WO2008114653A1 - 熱電変換モジュールの製造方法及び熱電変換モジュール - Google Patents
熱電変換モジュールの製造方法及び熱電変換モジュール Download PDFInfo
- Publication number
- WO2008114653A1 WO2008114653A1 PCT/JP2008/054400 JP2008054400W WO2008114653A1 WO 2008114653 A1 WO2008114653 A1 WO 2008114653A1 JP 2008054400 W JP2008054400 W JP 2008054400W WO 2008114653 A1 WO2008114653 A1 WO 2008114653A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conversion module
- thermoelectric conversion
- thermoelectric
- unfired
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
- H02N11/002—Generators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
- Laminated Bodies (AREA)
Abstract
本発明の熱電変換モジュールの製造方法は、絶縁性セラミックス粉末及びバインダを含み、互いに平行に所定方向に伸びるように形成された複数の孔を有する未焼成枠部材と、熱電材料の原料粉末を含み孔中に配置された熱電素子原料10と、を有する未焼成熱電基材13を形成する工程と、未焼成熱電基材13を孔が伸びる所定方向に引伸ばす工程と、を備えるものである。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/532,443 US20100119770A1 (en) | 2007-03-22 | 2008-03-11 | Process for Manufacturing Thermoelectric Conversion Module and Thermoelectric Conversion Module |
EP08721816A EP2136416A4 (en) | 2007-03-22 | 2008-03-11 | PROCESS FOR THE PRODUCTION OF A THERMOELECTRIC TRANSDUCER MODULE AND THERMOELECTRIC TRANSDUCER MODULE |
CN2008800092769A CN101657913B (zh) | 2007-03-22 | 2008-03-11 | 热电转换模块的制造方法及热电转换模块 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007075450A JP4912931B2 (ja) | 2007-03-22 | 2007-03-22 | 熱電変換モジュールの製造方法及び熱電変換モジュール |
JP2007-075450 | 2007-03-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008114653A1 true WO2008114653A1 (ja) | 2008-09-25 |
Family
ID=39765761
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/054400 WO2008114653A1 (ja) | 2007-03-22 | 2008-03-11 | 熱電変換モジュールの製造方法及び熱電変換モジュール |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100119770A1 (ja) |
EP (1) | EP2136416A4 (ja) |
JP (1) | JP4912931B2 (ja) |
CN (1) | CN101657913B (ja) |
TW (1) | TW200845440A (ja) |
WO (1) | WO2008114653A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120068389A1 (en) * | 2010-09-17 | 2012-03-22 | Chan Park | Methods of fabricating polycrystalline ceramic for thermoelectric devices |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5225056B2 (ja) * | 2008-01-29 | 2013-07-03 | 京セラ株式会社 | 熱電モジュール |
CN101393959B (zh) * | 2008-11-07 | 2012-04-11 | 中国科学院上海硅酸盐研究所 | 一种笼型化合物 |
TWI415314B (zh) * | 2009-02-05 | 2013-11-11 | Lg Chemical Ltd | 熱電元件模組及製造方法 |
AT511647B1 (de) * | 2011-07-08 | 2013-11-15 | Univ Wien Tech | Kühl-/heiz-vorrichtung |
DE102011090152B4 (de) * | 2011-12-30 | 2018-02-22 | Continental Automotive Gmbh | Thermogenerator |
DE102012205098B4 (de) * | 2012-03-29 | 2020-04-02 | Evonik Operations Gmbh | Thermoelektrische Bauelemente auf Basis trocken verpresster Pulvervorstufen |
DE102012205087A1 (de) * | 2012-03-29 | 2013-10-02 | Evonik Industries Ag | Pulvermetallurgische Herstellung eines thermoelektrischen Bauelements |
CN102867904B (zh) * | 2012-09-19 | 2015-11-11 | 中国科学院化学研究所 | 一种有机复合物热电材料及其制备方法与应用 |
US9472744B2 (en) | 2012-10-04 | 2016-10-18 | Marlow Industries, Inc. | System for thermoelectric energy generation |
DE102013219541B4 (de) * | 2013-09-27 | 2019-05-09 | Evonik Degussa Gmbh | Verbessertes Verfahren zur pulvermetallurgischen Herstellung thermoelektrischer Bauelemente |
EP3011837A1 (en) * | 2014-08-27 | 2016-04-27 | SWM Luxembourg s.a.r.l. | Method for making reconstituted plant material using extrusion or molding processes and products so obtained |
EP3196951B1 (de) | 2016-01-21 | 2018-11-14 | Evonik Degussa GmbH | Rationelles verfahren zur pulvermetallurgischen herstellung thermoelektrischer bauelemente |
CN106098925A (zh) * | 2016-06-28 | 2016-11-09 | 杜效中 | 一种用陶瓷薄膜做基材的薄膜热电半导体器件的制作方法 |
CN107056282B (zh) * | 2016-12-22 | 2020-05-12 | 广东风华高新科技股份有限公司 | 钇稳定氧化锆浆料、其制备方法及钇稳定氧化锆坯体的制备方法 |
