WO2008029636A1 - Dispositif de commande de moteur - Google Patents
Dispositif de commande de moteur Download PDFInfo
- Publication number
- WO2008029636A1 WO2008029636A1 PCT/JP2007/066417 JP2007066417W WO2008029636A1 WO 2008029636 A1 WO2008029636 A1 WO 2008029636A1 JP 2007066417 W JP2007066417 W JP 2007066417W WO 2008029636 A1 WO2008029636 A1 WO 2008029636A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat sink
- power semiconductor
- motor control
- control device
- heat
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/30—Structural association with control circuits or drive circuits
- H02K11/33—Drive circuits, e.g. power electronics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
- H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
Definitions
- the present invention relates to a motor control device such as an inverter device or a servo amplifier that mainly operates with a high-voltage power supply.
- the heat sink used in the motor control device is downsized and the number of parts of the entire device is reduced. It is related with the structure for implement
- a conventional motor control device for example, an inverter device, is provided with a plurality of power semiconductor modules which are heat generating components, and a heat sink for cooling the plurality of power semiconductor modules (for example, Patent Document 1). reference). Further, in order to reduce the number of parts of the entire apparatus, it is effective and generally used to manufacture the heat sink by die casting capable of manufacturing a complicated shape.
- the heat sink 1 is provided with a boss la, an engaging portion lb, and a fin lc.
- a substrate 6 is disposed on the boss la and is attached to the heat sink 1 with a screw 7.
- a first power semiconductor module 2 and a second power semiconductor module 4 are disposed on the heat sink 1 on the lower surface of the substrate 6.
- the power semiconductor module 2 is attached to the upper surface of the heat sink 1 with screws 3 and the power semiconductor module 4 is attached to the upper surface of the heat sink 1 with screws 5.
- a fan 8 is attached to the engaging portion lb, and the cooling efficiency of the heat sink 1 is improved by applying cooling air to the fin lc.
- the heat sink 1 is manufactured by die casting, and the number of parts can be reduced by providing the boss la for mounting the substrate 6 and the engaging portion lb for mounting the fan 8. Realized.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2004-349548
- the heat sink of the conventional motor control device has the following problems.
- the present invention has been made to solve such a problem, and by miniaturizing the heat sink without increasing the number of parts as much as possible, the motor control device can easily reduce the size and cost of the device. Is intended to provide.
- the present invention is configured as follows.
- the invention according to claim 1 is a heat sink, a plurality of semiconductor modules closely contacting the heat sink, a substrate electrically connected to the plurality of power semiconductor modules, and a flow of outside air to generate the heat sink.
- the heat sink is manufactured by combining two types of heat sinks, the first heat sink and the second heat sink. At least one of the power semiconductor modules is closely attached to each of the heat sinks.
- the invention according to claim 2 is characterized in that the first heat sink is a die-cast heat sink, the second heat sink is extruded, or a heat sink having a good thermal conductivity such as a caulking method is used, or a heat sink using a material. It is a feature.
- the invention according to claim 3 is characterized in that fins are provided in at least one of the first heat sink and the second heat sink.
- the invention according to claim 4 is characterized in that the first heat sink and the second heat sink are provided with fins, and the fins of the second heat sink are arranged leeward than the fins of the first heat sink. It is what.
- the invention according to claim 5 is characterized in that the fin pitch of the second heat sink is the first heat sink. It is characterized by being smaller than the fin pitch of Tosync.
- the invention according to claim 6 is characterized in that a heat insulating material is inserted between the two kinds of heat sinks.
- the present invention has the following effects.
- the heat sink is manufactured by combining two types of heat sinks including the first heat sink and the second heat sink, and the first heat sink can have a complicated shape.
- a simple die-casting heat sink a boss for mounting the board and an engaging part for mounting the fan can be easily provided, and the number of parts of the device can be reduced.
- the second heat sink a heat sink such as extruding or caulking with good thermal conductivity, the cooling efficiency can be improved, the heat sink can be downsized, and the motor controller can be downsized.
