WO2005004216A1 - ダイシング・ダイボンド用粘接着シートおよび半導体装置の製造方法 - Google Patents
ダイシング・ダイボンド用粘接着シートおよび半導体装置の製造方法 Download PDFInfo
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- WO2005004216A1 WO2005004216A1 PCT/JP2004/009629 JP2004009629W WO2005004216A1 WO 2005004216 A1 WO2005004216 A1 WO 2005004216A1 JP 2004009629 W JP2004009629 W JP 2004009629W WO 2005004216 A1 WO2005004216 A1 WO 2005004216A1
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- Prior art keywords
- dicing
- adhesive layer
- die
- adhesive
- adhesive sheet
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01025—Manganese [Mn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Definitions
- the present invention relates to a novel dicing adhesive sheet for die bonding. More specifically, the present invention relates to a dicing die-bonding adhesive sheet particularly suitable for use in a step of dicing a silicon wafer or the like and die bonding to a die pad portion of a substrate such as a lead frame.
- Patent Documents 13 to 13 disclose an adhesive sheet composed of an adhesive layer made of a specific composition and a base material.
- This adhesive layer has a function of fixing the wafer during wafer dicing, and can control the adhesive force between the substrate and the base material.
- the agent layer peels off together with the chip.
- the thermosetting resin in the adhesive layer develops an adhesive force, and the bonding between the IC chip and the substrate is completed.
- the adhesive sheet disclosed in the above-mentioned patent documents enables so-called direct die bonding, and can omit a step of applying a die bonding adhesive. That is, in the adhesive layer of the adhesive sheet described above, all components are cured after die bonding after energy beam curing and thermal curing, and the chip and the substrate are bonded very firmly.
- IC package structures have become diversified, and various characteristics have been developed in accordance with the structure. It is becoming required.
- the structure of the die pad on which the chip is mounted is also diversified, and irregularities with a height difference of about 5-20 / m may be formed on the die pad due to copper wiring and solder resist.
- the adhesive is not embedded densely due to the unevenness of the die pad, and the die pad and the adhesive layer are not embedded. Voids may be generated between them.
- Patent Document 1 JP-A-2-32181
- Patent Document 2 JP-A-8-239636
- Patent Document 3 JP-A-10-8001
- the present invention has been made in view of the above-described conventional technology, and even when a chip is mounted on a die pad portion having a large height difference, a void is formed between the die pad portion and the adhesive layer.
- An object of the present invention is to provide a dicing 'adhesive sheet for die bonding having an adhesive layer excellent in embedding property at the time of die bonding.
- the dicing / adhesive sheet for die bonding according to the present invention has an elastic modulus (M) at 100 ° C.
- An adhesive layer with a ratio (M / M) of 0.5 or less to the elastic modulus (M) at 70 ° C is on the substrate
- the adhesive layer comprises a pressure-sensitive adhesive component composed of an acrylic polymer having a weight average molecular weight of 30,000 500,000 and a thermosetting component. Further, the acrylic polymer preferably contains a repeating unit derived from butyl acetate at a ratio of 550% by mass.
- the adhesive layer contains a thermoplastic resin having a glass transition temperature of 60 to 150 ° C.
- the weight ratio of the acrylic polymer to the thermoplastic resin is preferably 9/1 to 13/7.
- the surface tension of the surface of the substrate in contact with the adhesive layer is 40 mNZm The following is preferred.
- the method for manufacturing a semiconductor device includes the steps of: adhering a semiconductor wafer to the adhesive layer of the dicing die-bonding adhesive sheet; dicing the semiconductor wafer; The adhesive layer is fixedly left on the IC chip, the base material is peeled off, and the IC chip is thermocompression-bonded onto a die pad portion via the adhesive layer.
- the adhesive layer has an excellent filling property under the die bonding conditions with respect to the irregularities of the die pad portion, so that the height difference Even when a chip is mounted on a large die pad portion, it is possible to contribute to an improvement in production efficiency without generating a void between the die pad portion and the adhesive layer.
- the dicing 'adhesive sheet for die bonding comprises a base material and an adhesive layer formed thereon, and has an elastic modulus at 100 ° C of the adhesive layer ( M) and elasticity at 70 ° C
- the ratio (M / M) to the ratio (M) is 0.5 or less, preferably 0.4 or less, more preferably 0.1 or less.
- the lower limit of the elastic modulus (M) at 70 ° C of the adhesive layer is preferably 5000 Pa.
- the upper limit of the elastic modulus (M) at 100 ° C is
- It is preferably 4000 Pa, and more preferably 3000 Pa.
- the adhesive layer has a pressure-sensitive adhesive property and a thermosetting property
- the above elastic modulus means an elastic modulus before thermosetting.
