PL1917111T3 - Sposób wytwarzania wyrobów mających powłokę przewodzącą prąd elektryczny - Google Patents
Sposób wytwarzania wyrobów mających powłokę przewodzącą prąd elektrycznyInfo
- Publication number
- PL1917111T3 PL1917111T3 PL06742922T PL06742922T PL1917111T3 PL 1917111 T3 PL1917111 T3 PL 1917111T3 PL 06742922 T PL06742922 T PL 06742922T PL 06742922 T PL06742922 T PL 06742922T PL 1917111 T3 PL1917111 T3 PL 1917111T3
- Authority
- PL
- Poland
- Prior art keywords
- electrically conductive
- conductive coating
- producing articles
- articles
- producing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
- B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2601/00—Inorganic fillers
- B05D2601/20—Inorganic fillers used for non-pigmentation effect
- B05D2601/28—Metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05018399 | 2005-08-24 | ||
PCT/EP2006/004572 WO2007022810A1 (en) | 2005-08-24 | 2006-05-15 | Process for producing articles having an electrically conductive coating |
EP06742922.5A EP1917111B1 (en) | 2005-08-24 | 2006-05-15 | Process for producing articles having an electrically conductive coating |
Publications (1)
Publication Number | Publication Date |
---|---|
PL1917111T3 true PL1917111T3 (pl) | 2015-07-31 |
Family
ID=35636958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL06742922T PL1917111T3 (pl) | 2005-08-24 | 2006-05-15 | Sposób wytwarzania wyrobów mających powłokę przewodzącą prąd elektryczny |
Country Status (13)
Country | Link |
---|---|
US (1) | US9603256B2 (pl) |
EP (1) | EP1917111B1 (pl) |
JP (1) | JP4943435B2 (pl) |
CN (1) | CN101262957B (pl) |
AU (1) | AU2006284245B2 (pl) |
CA (1) | CA2619997C (pl) |
DK (1) | DK1917111T3 (pl) |
ES (1) | ES2535231T3 (pl) |
PL (1) | PL1917111T3 (pl) |
PT (1) | PT1917111E (pl) |
RU (1) | RU2402385C2 (pl) |
TW (1) | TWI400718B (pl) |
WO (1) | WO2007022810A1 (pl) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007041752A1 (de) * | 2007-09-04 | 2009-03-05 | Bielomatik Leuze Gmbh + Co Kg | Chipmodul für ein RFID-System |
JP5087384B2 (ja) * | 2007-12-14 | 2012-12-05 | 三菱製紙株式会社 | 導電性部材の製造方法および導電性部材 |
US8153203B2 (en) * | 2009-01-12 | 2012-04-10 | The United States Of America As Represented By The Secretary Of The Navy | Conductive microcylinder-based paints for integrated antennas |
TWI452094B (zh) * | 2010-09-02 | 2014-09-11 | Nippon Steel & Sumitomo Metal Corp | Conductive, excellent corrosion resistance of the coated metal plate |
TWI481326B (zh) * | 2011-11-24 | 2015-04-11 | Showa Denko Kk | A conductive pattern forming method, and a conductive pattern forming composition by light irradiation or microwave heating |
US9245664B2 (en) * | 2011-12-02 | 2016-01-26 | E I Du Pont De Nemours And Company | Conductive metal ink |
RU2507301C1 (ru) * | 2012-08-16 | 2014-02-20 | Закрытое акционерное общество "Галилео Нанотех" | Способ изготовления rfid-антенн, работающих в диапазоне ультравысокой частоты |
JP5765741B2 (ja) | 2012-08-28 | 2015-08-19 | 日本ペイント・オートモーティブコーティングス株式会社 | 高意匠複層塗膜形成方法 |
RU2527458C1 (ru) * | 2012-12-13 | 2014-08-27 | Открытое акционерное общество "Государственный оптический институт им. С.И. Вавилова" | Способ нанесения электропроводящего покрытия светозащитной бленды |
KR101962749B1 (ko) * | 2013-01-23 | 2019-03-28 | 헨켈 아이피 앤드 홀딩 게엠베하 | 가요성 전도성 잉크 |
US8968824B2 (en) * | 2013-03-14 | 2015-03-03 | Dowa Electronics Materials Co., Ltd. | Method for producing silver conductive film |
US9957412B2 (en) | 2013-05-16 | 2018-05-01 | Lord Corporation | Aqueous conductive coating |
US9374907B2 (en) * | 2013-06-24 | 2016-06-21 | Xerox Corporation | Method of improving sheet resistivity of printed conductive inks |