- the fins of the second heat sink which have good thermal conductivity and heat of the power semiconductor module is well transmitted and are likely to reach a high temperature, are located further down than the fins of the first heat sink. By arranging, it is not affected by the first heat sink force S and the high temperature second heat sink.
- the heat radiation area is increased and the cooling efficiency is increased.
- the heat sink can be reduced in size, and the motor control device can be reduced in size.
- the heat transfer between the two heat sinks can be interrupted, the influence of the power semiconductor modules mounted on the first heat sink and the second heat sink is ignored. Therefore, the heat sink can be reduced in size efficiently, and the motor control device can be reduced in size.
- FIG. 1 is an exploded perspective view showing a motor control device according to a first embodiment of the present invention.
- FIG. 2 is an assembled perspective view of the motor control device in FIG. 1.
- FIG. 3 is a diagram showing the motor control device in FIG. 2, where (a) is a right side view and (b) is a rear view.
- FIG. 4 is an exploded perspective view showing a motor control device according to a second embodiment of the present invention.
- FIG. 5 is an assembled perspective view of the motor control device in FIG.
- FIG. 6 It is a figure which shows the motor control apparatus in FIG. 5, (a) is a right view, (b) is a rear view
- FIG. 7 is an exploded perspective view showing a motor control device in the prior art.
- FIG. 8 is an assembled perspective view of the motor control device in FIG.
- FIG. 9 is a diagram showing the motor control device in FIG. 8, where (a) is a right side view and (b) is a rear view.
- FIG. 1 is an exploded perspective view showing a motor control device according to a first embodiment of the present invention.
- FIG. 2 is an assembled perspective view of the motor control device in FIG. 3 is a diagram showing the motor control device in FIG. 2, in which (a) is a right side view and (b) is a rear view.
- 2 is the first power semiconductor module
- 4 is the second power semiconductor module
- 6 is the substrate
- 8 is the fan
- 9 is the first heat sink
- 10 is the second heat sink .
- the first heat sink 9 is provided with a boss 9a, an engaging portion 9b, and a hollow hole 9c.
- the substrate 6 is disposed on the boss 9a, and the first heat sink 9 is secured with a screw 7. It is attached to.
- the first power semiconductor module 2 is disposed on the first heat sink 9 on the lower surface of the substrate 6 and is attached in close contact with the upper surface of the first heat sink 9 with screws 3.
- the second power semiconductor module 4 is disposed on the second heat sink 10 and is attached in close contact with the upper surface of the second heat sink 10 with screws 5.
- the second heat sink 10 is disposed at the position of the hollow hole 9c of the first heat sink 9, and is attached to the first heat sink 9 with a screw 11.
- the second heat sink 10 is provided with fins 10a.
- a fan 8 is attached to the engaging portion 9b of the first heat sink 9, and the second heat sink 10 applies the cooling air to the fin 10c. The cooling efficiency of the heat sink 10 is improved.
- the first heat sink 9 is manufactured by die casting, and is provided with the boss 9a for attaching the substrate 6 and the engaging portion 9b for attaching the fan 8.
- the total number of parts can be reduced.
- the second heat The to-sink 10 uses a heat sink such as caulking with good thermal conductivity, and the fin pitch of the fin 10a is set smaller than the fin pitch that can be manufactured by die casting. This increases the heat radiation area of the second heat sink 10 and improves the cooling efficiency, so that the second heat sink 10 can be downsized.
- the thermal conductivity is The fins 10a of the second heat sink 10 are likely to be placed leeward than the fins (not shown) of the first heat sink 9 because the heat of the power semiconductor module is well transmitted and is likely to become high temperature.
- the first heat sink 9 is affected by high-temperature winds and the cooling performance deteriorates, it will not happen!