- the adhesive layer may further have energy ray curability.
- the elastic modulus means an elastic modulus after energy ray curing and before thermal curing.
- this adhesive layer has a significantly lower elastic modulus at 100 ° C. than the elastic modulus at 70 ° C. This means that the adhesive layer is fluidized in the high temperature region.
- die bonding of a semiconductor chip is performed under heating of 100 ° C or more, and other operations are performed at normal temperature. Therefore, the above-mentioned adhesive layer is fluidized under die bonding conditions, so that it is sufficiently filled into the irregularities of the die pad portion, and the void is formed. Can be prevented.
- the adhesive layer maintains a certain degree of elasticity, so that it adheres well to the chip, and the operability in the dicing process and the pickup process is not impaired.
- the adhesive layer basically comprises an adhesive component (A) and a thermosetting component (B), and may contain a thermoplastic resin (C). Also, if necessary, the energy ray-curable component (A)
- an acrylic polymer is usually preferably used as the adhesive component (A).
- the repeating unit of the acrylic polymer includes a repeating unit derived from a (meth) acrylate monomer and a (meth) atalinoleic acid derivative.
- the (meth) acrylic ester monomer there are used cycloalkyl (meth) acrylate, benzyl (meth) acrylate, and alkyl (meth) acrylate having an alkyl group of 118 carbon atoms. .
- alkyl (meth) acrylates in which the alkyl group has 118 carbon atoms such as methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, and methacrylic acid are particularly preferred.
- Propyl acrylate, butyl acrylate, butyl methacrylate and the like are used.
- the (meth) acrylic acid derivative include glycidyl (meth) acrylate.
- a copolymer containing a glycidyl (meth) acrylate unit and at least one alkyl (meth) acrylate unit is preferable.
- the content of the component unit derived from glycidyl (meth) acrylate in the copolymer is usually 0 to 80% by mass, preferably 550% by mass.
- alkyl (meth) acrylate it is preferable to use methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, or the like. Further, by introducing a hydroxyl group-containing monomer such as hydroxyethyl acrylate, it becomes easy to control the adhesion to the adherend and the adhesive properties.
- the weight average molecular weight of the acrylic polymer is 30,000 to 500,000, preferably 40,000. It is 0-400,000, more preferably 50,000-300,000. If the weight average molecular weight of the atalinole polymer is small, the value of M / M can be reduced.
- the acrylic polymer preferably has a vinyl acetate unit in a part of the repeating unit of the main chain.
- the acrylic polymer has repeating units of butyl acetate, the coating property of the coating solution for forming the adhesive layer is improved, and the generation of pinholes can be suppressed.
- the proportion of the repeating unit derived from butyl acetate in the acrylic polymer is preferably 550% by mass, more preferably 7.5 to 40% by mass, and particularly preferably 1030% by mass.
- thermosetting component (B) is not cured by energy rays, but has a property of forming a three-dimensional network when heated, and firmly bonding the adherend.
- a thermosetting component (B) is generally formed from a thermosetting resin such as epoxy, phenol, resorcinol, urea, melamine, furan, unsaturated polyester and silicone, and a suitable curing accelerator. It has been.
- Various such thermosetting components are known, and in the present invention, various conventionally known thermosetting components can be used without any particular limitation.
- An example of such a thermosetting component is an adhesive component comprising (B-1) an epoxy resin and (B-2) a heat-active latent epoxy resin curing agent.
- epoxy resin (B-1) various conventionally known epoxy resins are used, and usually those having a weight-average molecular weight of about 300 to 2000 are preferable, particularly 300 to 500, and more preferably. It is desirable to use a mixture of a 330400 normal liquid epoxy resin and a normal solid epoxy resin having a weight average molecular weight of 4002000, preferably 5001500.
- the epoxy equivalent of the epoxy resin preferably used in the present invention is usually 50 to 5000 g / eq.
- epoxy resin examples include glycidyl ethers of phenols such as bisphenol A, bisphenol F, resorcinol, phenol novolac, and cresol novolac; butanediol, polyethylene glycol, and polypropylene glycol.
- Glycidyl esters of carboxylic acids such as carboxylic acid and tetrahydrophthalic acid
- glycidyl-type or alkyl glycidyl-type epoxy resins in which active hydrogen bonded to a nitrogen atom such as aniline isocyanurate is substituted with a glycidyl group
- so-called alicyclic epoxides in which an epoxy is introduced by oxidizing a carbon-carbon double bond in a molecule, such as m_dioxane, can be given.
- a bisphenol-based glycidyl-type epoxy resin, a petalazole novolak-type epoxy resin, and a phenol novolak-type epoxy resin are preferably used.
