WO2006123508A1 - Dispositif de traitement de composants fragiles - Google Patents

Dispositif de traitement de composants fragiles Download PDF

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Publication number
WO2006123508A1
WO2006123508A1 PCT/JP2006/308509 JP2006308509W WO2006123508A1 WO 2006123508 A1 WO2006123508 A1 WO 2006123508A1 JP 2006308509 W JP2006308509 W JP 2006308509W WO 2006123508 A1 WO2006123508 A1 WO 2006123508A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive tape
tape
peeling
wafer
brittle
Prior art date
Application number
PCT/JP2006/308509
Other languages
English (en)
Japanese (ja)
Inventor
Takeshi Akechi
Original Assignee
Lintec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corporation filed Critical Lintec Corporation
Publication of WO2006123508A1 publication Critical patent/WO2006123508A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Definitions

  • the present invention relates to a brittle member processing apparatus and processing method, and more particularly to a brittle member processing apparatus having a function of transferring a semiconductor wafer subjected to back grinding to a ring frame.
  • a semiconductor wafer (hereinafter simply referred to as “wafer”) having a circuit surface formed is subjected to back surface grinding with a protective sheet applied to the circuit surface, and then to a ring frame.
  • a mounting process for integrating the wafer and a peeling process for peeling the protective sheet from the wafer are performed.
  • a wafer processing apparatus that performs the processing is described in Patent Document 1, for example.
  • a wafer is disposed on the inner peripheral side of the ring frame, and a mounting device for attaching a mounting tape to the wafer and the ring frame to integrate them together, and a circuit surface side of the wafer And a peeling device for adhering the peeling tape to the protective sheet attached to the wafer and peeling the protective sheet from the wafer while pulling the peeling tape obliquely upward.
  • Patent Document 1 JP 2000-68293 A
  • the wafer and the ring frame can be integrated, that is, the mounting and the protective sheet peeling process can be performed in a series of steps.
  • the rigidity is sufficient to support the wafer during grinding when a protective sheet is simply applied to the circuit surface.
  • the protective sheet cannot be secured, and ultra-thin grinding with surface smoothness cannot be achieved.
  • the protective sheet is required to have heat resistance and corrosion resistance due to surface treatment such as sputtering and metal deposition on the backside of the wafer. The actual situation is that the protection sheet cannot meet the demands.
  • a hard member such as a glass plate having a certain rigidity or plate thickness is attached to the circuit surface through a double-sided adhesive sheet, and the wafer is damaged by using the rigidity or plate thickness of the hard member.
  • the back grinding is performed extremely thinly without giving.
  • Patent Document 1 cannot separate the hard member from the wafer, and therefore, in a separate work process. In this case, it is necessary to peel off the hard member and the wafer, resulting in a disadvantage that the processing efficiency is hindered and the working efficiency is greatly reduced.
  • the present inventor has proposed a wafer processing apparatus that peels off a hard member that supports a wafer and transfers the wafer to a ring frame (Japanese Patent Application No. 2004-343736).
  • the purpose of the present invention is to effectively prevent the adhesive tape from stretching when transferring a brittle member affixed to a hard member to a frame, thereby eliminating the obstacles to peeling the hard member from the brittle member force. It is an object of the present invention to provide a brittle member processing apparatus that can do this.
  • the present invention uses a brittle member affixed to a hard member as an object to be processed, and removes the hard member force brittle member to be provided on a predetermined frame.
  • a brittle member affixed to a hard member as an object to be processed, and removes the hard member force brittle member to be provided on a predetermined frame.
  • the second adhesive tape is affixed to the opposite side of the surface of the first adhesive tape to which the brittle member is bonded, and the transfer is performed.
  • the present invention also provides a semiconductor wafer attached to a hard member via a double-sided adhesive tape.
  • the hard member force semiconductor wafer is peeled off and transferred to a first adhesive tape attached to a ring frame.
  • the second adhesive tape is affixed to the opposite side of the surface of the first adhesive tape to which the semiconductor wafer is adhered, and the transfer is performed.
  • the first and second adhesive tapes can be configured to be sequentially affixed through two affixing units.
