JP7243449B2 - 光モジュール - Google Patents
光モジュール Download PDFInfo
- Publication number
- JP7243449B2 JP7243449B2 JP2019098133A JP2019098133A JP7243449B2 JP 7243449 B2 JP7243449 B2 JP 7243449B2 JP 2019098133 A JP2019098133 A JP 2019098133A JP 2019098133 A JP2019098133 A JP 2019098133A JP 7243449 B2 JP7243449 B2 JP 7243449B2
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- JP
- Japan
- Prior art keywords
- optical
- substrate
- connection structure
- component
- optical module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4272—Cooling with mounting substrates of high thermal conductivity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4244—Mounting of the optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Semiconductor Lasers (AREA)
Description
120 光コネクタ部
130 ヒートシンク
140 回路基板
150 光処理部
151 主基板
151a 配線
152 接続構造部
152a ビアパタン
152b 段差
160 ICチップ
170、175 放熱部材
180 電子部品
190 光ファイバ
210 光学部品
220 周辺部品
230 TEC
240 カバー
301 FPC
Claims (8)
- 接着材によって第1の面に光学部品が接着され、前記第1の面に搭載される部品から発生する熱を第2の面に伝達する第1の基板と、
前記第1の基板の前記第2の面に接触し、前記第1の基板の前記第1の面から前記第2の面に伝達された熱を放熱する放熱部材と、
前記第1の基板の前記第1の面側から立ち上がり、前記第1の基板の材料よりも熱伝導率が小さい材料からなる接続構造部と、
前記接続構造部と接合される第2の基板とを有し、
前記光学部品は、光信号が通過する光路を構成することを特徴とする光モジュール。 - 前記第1の基板は、
光信号と電気信号を相互に変換する周辺部品を搭載し、
前記接続構造部は、
前記周辺部品に入出力される電気信号を前記第2の基板へ伝達する導体部を有する
ことを特徴とする請求項1に記載の光モジュール。 - 前記第2の基板は、
前記第1の基板と対向する位置に電子部品を搭載する
ことを特徴とする請求項1に記載の光モジュール。 - 前記接続構造部によって支持され、前記光学部品を覆うカバー部材をさらに有する
ことを特徴とする請求項1に記載の光モジュール。 - 前記第1の基板に配置される配線と前記第2の基板に配置される配線とを接続する可撓性のフレキシブル基板をさらに有することを特徴とする請求項1に記載の光モジュール。
- 前記第1の基板に接触し、前記第1の基板に搭載される部品から発生する熱を放熱する放熱部材をさらに有することを特徴とする請求項1に記載の光モジュール。
- 前記接続構造部は、
前記第2の基板にリフロー実装されることを特徴とする請求項1に記載の光モジュール。 - 前記光学部品の実装は、前記接着材で1μm以下の位置誤差で行われることを特徴とする請求項1に記載の光モジュール。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019098133A JP7243449B2 (ja) | 2019-05-24 | 2019-05-24 | 光モジュール |
US16/849,474 US11710914B2 (en) | 2019-05-24 | 2020-04-15 | Optical module |
CN202010330373.0A CN111983758A (zh) | 2019-05-24 | 2020-04-24 | 光学模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019098133A JP7243449B2 (ja) | 2019-05-24 | 2019-05-24 | 光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020194019A JP2020194019A (ja) | 2020-12-03 |
JP7243449B2 true JP7243449B2 (ja) | 2023-03-22 |
Family
ID=73441820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019098133A Active JP7243449B2 (ja) | 2019-05-24 | 2019-05-24 | 光モジュール |
Country Status (3)
Country | Link |
---|---|
US (1) | US11710914B2 (ja) |
JP (1) | JP7243449B2 (ja) |
CN (1) | CN111983758A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12029004B2 (en) | 2020-09-18 | 2024-07-02 | Nubis Communications, Inc. | Data processing systems including optical communication modules |
EP4356175A1 (en) * | 2021-06-17 | 2024-04-24 | Nubis Communications, Inc. | Communication systems having pluggable modules |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009011419A1 (ja) | 2007-07-19 | 2009-01-22 | Nec Corporation | 電子部品実装装置及びその製造方法 |