- epoxy resins can be used alone or in combination of two or more.
- the heat-activated latent epoxy resin curing agent (B-2) is a type of curing agent that does not react with the epoxy resin at room temperature, is activated by heating at a certain temperature or higher, and reacts with the epoxy resin.
- the activation method of the heat-active latent epoxy resin curing agent (B-2) includes a method of generating active species (anion and cation) by a chemical reaction by heating; ) Method of initiating curing reaction by dispersing and dissolving in epoxy resin stably at high temperature; method of initiating curing reaction by eluting at high temperature with molecular sieve-encapsulated curing agent; microcapsules And the like.
- heat-active latent epoxy resin curing agents can be used alone or in combination of two or more.
- dicyandiamide, imidazole compounds or mixtures thereof are particularly preferred.
- the heat-active latent epoxy resin curing agent (B-2) as described above is usually 0.120 parts by mass, preferably 0.5 part by mass, based on 100 parts by mass of the epoxy resin (B-1). — Used in a proportion of 15 parts by mass, particularly preferably in a proportion of 110 parts by mass.
- the thermosetting component (B) is preferably 10-97 in 100 parts by mass of the total ((A) + (B)) of the pressure-sensitive adhesive component (A) and the thermosetting component (B). It is used in an amount of 30 parts by mass, more preferably 30 parts by mass, and particularly preferably 50 parts by mass.
- thermoplastic resin having a glass transition point at 60 to 150 ° C.
- the value of M / M can be reduced.
- polyester resin polybutyl alcohol resin, polybutyl butyral, polychlorinated vinyl, polystyrene, polyamide resin, cellulose, polyethylene, polyisobutylene, polybutyl ether, polyimide resin, phenoxy resin, polymethyl methacrylate, styrene-isoprene Styrene block copolymer, styrene-butadiene-styrene block copolymer and the like can be mentioned.
- a phenoxy resin is particularly preferred because of its excellent compatibility with other components of the adhesive layer.
- the mixing ratio of the thermoplastic resin (C) in the adhesive layer is preferably 1 to 50 parts by mass, more preferably 1 to 50 parts by mass, per 100 parts by mass of the total of the adhesive component (A) and the thermosetting component (B). Is used in a proportion of 2 to 40 parts by mass, particularly preferably 3 to 30 parts by mass.
- the weight ratio of the acrylic polymer to the thermoplastic resin (acrylic polymer / thermoplastic resin) is 9/1 It is preferably 3/7.
- the adhesive layer may optionally contain an energy ray-curable component (D).
- an energy ray-curable component (D) By curing the energy ray-curable component (D), the adhesive strength of the adhesive layer can be reduced, so that delamination between the substrate and the adhesive layer can be easily performed.
- the energy ray-curable component (D) is a compound that polymerizes and cures when irradiated with energy rays such as ultraviolet rays and electron beams.
- energy rays such as ultraviolet rays and electron beams.
- Specific examples of the energy ray polymerizable compound include trimethylolpropane triatalylate, tetramethylol methane tetraatalylate, and pentane.
- Such a compound has at least one polymerizable double bond in the molecule, and usually has a weight average molecular weight of 100 to 30,000, preferably about 300,000.
- a compound having a dicyclopentadiene skeleton can be used as another example of the energy ray polymerizable compound.
- the energy ray-curable component (D) is used in an amount of 0 to 50 parts by mass, preferably 0 to 30 parts by mass, particularly preferably 5 to 50 parts by mass, based on 100 parts by mass of the total of the components (A) and (B). Used at a rate of about 20 parts by mass.
- the adhesive composition containing the energy ray-curable component (D) as described above is cured by irradiation with energy.
- energy beam specifically, an ultraviolet ray, an electron beam, or the like is used.
- the polymerization curing time and the amount of light irradiation can be reduced by mixing a photopolymerization initiator.
- photopolymerization initiator examples include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, and benzoin benzoate.
- Acid benzoin dimethyl ketal, 2,4-getyl thioxanthone, ⁇ _hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethyl thiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl , ⁇ -chloranthraquinone or 2,4,6_trimethylbenzoyldiphenylphosphine oxide.
- the photopolymerization initiator is preferably used in a proportion of about 0.01 to 20 parts by mass, preferably about 0.1 to 15 parts by mass, based on 100 parts by mass of the energy ray-curable component (D). .
- "Other ingredients ( ⁇ )" A coupling agent (E1) may be blended in the adhesive layer.
- the coupling agent (E1) desirably has a group that reacts with the functional group of the component (A)-(D), preferably the component (B).
