WO2007063763A1 - 回路基板に対する作業装置及び作業方法 - Google Patents
回路基板に対する作業装置及び作業方法 Download PDFInfo
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- WO2007063763A1 WO2007063763A1 PCT/JP2006/323397 JP2006323397W WO2007063763A1 WO 2007063763 A1 WO2007063763 A1 WO 2007063763A1 JP 2006323397 W JP2006323397 W JP 2006323397W WO 2007063763 A1 WO2007063763 A1 WO 2007063763A1
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- WIPO (PCT)
- Prior art keywords
- circuit board
- work
- curved surface
- measurement
- displacement amount
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
- Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
Definitions
- the present invention relates to a working apparatus and a working method for a circuit board that performs a predetermined work related to mounting of an electronic component on a circuit board on which the electronic component is mounted.
- a conductive paste or solder cream is applied to the work surface of the circuit board (hereinafter referred to as the substrate surface).
- the printing process, the conductive paste, etc. are applied.
- the process of mounting electronic components on the board surface of the board, the process of mechanically and electrically joining electronic components to the circuit board by thermocompression reflow, and individual circuit boards if the circuit board is a multi-piece board Various operations (or processing) are performed on the circuit board by the dicing process.
- an electronic component mounting apparatus disclosed in Japanese Patent Laid-Open No. 2000-299597 (reference 1) is known.
- the deviation (displacement amount) of the board surface on which the electronic component is mounted from the mounting reference plane is measured, and the deviation of the board surface is approximated using this deviation.
- the mounting height correction amount when mounting the electronic component on the board surface, and correcting the mounting height based on this correction amount the electronic component mounting surface can be adjusted to the board surface without excess or deficiency. It can be mounted by pressing.
- the warping shape of the entire board surface is virtually calculated based on the amount of displacement of the work reference surface force at an arbitrary position on the board surface. Therefore, when the target circuit board has a discontinuous surface due to the effects of steps, slits, notches, etc., the warpage shape separated from the actual surface shape of the substrate surface is affected by the increase or decrease in local displacement. May be hypothesized.
- the mounting height is corrected based on the calculated correction amount, there is a problem that the mounting surface of the electronic component cannot be pressed into contact with the substrate surface without being too short and the mounting quality is deteriorated. The problem of this reduction in mounting quality is also true for the quality of work when various work is performed on the circuit board.
- an object of the present invention is to solve the above-described problem, and in the operation for a circuit board in which a predetermined operation related to mounting of the electronic component is performed on the circuit board on which the electronic component is mounted. Even if there is a discontinuous surface due to the effects of steps, slits, notches, etc., the circuit board working device and method for the circuit board that can be maintained without degrading the quality of work on the circuit board Is to provide.
- the present invention is configured as follows.
- the difference between the maximum value and the minimum value of the measured displacement amount of the work reference surface force at the measurement location measured by the measurement means and the auxiliary measurement location set in the vicinity of the measurement location is not more than a threshold value.
- the shape of the work surface of the circuit board is a curved surface model. And calculating means for calculating the calculated displacement amount of the curved surface model from the work reference plane,
- a working device for a circuit board comprising: correction means for correcting a work height when working on the work surface of the circuit board based on the computed displacement amount of the curved surface model computed by the computing means I will provide a.
- the calculated displacement amount at each measurement location of the curved surface model calculated by the calculation means is compared with the measured displacement amount at each measurement location. Then, it is determined whether the difference between the two is less than or equal to a threshold value, and by determining that the difference is less than or equal to the threshold value, compatibility determination means for determining that the curved surface model is compatible is provided.
- a working device for the circuit board according to the first aspect is further provided.
- the calculation means is configured to determine the divided work surface based on the measured displacement amount for each divided work surface obtained by dividing the work surface of the circuit board into a plurality of regions.
- At least three measurement points are set on the work surface of the circuit board
- the work surface of the circuit board is determined based on the measurement displacement amount of the measurement location. Assuming the shape of the curved surface model, calculate the calculated displacement amount of the curved surface model from the work reference plane,
- a work method for a circuit board that performs work on the circuit board by correcting a work height when working on the work surface of the circuit board based on the calculated displacement amount of the calculated curved surface model. I will provide a.
