WO2008133228A1 - Silicon-containing compound, curable composition and cured product - Google Patents

Silicon-containing compound, curable composition and cured product Download PDF

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Publication number
WO2008133228A1
WO2008133228A1 PCT/JP2008/057664 JP2008057664W WO2008133228A1 WO 2008133228 A1 WO2008133228 A1 WO 2008133228A1 JP 2008057664 W JP2008057664 W JP 2008057664W WO 2008133228 A1 WO2008133228 A1 WO 2008133228A1
Authority
WO
WIPO (PCT)
Prior art keywords
group
silicon
curable composition
containing compound
cured product
Prior art date
Application number
PCT/JP2008/057664
Other languages
French (fr)
Japanese (ja)
Inventor
Takashi Sueyoshi
Kenji Hara
Seiichi Saito
Original Assignee
Adeka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corporation filed Critical Adeka Corporation
Priority to KR1020097017297A priority Critical patent/KR101526862B1/en
Publication of WO2008133228A1 publication Critical patent/WO2008133228A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

Disclosed is a silicon-containing compound represented by the general formula (0) below. Also disclosed is a curable composition containing 0.01-20 parts by mass of an epoxy curable compound per 100 parts by mass of the silicon-containing compound. This curable composition enables to obtain a cured product having excellent heat resistance and flexibility. (In the general formula (0), Ra-Rg each represents a C1-12 saturated aliphatic hydrocarbon group or a C1-12 aromatic hydrocarbon group; Y represents a C2-4 alkylene group; Z represents a group represented by one of the formulae (2)-(6) shown above; K represents a number of 2-7; T represents a number of 1-7; P represents a number of 0-3; and M and N represent numbers satisfying the following relation: N:M = 1:1-1:100, with the total of all M's and all N's being not less than 15, which make the mass average molecular weight of the compound to be 3,000-1,000,000. In the formulae (2)-(6), Xa-Xc each represents a C1-8 alkanediyl group, a -COO- group or a single bond; Rh-Rj each represents a hydrogen atom or a methyl group; and r represents 0 or 1.)
PCT/JP2008/057664 2007-04-23 2008-04-21 Silicon-containing compound, curable composition and cured product WO2008133228A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020097017297A KR101526862B1 (en) 2007-04-23 2008-04-21 Silicon-containing compound, curable composition and cured product

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-112742 2007-04-23
JP2007112742A JP5248034B2 (en) 2007-04-23 2007-04-23 Silicon-containing compound, curable composition, and cured product

Publications (1)

Publication Number Publication Date
WO2008133228A1 true WO2008133228A1 (en) 2008-11-06

Family

ID=39925679

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057664 WO2008133228A1 (en) 2007-04-23 2008-04-21 Silicon-containing compound, curable composition and cured product

Country Status (5)

Country Link
JP (1) JP5248034B2 (en)
KR (1) KR101526862B1 (en)
CN (2) CN103936999B (en)
TW (1) TWI425028B (en)
WO (1) WO2008133228A1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011001911A1 (en) * 2009-07-01 2011-01-06 協立化学産業株式会社 Energy ray-curable epoxy resin composition having excellent fast curing properties
JP2012144678A (en) * 2011-01-14 2012-08-02 Adeka Corp Silicon-containing curable resin composition
WO2012153821A1 (en) * 2011-05-10 2012-11-15 住友電気工業株式会社 Optical fiber
JP2012237801A (en) * 2011-05-10 2012-12-06 Sumitomo Electric Ind Ltd Optical fiber
JP2013057732A (en) * 2011-09-07 2013-03-28 Adeka Corp Optical fiber
WO2013140601A1 (en) * 2012-03-23 2013-09-26 株式会社Adeka Silicon-containing curable resin composition
JP2014208826A (en) * 2009-11-09 2014-11-06 ダウ コーニング コーポレーションＤｏｗｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ Process for preparing clustered functional polyorganosiloxane, and method for use thereof
WO2015012141A1 (en) * 2013-07-24 2015-01-29 株式会社Adeka Curable resin composition
US9593209B2 (en) 2009-10-22 2017-03-14 Dow Corning Corporation Process for preparing clustered functional polyorganosiloxanes, and methods for their use
US9670392B2 (en) 2013-02-11 2017-06-06 Dow Corning Corporation Stable thermal radical curable silicone adhesive compositions
US9718925B2 (en) 2013-02-11 2017-08-01 Dow Corning Corporation Curable silicone compositions comprising clustered functional polyorganosiloxanes and silicone reactive diluents
US10370574B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Method for forming thermally conductive thermal radical cure silicone compositions
US10370572B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin
US10493723B2 (en) 2015-11-05 2019-12-03 Dow Silicones Corporation Branched polyorganosiloxanes and related curable compositions, methods, uses, and devices