- the coupling agent (E1) is considered to react with the thermosetting component (B) (particularly preferably an epoxy resin) during the curing reaction, thereby impairing the heat resistance of the cured product.
- the adhesiveness and adhesion can be improved, and the water resistance (moisture and heat resistance) is also improved.
- the coupling agent (E1) a silane (silane coupling agent) is preferable from the viewpoint of its versatility and cost advantages.
- the coupling agent (E1) as described above is usually 0.120 parts by mass, preferably 0.315 parts by mass, particularly preferably 100 parts by mass of the thermosetting component (B). 0.5 Used in a proportion of 10 parts by mass.
- a crosslinking agent such as an organic polyvalent isocyanate compound or an organic polyvalent imine compound is used as the adhesive. You can add caroline.
- the organic polyvalent isocyanate compound includes an aromatic polyvalent isocyanate compound, an aliphatic polyvalent isocyanate compound, an alicyclic polyvalent isocyanate compound, and a polyvalent isocyanate compound. And the terminal isocyanate urethane prepolymer obtained by reacting the polyvalent isocyanate monohydrate compound with the polyol compound.
- organic polyvalent isocyanate-to-animate compound examples include, for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4 -Xylene diisocyanate, diphenylmethane-1,4'-diisocyanate, diphenylmethane-1,2,4, diisocyanate, 3-methyldiphenylmethanediisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane 1,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, lysine isocyanate and the like.
- organic polyvalent imine compound examples include ⁇ , ⁇ '-diphenylmethane-4,4, _bis (1_aziridinecarboxamide), trimethylolpropane-tri- ⁇ -aziridinylpropionate. , Tetramethylolmethane-tri- / 3-aziridinylpropionate, ⁇ , ⁇ , -toluene- 2,4-bis (1-aziridinecarboxamide) triethylenemelamine and the like.
- a conductive or thermally conductive filler such as nickel or aluminum coated with silver may be added.
- non-conductive fillers such as asbestos, silica, glass, mica, chromium oxide, titanium oxide, and pigment may be added. These fillers are blended at a ratio of about 0 to 400 parts by mass with respect to a total of 100 parts by mass of the components constituting the adhesive layer (excluding the filler). .
- the thickness of the adhesive layer composed of the above components is usually 3 to 100 x m, preferably 5 to 60 ⁇ m.
- the pressure-sensitive adhesive composed of the above components has pressure-sensitive adhesive properties and heat-curing properties, and adheres to the base material during dicing to contribute to the fixing of the wafer, and In this case, it can be used as an adhesive for bonding the chip and the die pad portion. Finally, a cured product with high impact resistance can be given through thermal curing, with excellent balance of shear strength and peel strength, and even under severe, hot and humid conditions. Sufficient adhesive properties can be maintained.
- An adhesive sheet for dicing and die bonding according to the present invention is obtained by laminating an adhesive layer on a substrate.
- the shape of the adhesive sheet for dicing and die bonding according to the present invention can take any shape such as a tape shape and a label shape.
- the substrate of the dicing adhesive sheet for die bonding includes, for example, polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polychlorinated vinyl film, vinyl chloride copolymer film, polyethylene Terephthalate finolem, polyethylene naphthalate finolem, polybutylene terephthalate finolem, polyurethane film, ethylene vinyl acetate film, ionomer resin film, ethylene (meth) acrylic acid copolymer film, ethylene (meth) acrylic acid ester copolymer Transparent films such as polymer films, polystyrene films, polycarbonate films, and polyimide films are used. These crosslinked films can also be used. In addition these products It may be a layer film. Further, in addition to the above-mentioned transparent films, opaque films or fluororesin films obtained by coloring them can be used.
- the surface tension of the surface of the substrate in contact with the adhesive layer is preferably 40 mN / m or less, more preferably 37 mN / m or less, and particularly preferably 35 mN / m or less.
- a substrate having a low surface tension can be obtained by appropriately selecting the material, or can be obtained by applying a release agent to the surface of the substrate and subjecting the substrate to a release treatment. .
- alkyd, silicone, fluorine, unsaturated polyester, polyolefin, wax, etc. are used as the release agent used for the release treatment of the base material.
- alkyd, silicone, fluorine are preferred because they have heat resistance.
- an alkyd resin is preferable because the adhesion to the substrate is high and the surface tension is easily adjusted.
- the release agent is used without solvent, or is diluted with a solvent or emulsified, and then a gravure coater, a Meyer bar coater, an air knife coater, or the like.
- the coating may be applied by a roll coater or the like and cured at room temperature or by heating or electron beam, or a laminate may be formed by wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, co-extrusion processing, or the like.