- At least one auxiliary measurement point is set in the vicinity of each of the measurement points.
- the difference between the maximum value and the minimum value of the measured displacement amounts at the measurement location and the auxiliary measurement location set in the vicinity thereof for each measurement location.
- the working method for a circuit board that determines that the circuit board is eligible when the value is equal to or less than the threshold.
- the work method for the circuit board according to the fourth aspect is assumed in which the new measurement point is additionally set in the measurement point setting and the new curved surface model is assumed. provide.
- the seventh aspect of the present invention in determining the compatibility between the assumed curved surface model and the work surface of the circuit board, the calculated displacement amount at each measurement location of the curved surface model.
- the measurement displacement amount at each of the measurement points is compared to determine that the difference between the two is equal to or less than a threshold value.
- the eighth aspect of the present invention in the assumption of the curved surface model, the above-described work surface of the circuit board is divided into a plurality of regions, and is divided based on the measured displacement amount.
- the work height can be accurately corrected assuming a curved surface model that approximates the shape of the board surface on which the work is performed on the circuit board. Even if there are discontinuous surfaces due to steps, slits, notches, etc., the quality of work on the circuit board can be maintained without deteriorating.
- FIG. 1 is a schematic plan view of an electronic component mounting apparatus according to the first embodiment of the present invention.
- FIG. 2 is a partial schematic side view of the electronic component mounting apparatus of the first embodiment.
- FIG. 3A shows the mounting height of the electronic component mounting apparatus of the first embodiment.
- FIG. 3B is a diagram illustrating a state in which the end of the circuit board is displaced downward.
- FIG. 3B shows a mounting height in the electronic component mounting apparatus according to the first embodiment. Theory It is a clear diagram and is a diagram showing a state in which the end of the circuit board is displaced upward,
- FIG. 4 is a flowchart showing a mounting height correction operation in mounting the electronic component of the first embodiment.
- FIG. 5A is a partial schematic plan view showing a measurement location set on the substrate surface of the first embodiment.
- FIG. 5B is a partial schematic plan view showing auxiliary measurement points set on the substrate surface of the first embodiment.
- FIG. 6 is a schematic perspective view showing a curved surface model of the circuit board in the first embodiment.
- FIG. 7 is a schematic side view showing how electronic components are mounted in the first embodiment.
- FIG. 8 is an explanatory diagram showing a configuration of a substrate processing system including the electronic component mounting apparatus according to the first embodiment.
- FIG. 9A is a schematic plan view showing a circuit board formed with slits to be handled by a working device for a circuit board that works according to the second embodiment of the present invention
- FIG. 9B is a schematic plan view showing a state in which the substrate surface of the circuit board of FIG. 9A is partitioned into a plurality of regions.
- FIG. 1 shows a schematic plan view of an electronic component mounting apparatus 101 which is an example of a working device for a circuit board according to the first embodiment of the present invention
- FIG. 2 shows a partial schematic side view thereof.
- the working device for the circuit board is used to manage the working height (or processing height), while various work (or processing) on the working surface of the circuit board (hereinafter referred to as board surface).
- the electronic component is mounted on the board surface while managing the mounting height, which is the height distance between the circuit board board surface and the work tool (or an electronic component held by the work tool).
- An electronic component mounting apparatus will be described as an example.
- a conveyance guide 2 is arranged at a substantially center on the base 1.
- the conveyance guide 2 functions as a substrate positioning unit that conveys the circuit board 3 on which electronic components are mounted and positions the circuit board 3 at a predetermined position.
- the transport direction of the circuit board 3 is the X direction
- the direction orthogonal to the circuit board 3 in the horizontal plane is the Y direction.
- component supply sections 4 are arranged, and a plurality of parts feeders 5 are detachably arranged in parallel.
- a pair of Y tables 6 are disposed at both ends of the base 1 in the X direction.
- An X table 7 is installed on these Y tables 6 and moves in the Y direction when the Y table 6 is driven.
- a transfer head 8 is disposed on the side of the X table 7 and moves in the X direction by driving the X table 7.
