KR20080091181A - 레이저 가공 장치 및 레이저 가공 방법 - Google Patents
레이저 가공 장치 및 레이저 가공 방법 Download PDFInfo
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- KR20080091181A KR20080091181A KR1020087018840A KR20087018840A KR20080091181A KR 20080091181 A KR20080091181 A KR 20080091181A KR 1020087018840 A KR1020087018840 A KR 1020087018840A KR 20087018840 A KR20087018840 A KR 20087018840A KR 20080091181 A KR20080091181 A KR 20080091181A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/035—Aligning the laser beam
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
- B23K2101/35—Surface treated articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/38—Fabrics, fibrous materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
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Abstract
Description
Claims (11)
- 레이저 가공 장치에 있어서,레이저 발진기와,반사경과,갈바노 미러와,렌즈와 피가공물을 탑재하기 위한 XY 테이블을 구비하고,상기 XY 테이블은 상하 이동가능한 복수의 분할 블록으로 구성되어 있는 것을 특징으로 하는레이저 가공 장치.
- 제 1 항에 있어서,상기 분할 블록은 복수의 흡착 구멍을 구비하고 있는 것을 특징으로 하는레이저 가공 장치.
- 제 2 항에 있어서,상기 흡착 구멍은 흡기, 흡기 해제, 배기, 배기 해제의 동작을 구비한 흡배기 장치에 연결되어 있는 것을 특징으로 하는레이저 가공 장치.
- 제 3 항에 있어서,상기 흡배기 장치는, 상기 분할 블록이 상승 정지 상태일 때 흡기 또는 흡기 해제를 실행하고, 상기 분할 블록이 하강 정지 상태일 때 배기 및 배기 해제를 실행하는 것을 특징으로 하는레이저 가공 장치.
- 제 1 항에 있어서,상기 레이저 발진기는 레이저 빔을 출사하고, 상기 반사경, 상기 갈바노 미러 렌즈를 거쳐서 상기 XY 테이블 상으로 상기 레이저 빔을 조사하고,상기 갈바노 미러의 동작에 의해 피가공물을 레이저 가공하는 영역인 갈바노 가공 구역을 갖고,상기 갈바노 가공 구역에 대응하는 분할 블록은 하강한 상태에서 정지하고,상기 갈바노 가공 구역에 대응하지 않는 분할 블록은 상승한 상태에서 정지 하는 것을 특징으로 하는레이저 가공 장치.
- 제 1 항에 있어서,상기 레이저 발진기는 레이저 빔을 출사하고, 상기 반사경, 상기 갈바노 미러 렌즈를 거쳐서 상기 XY 테이블 상으로 상기 레이저 빔을 조사하고,상기 갈바노 미터의 동작에 의해 피가공물을 레이저 가공하는 영역인 갈바노 가공 구역을 갖고,상기 갈바노 가공 구역은 상기 XY 테이블의 수평방향의 동작에 의해 이동하며,상기 XY 테이블의 일 방향만의 이동에 의한 상기 갈바노 가공 구역이 1열 또는 1행의 복수로 이루어지는 가공 구역의 영역은 1개의 분할 블록과 동등한 영역으로 설정되어 있는 것을 특징으로 하는레이저 가공 장치.
- 제 6 항에 있어서,상기 분할 블록은 직사각형이며,상기 가공 구역의 영역의 길이방향의 길이는 상기 분할 블록의 길이방향의 길이보다 짧게 설정되어 있는 것을 특징으로 하는레이저 가공 장치.
- 제 1 항에 있어서,상기 분할 블록은 서로 인접하여, 상기 분할 블록 중 어느 하나가 하강했을 때에 인접하는 분할 블록과의 사이에 마련된 간극이 생기고,상기 간극은 피가공물로부터 생기는 가공 분진을 집진하기 위한 집진용의 간극인 것을 특징으로 하는레이저 가공 장치.
- 제 1 항에 있어서,상기 XY 테이블은 탑재되는 피가공물을 흡착하여 보지(保持)하기 위한 흡기 구멍과 흡기 장치를 상기 XY 테이블의 4변 단부에 구비하고 있는 것을 특징으로 하는레이저 가공 장치.
- 레이저 가공 방법에 있어서,제 1 항에 기재된 레이저 가공 장치의 XY 테이블에 피가공물을 탑재하는 단계와,상하 이동가능한 복수의 분할 블록 중 적어도 1개의 분할 블록을 하강시킨 상태로 정지시키는 단계와,상기 분할 블록의 상방에 대응하는 영역의 피가공물에 레이저 빔을 조사해서 관통 구멍을 형성하는 단계를 구비하는 것을 특징으로 하는레이저 가공 방법.
- 레이저 가공 방법에 있어서,제 1 항에 기재된 레이저 가공 장치의 XY 테이블에 피가공물을 탑재하는 단계와,상하 이동가능한 복수의 분할 블록 중 적어도 1개의 분할 블록을 상승시킨 상태에서 정지시키는 단계와,상기 분할 블록 위에 대응하는 영역의 피가공물에 레이저 빔을 조사해서 비관통 구멍을 형성하는 단계를 구비하는 것을 특징으로 하는레이저 가공 방법.