- the film thickness of the substrate is usually 10 to 500 / im, preferably 15 to 300 ⁇ m, and particularly preferably 2 to 500 ⁇ m.
- the method for producing the dicing 'adhesive sheet for die bonding is not particularly limited, and may be produced by applying and drying a composition constituting an adhesive layer on a substrate.
- the adhesive layer may be provided on a release film and then transferred to the base material to produce the adhesive layer.
- a release film may be laminated on the upper surface of the adhesive layer in order to protect the adhesive layer.
- a ring frame fixing adhesive sheet for fixing the ring frame may be provided on the outer peripheral portion of the surface of the adhesive layer.
- the dicing adhesive / bonding sheet for dicing according to the present invention is fixed on a dicing apparatus by a ring frame, and one surface of the silicon wafer is diced. Place on the adhesive layer of the adhesive sheet for die bonding and press lightly to fix the wafer.
- the adhesive layer contains an energy ray-curable component, it is irradiated with an energy ray from the side of the substrate to increase the cohesive force of the adhesive layer, and Reduce the adhesive strength between the adhesive layer and the substrate.
- the above silicon wafer is cut by using a cutting means such as a dicing saw.
- the cutting depth at this time is set to the sum of the thickness of the silicon wafer and the thickness of the adhesive layer and the depth of the dicing machine that has been abraded.
- the energy ray irradiation may be performed after dicing, or may be performed after an expanding step described below.
- the distance between C chips has been extended, making it easier to pick up IC chips.
- a gap occurs between the adhesive layer and the base material, the adhesive force between the adhesive layer and the base material is reduced, and the chip pickup property is improved.
- the cut adhesive layer can be fixed to the IC chip and left there, and can be separated from the substrate.
- the IC chip is placed on the die pad portion via the adhesive layer.
- the die pad is heated before placing the IC chip or immediately after placing it.
- the heating temperature is usually 80-
- the temperature is 200 ° C., preferably 100-180 ° C.
- the heating time is usually 0.1 second and 15 minutes, preferably 0.5 second and 13 minutes
- the tip mounting pressure is usually lkPa-200 MPa.
- heating may be further performed as necessary.
- the heating conditions at this time are in the above-mentioned heating temperature range, and the heating time is usually 11 to 180 minutes, preferably 10 to 120 minutes.
- the adhesive layer is cured, and the IC chip and the die pad portion can be firmly bonded. Since the adhesive layer is fluidized under die bonding conditions, It is sufficiently buried in the unevenness of the die pad portion, and the generation of voids can be prevented.
- the adhesive agent serving as the chip fixing means is cured and sufficiently embedded in the unevenness of the die pad portion.
- sufficient package reliability and board mountability are achieved.
- the bonding sheet of the present invention can be used for bonding semiconductor compounds, glass, ceramics, metals, and the like, in addition to the above-mentioned methods of use.
- the adhesive / adhesive layers of Examples and Comparative Examples were laminated so as to have a thickness of 3 mm, and were partially cured by irradiating ultraviolet rays to obtain samples for elastic modulus measurement.
- the elastic modulus of the sample at a predetermined temperature at a frequency of 1 Hz was measured using a dynamic viscoelasticity measuring device (RME II, RDA II).
- the interface between the adhesive layer and the die pad portion was observed with an ultrasonic testing device. Was evaluated for filling properties.
- the IC packages obtained in the examples and comparative examples were left for 168 hours under the conditions of 85 ° C and 60% RH to absorb moisture.
- the presence / absence of peeling and peeling of the package and the occurrence of package cracks were evaluated using a scanning ultrasonic flaw detector and cross-sectional observation.
- the IC packages obtained in the examples and the comparative examples were mounted on a mother board (build-up wiring boards laminated for high-density mounting using BT resin) at 260 ° C. for 1 minute.
- the mother board on which the IC package is mounted is subjected to a thermal shock of -40 and 125 ° C (1 cycle of heating, holding of 9 minutes of heating temperature, 1 minute of cooling, 1 minute of cooling temperature, 9 minutes of cooling). I went cycling.
- the presence or absence of cracks between the motherboard and the IC package was evaluated using a scanning ultrasonic flaw detector and cross-sectional observation.
- the components of the adhesive layer are shown below.
- a weight average molecular weight of about 200,000 obtained by copolymerizing 35 parts by mass of butyl acrylate, 20 parts by mass of vinyl acetate, 25 parts by mass of 2-hydroxyethyl methacrylate, and 20 parts by mass of glycidyl methacrylate.
- a copolymer having a weight average molecular weight of about 200,000 obtained by copolymerizing 65 parts by mass of butyl acrylate, 25 parts by mass of 2-hydroxyethyl methacrylate, and 10 parts by mass of glycidyl methacrylate.