  • the first adhesive tape is an ultraviolet curable adhesive tape.
  • an adhesive tape having a lower adhesive strength than that of the first adhesive tape is used as the second adhesive tape.
  • the second adhesive tape is higher in rigidity than the first adhesive tape.
  • the second adhesive tape is provided with an external force S smaller than that of the first adhesive tape.
  • the adhesive tape for supporting the semiconductor wafer on the ring frame has a two-layer structure of the first adhesive tape and the second adhesive tape, the adhesive tape is attached to the semiconductor wafer. It is prevented that the adhesive tape is stretched by the peeling force when peeling the hard member, and the hard member can be peeled reliably and smoothly.
  • the second adhesive tape is peeled off after the transfer is performed, so that the support for picking up the chip of the semiconductor wafer will be supported by the first adhesive tape in the subsequent process. It is possible to sufficiently push up the tip.
  • FIG. 1 is a schematic perspective view showing an overall configuration of a wafer processing apparatus.
  • FIG. 2 is a cross-sectional view showing a series of steps in which an object to be treated is transferred to a ring frame.
  • FIG. 3 is a schematic perspective view of the mounting device.
  • FIG. 4 is a schematic perspective view of a transfer device.
  • FIG. 5 is a schematic perspective view showing a state in which a wafer is transferred to the ring frame side by a transfer device.
  • FIG. 6 is a schematic perspective view of a peeling apparatus.
  • FIG. 7 is an explanatory diagram of the peeling operation.
  • FIG. 1 shows a schematic perspective view in which a brittle member processing apparatus according to the present invention is applied to a wafer processing apparatus, and FIG. 2 illustrates the wafer processing steps over time.
  • FIG. 2 illustrates the wafer processing steps over time.
  • the processing object A according to the present embodiment has an UV curable adhesive on the side of the circuit surface (lower surface in the figure) of Weno as a brittle member.
  • a glass plate P as a hard member is bonded via a double-sided pressure-sensitive adhesive sheet S by adhesive.
  • the double-sided pressure-sensitive adhesive sheet S in this embodiment has a three-layer structure having an ultraviolet curable adhesive on one surface of the base sheet and a weakly viscous adhesive on the other surface.
  • FIG. 2 shows a schematic perspective view in which a brittle member processing apparatus according to the present invention is applied to a wafer processing apparatus
  • FIG. 2 illustrates the wafer processing steps over time.
  • FIG. 2 illustrates the wafer processing steps over time.
  • this processing object A includes a dicing tape DT constituting the first adhesive tape and a second dicing tape DT in a state where the wafer W is disposed on the inner peripheral side of the ring frame RF. It is integrated through the reinforcing tape RT that constitutes the adhesive tape. Then, as shown in FIG. 2 (C), after the glass plate P is peeled off at the interface between the double-sided pressure-sensitive adhesive sheet S and the glass plate P, the reinforcing tape RT is applied as shown in FIG. 2 (D). Further, as shown in FIG.
  • the double-sided adhesive sheet S left on the circuit surface side of the wafer W is peeled off from the wafer W, and finally, In particular, a process is performed in which only the wafer W is left inside the ring frame RF via the dicing tape DT (see FIG. 2 (F)).
  • the wafer processing apparatus 10 takes out the processing objects A stored in the magazine 11 one by one via the robot arm 12 and at the same time, the ultraviolet ray curable pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive sheet S.
  • UV irradiation device 13 that cures
  • alignment device 16 that transfers and positions the processing object A irradiated with ultraviolet rays with this UV irradiation device 13, and a mount that integrates processing object A into the ring frame RF Apparatus 17, transfer apparatus 20 for peeling glass plate P from processing object A and transferring wafer W to ring frame RF, and both surfaces left on the circuit surface side of the reinforcing tape RT and wafer W
  • a peeling device 21 for peeling the pressure-sensitive adhesive sheet S and a stock force 23 for storing the double-sided pressure-sensitive adhesive sheet S in a state of being supported by the wafer W-caging frame RF after being peeled off are configured.
  • the robot arm 12 that takes out the processing object A from the magazine 11 includes a multi-joint arm portion 12A and a lifting body 12B that supports the multi-joint arm portion 12A.
