WO2008087843A1 - プラズマ処理装置、プラズマ処理方法及び記憶媒体 - Google Patents

プラズマ処理装置、プラズマ処理方法及び記憶媒体 Download PDF

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Publication number
WO2008087843A1
WO2008087843A1 PCT/JP2007/075076 JP2007075076W WO2008087843A1 WO 2008087843 A1 WO2008087843 A1 WO 2008087843A1 JP 2007075076 W JP2007075076 W JP 2007075076W WO 2008087843 A1 WO2008087843 A1 WO 2008087843A1
Authority
WO
WIPO (PCT)
Prior art keywords
plasma
electrode
processing vessel
plasma processing
processing apparatus
Prior art date
Application number
PCT/JP2007/075076
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English (en)
French (fr)
Inventor
Ikuo Sawada
Peter Ventzek
Tatsuro Ohshita
Kazuyoshi Matsuzaki
Songyun Kang
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to CN2007800499145A priority Critical patent/CN101601125B/zh
Priority to US12/523,212 priority patent/US8636871B2/en
Priority to KR1020097014829A priority patent/KR101124924B1/ko
Publication of WO2008087843A1 publication Critical patent/WO2008087843A1/ja
Priority to US14/164,564 priority patent/US9252001B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

　処理容器の側壁の温度制御性が良好であり、またプラズマによる基板へのダメージを抑えることができるプラズマ処理装置を提供する。プラズマ処理装置１は、処理容器１１の上部に載置台２と対向するように設けられた第１の電極３１及び第２の電極３２と、これら第１の電極３１及び第２の電極３２の間に処理ガスを供給するためのガス供給部４と、第１の電極３１及び第２の電極３２の間に供給された処理ガスをプラズマ化するためにこれら電極３１、３２の間に高周波電力を印加する高周波電源部３３と、処理容器１１の下部から処理容器１１内の雰囲気を真空排気する排気装置１４とを備えている。載置台２上の基板Ｂ付近ではプラズマの電子温度が低くなり、プラズマが基板Ｂに与えるダメージを抑えることができ、また処理容器１１の材質として金属を用いることができるので、その温度制御性が良好である。
PCT/JP2007/075076 2007-01-15 2007-12-27 プラズマ処理装置、プラズマ処理方法及び記憶媒体 WO2008087843A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2007800499145A CN101601125B (zh) 2007-01-15 2007-12-27 等离子体处理装置
US12/523,212 US8636871B2 (en) 2007-01-15 2007-12-27 Plasma processing apparatus, plasma processing method and storage medium
KR1020097014829A KR101124924B1 (ko) 2007-01-15 2007-12-27 플라즈마 처리 장치, 플라즈마 처리 방법 및 기억 매체
US14/164,564 US9252001B2 (en) 2007-01-15 2014-01-27 Plasma processing apparatus, plasma processing method and storage medium

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-006206 2007-01-15
JP2007006206A JP5168907B2 (ja) 2007-01-15 2007-01-15 プラズマ処理装置、プラズマ処理方法及び記憶媒体

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/523,212 A-371-Of-International US8636871B2 (en) 2007-01-15 2007-12-27 Plasma processing apparatus, plasma processing method and storage medium
US14/164,564 Division US9252001B2 (en) 2007-01-15 2014-01-27 Plasma processing apparatus, plasma processing method and storage medium

Publications (1)

Publication Number Publication Date
WO2008087843A1 true WO2008087843A1 (ja) 2008-07-24

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Country Link
US (2) US8636871B2 (ja)
JP (1) JP5168907B2 (ja)
KR (1) KR101124924B1 (ja)
CN (1) CN101601125B (ja)
TW (1) TW200839924A (ja)
WO (1) WO2008087843A1 (ja)

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WO2013124898A1 (ja) * 2012-02-23 2013-08-29 国立大学法人東北大学 プラズマ処理装置およびプラズマ処理方法

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