- A3 Copolymer of 35 parts by mass of butyl acrylate, 20 parts by mass of acetate acetate, 25 parts by mass of 2-hydroxyethyl methacrylate, and 20 parts by mass of glycidyl methacrylate having a weight average molecular weight of about 700,000.
- A4 Copolymer of 65 parts by weight of butyl acrylate, 25 parts by weight of 2-hydroxyethyl methacrylate, and 10 parts by weight of glycidyl methacrylate having a weight average molecular weight of about 700,000. body
- Bisphenol A type liquid epoxy resin (Nippon Shokubai, BPA328, epoxy equivalent 220-240 g / eq, molecular weight about 400): 10 parts by mass
- Dicyclopentadiene skeleton-containing solid epoxy resin (Dainippon Ink and Chemicals,
- Curing accelerator (Curesol 2PHZ, manufactured by Shikoku Chemicals): 2 parts by mass
- Phenoxy resin (Tono Kasei, Phono Tote YP50_EK35, Tg: 100 ° C)
- Silane coupling agent MKC silicate MSEP2, manufactured by Mitsubishi Chemical Corporation
- E2 Polyisocyanate cross-linking agent (adduct of trimethylolpropane and toluylene diisocyanate)
- the dry film thickness of the adhesive composition of the formulation shown in Table 1 was applied to the surface of the release film (Rintec Co., 38 zm, SP-PET3811) that had been released with a silicone resin. Coated with a roll knife coater and dried to 20 xm, laminated on a 100 ⁇ m thick substrate (polyethylene film, surface tension 32 mN / m) and diced to obtain an adhesive sheet for die bonding. .
- Adhesion of the adhesive sheet for die bonding is performed using a tape mounter (Lintec, Adwill RAD 2500) and fixed to a wafer dicing ring frame (Disco, 2-6-1) did. Thereafter, ultraviolet light was irradiated from the substrate surface using a UV irradiation device (Adwill RAD 2000, manufactured by Lintec Corporation). Next, dicing was performed using a dicing device (AWD-4000B, manufactured by Tokyo Seimitsu Co., Ltd.) to a chip size of 9.0 mm ⁇ 9.0 mm.
- the amount of cut at the time of dicing was set so as to cut 10 ⁇ m deeper into the substrate from the interface between the substrate and the adhesive layer. Subsequently, it was pushed up with a needle from the side of the adhesive sheet for dicing and die bonding, and picked up so as to be separated at the interface between the adhesive layer and the base material.
- IC package substrate (Palladium plating and gold plating are sequentially patterned on the copper foil as die pads on the laminate of polyimide film (50 ⁇ m) and electrolytic copper foil (20 ⁇ m).
- the chip was mounted on the die pad portion (with zm solder resist) under the conditions of 120 ° C and 150 MPa for 1 second at 120 ° C and 150 MPa. Thereafter, the adhesive layer was cured by heating at 160 ° C. for 60 minutes.
- the side of the board where the chip is mounted is molded into a predetermined shape with mold resin (containing biphenyl-type epoxy resin and phenol novolak resin), and the resin is cured at 175 ° C for 6 hours and sealed under high pressure. did.
- a lead-free solder ball with a diameter of 0.5 mm was attached to the unsealed substrate side by a predetermined method to complete a BGA (Ball Grid Allay) type IC package.