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2412734A1 (en) 2009-03-23 2012-02-01 FUJIFILM Corporation Curable resin composition for cemented lenses, image pick-up lens, and process for produciton of image pick-up lens
JP5762876B2 (en) * 2011-08-03 2015-08-12 株式会社Adeka Epoxy resin curing agent and epoxy resin composition containing the epoxy resin curing agent
JP6135675B2 (en) * 2012-09-18 2017-05-31 Jnc株式会社 Epoxy and alkoxysilyl group-containing silsesquioxane and composition thereof
KR101768310B1 (en) * 2015-04-30 2017-08-16 삼성에스디아이 주식회사 Composition for window film, flexible window film prepared using the same and flexible display apparatus comprising the same
JPWO2019244531A1 (en) * 2018-06-21 2021-07-08 株式会社Adeka Manufacturing method of surface-treated aluminum nitride, surface-treated aluminum nitride, resin composition, and cured product
JP7021046B2 (en) * 2018-10-22 2022-02-16 信越化学工業株式会社 Additive-curable silicone composition, silicone cured product, and optical element
CN117777455B (en) * 2024-02-28 2024-05-10 山东同益光刻胶材料科技有限公司 Fluorine-containing polysiloxane, preparation method thereof, photoresist composition and application thereof

Citations (7)

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Publication number Priority date Publication date Assignee Title
JPH04226525A (en) * 1990-07-05 1992-08-17 General Electric Co <Ge> Epoxysiloxane/organic epoxy composition having high heat distortion temperature
JP2005133073A (en) * 2003-10-10 2005-05-26 Shin Etsu Chem Co Ltd Curing composition
JP2005523980A (en) * 2002-05-01 2005-08-11 ダウ・コーニング・コーポレイション Organohydrogen silicon compound
JP2005529989A (en) * 2002-05-01 2005-10-06 ダウ・コーニング・コーポレイション Composition with improved bath life
JP2006511645A (en) * 2002-12-20 2006-04-06 ダウ・コーニング・コーポレイション Branched polymers derived from organohydrogensilicon compounds
JP2006213762A (en) * 2005-02-01 2006-08-17 Asahi Kasei Corp Resin composition for sealing light-emitting element, light-emitting part, and display device given by using the light-emitting part
WO2007105556A1 (en) * 2006-03-10 2007-09-20 Adeka Corporation Curable composition for optical material and optical waveguide

Family Cites Families (5)