- the first power semiconductor module 2 and the second power semiconductor module 4 have different calorific values in most cases in normal use. For this reason, the power semiconductor module with the larger calorific value is inevitably attached to the heat sink 10 with higher cooling efficiency. That is, since the second power semiconductor module 4 generates a larger amount of heat than the first power semiconductor module 2, the second power semiconductor module 4 is connected to the second heat sink 10 with good cooling efficiency. It is installed.
- the failure limit temperature may be different between the first power semiconductor module 2 and the second power semiconductor module 4.
- the second heat sink to which the second power semiconductor module 4 is attached. 10 can be heated to a temperature higher than that of the first heat sink 9 to which the first power semiconductor module 2 is attached, and when the second heat sink 10 is downsized to the limit, The temperature of the heat sink 10 is higher than the temperature of the first heat sink 9.
- the first heat sink 9 and the second heat sink 10 are separate parts even though they are fastened with screws, there is a certain degree of heat insulation effect on the parts, and the temperature is low.
- FIG. 4 is an exploded perspective view of the motor control device of the present invention showing the configuration of the second embodiment.
- FIG. 5 is a perspective view of the motor control device in FIG. 6A is a right side view of the motor control device in FIG. 5, and
- FIG. 6B is a rear view of the motor control device in FIG.
- 2 is the first power semiconductor module
- 4 is the second power semiconductor module
- 6 is the board
- 8 is the fan
- 9 is the first heat sink
- 10 is the second heat sink
- 12 Is a heat insulating material.
- the first heat sink 9 is provided with a boss 9a, an engagement portion 9b, and a hollow hole 9c.
- the substrate 6 is disposed on the boss 9a, and the first heat sink 9 is attached to the first heat sink 9 with a screw 7. It is attached.
- the first power semiconductor module 2 is disposed on the first heat sink 9 on the lower surface of the substrate 6, and is attached in close contact with the upper surface of the first heat sink 9 with screws 3.
- the second power semiconductor module 4 is disposed on the second heat sink 10 and is attached in close contact with the upper surface of the second heat sink 10 with screws 5.
- the second heat sink 10 is arranged at the position of the hollow hole 9c of the first heat sink 9 via the heat insulating material 12, and is attached to the first heat sink 9 with a screw 11.
- the second heat sink 10 is provided with a fin 10a.
- a fan 8 is attached to the engaging portion 9b of the first heat sink 9, and the cooling air is applied to the fin 10c to apply the cooling air.
- the fins of the second heat sink which have good thermal conductivity and the heat of the power semiconductor module is well transmitted and are likely to reach a high temperature, are arranged more leeward than the fins of the first heat sink.
- the first heat sink 9 is manufactured by die casting, and the boss 9a for attaching the base plate 6 and the engaging portion 9b for attaching the fan 8 are provided.
- the total number of parts can be reduced.
- the second heat sink 10 uses a heat sink such as caulking with good thermal conductivity, and is provided smaller than the fin pitch that can be manufactured when the fin 10a is manufactured by the fin pitcher or die casting. This increases the heat radiation area of the second heat sink 10 and improves the cooling efficiency, so that the second heat sink 10 can be reduced in size.
- the first power semiconductor module 2 and the second power semiconductor module 4 have different calorific values in most cases in normal use. For this reason, the power semiconductor module with the larger calorific value is inevitably attached to the heat sink 10 with higher cooling efficiency. That is, since the second power semiconductor module 4 generates a larger amount of heat than the first power semiconductor module 2, the second power semiconductor module 4 is connected to the second heat sink 10 with good cooling efficiency. It is installed.
- the failure limit temperature may be different between the first power semiconductor module 2 and the second power semiconductor module 4.
- the second heat sink to which the second power semiconductor module 4 is attached is described. 10 can be heated to a temperature higher than that of the first heat sink 9 to which the first power semiconductor module 2 is attached, and when the second heat sink 10 is downsized to the limit, The temperature of the heat sink 10 is higher than the temperature of the first heat sink 9.
