WO2008129963A1 - 半導体発光素子およびその製造方法 - Google Patents

半導体発光素子およびその製造方法 Download PDF

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Publication number
WO2008129963A1
WO2008129963A1 PCT/JP2008/057176 JP2008057176W WO2008129963A1 WO 2008129963 A1 WO2008129963 A1 WO 2008129963A1 JP 2008057176 W JP2008057176 W JP 2008057176W WO 2008129963 A1 WO2008129963 A1 WO 2008129963A1
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WIPO (PCT)
Prior art keywords
layer
metal
emitting device
semiconductor light
gaas
Prior art date
Application number
PCT/JP2008/057176
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English (en)
French (fr)
Inventor
Masakazu Takao
Mitsuhiko Sakai
Kazuhiko Senda
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Rohm Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to EP08740273.1A priority Critical patent/EP2139052B1/en
Priority to KR1020097023683A priority patent/KR101446370B1/ko
Priority to US12/596,004 priority patent/US8106412B2/en
Application filed by Rohm Co., Ltd. filed Critical Rohm Co., Ltd.
Publication of WO2008129963A1 publication Critical patent/WO2008129963A1/ja
Priority to US13/327,860 priority patent/US8536598B2/en
Priority to US14/286,696 priority patent/US9196808B2/en
Priority to US14/928,349 priority patent/US9450145B2/en
Priority to US15/248,332 priority patent/US9786819B2/en
Priority to US15/716,452 priority patent/US10032961B2/en
Priority to US16/015,282 priority patent/US10483435B2/en
Priority to US16/657,403 priority patent/US11616172B2/en
Priority to US18/169,555 priority patent/US20230197906A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46Reflective coating, e.g. dielectric Bragg reflector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/0004Devices characterised by their operation
    • H01L33/002Devices characterised by their operation having heterojunctions or graded gap
    • H01L33/0025Devices characterised by their operation having heterojunctions or graded gap comprising only AIIIBV compounds
    • HELECTRICITY
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H01L33/06Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/10Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
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    • H01L33/14Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
    • H01L33/145Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure with a current-blocking structure
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L33/20Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22Roughened surfaces, e.g. at the interface between epitaxial layers
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    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
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    • H01L33/36Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
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    • H01L33/58Optical field-shaping elements
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    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)

Abstract

 不透明な半導体基板を用いて、金属反射層を形成して高輝度の半導体発光素子およびその製造方法を提供する。  GaAs層3と、GaAs層の表面に配置された第1金属バッファ層2と、第1金属バッファ層上に配置された第1金属層1と、GaAs層の裏面に配置された第2金属バッファ層4と第2金属層5とを備えるGaAs基板構造と、GaAs基板構造上に配置され、第3金属層12と、第3金属層上に配置される金属コンタクト層11と、金属コンタクト層上に配置されるp型クラッド層10と、p型クラッド層に配置される多重量子井戸層9と、多重量子井戸層上に配置されるn型クラッド層8と、n型クラッド層上に配置されるウィンドウ層7を備える発光ダイオード構造とから構成され、第1金属層1および第3金属層12を用いて、GaAs基板構造と、発光ダイオード構造を貼り付けることを特徴とする。
PCT/JP2008/057176 2007-04-16 2008-04-11 半導体発光素子およびその製造方法 WO2008129963A1 (ja)

Priority Applications (11)

Application Number Priority Date Filing Date Title
EP08740273.1A EP2139052B1 (en) 2007-04-16 2008-04-11 Semiconductor light-emitting device and method for manufacturing the same
KR1020097023683A KR101446370B1 (ko) 2007-04-16 2008-04-11 반도체 발광 소자 및 그 제조 방법
US12/596,004 US8106412B2 (en) 2007-04-16 2008-04-11 Semiconductor light emitting device and fabrication method for the same
US13/327,860 US8536598B2 (en) 2007-04-16 2011-12-16 Semiconductor light emitting device and fabrication method for the same
US14/286,696 US9196808B2 (en) 2007-04-16 2014-05-23 Semiconductor light emitting device
US14/928,349 US9450145B2 (en) 2007-04-16 2015-10-30 Semiconductor light emitting device
US15/248,332 US9786819B2 (en) 2007-04-16 2016-08-26 Semiconductor light emitting device
US15/716,452 US10032961B2 (en) 2007-04-16 2017-09-26 Semiconductor light emitting device
US16/015,282 US10483435B2 (en) 2007-04-16 2018-06-22 Semiconductor light emitting device
US16/657,403 US11616172B2 (en) 2007-04-16 2019-10-18 Semiconductor light emitting device with frosted semiconductor layer
US18/169,555 US20230197906A1 (en) 2007-04-16 2023-02-15 Semiconductor light emitting device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007107130A JP5346443B2 (ja) 2007-04-16 2007-04-16 半導体発光素子およびその製造方法
JP2007-107130 2007-04-16