- the camera 9 functions as a recognition unit that captures an image of the lower part and recognizes the position of the electronic component or the circuit board 3, that is, the position in the XY plane.
- the Y table 6 and the X table 7 function as horizontal moving means for horizontally moving the transfer head 8, the camera 9, and the height detection sensor 10 to arbitrary positions on the base 1.
- a line camera 11 is arranged between the conveyance guide 2 and the component supply unit 4.
- the transfer head 8 is provided with a plurality of nozzle units 12 (in the first embodiment, for example, three nozzle units 12 are arranged in a line). At the lower end of each nozzle unit 12, a nozzle 13 for picking up and picking up the electronic component P from the parts feeder 5 is mounted.
- each nozzle 13 is an example of a work tool for performing an operation of mounting electronic components on the circuit board 3.
- Each nozzle unit 10 is provided with a lifting device 12a that lifts and lowers the nozzle 13 in the Z direction. The electronic component P is moved by lowering the nozzle 13 and pressing the lower surface of the electronic component P against the board surface 3a. It is designed to be mounted on board 3.
- the Z direction is a direction perpendicular to the X direction and the Y direction.
- the height detection sensor 10 projects the laser beam onto the measurement location s on the substrate surface 3a and receives the reflected light. By detecting the light, the height of the substrate surface 3a, that is, the position in the Z direction is detected.
- the detection result of the height detection sensor 10 is processed by the calculation unit 14, and a displacement amount d (hereinafter referred to as a displacement amount) d of the measurement location s from the work reference plane 3b is measured.
- the height detection sensor 10 and the calculation unit 14 function as a measurement unit that measures the amount of displacement of the measurement point s from the work reference plane 3b.
- the work reference plane 3b is a board surface 3a in a state where the flat circuit board 3 without warping or deformation is positioned by the transport rail 2.
- the work reference plane 3b has an excess or shortage of electronic components P.
- the lowering stroke of the nozzle 13, that is, the mounting height is set so that the mounting can be performed without pressing. Therefore, when the circuit board 3 is warped or deformed, the board surface 3a and the work reference surface 3b do not coincide with each other. Therefore, when mounting the electronic component P on the circuit board 3, it is necessary to correct the mounting height.
- the board surface 3a of the circuit board 3 is deformed into a convex shape with respect to the work reference surface 3b, that is, is curved so that the end of the circuit board 3 is positioned below.
- the upward displacement dl is the amount of correction for the mounting height, and is subtracted from the mounting height set for the work reference plane 3b.
- the downward displacement d2 is the correction amount for the mounting height, and is added to the mounting height set for the work reference plane 3b.
- the control unit 15 functions as a correction unit that corrects the mounting height based on the amount of displacement of the curved surface model stored in the storage unit 17 from the work reference surface 3b.
- the mounting height is corrected by adjusting the descending stroke of the nozzle 13 by controlling the driving of the nozzle 13.
- the storage unit 17 includes a storage area in which various data, control programs, and the like are stored in addition to the curved surface model.
- the input unit 16 inputs a control signal to the control unit 15 and inputs data and programs to be stored in the storage unit 17.
- FIG. 5A which is a partial schematic plan view of the board surface 3a of the circuit board 3
- the measurement points (sl to s4 are exemplified) are set on the board surface 3a by the input unit 16 with XY coordinate values.
- the arrangement pattern force stored in advance in the storage unit 17 may be selected.
- an optimum arrangement pattern can be selected.
- FIG. 5B which is a partial schematic plan view of the substrate surface 3a, shows an example in which an auxiliary measurement point is set in the vicinity of one measurement point si in the measurement points shown in FIG. 5A (illustrated by sl to s4). Yes.
- Auxiliary measurement points are set at four points, sxl and sx2 in the X direction, syl and sy2 in the Y direction, with the measurement point si as the center.
- the number and arrangement of the auxiliary measurement points can be selected and set as appropriate, but it is more preferable to set them in the four directions of the measurement points as in the first embodiment.
- the auxiliary measurement location can be set with an XY coordinate value by the input unit 16 or may be selected from an arrangement pattern stored in advance in the storage unit 17.
- a suitable arrangement pattern can be selected.
- four auxiliary measurement points are set in the vicinity of other measurement points s2, s3, and s4.
