TW200705576A - Brittle member treatment apparatus - Google Patents
Brittle member treatment apparatusInfo
- Publication number
- TW200705576A TW200705576A TW095114956A TW95114956A TW200705576A TW 200705576 A TW200705576 A TW 200705576A TW 095114956 A TW095114956 A TW 095114956A TW 95114956 A TW95114956 A TW 95114956A TW 200705576 A TW200705576 A TW 200705576A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhered
- tape
- treatment apparatus
- glass plate
- brittle member
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
In an object (A) to be processed, a semiconductor wafer (W) is adhered to a glass plate (P) through a two-sided adhesive tape (S). The semiconductor wafer (W) is transferred and adhered by peeling the glass plate (P), after being adhered to a dicing tape (DT) adhered on a ring frame (RF). On an outer plane side of the dicing tape (DT), a reinforcing tape (RT) is adhered, and the reinforcing tape (RT) prevents the dicing tape (DT) from stretching at the time of peeling the glass plate (P).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005142246A JP2006319233A (en) | 2005-05-16 | 2005-05-16 | Brittle member treatment apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200705576A true TW200705576A (en) | 2007-02-01 |
Family
ID=37431087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095114956A TW200705576A (en) | 2005-05-16 | 2006-04-26 | Brittle member treatment apparatus |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2006319233A (en) |
TW (1) | TW200705576A (en) |
WO (1) | WO2006123508A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008055155A1 (en) * | 2008-12-23 | 2010-07-01 | Thin Materials Ag | Separation method for a layer system comprising a wafer |
JP5996347B2 (en) * | 2012-09-24 | 2016-09-21 | リンテック株式会社 | Sheet peeling apparatus and peeling method, and sheet pasting apparatus and pasting method |
JP5589045B2 (en) * | 2012-10-23 | 2014-09-10 | 日東電工株式会社 | Semiconductor wafer mounting method and semiconductor wafer mounting apparatus |
JP2015225881A (en) * | 2014-05-26 | 2015-12-14 | 株式会社ディスコ | Sticking method of tape |
JP6401009B2 (en) * | 2014-10-15 | 2018-10-03 | 株式会社ディスコ | Wafer processing method |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4757442B2 (en) * | 1997-02-10 | 2011-08-24 | リンテック株式会社 | Chip body adhesive sheet |
JP4312419B2 (en) * | 2002-05-09 | 2009-08-12 | リンテック株式会社 | Semiconductor wafer processing method |
-
2005
- 2005-05-16 JP JP2005142246A patent/JP2006319233A/en not_active Withdrawn
-
2006
- 2006-04-24 WO PCT/JP2006/308509 patent/WO2006123508A1/en active Application Filing
- 2006-04-26 TW TW095114956A patent/TW200705576A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2006319233A (en) | 2006-11-24 |
WO2006123508A1 (en) | 2006-11-23 |
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