JP2015129077A - フリットをガラス板に焼結する方法 - Google Patents
フリットをガラス板に焼結する方法 Download PDFInfo
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- 229910052779 Neodymium Inorganic materials 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- 241000255969 Pieris brassicae Species 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
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- 239000005407 aluminoborosilicate glass Substances 0.000 description 1
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- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
- C03C17/04—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/16—Silica-free oxide glass compositions containing phosphorus
- C03C3/21—Silica-free oxide glass compositions containing phosphorus containing titanium, zirconium, vanadium, tungsten or molybdenum
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/08—Frit compositions, i.e. in a powdered or comminuted form containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Glass Compositions (AREA)
- Joining Of Glass To Other Materials (AREA)
- Surface Treatment Of Glass (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
1. Sb−V−リン酸塩ガラスを溶融し、次いで、充填剤として使用したβ−ユークリプタイトを溶融し、結晶化させる。Sb−V−リン酸塩ガラスは以下の組成を有した(モル%):Sb2O3:23.5%、V2O5:47.5%、TiO2:1%、Al2O3:1%、Fe2O3:2.5%、およびP2O5:27%。
a. 10℃/分の変化率で25℃−325℃に加熱する(累積時間=0.5時間)(図3の工程302参照)。この変化率は、炉の設計およびガラス板102とフリット108への熱の伝達に関連する熱力学により制限される。
(a) 25℃−低温(200または250℃のいずれか)。
・ 焼結の最高温度が450℃である場合、フリット108は封着しなかった。
102,110 ガラス板
104 コンポーネント
106 電極
108 フリット
112 気密シール
114 封着装置
116 光またはビーム
118 封着線
Claims (9)
- フリットをガラス板に焼結する方法において、
ガラス板(102)を提供する工程、
前記ガラス板上に、ガラス、充填剤および分散ビヒクルを含むフリット(108)を配置する工程、
前記フリットが配置された前記ガラス板を炉内に入れる工程、
前記炉内で前記フリットを前記ガラス板に焼結する工程であって、
前記炉内の温度を、第1の温度から、前記フリットの前記分散ビヒクル内の有機成分を揮発させるのに十分に高いが、該フリット中の前記ガラスのガラス転移温度(Tg)よりは高くない第2の温度まで上昇させ、該第2の温度を所定の時間に亘り保持し、前記第2の温度を保持しながら、空気供給源をオフにし、還元性―不活性ガス供給源をオンにし、前記炉内に含まれた空気を前記還元性―不活性ガスにより置き換え、
前記炉内の温度を、前記第2の温度から、前記フリット中の前記ガラスのガラス転移温度(Tg)より高いが、該フリット中の該ガラスの結晶化温度より低い第3の温度まで上昇させ、該炉内で該第3の温度を所定の時間に亘り保持し、
前記炉内の温度を降下させる、
各ステップを含む工程、および
焼結した前記フリットを有する前記ガラス板を前記炉から取り出す工程、
を有してなることを特徴とする方法。 - 前記第2の温度を保持しながら、前記有機成分が完全に燃え尽きる前に、前記炉内に含まれた空気が前記還元性―不活性ガスにより実質的に置き換えられることを特徴とする請求項1に記載の方法。
- 前記第2の温度を保持する前記所定の時間は1時間8分であり、当該所定の時間の最後の8分間で、前記炉内に含まれた空気が前記還元性―不活性ガスにより実質的に置き換えられることを特徴とする請求項1または2に記載の方法。
- 前記焼結工程が8時間未満で行われることを特徴とする請求項1〜3のいずれか1項に記載の方法。
- 前記炉内の温度を前記第3の温度に保持しながら、該炉内の酸素レベルを50ppm〜22,220ppmの範囲内の所定のレベルに維持する工程をさらに含むことを特徴とする請求項1〜4のいずれか1項に記載の方法。
- 前記炉がクリーンルーム内に配置されていることを特徴とする請求項1〜5のいずれか1項に記載の方法。
- 前記フリットが、鉄、銅およびバナジウムから選択された遷移金属少なくとも1種類がドープされたガラスを含むことを特徴とする請求項1〜6のいずれか1項に記載の方法。
- 前記フリットが、ランタニドがドープされたガラスを含むことを特徴とする請求項1〜7のいずれか1項に記載の方法。
- 前記温度を降下させる工程が、還元性−不活性ガス供給源をオフにし、空気供給源をオンにする各ステップを含み、前記炉内に含まれた還元性−不活性ガスが空気により実質的に置き換えられることを特徴とする請求項1〜8のいずれか1項に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/156,377 | 2008-05-30 | ||
US12/156,377 US7992411B2 (en) | 2008-05-30 | 2008-05-30 | Method for sintering a frit to a glass plate |