  • the tip of the articulated arm 12A has a bifurcated shape, and the tip of the branch is provided with a suction part (not shown), which sucks the back side (upper side) of the processing object A.
  • the processing object A positioned by the alignment device 16 is attracted and transferred to the mounting device 17 side.
  • the ultraviolet irradiation device 13 includes a slide table 27 that can move along a pair of guide rails 25 and 25 arranged substantially parallel to each other, and an ultraviolet irradiation unit 28 positioned above the slide table 27. It consists of.
  • the slide table 27 moves along the guide rail 25 with the processing object A placed thereon, thereby curing the ultraviolet curable adhesive layer side of the double-sided adhesive sheet S for peeling described later. Get ready! /
  • the alignment device 16 includes a plate member 30 having a substantially rectangular outer shape in plan view, a central table 31 provided at the center of the plate member 30, and a flat surface supported by the plate member 30. And a pair of convex portions 32, 32 which are provided so as to be separated from each other and have a substantially semicircular shape in plan view.
  • the central table 31 is substantially horizontal.
  • the processing object A is rotated and positioning is performed to specify the crystal direction of the wafer W by a camera or the like (not shown) while the convex portions 32 and 32 are brought close to each other. Wafer W can be centered.
  • a slider 36 that can be moved via a rodless cylinder 35 and a slider 36 that can be moved up and down, and a bifurcated branch at the tip side.
  • a suction arm 37 having a portion is provided. The suction arm 37 sucks the processing object A and transfers the processing object A from the ultraviolet irradiation device 13 to the alignment device 16 side.
  • the mounting device 17 integrates the ring frame RF and the processing object A with the mounting table 40 that supports the ring frame RF and the processing object A, and the ring frame RF and the processing object A.
  • the ring frame RF is stocked in a stacked state on a stock table 42 disposed on the side of the mount table 40, and is mounted by the transfer arm 43 having the uppermost ring frame RF force adsorption part 43A. Transferred on 40.
  • the transfer arm 43 is supported by a slide block 45 that is movable via a single-axis bot 44. Further, the stock table 42 is supported by the lifting robot 46 so as to be able to move up and down, and each time the adsorption part 43A force S ring frame RF of the transfer arm 43 is sucked and transferred, the thickness of the ring frame RF is increased. It is going to rise.
  • the mount table 40 is provided so as to be movable up and down on a slide base 48 provided to be movable along a pair of guide rails 47, 47, and when the transfer arm 43 is positioned on the mount table 40.
  • the ring frame RF is provided so that it can be raised to a height position.
  • the first attaching unit 41A attaches the dicing tape DT to the ring frame RF and the back surface (upper surface in the drawing) of the wafer W.
  • the dicing tape DT in the present embodiment is used as a raw fabric L1 in which a strip-shaped release sheet is affixed to one surface of a belt-shaped ultraviolet curable resin tape, and the fat in the raw fabric L1. Tape side By forming closed-loop cuts therein, dicing tape DT having a substantially circular shape in plan view is formed at predetermined intervals.
  • the first sticking unit 41A is rotatably supported in a plane of a plate-like frame F directed in a substantially vertical plane, and a predetermined motor is provided by a torque motor (not shown) provided on the back side of the frame F.
  • a feeding roll 50A that supports the original fabric L1 so that the original fabric L1 can be fed out while applying tension, a peel plate 51A that abruptly reverses the feeding direction of the fed original fabric L1, and peels the dicing tape DT.
  • a press roll 52A arranged along the leading edge of the sheet plate 51A, a drive roll 55A that applies a scraping force to the original fabric L1, a nip roll 56A that sandwiches the original fabric L1 between the drive roll 55A, and a dicing tape DT.
  • the take-up roll 53A is composed of a take-up roll 53A for fixing and winding the lead end of the peeled original L1, and a guide roll 54A arranged in the middle of the feeding path.
  • the take-up roll 53A is connected to the output shaft of a motor (not shown) provided on the back side of the frame F by a pulley in the drive roll 55A, and the original fabric from which the dicing tape DT has been peeled off via a sliding belt.
  • L1 can be wound up without slack.
