WO2008093787A1 - 基板処理装置およびパーティクル付着防止方法 - Google Patents

基板処理装置およびパーティクル付着防止方法 Download PDF

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Publication number
WO2008093787A1
WO2008093787A1 PCT/JP2008/051540 JP2008051540W WO2008093787A1 WO 2008093787 A1 WO2008093787 A1 WO 2008093787A1 JP 2008051540 W JP2008051540 W JP 2008051540W WO 2008093787 A1 WO2008093787 A1 WO 2008093787A1
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WO
WIPO (PCT)
Prior art keywords
substrate
chamber
treatment subject
temperature
subject substrate
Prior art date
Application number
PCT/JP2008/051540
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English (en)
French (fr)
Inventor
Akitake Tamura
Teruyuki Hayashi
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to KR1020127002277A priority Critical patent/KR101176764B1/ko
Priority to US12/525,314 priority patent/US8950999B2/en
Priority to KR20097016200A priority patent/KR101177170B1/ko
Publication of WO2008093787A1 publication Critical patent/WO2008093787A1/ja
Priority to US14/582,590 priority patent/US20150114562A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3476—Testing and control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

　本発明は，被処理基板の表面上へのパーティクルの付着を防止することを技術的課題とするものであり、被処理基板を収容する基板収容容器がセットされる搬出入口を介して，前記基板収納容器との間で前記被処理基板の受け渡しを行う搬送室と，前記被処理基板に対して所定の処理を施す処理室と，前記処理室と前記搬送室とを接続するロードロック室と，前記搬送室と前記ロードロック室のうちの少なくとも一室内に前記被処理基板を搬入する際に，搬入する直前の当該被処理基板の温度が搬入しようとする室の室内温度よりも高くなるように，前記被処理基板の温度とその室の室内温度のうちの少なくとも一方を調整する温度調整手段と，を備えたことを特徴とする基板処理装置である。
PCT/JP2008/051540 2007-01-31 2008-01-31 基板処理装置およびパーティクル付着防止方法 WO2008093787A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020127002277A KR101176764B1 (ko) 2007-01-31 2008-01-31 기판 처리 장치 및 파티클 부착 방지 방법
US12/525,314 US8950999B2 (en) 2007-01-31 2008-01-31 Substrate processing apparatus and particle adhesion preventing method
KR20097016200A KR101177170B1 (ko) 2007-01-31 2008-01-31 기판 처리 장치 및 파티클 부착 방지 방법
US14/582,590 US20150114562A1 (en) 2007-01-31 2014-12-24 Substrate processing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-022449 2007-01-31
JP2007022449 2007-01-31

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/525,314 A-371-Of-International US8950999B2 (en) 2007-01-31 2008-01-31 Substrate processing apparatus and particle adhesion preventing method
US14/582,590 Division US20150114562A1 (en) 2007-01-31 2014-12-24 Substrate processing apparatus

Publications (1)

Publication Number Publication Date
WO2008093787A1 true WO2008093787A1 (ja) 2008-08-07

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ID=39674092

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Application Number Title Priority Date Filing Date
PCT/JP2008/051540 WO2008093787A1 (ja) 2007-01-31 2008-01-31 基板処理装置およびパーティクル付着防止方法

Country Status (5)

Country Link
US (2) US8950999B2 (ja)
JP (1) JP4896899B2 (ja)
KR (2) KR101177170B1 (ja)
TW (1) TWI423371B (ja)
WO (1) WO2008093787A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101015957B1 (ko) 2008-10-31 2011-02-23 세메스 주식회사 기판 처리 장치

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US20100111648A1 (en) 2010-05-06
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JP4896899B2 (ja) 2012-03-14
US8950999B2 (en) 2015-02-10
KR20120042867A (ko) 2012-05-03
JP2008211196A (ja) 2008-09-11
TWI423371B (zh) 2014-01-11
KR20090107521A (ko) 2009-10-13
TW200845277A (en) 2008-11-16

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