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JPS63138789A (ja) * | 1986-12-01 | 1988-06-10 | Komatsu Ltd | 熱電材料の製造方法 |
JPH08153899A (ja) | 1994-11-30 | 1996-06-11 | Mitsubishi Materials Corp | 熱電変換用サーモモジュール及びその製造方法 |
JPH09293909A (ja) * | 1996-02-26 | 1997-11-11 | Matsushita Electric Works Ltd | 熱電モジュール及びその製造方法 |
JPH11243169A (ja) * | 1998-02-24 | 1999-09-07 | Nissan Motor Co Ltd | 電子冷却モジュールおよびその製造方法 |
JP2001068747A (ja) * | 1999-06-25 | 2001-03-16 | Matsushita Electric Works Ltd | 熱電素子材料の焼結体の製造方法 |
JP2001160634A (ja) * | 1999-11-30 | 2001-06-12 | Aisin Seiki Co Ltd | 熱電半導体の製造方法 |
JP2002158379A (ja) * | 2000-11-21 | 2002-05-31 | National Institute Of Advanced Industrial & Technology | 熱電変換素子集合体、熱電モジュール及び熱電変換素子集合体の製造方法 |
Family Cites Families (12)
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US3326726A (en) * | 1963-03-22 | 1967-06-20 | Gen Motors Corp | Thermoelectric array and method of manufacture |
US3601887A (en) * | 1969-03-12 | 1971-08-31 | Westinghouse Electric Corp | Fabrication of thermoelectric elements |
US4950151A (en) * | 1985-01-31 | 1990-08-21 | Zachariades Anagnostic E | Rolling die for producing high modulus products |
GB2280686B (en) * | 1993-08-04 | 1997-05-07 | Bridon Plc | Orientated polymeric core for wire ropes |
JP2768256B2 (ja) * | 1993-12-28 | 1998-06-25 | ヤマハ株式会社 | 情報入力装置 |
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JP3740251B2 (ja) * | 1997-06-09 | 2006-02-01 | キヤノン株式会社 | 太陽電池モジュールの製造方法 |
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JP4286053B2 (ja) * | 2003-05-08 | 2009-06-24 | 株式会社Ihi | 熱電半導体材料、該熱電半導体材料による熱電半導体素子、該熱電半導体素子を用いた熱電モジュール及びこれらの製造方法 |
US7560053B2 (en) * | 2005-02-17 | 2009-07-14 | Nobuyoshi Imaoka | Thermoelectric material having a rhombohedral crystal structure |
JP4266228B2 (ja) * | 2006-03-24 | 2009-05-20 | 株式会社東芝 | 熱電変換モジュールおよびその製造方法 |
-
2007
- 2007-03-22 JP JP2007075450A patent/JP4912931B2/ja not_active Expired - Fee Related
-
2008
- 2008-03-11 EP EP08721816A patent/EP2136416A4/en not_active Withdrawn
- 2008-03-11 US US12/532,443 patent/US20100119770A1/en not_active Abandoned
- 2008-03-11 WO PCT/JP2008/054400 patent/WO2008114653A1/ja active Application Filing
- 2008-03-11 CN CN2008800092769A patent/CN101657913B/zh not_active Expired - Fee Related
- 2008-03-20 TW TW097109793A patent/TW200845440A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63138789A (ja) * | 1986-12-01 | 1988-06-10 | Komatsu Ltd | 熱電材料の製造方法 |
JPH08153899A (ja) | 1994-11-30 | 1996-06-11 | Mitsubishi Materials Corp | 熱電変換用サーモモジュール及びその製造方法 |
JPH09293909A (ja) * | 1996-02-26 | 1997-11-11 | Matsushita Electric Works Ltd | 熱電モジュール及びその製造方法 |
JPH11243169A (ja) * | 1998-02-24 | 1999-09-07 | Nissan Motor Co Ltd | 電子冷却モジュールおよびその製造方法 |
JP2001068747A (ja) * | 1999-06-25 | 2001-03-16 | Matsushita Electric Works Ltd | 熱電素子材料の焼結体の製造方法 |
JP2001160634A (ja) * | 1999-11-30 | 2001-06-12 | Aisin Seiki Co Ltd | 熱電半導体の製造方法 |
JP2002158379A (ja) * | 2000-11-21 | 2002-05-31 | National Institute Of Advanced Industrial & Technology | 熱電変換素子集合体、熱電モジュール及び熱電変換素子集合体の製造方法 |
Non-Patent Citations (1)
Title |
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See also references of EP2136416A4 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120068389A1 (en) * | 2010-09-17 | 2012-03-22 | Chan Park | Methods of fabricating polycrystalline ceramic for thermoelectric devices |
Also Published As
Publication number | Publication date |
---|---|
CN101657913A (zh) | 2010-02-24 |
EP2136416A1 (en) | 2009-12-23 |
JP2008235712A (ja) | 2008-10-02 |
CN101657913B (zh) | 2011-08-24 |
JP4912931B2 (ja) | 2012-04-11 |
EP2136416A4 (en) | 2012-01-04 |
US20100119770A1 (en) | 2010-05-13 |
TW200845440A (en) | 2008-11-16 |
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