  • the second pasting unit 41B has substantially the same device configuration as the first pasting unit 41A. Accordingly, the same reference numerals used in the description of the first sticking unit 41A are the same, and “B” is appended to the reference numerals and description thereof is omitted.
  • the raw fabric L2 used in the second pasting unit 41B is one in which a strip-shaped release sheet is pasted on one surface of a strip-shaped grease tape. By forming cuts in a closed loop shape in the surface of the tape, a reinforcing tape RT having a substantially circular shape in plan view is formed at predetermined intervals.
  • This reinforcing tape RT has a lower adhesive strength than that of the dicing tape DT, and has a rigidity higher than that of the dicing tape DT, that is, a material having a lower back.
  • the outer diameter of the reinforcing tape RT is set smaller than the outer diameter of the dicing tape DT.
  • the transfer device 20 is positioned at a position where it does not interfere with the suction table 60 that supports the glass plate P of the processing object A and the glass plate P.
  • a separation trigger 62 (see Fig. 2 (B)) is formed at the boundary between the pair of arms 61 and 61 that support the ring frame RF, and the UV curable adhesive layer of the glass plate P and double-sided adhesive sheet S.
  • a driving means 64 for moving the suction table 60 and the arms 61 and 61 relative to each other so that the glass plate P and the double-sided pressure-sensitive adhesive sheet S start to peel from the peeling tacking part 62. Yes.
  • the suction table 60 has a top surface with a substantially U-shaped recess 60A in plan view at the center thereof.
  • the arcuate part of the U-shaped part is provided approximately the same shape as the outer periphery of the glass plate P, and the ring frame RF is placed on the arm 61 so that the glass plate P is pressed in the arc-shaped direction of the U-shaped part.
  • the object to be processed A can be positioned in the X direction when it is slid to.
  • a large number of suction holes 60B are provided on the bottom surface of the recess 60A.
  • the concave portion 60 is set to a depth corresponding to the thickness of the glass plate P, whereby the upper surface position of the glass plate P, that is, the interface outer peripheral portion of the double-sided pressure-sensitive adhesive sheet S is peeled off.
  • the part 62 is configured to be formed.
  • the suction table 60 can be moved up and down via a lifting device (not shown). After the suction table 60 is temporarily lowered, the wafer W and the glass plate P are peeled off, and then the both surfaces of the wafer W are removed. Adhesive sheet S and glass plate P are kept against re-bonding
  • Steps 61A and 61A are formed on the pair of arms 61 and 61, respectively, to restrict displacement in the Y direction when the ring frame RF is placed.
  • a connecting bar 66 is provided between one end of each of the arms 61, 61, that is, one end on the left side in front of FIG. 4. This connecting bar 66 can be held so as to restrict the movement of the ring frame RF.
  • Two chuck members 68, 68 are provided.
  • the peeling tacking portion forming device 63 includes a single-axis robot 70, a standing block 71 movable along the single-axis robot 70, and an upper end portion of the standing block 71.
  • the blade member 72 is attached to the blade member 72.
  • the leading end side of the blade member 72 is provided so as to advance and retreat along the upper surface of the suction table 60 when the upright block 71 moves along the single-axis robot 70. Therefore, when the leading edge 72A of the blade member 72 moves forward toward the center of the suction table 60, the leading edge 72A enters from the outer peripheral side of the glass plate P and double-sided adhesive tape S, and the glass plate P and double-sided adhesive tape S.
  • a gap is formed at the interface with the UV curable adhesive layer, and the gap is formed as a peeling tack 62 It is supposed to be.
  • the driving means 64 extends through the blocks 74, 74 provided at the ends of the pair of arms 61, 61 and has a rotating shaft 75 supported by a support frame (not shown).
  • the motor 61 is configured to rotate the rotating shaft 75 in the circumferential direction.
  • the arms 61 and 61 have the rotating shaft 75 as the center of rotation and the side on which the connecting bar 66 is provided.
  • One end can be rotated as a free end. That is, the arms 61 and 61 are rotatably provided between an initial position where the arms 61 and 61 are kept substantially horizontal and a position where the free end rises and the entire arm 61 stands.
