WO2007118831A3 - Elektronisches bauelementmodul - Google Patents
Elektronisches bauelementmodul Download PDFInfo
- Publication number
- WO2007118831A3 WO2007118831A3 PCT/EP2007/053523 EP2007053523W WO2007118831A3 WO 2007118831 A3 WO2007118831 A3 WO 2007118831A3 EP 2007053523 W EP2007053523 W EP 2007053523W WO 2007118831 A3 WO2007118831 A3 WO 2007118831A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- component module
- cooling arrangement
- circuit board
- module
- Prior art date
Links
- 238000001816 cooling Methods 0.000 abstract 4
- 239000002918 waste heat Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48235—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a via metallisation of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06589—Thermal management, e.g. cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07727991A EP2008305A2 (de) | 2006-04-19 | 2007-04-11 | Elektronisches bauelementmodul |
CN2007800137892A CN101427371B (zh) | 2006-04-19 | 2007-04-11 | 电子部件模块 |
JP2009505850A JP4940295B2 (ja) | 2006-04-19 | 2007-04-11 | 電子素子モジュール |
KR20087028133A KR101478518B1 (ko) | 2006-04-19 | 2007-04-11 | 전자 컴포넌트 모듈 |
US12/226,471 US8164904B2 (en) | 2006-04-19 | 2007-04-11 | Electronic component module |
CA002650547A CA2650547A1 (en) | 2006-04-19 | 2007-04-11 | Electronic component module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006018161.1 | 2006-04-19 | ||
DE102006018161A DE102006018161A1 (de) | 2006-04-19 | 2006-04-19 | Elektronisches Bauelementmodul |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007118831A2 WO2007118831A2 (de) | 2007-10-25 |
WO2007118831A3 true WO2007118831A3 (de) | 2008-02-21 |
Family
ID=38536633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2007/053523 WO2007118831A2 (de) | 2006-04-19 | 2007-04-11 | Elektronisches bauelementmodul |
Country Status (9)
Country | Link |
---|---|
US (1) | US8164904B2 (de) |
EP (1) | EP2008305A2 (de) |
JP (1) | JP4940295B2 (de) |
KR (1) | KR101478518B1 (de) |
CN (1) | CN101427371B (de) |
CA (1) | CA2650547A1 (de) |
DE (1) | DE102006018161A1 (de) |
TW (1) | TW200810677A (de) |
WO (1) | WO2007118831A2 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2951019B1 (fr) * | 2009-10-07 | 2012-06-08 | Valeo Etudes Electroniques | Module de puissance pour vehicule automobile |
WO2011043493A1 (ja) * | 2009-10-08 | 2011-04-14 | 日本電気株式会社 | 半導体装置 |
JP5709218B2 (ja) * | 2009-11-27 | 2015-04-30 | 日本電気株式会社 | 半導体装置、3次元実装型半導体装置、半導体モジュール、電子機器、及びその製造方法 |
JP5740903B2 (ja) * | 2010-10-19 | 2015-07-01 | 富士通株式会社 | 電子装置、半導体装置、サーマルインターポーザ及びその製造方法 |
CN103930991B (zh) * | 2011-12-08 | 2018-05-22 | 富士电机株式会社 | 半导体器件及半导体器件制造方法 |
AT515100B1 (de) * | 2013-12-20 | 2015-06-15 | F & S Vermögensverwaltungs Gmbh | Trägermodul mit Überbrückungselement für ein Halbleiterelement |
JP2018098927A (ja) * | 2016-12-14 | 2018-06-21 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
US10928880B2 (en) | 2017-06-23 | 2021-02-23 | Dell Products L.P. | Power storage adapter for communicating battery data with a portable information handling system |
US10389154B2 (en) | 2017-06-23 | 2019-08-20 | Dell Products L.P. | Power storage adapter using a high efficiency charging method |
US10452102B2 (en) | 2017-06-23 | 2019-10-22 | Dell Products L.P. | Power delivery contract establishment in a power storage adapter |