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/596,004 A-371-Of-International US8106412B2 (en) 2007-04-16 2008-04-11 Semiconductor light emitting device and fabrication method for the same
US13/327,860 Division US8536598B2 (en) 2007-04-16 2011-12-16 Semiconductor light emitting device and fabrication method for the same

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WO2008129963A1 true WO2008129963A1 (ja) 2008-10-30

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US (10) US8106412B2 (ja)
EP (1) EP2139052B1 (ja)
JP (1) JP5346443B2 (ja)
KR (1) KR101446370B1 (ja)
CN (2) CN101657912A (ja)
TW (1) TWI481065B (ja)
WO (1) WO2008129963A1 (ja)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5346443B2 (ja) * 2007-04-16 2013-11-20 ローム株式会社 半導体発光素子およびその製造方法
US20100176369A2 (en) * 2008-04-15 2010-07-15 Mark Oliver Metalized Silicon Substrate for Indium Gallium Nitride Light-Emitting Diodes
KR101363022B1 (ko) * 2008-12-23 2014-02-14 삼성디스플레이 주식회사 유기 발광 표시 장치
KR100999726B1 (ko) 2009-05-04 2010-12-08 엘지이노텍 주식회사 발광소자 및 그 제조방법
JP2011129724A (ja) * 2009-12-18 2011-06-30 Dowa Electronics Materials Co Ltd 半導体発光素子およびその製造方法
TW201145577A (en) * 2010-06-11 2011-12-16 Hon Hai Prec Ind Co Ltd Light-emitting diode unit and method for making it
CN102280552B (zh) * 2010-06-14 2015-06-03 鸿富锦精密工业(深圳)有限公司 发光二极管晶粒及其制作方法
US9269870B2 (en) 2011-03-17 2016-02-23 Epistar Corporation Light-emitting device with intermediate layer
US9601657B2 (en) * 2011-03-17 2017-03-21 Epistar Corporation Light-emitting device
US8686398B2 (en) 2012-03-02 2014-04-01 Kabushiki Kaisha Toshiba Semiconductor light emitting device
US9450152B2 (en) * 2012-05-29 2016-09-20 Micron Technology, Inc. Solid state transducer dies having reflective features over contacts and associated systems and methods
JP2014022401A (ja) 2012-07-12 2014-02-03 Toshiba Corp 窒化物半導体発光素子
JP5954185B2 (ja) * 2012-12-04 2016-07-20 日亜化学工業株式会社 半導体素子の製造方法
TWI613838B (zh) * 2014-03-06 2018-02-01 晶元光電股份有限公司 發光元件
CN104502878B (zh) * 2014-12-26 2018-07-31 中国电子科技集团公司第十三研究所 微波GaAs衬底在片S参数微带线TRL校准件
CN105785304B (zh) * 2016-05-11 2018-09-18 中国电子科技集团公司第十三研究所 用于校准在片高值电阻测量***的标准件
DE102017115252A1 (de) * 2017-07-07 2019-01-10 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Schichtstapels und Schichtstapel
US10522708B2 (en) 2017-12-14 2019-12-31 Lumileds Llc Method of preventing contamination of LED die
EP3724931B1 (en) * 2017-12-14 2023-02-15 Lumileds LLC Method of preventing contamination of led die
JP2021012936A (ja) * 2019-07-05 2021-02-04 株式会社ディスコ 光デバイスの移設方法
TWI763377B (zh) * 2021-03-16 2022-05-01 兆勁科技股份有限公司 發光元件

