WO2009057596A1 - 導体内蔵セラミックスの製造方法 - Google Patents

導体内蔵セラミックスの製造方法 Download PDF

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WO2009057596A1
WO2009057596A1 PCT/JP2008/069558 JP2008069558W WO2009057596A1 WO 2009057596 A1 WO2009057596 A1 WO 2009057596A1 JP 2008069558 W JP2008069558 W JP 2008069558W WO 2009057596 A1 WO2009057596 A1 WO 2009057596A1
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molded product
ceramic
energization part
producing
conductor built
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PCT/JP2008/069558
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English (en)
French (fr)
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Yoshiya Tsutsui
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Kyocera Corporation
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Application filed by Kyocera Corporation filed Critical Kyocera Corporation
Priority to EP08845702.3A priority Critical patent/EP2228354B2/en
Priority to KR1020107010518A priority patent/KR101134396B1/ko
Priority to CN2008801138011A priority patent/CN101842333B/zh
Priority to US12/740,332 priority patent/US8591801B2/en
Priority to JP2009539069A priority patent/JPWO2009057596A1/ja
Publication of WO2009057596A1 publication Critical patent/WO2009057596A1/ja

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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/584Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B1/00Producing shaped prefabricated articles from the material
    • B28B1/002Producing shaped prefabricated articles from the material assembled from preformed elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B1/00Producing shaped prefabricated articles from the material
    • B28B1/008Producing shaped prefabricated articles from the material made from two or more materials having different characteristics or properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B1/00Producing shaped prefabricated articles from the material
    • B28B1/24Producing shaped prefabricated articles from the material by injection moulding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B23/00Arrangements specially adapted for the production of shaped articles with elements wholly or partly embedded in the moulding material; Production of reinforced objects
    • B28B23/0056Means for inserting the elements into the mould or supporting them in the mould
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    • C04B35/5607Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on refractory metal carbides
    • C04B35/5626Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on refractory metal carbides based on tungsten carbides
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    • C04B35/63Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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    • C04B41/5053Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials non-oxide ceramics
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
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    • C04B2235/6022Injection moulding

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Producing Shaped Articles From Materials (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Tubular Articles Or Embedded Moulded Articles (AREA)
  • Resistance Heating (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)

Abstract

 【課題】 金属リード線の加工を不要にし、脱脂・焼成時に発生する基体間の隙間からの異物・埃等の進入を防止し、絶縁破壊不良を低減することができる導体内蔵セラミックスの製造方法、およびその製造方法で製造した導体内蔵セラミックスを提供する。  【解決手段】 導電性セラミックス粉末およびバインダーを含む通電部用混合物を用いて通電部用成形体11を作製する工程と、通電部用成形体11を金型13内に保持し、絶縁性セラミックス粉末およびバインダーを含む基体用混合物15を金型13内に充填することにより、通電部用成形体11が基体用混合物15で覆われた素子成形体17を作製する工程と、素子成形体17を焼成する工程とを備えた導体内蔵セラミックスの製造方法である。通電部と基体との間に空隙が生じるのを抑制できるとともに、脱脂時や焼成時に素子成形体17内に外部からの異物や埃等が混入するのを抑制できる。
PCT/JP2008/069558 2007-10-29 2008-10-28 導体内蔵セラミックスの製造方法 WO2009057596A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP08845702.3A EP2228354B2 (en) 2007-10-29 2008-10-28 Process for producing conductor built-in ceramic
KR1020107010518A KR101134396B1 (ko) 2007-10-29 2008-10-28 도체 내장 세라믹스의 제조 방법
CN2008801138011A CN101842333B (zh) 2007-10-29 2008-10-28 导体内置陶瓷的制造方法
US12/740,332 US8591801B2 (en) 2007-10-29 2008-10-28 Process for producing conductor built-in ceramic
JP2009539069A JPWO2009057596A1 (ja) 2007-10-29 2008-10-28 導体内蔵セラミックスの製造方法

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Application Number Priority Date Filing Date Title
JP2007-280606 2007-10-29
JP2007280606 2007-10-29

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WO2009057596A1 true WO2009057596A1 (ja) 2009-05-07

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US (1) US8591801B2 (ja)
EP (1) EP2228354B2 (ja)
JP (1) JPWO2009057596A1 (ja)
KR (1) KR101134396B1 (ja)
CN (1) CN101842333B (ja)
WO (1) WO2009057596A1 (ja)

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JP2013105683A (ja) * 2011-11-15 2013-05-30 Ngk Spark Plug Co Ltd セラミックヒータの製造方法及びグロープラグの製造方法
JP2013105684A (ja) * 2011-11-15 2013-05-30 Ngk Spark Plug Co Ltd セラミックヒータの製造方法及びグロープラグの製造方法

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JP5657486B2 (ja) * 2010-07-30 2015-01-21 富士フイルム株式会社 インク組成物、インクセット、及び画像形成方法
JP5844621B2 (ja) * 2011-11-15 2016-01-20 日本特殊陶業株式会社 セラミックヒータの製造方法、グロープラグの製造方法、セラミックヒータ及びグロープラグ
DE102013200281A1 (de) * 2013-01-11 2014-07-17 Robert Bosch Gmbh Verfahren zum Herstellen einer Aufnahme für ein Sensorelement
GB201503785D0 (en) 2015-03-06 2015-04-22 Rolls Royce Plc Firing process and method
CN105489560A (zh) * 2015-11-30 2016-04-13 广东百圳君耀电子有限公司 一种无外壳填充保护型电路元件及其制成工艺
CN108698297A (zh) 2015-12-16 2018-10-23 德仕托金属有限公司 用于增材制造的方法和***
US11969795B2 (en) 2016-04-14 2024-04-30 Desktop Metal, Inc. Forming an interface layer for removable support
US20220297345A1 (en) * 2020-08-14 2022-09-22 Raytheon Technologies Corporation Method and system for molded coating on cmc
CN113414391A (zh) * 2021-07-12 2021-09-21 杭州铭赫科技有限公司 一种粉末注射成形工艺

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JPS59231322A (ja) 1983-06-13 1984-12-26 Ngk Spark Plug Co Ltd 自己制御型グロ−プラグ
JPH05337629A (ja) * 1992-06-09 1993-12-21 Toshiba Mach Co Ltd 鋳ぐるみによる複合部材の製造方法
JPH10249843A (ja) 1997-03-12 1998-09-22 Ngk Insulators Ltd 金属部材内蔵セラミックス部材の製造方法
JPH10259059A (ja) 1997-03-17 1998-09-29 Ngk Insulators Ltd 金属部材内蔵セラミックス部材の製造方法
JPH11255566A (ja) 1998-03-12 1999-09-21 Ngk Insulators Ltd 金属部材内蔵セラミックス部材の製造方法及び金属部材内蔵セラミックス部材
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JP2002016128A (ja) 2000-06-27 2002-01-18 Kyocera Corp 電極内蔵セラミックス
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CN101842333B (zh) 2013-06-19
EP2228354A1 (en) 2010-09-15
KR101134396B1 (ko) 2012-04-09
JPWO2009057596A1 (ja) 2011-03-10
EP2228354B1 (en) 2014-09-10
EP2228354B2 (en) 2017-10-18
EP2228354A4 (en) 2012-05-30
KR20100077197A (ko) 2010-07-07
US20100289181A1 (en) 2010-11-18
US8591801B2 (en) 2013-11-26
CN101842333A (zh) 2010-09-22

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