US10978896B2 (en) | 2017-06-23 | 2021-04-13 | Dell Products L.P. | High efficiency power storage adapter |
US10381844B2 (en) | 2017-06-23 | 2019-08-13 | Dell Products L.P. | Sourcing power from a battery or AC-DC converter of a power storage adapter |
US10476288B2 (en) | 2017-06-23 | 2019-11-12 | Dell Products L.P. | Power storage adapter for peak shift operation with a portable information handling system |
US10608443B2 (en) | 2017-08-15 | 2020-03-31 | Dell Products L.P. | Battery management using battery temperature distribution |
US10642333B2 (en) | 2017-08-24 | 2020-05-05 | Dell Products L.P. | Power storage adapter for efficient supply of power of multiple portable information handling systems |
US10673271B2 (en) | 2017-09-01 | 2020-06-02 | Dell Products L.P. | Efficient charging of multiple portable information handling systems based on learned charging characteristics |
US10620679B2 (en) | 2017-09-01 | 2020-04-14 | Dell Products L.P. | Prioritizing supplying electrical power by a power storage adapter to connected devices |
US10404105B2 (en) | 2017-09-14 | 2019-09-03 | Dell Products L.P. | Power storage adapter for wireless power transmission |
US11513928B2 (en) | 2017-09-18 | 2022-11-29 | Dell Products L.P. | Power storage adapter with power cable validation |
US10714797B2 (en) | 2017-09-18 | 2020-07-14 | Dell Products L.P. | Multilayer thermal laminate with aerogel for battery cell enclosures |
US10488906B2 (en) | 2017-09-26 | 2019-11-26 | Dell Products L.P. | Power delivery based on temperature and other factors in a power storage adapter |
US10278279B1 (en) * | 2017-10-30 | 2019-04-30 | Dell Products L.P. | Transformer thermal radiator for power field effect transistors |
JP6693986B2 (ja) * | 2018-03-12 | 2020-05-13 | ファナック株式会社 | モータ駆動装置 |
EP3557614A1 (de) * | 2018-04-17 | 2019-10-23 | Siemens Aktiengesellschaft | Leistungsmodul mit einem leistungselektronischen bauelement auf einer substratplatte und leistungselektronische schaltung mit einem solchen leistungsmodul |
US11307368B2 (en) | 2020-04-07 | 2022-04-19 | Cisco Technology, Inc. | Integration of power and optics through cold plates for delivery to electronic and photonic integrated circuits |
EP3930115B1 (de) * | 2020-06-23 | 2024-05-22 | Eltek AS | Stromversorgungssystem mit einem passiven kühlsystem |
CN114914234A (zh) * | 2021-02-10 | 2022-08-16 | 华为技术有限公司 | 一种功率结构体和制备方法以及设备 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4894706A (en) * | 1985-02-14 | 1990-01-16 | Nippon Telegraph And Telephone Corporation | Three-dimensional packaging of semiconductor device chips |
EP0688053A1 (de) * | 1994-06-17 | 1995-12-20 | ABB Management AG | Niederinduktives Leistungshalbleitermodul |
US5943213A (en) * | 1997-11-03 | 1999-08-24 | R-Amtech International, Inc. | Three-dimensional electronic module |
US6075287A (en) * | 1997-04-03 | 2000-06-13 | International Business Machines Corporation | Integrated, multi-chip, thermally conductive packaging device and methodology |
DE19859739A1 (de) * | 1998-12-23 | 2000-07-06 | Bosch Gmbh Robert | Kühlvorrichtung, insbesondere zur Verwendung in einem elektronischen Steuergerät |
DE19950026A1 (de) * | 1999-10-09 | 2001-04-12 | Bosch Gmbh Robert | Leistungshalbleitermodul |
DE102004019443B3 (de) * | 2004-04-19 | 2005-08-11 | Siemens Ag | Leistungsmodul |
