WO2008108131A1 - 熱硬化型ダイボンドフィルム - Google Patents
熱硬化型ダイボンドフィルム Download PDFInfo
- Publication number
- WO2008108131A1 WO2008108131A1 PCT/JP2008/051772 JP2008051772W WO2008108131A1 WO 2008108131 A1 WO2008108131 A1 WO 2008108131A1 JP 2008051772 W JP2008051772 W JP 2008051772W WO 2008108131 A1 WO2008108131 A1 WO 2008108131A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- die bonding
- bonding film
- thermosetting die
- thermosetting
- film
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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- H01L2924/3025—Electromagnetic shielding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800056620A CN101617395B (zh) | 2007-03-01 | 2008-02-04 | 热固化型芯片接合薄膜 |
US12/529,211 US7829441B2 (en) | 2007-03-01 | 2008-02-04 | Thermosetting die-bonding film |
KR1020097017946A KR101140512B1 (ko) | 2007-03-01 | 2008-02-04 | 열경화형 다이본드 필름 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-051767 | 2007-03-01 | ||
JP2007051767 | 2007-03-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008108131A1 true WO2008108131A1 (ja) | 2008-09-12 |
Family
ID=39738028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/051772 WO2008108131A1 (ja) | 2007-03-01 | 2008-02-04 | 熱硬化型ダイボンドフィルム |
Country Status (6)
Country | Link |
---|---|
US (1) | US7829441B2 (ja) |
JP (1) | JP5305501B2 (ja) |
KR (1) | KR101140512B1 (ja) |
CN (1) | CN101617395B (ja) |
TW (1) | TWI372173B (ja) |
WO (1) | WO2008108131A1 (ja) |
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US20100314782A1 (en) * | 2009-06-15 | 2010-12-16 | Nitto Denko Corporation | Dicing tape-integrated film for semiconductor back surface |
CN102010677A (zh) * | 2009-09-07 | 2011-04-13 | 日东电工株式会社 | 热固型芯片接合薄膜、切割/芯片接合薄膜及半导体装置 |
CN102153956A (zh) * | 2009-11-26 | 2011-08-17 | 日东电工株式会社 | 热固型胶粘薄膜、带有切割薄膜的胶粘薄膜、以及使用它们制造半导体装置的方法 |
CN102399505A (zh) * | 2010-09-13 | 2012-04-04 | 日东电工株式会社 | 切割/芯片接合薄膜 |
US20120114934A1 (en) * | 2009-05-13 | 2012-05-10 | Megumi Kodama | Bonding sheet |
JP2018182275A (ja) * | 2017-04-17 | 2018-11-15 | 日東電工株式会社 | ダイシングダイボンドフィルム |
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KR20150087222A (ko) * | 2012-11-20 | 2015-07-29 | 후루카와 덴키 고교 가부시키가이샤 | 반도체 칩의 제조방법 및 이것에 이용되는 박막 연삭용 표면 보호 테이프 |
TWI516530B (zh) * | 2013-03-22 | 2016-01-11 | Lintec Corp | A film for forming a protective film, and a composite sheet for forming a protective film |
JP2014216488A (ja) * | 2013-04-25 | 2014-11-17 | 日東電工株式会社 | 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置 |
JP6033734B2 (ja) * | 2013-04-30 | 2016-11-30 | 日東電工株式会社 | フィルム状接着剤、ダイシングテープ一体型フィルム状接着剤、及び、半導体装置の製造方法 |
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JP6791701B2 (ja) * | 2016-09-28 | 2020-11-25 | 日東電工株式会社 | ダイシングダイボンディングテープおよび半導体装置の製造方法 |
CN110383438B (zh) * | 2017-02-28 | 2022-11-08 | 琳得科株式会社 | 粘合片 |
JP7438741B2 (ja) * | 2019-12-13 | 2024-02-27 | 日東電工株式会社 | 半導体プロセスシート |
JP2021097156A (ja) | 2019-12-18 | 2021-06-24 | 日東電工株式会社 | ダイボンドシート、及び、ダイシングダイボンドフィルム |
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- 2008-02-04 WO PCT/JP2008/051772 patent/WO2008108131A1/ja active Application Filing
- 2008-02-04 KR KR1020097017946A patent/KR101140512B1/ko active IP Right Grant
- 2008-02-04 CN CN2008800056620A patent/CN101617395B/zh active Active
- 2008-02-04 US US12/529,211 patent/US7829441B2/en not_active Expired - Fee Related
- 2008-02-18 TW TW097105552A patent/TWI372173B/zh active
- 2008-02-26 JP JP2008044520A patent/JP5305501B2/ja active Active
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JP2006261657A (ja) * | 2005-02-21 | 2006-09-28 | Nitto Denko Corp | 半導体装置の製造方法 |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120114934A1 (en) * | 2009-05-13 | 2012-05-10 | Megumi Kodama | Bonding sheet |
US20100314782A1 (en) * | 2009-06-15 | 2010-12-16 | Nitto Denko Corporation | Dicing tape-integrated film for semiconductor back surface |
CN102010677A (zh) * | 2009-09-07 | 2011-04-13 | 日东电工株式会社 | 热固型芯片接合薄膜、切割/芯片接合薄膜及半导体装置 |
CN102153956A (zh) * | 2009-11-26 | 2011-08-17 | 日东电工株式会社 | 热固型胶粘薄膜、带有切割薄膜的胶粘薄膜、以及使用它们制造半导体装置的方法 |
CN102153956B (zh) * | 2009-11-26 | 2016-06-01 | 日东电工株式会社 | 热固型胶粘薄膜、带有切割薄膜的胶粘薄膜、以及使用它们制造半导体装置的方法 |
CN102399505A (zh) * | 2010-09-13 | 2012-04-04 | 日东电工株式会社 | 切割/芯片接合薄膜 |
US9123794B2 (en) | 2010-09-13 | 2015-09-01 | Nitto Denko Corporation | Dicing die bond film |
JP2018182275A (ja) * | 2017-04-17 | 2018-11-15 | 日東電工株式会社 | ダイシングダイボンドフィルム |
JP7019333B2 (ja) | 2017-04-17 | 2022-02-15 | 日東電工株式会社 | ダイシングダイボンドフィルム |
Also Published As
Publication number | Publication date |
---|---|
TW200846437A (en) | 2008-12-01 |
CN101617395B (zh) | 2011-08-17 |
JP5305501B2 (ja) | 2013-10-02 |
US7829441B2 (en) | 2010-11-09 |
KR20090107557A (ko) | 2009-10-13 |
TWI372173B (en) | 2012-09-11 |
KR101140512B1 (ko) | 2012-04-30 |
JP2008244463A (ja) | 2008-10-09 |
CN101617395A (zh) | 2009-12-30 |
US20100081258A1 (en) | 2010-04-01 |
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