- the displacement is measured for the measurement points and auxiliary measurement points set in steps ST1 and ST2 (step ST3).
- the displacement amount is measured by processing the detection result of the height detection sensor 10 in the calculation unit 14, and the measured displacement amount is set for each measurement location and each measurement location.
- Displacement at auxiliary measurement location The quantity is set in one group and temporarily stored in the storage unit 17.
- one measurement point si and four auxiliary measurement points sx 1, sx2, syl, and sy2 associated with this measurement point si are set and stored in one group. It is.
- the other measurement points s2, s3, and s4 are stored together with the displacement at the auxiliary measurement point set for each measurement point in step ST2.
- step ST4 a determination is made as to whether the displacement measured in step ST3 is eligible as a sampling displacement.
- the difference between the maximum displacement amount and the minimum displacement amount is calculated for each group of displacement amounts stored in the storage unit 17, and the difference between the maximum displacement amount and the minimum displacement amount is compared with a predetermined threshold value.
- the predetermined threshold value is stored in advance in the storage unit 17, and is set to, for example, 0.3 mm in the first embodiment. If the difference between the maximum displacement amount and the minimum displacement amount within each displacement amount group is less than or equal to a predetermined threshold value, it is determined that the displacement amount at the measurement location included in this group is eligible as the sampling displacement amount. Then, the displacement amount at the measurement location is selected as the sampling displacement amount when assuming the curved surface model (step ST5).
- the difference between the maximum displacement amount and the minimum displacement amount within the displacement amount group is larger than a predetermined threshold V, and the displacement amount at the measurement location included in this group is not suitable as the sampling displacement amount. It is determined. In other words, the difference between the maximum displacement amount and the minimum displacement amount within the group is greater than a predetermined threshold, which means that there is no local step, slit, notch, etc. between the measurement location and the nearby auxiliary measurement location. If a displacement at such a measurement location is selected as the sampling displacement in the assumption of a curved surface model, local variations may occur on the substrate surface. It is reflected in the approximation of the shape, and there is a possibility that a curved surface model that is far from the actual shape of the substrate surface is assumed. Therefore, if the difference between the maximum displacement amount and the minimum displacement amount in the group is larger than a predetermined threshold, the measurement location included in this set is invalidated and a new measurement location is set near the measurement location ( Step ST6).
- step ST5 In the setting of a new measurement location, it is possible to set the XY coordinate value on the substrate surface 3a by the input unit 16 similarly to the setting in step ST1, or from the arrangement pattern stored in the storage unit 17 in advance. You may make it set automatically. In newly set measurement points Even so, the setting of auxiliary measurement points (step ST2), displacement measurement (step ST3), and eligibility determination (step ST4) are performed. If it is determined in step ST4 that the displacement at the new measurement location is qualified as the sampling displacement, the displacement at the new measurement location is selected as the sampling displacement (step ST5).
- the amount of displacement on a discontinuous surface such as a local step, a slit, or a notch on the substrate surface 3a is not a sampling displacement amount for assuming a curved surface model.
- the increase or decrease in the amount of displacement does not affect the assumption of the curved surface model.
- a curved surface model that approximates the shape of the actual board surface 3a is assumed, and the mounting height that is corrected based on the amount of displacement of the curved surface model from the work reference surface 3b is adjusted to an appropriate height. Lead to improved mounting quality.
- FIG. 6 shows a curved surface model 20 that assumes a substrate surface 3a that is warped and deformed convexly with respect to the work reference surface 3b.
- the curved surface model 20 is converted into a mathematical formula and stored in the storage unit 17, and all the locations on the curved surface model 20 are represented by the XYZ coordinate system.
- the calculation unit 14 functions as a calculation means for calculating the amount of displacement of the curved surface model 20 from the work reference surface 3b, and calculates the amount of displacement from the work reference surface 3b in all locations of the curved surface model 20.
- the Z coordinate value zm which is the displacement in the XY coordinate value (xm, ym) of the curved surface model 20
- the mounting height is corrected as the amount of correction when mounting this Z coordinate value zm on the board surface 3a.
