WO2008084642A1 - レーザ加工装置及びそれを用いたレーザ加工方法 - Google Patents

レーザ加工装置及びそれを用いたレーザ加工方法 Download PDF

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Publication number
WO2008084642A1
WO2008084642A1 PCT/JP2007/074498 JP2007074498W WO2008084642A1 WO 2008084642 A1 WO2008084642 A1 WO 2008084642A1 JP 2007074498 W JP2007074498 W JP 2007074498W WO 2008084642 A1 WO2008084642 A1 WO 2008084642A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser processing
same
processing apparatus
processing method
divided block
Prior art date
Application number
PCT/JP2007/074498
Other languages
English (en)
French (fr)
Inventor
Yoshinori Nakagawa
Mitsuo Hara
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to EP07859895.0A priority Critical patent/EP1992443B1/en
Priority to CN2007800269232A priority patent/CN101489712B/zh
Priority to JP2008524294A priority patent/JP4737290B2/ja
Priority to US12/295,041 priority patent/US9421638B2/en
Publication of WO2008084642A1 publication Critical patent/WO2008084642A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35—Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/38—Fabrics, fibrous materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)

Abstract

　ＸＹテーブルが上下動可能な複数の分割ブロックで構成され、少なくとも１つの分割ブロックを下降した状態で停止させ、この分割ブロックの上方に対応する領域の被加工物にレーザビームを照射して貫通穴を形成するレーザ加工装置を提供する。
PCT/JP2007/074498 2006-12-22 2007-12-20 レーザ加工装置及びそれを用いたレーザ加工方法 WO2008084642A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP07859895.0A EP1992443B1 (en) 2006-12-22 2007-12-20 Laser processing apparatus and laser processing method using the same
CN2007800269232A CN101489712B (zh) 2006-12-22 2007-12-20 激光加工装置及使用该激光加工装置的激光加工方法
JP2008524294A JP4737290B2 (ja) 2006-12-22 2007-12-20 レーザ加工装置及びそれを用いたレーザ加工方法
US12/295,041 US9421638B2 (en) 2006-12-22 2007-12-20 Laser processing apparatus and laser processing method using the same technical field

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-345492 2006-12-22
JP2006345492 2006-12-22

Publications (1)

Publication Number Publication Date
WO2008084642A1 true WO2008084642A1 (ja) 2008-07-17

Family

ID=39608540

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074498 WO2008084642A1 (ja) 2006-12-22 2007-12-20 レーザ加工装置及びそれを用いたレーザ加工方法

Country Status (7)

Country Link
US (1) US9421638B2 (ja)
EP (1) EP1992443B1 (ja)
JP (1) JP4737290B2 (ja)
KR (1) KR100989255B1 (ja)
CN (1) CN101489712B (ja)
TW (1) TWI404587B (ja)
WO (1) WO2008084642A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010264508A (ja) * 2009-04-13 2010-11-25 Nippon Sharyo Seizo Kaisha Ltd 加工装置
WO2012035721A1 (ja) * 2010-09-16 2012-03-22 パナソニック株式会社 レーザ加工装置およびレーザ加工方法
WO2012039106A1 (ja) * 2010-09-24 2012-03-29 パナソニック株式会社 レーザ加工装置
JP2013136088A (ja) * 2011-12-28 2013-07-11 Mitsubishi Electric Corp 保持装置

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101569958B (zh) * 2009-03-06 2013-01-23 深圳市大族激光科技股份有限公司 Ito膜的加工方法及电子设备
CN102275039B (zh) * 2010-06-14 2014-12-03 株式会社Lg化学 用于移除膜卷切割***的副产物的装置
US8878095B2 (en) * 2010-12-17 2014-11-04 Electro Scientific Industries, Inc. Reducing back-reflection in laser micromachining systems
CN102523703A (zh) * 2012-01-06 2012-06-27 汕头超声印制板公司 一种pcb板上背钻孔的制作方法
CN103143842B (zh) * 2013-03-18 2015-06-10 武汉科技大学 一种用于软材料切割的激光切割***及其切割方法
CN103406663A (zh) * 2013-08-19 2013-11-27 昆山远大精工机械有限公司 一种割炬驱动式激光切割设备
KR101637456B1 (ko) * 2013-09-30 2016-07-07 주식회사 이오테크닉스 다중 위치 제어를 이용한 연속적 레이저 가공 방법 및 이를 적용하는 시스템
JP6668004B2 (ja) * 2015-06-09 2020-03-18 カンタツ株式会社 回路パターン製造装置、回路パターン製造方法および回路パターン製造プログラム
JP6892727B2 (ja) 2016-09-26 2021-06-23 カンタツ株式会社 パターン製造装置、パターン製造方法およびパターン製造プログラム
JP6839476B2 (ja) 2016-09-26 2021-03-10 カンタツ株式会社 パターン形成用シート
JP6870974B2 (ja) * 2016-12-08 2021-05-12 株式会社ディスコ 被加工物の分割方法
JP6487413B2 (ja) 2016-12-22 2019-03-20 ファナック株式会社 レーザ加工用ヘッドおよびそれを備えたレーザ加工システム
JP2018182126A (ja) 2017-04-17 2018-11-15 カンタツ株式会社 パターン形成用シート、パターン製造装置およびパターン製造方法
JP6938212B2 (ja) 2017-05-11 2021-09-22 株式会社ディスコ 加工方法
CN109926792B (zh) * 2019-04-25 2021-04-06 大族激光科技产业集团股份有限公司 一种激光切割载台
JP7303053B2 (ja) * 2019-07-17 2023-07-04 ファナック株式会社 調整補助具及びレーザ溶接装置
CN110977189B (zh) * 2019-11-18 2021-07-13 济南邦德激光股份有限公司 一种激光切割***及其切割方法
CN115087512A (zh) * 2020-02-10 2022-09-20 三菱电机株式会社 激光加工方法及激光加工装置

