WO2009014029A1 - 封着材料、封着タブレット及び封着用ガラス組成物 - Google Patents

封着材料、封着タブレット及び封着用ガラス組成物 Download PDF

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Publication number
WO2009014029A1
WO2009014029A1 PCT/JP2008/062750 JP2008062750W WO2009014029A1 WO 2009014029 A1 WO2009014029 A1 WO 2009014029A1 JP 2008062750 W JP2008062750 W JP 2008062750W WO 2009014029 A1 WO2009014029 A1 WO 2009014029A1
Authority
WO
WIPO (PCT)
Prior art keywords
sealing
lamp base
sealing material
mass
glass composition
Prior art date
Application number
PCT/JP2008/062750
Other languages
English (en)
French (fr)
Inventor
Kentaro Ishihara
Original Assignee
Nippon Electric Glass Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008116550A external-priority patent/JP5344362B2/ja
Priority claimed from JP2008116597A external-priority patent/JP5344363B2/ja
Application filed by Nippon Electric Glass Co., Ltd. filed Critical Nippon Electric Glass Co., Ltd.
Priority to EP08778171A priority Critical patent/EP2168927A4/en
Publication of WO2009014029A1 publication Critical patent/WO2009014029A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/068—Glass compositions containing silica with less than 40% silica by weight containing boron containing rare earths
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/122—Silica-free oxide glass compositions containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J61/00—Gas-discharge or vapour-discharge lamps
    • H01J61/02—Details
    • H01J61/36—Seals between parts of vessels; Seals for leading-in conductors; Leading-in conductors
    • H01J61/361—Seals between parts of vessel
    • H01J61/363—End-disc seals or plug seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J61/00—Gas-discharge or vapour-discharge lamps
    • H01J61/02—Details
    • H01J61/36—Seals between parts of vessels; Seals for leading-in conductors; Leading-in conductors
    • H01J61/366—Seals for leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/32—Sealing leading-in conductors
    • H01J9/323—Sealing leading-in conductors into a discharge lamp or a gas-filled discharge device

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Glass Compositions (AREA)

Abstract

　封着材料４を介して、外管２とランプ基材５が封着されている。電流供給部材３は、ランプ基材５に挿入されて、封着材料４によりランプ基材５に固定されている。排気管６は、ランプ基材５に挿入されて、封着材料４によりランプ基材５に固定されている。外管２の内部には放電容器が配置されている。封着材料４は、体積％で、ガラス粉末３５～７５％、耐火性フィラー粉末２５～６５％を含有し、熱膨張係数が７０×１０－７／°C未満であり、ガラス粉末が、ガラス組成として、質量％で、Ｂｉ２Ｏ３　５５～８５％、Ｂ２Ｏ３　５～２０％、ＺｎＯ　１～１５％、ＳｉＯ２　０～７％含有するものである。
PCT/JP2008/062750 2007-07-20 2008-07-15 封着材料、封着タブレット及び封着用ガラス組成物 WO2009014029A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP08778171A EP2168927A4 (en) 2007-07-20 2008-07-15 SEALING MATERIAL, SEALING COMPRESSOR AND GLASS COMPOSITION FOR SEALED SEALING

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2007-189455 2007-07-20
JP2007189290 2007-07-20
JP2007189455 2007-07-20
JP2007-189290 2007-07-20
JP2008-116550 2008-04-28
JP2008116550A JP5344362B2 (ja) 2007-07-20 2008-04-28 封着材料および封着タブレット
JP2008116597A JP5344363B2 (ja) 2007-07-20 2008-04-28 封着用ガラス組成物
JP2008-116597 2008-04-28

Publications (1)

Publication Number Publication Date
WO2009014029A1 true WO2009014029A1 (ja) 2009-01-29

Family

ID=41718830

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062750 WO2009014029A1 (ja) 2007-07-20 2008-07-15 封着材料、封着タブレット及び封着用ガラス組成物

Country Status (2)