- the adhesive layer for die-bonding has an excellent embedding property under the die-bonding condition with respect to the unevenness of the die pad portion. Even when the chip is mounted on the die pad portion, it is possible to contribute to the improvement of the production efficiency without generating a void between the die pad portion and the adhesive layer.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04747098A EP1650790B1 (en) | 2003-07-08 | 2004-07-07 | Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device |
US10/563,778 US20060252234A1 (en) | 2004-07-07 | 2004-07-07 | Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device |
JP2005511392A JP4536660B2 (ja) | 2003-07-08 | 2004-07-07 | ダイシング・ダイボンド用粘接着シートおよび半導体装置の製造方法 |
DE602004026875T DE602004026875D1 (de) | 2003-07-08 | 2004-07-07 | Härtbare selbstklebefolie zum zertrennen bzw. chip-bonden und verfahren zur herstellung eines halbleiterbauelements |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003271950 | 2003-07-08 | ||
JP2003-271950 | 2003-07-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005004216A1 true WO2005004216A1 (ja) | 2005-01-13 |
Family
ID=33562687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/009629 WO2005004216A1 (ja) | 2003-07-08 | 2004-07-07 | ダイシング・ダイボンド用粘接着シートおよび半導体装置の製造方法 |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1650790B1 (ja) |
JP (1) | JP4536660B2 (ja) |
KR (1) | KR100850772B1 (ja) |
CN (1) | CN100423201C (ja) |
DE (1) | DE602004026875D1 (ja) |
MY (1) | MY136936A (ja) |
TW (1) | TW200507193A (ja) |
WO (1) | WO2005004216A1 (ja) |
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JP2007073647A (ja) * | 2005-09-06 | 2007-03-22 | Sumitomo Bakelite Co Ltd | ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法及び半導体装置。 |
JP2007109808A (ja) * | 2005-10-12 | 2007-04-26 | Furukawa Electric Co Ltd:The | 半導体ウエハダイシング−ダイボンド用粘接着テープ |
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JP2008038111A (ja) * | 2006-08-10 | 2008-02-21 | Nippon Steel Chem Co Ltd | フィルム状接着剤及びそれを使用する半導体パッケージの製造方法 |
WO2008032510A1 (fr) | 2006-09-15 | 2008-03-20 | Lintec Corporation | Procédé de production d'un dispositif à semi-conducteur |
JP2008138023A (ja) * | 2006-11-30 | 2008-06-19 | Denki Kagaku Kogyo Kk | 粘着剤、粘着テープ、ダイジング用粘着テープ、及び、電子部品の製造方法 |
JP2008244463A (ja) * | 2007-03-01 | 2008-10-09 | Nitto Denko Corp | 熱硬化型ダイボンドフィルム |
JP2009200127A (ja) * | 2008-02-19 | 2009-09-03 | Disco Abrasive Syst Ltd | レーザ加工装置およびレーザ加工方法 |
JP2010034542A (ja) * | 2008-06-30 | 2010-02-12 | Lintec Corp | ウェハ加工用テープ |
JP2011132310A (ja) * | 2009-12-22 | 2011-07-07 | Nippon Zeon Co Ltd | エポキシ基含有シクロペンタジエン系樹脂からなる硬化性樹脂組成物 |
WO2011152045A1 (ja) * | 2010-06-02 | 2011-12-08 | 三井化学東セロ株式会社 | 半導体ウェハ表面保護用シート、およびそれを用いた半導体ウェハの保護方法と半導体装置の製造方法 |
JP2012054582A (ja) * | 2006-06-23 | 2012-03-15 | Hitachi Chem Co Ltd | 接着フィルム |
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JP2013058764A (ja) * | 2007-10-05 | 2013-03-28 | Hitachi Chemical Co Ltd | 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 |
JP2013077855A (ja) * | 2013-01-31 | 2013-04-25 | Lintec Corp | 半導体装置の製造方法に用いられる接着剤 |
WO2014058056A1 (ja) * | 2012-10-11 | 2014-04-17 | 日立化成株式会社 | 粘着剤組成物、積層体及び剥離方法 |
JP2015072997A (ja) * | 2013-10-02 | 2015-04-16 | リンテック株式会社 | 電子部品加工用粘着シートおよび半導体装置の製造方法 |
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JP5280034B2 (ja) * | 2007-10-10 | 2013-09-04 | 日東電工株式会社 | 配線回路基板用両面粘着テープ又はシートおよび配線回路基板 |
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JP4230080B2 (ja) * | 2000-02-18 | 2009-02-25 | リンテック株式会社 | ウエハ貼着用粘着シート |
JP2002141309A (ja) * | 2000-11-02 | 2002-05-17 | Lintec Corp | ダイシングシートおよびその使用方法 |
JP2002256235A (ja) * | 2001-03-01 | 2002-09-11 | Hitachi Chem Co Ltd | 接着シート、半導体装置の製造方法および半導体装置 |