- step ST8 the compatibility between the curved surface model 20 and the substrate surface 3a is determined.
- This judgment is based on the amount of displacement (measured value (measured displacement) measured at the sampling points used as the sampling displacement amount, based on how much deviation there is between the curved surface model 20 assumed in step ST7 and the substrate surface 3b. This is performed based on the difference between the displacement amount (calculated value (calculated displacement amount)) in the curved surface model 20 calculated from the XY coordinate values of the measurement location.
- the curved surface model 20 is compatible with the substrate surface 3a.
- the mounting height is corrected based on the displacement amount (calculated displacement amount) of the curved surface model 20 (step ST 9).
- the predetermined threshold is stored in advance in the storage unit 17, and is set to 0.3 mm, for example, in the first embodiment.
- the difference between the actually measured value (measured displacement amount) and the calculated value (calculated displacement amount) is larger than a predetermined threshold, it is determined that the curved surface model 20 does not conform to the substrate surface 3b.
- a new measurement point is additionally set in the vicinity of the measurement point where the difference from the calculated value exceeds the predetermined threshold (step ST10), and the number of measurement points is increased.
- the curved surface model 20 that is more suitable for the shape of the substrate surface 3a is assumed again.
- auxiliary measurement locations are set in step ST2
- the displacements are measured in step ST3, and then the displacements measured in step ST4 are measured. It is determined whether or not is suitable as a sampling displacement.
- the curved surface model 20 is assumed, again in step ST8, when it is determined that the newly assumed curved surface model 20 is suitable for the substrate surface 3a, the assumption of the curved surface model 20 is completed, and the newly assumed curved surface model is completed.
- the mounting height is corrected based on the amount of displacement of the cylinder 20 (step ST9).
- Such suitability determination is performed in the computing unit 14, and the computing unit 14 functions as a suitability judging means.
- FIG. 7 which is a schematic diagram showing how the electronic component is mounted at the mounting position of the circuit board 3, the mounting height when the electronic component P is mounted at an arbitrary mounting location m on the board surface 3a is h3. It is. Therefore, as shown in Fig. 6, the XY coordinate value (xm, ym) force of the mounting location m is also adjusted with respect to the work reference plane 3b by calculating the correction amount h2 by calculating the displacement amount zm of the curved surface model 20. The mounting height h3 is calculated by subtracting the correction amount h2 from the mounting height hi.
- the nozzle 13 that sucks and holds the electronic component P by the mounting height h3 thus corrected is lowered by the elevating device 12a, and the electronic material P is connected via the bonding material (for example, solder material).
- the electronic component P can be mounted on the circuit board 3 with high accuracy by pressing the component P against the circuit board 3.
- the curved surface model 20 approximated to the actual shape of the substrate surface 3a is assumed, and the curved surface model is thus obtained.
- the mounting height corrected based on the amount of displacement from the 20 work reference planes 3b is adjusted to an appropriate height, leading to improved mounting quality.
- the predetermined threshold value is set to 0.3 mm in step ST4 and step ST8 because the nozzle 13 that is lowered to mount the electronic component by driving the lifting device 12a is applied to the circuit board. Since about 0.3 mm is required as the amount of pushing in the electronic parts (the amount pushed in during pressing), an error of about 0.3 mm in the displacement of the substrate surface 3a is an allowable force. Therefore, it is preferable to improve the mounting quality by setting a predetermined threshold according to the pushing amount of the nozzle 13 as needed.
- a substrate production system comprising a plurality of work devices (hereinafter referred to as substrate work devices) for circuit boards as represented by the electronic component mounting apparatus 101 of the first embodiment.
- substrate work devices a substrate production system comprising a plurality of work devices (hereinafter referred to as substrate work devices) for circuit boards as represented by the electronic component mounting apparatus 101 of the first embodiment.
- the business processing system will be described with reference to the schematic explanatory diagram shown in FIG. In Figure 8,
- the substrate work processing system is configured by arranging a plurality of substrate work devices in the order of processes!
- the substrate working device 30 located at the uppermost stream of the process is provided with a height detection sensor 10, a calculation unit 14, a control unit 15, and a storage unit 17, and a curved surface expressed by a mathematical formula stored in the storage unit 17 is provided.