  • a transfer arm 78 that is movable via a single-axis robot 77 is provided at a lateral position between the transfer device 20 and the mount device 17, and the transfer arm 78 is provided with the dicing table 78.
  • the processing object A integrated with the ring frame RF is adsorbed via the DT and the reinforcing tape RT, and transferred to the transfer device 20.
  • a glass plate removing device 80 is provided in the right side region in FIG. 5 of the transfer device 20.
  • the glass plate removing device 80 includes a slider 82 that can move along a cylinder 81 that extends in the Y-axis direction, a suction arm 85 that is supported via a Z-axis cylinder 83 provided on the slider 82, and It consists of an elevating type collection table 86 that can collect and collect glass plates P in multiple stages.
  • This inversion transfer device 88 includes a single-axis robot 89 disposed along the Y-axis direction, a single-axis robot 91 for lifting supported by a slider 90 moving along the single-axis robot 89, The lifting / lowering slider 92 moves along the lifting / lowering single-axis robot 91, and the reverse suction arm 93 rotatably supported by the lifting / lowering slider 92.
  • the reverse adsorption arm 93 adsorbs the upper surface portion of the ring frame RF and then transfers it to the peeling adsorption table 100 or receives the ring frame RF from the receiving device 94 described later when the ring frame RF is reversed. It is provided as follows.
  • the receiving device 94 includes a Z-axis single-axis robot 96, a slider 97 supported by the Z-axis single-axis robot 96, and the slider 97. Elevating The lifting / lowering suction arm 98 is configured to suck the ring frame RF portion and transfer it to the reversing suction arm 93 after peeling of the reinforcing tape RT described later.
  • the peeling device 21 includes a pair of guide rails 101, 101 that support the peeling suction table 100 so as to be movable in the X direction, and between these guide rails 101.
  • a feed screw shaft 102 (not shown) that is disposed and extends through the nut member, and a peeling unit 105 that peels the reinforcing tape RT and the double-sided adhesive sheet S. It is configured.
  • the peeling unit 105 includes a peeling tape supply unit 106, a peeling tape bonding unit 107, and a peeling tape pulling unit 108.
  • the peeling tape supply unit 106 is disposed in a plane of the first elevating plate 111 and the first elevating plate 111 supported so as to be movable up and down along the first cylinder 110 extending in the Z-axis direction.
  • the guide member 115 includes a substantially L-shaped bracket 120 connected to the horizontal cylinder 117. The bracket 120 is positioned so that its long side is in a substantially horizontal plane and guides the peeling tape PT on the upper surface side. It is provided.
  • the peeling tape bonding portion 107 includes a second cylinder 121 extending in the Z-axis direction, a second lifting plate 122 supported by the second cylinder 121 so as to be movable up and down, and the second lifting and lowering plate.
  • the cutter blade 123 is disposed in the plane of the plate 122, the cutter receiver 124 is located below the cutter blade 123, and the welding unit 125 is provided adjacent to the cutter blade 123.
  • the cutter receiver 124 is supported by a cylinder (not shown) provided on the back surface of the second lifting plate 122 so as to be able to protrude and retract with respect to the surface of the second lifting plate 122, and the cutter blade 123 has a cutter blade 123.
  • the welding unit 125 includes a heat block 129 at the lower end of the piston rod 128 extending downward from the lower end of the cylinder body 127.
  • the heat block 129 attaches the peeling tape PT to the reinforcing tape RT or the wafer W.
  • the double-sided pressure-sensitive adhesive sheet S is welded.
  • the release sheet pulling portion 108 includes a cylinder 130 along the guide rail 101 at a position facing the release tape supply portion 106 and the release tape adhesive portion 107, and a slider that moves along the cylinder 130. 132 and a chuck 136 provided at the tip of the arm 134 supported by the slider 132.
  • the chuck 136 includes a lower jaw 136A and an upper jaw 136B, and is provided so as to sandwich and hold the peeling tape PT by closing the space between the lower jaw 136A and the upper jaw 136B. Therefore, after the chuck 136 sandwiches the peeling tape PT and a part of the peeling tape PT is welded to the reinforcing tape RT or the double-sided adhesive sheet S, the chuck is placed on the right side in FIGS. 7B and 7D. By moving 136, the reinforcing tape RT or the double-sided adhesive sheet S is pulled, and the surface force of the dicing tape DT and the wafer W is gradually peeled off. The peeled reinforcing tape RT and double-sided adhesive sheet S are discarded in a waste box (not shown).