JP4075801B2 (ja) * | 2001-08-27 | 2008-04-16 | 日立化成工業株式会社 | 接着シートならびに半導体装置およびその製造法 |
JP3617639B2 (ja) * | 2001-09-28 | 2005-02-09 | 住友ベークライト株式会社 | 半導体加工用シート、並びに、それを用いた半導体装置の製造方法及び半導体装置 |
JP3966808B2 (ja) * | 2002-12-03 | 2007-08-29 | 古河電気工業株式会社 | 粘接着テープ |
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- 2004-07-07 WO PCT/JP2004/009629 patent/WO2005004216A1/ja active Application Filing
- 2004-07-07 EP EP04747098A patent/EP1650790B1/en not_active Expired - Lifetime
- 2004-07-07 KR KR1020067000117A patent/KR100850772B1/ko active IP Right Grant
- 2004-07-07 DE DE602004026875T patent/DE602004026875D1/de not_active Expired - Lifetime
- 2004-07-07 CN CNB2004800189643A patent/CN100423201C/zh not_active Expired - Lifetime
- 2004-07-07 JP JP2005511392A patent/JP4536660B2/ja not_active Expired - Lifetime
- 2004-07-08 TW TW093120427A patent/TW200507193A/zh unknown
- 2004-07-08 MY MYPI20042716A patent/MY136936A/en unknown
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Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007073647A (ja) * | 2005-09-06 | 2007-03-22 | Sumitomo Bakelite Co Ltd | ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法及び半導体装置。 |
JP2007109808A (ja) * | 2005-10-12 | 2007-04-26 | Furukawa Electric Co Ltd:The | 半導体ウエハダイシング−ダイボンド用粘接着テープ |
JP2007220911A (ja) * | 2006-02-16 | 2007-08-30 | Nitto Denko Corp | 半導体装置製造用接着シート、及びそれを用いた半導体装置の製造方法 |
JP2013102190A (ja) * | 2006-06-23 | 2013-05-23 | Hitachi Chemical Co Ltd | 半導体デバイスの製造方法 |
JP5181222B2 (ja) * | 2006-06-23 | 2013-04-10 | 日立化成株式会社 | 半導体デバイスの製造方法 |
JP2012054582A (ja) * | 2006-06-23 | 2012-03-15 | Hitachi Chem Co Ltd | 接着フィルム |
JP2008038111A (ja) * | 2006-08-10 | 2008-02-21 | Nippon Steel Chem Co Ltd | フィルム状接着剤及びそれを使用する半導体パッケージの製造方法 |
WO2008032510A1 (fr) | 2006-09-15 | 2008-03-20 | Lintec Corporation | Procédé de production d'un dispositif à semi-conducteur |
US8545663B2 (en) | 2006-09-15 | 2013-10-01 | Lintec Corporation | Process for manufacturing semiconductor devices |
JP2008138023A (ja) * | 2006-11-30 | 2008-06-19 | Denki Kagaku Kogyo Kk | 粘着剤、粘着テープ、ダイジング用粘着テープ、及び、電子部品の製造方法 |
JP2008244463A (ja) * | 2007-03-01 | 2008-10-09 | Nitto Denko Corp | 熱硬化型ダイボンドフィルム |
JP2013058764A (ja) * | 2007-10-05 | 2013-03-28 | Hitachi Chemical Co Ltd | 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 |
JP2009200127A (ja) * | 2008-02-19 | 2009-09-03 | Disco Abrasive Syst Ltd | レーザ加工装置およびレーザ加工方法 |
JP2010034542A (ja) * | 2008-06-30 | 2010-02-12 | Lintec Corp | ウェハ加工用テープ |
JP2011132310A (ja) * | 2009-12-22 | 2011-07-07 | Nippon Zeon Co Ltd | エポキシ基含有シクロペンタジエン系樹脂からなる硬化性樹脂組成物 |
WO2011152045A1 (ja) * | 2010-06-02 | 2011-12-08 | 三井化学東セロ株式会社 | 半導体ウェハ表面保護用シート、およびそれを用いた半導体ウェハの保護方法と半導体装置の製造方法 |
US8476740B2 (en) | 2010-06-02 | 2013-07-02 | Mitsui Chemicals Tohcello, Inc. | Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet |
CN102867783A (zh) * | 2011-07-05 | 2013-01-09 | 台湾积体电路制造股份有限公司 | 用于切割***组件的装置和方法 |
CN102867783B (zh) * | 2011-07-05 | 2014-11-12 | 台湾积体电路制造股份有限公司 | 用于切割***组件的装置和方法 |
WO2014058056A1 (ja) * | 2012-10-11 | 2014-04-17 | 日立化成株式会社 | 粘着剤組成物、積層体及び剥離方法 |
JP2013077855A (ja) * | 2013-01-31 | 2013-04-25 | Lintec Corp | 半導体装置の製造方法に用いられる接着剤 |
JP2015072997A (ja) * | 2013-10-02 | 2015-04-16 | リンテック株式会社 | 電子部品加工用粘着シートおよび半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
MY136936A (en) | 2008-11-28 |
KR20060054274A (ko) | 2006-05-22 |
CN100423201C (zh) | 2008-10-01 |
EP1650790B1 (en) | 2010-04-28 |
TW200507193A (en) | 2005-02-16 |
EP1650790A4 (en) | 2007-08-29 |
KR100850772B1 (ko) | 2008-08-06 |
JP4536660B2 (ja) | 2010-09-01 |
CN1816899A (zh) | 2006-08-09 |
JPWO2005004216A1 (ja) | 2006-08-17 |
EP1650790A1 (en) | 2006-04-26 |
DE602004026875D1 (de) | 2010-06-10 |
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