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JP3737279B2 (en) * 1998-05-20 2006-01-18 株式会社カネカ Curable composition
JP3633802B2 (en) * 1998-11-02 2005-03-30 株式会社カネカ Curable composition for light emitting display body sealing material and method for producing light emitting display body
JP3797527B2 (en) * 1999-02-15 2006-07-19 株式会社カネカ Adhesive composition
JP5225528B2 (en) * 2001-05-30 2013-07-03 株式会社Ａｄｅｋａ Method for producing silicon-containing polymer
JP5132027B2 (en) * 2004-05-12 2013-01-30 株式会社Ａｄｅｋａ Silicon-containing curable composition and cured product obtained by thermally curing the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04226525A (en) * 1990-07-05 1992-08-17 General Electric Co <Ge> Epoxysiloxane/organic epoxy composition having high heat distortion temperature
JP2005523980A (en) * 2002-05-01 2005-08-11 ダウ・コーニング・コーポレイション Organohydrogen silicon compound
JP2005529989A (en) * 2002-05-01 2005-10-06 ダウ・コーニング・コーポレイション Composition with improved bath life
JP2006511645A (en) * 2002-12-20 2006-04-06 ダウ・コーニング・コーポレイション Branched polymers derived from organohydrogensilicon compounds
JP2005133073A (en) * 2003-10-10 2005-05-26 Shin Etsu Chem Co Ltd Curing composition
JP2006213762A (en) * 2005-02-01 2006-08-17 Asahi Kasei Corp Resin composition for sealing light-emitting element, light-emitting part, and display device given by using the light-emitting part
WO2007105556A1 (en) * 2006-03-10 2007-09-20 Adeka Corporation Curable composition for optical material and optical waveguide

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011001911A1 (en) * 2009-07-01 2011-01-06 協立化学産業株式会社 Energy ray-curable epoxy resin composition having excellent fast curing properties
KR101671047B1 (en) * 2009-07-01 2016-10-31 교리쯔 가가꾸 산교 가부시키가이샤 Energy ray-curable epoxy resin composition having excellent fast curing properties
JP5736568B2 (en) * 2009-07-01 2015-06-17 協立化学産業株式会社 Energy ray curable epoxy resin composition excellent in rapid curing
US9593209B2 (en) 2009-10-22 2017-03-14 Dow Corning Corporation Process for preparing clustered functional polyorganosiloxanes, and methods for their use
JP2016153512A (en) * 2009-11-09 2016-08-25 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ Process for preparing clustered functional polyorganosiloxanes, and methods for their use
JP2014208826A (en) * 2009-11-09 2014-11-06 ダウ コーニング コーポレーションＤｏｗｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ Process for preparing clustered functional polyorganosiloxane, and method for use thereof
JP2012144678A (en) * 2011-01-14 2012-08-02 Adeka Corp Silicon-containing curable resin composition
WO2012153821A1 (en) * 2011-05-10 2012-11-15 住友電気工業株式会社 Optical fiber
JP2012237801A (en) * 2011-05-10 2012-12-06 Sumitomo Electric Ind Ltd Optical fiber
US9297950B2 (en) 2011-05-10 2016-03-29 Sumitomo Electric Industries, Ltd. Optical fiber
JP2013057732A (en) * 2011-09-07 2013-03-28 Adeka Corp Optical fiber
WO2013140601A1 (en) * 2012-03-23 2013-09-26 株式会社Adeka Silicon-containing curable resin composition
US9670392B2 (en) 2013-02-11 2017-06-06 Dow Corning Corporation Stable thermal radical curable silicone adhesive compositions
US9718925B2 (en) 2013-02-11 2017-08-01 Dow Corning Corporation Curable silicone compositions comprising clustered functional polyorganosiloxanes and silicone reactive diluents
US10370574B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Method for forming thermally conductive thermal radical cure silicone compositions
US10370572B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin
WO2015012141A1 (en) * 2013-07-24 2015-01-29 株式会社Adeka Curable resin composition
JPWO2015012141A1 (en) * 2013-07-24 2017-03-02 株式会社Adeka Curable resin composition
US10493723B2 (en) 2015-11-05 2019-12-03 Dow Silicones Corporation Branched polyorganosiloxanes and related curable compositions, methods, uses, and devices

Also Published As

Publication number Publication date
TWI425028B (en) 2014-02-01
KR101526862B1 (en) 2015-06-08
KR20090129990A (en) 2009-12-17
CN101616962A (en) 2009-12-30
CN103936999B (en) 2016-08-17
CN103936999A (en) 2014-07-23
JP5248034B2 (en) 2013-07-31
TW200911886A (en) 2009-03-16
JP2008266485A (en) 2008-11-06

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