- the amount of displacement of the model from the work reference plane is calculated by the calculation unit 14, and the control unit 15 corrects the work height based on the amount of displacement and performs predetermined work processing on the substrate surface.
- the storage unit 17 of the substrate working device 30 is communicably connected to a control system including the calculation unit 14 and the control unit 15 provided in the substrate working devices 31, 32, and 33 disposed on the downstream side of the process. .
- the substrate working devices 31, 32, and 33 calculate the displacement amount of the work reference surface force of the curved surface model stored in the storage unit 17 of the substrate working device 30 in each operation unit 14, and calculate the displacement amount. Based on this, each control unit 15 corrects the working height and performs a predetermined work on the substrate surface.
- the curved surface model assumed by at least the substrate work apparatus positioned at the most upstream of the process. Based on this, it is possible to correct the work height in other board work devices, and the same curved surface model is used to correct the work height in all processes for performing various work on a single board. It leads to improvement. In addition, it is economical because it is only necessary to provide measuring means such as the height detection sensor 10 at least in the most upstream substrate working apparatus. Furthermore, since it is not necessary to measure the substrate surface for each process, the work time in each apparatus can be shortened, which is efficient.
- FIG. 9A is a schematic plan view showing a circuit board handled in the working device for the circuit board of the second embodiment
- FIG. 9B is a plan view showing a state in which the board surface of the circuit board of FIG. 9A is divided into a plurality of regions.
- FIG. In the first embodiment the entire board surface 3a of the circuit board 3 is assumed by one curved surface model 20, but in the second embodiment, the board surface 53a of the circuit board 53 is divided into arbitrary regions. This is different in that the shape of each section screen is assumed by a curved surface model, and the shape of the entire substrate surface 53a is assumed using a plurality of curved surface models. Only the differences from the first embodiment will be described below.
- FIG. 9A is a schematic plan view showing a circuit board handled in the working device for the circuit board of the second embodiment
- FIG. 9B is a plan view showing a state in which the board surface of the circuit board of FIG. 9A is divided into a plurality of regions.
- FIG. 9A is a schematic plan
- FIG. 9A shows a circuit board 53 in which slits 53c that are a plurality of openings are formed.
- the substrate surface 53a is divided into a plurality of regions with the position where the slit 53c is formed as a part of the partition line 53d.
- the substrate surface 53a is partitioned into, for example, three partition screens 53e, 53f, and 53g.
- the curved surface model of each of the section screens 53e, 53f, and 53g is assumed in the same manner as the assumption of the curved surface model of the substrate surface in the first embodiment.
- the lane marking 53d can be set as an XY coordinate value by the input unit 16, or a zoning pattern force stored in advance in the storage unit 17 may be selected.
- each curved surface model obtained by dividing one substrate surface 53b into a plurality of section screens 53e, 53f, and 53g a warped shape having a discontinuous warped shape or a complicated curved surface can be obtained. It is possible to assume a curved surface model that is more suitable for the substrate surface 53a on which a discontinuous surface due to a step, a slit, a notch, or the like exists.
- each section screen 53e, 53f, and 53g set at least three measurement points, and more preferably set the measurement points such as the vicinity of each corner and the middle position to measure the displacement. It is also preferable to make assumptions of curved surface models.
- auxiliary measurement location means to determine whether or not the displacement measured in the "measurement location” is appropriate as the sampling displacement. This is an auxiliary measurement point set in the vicinity of the measurement point. Therefore, it is used for the judgment of the above-mentioned suitability and not used for the assumption of a curved surface model.
- a circuit board generally includes a resist formation portion and an electrode formation portion, and these portions have different light reflectivities and the like, and the height detected by the height position detection sensor. It is possible that the data is different. Furthermore, the reflectance may be different even in the portion where the bonding material such as the cream solder is arranged on the circuit board. Therefore, an auxiliary measurement point is set near the periphery of the measurement point to determine whether the displacement measured at the measurement point is appropriate. From this point of view, it can be said that the auxiliary measurement point is not preferable if it is too close to or far from the measurement point.
- the approaching limit is the minimum electrode formation width formed on the circuit board, for example, 0.3 mm.