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302857A (ja) 1993-03-19 1994-10-28 Hewlett Packard Co <Hp> 発光ダイオードの製造方法
JPH09186365A (ja) * 1995-12-21 1997-07-15 Hewlett Packard Co <Hp> 発光半導体デバイス用高反射性接点及びその製造方法
JP2000277804A (ja) * 1995-06-15 2000-10-06 Nichia Chem Ind Ltd 窒化物半導体素子の製造方法及び窒化物半導体素子、並びに発光素子
JP2004146593A (ja) * 2002-10-24 2004-05-20 Rohm Co Ltd 半導体発光素子
WO2004051758A1 (ja) * 2002-11-29 2004-06-17 Sanken Electric Co., Ltd. 半導体発光素子及びその製造方法
JP2005123530A (ja) * 2003-10-20 2005-05-12 Shin Etsu Handotai Co Ltd 発光素子の製造方法
JP2005259820A (ja) * 2004-03-09 2005-09-22 Sharp Corp Iii−v族化合物半導体発光素子とその製造方法
JP2007012688A (ja) * 2005-06-28 2007-01-18 Toshiba Corp 半導体発光素子

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19537544A1 (de) * 1995-10-09 1997-04-10 Telefunken Microelectron Lumineszenzdiode mit verbesserter Lichtausbeute
US6608330B1 (en) * 1998-09-21 2003-08-19 Nichia Corporation Light emitting device
US6803596B2 (en) * 1999-12-27 2004-10-12 Sanyo Electric Co., Ltd. Light emitting device
US6586762B2 (en) * 2000-07-07 2003-07-01 Nichia Corporation Nitride semiconductor device with improved lifetime and high output power
US6803604B2 (en) * 2001-03-13 2004-10-12 Ricoh Company, Ltd. Semiconductor optical modulator, an optical amplifier and an integrated semiconductor light-emitting device
TW541710B (en) * 2001-06-27 2003-07-11 Epistar Corp LED having transparent substrate and the manufacturing method thereof
JP4833456B2 (ja) 2001-08-28 2011-12-07 古河電気工業株式会社 半導体デバイスの製造方法
US6784462B2 (en) 2001-12-13 2004-08-31 Rensselaer Polytechnic Institute Light-emitting diode with planar omni-directional reflector
JP3782357B2 (ja) 2002-01-18 2006-06-07 株式会社東芝 半導体発光素子の製造方法
DE10239045A1 (de) * 2002-08-26 2004-03-11 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines elektromagnetische Strahlung emittierenden Halbleiterchips und elektromagnetische Strahlung emittierender Halbleiterchip
US20050205886A1 (en) * 2002-11-29 2005-09-22 Sanken Electric Co., Ltd. Gallium-containing light-emitting semiconductor device and method of fabrication
JP2003282946A (ja) 2003-02-06 2003-10-03 Matsushita Electric Ind Co Ltd 発光ダイオード装置及びその製造方法
TWI230473B (en) 2003-03-10 2005-04-01 Sanken Electric Co Ltd Semiconductor light emitting device and manufacturing method thereof
US20040227151A1 (en) * 2003-03-31 2004-11-18 Hitachi Cable, Ltd. Light emitting diode
EP1697983B1 (en) * 2003-12-09 2012-06-13 The Regents of The University of California Highly efficient gallium nitride based light emitting diodes having surface roughening
TWM255518U (en) * 2004-04-23 2005-01-11 Super Nova Optoelectronics Cor Vertical electrode structure of Gallium Nitride based LED
JP4154731B2 (ja) * 2004-04-27 2008-09-24 信越半導体株式会社 発光素子の製造方法及び発光素子
US8049243B2 (en) * 2004-05-26 2011-11-01 Showa Denko K.K. Gallium nitride-based compound semiconductor light emitting device
US7508001B2 (en) * 2004-06-21 2009-03-24 Panasonic Corporation Semiconductor laser device and manufacturing method thereof
JP2006013381A (ja) 2004-06-29 2006-01-12 Shin Etsu Handotai Co Ltd 発光素子
KR20070038864A (ko) 2004-07-12 2007-04-11 로무 가부시키가이샤 반도체 발광소자
JP4592388B2 (ja) 2004-11-04 2010-12-01 シャープ株式会社 Iii−v族化合物半導体発光素子およびその製造方法
US8097897B2 (en) * 2005-06-21 2012-01-17 Epistar Corporation High-efficiency light-emitting device and manufacturing method thereof
US7951900B2 (en) 2005-06-17 2011-05-31 Eastman Chemical Company Dialysis filter housings comprising polyester compositions formed from 2,2,4,4-tetramethyl-1,3-cyclobutanediol and 1,4-cyclohexanedimethanol
JP4899348B2 (ja) * 2005-05-31 2012-03-21 信越半導体株式会社 発光素子の製造方法
WO2007015330A1 (ja) 2005-08-03 2007-02-08 Stanley Electric Co., Ltd. 半導体発光素子及びその製造方法
JP4362125B2 (ja) * 2006-03-15 2009-11-11 ローム株式会社 側面発光半導体素子及び側面発光半導体素子の製造方法
JP2008047672A (ja) * 2006-08-14 2008-02-28 Sumitomo Electric Ind Ltd 半導体光素子
JP4462251B2 (ja) * 2006-08-17 2010-05-12 日立電線株式会社 Iii−v族窒化物系半導体基板及びiii−v族窒化物系発光素子
JP4835377B2 (ja) 2006-10-20 2011-12-14 日立電線株式会社 半導体発光素子
JP5346443B2 (ja) * 2007-04-16 2013-11-20 ローム株式会社 半導体発光素子およびその製造方法
US8546818B2 (en) * 2007-06-12 2013-10-01 SemiLEDs Optoelectronics Co., Ltd. Vertical LED with current-guiding structure
JP5123573B2 (ja) * 2007-06-13 2013-01-23 ローム株式会社 半導体発光素子およびその製造方法
WO2009015386A1 (en) * 2007-07-26 2009-01-29 The Regents Of The University Of California Light emitting diodes with a p-type surface
US9634191B2 (en) * 2007-11-14 2017-04-25 Cree, Inc. Wire bond free wafer level LED
KR100975659B1 (ko) * 2007-12-18 2010-08-17 포항공과대학교 산학협력단 발광 소자 및 그 제조 방법
JP2009200178A (ja) * 2008-02-20 2009-09-03 Hitachi Cable Ltd 半導体発光素子
US8179937B2 (en) * 2009-01-08 2012-05-15 Quantum Electro Opto Systems Sdn. Bhd. High speed light emitting semiconductor methods and devices
JP4375497B1 (ja) * 2009-03-11 2009-12-02 住友電気工業株式会社 Iii族窒化物半導体素子、エピタキシャル基板、及びiii族窒化物半導体素子を作製する方法
US7906795B2 (en) * 2009-05-08 2011-03-15 Epistar Corporation Light-emitting device
JP2014120695A (ja) * 2012-12-19 2014-06-30 Rohm Co Ltd 半導体発光素子