US20140374672A1 (en) * | 2013-06-24 | 2014-12-25 | Xerox Corporation | Conductive metal inks with polyvinylbutyral binder |
US20140374671A1 (en) * | 2013-06-24 | 2014-12-25 | Xerox Corporation | Conductive metal inks with polyvinylbutyral and polyvinylpyrrolidone binder |
US20160215441A1 (en) * | 2013-08-09 | 2016-07-28 | Florida State University Research Foundation, Inc. | Conductive Composite Materials Containing Multi-Scale High Conductive Particles and Methods |
US20150240099A1 (en) * | 2014-02-24 | 2015-08-27 | Xerox Corporation | Silver flake conductive paste ink with nickel particles |
US10246599B2 (en) * | 2014-03-17 | 2019-04-02 | Xerox Corporation | Ink composition and method of determining a degree of curing of the ink composition |
RU2581084C2 (ru) * | 2014-06-26 | 2016-04-10 | Федеральное государственное бюджетное учреждение науки Ордена Трудового Красного Знамени Институт нефтехимического синтеза им. А.В. Топчиева Российской академии наук (ИНХС РАН) | Способ получения композитного лака для электропроводящего материала |
RU2580355C1 (ru) * | 2014-11-24 | 2016-04-10 | Общество с ограниченной ответственностью "Энкон-сервис" (ООО "Энкон-сервис") | Способ нанесения металлического покрытия на токопередающие поверхности контактных соединений |
US11189393B2 (en) * | 2015-03-23 | 2021-11-30 | Bando Chemical Industries, Ltd. | Conductive coated composite body and method for producing same |
RU2620435C1 (ru) * | 2016-07-14 | 2017-05-25 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Башкирский государственный университет" | Электропроводящие металлонаполненные полимерные композиции для 3D-печати |
CN106570959A (zh) * | 2016-11-01 | 2017-04-19 | 通化师范学院 | 基于gsm模块的智能防盗电控门锁*** |
CN107573745B (zh) * | 2017-08-17 | 2018-09-11 | 北京梦之墨科技有限公司 | 一种电磁屏蔽涂层材料及其制备方法 |
RU2710688C1 (ru) * | 2019-04-24 | 2020-01-09 | Джамиля Викторовна Чайкина | Детский конструктор, электропроводящая композиция и способ ее изготовления (варианты), способ формирования электропроводящих треков и ручной инструмент (варианты) |
Family Cites Families (28)
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US3498958A (en) * | 1968-06-27 | 1970-03-03 | Nat Starch Chem Corp | Water-and oil repellency agents |
US3779878A (en) * | 1969-06-16 | 1973-12-18 | Libbey Owens Ford Co | Method of producing antenna type windshields |
US3643756A (en) * | 1969-12-16 | 1972-02-22 | Libbey Owens Ford Co | Safety circuit control device |
DE2114934A1 (en) * | 1971-03-27 | 1972-10-05 | Remag Ag Zweigniederlassung Mu | Coating steel frame ends - to prevent rusting |
HU174316B (hu) * | 1976-12-10 | 1979-12-28 | Hajtomuevek Es Festoberendeze | Sposob i linija dlja nanesenija pokrytij na poverkhnosti |
US4522888A (en) * | 1980-12-29 | 1985-06-11 | General Electric Company | Electrical conductors arranged in multiple layers |
US4921755A (en) | 1988-03-23 | 1990-05-01 | Eastman Kodak Company | Coating composition and coated article |
JP2606504B2 (ja) * | 1991-10-07 | 1997-05-07 | 株式会社アドユニオン研究所 | 電磁波シールド材及びその製造方法 |
US5286415A (en) * | 1992-12-28 | 1994-02-15 | Advanced Products, Inc. | Water-based polymer thick film conductive ink |
DE69737328T2 (de) | 1997-02-20 | 2007-11-22 | Partnerships Ltd., Inc. | Niedertemperaturverfahren und zusammensetzungen zur herstellung elektischer leiter |
US5869130A (en) * | 1997-06-12 | 1999-02-09 | Mac Dermid, Incorporated | Process for improving the adhesion of polymeric materials to metal surfaces |
US5851438A (en) * | 1997-08-29 | 1998-12-22 | E. I. Du Pont De Nemours And Company | Thick film compositions for making medical electrodes |