  • a final transfer device 140 is arranged on the side of the peeling tape bonding portion 107.
  • the final transfer device 140 also has a force with a cylinder 141 extending in the X-axis direction, a slider 142 supported by the cylinder 141, and a suction arm 144 supported by the slider 142 so as to be movable up and down.
  • the adsorption arm 144 adsorbs the ring frame RF on the peeling table 100 that has moved downward, and between the pair of passage forming bodies 145, 145 having an L-shaped cross section located on the extension line of the guide rail 101,
  • the wafer W integrated with the ring frame RF is transferred.
  • the ring frame RF transferred between the passage forming bodies 145 is configured to be accommodated in the stocker 23 via the kicker 146 disposed between the passage forming bodies 145! RU
  • the processing objects A stored in the magazine 11 are taken out one by one by the robot arm 12 and transferred to the ultraviolet irradiation device 13.
  • ultraviolet rays are irradiated through the glass plate P of the processing object A to cure the ultraviolet curable pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive sheet S, and are prepared for peeling in a subsequent process.
  • the processing object A that has been irradiated with ultraviolet rays is transferred to the alignment device 16 by the suction arm 37, and the alignment device 16 identifies and centers the crystal orientation. So Then, the aligned processing object A is transferred to the mount table 40 of the mount device 17 via the robot arm 12. At this time, the ring frame RF is previously transferred to the mount table 40 by the operation of the transfer arm 43.
  • the mount table 40 moves in a direction passing below the first sticking unit 41A and the second sticking unit 41B.
  • the dicing tape DT and the reinforcing tape RT that are peeled off sequentially at the tip positions of the peel plates 51A and 51B of each unit 41A and 41B are applied under the pressing force of the press rolls 52A and 52B.
  • Object A and ring frame RF are integrated together.
  • the processing object A and the ring frame RF integrated in this way are adsorbed to the transfer arm 78 waiting above the mount table 40. It is held and transferred to the transfer device 20.
  • the glass plate P is received and held in the recess 60A provided in the central portion of the suction table 60 of the transfer device 20, while the ring frame RF is supported by the arm 61.
  • 61 are received in the step portions 61A, 61A formed on the inner side of each, and in this state, the outer peripheral portion of the chuck member 68 force S ring frame RF provided on the connecting bar 65 side is sandwiched.
  • the peeling tacking portion forming device 63 is operated, and the blade member 72 is moved forward along the upper surface of the suction table 60 toward the center of the object A to be processed.
  • a gap is formed, and the peeling tack 62 is formed by the gap.
  • the motor M of the driving means 64 is driven, and the free end side of the pair of arms 61, 61 is rotated so as to be spaced upward from the suction table 60.
  • the adhesion area between the glass plate P and the double-sided adhesive sheet S gradually decreases, and when the arm 61 rotates to a certain standing angle, for example, approximately 45 degrees, the adhesion area between the two becomes smaller.
  • the wafer W becomes zero, and the double-sided adhesive sheet S and the glass plate P force are completely peeled off and transferred to the wafer W holding frame RF.
  • the wafer W is supported by the dicing tape DT and the reinforcing tape RT, there is no inconvenience that the dicing tape is extended. Separation can be performed reliably.
  • the arms 61 and 61 return to the initial horizontal posture.
  • the adsorption table 60 is lowered in a direction to slightly lower the upper surface position, and the double-sided pressure-sensitive adhesive sheet S existing on the lower surface side of Ueno and W is kept so as not to adhere to the glass plate P again. It is.
  • the ring frame RF returned to the initial horizontal posture and the wafer W transferred to and integrated with the ring frame RF are attracted and held by the reversing suction arm 93 of the reversing transfer device 88 to be separated from the peeling tape. Bull 100 (see Fig. 7 (A)).