Country Link
EP (1) EP2168927A4 (ja)
WO (1) WO2009014029A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012035565A1 (en) * 2010-09-16 2012-03-22 Daunia Solar Cell S.R.L. Sealing agent with low softening temperature useful in the preparation of electronic devices
WO2012073662A1 (ja) * 2010-11-29 2012-06-07 セントラル硝子株式会社 無鉛低融点ガラス組成物
WO2016181736A1 (ja) * 2015-05-14 2016-11-17 日本電気硝子株式会社 ビスマス系ガラス粉末及びこれを用いた複合粉末材料
CN106663591A (zh) * 2014-07-18 2017-05-10 京瓷株式会社 发光装置
CN111556856A (zh) * 2017-11-28 2020-08-18 日立化成株式会社 密封材料和使用其的多层玻璃面板
CN114213025A (zh) * 2021-12-15 2022-03-22 西安赛尔电子材料科技有限公司 一种用于钽电容盖组封接玻璃的制备方法及封接工艺

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011130632A1 (en) * 2010-04-15 2011-10-20 Ferro Corporation Low-melting lead-free bismuth sealing glasses
JP5957847B2 (ja) * 2011-10-13 2016-07-27 セントラル硝子株式会社 ビスマス系ガラス組成物
EP2767518A4 (en) * 2011-10-14 2016-01-06 Asahi Glass Co Ltd GLASS FOR USE IN THE SPREADING LAYER OF AN ORGANIC LED ELEMENT, MULTILAYER SUBSTRATE FOR USE IN THE ORGANIC LED ELEMENT AND METHOD FOR PRODUCING THIS MULTILAYER SUBSTRATE, AND ORGANIC LED ELEMENT AND METHOD FOR THE PRODUCTION THEREOF
MY174696A (en) * 2013-02-25 2020-05-08 Saint Gobain Substrate for device having an organic light-emitting diode
CN105731803A (zh) * 2016-02-26 2016-07-06 中国建筑材料科学研究总院 一种铜封接玻璃粉及其制备方法及应用及电池的电极
WO2018070529A1 (ja) * 2016-10-13 2018-04-19 日本電気硝子株式会社 ビスマス系ガラス、ビスマス系ガラスの製造方法及び封着材料
GB201910100D0 (en) * 2019-07-15 2019-08-28 Johnson Matthey Plc Composition, paste and methods

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0517179A (ja) 1991-07-11 1993-01-26 Nippon Electric Glass Co Ltd 低融点低膨張性封着材料
JPH0624797A (ja) 1992-07-08 1994-02-01 Asahi Glass Co Ltd 接着又は封着用ガラス
JPH06263477A (ja) * 1993-03-12 1994-09-20 Nippon Seiki Co Ltd シ−ル構造
FR2794120A1 (fr) 1999-05-28 2000-12-01 Baruch Nachmansohn Verres de soudure a devitrification sans plomb ni autres materiaux toxiques
JP2002241143A (ja) 2001-02-09 2002-08-28 Ngk Insulators Ltd 封着用組成物
JP2003034550A (ja) * 2001-07-24 2003-02-07 Asahi Glass Co Ltd 無鉛ガラス、ガラスフリット、ガラスペースト、電子回路部品および電子回路
EP1291329A1 (en) 2000-05-11 2003-03-12 Matsushita Electric Industrial Co., Ltd. Glass composition, sealing glass for magnetic head and magnetic head
JP2003095697A (ja) * 2001-09-18 2003-04-03 Nihon Yamamura Glass Co Ltd 封着用組成物
JP2003128430A (ja) 2001-10-22 2003-05-08 Asahi Techno Glass Corp 無鉛ガラス組成物
WO2004037736A1 (ja) 2002-10-23 2004-05-06 Matsushita Electric Industrial Co., Ltd. 磁気ヘッド用ギャップ接合ガラスおよび磁気ヘッド
JP2004284934A (ja) * 2002-04-24 2004-10-14 Central Glass Co Ltd 無鉛低融点ガラス
EP1496025A1 (en) 2002-03-29 2005-01-12 Matsushita Electric Industrial Co., Ltd. Bismuth glass composition, and magnetic head and plasma display panel including the same as sealing member
US20060105898A1 (en) 2004-11-12 2006-05-18 Asahi Techno Glass Corporation Low melting glass, sealing composition and sealing paste
JP2007165551A (ja) * 2005-12-13 2007-06-28 Nippon Electric Glass Co Ltd 光学用キャップ部品
JP2008069033A (ja) * 2006-09-13 2008-03-27 Central Glass Co Ltd 無鉛低融点ガラス

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005000755A1 (ja) * 2003-06-27 2005-01-06 Yamato Electronic Co., Ltd. 封着加工用無鉛ガラス材とこれを用いた封着加工物及び封着加工方法
JP4900868B2 (ja) * 2004-12-14 2012-03-21 日本電気硝子株式会社 タブレット一体型排気管
JP5257824B2 (ja) * 2006-04-03 2013-08-07 日本電気硝子株式会社 非結晶性ガラスタブレットおよびタブレット一体型排気管