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JPS63111291U (ja) * 1987-01-12 1988-07-16
JPH0671475A (ja) * 1992-08-27 1994-03-15 Shibuya Kogyo Co Ltd レーザ加工装置
JPH11192571A (ja) * 1998-01-07 1999-07-21 Matsushita Electric Ind Co Ltd レーザー加工方法及びその装置
JPH11254166A (ja) 1997-12-25 1999-09-21 Matsushita Electric Ind Co Ltd 加工装置及び方法
JP2000153427A (ja) * 1998-11-17 2000-06-06 Amada Co Ltd ワーク支持加工装置
JP2000233291A (ja) 1999-02-09 2000-08-29 Matsushita Electric Ind Co Ltd レーザー加工装置および方法

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JPS59127988A (ja) 1983-01-11 1984-07-23 Asahi Optical Co Ltd レ−ザ加工機
JPS6277688A (ja) 1985-09-30 1987-04-09 Yokogawa Electric Corp ２値画像フィルタリング回路
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GB0329979D0 (en) * 2003-12-24 2004-01-28 Surface Generation Ltd Workpiece support
KR100596730B1 (ko) 2004-11-16 2006-07-05 대영산업주식회사 테일러 웰디드 블랭크 시스템의 판재 센터링 장치

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Publication number Priority date Publication date Assignee Title
JPS63111291U (ja) * 1987-01-12 1988-07-16
JPH0671475A (ja) * 1992-08-27 1994-03-15 Shibuya Kogyo Co Ltd レーザ加工装置
JPH11254166A (ja) 1997-12-25 1999-09-21 Matsushita Electric Ind Co Ltd 加工装置及び方法
JPH11192571A (ja) * 1998-01-07 1999-07-21 Matsushita Electric Ind Co Ltd レーザー加工方法及びその装置
JP2000153427A (ja) * 1998-11-17 2000-06-06 Amada Co Ltd ワーク支持加工装置
JP2000233291A (ja) 1999-02-09 2000-08-29 Matsushita Electric Ind Co Ltd レーザー加工装置および方法

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Title
See also references of EP1992443A4

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010264508A (ja) * 2009-04-13 2010-11-25 Nippon Sharyo Seizo Kaisha Ltd 加工装置
WO2012035721A1 (ja) * 2010-09-16 2012-03-22 パナソニック株式会社 レーザ加工装置およびレーザ加工方法
JP5691004B2 (ja) * 2010-09-16 2015-04-01 パナソニックＩｐマネジメント株式会社 レーザ加工装置およびレーザ加工方法
WO2012039106A1 (ja) * 2010-09-24 2012-03-29 パナソニック株式会社 レーザ加工装置
CN102596484A (zh) * 2010-09-24 2012-07-18 松下电器产业株式会社 激光加工装置
JP5500248B2 (ja) * 2010-09-24 2014-05-21 パナソニック株式会社 レーザ加工装置
JP2013136088A (ja) * 2011-12-28 2013-07-11 Mitsubishi Electric Corp 保持装置

Also Published As

Publication number Publication date
KR20080091181A (ko) 2008-10-09
JPWO2008084642A1 (ja) 2010-04-30
EP1992443A1 (en) 2008-11-19
KR100989255B1 (ko) 2010-10-20
EP1992443A4 (en) 2010-11-17
US9421638B2 (en) 2016-08-23
TW200909117A (en) 2009-03-01
CN101489712A (zh) 2009-07-22
US20090173723A1 (en) 2009-07-09
TWI404587B (zh) 2013-08-11
CN101489712B (zh) 2012-06-20
JP4737290B2 (ja) 2011-07-27
EP1992443B1 (en) 2013-09-25

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