  • the reinforcing tape RT is peeled off when the peeling table 100 passes below the peeling device 21. That is, the peeling table 100 moves below the peeling unit 105, the peeling tape PT is welded to the end of the reinforcing tape RT, and the chuck 136 that holds the peeling tape PT relatively moves in the lateral direction. Thus, the reinforcing tape RT can be peeled off from the dicing tape DT (see FIG. 7B). At this time, the reinforcing tape RT has a smaller outer shape, that is, a diameter than the dicing tape DT, so that there is no inconvenience that the RF force of the dicing tape DT carrying frame is also peeled off.
  • the operation is substantially the same as the previously proposed Japanese Patent Application No. 2004-343736.
  • the peeling table After the reinforcing tape RT is peeled off, the peeling table returns to the receiving device 94 side, and the receiving device 94 adsorbs and rises the wafer W integrated with the ring frame RF.
  • the reverse suction arm 93 is positioned on the lower surface side, sucks the ring frame RF, reverses the top and bottom, and is transferred again onto the peeling table 100, whereby the double-sided adhesive sheet S appears on the upper surface side. State. Then, the double-sided pressure-sensitive adhesive sheet S is peeled off through the peeling unit 105 in the same manner as the operation of peeling off the reinforcing tape RT.
  • the wafer W from which the double-sided pressure-sensitive adhesive sheet S has been peeled is adsorbed together with the ring frame RF and stored in the stock force 23, and after reaching a predetermined stock amount, dicing and die bonding. Post-process processing is performed.
  • the reinforcing tape RT is attached to the dicing tape DT. Therefore, when the glass plate is peeled off, the disadvantage that the dicing tape is extended can be eliminated and the glass plate can be peeled off reliably.
  • the reinforcing tape DT is peeled off from the dicing tape through the peeling unit, the chip can be pushed up smoothly as before when picking up the chip after dicing. It becomes possible.
  • the brittle member is the semiconductor wafer W
  • the present invention can also be applied to the case where other brittle plate-like bodies are transferred.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)

Abstract

Dans un objet (A) à traiter, une galette de semi-conducteur (W) est collée à une plaque de verre (P) au moyen d'une bande adhésive double face (S). La galette de semi-conducteur (W) est transférée et collée par décollement de la plaque de verre (P) après avoir été collée à une bande de découpage (DT) collée sur une structure annulaire (RF). Sur un plan extérieur de la bande de découpage (DT), une bande de renfort (RT) est collée afin d'empêcher que la bande de découpage (DT) s'étire au moment du décollement de la plaque de verre (P).
PCT/JP2006/308509 2005-05-16 2006-04-24 Dispositif de traitement de composants fragiles WO2006123508A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005142246A JP2006319233A (ja) 2005-05-16 2005-05-16 脆質部材の処理装置
JP2005-142246 2005-05-16

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WO2006123508A1 true WO2006123508A1 (fr) 2006-11-23

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TW (1) TW200705576A (fr)
WO (1) WO2006123508A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008055155A1 (de) * 2008-12-23 2010-07-01 Thin Materials Ag Trennverfahren für ein Schichtsystem umfassend einen Wafer
JP5996347B2 (ja) * 2012-09-24 2016-09-21 リンテック株式会社 シート剥離装置及び剥離方法、並びに、シート貼替装置及び貼替方法
JP5589045B2 (ja) * 2012-10-23 2014-09-10 日東電工株式会社 半導体ウエハのマウント方法および半導体ウエハのマウント装置
JP2015225881A (ja) * 2014-05-26 2015-12-14 株式会社ディスコ テープの貼着方法
JP6401009B2 (ja) * 2014-10-15 2018-10-03 株式会社ディスコ ウエーハの加工方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003332267A (ja) * 2002-05-09 2003-11-21 Lintec Corp 半導体ウエハの加工方法
JP2004119992A (ja) * 1997-02-10 2004-04-15 Lintec Corp チップ体製造用粘着シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119992A (ja) * 1997-02-10 2004-04-15 Lintec Corp チップ体製造用粘着シート
JP2003332267A (ja) * 2002-05-09 2003-11-21 Lintec Corp 半導体ウエハの加工方法

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