- the first heat sink 9 and the second heat sink 10 are separate parts even though they are fastened with screws, they have a certain degree of heat insulation effect on each other.
- first heat sink 9 and the second heat sink 10 are insulated by the heat insulating material 12, and heat transfer from the second heat sink 10 having a high temperature to the first heat sink 9 having a low temperature is performed. Can be almost prevented. For this reason, in reducing the size of the first heat sink 9, the influence of the second heat sink 10 is almost eliminated. Can be eliminated.
- the same idea can be applied to the case where the first power semiconductor module 2 has a higher failure limit temperature than the second semiconductor module 4.
- This is mainly related to motor control devices such as inverters and servo amplifiers that operate with high-voltage power supplies, and in particular to reduce the size of heat sinks used in motor control devices and reduce the number of parts in the entire device.
- This relates to the configuration, and can be used in the field of manufacturing and providing a motor control device that can easily reduce the size and cost of the device by reducing the size of the heat sink without increasing the number of parts.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Inverter Devices (AREA)
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020097004483A KR101319758B1 (ko) | 2006-09-04 | 2007-08-24 | 모터 제어장치 |
CN2007800328160A CN101513150B (zh) | 2006-09-04 | 2007-08-24 | 马达控制器 |
JP2008533091A JP4936019B2 (ja) | 2006-09-04 | 2007-08-24 | モータ制御装置 |
DE112007002019T DE112007002019T5 (de) | 2006-09-04 | 2007-08-24 | Motorsteuervorrichtung |
US12/439,767 US7898806B2 (en) | 2006-09-04 | 2007-08-24 | Motor controller |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-238649 | 2006-09-04 | ||
JP2006238649 | 2006-09-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008029636A1 true WO2008029636A1 (fr) | 2008-03-13 |
Family
ID=39157072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/066417 WO2008029636A1 (fr) | 2006-09-04 | 2007-08-24 | Dispositif de commande de moteur |
Country Status (7)
Country | Link |
---|---|
US (1) | US7898806B2 (ja) |
JP (1) | JP4936019B2 (ja) |
KR (1) | KR101319758B1 (ja) |
CN (1) | CN101513150B (ja) |
DE (1) | DE112007002019T5 (ja) |
TW (1) | TW200820553A (ja) |
WO (1) | WO2008029636A1 (ja) |
Cited By (2)
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JP2013055848A (ja) * | 2011-09-06 | 2013-03-21 | Toshiba Schneider Inverter Corp | インバータ装置 |
JP2018522420A (ja) * | 2015-07-13 | 2018-08-09 | ステゴ−ホールディング・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | 電気機器用筐体 |
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JP5693419B2 (ja) * | 2011-08-31 | 2015-04-01 | 三菱電機株式会社 | 電気機器の筐体 |
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CN104428197A (zh) * | 2012-01-13 | 2015-03-18 | 罗伯科技公司 | 机器人***及其使用方法 |
CN103687431B (zh) * | 2012-09-20 | 2016-12-21 | 施耐德东芝换流器欧洲公司 | 用于具有散热需求的设备的安装装置 |
JP5785203B2 (ja) * | 2013-02-26 | 2015-09-24 | ファナック株式会社 | ヒートシンクを含む冷却構造部を備えるサーボアンプ |
EP2998826A4 (en) * | 2013-05-17 | 2017-08-02 | Sony Interactive Entertainment Inc. | Electronic device and method for manufacturing same |