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JP2011511608A Division JP5698660B2 (ja) | 2008-05-30 | 2009-05-19 | フリットをガラス板に焼結する方法 |
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JP2014258641A Pending JP2015129077A (ja) | 2008-05-30 | 2014-12-22 | フリットをガラス板に焼結する方法 |
JP2017197463A Ceased JP2018048075A (ja) | 2008-05-30 | 2017-10-11 | フリットをガラス板に焼結する方法 |
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Country Status (7)
Country | Link |
---|---|
US (2) | US7992411B2 (ja) |
EP (1) | EP2300379A4 (ja) |
JP (3) | JP5698660B2 (ja) |
KR (1) | KR101450945B1 (ja) |
CN (1) | CN102112406B (ja) |
TW (1) | TWI403480B (ja) |
WO (1) | WO2009148502A2 (ja) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101519693B1 (ko) * | 2008-04-25 | 2015-05-12 | 하마마츠 포토닉스 가부시키가이샤 | 유리용착방법 |
JP5308717B2 (ja) * | 2008-05-26 | 2013-10-09 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
JP5308718B2 (ja) * | 2008-05-26 | 2013-10-09 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
US7992411B2 (en) * | 2008-05-30 | 2011-08-09 | Corning Incorporated | Method for sintering a frit to a glass plate |
US8147632B2 (en) | 2008-05-30 | 2012-04-03 | Corning Incorporated | Controlled atmosphere when sintering a frit to a glass plate |
KR101665727B1 (ko) * | 2008-06-11 | 2016-10-12 | 하마마츠 포토닉스 가부시키가이샤 | 유리 용착 방법 |
US8839643B2 (en) * | 2008-06-11 | 2014-09-23 | Hamamatsu Photonics K.K. | Fusion bonding process for glass |
JP5535653B2 (ja) * | 2008-06-23 | 2014-07-02 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
US20100118912A1 (en) * | 2008-11-10 | 2010-05-13 | Changyi Lai | Quality control of the frit for oled sealing |
US8245536B2 (en) * | 2008-11-24 | 2012-08-21 | Corning Incorporated | Laser assisted frit sealing of high CTE glasses and the resulting sealed glass package |
PT104282A (pt) * | 2008-12-05 | 2010-06-07 | Univ Do Porto | Processo de selagem com vidro de células solares dsc |
US8440479B2 (en) * | 2009-05-28 | 2013-05-14 | Corning Incorporated | Method for forming an organic light emitting diode device |
JPWO2011010489A1 (ja) * | 2009-07-23 | 2012-12-27 | 旭硝子株式会社 | 封着材料層付きガラス部材の製造方法及び製造装置、並びに電子デバイスの製造方法 |
JP5481167B2 (ja) * | 2009-11-12 | 2014-04-23 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
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Also Published As
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US20110256407A1 (en) | 2011-10-20 |
KR101450945B1 (ko) | 2014-10-15 |
KR20110025671A (ko) | 2011-03-10 |
CN102112406B (zh) | 2013-10-23 |
US7992411B2 (en) | 2011-08-09 |
JP2018048075A (ja) | 2018-03-29 |
TW201010953A (en) | 2010-03-16 |
US20090297862A1 (en) | 2009-12-03 |
WO2009148502A2 (en) | 2009-12-10 |
EP2300379A2 (en) | 2011-03-30 |
WO2009148502A3 (en) | 2010-02-25 |
JP5698660B2 (ja) | 2015-04-08 |
US8147976B2 (en) | 2012-04-03 |
TWI403480B (zh) | 2013-08-01 |
CN102112406A (zh) | 2011-06-29 |
JP2011523617A (ja) | 2011-08-18 |
EP2300379A4 (en) | 2013-08-14 |
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