DE69830846T2 (de) * | 1997-09-11 | 2006-05-24 | Precision Dynamics Corp., San Fernando | Radiofrequenzidentifikationsetikett auf flexiblem substrat |
US6007758A (en) * | 1998-02-10 | 1999-12-28 | Lucent Technologies Inc. | Process for forming device comprising metallized magnetic substrates |
NL1008460C2 (nl) * | 1998-03-03 | 1999-09-06 | Acheson Colloiden B V | Geleidende inkt of verf. |
US6451154B1 (en) * | 2000-02-18 | 2002-09-17 | Moore North America, Inc. | RFID manufacturing concepts |
JP5007777B2 (ja) * | 2000-05-21 | 2012-08-22 | Tdk株式会社 | 透明導電積層体 |
WO2001096632A2 (en) * | 2000-06-15 | 2001-12-20 | Applied Materials, Inc. | A method and apparatus for conditioning electrochemical baths in plating technology |
JP2004534362A (ja) | 2001-06-28 | 2004-11-11 | パレレック,インコーポレイテッド | 導電体製造のための低温方法および組成物 |
US20030066756A1 (en) * | 2001-10-04 | 2003-04-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
DE10302596A1 (de) * | 2002-01-24 | 2003-08-28 | Shipley Company Marlborough | Behandlung von Metalloberflächen mit einer modifizierten Oxidaustauschmasse |
US20030151028A1 (en) * | 2002-02-14 | 2003-08-14 | Lawrence Daniel P. | Conductive flexographic and gravure ink |
WO2004019666A1 (en) * | 2002-08-22 | 2004-03-04 | Agfa-Gevaert | Process for preparing a substantially transparent conductive layer configuration |
ITGE20020104A1 (it) * | 2002-11-22 | 2004-05-23 | Fabrizio Parodi | Composizioni polimeriche rapidamente riscaldabili |
US20040178391A1 (en) * | 2003-01-29 | 2004-09-16 | Conaghan Brian F. | High conductivity inks with low minimum curing temperatures |
US7881808B2 (en) * | 2006-03-29 | 2011-02-01 | Cardiac Pacemakers, Inc. | Conductive polymeric coating with optional biobeneficial topcoat for a medical lead |
JP2007284276A (ja) * | 2006-04-14 | 2007-11-01 | Nippon Sheet Glass Co Ltd | 導電性セラミックス焼結体付き窓ガラス及びその製造方法 |
JP5087384B2 (ja) * | 2007-12-14 | 2012-12-05 | 三菱製紙株式会社 | 導電性部材の製造方法および導電性部材 |
-
2006
- 2006-05-15 DK DK06742922.5T patent/DK1917111T3/en active
- 2006-05-15 PT PT67429225T patent/PT1917111E/pt unknown
- 2006-05-15 CN CN2006800306735A patent/CN101262957B/zh not_active Expired - Fee Related
- 2006-05-15 RU RU2008110957/05A patent/RU2402385C2/ru not_active IP Right Cessation
- 2006-05-15 AU AU2006284245A patent/AU2006284245B2/en not_active Ceased
- 2006-05-15 PL PL06742922T patent/PL1917111T3/pl unknown
- 2006-05-15 WO PCT/EP2006/004572 patent/WO2007022810A1/en active Application Filing
- 2006-05-15 ES ES06742922.5T patent/ES2535231T3/es active Active
- 2006-05-15 CA CA2619997A patent/CA2619997C/en not_active Expired - Fee Related
- 2006-05-15 JP JP2008527318A patent/JP4943435B2/ja active Active
- 2006-05-15 EP EP06742922.5A patent/EP1917111B1/en active Active
- 2006-05-15 TW TW095117185A patent/TWI400718B/zh active
- 2006-05-15 US US12/064,769 patent/US9603256B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
ES2535231T3 (es) | 2015-05-06 |
WO2007022810A1 (en) | 2007-03-01 |
CN101262957A (zh) | 2008-09-10 |
PT1917111E (pt) | 2015-05-18 |
CA2619997C (en) | 2013-08-13 |
EP1917111A1 (en) | 2008-05-07 |
JP4943435B2 (ja) | 2012-05-30 |
RU2008110957A (ru) | 2009-09-27 |
TWI400718B (zh) | 2013-07-01 |
DK1917111T3 (en) | 2015-04-27 |
RU2402385C2 (ru) | 2010-10-27 |
EP1917111B1 (en) | 2015-01-21 |
US9603256B2 (en) | 2017-03-21 |
CN101262957B (zh) | 2011-06-29 |
AU2006284245B2 (en) | 2010-11-18 |
TW200709230A (en) | 2007-03-01 |
CA2619997A1 (en) | 2007-03-01 |
JP2009506524A (ja) | 2009-02-12 |
AU2006284245A1 (en) | 2007-03-01 |
US20080246007A1 (en) | 2008-10-09 |
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