DE102004018477A1 (de) * | 2004-04-16 | 2005-11-03 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Halbleitermodul |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4630172A (en) * | 1983-03-09 | 1986-12-16 | Printed Circuits International | Semiconductor chip carrier package with a heat sink |
JPH0752762B2 (ja) * | 1985-01-07 | 1995-06-05 | 株式会社日立製作所 | 半導体樹脂パッケージ |
JPH04257286A (ja) * | 1991-02-08 | 1992-09-11 | Hitachi Cable Ltd | 複合プリント配線基板 |
JPH0888299A (ja) * | 1994-09-19 | 1996-04-02 | Fujitsu Ltd | 半導体装置 |
US5542175A (en) * | 1994-12-20 | 1996-08-06 | International Business Machines Corporation | Method of laminating and circuitizing substrates having openings therein |
JP2641041B2 (ja) * | 1995-03-01 | 1997-08-13 | 智 小野寺 | 集積回路の実装構造 |
US5557502A (en) * | 1995-03-02 | 1996-09-17 | Intel Corporation | Structure of a thermally and electrically enhanced plastic ball grid array package |
US5597643A (en) * | 1995-03-13 | 1997-01-28 | Hestia Technologies, Inc. | Multi-tier laminate substrate with internal heat spreader |
SE513352C2 (sv) * | 1998-10-26 | 2000-08-28 | Ericsson Telefon Ab L M | Kretskort och förfarande för framställning av kretskortet |
JP2000133745A (ja) * | 1998-10-27 | 2000-05-12 | Matsushita Electric Works Ltd | 半導体装置 |
JP3127149B2 (ja) * | 1999-03-19 | 2001-01-22 | 株式会社日立製作所 | 半導体装置 |
JP4142227B2 (ja) * | 2000-01-28 | 2008-09-03 | サンデン株式会社 | 車両用電動圧縮機のモータ駆動用インバータ装置 |
US6284982B1 (en) * | 2000-08-18 | 2001-09-04 | Ga-Tek Inc. | Method and component for forming an embedded resistor in a multi-layer printed circuit |
US6462950B1 (en) * | 2000-11-29 | 2002-10-08 | Nokia Mobile Phones Ltd. | Stacked power amplifier module |
US6518502B2 (en) * | 2001-05-10 | 2003-02-11 | Lamina Ceramics, In | Ceramic multilayer circuit boards mounted on a patterned metal support substrate |
US7095053B2 (en) * | 2003-05-05 | 2006-08-22 | Lamina Ceramics, Inc. | Light emitting diodes packaged for high temperature operation |
US8106505B2 (en) * | 2007-10-31 | 2012-01-31 | International Business Machines Corporation | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly |
-
2006
- 2006-04-19 DE DE102006018161A patent/DE102006018161A1/de not_active Withdrawn
-
2007
- 2007-04-11 WO PCT/EP2007/053523 patent/WO2007118831A2/de active Application Filing
- 2007-04-11 CA CA002650547A patent/CA2650547A1/en not_active Abandoned
- 2007-04-11 EP EP07727991A patent/EP2008305A2/de not_active Withdrawn
- 2007-04-11 KR KR20087028133A patent/KR101478518B1/ko not_active IP Right Cessation
- 2007-04-11 CN CN2007800137892A patent/CN101427371B/zh not_active Expired - Fee Related
- 2007-04-11 JP JP2009505850A patent/JP4940295B2/ja not_active Expired - Fee Related
- 2007-04-11 US US12/226,471 patent/US8164904B2/en not_active Expired - Fee Related
- 2007-04-17 TW TW096113450A patent/TW200810677A/zh unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4894706A (en) * | 1985-02-14 | 1990-01-16 | Nippon Telegraph And Telephone Corporation | Three-dimensional packaging of semiconductor device chips |
EP0688053A1 (de) * | 1994-06-17 | 1995-12-20 | ABB Management AG | Niederinduktives Leistungshalbleitermodul |
US6075287A (en) * | 1997-04-03 | 2000-06-13 | International Business Machines Corporation | Integrated, multi-chip, thermally conductive packaging device and methodology |
US5943213A (en) * | 1997-11-03 | 1999-08-24 | R-Amtech International, Inc. | Three-dimensional electronic module |