- the above is preferable. This is because such an electrode is the smallest of the uneven portions formed on the circuit board.
- the limit of separation if it is too far away, the original purpose of supplementing the measurement value at the measurement point cannot be achieved. For example, it is preferable to set it within 5 mm and at most 10 mm.
- the circuit loaded first is used.
- the measurement location and the auxiliary measurement location are set for the board, and a curved surface model is assumed.
- the first round is performed.
- the measurement location can be set at the same position as the measurement location set on the road board, and the curved surface model can be assumed without setting the auxiliary measurement location.
- the above-mentioned step of determining the suitability can be performed by setting the measurement location at the same position on the subsequent circuit board! This is because it can be skipped. In such a case, the assumption of a curved surface model can be made efficiently.
- the working device for the circuit board is an electronic component mounting device
- such a working device is soldered to the work surface of the circuit board.
- the present invention can also be applied to a dicing apparatus for dicing a substrate.
- the circuit board is formed of, for example, a relatively soft material and the amount of warpage is large
- the circuit board is disposed or operated above the circuit board conveyance path and its holding position. There may be a case where the constituent members of the circuit board and the circuit board interfere with each other.
- the amount of warping of the circuit board is determined by comparing with a preset threshold value, so that there is a possibility of interference with other components.
- a circuit board having a large amount of warpage is specified, and an error display of work processing is output. So As a result, it is possible to prevent the actual processing of interference with other components by stopping the work process for the circuit board having a large amount of warping.
- a method for further improving the height detection accuracy by the height detection sensor that detects the height of the measurement location by projecting the laser beam can be performed in combination with each of the above embodiments.
- a vacuum sensor is provided in the vacuum suction path of the nozzle for sucking and holding the electronic component, and the nozzle at a certain height is gradually lowered while performing vacuum suction. After that, the vacuum sensor detects the timing at which the vacuum pressure in the vacuum suction path has increased significantly, and acquires the encoder value in the nozzle lifting device at this timing.
- Such timing is the timing at which the tip of the nozzle comes into contact with the board surface of the circuit board, and the encoder position can be used to detect the height position of the board surface of the circuit board at the time of nozzle contact. it can.
- the height position of the board surface is detected by the height detection sensor at the same position on the circuit board.
- the difference from the value detected by the height detection sensor is calculated and stored as an offset correction amount.
- the offset correction amount is +0.2 mm, and then the height detection sensor + 0.2mm is added to the height position acquired by the above. Value value Corrected height position data is handled.
- the sensor for detecting the timing when the nozzle contacts the substrate surface is a vacuum sensor (pressure sensor)
- a flow rate sensor for detecting a vacuum suction amount may be used instead of the case where the sensor for detecting the timing when the nozzle contacts the substrate surface.
- the detection of the height position using the nozzle is performed on the group of the flattest surface among the groups of the measurement location and the auxiliary measurement location on the board surface of the circuit board.
