WO2009028440A1 - 表示装置、発光装置 - Google Patents

表示装置、発光装置 Download PDF

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Publication number
WO2009028440A1
WO2009028440A1 PCT/JP2008/065078 JP2008065078W WO2009028440A1 WO 2009028440 A1 WO2009028440 A1 WO 2009028440A1 JP 2008065078 W JP2008065078 W JP 2008065078W WO 2009028440 A1 WO2009028440 A1 WO 2009028440A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
attached
board
emitting device
display device
Prior art date
Application number
PCT/JP2008/065078
Other languages
English (en)
French (fr)
Inventor
Kenji Shinozaki
Shuji Gomi
Masataka Yokomizo
Original Assignee
Showa Denko K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko K.K. filed Critical Showa Denko K.K.
Publication of WO2009028440A1 publication Critical patent/WO2009028440A1/ja

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/003—Lens or lenticular sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

　発光装置１１ａは、複数の発光モジュール４０（４０ａ～４０ｊ）を並べて構成した発光部３１と、これら各発光モジュール４０が取り付けられる１枚の配線基板３２とを備える。各発光モジュール４０は、実装基板と、実装基板の表面に取り付けられる３個のＬＥＤとを備えている。そして、各実装基板は、配線基板３２に対して立てて取り付けられている。それにより、発光素子が取り付けられた板状基板の側面を配線基板に取り付けて光源を構成した際に、光量むらの発生を抑制する。
PCT/JP2008/065078 2007-08-31 2008-08-25 表示装置、発光装置 WO2009028440A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-226093 2007-08-31
JP2007226093A JP2009058768A (ja) 2007-08-31 2007-08-31 表示装置、発光装置

Publications (1)

Publication Number Publication Date
WO2009028440A1 true WO2009028440A1 (ja) 2009-03-05

Family

ID=40387160

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065078 WO2009028440A1 (ja) 2007-08-31 2008-08-25 表示装置、発光装置

Country Status (4)

Country Link
US (1) US8016448B2 (ja)
JP (1) JP2009058768A (ja)
TW (1) TW200919033A (ja)
WO (1) WO2009028440A1 (ja)

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KR101475314B1 (ko) * 2009-03-30 2014-12-23 엘지디스플레이 주식회사 엘이디 백라이트 유닛 및 이를 이용한 액정표시장치모듈
JP4820454B2 (ja) * 2009-10-23 2011-11-24 シャープ株式会社 液晶表示装置及びテレビ受信装置
JP4875773B2 (ja) * 2009-10-23 2012-02-15 シャープ株式会社 液晶表示装置及びテレビ受信装置
JP2011138731A (ja) * 2010-01-04 2011-07-14 Mitsubishi Electric Corp 照明装置
JP2013225373A (ja) 2010-08-18 2013-10-31 Sharp Corp 照明装置、表示装置、及びテレビ受信装置
CN101975376B (zh) * 2010-10-08 2012-07-11 深圳市华星光电技术有限公司 背光模块的发光源散热构造
KR101191360B1 (ko) * 2010-12-20 2012-10-15 주식회사 루멘스 발광소자 패키지 어레이 및 이를 구비한 백라이트 유닛
JP5748496B2 (ja) * 2011-02-10 2015-07-15 ローム株式会社 Ｌｅｄモジュール
CN103511995B (zh) * 2012-06-29 2016-04-20 展晶科技(深圳)有限公司 发光二极管灯条
US9239489B2 (en) * 2012-07-31 2016-01-19 Apple Inc. Display backlight with closely spaced light-emitting diode packages
JP6080471B2 (ja) * 2012-10-05 2017-02-15 株式会社エイコー桐生 エッジライト型面発光装置
US20150362661A1 (en) * 2014-06-13 2015-12-17 Chih-Wei Wu Led backlight assembly suitable of middle or small size lcd display
US20170168208A1 (en) * 2015-12-13 2017-06-15 Chih-Wei Wu Fluorescent led backlight plate assembly

Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2003078176A (ja) * 2001-09-06 2003-03-14 Sharp Corp 側面多色発光型表面実装タイプｌｅｄ
JP2003132719A (ja) * 2001-10-23 2003-05-09 Stanley Electric Co Ltd サイドライト型面光源装置
JP2004146411A (ja) * 2002-10-22 2004-05-20 Citizen Electronics Co Ltd 高輝度発光装置及びその製造方法
JP2005353507A (ja) * 2004-06-14 2005-12-22 Toyoda Gosei Co Ltd バックライト装置
JP2006032741A (ja) * 2004-07-20 2006-02-02 Citizen Electronics Co Ltd Ｓｍｄ型側面実装部品

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JP2001345485A (ja) * 2000-06-02 2001-12-14 Toyoda Gosei Co Ltd 発光装置
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JP2007163620A (ja) * 2005-12-12 2007-06-28 Hitachi Displays Ltd 液晶表示装置及びバックライト装置
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WO2007116556A1 (ja) * 2006-04-10 2007-10-18 Sharp Kabushiki Kaisha Ｌｅｄパッケージ並びにこれを備えた照明装置および液晶表示装置
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CN101501876B (zh) * 2006-08-25 2012-02-15 夏普株式会社 发光元件、发光元件阵列、背光源单元和液晶显示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078176A (ja) * 2001-09-06 2003-03-14 Sharp Corp 側面多色発光型表面実装タイプｌｅｄ
JP2003132719A (ja) * 2001-10-23 2003-05-09 Stanley Electric Co Ltd サイドライト型面光源装置
JP2004146411A (ja) * 2002-10-22 2004-05-20 Citizen Electronics Co Ltd 高輝度発光装置及びその製造方法
JP2005353507A (ja) * 2004-06-14 2005-12-22 Toyoda Gosei Co Ltd バックライト装置
JP2006032741A (ja) * 2004-07-20 2006-02-02 Citizen Electronics Co Ltd Ｓｍｄ型側面実装部品

Also Published As

Publication number Publication date
US8016448B2 (en) 2011-09-13
US20090059117A1 (en) 2009-03-05
TW200919033A (en) 2009-05-01
JP2009058768A (ja) 2009-03-19

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