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JPJP-P-2006-00345492 | 2006-12-22 | ||
JP2006345492 | 2006-12-22 |
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KR20080091181A true KR20080091181A (ko) | 2008-10-09 |
KR100989255B1 KR100989255B1 (ko) | 2010-10-20 |
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KR1020087018840A KR100989255B1 (ko) | 2006-12-22 | 2007-12-20 | 레이저 가공 장치 및 레이저 가공 방법 |
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US (1) | US9421638B2 (ko) |
EP (1) | EP1992443B1 (ko) |
JP (1) | JP4737290B2 (ko) |
KR (1) | KR100989255B1 (ko) |
CN (1) | CN101489712B (ko) |
TW (1) | TWI404587B (ko) |
WO (1) | WO2008084642A1 (ko) |
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CN101569958B (zh) * | 2009-03-06 | 2013-01-23 | 深圳市大族激光科技股份有限公司 | Ito膜的加工方法及电子设备 |
JP2010264508A (ja) * | 2009-04-13 | 2010-11-25 | Nippon Sharyo Seizo Kaisha Ltd | 加工装置 |
CN102275039B (zh) * | 2010-06-14 | 2014-12-03 | 株式会社Lg化学 | 用于移除膜卷切割***的副产物的装置 |
WO2012035721A1 (ja) * | 2010-09-16 | 2012-03-22 | パナソニック株式会社 | レーザ加工装置およびレーザ加工方法 |
CN102596484B (zh) * | 2010-09-24 | 2014-12-10 | 松下电器产业株式会社 | 激光加工装置 |
US8878095B2 (en) * | 2010-12-17 | 2014-11-04 | Electro Scientific Industries, Inc. | Reducing back-reflection in laser micromachining systems |
JP5656821B2 (ja) * | 2011-12-28 | 2015-01-21 | 三菱電機株式会社 | 保持装置 |
CN102523703A (zh) * | 2012-01-06 | 2012-06-27 | 汕头超声印制板公司 | 一种pcb板上背钻孔的制作方法 |
CN103143842B (zh) * | 2013-03-18 | 2015-06-10 | 武汉科技大学 | 一种用于软材料切割的激光切割***及其切割方法 |
CN103406663A (zh) * | 2013-08-19 | 2013-11-27 | 昆山远大精工机械有限公司 | 一种割炬驱动式激光切割设备 |
KR101637456B1 (ko) * | 2013-09-30 | 2016-07-07 | 주식회사 이오테크닉스 | 다중 위치 제어를 이용한 연속적 레이저 가공 방법 및 이를 적용하는 시스템 |
JP6668004B2 (ja) * | 2015-06-09 | 2020-03-18 | カンタツ株式会社 | 回路パターン製造装置、回路パターン製造方法および回路パターン製造プログラム |
JP6839476B2 (ja) | 2016-09-26 | 2021-03-10 | カンタツ株式会社 | パターン形成用シート |
JP6892727B2 (ja) | 2016-09-26 | 2021-06-23 | カンタツ株式会社 | パターン製造装置、パターン製造方法およびパターン製造プログラム |
JP6870974B2 (ja) * | 2016-12-08 | 2021-05-12 | 株式会社ディスコ | 被加工物の分割方法 |
JP6487413B2 (ja) | 2016-12-22 | 2019-03-20 | ファナック株式会社 | レーザ加工用ヘッドおよびそれを備えたレーザ加工システム |
JP2018182126A (ja) | 2017-04-17 | 2018-11-15 | カンタツ株式会社 | パターン形成用シート、パターン製造装置およびパターン製造方法 |
JP6938212B2 (ja) | 2017-05-11 | 2021-09-22 | 株式会社ディスコ | 加工方法 |
CN109926792B (zh) * | 2019-04-25 | 2021-04-06 | 大族激光科技产业集团股份有限公司 | 一种激光切割载台 |
JP7303053B2 (ja) * | 2019-07-17 | 2023-07-04 | ファナック株式会社 | 調整補助具及びレーザ溶接装置 |
CN110977189B (zh) * | 2019-11-18 | 2021-07-13 | 济南邦德激光股份有限公司 | 一种激光切割***及其切割方法 |
CN115087512A (zh) * | 2020-02-10 | 2022-09-20 | 三菱电机株式会社 | 激光加工方法及激光加工装置 |
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KR100596730B1 (ko) | 2004-11-16 | 2006-07-05 | 대영산업주식회사 | 테일러 웰디드 블랭크 시스템의 판재 센터링 장치 |
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2007
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- 2007-12-20 EP EP07859895.0A patent/EP1992443B1/en active Active
- 2007-12-20 US US12/295,041 patent/US9421638B2/en active Active
- 2007-12-20 JP JP2008524294A patent/JP4737290B2/ja active Active
- 2007-12-20 WO PCT/JP2007/074498 patent/WO2008084642A1/ja active Application Filing
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JP4737290B2 (ja) | 2011-07-27 |
CN101489712A (zh) | 2009-07-22 |
EP1992443B1 (en) | 2013-09-25 |
KR100989255B1 (ko) | 2010-10-20 |
US9421638B2 (en) | 2016-08-23 |
CN101489712B (zh) | 2012-06-20 |
WO2008084642A1 (ja) | 2008-07-17 |
EP1992443A4 (en) | 2010-11-17 |
US20090173723A1 (en) | 2009-07-09 |
TWI404587B (zh) | 2013-08-11 |
EP1992443A1 (en) | 2008-11-19 |
TW200909117A (en) | 2009-03-01 |
JPWO2008084642A1 (ja) | 2010-04-30 |
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