US20120014639A1 (en) | 2010-07-16 | 2012-01-19 | International Business Machines Corporation | Packaged multicore fiber optical transceiver module |
JP2012060125A (ja) | 2010-09-13 | 2012-03-22 | Tyco Electronics Svenska Holding Ab | 小型高速光モジュール |
JP2017041618A (ja) | 2015-08-21 | 2017-02-23 | 日本オクラロ株式会社 | 光モジュール |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2762792B2 (ja) * | 1991-08-30 | 1998-06-04 | 日本電気株式会社 | 光半導体装置 |
JP3450477B2 (ja) | 1994-12-20 | 2003-09-22 | 富士通株式会社 | 半導体装置及びその製造方法 |
JPH1051034A (ja) * | 1996-08-01 | 1998-02-20 | Rohm Co Ltd | 面実装型電子部品、その製造方法、これを回路基板上に実装する方法、およびこれを実装した回路基板 |
JP3916997B2 (ja) | 2002-04-30 | 2007-05-23 | スター精密株式会社 | 電気音響変換器 |
JP2005295752A (ja) * | 2004-04-02 | 2005-10-20 | Namiki Precision Jewel Co Ltd | 表面実装型振動モータ及びそれを搭載した携帯通信機器 |
JP2009105199A (ja) | 2007-10-23 | 2009-05-14 | Epson Toyocom Corp | 電子デバイス |
US9874688B2 (en) | 2012-04-26 | 2018-01-23 | Acacia Communications, Inc. | Co-packaging photonic integrated circuits and application specific integrated circuits |
US9306671B2 (en) * | 2012-12-07 | 2016-04-05 | Applied Optoelectronics, Inc. | Thermally isolated multi-channel transmitter optical subassembly and optical transceiver module including same |
JP2015029043A (ja) * | 2013-06-26 | 2015-02-12 | 京セラ株式会社 | 電子装置および光モジュール |
WO2015000591A2 (en) | 2013-07-03 | 2015-01-08 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Heat isolation structures for high bandwidth interconnects |
JP2015076489A (ja) * | 2013-10-08 | 2015-04-20 | 日立金属株式会社 | 光電気変換モジュールおよびそれを用いた伝送装置 |
JP2018077344A (ja) * | 2016-11-09 | 2018-05-17 | 富士通コンポーネント株式会社 | 光モジュール |
CN106847509B (zh) * | 2016-12-13 | 2018-07-13 | 厦门法拉电子股份有限公司 | 一种用于表面安装的聚丙烯薄膜电容器 |
JP6880777B2 (ja) * | 2017-01-27 | 2021-06-02 | 富士通株式会社 | 光モジュール |
US10720753B2 (en) * | 2018-08-13 | 2020-07-21 | Bae Systems Information And Electronic Systems Integration Inc. | Light emitting assembly and method thereof |
-
2019
- 2019-05-24 JP JP2019098133A patent/JP7243449B2/ja active Active
-
2020
- 2020-04-15 US US16/849,474 patent/US11710914B2/en active Active
- 2020-04-24 CN CN202010330373.0A patent/CN111983758A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009011419A1 (ja) | 2007-07-19 | 2009-01-22 | Nec Corporation | 電子部品実装装置及びその製造方法 |
US20120014639A1 (en) | 2010-07-16 | 2012-01-19 | International Business Machines Corporation | Packaged multicore fiber optical transceiver module |
JP2012060125A (ja) | 2010-09-13 | 2012-03-22 | Tyco Electronics Svenska Holding Ab | 小型高速光モジュール |
JP2017041618A (ja) | 2015-08-21 | 2017-02-23 | 日本オクラロ株式会社 | 光モジュール |
Also Published As
Publication number | Publication date |
---|---|
JP2020194019A (ja) | 2020-12-03 |
US20200373691A1 (en) | 2020-11-26 |
CN111983758A (zh) | 2020-11-24 |
US11710914B2 (en) | 2023-07-25 |
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