- the working height can be accurately corrected assuming a curved surface model approximated by the shape of the circuit board surface, so that a step, slit, or notch is formed on the target circuit board. Even if there is a discontinuous surface due to the influence of the above, it has the advantage that it can be maintained satisfactorily without degrading the quality of work on the circuit board. This is useful in the field of mounting components.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/095,083 US7809461B2 (en) | 2005-11-29 | 2006-11-24 | Working apparatus and working method for circuit board |
CN2006800445367A CN101317502B (zh) | 2005-11-29 | 2006-11-24 | 针对电路基板的操作装置和操作方法 |
DE112006003165T DE112006003165T5 (de) | 2005-11-29 | 2006-11-24 | Arbeitsvorrichtung und Arbeitsverfahren für Schaltungsplatinen |
JP2007511553A JP4185960B2 (ja) | 2005-11-29 | 2006-11-24 | 回路基板に対する作業装置及び作業方法 |
KR1020087012300A KR101268230B1 (ko) | 2005-11-29 | 2008-05-23 | 회로 기판에 대한 작업 장치 및 작업 방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2005-343272 | 2005-11-29 | ||
JP2005343272 | 2005-11-29 |
Publications (1)
Publication Number | Publication Date |
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WO2007063763A1 true WO2007063763A1 (ja) | 2007-06-07 |
Family
ID=38092098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/323397 WO2007063763A1 (ja) | 2005-11-29 | 2006-11-24 | 回路基板に対する作業装置及び作業方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7809461B2 (ja) |
JP (1) | JP4185960B2 (ja) |
KR (1) | KR101268230B1 (ja) |
CN (1) | CN101317502B (ja) |
DE (1) | DE112006003165T5 (ja) |
WO (1) | WO2007063763A1 (ja) |
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JP2009027015A (ja) * | 2007-07-20 | 2009-02-05 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着方法及び電子部品装着装置 |
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JP2009253038A (ja) * | 2008-04-07 | 2009-10-29 | Fuji Mach Mfg Co Ltd | 基板高度測定システムおよび電子部品実装機および基板高度測定方法 |
JP2009259984A (ja) * | 2008-04-15 | 2009-11-05 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置及び電子部品装着方法 |
JP2011233738A (ja) * | 2010-04-28 | 2011-11-17 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置、電子部品装着方法及び基板高さデータ編集装置 |
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WO2012056617A1 (ja) * | 2010-10-27 | 2012-05-03 | パナソニック株式会社 | 電子部品実装用装置および電子部品実装用の作業実行方法 |
JP2012094673A (ja) * | 2010-10-27 | 2012-05-17 | Panasonic Corp | 電子部品実装用装置および電子部品実装用の作業実行方法 |
DE112011103582T5 (de) | 2010-10-27 | 2013-08-29 | Panasonic Corp. | Bestückungsvorrichtung für elektronische Bauteile und Betriebsdurchführungsverfahren zum Bestücken von elektronischen Bauteilen |
JP2013004828A (ja) * | 2011-06-20 | 2013-01-07 | Panasonic Corp | 電子部品実装用装置および電子部品実装用の作業実行方法 |
WO2013005480A1 (ja) * | 2011-07-01 | 2013-01-10 | 富士機械製造株式会社 | レーザー高さ測定装置および部品実装機 |
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JPWO2014033856A1 (ja) * | 2012-08-29 | 2016-08-08 | 富士機械製造株式会社 | 基板用作業機器の基板高さ補正方法 |
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JPWO2015056785A1 (ja) * | 2013-10-17 | 2017-03-09 | ヤマハ発動機株式会社 | 部品実装装置 |
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JP2016219525A (ja) * | 2015-05-18 | 2016-12-22 | パナソニックIpマネジメント株式会社 | 部品実装装置における高さセンサの測定位置補正方法及び部品実装装置 |
WO2018216132A1 (ja) * | 2017-05-24 | 2018-11-29 | 株式会社Fuji | 測定位置決定装置 |
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JP2021124381A (ja) * | 2020-02-05 | 2021-08-30 | 日本電気硝子株式会社 | ガラス板の形状測定方法及びガラス物品の製造方法 |
JP7331719B2 (ja) | 2020-02-05 | 2023-08-23 | 日本電気硝子株式会社 | ガラス板の形状測定方法及びガラス物品の製造方法 |
EP4120814A4 (en) * | 2020-03-11 | 2023-03-15 | Fuji Corporation | DEVICE AND METHOD FOR MEASURING THE HEIGHT OF A SUBSTRATE |
JP7507412B2 (ja) | 2020-05-26 | 2024-06-28 | パナソニックIpマネジメント株式会社 | 部品装着装置および部品装着システム |
WO2023144862A1 (ja) * | 2022-01-25 | 2023-08-03 | 株式会社Fuji | 基板の製造方法および部品実装機 |
Also Published As
Publication number | Publication date |
---|---|
US20090125141A1 (en) | 2009-05-14 |
DE112006003165T5 (de) | 2008-12-24 |
US7809461B2 (en) | 2010-10-05 |
CN101317502B (zh) | 2011-02-16 |
JP4185960B2 (ja) | 2008-11-26 |
CN101317502A (zh) | 2008-12-03 |
KR20080070829A (ko) | 2008-07-31 |
KR101268230B1 (ko) | 2013-05-31 |
JPWO2007063763A1 (ja) | 2009-05-07 |
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