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302857A (ja) 1993-03-19 1994-10-28 Hewlett Packard Co <Hp> 発光ダイオードの製造方法
US5376580A (en) 1993-03-19 1994-12-27 Hewlett-Packard Company Wafer bonding of light emitting diode layers
JP2004080042A (ja) * 1993-03-19 2004-03-11 Lumileds Lighting Us Llc 第2の発光ダイオード層に対する接合のための発光ダイオード層表面のパターン形成
JP2000277804A (ja) * 1995-06-15 2000-10-06 Nichia Chem Ind Ltd 窒化物半導体素子の製造方法及び窒化物半導体素子、並びに発光素子
JPH09186365A (ja) * 1995-12-21 1997-07-15 Hewlett Packard Co <Hp> 発光半導体デバイス用高反射性接点及びその製造方法
JP2004146593A (ja) * 2002-10-24 2004-05-20 Rohm Co Ltd 半導体発光素子
WO2004051758A1 (ja) * 2002-11-29 2004-06-17 Sanken Electric Co., Ltd. 半導体発光素子及びその製造方法
JP2005123530A (ja) * 2003-10-20 2005-05-12 Shin Etsu Handotai Co Ltd 発光素子の製造方法
JP2005259820A (ja) * 2004-03-09 2005-09-22 Sharp Corp Iii−v族化合物半導体発光素子とその製造方法
JP2007012688A (ja) * 2005-06-28 2007-01-18 Toshiba Corp 半導体発光素子

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2139052A4

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US20160365489A1 (en) 2016-12-15
EP2139052B1 (en) 2018-11-21
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