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0517179A (ja) 1991-07-11 1993-01-26 Nippon Electric Glass Co Ltd 低融点低膨張性封着材料
JPH0624797A (ja) 1992-07-08 1994-02-01 Asahi Glass Co Ltd 接着又は封着用ガラス
JPH06263477A (ja) * 1993-03-12 1994-09-20 Nippon Seiki Co Ltd シ−ル構造
FR2794120A1 (fr) 1999-05-28 2000-12-01 Baruch Nachmansohn Verres de soudure a devitrification sans plomb ni autres materiaux toxiques
EP1291329A1 (en) 2000-05-11 2003-03-12 Matsushita Electric Industrial Co., Ltd. Glass composition, sealing glass for magnetic head and magnetic head
JP2002241143A (ja) 2001-02-09 2002-08-28 Ngk Insulators Ltd 封着用組成物
JP2003034550A (ja) * 2001-07-24 2003-02-07 Asahi Glass Co Ltd 無鉛ガラス、ガラスフリット、ガラスペースト、電子回路部品および電子回路
JP2003095697A (ja) * 2001-09-18 2003-04-03 Nihon Yamamura Glass Co Ltd 封着用組成物
JP2003128430A (ja) 2001-10-22 2003-05-08 Asahi Techno Glass Corp 無鉛ガラス組成物
EP1496025A1 (en) 2002-03-29 2005-01-12 Matsushita Electric Industrial Co., Ltd. Bismuth glass composition, and magnetic head and plasma display panel including the same as sealing member
JP2004284934A (ja) * 2002-04-24 2004-10-14 Central Glass Co Ltd 無鉛低融点ガラス
WO2004037736A1 (ja) 2002-10-23 2004-05-06 Matsushita Electric Industrial Co., Ltd. 磁気ヘッド用ギャップ接合ガラスおよび磁気ヘッド
US20060105898A1 (en) 2004-11-12 2006-05-18 Asahi Techno Glass Corporation Low melting glass, sealing composition and sealing paste
JP2007165551A (ja) * 2005-12-13 2007-06-28 Nippon Electric Glass Co Ltd 光学用キャップ部品
JP2008069033A (ja) * 2006-09-13 2008-03-27 Central Glass Co Ltd 無鉛低融点ガラス

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2168927A4 *

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012035565A1 (en) * 2010-09-16 2012-03-22 Daunia Solar Cell S.R.L. Sealing agent with low softening temperature useful in the preparation of electronic devices
US8927445B2 (en) 2010-09-16 2015-01-06 Daunia Solar Cell S.R.L. Sealing agent with low softening temperature useful in the preparation of electronic devices
KR101811374B1 (ko) 2010-09-16 2017-12-22 다우니아 솔라 셀 에스.알.엘. 전자장치의 제조에 유용한 저 연화점의 실링제
WO2012073662A1 (ja) * 2010-11-29 2012-06-07 セントラル硝子株式会社 無鉛低融点ガラス組成物
JP2012116669A (ja) * 2010-11-29 2012-06-21 Central Glass Co Ltd 無鉛低融点ガラス組成物
CN106663591A (zh) * 2014-07-18 2017-05-10 京瓷株式会社 发光装置
EP3171389A4 (en) * 2014-07-18 2018-03-28 Kyocera Corporation Light-emitting device
CN106663591B (zh) * 2014-07-18 2018-09-28 京瓷株式会社 发光装置
WO2016181736A1 (ja) * 2015-05-14 2016-11-17 日本電気硝子株式会社 ビスマス系ガラス粉末及びこれを用いた複合粉末材料
CN111556856A (zh) * 2017-11-28 2020-08-18 日立化成株式会社 密封材料和使用其的多层玻璃面板
CN111556856B (zh) * 2017-11-28 2023-07-28 株式会社力森诺科 密封材料和使用其的多层玻璃面板
CN114213025A (zh) * 2021-12-15 2022-03-22 西安赛尔电子材料科技有限公司 一种用于钽电容盖组封接玻璃的制备方法及封接工艺

Also Published As

Publication number Publication date
EP2168927A4 (en) 2012-01-11
EP2168927A1 (en) 2010-03-31

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