manufacturing plasma display panel
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