CN110083212B (zh) | 2013-05-17 | 2023-07-14 | 索尼电脑娱乐公司 | 电子设备 |
JP2015050257A (ja) * | 2013-08-30 | 2015-03-16 | 株式会社東芝 | 車両用電力変換装置及び鉄道車両 |
JP5907151B2 (ja) * | 2013-11-29 | 2016-04-20 | トヨタ自動車株式会社 | 車載電子機器のケース |
JP6146364B2 (ja) * | 2014-03-31 | 2017-06-14 | 富士電機株式会社 | 電力変換装置 |
US9387906B2 (en) * | 2014-09-10 | 2016-07-12 | Ford Global Technologies, Llc | Battery box for electric cycle |
WO2016041145A1 (zh) * | 2014-09-16 | 2016-03-24 | 深圳市大疆创新科技有限公司 | 散热装置及采用该散热装置的uav |
FI126380B (en) * | 2014-10-27 | 2016-11-15 | Kone Corp | The drive unit |
KR102234549B1 (ko) * | 2014-12-01 | 2021-04-01 | 현대모비스 주식회사 | 모터 및 인버터 통합형 재시동 장치 |
JP6294263B2 (ja) * | 2015-07-06 | 2018-03-14 | ファナック株式会社 | ファンモータを交換できるモータ駆動装置、およびこれを備えた制御盤 |
JP2017045775A (ja) * | 2015-08-24 | 2017-03-02 | 株式会社東芝 | 送信機および電子機器 |
WO2017218614A1 (en) | 2016-06-15 | 2017-12-21 | Hunter Fan Company | Ceiling fan system and electronics housing |
JP6885126B2 (ja) * | 2017-03-22 | 2021-06-09 | 富士電機株式会社 | インバータ装置 |
KR102671866B1 (ko) * | 2019-01-17 | 2024-05-31 | 엘에스일렉트릭(주) | 인버터용 방열모듈 |
DE102019122511A1 (de) * | 2019-08-21 | 2021-02-25 | Seg Automotive Germany Gmbh | Stromrichtereinheit und elektrische Maschine |
DE102020105961B4 (de) * | 2020-03-05 | 2021-09-30 | Danfoss Power Electronics A/S | Luftgekühlter Motorregler zum Regeln mindestens eines Elektromotors und Verfahren zum Regeln eines Ventilators eines entsprechenden Motorreglers |
EP4150744A1 (de) | 2020-05-15 | 2023-03-22 | SEW-EURODRIVE GmbH & Co. KG | Antrieb mit gekühlten anschlusskasten |
CN113423248A (zh) * | 2021-06-30 | 2021-09-21 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | 风冷固态功率放大器 |
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2007
- 2007-08-24 WO PCT/JP2007/066417 patent/WO2008029636A1/ja active Application Filing
- 2007-08-24 JP JP2008533091A patent/JP4936019B2/ja not_active Expired - Fee Related
- 2007-08-24 CN CN2007800328160A patent/CN101513150B/zh not_active Expired - Fee Related
- 2007-08-24 US US12/439,767 patent/US7898806B2/en not_active Expired - Fee Related
- 2007-08-24 KR KR1020097004483A patent/KR101319758B1/ko not_active IP Right Cessation
- 2007-08-24 DE DE112007002019T patent/DE112007002019T5/de not_active Withdrawn
- 2007-09-03 TW TW096132751A patent/TW200820553A/zh not_active IP Right Cessation
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JPH042050U (ja) * | 1990-04-23 | 1992-01-09 | ||
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Cited By (2)
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JP2013055848A (ja) * | 2011-09-06 | 2013-03-21 | Toshiba Schneider Inverter Corp | インバータ装置 |
JP2018522420A (ja) * | 2015-07-13 | 2018-08-09 | ステゴ−ホールディング・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | 電気機器用筐体 |
Also Published As
Publication number | Publication date |
---|---|
CN101513150A (zh) | 2009-08-19 |
TW200820553A (en) | 2008-05-01 |
US7898806B2 (en) | 2011-03-01 |
KR20090054979A (ko) | 2009-06-01 |
US20100053898A1 (en) | 2010-03-04 |
JP4936019B2 (ja) | 2012-05-23 |
DE112007002019T5 (de) | 2009-10-08 |
TWI336985B (ja) | 2011-02-01 |
JPWO2008029636A1 (ja) | 2010-01-21 |
KR101319758B1 (ko) | 2013-10-29 |
CN101513150B (zh) | 2011-08-10 |
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