DE19859739A1 (de) * | 1998-12-23 | 2000-07-06 | Bosch Gmbh Robert | Kühlvorrichtung, insbesondere zur Verwendung in einem elektronischen Steuergerät |
DE19950026A1 (de) * | 1999-10-09 | 2001-04-12 | Bosch Gmbh Robert | Leistungshalbleitermodul |
DE102004018477A1 (de) * | 2004-04-16 | 2005-11-03 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Halbleitermodul |
DE102004019443B3 (de) * | 2004-04-19 | 2005-08-11 | Siemens Ag | Leistungsmodul |
Also Published As
Publication number | Publication date |
---|---|
KR101478518B1 (ko) | 2015-01-06 |
TW200810677A (en) | 2008-02-16 |
EP2008305A2 (de) | 2008-12-31 |
WO2007118831A2 (de) | 2007-10-25 |
CN101427371A (zh) | 2009-05-06 |
CA2650547A1 (en) | 2007-10-25 |
JP2009534822A (ja) | 2009-09-24 |
US20090097208A1 (en) | 2009-04-16 |
US8164904B2 (en) | 2012-04-24 |
CN101427371B (zh) | 2011-12-14 |
KR20090005190A (ko) | 2009-01-12 |
JP4940295B2 (ja) | 2012-05-30 |
DE102006018161A1 (de) | 2007-10-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2007118831A3 (de) | Elektronisches bauelementmodul | |
ATE557576T1 (de) | Leiterplatine mit elektronischem bauelement | |
WO2008157143A3 (en) | Edge connection structure for printed circuit boards | |
WO2006099936A3 (de) | Vorrichtung und verfahren zur bestimmung der temperatur eines kühlkörpers | |
WO2006015685A3 (de) | Bauteilanordnung mit optimierter montagefähigkeit | |
TW200706076A (en) | Printed wiring board | |
WO2007001505A3 (en) | Die module system and method | |
GB2437465B (en) | Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device, and electronic device using multilayer wiring board | |
SG153797A1 (en) | Circuit board | |
EP2071907A4 (de) | Flex-rigid-leiterplatte und verfahren zur herstellung der flex-rigid-leiterplatte | |
WO2006102876A3 (de) | Elektronische baugruppe | |
TW200943616A (en) | System and method for integrated waveguide packaging | |
EP2034806A4 (de) | Leiterplatteneinrichtung, verfahren zum verbinden von leiterplatten und schaltungssubstratmoduleinrichtung | |
TW200709766A (en) | Flexible circuit board with heat sink | |
WO2010048653A3 (de) | Verfahren zur integration eines elektronischen bauteils in eine leiterplatte | |
WO2007014801A3 (de) | Kühlsystem für elektronikgehäuse | |
WO2009011419A1 (ja) | 電子部品実装装置及びその製造方法 | |
TW200731885A (en) | Rigid-flexible printed circuit board and method of manufacturing the same | |
IN2014DN10155A (de) | ||
EP1555862A3 (de) | Verfahren zur Herstellung einer Leiterplatte mit eingebautem elektronischem Bauteil | |
TW200708239A (en) | Electronic system | |
TW200731881A (en) | Methods and devices for cooling printed circuit boards | |
TW200744431A (en) | Electronic device | |
WO2009054105A1 (ja) | 部品内蔵プリント配線基板およびその製造方法 | |
WO2009037833A1 (ja) | 立体プリント配線板およびその製造方法ならびに電子部品モジュール |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 2007727991 Country of ref document: EP |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 07727991 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 200780013789.2 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2009505850 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2650547 Country of ref document: CA |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020087028133 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12226471 Country of ref document: US |